CN111064094A - Efficient heat dissipation type prefabricated substation and heat dissipation method thereof - Google Patents
Efficient heat dissipation type prefabricated substation and heat dissipation method thereof Download PDFInfo
- Publication number
- CN111064094A CN111064094A CN201911102873.2A CN201911102873A CN111064094A CN 111064094 A CN111064094 A CN 111064094A CN 201911102873 A CN201911102873 A CN 201911102873A CN 111064094 A CN111064094 A CN 111064094A
- Authority
- CN
- China
- Prior art keywords
- air
- heat dissipation
- temperature
- pressure
- box body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 44
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 230000009466 transformation Effects 0.000 claims description 37
- 238000012544 monitoring process Methods 0.000 claims description 31
- 230000009467 reduction Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 10
- 238000005057 refrigeration Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 2
- 230000009471 action Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/46—Boxes; Parts thereof or accessories therefor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B7/00—Enclosed substations, e.g. compact substations
- H02B7/06—Distribution substations, e.g. for urban network
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a high-efficiency heat-dissipation prefabricated substation and a heat dissipation method thereof, and the substation comprises a box body, a triangular double-layer top cover arranged at the top end of the box body, a sealing plate arranged below the triangular double-layer top cover on the inner wall of the box body through threads, an air inlet arranged on a side panel of the box body, an air suction pump arranged on the outer surface of the box body at the position of the air inlet, an air supply pipeline arranged between the air inlet and the sealing plate, a semiconductor refrigerator fixedly arranged on a lower plate of the double-layer triangular top cover, a plurality of air guide outlets with downward openings arranged on the sealing plate, an electromagnetic valve arranged in each air guide outlet, and a heat dissipation air outlet mechanism for forming air convection arranged on each side surface; according to the scheme, the temperature of the variable-voltage component is divided into three stages according to the surface temperature of the variable-voltage component, and the air convection heat dissipation and low-temperature pressure maintaining and cooling modes are used corresponding to different temperatures, so that the control mode is simple, and the heat dissipation efficiency is high.
Description
Technical Field
The embodiment of the invention relates to the technical field of transformer stations, in particular to a high-efficiency heat-dissipation type preassembled transformer substation and a heat dissipation method thereof.
Background
The transformer substation is a place for converting voltage and current, receiving electric energy and distributing electric energy in an electric power system. The substations in the power plant are step-up substations, which are used to boost up the electrical energy generated by the generator and feed it into the high-voltage network.
The prefabricated substation is a typical representative of a substation, is a high-voltage switch device, a distribution transformer and a low-voltage distribution device, is factory prefabricated indoor and outdoor compact distribution equipment which is integrated according to a certain wiring scheme, namely, the functions of transformer voltage reduction, low-voltage distribution and the like are organically combined together and installed in a steel structure box which is damp-proof, rust-proof, dust-proof, rat-proof, fire-proof, anti-theft, heat-insulating, totally-closed and movable, is particularly suitable for urban network construction and transformation, and is a brand-new substation which rises after a civil substation. The prefabricated substation is suitable for mines, factory enterprises, oil-gas fields and wind power stations, replaces the original civil power distribution room and power distribution station, and becomes a novel complete set of power transformation and distribution device.
Most of the existing preassembled transformer substations are provided with heat dissipation windows on the side surfaces of the box bodies, and heat dissipation is carried out through convection of air inside and outside the heat dissipation windows, so that the existing preassembled transformer substations have the following defects:
(1) the heat dissipation window is arranged on the side surface, the heat dissipation airflow of the heat dissipation window is blocked by the voltage transformation assembly, the part of the voltage transformation assembly, which is right opposite to the heat dissipation window, dissipates heat quickly, and the convection action on other surfaces of the voltage transformation assembly is not obvious, so that the heat dissipation effect on other side surfaces of the voltage transformation assembly is not obvious, and the whole heat dissipation effect is poor;
(2) most of the existing heat dissipation modes improve the heat dissipation efficiency only by increasing the air flow speed and increasing the air flow contact area, but when the variable-pressure component is heated to a high-temperature state, the air temperature of the variable-pressure component cannot be timely reduced only by a high-speed air flow heat dissipation mode, and the potential safety hazard is high.
Disclosure of Invention
Therefore, the embodiment of the invention provides an efficient heat dissipation type prefabricated substation and a heat dissipation method thereof.
In order to achieve the above object, an embodiment of the present invention provides the following: a high-efficiency heat-dissipation prefabricated substation comprises a box body and a triangular double-layer top cover arranged at the top end of the box body, wherein a sealing plate is arranged on the inner wall of the box body below the triangular double-layer top cover through threads, an air inlet is formed in a side panel of the box body, an air suction pump is arranged on the outer surface of the box body at the position of the air inlet, an air supply pipeline is arranged between the air inlet and the sealing plate, a high-pressure air storage chamber used for temporarily storing the pressure of pressurized air is formed between the sealing plate and the double-layer triangular top cover, and the air outside the box body is transmitted into the high-pressure air storage chamber through the air supply;
the semiconductor refrigerator used for cooling air in the high-pressure air storage chamber is fixedly mounted on the lower plate of the double-layer triangular top cover, the sealing plate is further provided with a plurality of air guide outlets with downward openings, each air guide outlet is internally provided with an electromagnetic valve, and each side face of the box body is provided with a heat dissipation air outlet mechanism used for forming air convection.
As a preferred scheme of the present invention, the refrigeration end of the semiconductor refrigerator faces the high-pressure gas storage chamber, the heating end of the semiconductor refrigerator faces the upper plate of the triangular double-layer top cover, the lower plate of the triangular double-layer top cover is a thermal insulation plate, the upper plate of the triangular double-layer top cover is a thermal conductive plate, a plurality of uniformly distributed heat dissipation through holes are arranged on two sides of the tip end of the upper plate of the triangular double-layer top cover, the middle sections of the refrigeration end and the heating end of the semiconductor refrigerator are fixedly mounted on the lower plate of the triangular double-layer top cover, and the heating end of the semiconductor refrigerator is provided with a heat dissipation.
As a preferable scheme of the invention, the heat dissipation air outlet mechanism comprises a heat dissipation window arranged on the box body, the heat dissipation window is provided with a plurality of rotating louver fans which are horizontally and uniformly distributed, the edge position of the heat dissipation window is provided with an inserting hole, and two ends of each rotating louver fan are inserted into the inserting holes and can rotate around the inserting holes.
As a preferred scheme of the invention, one end of each rotating louver fan is further provided with a linear driving mechanism, the linear driving mechanism comprises an action toothed ring arranged at the same side end of each rotating louver fan and a pushing cylinder for driving the action toothed ring to rotate, an output shaft of the pushing cylinder vertically moves up and down, a push-pull saw blade meshed with the action toothed ring is mounted on the output shaft of the pushing cylinder, and the pushing cylinder drives the rotating louver fan to rotate forward and backward through the push-pull saw blade.
As a preferable aspect of the present invention, the inner orifice of the heat dissipation through-hole is slightly higher than the outer orifice of the heat dissipation through-hole.
As a preferred scheme of the present invention, the push cylinder is connected to a temperature monitoring system, the temperature monitoring system monitors the temperature of the pressure swing assembly in real time by using a temperature sensor, the temperature sensor is connected to an input end of the temperature monitoring system, the air pump, the semiconductor refrigerator and the push cylinder are connected to an output end of the temperature monitoring system, the temperature monitoring system divides the temperature of the pressure swing assembly into a safety range, a convection heat dissipation range and a low-temperature pressure maintaining range according to a monitoring value of the temperature sensor, and the temperature monitoring system controls the working states of the air pump, the semiconductor refrigerator and the push cylinder according to a temperature corresponding range of the pressure swing assembly.
As a preferred scheme of the present invention, an air pressure detector is installed in the high pressure air storage chamber, the air pressure detector is connected to a flow concentration pressure processing unit, the air pressure detector is connected to an input end of the flow concentration pressure processing unit, and the electromagnetic valve, the push cylinder and the air pump are respectively connected to an output end of the flow concentration pressure processing unit.
In addition, the invention also provides a heat dissipation method of the high-efficiency heat dissipation type preassembled transformer substation, which comprises the following steps:
step 100, detecting the real-time temperature of the voltage transformation assembly by a temperature sensor, comparing the real-time temperature with a set threshold in real time, and dividing the real-time temperature into three levels according to the size, wherein the three levels are a safety range, a convection heat dissipation range and a low-temperature heat reduction range;
step 200, if the temperature of the variable-pressure component is in a convection heat dissipation range, implementing an air convection heat dissipation mode, opening the rotating louver fan, performing flow collection and pressurization by using an air suction pump, and performing convection heat dissipation treatment on the variable-pressure component;
step 300, if the temperature of the voltage transformation assembly is in a low-temperature heat reduction range, implementing a low-temperature pressure maintaining heat reduction mode, closing the rotating louver, performing flow collecting pressurization by using an air pump, electrifying the semiconductor refrigerator, closing the rotating louver, and implementing low-temperature pressure maintaining cooling treatment on the voltage transformation assembly;
step 400, monitoring the internal air pressure of the box body in real time, closing the rotary louver when the internal air pressure is larger than a safety range, discharging cold air, and performing cooling treatment of low-temperature pressure maintaining on the variable-pressure component again after the air pressure is reduced;
and 500, reducing the temperature of the voltage transformation assembly to a safe range, and stopping heat dissipation treatment.
In a preferred embodiment of the present invention, in step 200, the rotating louver is normally open within a safe temperature range of the voltage transformation assembly.
As a preferred aspect of the present invention, in step 300, after the low-temperature pressure-maintaining and heat-reducing mode is selected, the low-temperature pressure-maintaining and heat-reducing mode continues to operate until the temperature of the voltage transformation component is reduced to be within the safe range.
The embodiment of the invention has the following advantages:
(1) according to the invention, the external air is firstly gathered at the top end of the box body for high-pressure flow collection, then the high-pressure air in the heat dissipation component at the top is blown downwards integrally to dissipate heat of all surfaces of the voltage transformation component, and the air flow velocity is increased and the heat dissipation area is enlarged, so that the high-efficiency air convection heat dissipation treatment can be realized by combining the high-pressure flow collection at the top end of the box body and the heat dissipation window at the side surface of the box body.
(2) When high-pressure flow concentration is carried out, the high-pressure air can be cooled to generate high-pressure cold air, the high-pressure cold air is blown downwards from the whole top end, the heat dissipation window is closed, and the transformation assembly is subjected to low-temperature pressure maintaining and cooling treatment, so that the heat dissipation efficiency can be improved, the transformation assembly is rapidly cooled, and the safety use performance of the whole prefabricated substation is improved.
(3) According to the surface temperature of the voltage transformation assembly, the temperature of the voltage transformation assembly is divided into three stages, and the air convection heat dissipation mode and the low-temperature pressure maintaining and temperature reducing mode are used corresponding to different temperatures, so that the control mode is simple, the heat dissipation efficiency is high, the overall energy consumption of the heat dissipation mechanism can be reduced, and the cost performance of the heat dissipation mechanism is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
Fig. 1 is a schematic view of an overall structure of a heat dissipation mechanism according to an embodiment of the present invention;
FIG. 2 is a schematic view of a heat dissipation window of the heat dissipation mechanism according to the embodiment of the present invention;
FIG. 3 is a schematic side sectional view of a heat dissipation mechanism according to an embodiment of the present invention
FIG. 4 is a schematic structural diagram illustrating the operation of a heat dissipation mechanism according to an embodiment of the present invention;
FIG. 5 is a flow chart illustrating a heat dissipation method according to an embodiment of the invention;
in the figure:
1-a box body; 2-triangular double-layer top cover; 3-sealing the plate; 4-an air inlet; 5-an air pump; 6-air supply pipeline; 7-high pressure gas storage chamber; 8-a semiconductor refrigerator; 9-a wind guide outlet; 10-an electromagnetic valve; 11-a heat dissipation air outlet mechanism; 12-heat dissipating through holes; 13-a heat dissipation fan; 14-a heat dissipation window; 15-rotating the louver fan; 16-an insertion hole; 17-a linear drive mechanism; 18-a temperature monitoring system; 19-a temperature sensor; 20-a gas pressure detector; 21-collecting pressure processing unit.
1701-acting toothed ring; 1702-push cylinder; 1703 push-pull saw blade.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1, the present invention provides a high-efficiency heat dissipation type prefabricated substation, which collects and pressurizes air, and quickly blows the air to a transformation assembly after reaching a certain pressure, so as to increase the air velocity, improve the convection between the air inside the prefabricated substation and the outside air, and improve the heat dissipation effect, and meanwhile, directly construct and maintain a low temperature environment in the internal space of the prefabricated substation, thereby realizing the quick cooling treatment of the transformation assembly, and being different from the heat dissipation method of simply using a heat dissipation fan or a cooling mechanism in the prior art.
The novel solar water heater comprises a box body 1 and a triangular double-layer top cover 2 arranged on the top end of the box body 1, a sealing plate 3 is installed on the inner wall of the box body 1 below the triangular double-layer top cover 2 through threads, an air inlet 4 is formed in the side panel of the box body 1, an air suction pump 5 is installed on the outer surface of the box body 1 at the position of the air inlet 4, an air supply pipeline 6 is arranged between the air inlet 4 and the sealing plate 3, a high-pressure air storage chamber 7 used for temporarily storing the pressure of pressurized air is formed between the sealing plate 3 and the double-layer triangular top cover 2, and the air outside the box body is transmitted to the interior of the high-pressure air storage chamber.
Therefore, as one of the main features of the present invention, a high pressure air receiver 7 is provided at the upper end of the casing 1, and when heat is radiated, external air is temporarily stored in the high pressure air receiver 7 by the air pump 5 to increase the pressure of the external air, and it is known that the greater the air flow blown to the pressure variable module, the faster the heat radiation speed when the pressure of the air in the high pressure air receiver 7 is increased to a certain value and the air in the high pressure air receiver 7 is released again, the greater the flow rate of the air, and the higher the heat radiation speed.
Fixed mounting has the semiconductor cooler 8 that is arranged in the air cooling to in the high-pressure reservoir 7 on the hypoplastron of double-deck triangle top cap 2, and high-pressure reservoir 7 in this embodiment not only can increase air velocity, simultaneously through semiconductor cooler 8, cool down the air in the high-pressure reservoir 7 once more, thereby when the air in high-pressure reservoir 7 was used in the vary voltage subassembly cooling, utilize the heat convection principle, the radiating efficiency of improvement vary voltage subassembly that can further.
According to the fact that the semiconductor refrigerator 8 is a thermoelectric refrigerating material with thermoelectric energy conversion characteristics, due to the fact that the semiconductor material has the best thermoelectric energy conversion performance characteristics, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively by utilizing the Peltier effect of the semiconductor material, and double purposes of refrigerating and heating can be achieved.
In the present embodiment, the air is cooled mainly by the cooling end of the semiconductor refrigerator 8, so that the cooling end of the semiconductor refrigerator 8 faces the high-pressure air receiver 7 to cool the temporarily stored air, and the heating end of the semiconductor refrigerator 8 faces the upper plate of the triangular double-layer top cover 2, and the heat is discharged through the upper plate of the triangular double-layer top cover 2.
Preferably, in the present embodiment, the lower plate of the triangular double-layer top cover 2 is a heat insulating plate, the upper plate of the triangular double-layer top cover 2 is a heat conducting plate, and the middle sections of the cooling end and the heating end of the semiconductor refrigerator 8 are fixedly mounted on the lower plate of the triangular double-layer top cover 2.
This embodiment keeps apart semiconductor refrigeration's system hot junction and refrigeration end, and the lower board of the double-deck top cap 2 of triangle is selected as the thermal-insulated board material, and the effectual low temperature effect that prevents to heat the end influence system cold junction guarantees the stable low temperature environment of high-pressure gas receiver 7.
This embodiment will heat the end and mainly set up in the cavity of triangle double-deck top cap 2, in order to guarantee semiconductor cooler 8's security performance, need in time carry out the thermal treatment to semiconductor cooler 8's the end that heats, avoid the temperature in the end that heats too big, damage semiconductor cooler 8 itself, consequently be equipped with a plurality of evenly distributed's radiating through-hole 12 in the most advanced both sides of upper plate of triangle double-deck top cap 2, semiconductor cooler 8's the end that heats is equipped with radiator fan 13, increases the air flow through radiator fan 13, carries out cooling treatment to semiconductor cooler 8's the end that heats, and the heat is realizing the air convection through radiating through-hole 12, further accelerates cooling efficiency.
In addition, the inner hole opening of the heat dissipation through hole 12 is slightly higher than the outer hole opening of the heat dissipation through hole 12, the shape characteristics of the heat dissipation through hole 12 do not influence the normal heat dissipation treatment of the semiconductor refrigerator 8, and meanwhile, rainwater in rainy days can be prevented from falling into the cavity of the triangular double-layer top cover 2 from the heat dissipation through hole 12 to damage the heating end of the semiconductor refrigerator 8, so that the rainwater prevention effect is achieved.
To sum up, the main functions of the structure on the triangular double-layer top cover 2 are as follows:
firstly, the lower plate of the triangular double-layer top cover 2 is a heat insulation plate, so that the heating end of the semiconductor refrigerator 8 is prevented from influencing the normal cooling effect of the cooling end;
two, set up a plurality of evenly distributed's heat dissipation through-hole 12 at the edge of triangle double-deck top cap 2, because the heat in heating end can't be through the cooling of refrigeration end, consequently this embodiment reduces the temperature on heating end surface through radiator fan 13 to realize the heat convection with heat through heat dissipation through-hole 12, guarantee to heat the end normal cooling and handle, improve the holistic life of semiconductor cooler 8.
Therefore, as the second main characteristic point of the present invention, after the heating end of the semiconductor refrigerator 8 cools the air inside the high-pressure air storage chamber 7, and the air pressure of the high-pressure air storage chamber 7 reaches a certain requirement, the cold air is uniformly ejected through the plurality of air guide outlets 9 with downward openings of the sealing plate 3, and the electromagnetic valves 10 are arranged in the air guide outlets 9 and are opened, at this time, the air flow speed is high, and the air temperature is low, so that a good cooling effect can be achieved for the voltage transformation assembly.
As the air pump 5 continuously pressurizes the inside of the box body 1, in order to keep the internal air pressure of the box body 1 at the standard atmospheric pressure, the invention is provided with a heat dissipation air outlet mechanism 11 for forming air convection on each side surface of the box body 1.
As shown in fig. 2 and 3, the heat dissipation air outlet mechanism 11 includes a heat dissipation window 14 disposed on the box body 1, a plurality of rotating louver fans 15 are disposed on the heat dissipation window 14 and are horizontally and uniformly distributed, an insertion hole 16 is disposed at an edge position of the heat dissipation window 14, and two ends of each rotating louver fan 15 are inserted into the insertion hole 16 and can rotate around the insertion hole 16.
The rotating louver 15 is normally open, and when the high-pressure air sprayed from the air guide outlet 9 at the top of the box body 1 cools the voltage transformation assembly, the air is discharged from the heat dissipation window 14 to realize air convection, so that the heat dissipation rate is increased.
Therefore, as a third main characteristic point of the present invention, in the present embodiment, the high-pressure air storage chamber 7 is disposed at the top end of the box body 1, and the heat dissipation window 14 is disposed at the lower end of each side surface of the box body 1, so as to provide two heat dissipation modes, the first heat dissipation mode is air convection heat dissipation, the rotating louver 15 of the heat dissipation window 14 is opened, and the high-pressure air ejected from the high-pressure air storage chamber 7 completely passes through the voltage transformation component, cools the voltage transformation component, and is then exhausted from the gap between the rotating louver 15 of the heat dissipation window 14; the second heat dissipation mode is low-temperature pressure maintaining heat dissipation, the rotating louver fan 15 of the heat dissipation window 14 is closed, the air is cooled through the semiconductor refrigerator 8, the cooled air is used for cooling the variable-pressure component in the sealed box body 1 space, when the pressure of the box body 1 reaches the maximum safe pressure, the rotating louver fan 15 is opened again, cold air is released to balance air pressure, the second heat dissipation mode is circulated, the variable-pressure component can be cooled rapidly at low temperature, therefore, the heat dissipation area of the variable-pressure component can be effectively increased by using the high-pressure air storage chamber 7 and the heat dissipation window 14 in a combined mode, and the heat dissipation effect is further improved.
According to the above description of the combined function of the high-pressure air storage chamber 7 and the rotating louver 15, the high-pressure air storage chamber 7 has two implementation modes of air convection heat dissipation and low-temperature heat reduction, when the rotating louver 15 rotates to the heat dissipation window 14 to be in an open state, the air sprayed from the high-pressure air storage chamber 7 realizes the air convection heat dissipation, and when the rotating louver 15 rotates to the heat dissipation window 14 to be in a closed state, the cold air sprayed from the high-pressure air storage chamber 7 keeps the low-temperature reduction on the voltage transformation assembly.
In order to ensure that the rotating louver 15 can automatically realize opening and closing operations, in the present embodiment, a linear driving mechanism 17 is provided at one end of all the rotating louver 15, the linear driving mechanism 17 includes an action toothed ring 1701 provided at the same side end of all the rotating louver 15, and a pushing cylinder 1702 driving the action toothed ring 1701 to rotate, an output shaft of the pushing cylinder 1702 vertically moves up and down, a push-pull saw blade 1703 engaged with the action toothed ring 1701 is mounted on the output shaft of the pushing cylinder 1702, and the pushing cylinder 1702 drives the rotating louver 15 to rotate forward and backward by the push-pull saw blade 1703.
For example, if the pushing cylinder 1702 pushes the push-pull saw blade 1703 to engage with the action toothed ring 1701, and the rotating louver 15 is driven to rotate forward, the distance between the adjacent rotating louver fans 15 is increased, and normal air convection heat dissipation operation can be performed, otherwise, when the pushing cylinder 1702 pulls the push-pull saw blade 1703 in the reverse direction to engage with the action toothed ring 1701, and the rotating louver 15 is driven to rotate backward, the distance between the adjacent rotating louver fans 15 is decreased until the rotating louver fans 15 completely shield the heat dissipation window 14, and the box body 1 is in a sealed state, so that low-temperature heat reduction processing can be performed on the voltage transformation assembly conveniently.
The pushing cylinder 1702 is installed on the inner wall of the box body 1, an inner sunken three-dimensional groove 1704 which can be used for the action ring 1701 to rotate is arranged on the inner wall of the box body 1, a plurality of trapezoidal baffles 1705 which are uniformly distributed are arranged at the edge of the inner sunken three-dimensional groove 1704, and the trapezoidal baffles 1705 act on the outer surface of the push-pull saw blade 1703 to limit the push-pull saw blade 1703 to vertically move.
In order to avoid the push-pull saw blade 1403 from tilting or deforming in other directions, and therefore the push-pull saw blade 1403 cannot be completely meshed with the action toothed ring 1401, the trapezoidal baffle 1405 is used for circling the push-pull saw blade 1403, and the push-pull saw blade 1403 is guaranteed to move only in the vertical direction.
As shown in fig. 4, the push cylinder 1702 is connected to a temperature monitoring system 18, the temperature monitoring system 18 monitors the temperature of the variable pressure component in real time by using a temperature sensor 19, the temperature sensor 19 is connected to an input end of the temperature monitoring system 18, and the suction pump 5, the semiconductor refrigerator 8 and the push cylinder 1702 are connected to an output end of the temperature monitoring system 18.
The temperature monitoring system 18 divides the temperature of the variable pressure component into a safety range, a convection heat dissipation range and a low-temperature pressure maintaining range according to the monitoring value of the temperature sensor 19, and the temperature monitoring system 18 controls the working states of the air pump 5, the semiconductor refrigerator 8 and the pushing cylinder 1702 according to the temperature corresponding range of the variable pressure component.
When the temperature monitoring system 18 is larger than the normal value according to the data of the temperature sensor 19, the temperature monitoring system 18 selects one of the heat dissipation modes according to the current temperature range, so that the temperature monitoring system 18 controls the air pump 5 to work, and adjusts the inward extension and the outward extension of the push cylinder 1702, so as to drive the rotating louver 15 to rotate forward and backward, realize the regulation and control of the opening and the closing of the heat dissipation window 11, and respectively complete the automatic control of the two heat dissipation modes.
When the air convection heat dissipation mode is selected according to the current temperature of the variable pressure component, the temperature monitoring system 18 controls the air pump 5 to work, the air cylinder 1702 is pushed to control the rotating louver fan 15 to be opened relatively, the air pump 5 conveys and collects external air into the high-pressure air storage chamber 7, the air pressure is increased gradually, the air flow speed when the air is released is improved, and the rapid heat dissipation of the variable pressure component is realized.
When low-temperature pressure maintaining and temperature reduction are selected according to the current temperature of the variable-pressure component, the temperature monitoring system 18 controls the air pump 5 to work, the air cylinder 1702 is pushed to control the rotary louver fan 15 to be closed relatively, the air pump 5 conveys and collects external air into the high-pressure air storage chamber 7 firstly, the air pressure is increased gradually, the air is cooled through the semiconductor refrigerator 8, and after cold air is released, the temperature in the box body is reduced within a period of time, so that the rapid temperature reduction of the variable-pressure component is realized.
Therefore, when the air convection heat dissipation mode and the low-temperature pressure maintaining and cooling mode are used, the air pressure in the high-pressure air storage chamber 7 needs to be monitored in real time, so that the air pressure detectors 20 are installed in the high-pressure air storage chamber 7 and the box body 1, the air pressure detectors 20 are connected with the flow concentration pressure processing unit 21, the air pressure detectors 20 are connected with the input end of the flow concentration pressure processing unit 21, and the electromagnetic valve 10 and the pushing cylinder 1702 are respectively connected with the output end of the flow concentration pressure processing unit 21.
In addition, in this embodiment, when the low-temperature pressure-maintaining and cooling mode is used to cool the voltage transformation assembly, the air pressure detector 20 is also required to monitor the air pressure in the tank 1 in real time, so that there are at least two air pressure detectors 20 in this embodiment, one of the two air pressure detectors is used to monitor the air pressure in the high-pressure air storage chamber 7, and the other is used to monitor the air pressure in the tank 1, when the air pressure in the high-pressure air storage chamber 7 reaches a rated value, the manifold pressure processing unit 21 controls the electromagnetic valve 10 to open, releases the air in the high-pressure air storage chamber 7, and controls the push cylinder 1702 to close, so as to maintain the pressure and cool the tank 1, and after the pressure increases to a certain value, the manifold pressure processing unit 21 controls the push cylinder 1702 to open, so as to reduce the pressure in the tank 1, and replace the newest.
Example 2
As shown in fig. 5, in order to explain the implementation process of the heat dissipation function, the invention further provides a heat dissipation method of a high-efficiency heat dissipation type pre-installed substation, which includes the following steps:
step 100, detecting the real-time temperature of the voltage transformation assembly by the temperature sensor, comparing the real-time temperature with a set threshold in real time, and dividing the real-time temperature into three levels according to the size, wherein the three levels are a safety range, a convection heat dissipation range and a low-temperature heat reduction range.
And 200, if the temperature of the variable-pressure component is in the convection heat dissipation range, implementing an air convection heat dissipation mode, opening the rotating louver fan, and performing convection heat dissipation treatment on the variable-pressure component by utilizing the air suction pump for collecting and pressurizing.
Because the working strength of the transformer station is larger, the rotating louver fan is in a normally open state within the safe temperature range of the transformer assembly for facilitating heat dissipation.
And step 300, if the temperature of the voltage transformation assembly is in a low-temperature heat reduction range, implementing a low-temperature pressure maintaining heat reduction mode, closing the rotating louver, performing flow collecting pressurization by using an air extraction pump, electrifying the semiconductor refrigerator, closing the rotating louver, and implementing low-temperature pressure maintaining cooling treatment on the voltage transformation assembly.
And step 400, monitoring the air pressure inside the box body in real time, closing the rotary louver when the internal air pressure is larger than a safety range, discharging cold air, and performing cooling treatment of low-temperature pressure maintaining on the variable-pressure component again after the air pressure is reduced.
And after the low-temperature pressure maintaining and heat reducing mode is selected, the low-temperature pressure maintaining and heat reducing mode continuously works until the temperature of the voltage transformation assembly is reduced to be within a safety range.
And 500, reducing the temperature of the voltage transformation assembly to a safe range, and stopping heat dissipation treatment.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. The utility model provides a high-efficient heat dissipation type prepackage type transformer substation which characterized in that: the device comprises a box body (1) and a triangular double-layer top cover (2) arranged at the top end of the box body (1), a sealing plate (3) is arranged below the triangular double-layer top cover (2) on the inner wall of the box body (1) through threads, an air inlet (4) is arranged on a side panel of the box body (1), an air suction pump (5) is arranged on the outer surface of the box body (1) at the position of the air inlet (4), an air supply pipeline (6) is arranged between the air inlet (4) and the sealing plate (3), a high-pressure air storage chamber (7) used for temporarily storing the pressure of pressurized air is formed between the sealing plate (3) and the double-layer triangular top cover (2), and air outside the box body is transmitted to the high-pressure air storage chamber (7) through the air supply pipeline (6);
the air-cooling box is characterized in that a semiconductor refrigerator (8) used for cooling air in the high-pressure air storage chamber (7) is fixedly mounted on a lower plate of the double-layer triangular top cover (2), a plurality of air guide outlets (9) with downward openings are further arranged on the sealing plate (3), each air guide outlet (9) is internally provided with an electromagnetic valve (10), and each side face of the box body (1) is provided with a heat dissipation air outlet mechanism (11) used for forming air convection.
2. The high-efficiency heat-dissipation type preassembled transformer substation as claimed in claim 1, characterized in that: the refrigeration end of semiconductor refrigerator (8) is towards high-pressure gas storage chamber (7), the end of heating of semiconductor refrigerator (8) is towards the upper plate of the double-deck top cap of triangle (2), the hypoplastron of the double-deck top cap of triangle (2) is the heat insulating board, the upper plate of the double-deck top cap of triangle (2) is the heat-conducting plate, the most advanced both sides of upper plate of the double-deck top cap of triangle (2) are equipped with a plurality of evenly distributed's radiating through-hole (12), and the middle section fixed mounting of the cold end of semiconductor refrigerator (8) and the end of heating is on the hypoplastron of the double-deck top cap of triangle (2), the end of heating of semiconductor refrigerator (8) is equipped.
3. The high-efficiency heat-dissipation type preassembled transformer substation as claimed in claim 1, characterized in that: the heat dissipation air outlet mechanism (11) comprises a heat dissipation window (14) arranged on the box body (1), a plurality of rotating louver fans (15) which are uniformly distributed horizontally are arranged on the heat dissipation window (14), an inserting hole (16) is formed in the edge position of the heat dissipation window (14), and two ends of each rotating louver fan (15) are inserted into the inserting hole (16) and can rotate around the inserting hole (16).
4. The high-efficiency heat-dissipation type preassembled transformer substation as claimed in claim 1, characterized in that: all the one end that rotate louver fan (15) still is equipped with linear drive mechanism (17), linear drive mechanism (17) are including setting up effect ring gear (1701) at all rotation louver fan (15) with the side to and drive the rotatory push cylinder (1702) of effect ring gear (1701), the vertical reciprocating of output shaft of push cylinder (1702), install on the output shaft of push cylinder (1702) and act on the push-and-pull saw blade (1703) of ring gear (1701) meshing, push cylinder (1702) drive through push-and-pull saw blade (1703) and rotate louver fan (15) just reverse.
5. The high-efficiency heat-dissipation type preassembled transformer substation as claimed in claim 2, characterized in that: the inner hole opening of the heat dissipation through hole (12) is slightly higher than the outer hole opening of the heat dissipation through hole (12).
6. The preassembled transformer substation with the heat dissipation and moisture prevention functions of claim 4, wherein: the temperature monitoring system is characterized in that the pushing cylinder (1702) is connected with a temperature monitoring system (18), the temperature monitoring system (18) utilizes a temperature sensor (19) to monitor the temperature of the variable pressure component in real time, the temperature sensor (19) is connected with the input end of the temperature monitoring system (18), the air suction pump (5), the semiconductor refrigerator (8) and the pushing cylinder (1702) are connected with the output end of the temperature monitoring system (18), the temperature monitoring system (18) divides the temperature of the variable pressure component into a safety range, a convection heat dissipation range and a low-temperature pressure maintaining range according to the monitoring value of the temperature sensor (19), and the temperature monitoring system (18) controls the working states of the air suction pump (5), the semiconductor refrigerator (8) and the pushing cylinder (1702) according to the temperature corresponding range of the variable pressure component.
7. The high-efficiency heat-dissipation type preassembled transformer substation as claimed in claim 4, wherein: an air pressure detector (20) is installed in the high-pressure air storage chamber (7), the air pressure detector (20) is connected with a flow concentration pressure processing unit (21), the air pressure detector (20) is connected with the input end of the flow concentration pressure processing unit (21), and the electromagnetic valve (10), the pushing cylinder (1702) and the air suction pump (5) are respectively connected with the output end of the flow concentration pressure processing unit (21).
8. A heat dissipation method of a high-efficiency heat dissipation type preassembled transformer substation is characterized by comprising the following steps:
step 100, detecting the real-time temperature of the voltage transformation assembly by a temperature sensor, comparing the real-time temperature with a set threshold in real time, and dividing the real-time temperature into three levels according to the size, wherein the three levels are a safety range, a convection heat dissipation range and a low-temperature heat reduction range;
step 200, if the temperature of the variable-pressure component is in a convection heat dissipation range, implementing an air convection heat dissipation mode, opening the rotating louver fan, performing flow collection and pressurization by using an air suction pump, and performing convection heat dissipation treatment on the variable-pressure component;
step 300, if the temperature of the voltage transformation assembly is in a low-temperature heat reduction range, implementing a low-temperature pressure maintaining heat reduction mode, closing the rotating louver, performing flow collecting pressurization by using an air pump, electrifying the semiconductor refrigerator, closing the rotating louver, and implementing low-temperature pressure maintaining cooling treatment on the voltage transformation assembly;
step 400, monitoring the internal air pressure of the box body in real time, closing the rotary louver when the internal air pressure is larger than a safety range, discharging cold air, and performing cooling treatment of low-temperature pressure maintaining on the variable-pressure component again after the air pressure is reduced;
and 500, reducing the temperature of the voltage transformation assembly to a safe range, and stopping heat dissipation treatment.
9. The heat dissipation method of the high-efficiency heat dissipation type preassembled transformer substation as claimed in claim 8, wherein: in step 200, the rotating louver is normally open within the safe temperature range of the voltage transformation assembly.
10. The heat dissipation method of the high-efficiency heat dissipation type preassembled transformer substation as claimed in claim 8, wherein: in step 300, after the low-temperature pressure maintaining and heat reducing mode is selected, the low-temperature pressure maintaining and heat reducing mode continues to work until the temperature of the voltage transformation component is reduced to a safe range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911102873.2A CN111064094B (en) | 2019-11-12 | 2019-11-12 | Efficient heat dissipation type prefabricated substation and heat dissipation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911102873.2A CN111064094B (en) | 2019-11-12 | 2019-11-12 | Efficient heat dissipation type prefabricated substation and heat dissipation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111064094A true CN111064094A (en) | 2020-04-24 |
| CN111064094B CN111064094B (en) | 2021-09-17 |
Family
ID=70297793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911102873.2A Active CN111064094B (en) | 2019-11-12 | 2019-11-12 | Efficient heat dissipation type prefabricated substation and heat dissipation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111064094B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113241596A (en) * | 2021-05-31 | 2021-08-10 | 曹占魁 | Sealed high-efficiency heat-dissipation electric power cabinet |
| CN113991975A (en) * | 2021-10-27 | 2022-01-28 | 浙江佳乐科仪股份有限公司 | Special frequency converter for textile machine |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104953493A (en) * | 2015-07-17 | 2015-09-30 | 国家电网公司 | Smart cooling device for electric power high-voltage switch cabinet and control method thereof |
| EP3182813A1 (en) * | 2015-12-18 | 2017-06-21 | ABB Technology Oy | Inverter cooler system |
| US9795065B2 (en) * | 2015-12-21 | 2017-10-17 | Dell Products, L.P. | Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem |
| CN207070557U (en) * | 2017-06-03 | 2018-03-02 | 东莞几何网络科技有限公司 | A kind of cloud storage service device cabinet to cool automatically |
| CN109038303A (en) * | 2018-07-17 | 2018-12-18 | 东南大学 | A kind of composite ventilated cooling system of main transformer room |
| CN208284871U (en) * | 2018-05-17 | 2018-12-25 | 山西华禧电力工程有限公司 | The heat dissipating cabinet body structure of the compound cabinet of smart grid photoelectricity |
| CN208589689U (en) * | 2018-07-18 | 2019-03-08 | 山东瑞邦电气有限公司 | A kind of box-type substation cooling device |
-
2019
- 2019-11-12 CN CN201911102873.2A patent/CN111064094B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104953493A (en) * | 2015-07-17 | 2015-09-30 | 国家电网公司 | Smart cooling device for electric power high-voltage switch cabinet and control method thereof |
| EP3182813A1 (en) * | 2015-12-18 | 2017-06-21 | ABB Technology Oy | Inverter cooler system |
| US9795065B2 (en) * | 2015-12-21 | 2017-10-17 | Dell Products, L.P. | Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem |
| CN207070557U (en) * | 2017-06-03 | 2018-03-02 | 东莞几何网络科技有限公司 | A kind of cloud storage service device cabinet to cool automatically |
| CN208284871U (en) * | 2018-05-17 | 2018-12-25 | 山西华禧电力工程有限公司 | The heat dissipating cabinet body structure of the compound cabinet of smart grid photoelectricity |
| CN109038303A (en) * | 2018-07-17 | 2018-12-18 | 东南大学 | A kind of composite ventilated cooling system of main transformer room |
| CN208589689U (en) * | 2018-07-18 | 2019-03-08 | 山东瑞邦电气有限公司 | A kind of box-type substation cooling device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113241596A (en) * | 2021-05-31 | 2021-08-10 | 曹占魁 | Sealed high-efficiency heat-dissipation electric power cabinet |
| CN113241596B (en) * | 2021-05-31 | 2022-07-22 | 西安昊正实业有限公司 | Sealed high-efficiency heat-dissipation electric power cabinet |
| CN113991975A (en) * | 2021-10-27 | 2022-01-28 | 浙江佳乐科仪股份有限公司 | Special frequency converter for textile machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111064094B (en) | 2021-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209133937U (en) | A kind of high-tension switch cabinet of good heat dissipation effect | |
| CN111064094B (en) | Efficient heat dissipation type prefabricated substation and heat dissipation method thereof | |
| US5488801A (en) | Solar appliances | |
| CN211046177U (en) | Intelligent box-type substation based on internet technology | |
| CN110912009A (en) | Electric control cabinet capable of keeping constant temperature | |
| CN206992559U (en) | A kind of power distribution cabinet of fast cooling | |
| CN219959897U (en) | Outdoor power distribution cabinet with good heat dissipation effect | |
| CN106488692B (en) | A kind of idle Temperature fall Cabinet | |
| CN219041195U (en) | Intelligent constant temperature control JP cabinet | |
| CN111237933A (en) | Hybrid cooling system between unmanned on duty equipment of no external electricity | |
| CN105281233A (en) | Safe outdoor electric power equipment cabinet with high efficiency | |
| CN112489947B (en) | Multifunctional automatic transformer | |
| CN204836921U (en) | Outdoor rack with intelligence shutter exhaust apparatus | |
| CN116014593A (en) | Feeder cabinet with movable heat dissipation device | |
| CN114017867A (en) | Intelligent environment control machine | |
| CN110863622B (en) | Integrated building with novel ventilation roofing | |
| CN207378981U (en) | The cooling system in relative closure space | |
| CN207006626U (en) | Round-the-clock dual intensity integration supplies collecting system | |
| CN207353701U (en) | A kind of intelligent outdoor comprehensive distribution box | |
| CN111828157A (en) | Heat radiator of mute diesel generator | |
| CN217735610U (en) | Mute box type generator set with heat radiation structure | |
| CN220914849U (en) | Efficient energy-saving preassembled transformer substation | |
| CN109788723A (en) | A kind of driving power intelligence cooler bin | |
| CN219919842U (en) | Automatic fresh air system with external solar power | |
| CN216215263U (en) | Safety switch cabinet with heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |