CN111033964A - Motor with a stator having a stator core - Google Patents
Motor with a stator having a stator core Download PDFInfo
- Publication number
- CN111033964A CN111033964A CN201880053564.8A CN201880053564A CN111033964A CN 111033964 A CN111033964 A CN 111033964A CN 201880053564 A CN201880053564 A CN 201880053564A CN 111033964 A CN111033964 A CN 111033964A
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- China
- Prior art keywords
- heat sink
- capacitor
- motor
- main body
- housing
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Motor Or Generator Frames (AREA)
Abstract
The motor has: a motor main body having a rotor rotatable about a central axis and a stator radially opposed to the rotor; a circuit board electrically connected to the motor main body and extending in a planar direction; a capacitor mounted on one side of the circuit board perpendicular to the planar direction; and a heat sink that is in direct or indirect contact with the circuit substrate, wherein the circuit substrate has a 1 st surface on one side and a 2 nd surface on the other side, the 2 nd surface has a capacitor overlapping region overlapping with the capacitor when viewed from a direction perpendicular to a planar direction of the circuit substrate, the heat sink covers at least a part of a side surface of the capacitor on one side of the circuit substrate, and covers the capacitor overlapping region on the other side of the circuit substrate.
Description
Technical Field
The present invention relates to a motor.
Background
In an electromechanical motor including a circuit board for controlling a motor main body, it is known that elements such as a capacitor, which generate a large amount of heat, are housed in a heat sink to dissipate the heat. Patent document 1 discloses a motor drive device in which an electric field capacitor (capacitor) is housed in a housing portion of an Electronic Control Unit (ECU) case.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2013-062959
Disclosure of Invention
Problems to be solved by the invention
The capacitor is accommodated in the radiator, so that the heat dissipation effect of the capacitor is improved. However, in the motor driving device described above, there is a possibility that heat dissipation from the circuit board cannot be performed.
In the circuit board around the capacitor, a current larger than that of electronic components other than the capacitor flows from the capacitor. In view of the above problems, it is an object of one embodiment of the present invention to provide a motor that promotes heat dissipation not only in a capacitor itself but also in a circuit board around the capacitor.
Means for solving the problems
One embodiment of the present invention is a motor including: a motor main body having a rotor rotatable about a central axis and a stator radially opposed to the rotor; a circuit board electrically connected to the motor main body and extending in a planar direction; a capacitor mounted on one side of the circuit board perpendicular to a planar direction; and a heat sink that is in direct or indirect contact with the circuit substrate, wherein the circuit substrate has a 1 st surface on one side and a 2 nd surface on the other side, and the 2 nd surface has a capacitor overlapping region overlapping with the capacitor when viewed from a direction perpendicular to a planar direction of the circuit substrate, and the heat sink covers at least a part of a side surface of the capacitor on the one side of the circuit substrate and the capacitor overlapping region on the other side of the circuit substrate.
Effects of the invention
According to one embodiment of the present invention, a motor is provided that promotes heat dissipation from a circuit board around a capacitor in addition to heat dissipation from the capacitor itself.
Drawings
Fig. 1 is a perspective view of a motor according to an embodiment, and is a view showing a state in which a cover is removed upward from a housing.
Fig. 2 is a sectional view taken along line II-II of fig. 1.
Fig. 3 is an enlarged view of the V region of fig. 2.
Fig. 4 corresponds to modification 1 of the configuration shown in fig. 3.
Fig. 5 corresponds to modification 2 of the configuration shown in fig. 3.
Fig. 6 is a cross-sectional view of a 3 rd modification of the motor of fig. 1, and corresponds to the 3 rd modification of the structure shown in fig. 3.
Detailed Description
Hereinafter, a motor 1 according to an embodiment of the present invention will be described with reference to the drawings. The scope of the present invention is not limited to the following embodiments, and can be arbitrarily changed within the scope of the technical idea of the present invention. In the drawings below, in order to facilitate understanding of the respective structures, the actual structures may be different in scale, number, and the like from those of the respective structures.
In the drawings, an XYZ coordinate system is appropriately shown as a three-dimensional rectangular coordinate system. In the XYZ coordinate system, the Z-axis direction is a direction parallel to the axial direction of the central axis J described later. The X-axis direction is a direction perpendicular to the Z-axis direction. The Y-axis direction is a direction perpendicular to both the X-axis direction and the Z-axis direction.
In the following description, the positive side (+ Z side) in the Z-axis direction is referred to as "upper side", and the negative side (-Z side) in the Z-axis direction is referred to as "lower side". The upper side and the lower side are names used for illustration only, and do not limit the actual positional relationship and direction. Unless otherwise specified, a direction (Z-axis direction) parallel to the central axis J of the motor main body 2 described below is simply referred to as "axial direction", a radial direction around the central axis J is simply referred to as "radial direction", and a circumferential direction around the central axis J, that is, a direction around the central axis J is simply referred to as "circumferential direction". In the following description, the term "plan view" refers to a state viewed from above in the axial direction.
[ Motor ]
Fig. 1 is a perspective view of a motor 1 according to the present embodiment, and is a view showing a state in which a lid 40 described later is removed upward from a housing (a heat sink, a 1 st heat sink, and a part of the heat sink) 50. Fig. 2 is a sectional view of the motor 1 taken along line II-II of fig. 1. Fig. 3 is a sectional view of the motor 1, and is an enlarged view of a V region of fig. 2. Fig. 4 is a sectional view of a 1 st modification of the motor 1. Fig. 5 is a sectional view of a 2 nd modification of the motor 1. Fig. 6 is a sectional view of a 3 rd modification of the motor 1. Fig. 4 to 6 correspond to the sectional views shown in fig. 3.
As shown in fig. 2, the motor 1 includes a motor main body 2, an upper bearing 7A, a lower bearing 7B, a bearing holder 30, a circuit board 60, a case (a heat sink, a 1 st heat sink, and a part of the heat sink) 50, an upper heat sink (a heat sink, a 2 nd heat sink, and another part of the heat sink) 80, and a cover 40.
