CN111071501A - Modal test structure temperature compensator under vacuum environment - Google Patents
Modal test structure temperature compensator under vacuum environment Download PDFInfo
- Publication number
- CN111071501A CN111071501A CN201911406838.XA CN201911406838A CN111071501A CN 111071501 A CN111071501 A CN 111071501A CN 201911406838 A CN201911406838 A CN 201911406838A CN 111071501 A CN111071501 A CN 111071501A
- Authority
- CN
- China
- Prior art keywords
- compensation plate
- plate
- test piece
- test
- temperature compensator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G7/00—Simulating cosmonautic conditions, e.g. for conditioning crews
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G7/00—Simulating cosmonautic conditions, e.g. for conditioning crews
- B64G2007/005—Space simulation vacuum chambers
Landscapes
- Engineering & Computer Science (AREA)
- Remote Sensing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The embodiment of the invention relates to a temperature compensator of a modal test structure in a vacuum environment, which comprises: the thermal vacuum test box comprises a thermal vacuum test box body, an upper compensation plate, a lower compensation plate and the like, wherein the upper compensation plate and the lower compensation plate jointly form a temperature compensator, a test piece is fixed on the inner rear wall of the thermal vacuum test box body, the upper compensation plate and the lower compensation plate are respectively positioned on the upper side and the lower side of the test piece, the material and the thermal load of the upper compensation plate and the lower compensation plate are the same as those of the test piece, the upper compensation plate and the lower compensation plate cover most of the circumferential position of the test piece, and the radiation heat of the test piece to the surrounding space can be effectively reduced; the annular base is used for going up compensating plate and compensating plate fixed connection down on the inside back wall of hot vacuum test case body, and the screw hole is used for using with the screw cooperation, fixes annular base on the inside back wall of hot vacuum test case body through using the screw, and this kind of connected mode makes to go up compensating plate and lower compensating plate and connects firmly, avoids receiving external force to influence and vibrate, avoids influencing the test piece.
Description
Technical Field
The embodiment of the invention relates to a temperature compensator for a thermal vacuum test, in particular to a temperature compensator with a modal test structure in a vacuum environment.
Background
The thermal vacuum test is a test for verifying the performance and function of a test piece under the conditions of vacuum and certain temperature, the thermal vacuum test is carried out on a spacecraft in the development process, the identification-level thermal vacuum test is carried out in the initial sample development stage, and the acceptance-level thermal vacuum test is carried out on the launched spacecraft in each launching, no matter the spacecraft is launched for the first time or launched repeatedly.
The high-temperature test piece under the vacuum environment easily radiates heat to the surrounding space, so that the heat inside the test piece is dissipated.
Disclosure of Invention
In view of this, in order to reduce the influence of thermal radiation, the embodiment of the invention provides a temperature compensator with a modal test structure in a vacuum environment.
In a first aspect, an embodiment of the invention provides a temperature compensator of a modal test structure in a vacuum environment, which comprises a thermal vacuum test box body, wherein an upper compensation plate and a lower compensation plate are sequentially arranged on an inner rear wall of the thermal vacuum test box body from top to bottom, and a test piece base installation groove is expanded on the inner rear wall of the thermal vacuum test box body.
In one possible embodiment, the upper compensation plate and the lower compensation plate are both curved plates.
In one possible embodiment, the inner arc side walls of the upper compensation plate and the lower compensation plate are both arranged towards the horizontal direction of the test piece.
In one possible embodiment, the rear ends of the upper compensation plate and the lower compensation plate are connected with the inner rear wall of the thermal vacuum test chamber body through an annular base.
In a possible embodiment, the inner side walls of the two annular bases are fixedly connected with the rear ends of the upper compensation plate and the lower compensation plate respectively, and threaded holes are uniformly formed in the annular bases.
In one possible embodiment, the annular base is fixedly connected with the inner rear wall of the thermal vacuum test chamber body through screws.
According to the temperature compensator with the modal test structure in the vacuum environment, the upper compensation plate and the lower compensation plate jointly form the temperature compensator, a test piece base installation groove is expanded on the inner rear wall of the thermal vacuum test box body, a test piece is fixed on the inner rear wall of the thermal vacuum test box body, the upper compensation plate and the lower compensation plate are respectively positioned on the upper side and the lower side of the test piece, the material and the thermal load of the upper compensation plate and the lower compensation plate are the same as those of the test piece, the upper compensation plate and the lower compensation plate cover most of the circumferential position of the test piece, and the radiation heat of the test piece to the surrounding space can be effectively reduced; the annular base is used for fixedly connecting the upper compensating plate and the lower compensating plate on the inner rear wall of the thermal vacuum test box body, the threaded holes are used in cooperation with screws, the annular base is fixed on the inner rear wall of the thermal vacuum test box body through the screws, the upper compensating plate and the lower compensating plate are connected stably in the connecting mode, vibration caused by external force is avoided, and the influence on a test piece is avoided.
