CN111044891A - Automatic testing device for solid-state relay - Google Patents
Automatic testing device for solid-state relay Download PDFInfo
- Publication number
- CN111044891A CN111044891A CN201911225818.2A CN201911225818A CN111044891A CN 111044891 A CN111044891 A CN 111044891A CN 201911225818 A CN201911225818 A CN 201911225818A CN 111044891 A CN111044891 A CN 111044891A
- Authority
- CN
- China
- Prior art keywords
- state relay
- solid
- material pipe
- groove
- photoelectric switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/327—Testing of circuit interrupters, switches or circuit-breakers
- G01R31/3277—Testing of circuit interrupters, switches or circuit-breakers of low voltage devices, e.g. domestic or industrial devices, such as motor protections, relays, rotation switches
- G01R31/3278—Testing of circuit interrupters, switches or circuit-breakers of low voltage devices, e.g. domestic or industrial devices, such as motor protections, relays, rotation switches of relays, solenoids or reed switches
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The embodiment of the application provides an automatic testing arrangement of solid state relay, relate to the device and detect technical field, realize the transport to solid state relay in the testing process through each part mechanism among the controller drive actuating mechanism for the automatic material loading of accomplishing of solid state relay, the transfer in test, the unloading is transported, is connected through the accredited testing organization electricity among test equipment and the actuating mechanism simultaneously, accomplishes the solid state relay who loads on the accredited testing organization and detects, thereby improves the detection efficiency to solid state relay.
Description
Technical Field
The application belongs to the technical field of device detection, and particularly relates to an automatic testing device for a solid-state relay.
Background
The solid-state relay is used as a universal device in the electronic industry, and has a wide application range. The quality of the solid-state relay directly determines the service life and stability of the electronic product. Therefore, all manufacturers need to perform performance detection and safety detection on the solid-state relay in a mode of total inspection or sampling during production and incoming material. The conventional manual equipment test is not suitable for the total number test in a factory and the total number test in abnormal conditions, and a large amount of manual processing is consumed.
Disclosure of Invention
For solving the problem of adopting artifical mode total number inspection solid state relay, detection efficiency is low to a certain extent at least, this application provides a solid state relay automatic testing arrangement, can improve the detection efficiency to solid state relay.
In order to achieve the above object, the present application provides an automatic testing device for a solid-state relay, comprising: the device comprises a controller, test equipment and an actuating mechanism; the controller is used for driving the actuating mechanism to carry the solid-state relay; the actuator includes: the device comprises a vibration feeding mechanism, a vibration discharging mechanism, a testing mechanism and a testing and carrying mechanism;
the vibration feeding mechanism is used for guiding the solid state relay loaded in the feeding pipe of the vibration feeding mechanism to a first device grabbing groove position on the vibration feeding mechanism in a vibration mode;
the vibration discharging mechanism is used for guiding the solid state relay in the second device grabbing groove position to the feeding pipe of the solid state relay in a vibration mode;
the test carrying mechanism is used for carrying the solid-state relay from the first device grabbing slot position to the test mechanism, carrying the qualified solid-state relay from the test mechanism to the second device grabbing slot position, and carrying the unqualified solid-state relay from the test mechanism to the NG product recovery box;
the testing equipment is electrically connected with the testing mechanism and used for detecting the solid-state relay loaded on the testing mechanism.
In the above automatic testing device for a solid-state relay, the actuator further includes: the device comprises a material pipe conveying mechanism, a feeding mechanism, a discharging mechanism and a transition bin;
the material pipe carrying mechanism is used for carrying the material pipe loaded with the solid-state relay from the feeding mechanism to the vibration feeding mechanism, carrying the material pipe loaded with the solid-state relay from the vibration discharging mechanism to the discharging mechanism, carrying the empty material pipe from the vibration feeding mechanism to the transition bin, and carrying the empty material pipe from the transition bin to the vibration discharging mechanism.
In the above solid-state relay automatic testing device, the vibration feeding mechanism includes: the device comprises a first vibrator, a first material pipe placing groove and a first device guiding groove, wherein a first feeding photoelectric switch is arranged at a feeding hole of the first device guiding groove, and a first discharging photoelectric switch and a first device grabbing groove position are arranged at a discharging hole of the first device guiding groove;
the first vibrator is used for guiding the solid-state relay on the first material pipe placing groove out of the material pipe through self vibration and guiding the solid-state relay to the first device grabbing groove position through the first device guiding groove;
the first feeding photoelectric switch is used for controlling the material pipe conveying mechanism to convey an empty material pipe from the vibration feeding mechanism to the transition bin when the material pipe on the first material pipe placing groove is emptied;
and the first discharging photoelectric switch is used for controlling the test carrying mechanism to carry the solid-state relay to the test mechanism from the first device grabbing slot position.
In the above automatic testing apparatus for solid-state relays, a heating device is disposed on the first device guiding groove and is used for heating the solid-state relay on the first device guiding groove.
In the above automatic testing device for solid-state relays, the vibration discharging mechanism includes: the second vibrator, the second material tube placing groove and the second device guiding groove are arranged, a second discharging photoelectric switch is arranged at a discharging port of the second device guiding groove, and a second feeding photoelectric switch and a second device grabbing groove position are arranged at a feeding port of the second device guiding groove;
the second vibration generator is used for guiding the solid-state relay on the second device grabbing slot position into the material pipe on the second material pipe placing slot through the second device guiding slot by self vibration;
the second discharging photoelectric switch is used for controlling the material pipe conveying mechanism to convey the material pipe loaded with the solid-state relay from the vibration discharging mechanism to the blanking mechanism when the material pipe on the second material pipe placing groove is full;
and the second feeding photoelectric switch is used for controlling the test carrying mechanism to carry the qualified solid-state relay to the second device grabbing slot position from the test mechanism.