That is, the motor 1 includes a housing 50 that houses a stator 25 and a circuit board 60 described later. An element housing 55 functioning as a part of the heat sink is located inside the case 50. The upper heat sink 80 functioning as the other part of the heat sink is exposed to the outside of the case 50. The element housing portion 55 is positioned inside the housing 50, and houses the stator 25 and the circuit board 60 in the housing 50, thereby concentrating the components of the motor 1 to save space and reducing the size of the motor 1. By exposing the upper heat sink 80 to the outside of the case 50, heat from the element housing portion 55 and heat from the capacitor overlapping region 61X can be smoothly released to the outside of the motor 1.
[ Motor subject ]
The motor main body 2 has a rotor 20 and a stator 25. The rotor 20 rotates about a central axis J extending in the vertical direction (axial direction). Rotor 20 includes shaft 21, rotor core 22, and rotor magnet 23. The shaft 21 extends along the central axis J. The shaft 21 is supported by the upper bearing 7A and the lower bearing 7B so as to be rotatable about the center axis J. Rotor core 22 is fixed to shaft 21. Rotor core 22 circumferentially surrounds shaft 21. Rotor magnet 23 is fixed to rotor core 22. More specifically, the rotor magnet 23 is fixed to an outer surface of the rotor core 22 along the circumferential direction. The rotor core 22 and the rotor magnet 23 rotate together with the shaft 21.
The stator 25 is located radially outside the rotor 20. The stator 25 is opposed to the rotor 20 with a gap therebetween in the radial direction, and surrounds the rotor 20 on the radially outer side. The stator 25 has a stator core 27, an insulator 28, and a coil 29. The insulating member 28 is made of an insulating material. The insulator 28 covers at least a part of the stator core 27. When the motor 1 is driven, the coil 29 excites the stator core 27. The coil 29 is formed by winding a coil wire (not shown). The coil wire is wound around the teeth of the stator core 27 via an insulator 28. The coil wire is drawn upward at its end and is connected to the circuit board 60 through a through hole provided in the bearing holder 30. When a bus bar is provided between the motor main body 2 and the bearing holder 30, the end of the coil wire is connected to the bus bar, and the bus bar is connected to the circuit board 60. That is, the motor main body 2 includes a rotor 20 rotatable about the central axis J and a stator 25 radially opposed to the rotor 20.
[ Upper and lower side Bearings ]
The upper bearing 7A rotatably supports the upper end portion of the shaft 21. The upper bearing 7A is located on the upper side of the stator 25. The upper bearing 7A is supported by a bearing holder 30. The lower bearing 7B rotatably supports the lower end portion of the shaft 21. The lower bearing 7B is located on the lower side of the stator 25. The lower bearing 7B is supported by the lower bearing holding portion 54c of the housing 50.
In the present embodiment, the upper bearing 7A and the lower bearing 7B are ball bearings. However, the types of the upper bearing 7A and the lower bearing 7B are not particularly limited, and may be other types of bearings.
[ Shell (radiator, No. 1 radiator, part of radiator) ]
The housing 50 is located on the lower side of the circuit substrate 60. The case 50 of the present embodiment directly contacts the circuit board 60, and functions as a heat sink for cooling the circuit board 60. The case 50 may be in indirect contact with the circuit board 60 as long as it is in thermal contact with the circuit board 60 and cools the circuit board 60. More specifically, the case 50 may be in contact with the circuit board 60 via a heat dissipating material such as heat dissipating grease.
The case 50 has a heat sink 53, a motor body housing 54, and an element housing 55. The case 50 absorbs heat mainly generated by the circuit substrate 60 at the heat sink portion 53. The housing 50 accommodates the motor main body 2 in the motor main body accommodating portion 54. The case 50 houses a capacitor 65 provided on the circuit board 60 in the element housing portion 55.
The housing 50 is constructed as one piece. That is, the case 50 functions as a heat sink, a function of housing the motor main body 2, and a function of housing the capacitor 65 as one component. The case 50 and the element housing 55 as a heat sink covering the capacitor 65 are formed as one component, thereby achieving space saving of the heat sink and suppressing the size of the motor 1 in the axial direction. Further, the case 50 may be a separate member in which at least 1 of the heat sink 53, the motor body housing 54, and the element housing 55 is fastened by fastening means such as screws. The heat sink 53 may be a separate member from the motor body housing 54, and the heat sink 53 may be a part of the bearing holder 30. However, by making the case 50a single component, heat of the circuit board 60 absorbed by the heat sink 53 can be efficiently dissipated not only in the heat sink 53 but also in the motor main body housing 54 and the element housing 55. That is, according to the present embodiment, since the case 50 is configured as one member, the heat radiation effect of the case 50 is improved. In addition, according to the present embodiment, since the housing 50 is formed of one member, the assembly process of the motor 1 can be simplified.
The case 50 is made of a metal material having high heat dissipation characteristics and sufficient rigidity. For example, the case 50 is made of aluminum alloy. In this case, the housing 50 is manufactured by forming a rough shape by die casting or the like, and then cutting a surface requiring precision.
The heat sink portion 53 extends in a direction perpendicular to the center axis J. The heat sink 53 is located below the circuit board 60. The heat sink 53 extends along the circuit board 60 below the circuit board 60. The heat sink 53 is located between the motor body housing 54 and the element housing 55 in a plan view, and connects the motor body housing 54 and the element housing 55. The heat sink 53 has an upper surface 53a facing upward and a lower surface 53b facing downward.
The heat dissipating surface 53c is provided on the upper surface 53a of the heat sink 53, and the heat dissipating surface 53c is in direct contact with the lower surface (1 st surface) 61c of the substrate main body 61 of the circuit board 60 or in indirect contact with the circuit board via a member such as a heat dissipating material. That is, the heat sink 53 has a heat radiation surface 53c that contacts the substrate main body 61. The heat sink 53 absorbs heat from the circuit board 60 at the heat radiating surface 53c, and cools the circuit board 60.