Drawings
FIG. 1 is a front view of the main structure of the present invention;
fig. 2 is a side view of the main structure of the present invention.
In the figure: 1-a thermal vacuum test box body, 2-an upper compensation plate, 3-a lower compensation plate, 4-a test piece, 5-an annular base and 6-a threaded hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
For the convenience of understanding of the embodiments of the present invention, the following description will be further explained with reference to specific embodiments, which are not to be construed as limiting the embodiments of the present invention.
Referring to fig. 1-2, a temperature compensator with a modal test structure in a vacuum environment, referring to fig. 1-2, comprising a thermal vacuum test chamber body 1, wherein the vacuum test chamber body 1 is used for performing a thermal vacuum test on a test piece (4), referring to fig. 1, an upper compensation plate 2 and a lower compensation plate 3 are sequentially arranged on an inner rear wall of the thermal vacuum test chamber body 1 from top to bottom, the upper compensation plate 2 and the lower compensation plate 3 jointly form the temperature compensator, a test piece (4) base mounting groove is expanded on an inner rear wall of the thermal vacuum test chamber body 1, the test piece (4) is fixed on the inner rear wall of the thermal vacuum test chamber body 1 by using bolts, the upper compensation plate 2 and the lower compensation plate 3 are respectively located at the upper side and the lower side of the test piece (4), the material and the thermal load of the upper compensation plate 2 and the lower compensation plate 3 are the same as those of the test piece (4), the upper compensating plate 2 and the lower compensating plate 3 cover most of the circumferential position of the test piece (4) with the test piece (4), and the radiation heat of the test piece (4) to the surrounding space can be effectively reduced.
Referring to fig. 1, specifically, the upper compensation plate 2 and the lower compensation plate 3 are both arc-shaped plates. According to the shape of the test piece (4), the upper compensation plate 2 and the lower compensation plate 3 can be designed to be semicircular or semi-elliptical, the upper compensation plate 2 and the lower compensation plate 3 cover most of the circumferential position of the test piece (4) with the test piece (4), and the radiation heat of the test piece (4) to the surrounding space can be effectively reduced.
Referring to fig. 1, specifically, the inner arc side walls of the upper compensation plate 2 and the lower compensation plate 3 are both disposed toward the horizontal direction of the test piece (4). The upper compensation plate 2, the lower compensation plate 3 and the test piece (4) are spaced from each other at a certain distance, the test piece (4) is covered by the upper compensation plate 2 and the lower compensation plate 3 at most of the circumferential position of the test piece (4), and the radiation heat of the test piece (4) to the surrounding space can be effectively reduced.
Referring to fig. 1, specifically, the rear ends of the upper compensation plate 2 and the lower compensation plate 3 are connected to the inner rear wall of the thermal vacuum test chamber body 1 through an annular base 5. The annular base 5 is used for fixedly connecting the upper compensation plate 2 and the lower compensation plate 3 to the inner rear wall of the thermal vacuum test box body 1.
Referring to fig. 1-2, specifically, the inner side walls of the two annular bases 5 are respectively fixedly connected to the rear ends of the upper compensation plate 2 and the lower compensation plate 3, and the annular bases 5 are uniformly provided with threaded holes 6. The annular base 5 is used for fixedly connecting the upper compensation plate 2 and the lower compensation plate 3 to the inner rear wall of the thermal vacuum test box body 1, the threaded holes 6 are used in cooperation with screws, and the annular base 5 is fixed to the inner rear wall of the thermal vacuum test box body 1 through the screws.
Referring to fig. 1-2, specifically, the annular base 5 is fixedly connected to the inner rear wall of the thermal vacuum test chamber body 1 by screws. The annular base 5 is used for fixedly connecting the upper compensating plate 2 and the lower compensating plate 3 on the inner rear wall of the thermal vacuum test box body 1, the threaded holes 6 are used in cooperation with screws, the annular base 5 is fixed on the inner rear wall of the thermal vacuum test box body 1 through screws, and the upper compensating plate 2 and the lower compensating plate 3 are connected stably in the connecting mode, so that vibration caused by external force is avoided, and a test piece (4) is prevented from being influenced.
