CN111031764B - Cavity-dividing heat dissipation structure of airborne liquid crystal display - Google Patents
Cavity-dividing heat dissipation structure of airborne liquid crystal display Download PDFInfo
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- CN111031764B CN111031764B CN201911347877.7A CN201911347877A CN111031764B CN 111031764 B CN111031764 B CN 111031764B CN 201911347877 A CN201911347877 A CN 201911347877A CN 111031764 B CN111031764 B CN 111031764B
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- card
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- cold plate
- plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 24
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 4
- 238000004088 simulation Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 208000002925 dental caries Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20972—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Nonlinear Science (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention is used in the field of heat design of an airborne liquid crystal display, and particularly relates to a cavity-dividing heat dissipation structure of an airborne liquid crystal display. The front shell, the backlight cold plate, the rear cover plate and the daughter card cold plate divide the heat dissipation structure into three independent cavities, namely a front cavity, a middle cavity and a rear cavity. The inner space of the product can be effectively utilized, and the dimension of the product in the thickness direction can be reduced. The high-heat device positions and the heat dissipation positions of the functional modules are reasonably arranged. The heat between the modules is prevented from being influenced mutually, and the assembly and the disassembly are convenient, so that the maintenance is high.
Description
Technical Field
The invention is used in the field of thermal design of the airborne liquid crystal display. In particular to a cavity-dividing heat dissipation structure of an airborne liquid crystal display.
Background
With the continuous improvement of the functions and performance requirements of the onboard liquid crystal display, the product is increasingly provided with more and more functional daughter cards, and the volume power density and the surface heat flux density of the whole product are also continuously increased. In a limited space, how to transfer the heat of the high-heat device on each functional module to the external shell can not cause excessive increase of the volume of the product, and becomes important and difficult in structural design of the product.
Disclosure of Invention
The functional module of the product is reasonably arranged under the condition of smaller space, and the heat of the high-heat device on the printed board is conducted to the shell for heat dissipation.
Technical proposal
The utility model provides an airborne LCD divides chamber heat radiation structure, preceding casing, backlight cold plate, back shroud and sub-card cold plate divide into three independent cavitys of preceding cavity, well cavity, back cavity with heat radiation structure and constitute. The front cavity consists of a front shell component, a backlight component and the front part of the backlight cold plate, wherein the front part of the backlight component is clung to the rear part of the front shell component, and the rear part of the backlight component is clung to the front part of the backlight cold plate. The middle cavity consists of the rear part of the backlight cold plate, the sub-card carrier plate and the front part of the rear cover plate. A display control board is arranged between the rear part of the backlight cold plate and the sub-card carrier plate, a connector at the rear end of the display control board is crosslinked with a connector at the front end of the carrier plate, and a high-heat device on the sub-card carrier plate and a connector for communicating with a functional sub-card are arranged at the rear end of the carrier plate; the rear cavity is composed of the rear part of the rear cover plate, the functional daughter card and the daughter card cold plate. The connector on the front end of the functional sub-card is crosslinked with the connector on the rear end of the sub-card carrier plate, and the high-heat device is arranged at the rear end of the functional sub-card and transfers heat to the sub-card cold plate to realize cooling.
And a plurality of fans are arranged on the daughter card cold plate, and the quantity of the fans is determined according to the conditions of the heat flux density of the product, the characteristic curve of the fans, the result of the thermal simulation of the product, the high-low temperature test result of the product and the like.
The fan is arranged at the lower part of the daughter card cold plate.
The fan uses a centrifugal fan, and the wind direction is from bottom to top.
The functional daughter cards are a plurality of, including but not limited to FC daughter cards, AFDX network terminal daughter cards, ARINC818 daughter cards.
The back cover plate is provided with a groove, and the functional daughter card and the daughter card cold plate are arranged in the groove.
The connector and the high-heat device on the functional sub-card are arranged on the opposite side of the functional sub-card.
The connector and the high-heat device which are cross-linked with the display control panel on the carrier plate are arranged on the opposite side of the sub-card carrier plate.
Technical effects
1. The inner space of the product can be effectively utilized, and the dimension of the product in the thickness direction can be reduced.
2. The high-heat device positions and the heat dissipation positions of the functional modules are reasonably arranged. Avoiding the heat interaction between the modules.
3. The assembly relation of each functional module is simple, the assembly and the disassembly are convenient, and the maintenance is high.