In the above automatic testing apparatus for solid-state relays, a cooling device is disposed on the second device guiding groove and is used for dissipating heat of the solid-state relay on the second device guiding groove.
In the above automatic testing device for a solid-state relay, the testing mechanism includes: the test device comprises a first support frame, a first clamping cylinder arranged on the first support frame, a positioning groove and a test probe;
the first clamping cylinder is used for clamping the test probe so that the test probe is contacted with a pin of the solid-state relay placed in the positioning groove through the positioning groove; the test probe is electrically connected with the test equipment.
In the above automatic test device for a solid-state relay, the test transfer mechanism includes: the first stepping motor, the first lead screw, the first guide rod, the first mobile machine table and the first limit photoelectric switch are positioned on the second support frame;
the first stepping motor is driven by the controller and drives the first moving machine table to move along the first guide rod by controlling the first lead screw to rotate;
the first limit photoelectric switch is positioned on the first guide rod, is correspondingly arranged above the first device guide groove, the second device guide groove station and the positioning groove station, and is used for limiting the first mobile machine platform to move to the corresponding grabbing station;
the first mobile machine platform is provided with a first downlink cylinder, a telescopic cylinder and a rubber suction nozzle, the rubber suction nozzle is controlled by the first downlink cylinder and the telescopic cylinder to move, the first device grabbing slot position is used for carrying the solid state relay to the positioning slot of the testing mechanism, the qualified solid state relay is carried to the second device grabbing slot position from the positioning slot of the testing mechanism, and the unqualified solid state relay is carried to the NG product recycling box from the positioning slot of the testing mechanism.
In the above solid-state relay automatic testing device, the material pipe conveying mechanism includes: the first stepping motor, the first lead screw, the first guide rod, the first mobile machine table and the first limit photoelectric switch are positioned on the first support frame;
the second stepping motor is driven by the controller and drives the second moving machine table to move along the second guide rod by controlling the second lead screw to rotate;
the second limit photoelectric switch is positioned on the second guide rod, is correspondingly arranged above the feeding mechanism, the vibration discharging mechanism, the discharging mechanism and the material pipe station of the transition bin, and is used for limiting the second movable machine platform to move to the corresponding grabbing station;
and a second descending cylinder and a second clamping cylinder are arranged on the second mobile machine table and used for clamping the material pipe on the station and controlling the material pipe to move up and down.
In the above automatic testing device for a solid-state relay, the feeding mechanism includes: the device comprises two first height limiting grooves, a fourth supporting frame, a third stepping motor, a third screw rod, a first push rod and a first height limiting photoelectric switch, wherein the first height limiting grooves and the fourth supporting frame are oppositely arranged;
the third stepping motor is driven by the controller, and drives the first push rod to move up and down by controlling the third lead screw to rotate so as to enable the material pipe loaded with the solid-state relay on the first push rod to move up along the first height limiting groove; the first height-limiting photoelectric switch is used for limiting the first push rod to a material pipe grabbing station of the feeding mechanism;
the unloading mechanism includes: the second height limiting groove, the fifth support frame, the fourth stepping motor, the fourth lead screw, the second push rod and the second height limiting photoelectric switch are oppositely arranged;
the fourth stepping motor is driven by the controller, and drives the second pushing rod to move up and down by controlling the rotation of the fourth lead screw, so that the material pipe loaded with the solid-state relay on the second pushing rod moves downwards along the second height limiting groove; the second height-limiting photoelectric switch is used for limiting the second push rod to a material pipe grabbing station of the blanking mechanism;
the transition bin comprises: the device comprises two oppositely arranged third height limiting grooves, a sixth supporting frame, a fifth stepping motor, a fifth screw rod, a third push rod and a third height limiting photoelectric switch, wherein the fifth stepping motor, the fifth screw rod, the third push rod and the third height limiting photoelectric switch are arranged on the sixth supporting frame;
the fifth stepping motor is driven by the controller and drives the third push rod to move up and down by controlling the fifth lead screw to rotate so as to enable the empty pipe on the third push rod to move up and down along the third height limiting groove; the third height-limiting photoelectric switch is used for limiting the third push rod to a material pipe grabbing station of the transition bin.
The automatic testing device for the solid-state relay comprises a controller, testing equipment and an executing mechanism, wherein the controller drives each mechanism in the executing mechanism to carry the solid-state relay in the testing process, so that the solid-state relay automatically completes the transfer and transportation in the processes of loading, testing and unloading, and meanwhile, the testing equipment is electrically connected with the testing mechanism in the executing mechanism to complete the detection of the solid-state relay loaded on the testing mechanism, thereby improving the detection efficiency of the solid-state relay.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of an actuator according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of a vibratory feeding mechanism in an embodiment of the present application;
FIG. 3 is a schematic view of a vibration discharging mechanism in an embodiment of the present application;
FIG. 4 is a schematic view of a testing mechanism in an embodiment of the present application;
FIG. 5 is a schematic view of a test handling mechanism according to an embodiment of the present application;
FIG. 6 is a schematic view of a material tube conveying mechanism in an embodiment of the present application;
FIG. 7 is a schematic view of a loading mechanism in an embodiment of the present application;
FIG. 8 is a schematic view of a blanking mechanism in an embodiment of the present application;
fig. 9 is a schematic view of a transition bin in an embodiment of the present application.