As will be described later, the circuit board 60 includes a plurality of field effect transistors 66 mounted on the upper surface (2 nd surface) 61d of the board main body 61. The field effect transistor 66 is also referred to as fet (field effect transistor). The field effect transistor 66 is a heat generating element that easily generates heat on the circuit substrate 60. At least a part of the field effect transistor 66 overlaps with the heat dissipation surface 53c when viewed from the axial direction. This enables heat generated by the field effect transistor 66 to efficiently move to the heat sink 53 on the heat radiating surface 53 c. This suppresses an excessive temperature rise of the field effect transistor 66, and can improve the reliability of the operation of the field effect transistor 66.
In the present embodiment, a case where the heat generating element overlapping the heat radiating surface 53c in the axial direction is the field effect transistor 66 is exemplified. However, the heat generating element overlapping the heat radiating surface 53c may be another mounting member (element). In the present specification, the heat generating element refers to an element that generates heat and becomes high temperature during operation in the mounting member. As the heat generating element, a driver integrated circuit for driving a field effect transistor and a power supply integrated circuit are exemplified in addition to a field effect transistor and a capacitor, but the type is not limited as long as the element becomes a high temperature.
The heat sink 53 is provided with ribs 56. The rib 56 is located immediately below the heat dissipation surface 53c that is in contact with the substrate main body 61. That is, at least a part of the rib 56 overlaps the heat radiation surface 53c when viewed from the axial direction.
The motor main body housing portion 54 has a cylindrical shape that is open to the upper side (+ Z side). The motor body housing portion 54 extends downward from the heat sink portion 53. The motor body housing portion 54 houses the rotor 20 and the stator 25. The motor main body housing portion 54 has a cylindrical portion 54a, a bottom portion 54b, and a lower bearing holding portion 54 c. The motor main body housing portion 54 may be a cylindrical member without the bottom portion 54 b. In this case, a bearing holder for holding a bearing is separately attached to the opening on the lower side of the motor body housing portion 54.
The cylindrical portion 54a surrounds the stator 25 from the radially outer side. In the present embodiment, the cylindrical portion 54a is cylindrical. The stator core 27 and the bearing holder 30 are fixed to the inner peripheral surface of the cylindrical portion 54 a. At the upper end of the cylindrical portion 54a, the heat sink portion 53 is connected to the outer peripheral surface of the cylindrical portion 54 a.
The bottom portion 54b is located at the lower end of the cylindrical portion 54 a. The bottom portion 54b is located on the lower side of the stator 25. The lower bearing holding portion 54c is located at the center of the bottom portion 54b in plan view. The lower bearing holding portion 54c holds the lower bearing 7B. A hole 54d penetrating in the axial direction is provided at the center of the lower bearing holder 54c in a plan view. The lower end of the shaft 21 is inserted into the hole 54 d.
The element housing portion 55 is open to the upper side (+ Z side). The element housing portion 55 extends downward from the heat sink portion 53. As shown in fig. 1, the element housing section 55 of the present embodiment houses 3 capacitors 65. The 3 capacitors 65 are arranged in one direction (Y-axis direction in the present embodiment) perpendicular to the central axis J. In a plan view, element housing portion 55 has a longitudinal direction defined by a direction in which 3 capacitors 65 are arranged (i.e., a direction in which 2 nd rib 56b extends). The dimension S1 in the longitudinal direction of the element housing portion 55 is smaller than the diameter D of the motor body housing portion 54. That is, even when the plurality of capacitors 65 are arranged in a row in one direction, the dimension S1 in the longitudinal direction of the element housing portion 55 is not larger than the motor main body housing portion 54. Therefore, the size of the motor 1 can be suppressed in the direction perpendicular to the central axis J.
As shown in fig. 2, the capacitor 65 has a top surface 65b facing downward and a side surface 65a facing in a direction perpendicular to the axial direction. The element housing portion 55 includes: a sidewall portion 55a surrounding a side surface 65a of the capacitor 65; and a housing bottom portion 55b located below the capacitor 65 and axially opposed to the top surface 65b of the capacitor 65.
According to the present embodiment, the case 50 has the element housing portion 55 housing the capacitor 65. The capacitor 65 is a heating element that easily generates heat larger than the field effect transistor 66 or other electronic components on the circuit board 60. Therefore, heat generated at the capacitor 65 can be efficiently absorbed in the element housing portion 55. Further, a heat dissipating material such as heat dissipating grease is preferably accommodated between the side wall portion 55a of the element accommodating portion 55 and the side surface 65a of the capacitor 65. This enables heat to be efficiently transferred from side surface 65a of capacitor 65 toward element housing portion 55, thereby improving the reliability of the operation of capacitor 65.
The capacitor 65 has an explosion-proof valve 90 at a front end portion 65t in a direction perpendicular to the planar direction. That is, the capacitor 65 has the explosion-proof valve 90 at the axial front end portion 65t of the motor main body 2. The diameter of the outer side of the explosion-proof valve 90 is smaller than the diameter of the front end portion 65t of the capacitor 65. Further, a heat dissipation material may be disposed between the housing bottom portion 55b of the element housing portion 55 and the top surface 65b of the capacitor 65. The heat dissipating material is configured to avoid at least the explosion-proof valve 90.
The element housing portion 55 may be configured to be open to the lower side without the housing bottom portion 55 b. In addition, a part of the side wall portion 55a of the element housing portion 55 may be opened in the horizontal direction. That is, the housing bottom portion 55b and the side wall portion 55a do not necessarily surround the top surface 65b and the side surface 65a of the capacitor 65 as a whole. That is, the element housing portion 55 covers at least a part of the side surface 65a of the capacitor 65 on the lower side (one side) of the circuit board 60. For example, the plurality of capacitors 65 may be spaced widely from each other. At this time, the element housing portion 55 is enlarged to such an extent that the capacitor 65 can be interposed between the element housing portion 55 and the side wall portion 55a with a space therebetween. It may be the case that there is only one capacitor 65. In these cases, it is preferable that the element housing portion 55 cover the side surface 65a of the capacitor 65 over the entire circumference.