Drawings
FIG. 1 is a schematic view of a heat dissipation structure
Fig. 2 is a side view of a heat dissipating structure
Detailed Description
The invention is described in detail below with reference to examples and figures, the characteristics of which are as follows: the whole heat dissipation structure is arranged in a heating module mode and is wholly heat-conducting. The rear cover plate has one side provided with a loading board and the other side provided with a functional sub-card. Deep groove and boss of the back cover plate.
As shown in fig. 1 and 2, the front housing, the backlight cooling plate, the rear cover plate and the daughter card cooling plate divide the product into three independent cavities, namely, a front cavity, a middle cavity and a rear cavity, and the backlight assembly, the daughter card carrier plate and the functional daughter card are respectively provided with independent heat dissipation cooling plates. The backlight assembly clings to the backlight cold plate; the sub-card carrier plate is arranged on the rear cover plate, the high-heat device on the sub-card carrier plate is arranged on one side close to the rear cover plate, and the connector crosslinked with the front end is arranged on the other side; the connector of the rear-end functional daughter card passes through the rear cover plate to be crosslinked with the connector on the daughter card carrier plate, and the high-heat device is arranged on the opposite side of the connector, so that heat is transferred to the rear-end cold plate in a conduction mode.
If the flow density of the product is too high or the thermal simulation shows that the temperature rise exceeds the temperature rise requirement of the whole product, a fan can be additionally arranged on the daughter card cold plate to perform forced air cooling.
The front shell, the backlight cold plate, the rear cover plate and the daughter card cold plate divide the heat dissipation structure into three relatively independent cavities, namely a front cavity, a middle cavity and a rear cavity. The three cavities can avoid the mutual influence among the modules as much as possible. The front cavity consists of a front shell component, a backlight component and the front part of the backlight cold plate, the front part of the backlight component is clung to the rear part of the front shell component, and the rear part of the backlight component is clung to the front part of the backlight cold plate for heat dissipation. The middle cavity consists of the rear part of the backlight cold plate, the sub-card carrier plate and the front part of the rear cover plate. A display control board is arranged between the rear part of the backlight cold plate and the sub-card carrier plate, a connector at the rear end of the display control board is crosslinked with a connector at the front end of the carrier plate, and a high-heat device on the sub-card carrier plate and a connector for communicating with the functional sub-card are arranged at the rear end of the carrier plate. The high-heat device on the sub-card carrier plate is tightly attached to the front end of the rear cover plate to dissipate heat; the rear cavity is composed of the rear part of the rear cover plate, the functional daughter card and the daughter card cold plate. The connector on the front end of the functional sub-card is crosslinked with the connector on the rear end of the sub-card carrier plate, and the high-heat device is arranged at the rear end of the functional sub-card and is tightly attached to the sub-card cold plate for heat dissipation.
And a plurality of fans are arranged on the daughter card cold plate, and the quantity of the fans is determined according to the conditions of the heat flux density of the product, the characteristic curve of the fans, the result of the thermal simulation of the product, the high-low temperature test result of the product and the like. When the natural heat dissipation is insufficient to control the temperature rise of the product, the fan can be arranged to cool the forced air preferentially, and even the daughter card cold plate is designed to be Cheng Junwen plates.
The fan is arranged at the lower part of the daughter card cold plate, so that the air channel of the fan can be prolonged, and the heat dissipation efficiency of the heat dissipation structure is improved.
The fan uses a centrifugal fan, the wind direction is from bottom to top, and the direction of the fan is consistent with the lift force direction of natural convection. The included angle between the air inlet direction and the air outlet direction of the centrifugal fan is 90 degrees, so that the sizes of the centrifugal fan in the thickness direction of the product can be reduced.
The functional sub-cards are a plurality of, and the sub-cards comprise, but are not limited to, FC sub-cards, AFDX network terminal sub-cards, ARINC818 sub-cards and 1394B sub-cards, and connectors of the sub-cards and the high-heat devices are arranged on different sides.
The back cover plate is provided with a groove, the functional daughter card and the daughter card cold plate are arranged in the groove, so that the space in the groove can be effectively utilized, and the size of the product in the thickness direction is reduced.
The connector and the high-heat device on the functional sub-card are arranged on the opposite side of the functional sub-card, so that a heat dissipation space is conveniently discharged, and the mutual influence of heat of front and rear modules can be avoided.