Description of the reference numerals
1-vibration feeding mechanism, 2-vibration discharging mechanism, 3-testing mechanism, 4-testing and carrying mechanism, 5-material pipe carrying mechanism, 6-feeding mechanism, 7-discharging mechanism, 8-transition bin, 11-first device grabbing slot position, 12-first vibrator, 13-first material pipe placing slot, 14-first device guiding slot, 15-first feeding photoelectric switch, 16-first discharging photoelectric switch, 21-second device grabbing slot position, 22-second vibrator, 23-second material pipe placing slot, 24-second device guiding slot, 25-second discharging photoelectric switch, 26-second feeding photoelectric switch, 31-first supporting frame, 32-first clamping cylinder, 33-positioning slot, 34-testing probe, 41-a second support frame, 42-a first stepping motor, 43-a first lead screw, 44-a first guide rod, 45-a first movable machine table, 46-a first limit photoelectric switch, 47-a first downlink air cylinder, 48-a telescopic air cylinder, 49-a rubber suction nozzle, 491-a positioning clamping groove, 51-a third support frame, 52-a second stepping motor, 53-a second lead screw, 54-a second guide rod, 55-a second movable machine table, 56-a second limit photoelectric switch, 57-a second downlink air cylinder, 58-a second clamping air cylinder, 61-a first height limit groove, 62-a fourth support frame, 63-a third stepping motor, 64-a third lead screw, 65-a first push rod, 66-a first height limit photoelectric switch, 71-a second height limit groove, 72-a fifth support frame, 73-a fourth stepping motor, 74-a fourth screw rod, 75-a second push rod, 76-a second height-limiting photoelectric switch, 81-a third height limiting groove, 82-a sixth support frame, 83-a fifth stepping motor, 84-a fifth screw rod, 85-a third push rod and 86-a third height-limiting photoelectric switch.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail below. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment provides an automatic testing device for a solid-state relay, which comprises: the device comprises a controller, test equipment and an actuating mechanism; the controller is used for driving the actuating mechanism to carry the solid-state relay; as shown in fig. 1, the actuator specifically includes: the device comprises a vibration feeding mechanism 1, a vibration discharging mechanism 2, a testing mechanism 3 and a testing and carrying mechanism 4; wherein:
the vibration feeding mechanism 1 is used for guiding the solid state relay loaded in the feeding pipe of the vibration feeding mechanism to the first device grabbing groove position 11 of the vibration feeding mechanism;
the vibration discharging mechanism 2 is used for guiding the solid state relay in the second device grabbing groove position 21 to the feeding pipe of the solid state relay in a vibration mode;
the test carrying mechanism 4 is used for carrying the solid-state relay from the first device grabbing slot position 11 to the testing mechanism 3, carrying the qualified solid-state relay from the testing mechanism 3 to the second device grabbing slot position 21, and carrying the unqualified solid-state relay from the testing mechanism 3 to the NG product recycling bin;
the testing equipment is electrically connected with the testing mechanism 3 and used for detecting the solid-state relay loaded on the testing mechanism 3.
Specifically, as shown in fig. 1, the vibration feeding mechanism 1 and the vibration discharging mechanism 2 are placed in parallel and opposite to each other, and material pipes are placed on the vibration feeding mechanism and the vibration discharging mechanism on the left side of the vibration feeding mechanism for loading the solid-state relay; and a slot for placing the solid-state relay is arranged close to the right side. In contrast, the vibration feeding mechanism 1 is used for guiding the solid state relay loaded in the feeding pipe thereof to the first device grabbing slot 11 (located at the rightmost end of the slot for placing the solid state relay) thereof by vibration; the vibration discharging mechanism 2 is used for guiding the solid state relay in the second device grabbing slot 21 (located at the rightmost end of the slot for placing the solid state relay) to the feeding pipe thereof in a vibration mode. The testing mechanism 3 is located between the first device grabbing slot position 11 and the second device grabbing slot position 21, and the testing device is electrically connected with the testing mechanism 3 and used for detecting the solid-state relay loaded on the testing mechanism 3. In the test process, the test carrying mechanism 4 can carry the solid-state relay from the first device grabbing slot position 11 to the test mechanism 3 to complete the feeding process; after the device to be tested detects the solid-state relay loaded on the testing mechanism 3, the testing and carrying mechanism 4 carries the solid-state relay which is qualified in detection from the testing mechanism 3 to the second device grabbing slot 21 to complete the blanking process, and carries the solid-state relay which is unqualified in detection from the testing mechanism 3 to an NG (natural gas) product recycling box (for example, a recycling box with an NG (natural gas) product identification is arranged beside the testing mechanism 3 in fig. 1), so that the automatic carrying of the solid-state relay in the detection process is realized. The testing personnel only need to place the material pipe that is equipped with the solid state relay that waits to detect vibration feed mechanism 1, and the material pipe that will detect qualified solid state relay takes away from vibration discharge mechanism 2 and can accomplish the test, has saved the human cost greatly.
In a specific implementation, as shown in fig. 1, the actuator may further include: the device comprises a material pipe conveying mechanism 5, a feeding mechanism 6, a discharging mechanism 7 and a transition bin 8; wherein:
and the material pipe conveying mechanism 5 is used for conveying the material pipe loaded with the solid-state relay from the feeding mechanism 6 to the vibration feeding mechanism 1, conveying the material pipe loaded with the solid-state relay from the vibration discharging mechanism 2 to the discharging mechanism 7, conveying the empty material pipe from the vibration feeding mechanism 1 to the transition bin 8, and conveying the empty material pipe from the transition bin 8 to the vibration discharging mechanism 2.
Specifically, as shown in fig. 1, the feeding mechanism 6, the discharging mechanism 7 and the transition bin 8 are used for buffering and storing the material pipes and conveying the material pipes between the mechanisms and the vibration feeding mechanism 1 and the vibration discharging mechanism 2 through the material pipe conveying mechanism 5. For example, a tester can put the material tubes carrying the solid relays to be tested on the feeding mechanism 6 in advance in batches for buffering, and sequentially convey the material tubes to the vibration feeding mechanism 1 through the material tube conveying mechanism 5 to prepare for feeding; after the feeding is finished, the empty material pipes left on the vibration feeding mechanism 1 can be conveyed to a transition bin 8 through a material pipe conveying mechanism 5 for use in the process of blanking, and meanwhile, a storage space is also left for the next batch of material pipes to be fed; when the material pipes on the vibration discharging mechanism 2 are full of the solid-state relays which are detected to be completed, the material pipes can be conveyed to the discharging mechanism 7 through the material pipe conveying mechanism 5, and then the material pipe conveying mechanism 5 can convey the empty material pipes on the transition bin 8 to the vibration discharging mechanism 2 so as to load the solid-state relays which are detected to be completed. In the process, the detection personnel only need to place the material pipe loaded with the solid-state relay to be detected on the feeding mechanism 6 in batches, and take the material pipe of the detected solid-state relay down from the discharging mechanism 7, so that the complexity of manual operation is greatly reduced.
In one embodiment, as shown in fig. 2, the vibrating feeding mechanism 1 may specifically include: the device comprises a first vibrator 12, a first material pipe placing groove 13 and a first device guiding groove 14, wherein a first feeding photoelectric switch 15 is arranged at a feeding hole of the first device guiding groove 14, and a first discharging photoelectric switch 16 and a first device grabbing groove position 11 are arranged at a discharging hole of the first device guiding groove 14; wherein:
a first vibrator 12 for guiding the solid-state relay on the first material tube placing groove 13 out of the material tube by self-vibration to the first device catching groove 11 through the first device guiding groove 14;
the first feeding photoelectric switch 15 is used for controlling the material pipe conveying mechanism 5 to convey the empty material pipe from the vibration feeding mechanism 1 to the transition bin 8 when the material pipe on the first material pipe placing groove 13 is emptied;
and the first discharging photoelectric switch 16 is used for controlling the test handling mechanism 4 to handle the solid-state relay from the first device grabbing slot position 11 to the test mechanism 3.
Specifically, as shown in fig. 2, the first vibrator 12 guides the solid-state relay on the first parts placement groove 13 out of the parts from the parts through its own vibration to the first parts catch groove 11 via the first parts guide groove 14; in this process, the first feeding photoelectric switch 15 counts the number of solid-state relays entering the first device guide groove 14, and calculates whether the material tube has been emptied. When the material pipe is emptied, the controller can be triggered to control the material pipe carrying mechanism 5 to carry the empty material pipe from the vibration feeding mechanism 1 to the transition bin 8. In addition, in the process of guiding the solid-state relay, the first discharging photoelectric switch 16 detects whether the solid-state relay exists on the first device grabbing slot 11, and if so, the controller can be triggered to control the test handling mechanism 4 to carry the solid-state relay from the first device grabbing slot 11 to the test mechanism 3 for detection.
In a specific implementation, a heating device is further disposed on the first device guiding slot 14, and is used for heating the solid-state relay on the first device guiding slot 14, so as to implement the heating aging detection of the solid-state relay. For example, a heating rod may be disposed at the bottom of the first device guiding groove 14, and the solid-state relay is heated by heating the heating rod via an external power supply.
In one embodiment, as shown in fig. 3, the vibration discharging mechanism 2 may specifically include: a second oscillator 22, a second material tube placing groove 23 and a second device guiding groove 24, wherein a second discharging photoelectric switch 25 is arranged at a discharging port of the second device guiding groove 24, and a second feeding photoelectric switch 26 and a second device grabbing groove 21 are arranged at a feeding port of the second device guiding groove 24;
a second oscillator 22 for guiding the solid-state relay on the second device-grasping slot 21 into the feeding tube on the second feeding-tube placing slot 23 through the second device guide slot 24 by self-oscillation;
a second discharging photoelectric switch 25 for controlling the material pipe conveying mechanism 5 to convey the material pipe loaded with the solid-state relay from the vibration discharging mechanism 2 to the discharging mechanism 7 when the material pipe on the second material pipe placing groove 23 is full;
and the second feeding photoelectric switch 26 is used for controlling the test handling mechanism 4 to carry the qualified solid-state relay from the test mechanism 3 to the second device grabbing slot position 21.
Specifically, as shown in fig. 3, the second oscillator 22 guides the solid-state relay on the second device-grasping slot 21 into the hopper on the second hopper placement slot 23 through the second device guide slot 24 by self-oscillation; in the process, the second discharging photoelectric switch 25 counts the solid-state relays entering the material pipe to calculate whether the material pipe is full. When the material pipe is full, the controller can be triggered to control the material pipe conveying mechanism 5 to convey the material pipe loaded with the solid-state relay from the vibration discharging mechanism 2 to the blanking mechanism 7. In addition, in the process of guiding the solid-state relay, the second feeding photoelectric switch 26 detects whether the solid-state relay exists on the second device grabbing slot 21, and if not, the controller can be triggered to control the test handling mechanism 4 to carry the solid-state relay which is detected to be qualified from the test mechanism 3 to the second device grabbing slot 21.