In the present embodiment, the motor body housing portion 54 and the element housing portion 55 each extend downward from the heat sink portion 53. That is, the motor body housing portion 54 and the element housing portion 55 are separated from each other when viewed from the axial direction. According to the present embodiment, since the motor body housing portion 54 and the element housing portion 55 extend from the heat sink portion 53, respectively, the surface area of the outer peripheral surface of the case 50 is increased, and the heat radiation effect of the case 50 can be improved. As described above, the motor body housing portion 54 and the element housing portion 55 may be different members fixed to each other with the heat sink portion 53 interposed therebetween.
The housing 50 has an upper surface 50a facing the upper side. The upper surface 50a is provided to straddle the motor main body housing portion 54, the element housing portion 55, and the heat sink portion 53 of the housing 50. The upper surface 50a is opposed to the lid 40. The upper surface 50a is provided with a 2 nd groove portion 52 extending along an outer edge of the upper surface 50 a. The 2 nd groove portion 52 is recessed downward with respect to the upper surface 50 a. The 2 nd groove portion 52 extends with a uniform width and a uniform depth in a plane perpendicular to the center axis J. The 2 nd groove portion 52 accommodates the 2 nd projecting portion 42 of the cover portion 40 described later.
[ Bearings-holder ]
The bearing holder 30 is located on the upper side (+ Z side) of the stator 25. The bearing holder 30 supports the upper bearing 7A. The bearing holder 30 has a circular shape in plan view, for example, concentric with the central axis J. The bearing holder 30 is positioned in the opening 54e on the upper side of the motor body housing 54, and is fixed to the inner peripheral surface of the motor body housing 54.
The bearing holder 30 includes a holder body 31 having an annular disk shape in plan view, an upper bearing holding portion 32 located radially inward of the holder body 31, and a holder fixing portion 33 located radially outward of the holder body 31.
The upper bearing holding portion 32 holds the upper bearing 7A. The upper bearing holding portion 32 is located at the center of the bearing holder 30 in a plan view. A hole 32a penetrating in the axial direction is provided at the center of the upper bearing holder 32 in a plan view. The upper end of the shaft 21 is inserted into the hole 32 a. The holder fixing portion 33 has a cylindrical shape protruding in the vertical direction from the radial outer edge of the holder body portion 31. The outer peripheral surface of the holder fixing portion 33 is radially opposed to the inner peripheral surface of the motor body housing portion 54. The holder fixing portion 33 is fitted and fixed to the inner peripheral surface of the motor body housing portion 54.
At least a part of the bearing holder 30 overlaps the heat sink portion 53 of the housing 50 in the axial direction. Therefore, the space above the bearing holder 30 can be sufficiently enlarged. As a result, the degree of freedom in the arrangement of the circuit board 60 positioned above the bearing holder 30 and the degree of freedom in the arrangement of the components mounted on the circuit board 60 can be improved.
[ Circuit Board ]
The circuit board 60 is located above the motor main body 2 and the bearing holder 30. The circuit board 60 extends in a direction perpendicular to the central axis J (i.e., a direction perpendicular to the vertical direction, a planar direction). A coil wire extending from the coil 29 of the stator 25 is connected to the circuit board 60. That is, the circuit board 60 is electrically connected to the motor main body 2 and is extended in the planar direction. The circuit board 60 controls the rotation of the rotor 20 by flowing a current through the coil 29.
The circuit board 60 includes a substrate main body 61, a plurality of (3 in the present embodiment) capacitors 65, and a plurality of field effect transistors 66. In addition, the substrate main body 61 includes electronic components (not shown) for controlling the rotation of the rotor 20.
The circuit board 60 is located at a position different from the motor main body 2 in the axial direction. The capacitor 65 is located radially outside the motor main body 2. A space is provided between the element housing portion 55 of the case 50 located on the side surface 65a of the capacitor 65 and the outer peripheral surface 54r of the motor main body housing portion 54. That is, a space is provided between the element housing portion 55 and the outer peripheral surface 2r of the motor main body 2. Since the circuit board 60 is positioned above the motor main body 2 in the axial direction and the capacitor 65 is positioned outside the motor main body 2 in the radial direction, heat from the capacitor 65 or the capacitor overlapping region 61X of the circuit board 60 can be made less likely to be transmitted to the motor main body 2. The influence of heat radiation from the element housing portion 55 on the motor main body 2 is also suppressed by the space between the element housing portion 55 of the case 50 and the outer peripheral surface 2r of the motor main body 2. Further, the area of the element housing portion 55 exposed to the outside is increased. This makes it possible to easily release the heat transmitted to the element housing 55 to the outside.
The substrate main body 61 is arranged perpendicular to the axial direction (i.e., the up-down direction). The substrate main body 61 has an upper surface 61d facing upward and a lower surface 61c facing downward. Further, the substrate main body 61 includes: a motor body overlapping portion 61A that overlaps the motor body 2 when viewed in the vertical direction; and a protruding portion 61B located outside the motor main body 2 when viewed from the up-down direction. The protruding portion 61B includes a capacitor overlapping portion 61C overlapping the capacitor 65 when viewed from the vertical direction. The capacitor overlapping portion 61C on the upper surface 61d of the substrate main body 61 serves as a capacitor overlapping region 61X. That is, the upper surface 61d of the substrate main body 61 has a capacitor overlapping region 61X when viewed from the axial direction side (direction perpendicular to the planar direction).
The capacitor 65 is mounted on the lower surface 61c of the substrate body 61. That is, the capacitor 65 is mounted on the lower side (the side perpendicular to the planar direction) of the circuit board. The capacitor 65 has a cylindrical shape extending in the axial direction. The capacitor 65 has: a top surface 65b located on the opposite side of the substrate main body 61, facing the lower side; and a side surface 65a facing in a direction perpendicular to the axial direction (vertical direction). Among the components mounted on the circuit board 60, the capacitor 65 has the largest dimension in the axial direction (vertical direction). The field effect transistor 66 is mounted on the upper surface 61d of the substrate main body 61. The field effect transistor 66 has a rectangular shape in plan view. Further, electronic components such as a rotation sensor and a choke coil are mounted on one or both of the upper surface 61d and the lower surface 61c of the substrate main body 61 in addition to the capacitor 65 and the field effect transistor 66.
