CN111065242A - Flexible heat conducting pad with composite structure - Google Patents
Flexible heat conducting pad with composite structure Download PDFInfo
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- CN111065242A CN111065242A CN201911353646.7A CN201911353646A CN111065242A CN 111065242 A CN111065242 A CN 111065242A CN 201911353646 A CN201911353646 A CN 201911353646A CN 111065242 A CN111065242 A CN 111065242A
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- heat
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- heat conducting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a flexible heat-conducting pad with a composite structure, which comprises a base material and a heat-conducting material arranged in the base material, wherein the heat-conducting material is columnar solid or is columnar solid formed by bonding heat-conducting powder by using a bonding agent. The flexible heat conducting pad with the composite structure has good elasticity, can be manufactured into different thicknesses according to specific conditions so as to be tightly attached to a gap between a power device and a radiator, effectively eliminate air and improve the radiating effect; the flexible heat conducting pad with the composite structure has good heat conducting performance, and can effectively transfer heat on the surface of a power device to a radiator; the heat conducting performance of the flexible heat conducting pad with the composite structure has designability, and the heat radiating effect of the heat conducting pad can be changed by adjusting the number or the total sectional area of the heat conducting columns.
Description
Technical Field
The invention belongs to a heat conduction material with a composite structure, which is used for the heat dissipation field of batteries, LED lamps or heating electronic devices, and particularly relates to a flexible heat conduction pad with a composite structure.
Background
With the rapid development of electronic equipment towards miniaturization, light weight and high performance, the effective heat dissipation requirement of a limited space in the equipment is more and more urgent, and application occasions relate to a microprocessor, a storage module, a cache memory chip, a DC/DC converter, an IGBT (insulated gate bipolar translator) and other power modules, a power semiconductor device, a solid-state relay, a bridge rectifier, a power battery, a high-power LED lamp and the like. Common means include air cooling, liquid cooling, dry ice, liquid nitrogen, compressor cooling, etc., wherein the simplest and most common means is fan cooling, and in order to effectively transfer heat from the power device to the fan, an effective heat conducting material is usually required to fill the metal housing connecting the surface of the power device and the fan, as shown in fig. 1.
The currently commonly used heat-conducting media comprise heat-conducting silicone grease, heat-conducting silica gel, graphite gaskets, flexible heat-conducting pads and the like, wherein the heat-conducting silicone grease takes silicone oil as a raw material, and is added with a thickening agent and a filler to prepare a grease-like substance, so that the heat-conducting silicone grease has certain heat conductivity, is high-temperature resistant, ageing resistant and waterproof; the heat-conducting silica gel is prepared by adding a filler and a viscous substance into silicone oil, is hard after solidification, can effectively connect the surface of a power device and a radiator, has higher heat dissipation efficiency than silicone grease, is easy to be stuck and is not easy to replace; the flexible heat conducting pad has good heat conductivity and voltage-resistant insulation characteristics, has flexibility, can be well attached to a gap between a power device and a radiator, and is convenient to disassemble and replace, the defect of the above heat conducting materials is that the heat conducting capacity is not high, the heat conducting coefficient is generally not more than 6W/mK at most, common products are generally about 2W/mK, and the heat radiating requirement of a high-power heating device is difficult to meet.
Disclosure of Invention
In order to solve the problems, the invention provides a flexible heat conducting pad with a composite structure, wherein an inorganic material with excellent heat conductivity and higher insulating property is made into a heat conducting column with a specific shape and is embedded and bonded to a flexible silicon rubber substrate, so that the heat conducting property of the inorganic material and the elasticity of silicon rubber are comprehensively utilized, a gap between a power device and a radiator can be well attached, heat can be effectively conducted, and the limitation of the existing heat conducting material is overcome.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the invention relates to a flexible heat-conducting pad with a composite structure, which comprises a base material and a heat-conducting material arranged in the base material, wherein the heat-conducting material is columnar solid or is columnar solid formed by bonding heat-conducting powder by using a bonding agent.
The invention is further improved in that: the adhesive is organic adhesive, and the heat conducting powder is adhered into columnar solid through the organic adhesive.
The invention is further improved in that: the organic binder is thermosetting resin such as epoxy resin, polyester resin, and maleic resin, or a solution of thermoplastic resin in an organic solvent or a melt of thermoplastic resin, and includes polyethylene, polypropylene, polyvinyl chloride, polystyrene, and polymethacrylic acid.
The invention is further improved in that: the adhesive is an inorganic adhesive, and the heat-conducting powder is bonded into a columnar solid through the inorganic adhesive.
The invention is further improved in that: the inorganic binder is water glass, gypsum, clay, cement, low-melting-point glass, low-melting-point metal, sulfur, glass ceramic, silicate, phosphate, colloidal alumina or dental cement.
The invention is further improved in that: the matrix material is silicon rubber, polyurethane, rubber, elastic gel, polyisobutylene and the like and compounds or derivatives thereof.
The invention is further improved in that: the heat conduction material is aluminum oxide, silicon dioxide, zinc oxide, magnesium oxide, silicon carbide, aluminum nitride, boron nitride, carbon powder, graphite powder, carbon nano tubes, carbon fibers, graphene and the like.
The invention has the beneficial effects that: the flexible heat conducting pad with the composite structure has good elasticity, can be manufactured into different thicknesses according to specific conditions so as to be tightly attached to a gap between a power device and a radiator, effectively eliminate air and improve the radiating effect; the flexible heat conducting pad with the composite structure has good heat conducting performance, and can effectively transfer heat on the surface of a power device to a radiator; the heat conducting performance of the flexible heat conducting pad with the composite structure has designability, and the heat radiating effect of the heat conducting pad can be changed by adjusting the number or the total sectional area of the heat conducting columns.
Drawings
Fig. 1 is a schematic view of a flexible thermal pad in use.
FIG. 2 is a schematic structural view of the composite thermal pad of the present invention.
Fig. 3 is a schematic structural view of embodiment 1 of the present invention.
Fig. 4 is a schematic structural diagram of embodiment 2 of the present invention.
FIG. 5 is a top view of a profile of a test heat-conducting post of the present invention.
FIG. 6 is a bottom view of a profile of a test heat-conducting post of the present invention.
Wherein: 4-a substrate; 5-heat conduction column.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.
Example 1:
the invention relates to a flexible heat-conducting pad with a composite structure, which comprises a base material 4 and a heat-conducting material arranged in the base material 4, wherein the heat-conducting material is a columnar solid or a columnar solid formed by bonding heat-conducting powder by a bonding agent, the bonding agent is an organic bonding agent, the heat-conducting powder is bonded into the columnar solid by the organic bonding agent, the organic bonding agent is thermosetting resin such as epoxy resin, polyester resin and maleic resin, or is a dissolved substance of the thermoplastic resin in an organic solvent or a molten substance of the thermoplastic resin, and comprises polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethacrylic acid and the like, or the bonding agent is an inorganic bonding agent, the heat-conducting powder is bonded into the columnar solid by the inorganic bonding agent, and the inorganic bonding agent is water glass, gypsum, clay, cement, or the like, The dental cement comprises a base material 4 and a heat conducting material, wherein the base material 4 is silicon rubber, and the heat conducting material is aluminum oxide, silicon dioxide, zinc oxide, magnesium oxide, silicon carbide, aluminum nitride, boron nitride, carbon powder, graphite powder, carbon nano tubes, carbon fibers, graphene and the like.
As shown in fig. 3, the specific method for preparing the flexible thermal pad is as follows:
(1) coating a demoulding material on a mould with regularly arranged cylindrical bulges on the surface, and putting the mould into a container, wherein the height of the bulges can be processed according to the requirements of a product;
(2) pouring the mixed silicon rubber, namely the base material 4 into a container, and standing until the silicon rubber is solidified;
(3) removing the solidified silicon rubber from the container, demolding the silicon rubber, taking down the silicon rubber, and then putting the silicon rubber back into the container;
(4) adding a heat conducting column, wherein the specific method is that heat conducting material slurry with an adhesive is poured into the holes of the silicon rubber, and then the heat conducting column is formed by strickling and standing the heat conducting material slurry until the slurry is solidified; or brushing an adhesive on the side surface of the prepared heat conducting column, inserting the heat conducting column into the holes of the silicon rubber one by one, standing until the adhesive is cured, and finally obtaining the flexible heat conducting pad with the composite structure.
Example 2:
as shown in fig. 4, the difference between the embodiment 2 and the embodiment 1 is the equipment method, which specifically includes:
(1) coating a release agent on the surface of the template, then regularly arranging the prepared heat conduction columns on the surface of the template, and putting the template into a container;
(2) pouring the mixed silica gel into a container, and standing until the silicone rubber is solidified;
(3) and (4) removing the solidified silicon rubber from the container, and demolding and taking down the silicon rubber to obtain the flexible heat-conducting pad with the composite structure.
This application has carried out the experiment for proving heat conduction system:
1. experimental materials:
silica gel purchased from Hengchang liquid silica gel factory, wherein Shore hardness is 0 degree; an alumina cylinder of Kun mountain JiangYi special ceramic processing plant was purchased, with a diameter of 2mm, 3mm and a height of 6 mm.
2. Test method
The experiment is suitable for measuring the heat conductivity coefficient by adopting a heat flow meter method, and the sample size requirement is 25.4mm by 25.4 mm.
The test principle is as follows: when a stable Q passes through a positive direction heat conductor with an area of F and a thickness of δ, a one-dimensional stable heat conduction condition is present in the heat conductor, according to the fourier law:
in the formula, t1,t2The temperature of the upper and lower surfaces is shown, lambda is the heat conductivity coefficient, and delta t is the temperature difference between the two surfaces of the flat plate.
At this time:
in the experiment, the temperature t of the two plates1,t2The heat conductivity λ can be obtained by calculating the heat flow rate, i.e., the heat flow density q, flowing through the inner surface of the flat plate, and the thickness δ of the flat plate, which are known quantities.
3. Sample structural design
The sample size is 25.4mm by 25.4mm, the distribution of alumina with the diameter of 2mm and the diameter of 3mm is designed, and the equal area occupied by the alumina cylinders in the upper surface and the lower surface is ensured; the design is shown in the distribution diagram of the heat-conducting columns in FIGS. 5-6, and the ratio of the alumina to the total area is 17.53%;
4. the experimental steps are as follows:
(1) weighing a silica gel component A and a silica gel component B in a beaker by using an electronic balance, wherein the weight ratio of the component A to the component B is 1: 1, and stirring for 5min by using a glass rod to fully mix the component A and the component B;
(2) putting the stirred silica gel solution into a vacuum drying box, vacuumizing until the silica gel in the beaker does not bubble any more, and taking out the beaker;
(3) preparing a heat-conducting rubber mat according to the method (see figure 3) disclosed by the invention, slowly pouring the vacuumized silica gel into a manufactured mould, pouring, standing for 12h, and waiting for curing;
(4) taking out the cured silica gel, and respectively and sequentially filling the processed alumina cylinders with the diameters of 2mm and 3mm into the silica gel;
(5) numbering the samples, wherein the sample without an alumina structure and only containing silica gel is the sample No. 1; the silica gel sample added with the alumina column with the diameter of 2mm is a No. 2 sample; the silica gel sample added with the alumina column with the diameter of 3mm is a No. 3 sample;
(6) and testing the sample by adopting a heat flow meter method, and recording the testing temperature and the heat conductivity coefficient.
(7)5, results of the experiment
Experimental result shows that adding the alumina heat conduction cylinder can greatly improve the heat conductivity of the silica gel pad, and for sample 2, the alumina cylinder with the diameter of 2mm is added, and the heat conductivity is 3.173
W/(m × K), 1169.2% relative to the matrix; for sample 3, an alumina cylinder of 3mm diameter was added, with a thermal conductivity of 4.308W/(m K), an improvement of 1623.2% over the matrix.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (7)
1. A flexible heat conducting pad with a composite structure is characterized in that: the flexible heat conduction pad comprises a base material (4) and a heat conduction material arranged in the base material (4), wherein the heat conduction material is columnar solid or columnar solid formed by bonding heat conduction powder by using a bonding agent.
2. A composite structural flexible thermal pad according to claim 1, wherein: the adhesive is an organic adhesive, and the heat-conducting powder is adhered into a columnar solid through the organic adhesive.
3. A composite structural flexible thermal pad according to claim 2, wherein: the organic binder is thermosetting resin such as epoxy resin, polyester resin, maleic resin, etc., or a dissolved substance of thermoplastic resin in an organic solvent or a molten substance of thermoplastic resin, including polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethacrylic acid, etc.
4. A composite structural flexible thermal pad according to claim 1, wherein: the adhesive is an inorganic adhesive, and the heat-conducting powder is bonded into a columnar solid through the inorganic adhesive.
5. A composite structured flexible thermal pad according to claim 4, wherein: the inorganic binder is water glass, gypsum, clay, cement, low-melting-point glass, low-melting-point metal, sulfur, glass ceramic, silicate, phosphate, colloidal alumina or dental cement.
6. A composite structured flexible thermal pad according to any one of claims 1 to 5, wherein: the base material (4) is silicon rubber, polyurethane, rubber, elastic gel, polyisobutylene and the like and a compound or a derivative thereof.
7. A composite structured flexible thermal pad according to any one of claims 1 to 5, wherein: the heat conduction material is aluminum oxide, silicon dioxide, zinc oxide, magnesium oxide, silicon carbide, aluminum nitride, boron nitride, carbon powder, graphite powder, carbon nano tubes, carbon fibers, graphene and the like.
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| CN201911353646.7A CN111065242A (en) | 2019-12-25 | 2019-12-25 | Flexible heat conducting pad with composite structure |
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| CN201911353646.7A CN111065242A (en) | 2019-12-25 | 2019-12-25 | Flexible heat conducting pad with composite structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112656276A (en) * | 2020-12-28 | 2021-04-16 | 深圳科利电器有限公司 | Toilet seat ring based on graphene heating, temperature control system and electronic toilet |
| CN113115557A (en) * | 2021-02-05 | 2021-07-13 | 吕建忠 | Heat dissipation silica gel piece of embedded heat conduction group |
| CN115890987A (en) * | 2022-12-19 | 2023-04-04 | 苏州可米可酷食品有限公司 | Intelligent flexible mold and application production system thereof |
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| CN112656276A (en) * | 2020-12-28 | 2021-04-16 | 深圳科利电器有限公司 | Toilet seat ring based on graphene heating, temperature control system and electronic toilet |
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Application publication date: 20200424 |
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