In one embodiment, a cooling device is disposed on the second device guiding groove 24 for dissipating heat of the solid state relay on the second device guiding groove 24. For example, a cold air pipe and a cold air outlet hole may be disposed at the bottom of the second device guide slot 24, and the solid-state relay that has just completed the heating and aging detection is cooled by an external cold air source to dissipate heat.
In one embodiment, as shown in fig. 4, the testing mechanism 3 may include: the test device comprises a first support frame 31, a first clamping cylinder 32 arranged on the first support frame 31, a positioning groove 33 and a test probe 34;
a first clamping cylinder 32 for clamping the test probe 34 so that the test probe 34 contacts the pins of the solid-state relay placed in the positioning groove 33 through the positioning groove 33; test probes 34 are electrically connected to the test equipment.
Specifically, as shown in fig. 4, after the solid-state relay is placed in the positioning slot 33 through the rubber suction nozzle 49 on the test handling mechanism 4, the first clamping cylinder 32 pushes the test probe 34 to act, so as to connect with the solid-state relay pin, so that the test equipment can test the solid-state relay through the test probe 34.
In one embodiment, as shown in fig. 5, the test handler 4 may include: a second support frame 41, a first stepping motor 42 positioned on the second support frame 41, a first lead screw 43, a first guide rod 44, a first mobile machine 45 and a first limit photoelectric switch 46;
a first stepping motor 42, which is driven by the controller to drive the first moving machine table to move along the first guide bar 44 by controlling the first lead screw 43 to rotate;
the first limit photoelectric switch 46 is located on the first guide rod 44, and correspondingly disposed above the first device guide groove 14, the second device guide groove 24, and the positioning groove 33, and configured to limit the first moving machine 45 to move to the corresponding grabbing station;
the first movable machine table 45 is provided with a first descending cylinder 47, a telescopic cylinder 48 and a rubber suction nozzle 49, the rubber suction nozzle 49 is controlled by the first descending cylinder 47 and the telescopic cylinder 48 to move, the solid-state relay which is qualified in detection is conveyed to the positioning groove 33 of the testing mechanism 3 from the first device grabbing groove 11, the solid-state relay which is qualified in detection is conveyed to the second device grabbing groove 21 from the positioning groove 33 of the testing mechanism 3, and the solid-state relay which is unqualified in detection is conveyed to the NG product recycling box from the positioning groove 33 of the testing mechanism 3.
Specifically, as shown in fig. 4 and 5, the first lower air cylinder 47 can control the up-and-down movement of the rubber suction nozzle 49 and the solid-state relay, and the telescopic air cylinder 48 can control the front-and-back movement of the rubber suction nozzle 49 and the solid-state relay;
the first limit photoelectric switches 46 (three) can control the first movable machine 45 to further control the rubber suction nozzle 49 to move among 3 stations (the first device grabbing slot position 11 station in the vibration feeding mechanism 1, the positioning slot position 33 station in the testing mechanism 3, and the second device grabbing slot position 21 station in the vibration discharging mechanism 2), and the specific advancing position of the rubber suction nozzle is controlled by the first limit photoelectric switches 46. In order to make the rubber suction nozzle 49 accurately suck the solid state relay and accurately place the solid state relay into the positioning slot 33, a positioning slot 491 is further provided on the rubber suction nozzle 49 for accurately limiting the position of the solid state relay.
The test and handling process comprises the following steps: after the last action (conveying the solid-state relay to the second device grabbing slot 21) is completed, when the first discharging photoelectric switch 16 detects that the solid-state relay enters the first device grabbing slot 11, the test conveying mechanism 4 controls the first mobile machine 45 to move to the first device grabbing slot 11 to grab the solid-state relay to be tested, and then moves to the positioning slot 33 of the test mechanism 3 to place the solid-state relay to be tested in the positioning slot 33; the controller drives the test probe 34 of the test mechanism 3 to contact the solid-state relay and synchronously drives the test equipment to test; if the test result is NG (failing the test), the telescopic cylinder 48 is controlled to act, the NG is placed in the NG recycling bin, and if the test result is OK (passing the test), the rubber suction nozzle 49 of the test handling mechanism 4 sucks the solid state relay, then the solid state relay moves to the position above the second device guiding groove 24, and the solid state relay is placed in the second device grabbing groove 21.
In one embodiment, as shown in fig. 6, the material pipe conveying mechanism 5 includes: a third support frame 51, a second stepping motor 52 positioned on the third support frame 51, a second lead screw 53, a second guide rod 54, a second mobile machine 55 and a second limit photoelectric switch 56;
a second stepping motor 52 driven by the controller by controlling the rotation of the second lead screw 53
The second moving machine 55 moves along the second guide bar 54;
the second limit photoelectric switch 56 is located on the second guide rod 54, and is correspondingly arranged above the material pipe stations of the feeding mechanism 6, the vibration feeding mechanism 1, the vibration discharging mechanism 2, the discharging mechanism 7 and the transition bin 8, and is used for limiting the second movable machine platform 55 to move to the corresponding grabbing station;
the second moving machine 55 is provided with a second descending cylinder 57 and a second clamping cylinder 58, which are used for clamping the material pipe on the station and controlling the material pipe to move up and down.
Specifically, as shown in fig. 6, the overall operation of the material pipe conveying mechanism 5 is to control the specific position where the second movable machine 55 travels through the second limit photoelectric switch 56; the material pipe is clamped and ascended through the second descending cylinder 57 and the second clamping cylinder 58.
In one embodiment, as shown in fig. 7, the feeding mechanism 6 may include: the device comprises two first height limiting grooves 61, a fourth supporting frame 62, a third stepping motor 63, a third lead screw 64, a first push rod 65 and a first height limiting photoelectric switch 66 which are oppositely arranged, wherein the third stepping motor 63 is arranged on the fourth supporting frame 62;
the third step motor 63 is driven by the controller, and drives the first pushing rod 65 to move up and down by controlling the third screw 64 to rotate, so that the material pipe loaded with the solid-state relay on the first pushing rod 65 moves up along the first height limiting groove 61; the first height-limiting photoelectric switch 66 is used for limiting the first push rod 65 to the material pipe grabbing station of the feeding mechanism 6.
Specifically, the first push rod 65 is limited in moving up position by the first height-limiting photoelectric switch 66, that is, limited to move up to the station to be grabbed. When the first height-limiting photoelectric switch 66 detects that there is no material pipe, the trigger controller drives the third stepping motor 63 to drive the third lead screw 64 to move, so that the first push rod 65 moves upwards to the grabbing station.
In one embodiment, as shown in fig. 8, the feeding mechanism 7 may include: two oppositely arranged second height limiting grooves 71, a fifth supporting frame 72, a fourth stepping motor 73 arranged on the fifth supporting frame 72, a fourth lead screw 74, a second push rod 75 and a second height limiting photoelectric switch 76;
the fourth stepping motor 73 is driven by the controller, and drives the second pushing rod 75 to move up and down by controlling the fourth lead screw 74 to rotate, so that the material pipe loaded with the solid-state relay on the second pushing rod 75 moves down along the second height limiting groove 71; the second height-limiting photoelectric switch 76 is used for limiting the second push rod 75 to the material pipe grabbing station of the blanking mechanism 7.
Specifically, the second push rod 75 is limited in downward movement position by the second height-limiting photoelectric switch 76, that is, limited to move only downward to the station to be grabbed. When the second height-limiting photoelectric switch 76 detects that there is a material tube, the trigger controller drives the fourth stepping motor 73 to drive the fourth lead screw 74 to move, so that the second push rod 75 moves downwards to the grabbing station.
In one embodiment, as shown in fig. 9, the transition bin 8 may include: the device comprises two oppositely arranged third height limiting grooves 81, a sixth supporting frame 82, a fifth stepping motor 83 arranged on the sixth supporting frame 82, a fifth screw 84, a third push rod 85 and a third height limiting photoelectric switch 86;
the fifth stepping motor 83 is driven by the controller, and drives the third push rod 85 to move up and down by controlling the fifth lead screw 84 to rotate, so that the empty material pipe on the third push rod 85 moves up and down along the third height limiting groove 81; the third height-limiting photoelectric switch 86 is used for limiting the third push rod 85 to the material pipe grabbing station of the transition bin 8.
Specifically, the second push rod 75 is limited in downward movement position by the second height-limiting photoelectric switch 76, that is, limited to move only downward to the station to be grabbed. When the second height-limiting photoelectric switch 76 detects that there is a material tube, the trigger controller drives the fourth stepping motor 73 to drive the fourth lead screw 74 to move, so that the second push rod 75 moves downwards to the grabbing station.
The working principle of the automatic testing device for the solid-state relay is as follows:
1. and (4) starting, connecting, resetting and charging are completed (after a material pipe of the solid-state relay to be tested is manually loaded to the feeding mechanism 6, the equipment is started).
2. And a third stepping motor 63 in the feeding mechanism 6 controls a third lead screw 64 to rotate and drive a first push rod 65 to move up and down, so that a material pipe loaded with the solid-state relay on the first push rod 65 moves upwards to a station to be grabbed along a first height limiting groove.
3. The material pipe conveying mechanism 5 conveys the material pipe to be tested from the feeding mechanism 6 to the vibration feeding mechanism 1.
4. The first vibrator 12 in the vibration feeding mechanism 1 guides the solid-state relay on the first parts placement groove 13 out of the parts tube by self-vibration to the first parts catching groove 11 through the first parts guide groove 14.
5. The test handling mechanism 4 sucks a single heated solid-state relay to travel to the testing mechanism 3 at a first device grabbing slot position in the vibration feeding mechanism 1.
6. And the testing mechanism 3 is combined with the testing equipment to test the solid-state relay and judge whether the device is qualified. If the article is NG article, the article is placed in an NG article recycling box by the test carrying mechanism 4; if the position is OK, the second device grabbing slot 21 placed in the vibration discharging mechanism 2.
7. The second oscillator 22 in the vibration discharging mechanism 2 guides the solid-state relay on the second device-grasping slot 21 into the feeding tube in the second feeding tube placing slot 23 through the second device guide slot 24 by self-vibration.
8. In the process of executing the steps 1 to 7, whether the test conveying mechanism 4 executes conveying is determined by detecting the first discharging photoelectric switch 16 and the second feeding photoelectric switch 26 in real time.
9. In the process of executing the steps 1 to 7, the number of the solid relays in the material pipe is detected in real time through the first feeding photoelectric switch 15 and the second discharging photoelectric switch 25, and the material pipe conveying mechanism 5 is determined to execute the operations of feeding the material pipe to be detected and discharging the material pipe filled with the material pipe.
10. And (6) completing the test.
The automatic testing device for the solid-state relay comprises a controller, testing equipment and an executing mechanism, wherein the controller drives each mechanism in the executing mechanism to carry the solid-state relay in the testing process, so that the solid-state relay automatically completes the transfer and transportation in the processes of loading, testing and unloading, and meanwhile, the testing equipment is electrically connected with the testing mechanism in the executing mechanism to complete the detection of the solid-state relay loaded on the testing mechanism, thereby improving the detection efficiency of the solid-state relay.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments.