The capacitor 65 and the field effect transistor 66 as the heat generating element are mounted on the extension portion 61B of the substrate main body 61. An upper heat sink 80 described later is located on the upper side of the protruding portion 61B. The upper heat sink 80 is in direct or indirect contact with the extension portion 61B and the field effect transistor 66 mounted on the upper surface 61d of the extension portion 61B to cool them. In addition, the heat sink portion 53 and the element housing portion 55 of the case 50 are located below the protruding portion 61B. The heat sink 53 and the element housing 55 are in direct or indirect contact with the extension 61B and the capacitor 65 attached to the lower surface 61c of the extension 61B to cool them. That is, the upper heat sink 80 covers the capacitor overlapping region 61X on the upper side (the other side) of the circuit substrate 60. In addition, according to the present embodiment, the extension portion 61B on which the heating element (the capacitor 65 and the field effect transistor 66) is mounted is sandwiched between the upper heat sink 80 and the case 50 from the up-down direction. This enables the upper heat sink 80 and the case 50 to effectively cool the heating elements 65 and 66 attached to the extension portion 61B. Further, according to the present embodiment, by disposing the heater elements 65 and 66 to be cooled in the extension portion 61B of the substrate main body 61, the structure required for cooling the heater elements 65 and 66 can be disposed so as to be shifted from the motor main body 2 in a plan view. Therefore, the axial dimension (vertical dimension) of the motor 1 can be reduced. That is, the capacitor 65 is located radially outside the motor main body 2. The element housing portion 55 and the upper heat sink 80 of the case 50 are located on the lower side and the upper side (both sides in the axial direction) of the circuit board 60. Since the element housing portion 55 and the upper heat sink 80 of the case 50 are positioned on the lower side and the upper side of the circuit board 60, heat from the capacitor 65 and the capacitor overlapping region 61X of the circuit board 60 can be radiated from both the lower side and the upper side. This suppresses the heat transfer in the radial direction into the circuit board 60.
[ Upper radiator (second radiator, 2 nd radiator) ]
The upper heat sink 80 is located on the upper side of the circuit substrate 60. The upper heat sink 80 covers a part of the circuit substrate 60 from the upper side. The upper heat sink 80 of the present embodiment is in direct or indirect contact with the circuit board 60, and functions as an upper heat sink for cooling the circuit board 60. The upper heat sink 80 may be in direct contact with the circuit board 60 or may be in indirect contact therewith, as long as it is in thermal contact with the circuit board 60 and cools the circuit board 60. More specifically, the upper heat sink 80 may be in contact with the circuit board 60 via a heat dissipating material such as heat dissipating grease.
The upper heat sink 80 has a heat absorbing portion 85 and fins 89a on an upper surface 85a of the heat absorbing portion 85. The upper heat sink 80 is made of a metal material (e.g., an aluminum alloy or a copper alloy) having high heat dissipation characteristics.
As shown in fig. 3, the heat absorbing portion 85 has an upper surface 85a facing upward and a lower surface 85b facing downward. In addition, the heat absorbing portion 85 is provided with a pair of screw insertion holes. The screw insertion hole penetrates the heat absorbing portion 85 in the axial direction. Fixing screws are inserted into the pair of screw insertion holes, respectively. The fixing screw is screwed to the heat sink portion 53 of the housing 50. Thereby, the lower surface 85b of the heat absorbing portion 85 abuts the upper surface 53a of the heat sink portion 53, and the upper heat sink 80 is fixed to the case 50.
According to the present embodiment, the upper heat sink 80 is directly in contact with and fixed to the housing 50. The upper heat sink 80 and the case 50 respectively absorb heat from the circuit substrate 60. By bringing the upper heat sink 80 and the case 50 into contact with each other and fixing them, thermal movement is generated between the upper heat sink 80 and the case 50. Therefore, when either one of the upper heat sink 80 and the case 50 becomes high temperature, the heat can be transferred to the other side and the heat can be dissipated from the other side. This improves the heat dissipation efficiency, and as a result, the cooling effect of the circuit board 60 can be improved.
As will be described later, the lid 40 is provided above the upper heat sink 80. The lid 40 is provided with an opening 49 penetrating in the vertical direction. The upper heat sink 80 has an exposed portion 89 exposed from the opening portion 49 of the cover 40. The exposed portion 89 is located on the upper surface 85a of the heat sink 85.
According to the present embodiment, the upper heat sink 80 has the exposed portion 89, and therefore the upper heat sink 80 can efficiently dissipate heat absorbed from the circuit board 60 to the outside of the motor 1 from the exposed portion 89. This can improve the cooling efficiency of the circuit board 60 by the upper heat sink 80.
The exposed portion 89 of the upper heat sink 80 is located directly above the capacitor 65 or the field effect transistor 66 as a heat generating element. That is, when viewed from the axial direction (vertical direction), the exposed portion 89 of the upper heat sink 80 overlaps at least a part of the field effect transistor 66. This allows heat transferred from the circuit board 60 to the upper heat sink 80 to be efficiently dissipated in the exposed portion 89. The heating element overlapping the exposed portion 89 when viewed in the axial direction may be a heating element other than the capacitor 65 or the field effect transistor 66 (for example, a driver integrated circuit for driving a field effect transistor, an integrated circuit for a power supply).
As shown in fig. 1, the fins 89a are located at the exposed portion 89 of the upper heat sink 80. The fins 89a protrude upward from the upper surface 85a of the heat absorbing portion 85. As shown in fig. 2, the fin 89a penetrates the opening 49 in the exposed portion 89.
The upper heat sink 80 is provided with a plurality of fins 89 a. The plurality of fins 89a extend in one direction perpendicular to the up-down direction. In the present embodiment, the fins 89a extend in the X-axis direction. According to the present embodiment, by providing the fins 89a in the exposed portion 89, the surface area of the exposed portion 89 can be increased, and the heat radiation efficiency of the upper heat sink 80 of the exposed portion 89 can be improved. Further, according to the present embodiment, since the plurality of fins 89a extend in one direction, when the motor 1 is disposed in the gas flowing in one direction, the fins 89a are disposed so as to extend in the flowing direction of the gas, and thus the heat radiation efficiency of the fins 89a can be improved.
In the present embodiment, the case where the upper heat sink 80 has the fins 89a is exemplified. However, if the upper heat sink 80 has the exposed portion 89, a certain effect of improving the heat radiation efficiency can be obtained even if the upper heat sink 80 does not have the fins 89 a.
The heat sink 85 has a top surface 85a provided with a 1 st groove portion 81, and the 1 st groove portion 81 surrounds the exposed portion 89 when viewed in the axial direction (vertical direction). The 1 st groove portion 81 extends with a uniform width and a uniform depth in a plane perpendicular to the center axis J. The 1 st groove portion 81 is recessed downward with respect to the upper surface 85 a. The 1 st protruding portion 41 of the lid portion 40 described later is housed in the 1 st groove portion 81.
[ COVER ]
As shown in fig. 2, the cover 40 is positioned above the case 50, the circuit board 60, and the upper heat sink 80. The lid portion 40 covers the upper surface 50a of the housing 50. The cover 40 covers the circuit board 60 from above, and protects the circuit board 60. The cover 40 covers the opening of the motor main body housing 54 of the housing 50, and suppresses intrusion of contaminants into a rotating portion of the motor main body 2 and the like.
As shown in fig. 1, the cover 40 includes: a flat portion 45; an outer edge portion 46 located on the outer edge of the flat portion 45 and protruding downward with respect to the flat portion 45; and a connector portion 47 extending upward from the flat portion 45.
The connector portion 47 has a cylindrical shape extending upward from the flat portion 45. A connection terminal (not shown) extending upward from the circuit board 60 is provided inside the connector portion 47. The connection terminals are connected to an external device (not shown) that supplies power to the circuit board 60.
As shown in fig. 2, the flat portion 45 extends in a direction perpendicular to the axial direction (vertical direction). That is, the flat portion 45 extends along the circuit substrate 60. The flat portion 45 has an upper surface 45a facing upward and a lower surface 45b facing downward.
The flat portion 45 is provided with an opening 49. The opening 49 has a rectangular shape when viewed from the axial direction. The fins 89a of the upper heat sink 80 are inserted into the openings 49. The upper end of the fin 89a is located above the upper surface 45a of the flat portion 45.
The lower surface 45b of the flat portion 45 is axially separated from the heat absorbing portion 85. Therefore, the flat portion 45 does not contact the upper heat sink 80. The lower surface 45b of the flat portion 45 is provided with a 1 st projecting portion 41 projecting downward.
The 1 st projection 41 surrounds the opening 49 when viewed from the axial direction. The 1 st projection 41 extends with a uniform width and a uniform height in a plane perpendicular to the central axis J. The 1 st projection 41 is received in the 1 st groove 81, and the 1 st groove 81 is provided in the upper heat sink 80. The upper heat sink 80 is provided with an exposed portion 89 exposed from the opening portion 49. Therefore, when viewed from the axial direction (vertical direction), exposed portion 89 is surrounded by 1 st protruding portion 41 and 1 st groove portion 81. A gap is provided between the inner wall surface of the 1 st groove portion 81 and the 1 st convex portion 41. The 1 st groove portion 81 is filled with an adhesive B.
Hereinafter, a preferred arrangement and shape of the upper heat sink 80 will be described from the viewpoint of promoting heat dissipation of the circuit board 60 around the capacitor 65 in addition to heat dissipation of the capacitor 65 itself.
In the present embodiment, as shown enlarged in fig. 3, the element housing portion 55 of the case 50 covers the side surface 65a of the capacitor 65, and the upper heat sink 80 covers the capacitor overlapping region 61X of the circuit board 60. That is, the side wall portion 55a and the housing bottom portion 55b are integrated as the element housing portion 55, the side wall portion 55a of the element housing portion 55 faces the side surface 65a of the capacitor 65, and the housing bottom portion 55b of the element housing portion 55 faces the top surface 65b of the capacitor 65. The lower surface 85b of the heat absorbing portion 85 of the upper heat sink 80 faces the capacitor overlapping region 61X of the circuit board 60.
In the motor 1, the capacitor 65 supplies power to an inverter that drives the motor main body 2, and generates much heat. In addition, a large amount of heat is emitted from the capacitor overlapping region 61X in the planar region of the circuit board 60. Since the current flowing through the capacitor is concentrated in the capacitor overlapping region 61X of the circuit substrate 60, more heat is generated. According to the present embodiment, since case 50 and upper heat sink 80 cover side surface 65a of capacitor 65 that generates most of the heat, the heat generated by capacitor 65 can be efficiently dissipated. Further, since the upper heat sink 80 covers at least the capacitor overlapping area 61X of the upper surface 61d of the circuit substrate 60, it is possible to efficiently dissipate heat generated from the capacitor 65 itself, and also to dissipate heat generated from the capacitor overlapping area 61X.
In addition, according to the present embodiment, since the heat sink is divided into the element housing portion 55 of the case 50 and the upper heat sink 80, the degree of freedom in the arrangement and design of the heat sink can be increased. For example, the case 50 may be disposed below the circuit board 60, and the upper heat sink 80 may be disposed above the circuit board 60. For example, when the amount of heat generated from the side surface 65a of the capacitor 65 is larger than the amount of heat generated from the capacitor overlapping region 61X of the circuit substrate 60, the shapes of the respective structures of the case 50 and the upper heat sink 80 can be adjusted so that the heat radiation performance of the element housing portion 55 is higher than the heat radiation performance of the upper heat sink 80.
In the present embodiment, the capacitor 65 has an explosion-proof valve 90 at an upper end portion 65 t. The end portion 65t of the capacitor 65 is an end portion in a direction perpendicular to the planar direction of the circuit substrate 65. Element housing portion 55 of case 50 covers a portion of side surface 65a of capacitor 65 except for a portion where the distance from adjacent capacitor 65 is small. Further, the side surface 65a of the capacitor 65 may be covered over the entire circumference.
