CN111025125A - Infrared assembly circuit board detection device and detection method - Google Patents
Infrared assembly circuit board detection device and detection method Download PDFInfo
- Publication number
- CN111025125A CN111025125A CN201911172505.5A CN201911172505A CN111025125A CN 111025125 A CN111025125 A CN 111025125A CN 201911172505 A CN201911172505 A CN 201911172505A CN 111025125 A CN111025125 A CN 111025125A
- Authority
- CN
- China
- Prior art keywords
- infrared
- lamp
- lamps
- circuit board
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides an infrared assembled circuit board detection device and a detection method, which comprise the following steps: a plurality of infrared transmitting lamps and infrared receiving lamps are arranged and welded on the infrared assembly circuit board in a mixed mode; the control panel controls to light one infrared emission lamp and gates the corresponding infrared receiving lamp; the infrared receiving lamp receives an infrared signal sent by the infrared transmitting lamp reflected by the reflecting medium; and judging whether the infrared transmitting lamp and the infrared receiving lamp are normal or not according to the received infrared signal. The infrared assembly circuit board detection device and the detection method can detect the condition of the internal circuit of the PCBA and the condition of the infrared transmitting/receiving lamp firstly, and provide the PCBA with high quality for subsequent assembly.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to an infrared assembly circuit board detection device and a detection method.
Background
The assembled Printed Circuit Board (PCBA, Printed Circuit Board + Assembly) is a PCB blank Board which is processed by SMT (surface mount technology) or by the whole process of DIP (dual in-line package) Assembly. SMT and DIP are both ways of integrating parts on a PCB board, and the main difference is that SMT does not require drilling holes in the PCB, and in DIP, PIN PINs of parts are inserted into the drilled holes.
In the existing manufacture of the infrared geminate transistor touch frame PCBA, the infrared geminate transistor touch frame PCBA is generally packaged by adopting a packaging technology. But as the degree of integration of infrared geminate transistor touch-sensitive frame PCBA becomes high, it is also more and more difficult to detect its quality.
The existing detection mode depends on manual visual inspection or no inspection, and detection is carried out by functional test during rear-end assembly, so that the detection mode has low efficiency and easy omission, and defective products are mixed into finished products, thereby influencing the quality of the products.
Disclosure of Invention
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: an infrared assembled circuit board detection device comprising: the infrared assembly circuit board, the control board, the display device and the reflecting medium; wherein the content of the first and second substances,
the control panel controls the infrared assembly circuit board, and the control panel is communicated with the display device;
a plurality of infrared emission lamps and infrared receiving lamps are welded on the infrared assembly circuit board, the infrared emission lamps send infrared signals, and the infrared signals are received by the infrared receiving lamps after being reflected by the reflecting medium.
Further, in the infrared assembled circuit board detection device, the infrared emission lamp and the infrared receiving lamp are arranged in a mixed manner.
Correspondingly, the invention also provides an infrared assembly circuit board detection method, which uses the infrared assembly circuit board detection device and comprises the following steps:
a plurality of infrared transmitting lamps and infrared receiving lamps are arranged and welded on the infrared assembly circuit board in a mixed mode;
the control panel controls to light one infrared emission lamp and gates the corresponding infrared receiving lamp;
the infrared receiving lamp receives an infrared signal sent by the infrared transmitting lamp reflected by the reflecting medium;
and judging whether the infrared transmitting lamp and the infrared receiving lamp are normal or not according to the received infrared signal.
Further, in the method for detecting an infrared assembled circuit board, in the step of judging whether the infrared transmitting lamps and the infrared receiving lamps are normal according to the received infrared signals, if one infrared transmitting lamp is turned on and the corresponding infrared receiving lamp selected by the infrared transmitting lamp can receive the infrared signals, the infrared transmitting lamp, the corresponding infrared receiving lamp selected by the infrared transmitting lamp and the corresponding electric street lamp are all determined to be normal.
Further, in the infrared assembled circuit board detection method, in the step of determining whether the infrared transmitting lamps and the infrared receiving lamps are normal according to the received infrared signals, if one infrared transmitting lamp is turned on, none of the infrared receiving lamps corresponding to the selected lamp cannot receive the infrared signals, another infrared transmitting lamp is turned on, and all of the infrared receiving lamps corresponding to the selected lamp can receive the infrared signals, and the turned-on infrared transmitting lamp or the circuit is determined to be abnormal.
Further, in the method for detecting an infrared assembled circuit board, in the step of determining whether the infrared transmitting lamps and the infrared receiving lamps are normal according to the received infrared signals, if one infrared transmitting lamp is turned on, and at least one of the infrared receiving lamps corresponding to the selected infrared transmitting lamp cannot receive the infrared signals, another infrared transmitting lamp is turned on, and the infrared receiving lamp which cannot receive the infrared signals, the infrared receiving lamp or the circuit is determined to be abnormal; the infrared receiving lamp which can not receive the infrared signal can receive the infrared signal, and the infrared transmitting lamp which is lighted first or the circuit is determined to be abnormal.
Compared with the prior art, the invention has the advantages that: the infrared assembly circuit board detection device and the detection method can detect the condition of the internal circuit of the PCBA and the condition of the infrared transmitting/receiving lamp firstly, and provide the PCBA with high quality for subsequent assembly.
Drawings
FIG. 1 is a schematic structural diagram of an infrared assembled circuit board detection device of the present invention;
fig. 2 is a schematic flow chart of the infrared assembled circuit board detection method of the present invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
Referring to fig. 1, as shown in fig. 1, the present invention provides an infrared assembled circuit board detection apparatus, including: the infrared assembled circuit board 1, the control board 2, the display device 3 and the reflecting medium 4; wherein the content of the first and second substances,
the control panel 2 controls the infrared assembly circuit board 1, and the control panel 2 is communicated with the display device 3; a plurality of infrared emission lamps 11 and infrared receiving lamps 12 are welded on the infrared assembly circuit board 1, the infrared emission lamps 11 emit infrared signals, and the infrared signals are received by the infrared receiving lamps 12 after being reflected by the reflecting medium 4. In the present embodiment, the infrared emission lamp 11 and the infrared reception lamp 12 are mixedly arranged.
Referring to fig. 2 further, as shown in fig. 2, the present invention provides an infrared assembled circuit board detection method for the infrared assembled circuit board detection apparatus, including the following steps:
the method comprises the following steps: a plurality of infrared transmitting lamps and infrared receiving lamps are arranged and welded on the infrared assembly circuit board in a mixed mode;
step two: the control panel controls to light one infrared emission lamp and gates the corresponding infrared receiving lamp;
step three: the infrared receiving lamp receives an infrared signal sent by the infrared transmitting lamp reflected by the reflecting medium;
step four: and judging whether the infrared transmitting lamp and the infrared receiving lamp are normal or not according to the received infrared signal.
In this embodiment, one infrared-emitting lamp (lamp a) is first turned on,
one situation may occur: and if the infrared receiving lamp corresponding to the selected switch-on (lamp A) can receive the infrared signal, the infrared transmitting lamp (lamp A), the infrared receiving lamp corresponding to the selected switch-on and the circuit are all determined to be normal.
A second case may occur: and if the infrared receiving lamp (B lamp) corresponding to the selected switch-on can receive the infrared signal, the first lighted infrared emitting lamp (A lamp) or the circuit is determined to be abnormal.
Situation three may occur: when at least one infrared receiving lamp corresponding to the lamp A is selected to be switched on and cannot receive the infrared signal, another infrared transmitting lamp (lamp B) is turned on, and the infrared receiving lamp which cannot receive the infrared signal still cannot receive the infrared signal, the infrared receiving lamp or the circuit is determined to be abnormal; if the infrared receiving lamp which cannot receive the infrared signal can receive the infrared signal, the infrared transmitting lamp (lamp a) which is lighted first or the circuit is determined to be abnormal.
In summary, the infrared assembled circuit board detection device and the detection method of the invention can detect the condition of the internal circuit of the PCBA and the condition of the infrared transmitting/receiving lamp in advance, and provide the PCBA with high quality for subsequent assembly.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. An infrared assembled circuit board detection device, comprising: the infrared assembly circuit board, the control board, the display device and the reflecting medium; wherein the content of the first and second substances,
the control panel controls the infrared assembly circuit board, and the control panel is communicated with the display device;
a plurality of infrared emission lamps and infrared receiving lamps are welded on the infrared assembly circuit board, the infrared emission lamps send infrared signals, and the infrared signals are received by the infrared receiving lamps after being reflected by the reflecting medium.
2. The infrared assembled circuit board inspection device of claim 1, wherein said infrared emitting lamps and infrared receiving lamps are arranged in a mixed arrangement.
3. An infrared assembled circuit board inspection method using the infrared assembled circuit board inspection device according to claim 1, comprising:
a plurality of infrared transmitting lamps and infrared receiving lamps are arranged and welded on the infrared assembly circuit board in a mixed mode;
the control panel controls to light one infrared emission lamp and gates the corresponding infrared receiving lamp;
the infrared receiving lamp receives an infrared signal sent by the infrared transmitting lamp reflected by the reflecting medium;
and judging whether the infrared transmitting lamp and the infrared receiving lamp are normal or not according to the received infrared signal.
4. The infrared assembled circuit board detection method of claim 3, wherein in said step of determining whether the infrared transmitting lamps and the infrared receiving lamps are normal according to the received infrared signals, if one infrared transmitting lamp is turned on and the corresponding infrared receiving lamp selected by the infrared transmitting lamp can receive the infrared signal, the infrared transmitting lamp, the corresponding infrared receiving lamp selected by the infrared receiving lamp and the circuit are determined to be normal.
5. The infrared assembled circuit board detection method of claim 3, wherein in said step of judging whether the infrared transmitting lamps and the infrared receiving lamps are normal according to the received infrared signals, if one infrared transmitting lamp is turned on and none of the corresponding infrared receiving lamps selected by the infrared transmitting lamp can receive the infrared signal, the other infrared transmitting lamp is turned on and all of the corresponding infrared receiving lamps selected by the infrared transmitting lamp can receive the infrared signal, the infrared transmitting lamp or the circuit which is turned on first is determined to be abnormal.
6. The infrared assembled circuit board detection method as claimed in claim 3, wherein in said step of judging whether said infrared transmitting lamps and infrared receiving lamps are normal according to the received infrared signals, if one infrared transmitting lamp is turned on, and at least one of the corresponding infrared receiving lamps selected by it cannot receive an infrared signal, then another infrared transmitting lamp is turned on, and the infrared receiving lamp which has just failed to receive an infrared signal cannot receive an infrared signal, then it is determined that the infrared receiving lamp or circuit is abnormal; the infrared receiving lamp which can not receive the infrared signal can receive the infrared signal, and the infrared transmitting lamp which is lighted first or the circuit is determined to be abnormal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911172505.5A CN111025125A (en) | 2019-11-26 | 2019-11-26 | Infrared assembly circuit board detection device and detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911172505.5A CN111025125A (en) | 2019-11-26 | 2019-11-26 | Infrared assembly circuit board detection device and detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111025125A true CN111025125A (en) | 2020-04-17 |
Family
ID=70202495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911172505.5A Pending CN111025125A (en) | 2019-11-26 | 2019-11-26 | Infrared assembly circuit board detection device and detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111025125A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113324773A (en) * | 2021-04-08 | 2021-08-31 | 嘉鲁达创业投资管理有限公司 | Robot monitoring system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844943A (en) * | 2005-04-06 | 2006-10-11 | 华硕电脑股份有限公司 | Manufacture defect analysis system and detection method thereof |
| CN102331888A (en) * | 2011-06-01 | 2012-01-25 | 广州视睿电子科技有限公司 | Fault detection method and device of infrared emission and reception tube touch system |
| CN103869236A (en) * | 2014-03-31 | 2014-06-18 | 广州华欣电子科技有限公司 | Method and jig for testing infrared touch screen PCBA |
| CN104424059A (en) * | 2013-08-22 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Jumper state detection device, system and method |
| CN205121527U (en) * | 2015-11-13 | 2016-03-30 | 湖州佳格电子科技有限公司 | Infrared touch -screen circuit board and by its infrared touch -screen frame that constitutes |
| CN106226641A (en) * | 2016-08-30 | 2016-12-14 | 温岭甬岭水表有限公司 | A kind of device of quick detection infrared receiver tube open circuit |
| CN109962743A (en) * | 2017-12-22 | 2019-07-02 | 瑞萨电子株式会社 | Semiconductor devices and semiconductor system |
| CN110471573A (en) * | 2019-08-01 | 2019-11-19 | 广州华欣电子科技有限公司 | Adjusting method, device, equipment, medium and the infrared touch frame of infrared signal |
-
2019
- 2019-11-26 CN CN201911172505.5A patent/CN111025125A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844943A (en) * | 2005-04-06 | 2006-10-11 | 华硕电脑股份有限公司 | Manufacture defect analysis system and detection method thereof |
| CN102331888A (en) * | 2011-06-01 | 2012-01-25 | 广州视睿电子科技有限公司 | Fault detection method and device of infrared emission and reception tube touch system |
| CN104424059A (en) * | 2013-08-22 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Jumper state detection device, system and method |
| CN103869236A (en) * | 2014-03-31 | 2014-06-18 | 广州华欣电子科技有限公司 | Method and jig for testing infrared touch screen PCBA |
| CN205121527U (en) * | 2015-11-13 | 2016-03-30 | 湖州佳格电子科技有限公司 | Infrared touch -screen circuit board and by its infrared touch -screen frame that constitutes |
| CN106226641A (en) * | 2016-08-30 | 2016-12-14 | 温岭甬岭水表有限公司 | A kind of device of quick detection infrared receiver tube open circuit |
| CN109962743A (en) * | 2017-12-22 | 2019-07-02 | 瑞萨电子株式会社 | Semiconductor devices and semiconductor system |
| CN110471573A (en) * | 2019-08-01 | 2019-11-19 | 广州华欣电子科技有限公司 | Adjusting method, device, equipment, medium and the infrared touch frame of infrared signal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113324773A (en) * | 2021-04-08 | 2021-08-31 | 嘉鲁达创业投资管理有限公司 | Robot monitoring system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9953552B2 (en) | LED display unit board, LED display screen control card and LED display screen system | |
| US7439947B2 (en) | Liquid crystal display driving circuit and display utilizing the same | |
| US20110133673A1 (en) | Led driving circuit having error detection function | |
| US10074339B2 (en) | Receiver circuit and operating method of the same | |
| AU2001228211A1 (en) | Method and system for detecting defects on a printed circuit board | |
| TW200801491A (en) | System for testing a flat panel display device and method thereof | |
| CN111025125A (en) | Infrared assembly circuit board detection device and detection method | |
| CN101839868A (en) | Illumination source for detecting SMT welding quality and detecting system | |
| TWI556202B (en) | Display driving apparatus and method for driving display apparatus | |
| CN103513144B (en) | Electronic system, connection failure reporting system and related method | |
| CN110865087A (en) | PCBA quality detection method based on artificial intelligence | |
| CN111883049A (en) | Shadow eliminating potential adjusting method, line driving circuit and LED display device | |
| CN101382501A (en) | Automatic optical detection device and method | |
| JP2010230568A (en) | Inspection method of led, and led unit | |
| CN107167939A (en) | Polarizer sheet sticking detection means and polaroid attaching device | |
| CN105445979A (en) | Lighting jig and lighting method | |
| US20070033456A1 (en) | Integrated circuit test system and associated methods | |
| KR970019779A (en) | Magnetic insertion defect inspection device and method of printed circuit board | |
| CN116312338A (en) | Light source driving circuit and communication device for display system | |
| CN102123538A (en) | LED (light-emitting diode) driving device | |
| KR100674026B1 (en) | Method of detecting a board and apparatus for performing the same | |
| KR100696597B1 (en) | Method of detecting a board and apparatus for performing the same | |
| CN106535395A (en) | Photoelectric detection structure for failure LED | |
| CN101655531A (en) | Method and device for detecting frame wiring system | |
| CN106908454B (en) | Substrate detection device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200417 |