The working principle is as follows: the vacuum test box body 1 is used for performing a thermal vacuum test on a test piece (4), an upper compensation plate 2 and a lower compensation plate 3 are sequentially arranged on the inner rear wall of the thermal vacuum test box body 1 from top to bottom, the upper compensation plate 2 and the lower compensation plate 3 jointly form a temperature compensator, a test piece (4) base installation groove is expanded on the inner rear wall of the thermal vacuum test box body 1, the test piece (4) is fixed on the inner rear wall of the thermal vacuum test box body 1 by using bolts, the upper compensating plate 2 and the lower compensating plate 3 are respectively positioned at the upper side and the lower side of a test piece (4), the material and the thermal load of the upper compensating plate 2 and the lower compensating plate 3 are the same as those of a test piece (4), the upper compensation plate 2 and the lower compensation plate 3 cover most of the circumferential position of the test piece (4) with the test piece (4), so that the radiation heat of the test piece (4) to the surrounding space can be effectively reduced; the annular base 5 is used for fixedly connecting the upper compensating plate 2 and the lower compensating plate 3 on the inner rear wall of the thermal vacuum test box body 1, the threaded holes 6 are used in cooperation with screws, the annular base 5 is fixed on the inner rear wall of the thermal vacuum test box body 1 through screws, and the upper compensating plate 2 and the lower compensating plate 3 are connected stably in the connecting mode, so that vibration caused by external force is avoided, and a test piece (4) is prevented from being influenced.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. The utility model provides a modal test structure temperature compensator under vacuum environment, its characterized in that, includes hot vacuum test case body (1), from top to bottom has set gradually compensation board (2) and compensation board (3) down on the inside back wall of hot vacuum test case body (1), it has test piece (4) base mounting groove to open on the inside back wall of hot vacuum test case body (1).
2. A modal test structure temperature compensator according to claim 1, wherein the upper compensation plate (2) and the lower compensation plate (3) are both curved plates.
3. A modal test structure temperature compensator under vacuum environment as set forth in claim 2, wherein the inner arc side walls of the upper compensating plate (2) and the lower compensating plate (3) are both disposed toward the horizontal direction of the test piece (4).
4. A modal test structure temperature compensator according to claim 1, wherein the rear ends of the upper compensation plate (2) and the lower compensation plate (3) are connected with the inner rear wall of the thermal vacuum test chamber body (1) through an annular base (5).
5. A modal test structure temperature compensator according to claim 4, wherein the inner side walls of the two annular bases (5) are respectively fixedly connected with the rear ends of the upper compensation plate (2) and the lower compensation plate (3), and threaded holes (6) are uniformly formed in the annular bases (5).
6. A modal test structure temperature compensator according to claim 5, wherein the annular base (5) is fixedly connected with the inner rear wall of the thermal vacuum test chamber body (1) through screws.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911406838.XA CN111071501B (en) | 2019-12-31 | 2019-12-31 | Modal test structure temperature compensator under vacuum environment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911406838.XA CN111071501B (en) | 2019-12-31 | 2019-12-31 | Modal test structure temperature compensator under vacuum environment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111071501A true CN111071501A (en) | 2020-04-28 |
CN111071501B CN111071501B (en) | 2021-04-20 |
Family
ID=70320394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911406838.XA Active CN111071501B (en) | 2019-12-31 | 2019-12-31 | Modal test structure temperature compensator under vacuum environment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111071501B (en) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981815A (en) * | 1988-05-09 | 1991-01-01 | Siemens Aktiengesellschaft | Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors |
RU2208564C1 (en) * | 2001-11-15 | 2003-07-20 | Федеральное государственное унитарное предприятие "Научно-производственное объединение им. С.А. Лавочкина" | Method of thermal vacuum tests and device for realization of this method |
CN101633555A (en) * | 2008-07-24 | 2010-01-27 | 洛阳兰迪玻璃机器有限公司 | Tempered glass heating furnace |
KR100943879B1 (en) * | 2009-07-14 | 2010-02-24 | (주)쎄트렉아이 | Device for compensating a temperature in test of a thermal-vacuum and compensation method of the same |
CN104535605A (en) * | 2014-11-27 | 2015-04-22 | 上海卫星装备研究所 | Heat flux density calibration system for vacuum wave-absorbing type external heat flux analog device |
CN105067655A (en) * | 2015-07-31 | 2015-11-18 | 中国科学技术大学 | Flame retardant electric cable vertical combustion performance testing apparatus under barrel-shaped annular radiation heating condition |
CN106081174A (en) * | 2016-07-26 | 2016-11-09 | 上海卫星装备研究所 | A kind of Orbital heat flux analog and hot-fluid control method thereof |
CN106394943A (en) * | 2016-10-12 | 2017-02-15 | 北京理工大学 | Infrared dynamic scene simulator capable of working in low-temperature vacuum environment |
CN207700022U (en) * | 2017-09-27 | 2018-08-07 | 佛山迅拓奥科技有限公司 | A kind of Automatic Control pavement marker |
CN110466810A (en) * | 2019-07-19 | 2019-11-19 | 北京空间飞行器总体设计部 | The space-environment simulator and its installation method of a kind of roll type boom mechanism |
-
2019
- 2019-12-31 CN CN201911406838.XA patent/CN111071501B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981815A (en) * | 1988-05-09 | 1991-01-01 | Siemens Aktiengesellschaft | Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors |
RU2208564C1 (en) * | 2001-11-15 | 2003-07-20 | Федеральное государственное унитарное предприятие "Научно-производственное объединение им. С.А. Лавочкина" | Method of thermal vacuum tests and device for realization of this method |
CN101633555A (en) * | 2008-07-24 | 2010-01-27 | 洛阳兰迪玻璃机器有限公司 | Tempered glass heating furnace |
KR100943879B1 (en) * | 2009-07-14 | 2010-02-24 | (주)쎄트렉아이 | Device for compensating a temperature in test of a thermal-vacuum and compensation method of the same |
CN104535605A (en) * | 2014-11-27 | 2015-04-22 | 上海卫星装备研究所 | Heat flux density calibration system for vacuum wave-absorbing type external heat flux analog device |
CN105067655A (en) * | 2015-07-31 | 2015-11-18 | 中国科学技术大学 | Flame retardant electric cable vertical combustion performance testing apparatus under barrel-shaped annular radiation heating condition |
CN106081174A (en) * | 2016-07-26 | 2016-11-09 | 上海卫星装备研究所 | A kind of Orbital heat flux analog and hot-fluid control method thereof |
CN106394943A (en) * | 2016-10-12 | 2017-02-15 | 北京理工大学 | Infrared dynamic scene simulator capable of working in low-temperature vacuum environment |
CN207700022U (en) * | 2017-09-27 | 2018-08-07 | 佛山迅拓奥科技有限公司 | A kind of Automatic Control pavement marker |
CN110466810A (en) * | 2019-07-19 | 2019-11-19 | 北京空间飞行器总体设计部 | The space-environment simulator and its installation method of a kind of roll type boom mechanism |
Non-Patent Citations (1)
Title |
---|
薛吉林;刘孝亮;范志超;马双伟;王慧;王冰: "《1500℃高温真空(充气)环境蠕变疲劳试验装置研发》", 《工程与试验》 * |
Also Published As
Publication number | Publication date |
---|---|
CN111071501B (en) | 2021-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1985153B1 (en) | Improved suspension device for microphone | |
CN111071501B (en) | Modal test structure temperature compensator under vacuum environment | |
US20160238434A1 (en) | Balance and draft shield therfor | |
CN111258025A (en) | Large-diameter reflector supporting device | |
US9274563B2 (en) | Footpad and carrying apparatus having the same | |
US6237463B1 (en) | Isolation system mount for mounting sensitive electronic equipment to non-recoiled artillery | |
CN210266373U (en) | Swift construction metal bellows expansion joint | |
JP5161616B2 (en) | Electronic device mounting structure inside the housing | |
KR200482739Y1 (en) | Box for Arranging Elements Displaced on a Desk of Computer | |
JP2015063231A (en) | Fuel tank and fuel tank attachment structure | |
US3122917A (en) | figure | |
CN211826684U (en) | Large-diameter reflector supporting device | |
KR101618520B1 (en) | Oven device with heat transfer space between heat transfer structures | |
CN215726301U (en) | Composite mounting's multipurpose digital sensor that weighs | |
JP2016118214A (en) | Vibration control device and refrigeration cycle device using the same | |
CN217763563U (en) | Electric ceramic stove assembly | |
CN109062387B (en) | Heat dissipation mechanism for computer | |
JP5828133B2 (en) | Radiation structure of lighting device | |
JP3197655U (en) | Side shelf reinforcement structure for display shelf mounting plate | |
CN216927315U (en) | Backlight module and interactive flat plate | |
CN216555669U (en) | Pipeline bracket capable of achieving low-friction arch-resistant shock absorption | |
JP2002163919A (en) | Illumination instrument | |
CN213900149U (en) | Pipeline connection structure and heat insulation box | |
US20230164467A1 (en) | Heater with mounting pads for mechanical, thermal, and opto-mechanical functionality | |
CN109276004B (en) | Protective structure of computer equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |