CN111049706B - Communication module testing device - Google Patents
Communication module testing device Download PDFInfo
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- CN111049706B CN111049706B CN201911346534.9A CN201911346534A CN111049706B CN 111049706 B CN111049706 B CN 111049706B CN 201911346534 A CN201911346534 A CN 201911346534A CN 111049706 B CN111049706 B CN 111049706B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L43/00—Arrangements for monitoring or testing data switching networks
- H04L43/50—Testing arrangements
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Abstract
The invention discloses a communication module testing device, which comprises: the switching circuit is used for connecting with the functional interface of the communication module and converting the functional interface into at least two paths of outputs, and each path of output corresponds to different functional modules or interfaces respectively; the control switch is connected with the switching control end of the switch circuit and used for outputting a control signal to the switching control end, and the control signal is used for controlling the switch circuit to select one output from the at least two outputs to be connected with a corresponding functional module or interface; the power input interface is used for accessing a power supply; and the voltage conversion circuit is connected with the power input interface and the functional module or the interface and is used for converting the power into the voltage required by the communication module or the functional module and then supplying power. According to the invention, through the matching of the switch circuit and the control switch, the free switching between the functional interface and different functional modules or interfaces is realized, and different test requirements are met.
Description
Technical Field
The invention belongs to the field of communication, and particularly relates to a communication module testing device.
Background
The existing communication module test scheme is to connect the tested communication module to test devices with different functions, and usually only one peripheral is connected to one test device, so that the same functional interface can only be fixedly connected with one peripheral and cannot be connected with other peripherals, and if the communication module is connected with different peripherals, only the test device can be replaced. The testing device with single function and fixedly connected with the peripheral cannot meet the requirement of quickly switching different peripherals during testing.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a communication module testing device, which aims to overcome the defect that the existing module testing device in the prior art can only allow a functional interface and one peripheral to be fixedly connected and cannot meet the requirement of quickly switching different peripherals during testing.
The invention solves the technical problems through the following technical scheme:
a communication module testing apparatus, comprising:
the switching circuit is used for connecting with the functional interface of the communication module and converting the functional interface into at least two paths of outputs, and each path of output corresponds to different functional modules or interfaces respectively;
the control switch is connected with the switching control end of the switch circuit and used for outputting a control signal to the switching control end, and the control signal is used for controlling the switch circuit to select one output from the at least two outputs to be connected with a corresponding functional module or interface;
the power input interface is used for accessing a power supply;
and the voltage conversion circuit is connected with the power input interface and the functional module or the interface and is used for converting the power into the voltage required by the communication module or the functional module and then supplying power to the communication module or the functional module.
Preferably, the control switch comprises a toggle switch.
Preferably, the same control switch is connected to the switching control terminals of two or more switching circuits, and the control switch is configured to synchronously output the control signal to the switching control terminals of all the connected switching circuits.
Preferably, two or more control switches are connected to the switching control end of the same switch circuit, the control signals output by all the control switches constitute a combined control signal, and the combined control signal is used for controlling the commonly connected switch circuit to select one output from the at least two outputs to be connected with the corresponding functional module or interface.
Preferably, the functional interface includes an SDIO (secure digital input/output card) interface, the switch circuit includes a first switch circuit, the first switch circuit is used for connecting with the SDIO interface and converting the SDIO interface into two paths of outputs, and each path of output corresponds to an SD (secure digital) card functional test module and an EMMC (embedded memory standard specification established by the MMC association and mainly aimed at products such as mobile phones or tablet computers) functional test module.
Preferably, the functional interfaces include a USB2.0 interface and a USB3.0 interface;
the switching circuit comprises a second switching circuit and a third switching circuit;
the second switch circuit is used for connecting with the USB2.0 interface and converting the USB2.0 interface into two paths of outputs, and each path of output respectively corresponds to a PC (personal computer) end interface and an AP (wireless access point) processor end interface;
the third switch circuit is used for connecting with the USB3.0 interface and converting the USB3.0 interface into two paths of output, and each path of output corresponds to a PC end interface and an AP processor end interface respectively;
and the same control switch is connected with the switching control end of the second switch circuit and the switching control end of the third switch circuit.
Preferably, the functional interface comprises a PCIE (a high speed serial computer expansion bus standard) interface;
the switching circuit comprises a fourth switching circuit;
the fourth switch circuit is used for being connected with the PCIE interface and converting the PCIE interface into three paths of outputs, and each path of output corresponds to an AP processor terminal interface, a WiFi interface and a PC terminal interface respectively;
and the two control switches are connected with the switching control end of the fourth switch circuit, and control signals output by the two control switches form a two-bit binary combination control signal.
Preferably, the communication module testing apparatus further includes: the millimeter wave antenna module is used for accessing a radio frequency antenna control signal from the communication module;
the millimeter wave power supply is arranged adjacent to the millimeter wave antenna module;
and the heat dissipation device is arranged adjacent to the millimeter wave power supply.
Preferably, the switch circuit, the control switch, the power input interface and the voltage conversion circuit are arranged on an EVB (evaluation board), a patch stud is further welded on the EVB, and the EVB and a communication module connected with the EVB are fixed through the patch stud.
Preferably, the communication module is provided with a first radio frequency base, the EVB is further provided with a second radio frequency base, and the first radio frequency base and the second radio frequency base are connected through a radio frequency coaxial line.
On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.
The positive progress effects of the invention are as follows: according to the invention, through the matching of the switch circuit and the control switch, the free switching between the functional interface and different functional modules or interfaces is realized, and different test requirements are met.
Drawings
Fig. 1 is a schematic block diagram of a communication module testing apparatus according to embodiment 1 of the present invention;
fig. 2 is a partial schematic block diagram of a communication module testing apparatus according to embodiment 1 of the present invention, in which the functional interface is an SDIO interface;
fig. 3 is a partial schematic block diagram of a communication module testing apparatus in which functional interfaces are a USB2.0 interface and a USB3.0 interface according to embodiment 1 of the present invention;
fig. 4 is a partial schematic block diagram of a communication module testing apparatus in which a functional interface is a PCIE interface in embodiment 1 of the present invention.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
Example 1
The embodiment provides a testing device for a communication module. As shown in fig. 1, the communication module testing apparatus includes: a switch circuit 11, a control switch 12, a power input interface 13 and a voltage conversion circuit 14.
The switch circuit 11 is used for connecting with the functional interface 01 of the communication module and converting the functional interface 01 into at least two paths of outputs, and each path of output corresponds to a different functional module or interface 15. The control switch 12 is connected to a switching control end of the switch circuit 11, the control switch 12 is configured to output a control signal to the switching control end, and the control signal is configured to control the switch circuit 11 to select one of the at least two outputs to connect to a corresponding functional module or interface 15. The power input interface 13 is used for accessing a power supply. The voltage conversion circuit 14 is connected to the power input interface 13 and the functional module or interface 15, and the voltage conversion circuit 14 is configured to convert a power supply into a voltage required by the communication module 01 or the functional module 15 and then supply power to the communication module 01 or the functional module 15.
In this embodiment, the communication module may be a 5G communication module, the functional interface may be any one or more functional interfaces of the communication module, the whole communication module testing apparatus may include more than one switch circuit 11 and one control switch 12, and the switching between the functional interface 01 and different functional modules or interfaces 15 is realized by controlling the switch circuit 11 through the control switch 12. A control switch 11 can control a switch circuit 12 to realize the switching connection of one functional interface 01 and different functional modules or interfaces 15; one control switch 11 can also synchronously control a plurality of switch circuits 12 to synchronously realize the switching connection of a plurality of functional interfaces 01 and corresponding functional modules or interfaces 15; a plurality of control switches 12 can also jointly control a switch circuit 11 for the switched connection of a functional interface 01 to a plurality of functional modules or interfaces 15. The connections described herein all include electrical conduction.
For the case that one control switch 12 controls one switch circuit 11, one control switch 12 is connected to the switching control terminal of one switch circuit 11, and the control switch 12 outputs a control signal to the connected one switch circuit 11:
as shown in fig. 2, taking the functional interface as the SDIO interface 011 as an example, the switch circuit connected to the SDIO interface 011 is the first switch circuit 111, and the control switch connected to the switching control terminal of the first switch circuit 111 is the first control switch 121 (the power input interface 13 and the voltage conversion circuit 14 are omitted in the figure). The first switch circuit 111 is configured to convert the SDIO interface 011 into two outputs, where each output corresponds to the SD card function test module 151 and the EMMC function test module 152. The SD card function test module 151 includes related circuits for testing SD card functions, the EMMC function test module 152 includes related circuits for testing EMMC functions, and the specific circuits in the modules can be implemented by using the prior art, which is not described herein. The first control switch 121 outputs a first control signal to the switching control terminal of the first switch circuit 111. Taking the first control switch 121 as the first toggle switch as an example, the tester can toggle the first toggle switch according to the test requirement, and the first toggle switch outputs a high level or a low level according to the toggle position. Suppose that: a high level represents the SD card functional test module 151 and a low level represents the EMMC functional test module 152, then: when the first control signal is at a high level, the first switch circuit 111 connects one output of the SDIO interface 011 with the SD card function test module 151; when the first control signal is at a low level, the first switch circuit 111 connects the other output of the SDIO interface 011 to the EMMC function test module 152.
The above situation is more suitable for the situation that the functional module corresponding to the functional interface or the interface number is less, and two kinds of switching circuits are realized through one toggle switch.
For the situation that one control switch 12 controls two or more switch circuits 11, the same control switch 12 is connected to the switching control terminals of the two or more switch circuits 11, and the control switch 12 synchronously outputs control signals to the switching control terminals of all the connected switch circuits 11:
as shown in fig. 3, taking two functional interfaces to be switched as an example of the USB2.0 interface 012 and the USB3.0 interface 013, the switch circuit connected to the USB2.0 interface 012 is the second switch circuit 112, the second switch circuit 112 can be implemented using a TS3USB221 chip, the switch circuit connected to the USB3.0 interface 013 is the third switch circuit 113, the third switch circuit 113 can be implemented using an HD3SS32 chip, and the second control switch 122 is connected to both the switching control terminal of the second switch circuit 112 and the switching control terminal of the third switch circuit 113. The second switch circuit 112 is configured to convert the USB2.0 interface 012 into two outputs, where each output corresponds to the PC interface 153 and the AP processor interface 154. The third switch circuit 113 is configured to convert the USB3.0 interface 013 into two paths of outputs, where each path of output corresponds to the PC port interface 153 and the AP processor port interface 154, respectively. The second control switch 122 synchronously outputs the second control signal to the switching control terminal of the second switch circuit 112 and the switching control terminal of the third switch circuit 113. Taking the second control switch 122 as the second toggle switch as an example, the tester can toggle the second toggle switch according to the test requirement, and the second toggle switch outputs a high level or a low level according to the toggle position. Suppose that: high represents the PC-side interface 153 and low represents the AP processor-side interface 154, then: when the second control signal is at a high level, the second switch circuit 112 connects one output of the USB2.0 interface 012 with the PC terminal interface 153, and the third switch circuit 113 connects one output of the USB3.0 interface 013 with the PC terminal interface 153; when the second control signal is at a low level, the second switch circuit 112 interfaces the other output of the USB2.0 interface 012 with the AP processor terminal 154, and the third switch circuit 113 interfaces the other output of the USB3.0 interface 013 with the AP processor terminal 154.
The above condition is suitable for the condition that the functional interfaces are more in types and different functional interfaces have certain correlation during testing, a plurality of functional interfaces are realized through a toggle switch, and two switching circuits of each functional interface are favorable for simplifying the overall structure of the device and reducing the hardware cost.
Aiming at the condition that a plurality of control switches 12 control one switch circuit 11 together, two or more control switches 12 are connected with the switching control end of the same switch circuit 11, the control signals output by all the control switches 12 form a combined control signal, and the combined control signal is used for controlling the switch circuit 11 connected together to select one output from at least two outputs to be connected with a corresponding functional module or interface 15:
as shown in fig. 4, taking the functional interface as the PCIE interface 014 as an example, the switch circuit connected to the PCIE interface 014 is the fourth switch circuit 114, the fourth switch circuit 114 can be implemented by using a PI3PC1E3413 chip, and two control switches connected to the switching control end of the fourth switch circuit 114 are the third control switch 123 and the fourth control switch 124 respectively. The fourth switch circuit 114 is configured to convert the PCIE interface 014 into three outputs, where each output corresponds to the AP processor interface 154, the WiFi interface 155, and the PC interface 153, respectively. The third control signal of the third control switch 123 and the fourth control signal output by the fourth control switch 124 constitute a binary combined control signal of two bits. Taking the third control switch 123 as the third toggle switch and the fourth control switch 124 as the fourth toggle switch as an example, the tester can toggle the third toggle switch and the fourth toggle switch according to the test requirement, and the third toggle switch and the fourth toggle switch output a high level or a low level according to the toggle position. Suppose that: the third control signal is low and the fourth control signal is high representing the AP processor port 154, the third control signal is high and the fourth control signal is low representing the PC port 153, the third control signal is high and the fourth control signal is high representing the WiFi port 155, then: when the third control signal is at a low level and the fourth control signal is at a high level, the fourth switch circuit 114 connects the first output of the PCIE interface 014 with the AP processor terminal interface 154; when the third control signal is at a high level and the fourth control signal is at a low level, the fourth switch circuit 114 connects the second output of the PCIE interface 014 to the PC port interface 153; when the third control signal is at a high level and the fourth control signal is at a high level, the fourth switch circuit 114 connects the third output of the PCIE interface 014 with the WiFi interface 155.
The above situation is suitable for the situation that the functional modules corresponding to the functional interfaces or the interfaces are large in number, and more than two switching circuits are realized through a plurality of toggle switches.
In this embodiment, in order to enrich the test function, the communication module testing apparatus may further include: the millimeter wave antenna module is used for accessing a radio frequency antenna control signal from the communication module; the millimeter wave power supply is arranged adjacent to the millimeter wave antenna module; and the heat dissipation device is arranged adjacent to the millimeter wave power supply.
In this embodiment, in order to facilitate movement and use, the switch circuit 11, the control switch 12, the power input interface 13, and the voltage conversion circuit 14 are disposed on the EVB, and considering that the existing testing apparatus only connects the communication module 01 to each part on the EVB during testing but does not fix the communication module 01 to the EVB, which is easy to cause loose connection, thereby affecting the testing result, in this embodiment, a patch stud is further welded on the EVB, and the EVB and the communication module 01 connected to the EVB are fixed by the patch stud, so that on one hand, the EVB and the communication module 01 can be completely fixed, and on the other hand, the communication module 01 can be effectively prevented from warping.
In this embodiment, the communication module is provided with a first radio frequency base, the EVB is further provided with a second radio frequency base, and the first radio frequency base and the second radio frequency base are connected through a radio frequency coaxial line. The radio frequency impedance matching can be good through the connection of the radio frequency coaxial line, the number of the first radio frequency seats and the number of the second radio frequency seats can be multiple, and the radio frequency performance of different positions can be conveniently tested through the connection between different radio frequency seats. For example, the antennas with different functions, the main antenna, the diversity antenna and the GPS antenna can be connected to different radio frequency seats, so that the debugging is convenient, and the number of the radio frequency seats is reduced.
In this embodiment, the power input interface can use 12V power supply to supply power, and then converts the required voltage value of foretell functional module into through voltage conversion circuit, and communication module needs to use 5V and 3.8V power, and the AP processor needs to use 4.2V, and WIFI, EMMC, SD card need use 3.3V and 1.8V power.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and that the scope of the invention is defined by the appended claims. Various changes or modifications to these embodiments may be made by those skilled in the art without departing from the principle and spirit of this invention, and these changes and modifications are within the scope of this invention.
Claims (10)
1. A communication module testing apparatus, comprising:
the switching circuit is used for connecting with the functional interface of the communication module and converting the functional interface into at least two paths of outputs, and each path of output corresponds to different functional modules or interfaces respectively;
the control switch is connected with the switching control end of the switch circuit and used for outputting a control signal to the switching control end, and the control signal is used for controlling the switch circuit to select one output from the at least two outputs to be connected with a corresponding functional module or interface;
the power input interface is used for accessing a power supply;
and the voltage conversion circuit is connected with the power input interface and the functional module or the interface and is used for converting the power into the voltage required by the communication module or the functional module and then supplying power to the communication module or the functional module.
2. The communication module testing apparatus of claim 1, wherein the control switch comprises a toggle switch.
3. The apparatus according to claim 1, wherein the same control switch is connected to the switching control terminals of two or more switching circuits, and the control switch is configured to synchronously output the control signal to the switching control terminals of all the connected switching circuits.
4. The testing apparatus of claim 1, wherein two or more control switches are connected to the switching control terminal of the same switch circuit, and the control signals outputted from all the control switches constitute a combined control signal for controlling the commonly connected switch circuit to select one output from the at least two outputs for connecting to the corresponding functional module or interface.
5. The device as claimed in claim 1, wherein the functional interface comprises an SDIO interface, and the switch circuit comprises a first switch circuit, the first switch circuit is configured to connect to the SDIO interface and convert the SDIO interface into two outputs, and each output corresponds to the SD card functional test module and the EMMC functional test module.
6. The communication module testing apparatus of claim 3, wherein the functional interfaces comprise a USB2.0 interface and a USB3.0 interface;
the switching circuit comprises a second switching circuit and a third switching circuit;
the second switch circuit is used for connecting with the USB2.0 interface and converting the USB2.0 interface into two paths of output, and each path of output respectively corresponds to a PC end interface and an AP processor end interface;
the third switch circuit is used for being connected with the USB3.0 interface and converting the USB3.0 interface into two paths of output, and each path of output corresponds to a PC (personal computer) end interface and an AP (access point) processor end interface respectively;
and the same control switch is connected with the switching control end of the second switch circuit and the switching control end of the third switch circuit.
7. The apparatus of claim 4, wherein the functional interface comprises a PCIE interface;
the switching circuit comprises a fourth switching circuit;
the fourth switch circuit is used for being connected with the PCIE interface and converting the PCIE interface into three paths of outputs, and each path of output corresponds to an AP processor terminal interface, a WiFi interface and a PC terminal interface respectively;
and the two control switches are connected with the switching control end of the fourth switch circuit, and control signals output by the two control switches form a two-bit binary combination control signal.
8. The communication module testing apparatus of claim 1, further comprising: the millimeter wave antenna module is used for accessing a radio frequency antenna control signal from the communication module;
the millimeter wave power supply is arranged adjacent to the millimeter wave antenna module;
and the heat dissipation device is arranged adjacent to the millimeter wave power supply.
9. The communication module testing device of claim 1, wherein the switch circuit, the control switch, the power input interface and the voltage conversion circuit are disposed on an EVB, and a patch stud is further welded on the EVB, and the EVB and the communication module connected to the EVB are fixed by the patch stud.
10. The apparatus as claimed in claim 9, wherein the communication module has a first rf socket thereon, the EVB has a second rf socket thereon, and the first rf socket and the second rf socket are connected by a rf coaxial line.
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| CN201911346534.9A CN111049706B (en) | 2019-12-24 | 2019-12-24 | Communication module testing device |
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| CN201911346534.9A CN111049706B (en) | 2019-12-24 | 2019-12-24 | Communication module testing device |
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| CN112422204B (en) * | 2020-10-30 | 2023-04-07 | 重庆芯讯通无线科技有限公司 | Testing device of communication module |
| CN115397089A (en) * | 2021-05-25 | 2022-11-25 | 中兴通讯股份有限公司 | Printed circuit board, terminal, method, device and storage medium |
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