CN111031755A - Flat-plate evaporator loop heat pipe system for multiple heat sources - Google Patents
Flat-plate evaporator loop heat pipe system for multiple heat sources Download PDFInfo
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- CN111031755A CN111031755A CN201911308617.9A CN201911308617A CN111031755A CN 111031755 A CN111031755 A CN 111031755A CN 201911308617 A CN201911308617 A CN 201911308617A CN 111031755 A CN111031755 A CN 111031755A
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- evaporator
- pipe system
- heat
- heat sources
- heat pipe
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the field of electronic device heat dissipation, and particularly discloses a flat plate type evaporator loop heat pipe system for multiple heat sources. This system includes evaporimeter, gas pipeline, liquid pipeline and condenser, wherein: the evaporator is a flat plate evaporator, the shape of the evaporator is matched with the shape of the heat source distribution, so that the evaporator is ensured to cover all heat sources, and two sides of the evaporator are respectively connected with the condenser through a gas pipeline and a liquid pipeline, so that a loop heat pipe system of the flat plate evaporator is formed. In the flat plate type evaporator loop heat pipe system for multiple heat sources, the evaporator adopts the flat plate type evaporator, and the shape of the evaporator is matched with the distribution shape of the heat sources, so that a plurality of heat sources in a coverage range can be simultaneously radiated, a large-area heat source and an irregular-shape heat source can be matched, and more heat can be absorbed under the same heat flow density due to the larger heating area of the evaporator, so that the flat plate type evaporator loop heat pipe system has a better heat transfer effect and protects the heat sources from being damaged.
Description
Technical Field
The invention belongs to the field of electronic device heat dissipation, and particularly relates to a flat plate type evaporator loop heat pipe system for multiple heat sources.
Background
The heat dissipation problem of electronic devices is an important problem in industrial production, and the self temperature rise of electronic components caused by heat generation can cause work failure and even module burning. The loop heat pipe is used as a passive heat transfer device, is widely applied to the fields of military industry, aerospace and electronic heat dissipation, and has a better effect compared with forced convection of a fan by means of phase change heat transfer. The loop heat pipe has large heat dissipation potential, no moving part and no noise during operation; the pipeline arrangement is flexible, and long-distance transmission can be carried out; the anti-gravity operation can be carried out, the heat transfer temperature difference is small, and the like.
The loop heat pipe may be classified into a cylindrical loop heat pipe and a plate-type loop heat pipe. The flat-plate loop heat pipe is flexible in position arrangement, and compared with a cylindrical loop heat pipe with the same size, the flat-plate loop heat pipe can effectively increase the contact area with a heat source, so that the flat-plate loop heat pipe can be applied to different occasions, and the flow direction of gas can be conveniently adjusted to realize the cooperative change of a temperature field and a speed field. As the heat source scene updates, power changes, and distribution adjustments, the structure and form of the loop heat pipe system also change accordingly.
For the problem of heat dissipation of multiple heat sources, a hybrid loop heat pipe system of multiple evaporators is mainly adopted at present, the system can be matched with the heat sources in a targeted manner, but the system also has the problem of low matching margin, and along with the increase of hybrid loop heat pipes, the system becomes complex, so that the problems of weight increase, unstable starting and the like are caused. Hybrid loop heat pipes also have difficulty achieving balance and thermal uniformity between heat sources for heat sources of different power.
Disclosure of Invention
In view of the above defects or improvement requirements of the prior art, the present invention provides a flat plate evaporator loop heat pipe system for multiple heat sources, wherein the system combines the characteristic of irregular distribution of multiple heat sources, correspondingly designs an evaporator matched with the distribution shape of the heat sources, and accordingly can effectively solve the problem of complexity and unbalance of a multiple heat source heat dissipation system, and is particularly suitable for the application occasions of multiple heat source heat dissipation.
In order to achieve the above object, the present invention provides a flat plate evaporator loop heat pipe system for multiple heat sources, the system comprising an evaporator, a gas pipeline, a liquid pipeline and a condenser, wherein: the evaporator is a flat plate evaporator, the shape of the evaporator is matched with the shape of heat source distribution, so that the evaporator is ensured to cover all heat sources, and two sides of the evaporator are respectively connected with the condenser through the gas pipeline and the liquid pipeline, so that the loop heat pipe system of the flat plate evaporator is formed.
As a further preferred option, the evaporator is provided with a boss for attachment to a heat source in a different plane.
As a further preference, the boss is rectangular or circular.
Preferably, the loop heat pipe system of the flat plate evaporator for multiple heat sources further comprises a system filling port, and the system filling port is connected with the liquid pipeline or the compensation cavity of the evaporator and is used for vacuumizing or filling working medium into the loop system of the flat plate evaporator.
As a further preference, the gas line is a smooth round tube.
Further preferably, the gas pipeline and the liquid pipeline are wrapped with heat insulation materials.
As a further preference, the shape of the evaporator is rectangular, circular or a combination of rectangular and circular.
As a further preference, the flat evaporator loop heat pipe system for multiple heat sources is made of copper or aluminum.
Generally, compared with the prior art, the above technical solution conceived by the present invention mainly has the following technical advantages:
1. in the flat plate type evaporator loop heat pipe system for multiple heat sources, the evaporator adopts the flat plate type evaporator, and the shape of the evaporator is matched with the shape of the heat source distribution, so that a plurality of heat sources in a coverage area can be simultaneously radiated, a large-area heat source and an irregular-shape heat source can be matched, and more heat can be absorbed under the same heat flux density due to the larger heating area of the evaporator, so that the flat plate type evaporator loop heat pipe system has a better heat transfer effect, protects the heat sources from being damaged, and has the advantages of convenient processing, less pipelines and low welding cost compared with a loop heat pipe system formed by connecting a plurality of evaporators in series and parallel;
2. particularly, the bosses with different heights are arranged and can be attached to heat sources on different planes, so that the cost increase caused by adding the evaporator due to a single heat source is avoided, and the flat plate type evaporator loop heat pipe system for multiple heat sources has wider application prospect;
3. in addition, the invention can ensure the heat dissipation efficiency of the loop heat pipe system by additionally arranging the system filling opening and optimizing the structures and arrangement modes of the lug boss, the gas pipeline and the liquid pipeline.
Drawings
FIG. 1 is a schematic diagram of a flat-plate evaporator loop heat pipe system for multiple heat sources constructed in accordance with a preferred embodiment of the present invention;
FIG. 2 is a cross-sectional view of a flat plate evaporator loop heat pipe system for multiple heat sources provided by the present invention;
FIG. 3 is a schematic diagram of a flat-plate evaporator loop heat pipe system for multiple heat sources using the present invention provided with non-coplanar heat sources;
FIG. 4 is a schematic diagram of a flat-plate evaporator loop heat pipe system constructed for multiple heat sources in accordance with another preferred embodiment of the present invention;
FIG. 5 is a schematic view of a flat plate evaporator loop heat pipe system for multiple heat sources using the present invention under an irregular heat source;
FIG. 6 is a schematic diagram of a flat plate evaporator loop heat pipe system for multiple heat sources utilizing a regular square heat source according to the present invention;
FIG. 7 is a schematic diagram of a flat plate evaporator loop heat pipe system for multiple heat sources utilizing a regular circular heat source provided by the present invention;
FIG. 8 is a schematic view of a flat plate evaporator loop heat pipe system for multiple heat sources employing the present invention under a regular square heat source;
FIG. 9 is a schematic diagram of a flat plate evaporator loop heat pipe system for multiple heat sources constructed using a rectangular combination evaporator;
FIG. 10 is a schematic perspective view of the flat plate evaporator loop heat pipe system of FIG. 9 for multiple heat sources.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
1-evaporator, 2-gas pipeline, 3-condenser, 4-liquid pipeline, 5-heat source, 6-capillary core, 7-compensation cavity, 8-system filling opening and 9-boss.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1, the present invention provides a flat plate evaporator loop heat pipe system for multiple heat sources, the system includes an evaporator 1, a gas pipeline 2, a liquid pipeline 4 and a condenser 3, wherein: the evaporator 1 is a flat plate evaporator, the shape of the evaporator is matched with the shape of heat source distribution, and the evaporator can be in a rectangular shape, a circular shape or a combined shape of the rectangular shape and the circular shape, so that the evaporator 1 can cover all heat sources 5, and preferably the shape of the evaporator with a smaller coverage area is selected, as shown in fig. 2, the evaporator 1 comprises a capillary core 6 and a compensation cavity 7, the compensation cavity 7 is positioned at one side of a principle heat source binding surface in the evaporator, the capillary core 6 takes a small aperture and a high permeability as necessary screening conditions, meanwhile, two sides of the evaporator 1 are respectively connected with a condenser 3 through a gas pipeline 2 and a liquid pipeline 4, so that a flat plate evaporator loop heat pipe system is formed, and the length of the gas pipeline 2 is smaller than that of the liquid.
Further, as shown in fig. 3, the evaporator 1 is provided with bosses 9 for fitting with heat sources in different planes, the height of the bosses 9 is selected according to actual conditions, the shape of the bosses 9 includes, but is not limited to, the shape that a rectangular or circular lamp can cover the heat sources, and the height of the bosses 9 is adjusted according to the actual conditions of the heat sources.
Further, as shown in fig. 4, the flat-plate evaporator loop heat pipe system for multiple heat sources further includes a system filling port 8, and the system filling port 8 is connected to the liquid pipeline 4 or the compensation cavity of the evaporator 1, and is used for vacuumizing or filling working medium into the flat-plate evaporator loop system.
Furthermore, the condenser is formed by connecting parallel pipelines or series pipelines, radiating fins are arranged on the outer side of the condenser, the arrangement mode comprises transverse arrangement, longitudinal arrangement or other angles, the pipelines and the fins can be arranged according to radiating requirements and wind speed, and the condenser is arranged at a position with high wind speed and low humidity as much as possible.
Further, the pipeline spatial arrangement and pipeline cross-section size, the shape of gas pipeline 2 and liquid pipeline 4 can be selected according to the design requirement, generally, gas pipeline 2 should avoid return bend and variable cross-section design, the suggestion adopts smooth pipe and guarantees that the internal diameter matches with the evaporimeter interface to the outside parcel of gas pipeline 2 and liquid pipeline 4 has insulation material.
Further, the flat plate evaporator loop heat pipe system for multiple heat sources is made of materials with high heat conductivity coefficient or materials with low density and good heat conductivity, including but not limited to copper, aluminum and other alloy materials; the distribution of the heat sources is different, so the shape of the evaporator 1 includes but is not limited to a rectangle, a polygon or other polygon combination shapes, and the direction of a steam channel in the evaporator 1 is consistent with the direction of large temperature gradient of the heat sources, which is beneficial to steam flow, and communication channels are added between the channels to reduce thermal non-uniformity, fig. 5-10 are schematic diagrams of a flat plate evaporator loop heat pipe system for multiple heat sources provided by the invention applied under different heat sources, the arrangement forms of the evaporator 1 and the condenser 3 can be properly adjusted according to actual working requirements, fig. 1 shows that the two are in the same horizontal plane, fig. 5 shows that the condenser 3 is arranged on the upper side of the evaporator 1, the heat source is arranged on the upper side of the evaporator 1, fig. 10 shows that the condenser 3 is arranged on the upper side of the evaporator 1.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (8)
1. A flat evaporator loop heat pipe system for multiple heat sources, comprising an evaporator (1), a gas line (2), a liquid line (4) and a condenser (3), wherein: the evaporator (1) is a flat plate evaporator, the shape of the evaporator is matched with the distribution shape of the heat source (5), so that the evaporator (1) is ensured to cover all the heat source (5), and two sides of the evaporator (1) are respectively connected with the condenser (3) through the gas pipeline (2) and the liquid pipeline (4), so that the flat plate evaporator loop heat pipe system is formed.
2. Flat-plate evaporator loop heat pipe system for multiple heat sources according to claim 1, characterized in that the evaporator (1) is provided with bosses (9) for attachment to heat sources in different planes.
3. Flat-plate evaporator loop heat pipe system for multiple heat sources according to claim 2, characterized in that the bosses (9) are rectangular or circular.
4. The flatbed evaporator loop heat pipe system for multiple heat sources as claimed in claim 1, further comprising a system fill port (8), wherein the system fill port (8) is connected to the liquid line (4) or the compensation chamber of the evaporator (1) for evacuating or filling the flatbed evaporator loop system with working fluid.
5. The flat plate evaporator loop heat pipe system for multiple heat sources according to claim 1, wherein the gas piping (2) is a smooth circular pipe.
6. The flat plate evaporator loop heat pipe system for multiple heat sources according to claim 1, wherein the gas piping (2) and the liquid piping (4) are externally wrapped with a heat insulating material.
7. Flat-plate evaporator loop heat pipe system for multiple heat sources according to claim 1, characterized in that the shape of the evaporator (1) is rectangular, circular or a combination of rectangular and circular.
8. A flat plate evaporator loop heat pipe system for multiple heat sources according to any of claims 1 to 7, wherein the flat plate evaporator loop heat pipe system for multiple heat sources is made of copper or aluminum.
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CN201911308617.9A CN111031755B (en) | 2019-12-18 | 2019-12-18 | Flat-plate evaporator loop heat pipe system for multiple heat sources |
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CN201911308617.9A CN111031755B (en) | 2019-12-18 | 2019-12-18 | Flat-plate evaporator loop heat pipe system for multiple heat sources |
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CN111031755B CN111031755B (en) | 2020-12-29 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111479452A (en) * | 2020-05-11 | 2020-07-31 | 珠海格力电器股份有限公司 | Electric appliance box and air conditioner that radiating efficiency is high |
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CN107949238A (en) * | 2017-11-10 | 2018-04-20 | 中国船舶重工集团公司第七六研究所 | A kind of soaking plate heat dissipating device with support column arrangement and preparation method thereof |
CN209572318U (en) * | 2018-12-11 | 2019-11-01 | 曙光信息产业(北京)有限公司 | Temperature-uniforming plate and server |
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2019
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CN201364062Y (en) * | 2009-01-09 | 2009-12-16 | 中山伟强科技有限公司 | Sintering-type thermotube-type soaking board with convex platform |
CN102374807A (en) * | 2010-08-20 | 2012-03-14 | 富准精密工业(深圳)有限公司 | Loop heat pipe |
CN104661490A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
CN106197103A (en) * | 2016-07-04 | 2016-12-07 | 中国科学院大学 | A kind of loop circuit heat pipe and using method |
CN107782189A (en) * | 2017-09-27 | 2018-03-09 | 北京空间飞行器总体设计部 | Resistance to malleation, high-power flat evaporator and its processing method and the flat board loop circuit heat pipe based on the evaporator |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN111479452A (en) * | 2020-05-11 | 2020-07-31 | 珠海格力电器股份有限公司 | Electric appliance box and air conditioner that radiating efficiency is high |
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