The connector and the high-heat device which are cross-linked with the display control panel on the sub-card carrier plate are arranged on the opposite side of the sub-card carrier plate, so that a heat dissipation space is conveniently discharged, and the mutual influence of heat of front and rear modules can be avoided.
Claims (5)
1. The utility model provides an airborne LCD divides chamber heat radiation structure which characterized in that: the front shell, the backlight cold plate, the rear cover plate and the daughter card cold plate divide the heat dissipation structure into three independent cavities, namely a front cavity, a middle cavity and a rear cavity; the front cavity consists of a front shell component, a backlight component and the front part of the backlight cold plate, wherein the front part of the backlight component is clung to the rear part of the front shell component, and the rear part of the backlight component is clung to the front part of the backlight cold plate; the middle cavity consists of the rear part of the backlight cold plate, the sub-card carrier plate and the front part of the rear cover plate; a display control board is arranged between the rear part of the backlight cold plate and the sub-card carrier plate, a connector at the rear end of the display control board is crosslinked with a connector at the front end of the carrier plate, and a high-heat device on the sub-card carrier plate and a connector for communicating with a functional sub-card are arranged at the rear end of the carrier plate; the rear cavity consists of the rear part of the rear cover plate, a functional daughter card and a daughter card cold plate; the connector on the front end of the functional sub-card is crosslinked with the connector on the rear end of the sub-card carrier plate, and the high-heat device is arranged on the rear end of the functional sub-card and transfers heat to the sub-card cold plate to realize cooling; the daughter card cold plate is provided with a plurality of fans, and the quantity of the fans is determined according to the heat flux density of the product, the characteristic curve of the fans, the thermal simulation result of the product and the high-low temperature test result of the product; the fan uses a centrifugal fan, and the wind direction is from bottom to top; the number of the functional sub-cards is a plurality, and the functional sub-cards comprise an FC sub-card, an AFDX network terminal sub-card and an ARINC818 sub-card.
2. The airborne liquid crystal display cavity-splitting heat dissipation structure of claim 1, wherein: the fan is arranged at the lower part of the daughter card cold plate.
3. The airborne liquid crystal display cavity-splitting heat dissipation structure of claim 1, wherein: the back cover plate is provided with a groove, and the functional daughter card and the daughter card cold plate are arranged in the groove.
4. The airborne liquid crystal display cavity-splitting heat dissipation structure of claim 1, wherein: the connector and the high-heat device on the functional sub-card are arranged on the opposite side of the functional sub-card.
5. The airborne liquid crystal display cavity-splitting heat dissipation structure of claim 1, wherein: the connector and the high-heat device which are cross-linked with the display control panel on the carrier plate are arranged on the opposite side of the sub-card carrier plate.
Priority Applications (1)
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CN201911347877.7A CN111031764B (en) | 2019-12-24 | 2019-12-24 | Cavity-dividing heat dissipation structure of airborne liquid crystal display |
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CN201911347877.7A CN111031764B (en) | 2019-12-24 | 2019-12-24 | Cavity-dividing heat dissipation structure of airborne liquid crystal display |
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CN111031764A CN111031764A (en) | 2020-04-17 |
CN111031764B true CN111031764B (en) | 2024-07-12 |
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Citations (1)
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CN211509646U (en) * | 2019-12-24 | 2020-09-15 | 太原航空仪表有限公司 | Machine-mounted liquid crystal display divides chamber heat radiation structure |
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KR100933631B1 (en) * | 2009-08-18 | 2009-12-23 | 삼성전자주식회사 | Back light assembly and liquid crystal display comprising the same |
CN103648258A (en) * | 2013-12-20 | 2014-03-19 | 中航华东光电有限公司 | Heat-radiating device of large screen display |
IT201700031356A1 (en) * | 2017-03-22 | 2018-09-22 | Imecon Eng S R L | Electronic panel for digital signage |
JP2019191309A (en) * | 2018-04-23 | 2019-10-31 | シャープ株式会社 | Liquid crystal display device |
CN214381917U (en) * | 2020-12-24 | 2021-10-08 | 太原航空仪表有限公司 | Forced air cooling heat dissipation structure of airborne display |
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CN211509646U (en) * | 2019-12-24 | 2020-09-15 | 太原航空仪表有限公司 | Machine-mounted liquid crystal display divides chamber heat radiation structure |
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