According to the present embodiment, since element housing portion 55 of case 50 covers side surface 65a of capacitor 65, heat generated from capacitor 65 can be efficiently dissipated.
Modification 1
As described above, if the side surface 65a of the capacitor 65 and the capacitor overlapping region 61X are covered with the case 50 or the upper heat sink 80, the element housing portion 55 may not have the housing bottom portion 55b as shown in fig. 4. That is, the lower side of the capacitor 65 may be opened. In a cross section obtained by cutting the capacitor 65 and the case 50 in the radial direction, the element housing portion 55 covers the side wall portion 55A of the capacitor 65 from the radial outside with a 1 st portion 55A (the element housing portion 55 on the left side of the paper surface in fig. 4) and a 2 nd portion 55B (the element housing portion 55 on the right side of the paper surface in fig. 4). The 1 st part 55A and the 2 nd part 55B may be formed of one member or may be formed of different members.
According to the present embodiment, the total volume of the element housing portion 55 is reduced, so that the cost of the motor 1 can be reduced. In addition, according to the present embodiment, the element housing portion 55 can be designed so as to avoid the explosion-proof valve 90.
As described above, the side surface 65a of the capacitor 65 and the capacitor overlapping region 61X may be covered with the case 50 or the upper heat sink 80. As shown in fig. 5, side surface 65a of capacitor 65 may have: a 1 st region 100A extending in the circumferential direction on a side close to the motor main body 2 in the radial direction (see fig. 2); and a 2 nd region 100B which is offset from the 1 st region 100A on a side away from the motor main body 2 and extends in the circumferential direction. The case 50 may cover the 1 st region 100A of the side surface 65a of the capacitor 65, and the upper heat sink 80 may cover the 2 nd region 100B of the side surface 65a of the capacitor 65. For example, the side wall portion 55a of the element housing portion 55 may cover the 1 st area 100A of the capacitor 65, and the housing bottom portion 55b of the element housing portion 55 may cover the top surface 65b of the capacitor 65. The upper heat sink 80 may have an extension 104 extending from a radially outer end portion thereof to the radially outer side of the 2 nd region 100B of the capacitor 65 and downward. The extension 104 is opposed to the 2 nd region 100B of the capacitor 65. The gap between the element housing portion 55 of the case 50 and the extension portion 104 of the upper heat sink 80 is open at the lower end.
According to the present embodiment, by the overall design of the motor 1, even when the 1 st region 100A and the 2 nd region 100B of the side surface 65a of the capacitor 65 are required to be covered with the respective heat sinks, the heat generated from the capacitor 65 can be efficiently dissipated.
Modification 3
As described above, the side surface 65a of the capacitor 65 and the capacitor overlapping region 61X may be covered with the case 50 or the upper heat sink 80. As shown in fig. 6, the housing bottom portion 55b may not be provided. That is, the lower side of the capacitor 65 may be open. Although fig. 5 and 6 show an example in which the capacitor 65 is disposed on the lower surface 61c so as to be flush with the radially outer end surface of the circuit board 60, the capacitor 65 may be disposed radially inward of the position shown in fig. 5 and 6. In such a configuration, the extension portion 104 may descend from the end portion on the radial outer side of the upper heat sink 80 and may be wound around so as to approach the radial outer side of the 2 nd region 100B of the capacitor 65. The gap between the element housing portion 55 of the case 50 and the extending portion 104 of the upper heat sink 80 may be located radially inward of the positions shown in fig. 5 and 6.
According to the present embodiment, as in modification 2, even when it is required to cover the 1 st region 100A and the 2 nd region 100B of the side surface 65a of the capacitor 65 with the respective heat sinks, the heat generated from the capacitor 65 can be efficiently dissipated.
Next, a process of assembling the lid 40 in the manufacturing process of the motor 1 will be described. In the present embodiment, the assembly of the lid 40 to the motor 1 is performed at the end of the assembly process.
First, the interiors of the 1 st groove portion 81 of the upper heat sink 80 and the 2 nd groove portion 52 of the case 50 are filled with the uncured adhesive B. Next, the lid portion 40 is brought close to the upper heat sink 80 and the case 50 fixed to the upper heat sink 80 from the upper side, the 1 st protruding portion 41 is inserted into the 1 st groove portion 81, and the 2 nd protruding portion 42 is inserted into the 2 nd groove portion 52. Subsequently, the adhesive B is cured. The lid 40 is assembled to the motor 1 through the above steps.
According to the present embodiment, the 1 st projecting portion 41 and the 2 nd projecting portion 42 project in the same direction, and the 1 st groove portion 81 and the 2 nd groove portion 52 open in the same direction. In addition, the 1 st groove portion 81 and the 2 nd groove portion 52 are filled with uncured adhesive B. Since the 1 st groove portion 81 and the 2 nd groove portion 52 are opened in the same direction, the 1 st groove portion 81 and the 2 nd groove portion 52 can be simultaneously filled with the uncured adhesive B. In addition, the following steps can be adopted: after the uncured adhesive B is filled in the 1 st groove part 81 and the 2 nd groove part 52, the lid part 40 is lowered, and the 1 st protruding part 41 and the 2 nd protruding part 42 are accommodated in the 1 st groove part 81 and the 2 nd groove part 52, respectively. This can simplify the assembly process of the lid 40.
As shown in fig. 1, the case 50 and the lid 40 are fixed to each other by the engaging portion 6. The motor 1 is provided with a plurality of engaging portions 6 in the circumferential direction.
The engagement portion 6 is constituted by a hook portion 43 provided to the cover portion 40 and a pawl portion 58 provided to the housing 50. The hook portion 43 of the lid portion 40 extends downward in a U shape from the outer edge portion 46. The claw portion 58 protrudes outward in the horizontal direction from the outer side surface of the housing 50. In the process of assembling the lid portion 40, the worker brings the lid portion 40 close to the housing 50 in the axial direction, fits the claw portions 58 into the hook portions 43, and fixes the lid portion 40 to the housing 50. In the present embodiment, the engagement portion 6 is provided to hold the lid portion 40 during a period from when the lid portion 40 is assembled to the case 50 to when the adhesive B is cured. When the adhesive B is not used for fixing the lid 40, the lid 40 is fixed to the housing 50 by the fixing function of the engaging portion 6.
While the embodiment and the modification of the present invention have been described above, the configurations and combinations thereof in the embodiment and the modification are merely examples, and addition, omission, replacement, and other modifications of the configurations can be made within the scope not departing from the gist of the present invention. The present invention is not limited to the embodiments.
For example, in the above embodiment, the rotor 20 is an inner rotor disposed radially inside the coil 29. However, the arrangement of the rotor 20 is not limited to this, and the rotor 20 may be an outer rotor arranged radially outside the coil 29, for example.
Description of the reference symbols
1: a motor; 2: a motor main body; 2 r: outer peripheral surface 6: a fastening part; 7A: an upper side bearing (bearing); 20: a rotor; 21: a shaft; 25: a stator; 30: a bearing retainer; 40: a cover portion; 41: the 1 st convex part; 42: a 2 nd convex part; 49: an opening part; 50: a case (heat sink, 1 st heat sink, part of heat sink); 52: a 2 nd groove part; 53: a radiator portion (radiator main body portion); 53 c: a heat dissipating surface; 54: a motor main body housing section; 54e, and (b) 54 e: an opening; 55: an element housing section; 56: a rib; 60: a circuit substrate; 61: a substrate main body; 61A: a motor main body overlapping portion; 61B: a protruding portion; 61X: a capacitor overlapping section; 65: a capacitor; 80: an upper heat sink (2 nd heat sink, another part of the heat sink); 81: a 1 st groove part; 89: an exposed portion; 89 a: a fin; b: an adhesive; d: a diameter; j: a central axis; s1: and (4) size.
Claims (8)
1. A motor, comprising:
a motor main body having a rotor rotatable about a central axis and a stator radially opposed to the rotor;
a circuit board electrically connected to the motor main body and extending in a planar direction;
a capacitor mounted on one side of the circuit board perpendicular to a planar direction; and
a heat sink in direct or indirect contact with the circuit substrate,
the circuit substrate has a 1 st surface on one side and a 2 nd surface on the other side,
the 2 nd surface has a capacitor overlapping region overlapping with the capacitor when viewed from a direction perpendicular to a planar direction of the circuit substrate,
the heat sink covers at least a part of a side surface of the capacitor on one side of the circuit substrate, and covers the capacitor overlapping area on the other side of the circuit substrate.
2. The motor of claim 1,
the capacitor has an explosion-proof valve at an end in a direction perpendicular to a planar direction of the circuit substrate,
the heat sink covers the side surfaces of the capacitor over the entire circumference.
3. The motor according to claim 1 or 2,
the heat sink has:
1 st radiator; and
a second heat sink (2) for dissipating heat generated by the first heat sink,
the 1 st heat sink covers the sides of the capacitor,
the 2 nd heat spreader covers the capacitor overlap region.
4. The motor according to any one of claims 1 to 3,
the heat sink has:
1 st radiator; and
a second heat sink (2) for dissipating heat generated by the first heat sink,
the side face of the capacitor has a 1 st region extending in the circumferential direction and a 2 nd region offset from the 1 st region and extending in the circumferential direction,
the 1 st heat sink covers the 1 st area,
the 2 nd heat sink covers the 2 nd area.
5. The motor according to any one of claims 1 to 4,
the capacitor is located radially outside the motor body,
the heat sink is located on both sides of the circuit substrate in the axial direction of the motor main body.
6. The motor according to any one of claims 1 to 5,
the circuit substrate is located at a position different from the motor main body in the axial direction,
the capacitor is located radially outside the motor body,
a gap is provided between the heat sink located on the side of the capacitor and the outer peripheral surface of the motor main body.
7. The motor according to any one of claims 1 to 6,
the motor main body has:
a housing that houses the stator; and
a bearing holder disposed at the opening of the housing,
the heat sink and the housing or the bearing holder form one part.
8. The motor according to any one of claims 1 to 7,
the motor has a housing for accommodating the stator and the circuit board,
a part of the heat sink is located inside the housing, and another part is exposed to the outside of the housing.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-192188 | 2017-09-29 | ||
| JP2017192188 | 2017-09-29 | ||
| PCT/JP2018/028636 WO2019064896A1 (en) | 2017-09-29 | 2018-07-31 | Motor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111033964A true CN111033964A (en) | 2020-04-17 |
| CN111033964B CN111033964B (en) | 2022-09-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880053564.8A Active CN111033964B (en) | 2017-09-29 | 2018-07-31 | Motor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2019064896A1 (en) |
| CN (1) | CN111033964B (en) |
| WO (1) | WO2019064896A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7069733B2 (en) * | 2018-01-15 | 2022-05-18 | 富士電機株式会社 | Heat dissipation block and power converter |
| JP2021044984A (en) * | 2019-09-12 | 2021-03-18 | 日本電産株式会社 | Motor and electric power steering device |
| DE112021000813T5 (en) * | 2020-01-31 | 2022-11-24 | Hanon Systems | ELECTRICAL COMPRESSOR, INVERTER MANUFACTURING EQUIPMENT AND INVERTER MANUFACTURING PROCESS |
| JP7361891B2 (en) * | 2020-04-16 | 2023-10-16 | 三菱電機株式会社 | rotating electric machine |
| DE102020131009A1 (en) * | 2020-11-24 | 2022-05-25 | Still Gesellschaft Mit Beschränkter Haftung | Converter and method for its manufacture |
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- 2018-07-31 JP JP2019544352A patent/JPWO2019064896A1/en active Pending
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- 2018-07-31 WO PCT/JP2018/028636 patent/WO2019064896A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111033964B (en) | 2022-09-20 |
| JPWO2019064896A1 (en) | 2020-10-22 |
| WO2019064896A1 (en) | 2019-04-04 |
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