It should be noted that, in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Further, in the description of the present application, the meaning of "a plurality" means at least two unless otherwise specified.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. An automatic testing device for a solid-state relay, comprising: the device comprises a controller, test equipment and an actuating mechanism; the controller is used for driving the actuating mechanism to carry the solid-state relay; the actuator includes: the device comprises a vibration feeding mechanism, a vibration discharging mechanism, a testing mechanism and a testing and carrying mechanism;
the vibration feeding mechanism is used for guiding the solid state relay loaded in the feeding pipe of the vibration feeding mechanism to a first device grabbing groove position on the vibration feeding mechanism in a vibration mode;
the vibration discharging mechanism is used for guiding the solid state relay in the second device grabbing groove position to the feeding pipe of the solid state relay in a vibration mode;
the test carrying mechanism is used for carrying the solid-state relay from the first device grabbing slot position to the test mechanism, carrying the qualified solid-state relay from the test mechanism to the second device grabbing slot position, and carrying the unqualified solid-state relay from the test mechanism to the NG product recovery box;
the testing equipment is electrically connected with the testing mechanism and used for detecting the solid-state relay loaded on the testing mechanism.
2. The solid state relay automatic test device of claim 1, wherein the actuator further comprises: the device comprises a material pipe conveying mechanism, a feeding mechanism, a discharging mechanism and a transition bin;
the material pipe carrying mechanism is used for carrying the material pipe loaded with the solid-state relay from the feeding mechanism to the vibration feeding mechanism, carrying the material pipe loaded with the solid-state relay from the vibration discharging mechanism to the discharging mechanism, carrying the empty material pipe from the vibration feeding mechanism to the transition bin, and carrying the empty material pipe from the transition bin to the vibration discharging mechanism.
3. The solid state relay automatic test device of claim 2, wherein the vibration feed mechanism comprises: the device comprises a first vibrator, a first material pipe placing groove and a first device guiding groove, wherein a first feeding photoelectric switch is arranged at a feeding hole of the first device guiding groove, and a first discharging photoelectric switch and a first device grabbing groove position are arranged at a discharging hole of the first device guiding groove;
the first vibrator is used for guiding the solid-state relay on the first material pipe placing groove out of the material pipe through self vibration and guiding the solid-state relay to the first device grabbing groove position through the first device guiding groove;
the first feeding photoelectric switch is used for controlling the material pipe conveying mechanism to convey an empty material pipe from the vibration feeding mechanism to the transition bin when the material pipe on the first material pipe placing groove is emptied;
and the first discharging photoelectric switch is used for controlling the test carrying mechanism to carry the solid-state relay to the test mechanism from the first device grabbing slot position.
4. The automatic testing device for the solid-state relay according to claim 3, wherein a heating device is disposed on the first device guiding slot for heating the solid-state relay on the first device guiding slot.
5. The automatic testing device for the solid state relay of claim 4, wherein the vibration discharging mechanism comprises: the second vibrator, the second material tube placing groove and the second device guiding groove are arranged, a second discharging photoelectric switch is arranged at a discharging port of the second device guiding groove, and a second feeding photoelectric switch and a second device grabbing groove position are arranged at a feeding port of the second device guiding groove;
the second vibration generator is used for guiding the solid-state relay on the second device grabbing slot position into the material pipe on the second material pipe placing slot through the second device guiding slot by self vibration;
the second discharging photoelectric switch is used for controlling the material pipe conveying mechanism to convey the material pipe loaded with the solid-state relay from the vibration discharging mechanism to the blanking mechanism when the material pipe on the second material pipe placing groove is full;
and the second feeding photoelectric switch is used for controlling the test carrying mechanism to carry the qualified solid-state relay to the second device grabbing slot position from the test mechanism.
6. The automatic testing device for the solid state relay according to claim 5, wherein a cooling device is disposed on the second device guiding slot for dissipating heat of the solid state relay on the second device guiding slot.
7. The solid state relay automatic test device of claim 6, wherein the test mechanism comprises: the test device comprises a first support frame, a first clamping cylinder arranged on the first support frame, a positioning groove and a test probe;
the first clamping cylinder is used for clamping the test probe so that the test probe is contacted with a pin of the solid-state relay placed in the positioning groove through the positioning groove; the test probe is electrically connected with the test equipment.
8. The solid state relay automatic test device of claim 7, wherein the test handling mechanism comprises: the first stepping motor, the first lead screw, the first guide rod, the first mobile machine table and the first limit photoelectric switch are positioned on the second support frame;
the first stepping motor is driven by the controller and drives the first moving machine table to move along the first guide rod by controlling the first lead screw to rotate;
the first limit photoelectric switch is positioned on the first guide rod, is correspondingly arranged above the first device guide groove, the second device guide groove station and the positioning groove station, and is used for limiting the first mobile machine platform to move to the corresponding grabbing station;
the first mobile machine platform is provided with a first downlink cylinder, a telescopic cylinder and a rubber suction nozzle, the rubber suction nozzle is controlled by the first downlink cylinder and the telescopic cylinder to move, the first device grabbing slot position is used for carrying the solid state relay to the positioning slot of the testing mechanism, the qualified solid state relay is carried to the second device grabbing slot position from the positioning slot of the testing mechanism, and the unqualified solid state relay is carried to the NG product recycling box from the positioning slot of the testing mechanism.
9. The automatic testing device for the solid state relay according to claim 2, wherein the material pipe handling mechanism comprises: the first stepping motor, the first lead screw, the first guide rod, the first mobile machine table and the first limit photoelectric switch are positioned on the first support frame;
the second stepping motor is driven by the controller and drives the second moving machine table to move along the second guide rod by controlling the second lead screw to rotate;
the second limit photoelectric switch is positioned on the second guide rod, is correspondingly arranged above the feeding mechanism, the vibration discharging mechanism, the discharging mechanism and the material pipe station of the transition bin, and is used for limiting the second movable machine platform to move to the corresponding grabbing station;
and a second descending cylinder and a second clamping cylinder are arranged on the second mobile machine table and used for clamping the material pipe on the station and controlling the material pipe to move up and down.
10. The automatic test device for solid state relays according to claim 9, wherein the loading mechanism comprises: the device comprises two first height limiting grooves, a fourth supporting frame, a third stepping motor, a third screw rod, a first push rod and a first height limiting photoelectric switch, wherein the first height limiting grooves and the fourth supporting frame are oppositely arranged;
the third stepping motor is driven by the controller, and drives the first push rod to move up and down by controlling the third lead screw to rotate so as to enable the material pipe loaded with the solid-state relay on the first push rod to move up along the first height limiting groove; the first height-limiting photoelectric switch is used for limiting the first push rod to a material pipe grabbing station of the feeding mechanism;
the unloading mechanism includes: the second height limiting groove, the fifth support frame, the fourth stepping motor, the fourth lead screw, the second push rod and the second height limiting photoelectric switch are oppositely arranged;
the fourth stepping motor is driven by the controller, and drives the second pushing rod to move up and down by controlling the rotation of the fourth lead screw, so that the material pipe loaded with the solid-state relay on the second pushing rod moves downwards along the second height limiting groove; the second height-limiting photoelectric switch is used for limiting the second push rod to a material pipe grabbing station of the blanking mechanism;
the transition bin comprises: the device comprises two oppositely arranged third height limiting grooves, a sixth supporting frame, a fifth stepping motor, a fifth screw rod, a third push rod and a third height limiting photoelectric switch, wherein the fifth stepping motor, the fifth screw rod, the third push rod and the third height limiting photoelectric switch are arranged on the sixth supporting frame;
the fifth stepping motor is driven by the controller and drives the third push rod to move up and down by controlling the fifth lead screw to rotate so as to enable the empty pipe on the third push rod to move up and down along the third height limiting groove; the third height-limiting photoelectric switch is used for limiting the third push rod to a material pipe grabbing station of the transition bin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911225818.2A CN111044891A (en) | 2019-12-04 | 2019-12-04 | Automatic testing device for solid-state relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911225818.2A CN111044891A (en) | 2019-12-04 | 2019-12-04 | Automatic testing device for solid-state relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111044891A true CN111044891A (en) | 2020-04-21 |
Family
ID=70234544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911225818.2A Pending CN111044891A (en) | 2019-12-04 | 2019-12-04 | Automatic testing device for solid-state relay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111044891A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113857082A (en) * | 2021-09-29 | 2021-12-31 | 南京艾龙自动化装备有限公司 | Relay automatic separation device |
| CN116540088A (en) * | 2023-06-26 | 2023-08-04 | 深圳市优界科技有限公司 | Automatic detection device for relay |
-
2019
- 2019-12-04 CN CN201911225818.2A patent/CN111044891A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113857082A (en) * | 2021-09-29 | 2021-12-31 | 南京艾龙自动化装备有限公司 | Relay automatic separation device |
| CN116540088A (en) * | 2023-06-26 | 2023-08-04 | 深圳市优界科技有限公司 | Automatic detection device for relay |
| CN116540088B (en) * | 2023-06-26 | 2023-09-12 | 深圳市优界科技有限公司 | Automatic detection device for relay |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110508500B (en) | Multi-station chip testing and sorting machine | |
| CN111044891A (en) | Automatic testing device for solid-state relay | |
| KR101811662B1 (en) | Handler for testing semiconductor device and test supportion method of the same | |
| JPH10232262A (en) | Testing conveyor for semiconductor device | |
| CN110987629B (en) | Full-automatic tensile test equipment and control system thereof | |
| CN101234382A (en) | System for sorting packaged chips and method for sorting packaged chips | |
| CN101858387A (en) | Assembly line for automobile first-generation hub bearing | |
| CN109047045A (en) | A kind of automatic checkout equipment of LED seat | |
| CN114653606B (en) | High-efficient chip detects encapsulation equipment | |
| CN109319715A (en) | A kind of refrigerant automation filling production lines and its packaging process | |
| KR101372240B1 (en) | Pitch alteration apparatus, electronic component handling apparatus and electronic component test apparatus | |
| CN205309782U (en) | Intelligence wrist -watch automatic production line | |
| CN108928510A (en) | Semiconductor braiding packaging machine | |
| CN110104421A (en) | A kind of materials switching device, a kind of charging equipment, a kind of discharging equipment and a kind of detection system | |
| CN211905623U (en) | Full-automatic voltage internal resistance test system | |
| CN115092626A (en) | Lithium battery production conveying line | |
| CN113894062B (en) | Automatic test equipment of detector | |
| CN209363069U (en) | A kind of automatic checkout equipment of LED seat | |
| CN211741508U (en) | Automatic testing device for solid-state relay | |
| CN108928511A (en) | Full-automatic semiconductor braiding packaging machine | |
| CN108538773B (en) | Tube-mounted chip feeding device, tube-mounted chip burner and control method thereof | |
| CN209113454U (en) | A kind of refrigerant automation filling production lines | |
| CN219073656U (en) | Automatic tester for semi-finished charger | |
| CN108572829B (en) | Burning device, tube-mounted chip burning machine and control method thereof | |
| CN108565242B (en) | Tube-mounted chip blanking device, tube-mounted chip burner and control method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |