CN111048543A - Display module - Google Patents
Display module Download PDFInfo
- Publication number
- CN111048543A CN111048543A CN201811190142.3A CN201811190142A CN111048543A CN 111048543 A CN111048543 A CN 111048543A CN 201811190142 A CN201811190142 A CN 201811190142A CN 111048543 A CN111048543 A CN 111048543A
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- China
- Prior art keywords
- micro light
- display module
- pixel circuits
- light source
- light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
Abstract
The invention relates to a display module, which comprises a silicon wafer, a plurality of pixel circuits and a plurality of micro light sources, wherein the pixel circuits are formed on the silicon wafer. The micro light sources are arranged on the silicon wafer and are respectively and electrically connected with the corresponding pixel circuits so as to be driven by the pixel circuits to generate a plurality of light beams. The display module of the invention does not need to adopt a low-temperature polysilicon process, so the cost of the display module can be reduced. In addition, the process of arranging a plurality of pixel circuits on the silicon wafer is simple, so that the manufacturing error can be reduced.
Description
Technical Field
The present invention relates to a display module, and more particularly, to a small-sized display module.
Background
The display module can be applied to various electronic products, such as: various display interfaces such as televisions, computer screens, advertising panels, tablet computer screens, mobile phone screens and the like. Generally, a display module includes a plurality of light sources and a glass substrate, wherein the light sources are disposed on the glass substrate, and a plurality of circuits are disposed on the glass substrate and electrically connected to the light sources to drive the light sources, thereby generating required light.
With the progress of science and technology, an Organic Light Emitting Diode (OLED) is introduced in the market as a Light source of a display module, and compared with a common Thin film transistor liquid crystal display (TFT-LCD) module in the market, the display module using the OLED as the Light source has the advantages of wider viewing angle, higher contrast ratio, lower power consumption, faster response time, preferable color saturation, and the like.
However, the display module including the organic light emitting diode has the following disadvantages: the circuits disposed on the glass substrate must be formed by Low Temperature Poly-Silicon (LTPS) process, which is expensive in equipment cost, so that the cost of the display module is high. On the other hand, due to the material characteristics of the glass panel, errors are likely to occur in the circuit process.
Therefore, a display module with reduced cost and improved yield is needed.
Disclosure of Invention
The invention mainly aims to provide a display module capable of reducing cost.
Another objective of the present invention is to provide a display module capable of increasing yield.
In a preferred embodiment, the present invention provides a display module including a silicon wafer, a plurality of pixel circuits and a plurality of first micro light sources, wherein the plurality of pixel circuits are formed on the silicon wafer. Each first micro light source corresponds to one pixel circuit, and the plurality of first micro light sources are arranged on the silicon wafer and are respectively and electrically connected with the corresponding pixel circuits to be driven by the plurality of pixel circuits to generate a plurality of first light beams.
In short, the display module of the present invention has the pixel circuit disposed on the silicon wafer, and the electrical connections between the first micro light sources, the second micro light sources, and the third micro light sources are established, so as to avoid the error of the glass panel in the process, i.e., the display module of the present invention can reduce the manufacturing error. In addition, the display module only needs to adopt the traditional process, and does not need to adopt the low-temperature polysilicon process. Compared with the prior art, the display module has lower cost.
Drawings
Fig. 1 is a structural top view of a display module according to a preferred embodiment of the invention.
FIG. 2 is a top view of the first micro light source and the pixel circuit of the display module according to the present invention.
FIG. 3 is a schematic structural side view of a display module according to a preferred embodiment of the invention.
FIG. 4 is a partial circuit diagram of a display module according to a preferred embodiment of the invention.
Description of reference numerals:
1 display module
10 silicon wafer
11 first micro light source
12 second miniature light source
13 third micro light source
14 pixel circuit
15 control circuit
111 first conductive pad
121 second conductive pad
131 third conducting pad
Detailed Description
In view of the problems of the prior art, the present invention provides a display module to solve the disadvantages of the prior art. First, please refer to fig. 1, fig. 2 and fig. 3, wherein fig. 1 is a top view of a display module according to a preferred embodiment of the present invention, fig. 2 is a top view of a first micro light source and a pixel circuit of the display module according to the present invention, and fig. 3 is a side view of the display module according to the present invention. The display module 1 includes a silicon wafer 10, a plurality of first micro light sources 11, a plurality of second micro light sources 12, a plurality of third micro light sources 13, and a plurality of pixel circuits 14. A plurality of pixel circuits 14 are formed on the silicon wafer 10 by etching technology, and each pixel circuit 14 corresponds to one first micro light source 11, one second micro light source 12 or one third micro light source 13. The operation of the etching technique is well known to those skilled in the art and will not be described further.
The plurality of first micro light sources 11 are disposed on the silicon wafer 10 and located at one side of the silicon wafer 10, and the plurality of first micro light sources 11 are electrically connected to the corresponding pixel circuits 14 respectively, and can be driven by the plurality of pixel circuits 14 to generate a plurality of first light beams. The plurality of second micro light sources 12 are disposed on the silicon wafer 10 and located at one side of the plurality of first micro light sources 11, and the plurality of second micro light sources 12 are electrically connected to the corresponding pixel circuits 14 respectively, and can be driven by the plurality of pixel circuits 14 to generate a plurality of second light beams. The third micro light sources 13 are disposed on the silicon wafer 10 and located on the other side of the silicon wafer 10, and the third micro light sources 13 are electrically connected to the corresponding pixel circuits 14 respectively, and can be driven by the pixel circuits 14 to generate third light beams. The pixel circuit 14 can control the current flowing through the first to third micro light sources 11 to 13 to control the brightness of the first to third light beams generated by the first to third micro light sources.
In the preferred embodiment, the first Micro light sources 11 are red Micro light emitting diodes (Micro LEDs), the second Micro light sources 12 are green Micro light emitting diodes, and the third Micro light sources 13 are blue Micro light emitting diodes, and the number of the first Micro light sources 11, the second Micro light sources 12, and the third Micro light sources 13 is 800, respectively, to form 3 × 800 pixels. The arrangement and number of the first micro light sources 11, the second micro light sources 12 and the third micro light sources 13 are only for illustration purpose, and not limited thereto. In another preferred embodiment, the first micro light sources, the second micro light sources and the third micro light sources may be arranged in a staggered manner. It should be noted that, although the display module of the present invention includes three colors of micro light sources therein, the disclosure is only illustrative and not limited thereto.
As shown in fig. 2 and 3, the first micro light source 11 has a plurality of first conductive pads 111, which are electrically connected to the corresponding pixel circuits 14. In the preferred embodiment, the first conductive pads 111 are electrically connected to the corresponding pixel circuits 14 by Bonding (Bonding). On the other hand, the second micro light source 12 has a plurality of second conductive pads 121, the third micro light source 13 has a plurality of third conductive pads 131, and the plurality of second conductive pads 121 and the plurality of third conductive pads 131 are also electrically connected to the corresponding pixel circuits 14, respectively. After the electrical connection between the first micro light source 11 and the corresponding pixel circuit 14 is established, the circuit connection state is shown in fig. 4.
In a preferred embodiment, the display module 1 of the present invention further includes a control circuit 15 disposed on the silicon wafer 10 and electrically connected to the plurality of pixel circuits 14, wherein the control circuit 15 is configured to control which pixel circuit 14 of the plurality of pixel circuits 14 operates according to the received signal, so as to drive the first micro light source 11, the second micro light source 11, or the third micro light source 13 connected to the pixel circuit 14, thereby generating a required light beam at a desired position in the display module 1. For example, the following steps are carried out: when the display module 1 is used as a screen, the control circuit 15 can receive the image signal played by the display module 1, and can know which first micro light source 11, which second micro light source 11, or which third micro light source 13 in the display module 1 should be driven according to the image signal, so that the control circuit 15 can drive the corresponding pixel circuits 14 to make the corresponding first micro light source 11, second micro light source 11, or third micro light source 13 generate the first light beam, the second light beam, or the third light beam, respectively. Therefore, the display module 1 can display the image corresponding to the frame signal.
Similarly, when the display module 1 is used as a light source of a printer, the control circuit 15 can receive the image signal of the display module 1 and can know which first micro light source 11, which second micro light source 11, or which third micro light source 13 in the display module 1 should be driven according to the image signal, so that the control circuit 15 can drive the corresponding pixel circuits 14 to make the corresponding first micro light source 11, second micro light source 11, or third micro light source 13 generate the first light beam, the second light beam, or the third light beam, respectively. Therefore, the display module 1 can output a plurality of light beams corresponding to the image signal, so that the printer can print out the required image according to the light beams.
According to the above, the display module of the present invention has the pixel circuit disposed on the silicon wafer, and the electrical connections between the first micro light sources, the second micro light sources, and the third micro light sources are established, so as to prevent the glass panel from generating errors in the manufacturing process, i.e., the display module of the present invention can reduce the manufacturing errors. In addition, the display module only needs to adopt the traditional process, and does not need to adopt the low-temperature polysilicon process. Compared with the prior art, the display module has lower cost.
The above description is only a preferred embodiment of the present invention and is not intended to limit the claims of the present invention, so that other equivalent changes or modifications without departing from the concept disclosed in the present invention should be included in the claims of the present disclosure.
Claims (8)
1. A display module, comprising:
a silicon wafer;
a plurality of pixel circuits formed on the silicon wafer; and
the first micro light sources are arranged on the silicon wafer and are respectively and electrically connected with the corresponding pixel circuits, and the first micro light sources are driven by the pixel circuits to generate a plurality of first light beams.
2. The display module of claim 1, wherein the plurality of pixel circuits are formed on the silicon wafer by an etching technique.
3. The display module of claim 1, wherein the first micro light source has a plurality of first conductive pads electrically connected to the corresponding pixel circuits.
4. The display module according to claim 3, wherein the first conductive pads are electrically connected to the corresponding pixel circuits by bonding.
5. The display module of claim 1, further comprising:
a plurality of second micro light sources, each corresponding to one of the pixel circuits, disposed on the silicon wafer and electrically connected to the corresponding pixel circuit respectively, for being driven by the pixel circuits to generate a plurality of second light beams; and
and each third micro light source corresponds to one pixel circuit, is arranged on the silicon wafer and is respectively and electrically connected with the corresponding pixel circuit and is used for being driven by the pixel circuits to generate a plurality of third light beams.
6. The display module according to claim 5, further comprising a control circuit disposed on the silicon wafer and electrically connected to the plurality of pixel circuits for controlling which of the plurality of pixel circuits operates to drive the first micro light source, the second micro light source or the third micro light source connected to the pixel circuits.
7. The display module of claim 5, wherein the first micro light source is a red micro light emitting diode, the second micro light source is a green micro light emitting diode, and the third micro light source is a blue micro light emitting diode.
8. The display module of claim 5, wherein the number of the first micro light sources, the second micro light sources and the third micro light sources is 800 respectively to form 3 x 800 pixels.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811190142.3A CN111048543A (en) | 2018-10-12 | 2018-10-12 | Display module |
Applications Claiming Priority (1)
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CN201811190142.3A CN111048543A (en) | 2018-10-12 | 2018-10-12 | Display module |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20120223875A1 (en) * | 2009-12-09 | 2012-09-06 | Nano And Advanced Materials Institute Limited | Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology |
US20170179192A1 (en) * | 2015-12-21 | 2017-06-22 | Hong Kong Beida Jade Bird Display Limited | Semiconductor Devices with Integrated Thin-Film Transistor Circuitry |
US20170179097A1 (en) * | 2015-12-21 | 2017-06-22 | Hong Kong Beida Jade Bird Display Limited | Making Semiconductor Devices with Alignment Bonding and Substrate Removal |
US20180019233A1 (en) * | 2016-07-18 | 2018-01-18 | Lumens Co., Ltd. | Micro-led array display devices |
CN108198835A (en) * | 2017-12-07 | 2018-06-22 | 黎子兰 | A kind of LED display unit, display and its manufacturing method |
-
2018
- 2018-10-12 CN CN201811190142.3A patent/CN111048543A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120223875A1 (en) * | 2009-12-09 | 2012-09-06 | Nano And Advanced Materials Institute Limited | Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology |
US20170179192A1 (en) * | 2015-12-21 | 2017-06-22 | Hong Kong Beida Jade Bird Display Limited | Semiconductor Devices with Integrated Thin-Film Transistor Circuitry |
US20170179097A1 (en) * | 2015-12-21 | 2017-06-22 | Hong Kong Beida Jade Bird Display Limited | Making Semiconductor Devices with Alignment Bonding and Substrate Removal |
US20180019233A1 (en) * | 2016-07-18 | 2018-01-18 | Lumens Co., Ltd. | Micro-led array display devices |
CN108198835A (en) * | 2017-12-07 | 2018-06-22 | 黎子兰 | A kind of LED display unit, display and its manufacturing method |
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