CN111019573A - High-polymer adhesive film for bonding plywood and preparation method thereof - Google Patents
High-polymer adhesive film for bonding plywood and preparation method thereof Download PDFInfo
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- CN111019573A CN111019573A CN201911378167.0A CN201911378167A CN111019573A CN 111019573 A CN111019573 A CN 111019573A CN 201911378167 A CN201911378167 A CN 201911378167A CN 111019573 A CN111019573 A CN 111019573A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2451/00—Presence of graft polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high polymer adhesive film for bonding plywood, which comprises the following raw materials of 20-50% of polyethylene graft polymer, 10-30% of polyethylene, 10-30% of ethylene copolymer, 5-30% of thermoplastic elastomer, 5-30% of tackifier and 0.1-1% of antioxidant. The invention also provides a preparation method of the polymer adhesive film, which comprises the steps of blending and modifying the raw materials according to the proportion, and preparing the raw materials into the adhesive film through casting or coextrusion film blowing and other forming processes. The preparation method has simple production process, and the generated polymer adhesive film can be used for bonding wood chips and wood boards, can replace phenolic aldehyde and urea formaldehyde bonding materials adopted in the production of plywood at present, and has the characteristics of high bonding strength, no volatile matters such as formaldehyde, benzene and esters, environmental protection, no pollution, excellent temperature resistance and water resistance, convenient construction and the like.
Description
Technical Field
The invention relates to the field of chemical material synthesis, in particular to a high polymer adhesive film for bonding plywood and a preparation method thereof.
Background
The plywood is a three-layer or multi-layer plate material formed by gluing a veneer formed by rotary cutting a wood section or a veneer cut by planning a batten by using an adhesive, has the advantages of small deformation, large breadth, inconvenient construction, difficult warping, large cross grain tensile strength and the like, has the advantage of improving the utilization rate of wood, and is widely applied to furniture, carriages, shipbuilding, military industry, packaging and other industrial departments.
From the above, the adhesive plays an important role in the preparation process of the plywood, and can greatly influence the bonding strength, the service life and the aging resistance of the plywood, while the existing adhesive for the plywood has general bonding strength to wood veneers and poor aging resistance, so that the service life of the plywood is greatly shortened. And the currently used adhesives are mostly phenol aldehyde and urea formaldehyde binding materials, and the aldehyde materials are volatile and harmful to human bodies. Therefore, an adhesive which has high bonding strength, no volatile matters such as formaldehyde, benzene, esters and the like, environmental protection, no pollution, excellent temperature resistance and water resistance and convenient construction is urgently needed to be prepared.
Disclosure of Invention
The invention provides a high polymer adhesive film for bonding plywood and a preparation method thereof, which aim to solve the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a high polymer adhesive film for bonding plywood, which comprises the following raw material formula:
further, the polyethylene graft polymer is selected from one or more of maleic anhydride grafted polyethylene (LDPE-MAH), maleic anhydride grafted ethylene-vinyl acetate (EVA-MAH) and maleic anhydride grafted ethylene octene copolymer (POE-MAH).
Further, the polyethylene is selected from one or more of LDPE, LLDPE and HDPE.
Further, the ethylene copolymer is one or more of ternary copolymers of EVA, EEA and ethylene, and the content of ethylene in the ethylene copolymer is 20-30%.
Further, the thermoplastic elastomer is selected from one or more of POE, POP, SIS, SEBS, EPDM and SBR.
Further, the tackifier is selected from one or more of terpene resin, phenolic terpene resin, C5 hydrogenated petroleum resin and C5/C9 copolymer resin.
Further, the antioxidant is selected from one or more of 1010 antioxidant, 1076 antioxidant, 168 antioxidant, 264 antioxidant and B215 antioxidant.
The second aspect of the present invention is a method for preparing the polymer adhesive film, comprising the following steps:
selecting raw materials and the proportion thereof;
step two, fully mixing the raw materials in the step one in a high-speed mixer according to a proportion;
and step three, extruding and granulating the mixture obtained in the step two through a double screw at the extrusion temperature of 150-200 ℃, and then preparing the polymer adhesive film through film blowing or tape casting equipment.
Further, the thickness of the polymer adhesive film prepared in the third step is 0.02-0.08 mm.
By adopting the technical scheme, compared with the prior art, the invention has the following technical effects:
the invention provides a preparation method of a high polymer adhesive film for bonding plywood, which is characterized in that a polyethylene graft polymer, polyethylene, an ethylene copolymer, a thermoplastic elastomer, a tackifier and an antioxidant are blended and modified according to a proportion, and a bonding film is prepared by casting or coextrusion film blowing and other forming processes, and the production process is simple. The generated polymer adhesive film can be used for bonding wood chips and wood boards, can replace phenolic aldehyde and urea formaldehyde bonding materials adopted in the existing production of plywood, and has the characteristics of high bonding strength, no volatile matters such as formaldehyde, benzene and esters, environmental protection, no pollution, excellent temperature resistance and water resistance, convenient construction and the like.
Detailed Description
The invention provides a preparation method of a high polymer adhesive film for bonding plywood, which is characterized in that a polyethylene graft polymer, polyethylene, an ethylene copolymer, a thermoplastic elastomer, a tackifier and an antioxidant are blended and modified according to a proportion, and a bonding film is prepared by molding processes such as tape casting or co-extrusion film blowing.
The present invention will be described in detail and specifically with reference to the following examples to facilitate better understanding of the present invention, but the following examples do not limit the scope of the present invention.
Example one
The embodiment provides a preferable polymer adhesive film for bonding plywood, which comprises the following raw materials in percentage by weight:
table 1 raw material formulation of polymer film for plywood bonding
Example two
The embodiment provides a preferable polymer adhesive film for bonding plywood, which comprises the following raw materials in percentage by weight:
TABLE 2 raw material formulation of polymer film for plywood bonding
EXAMPLE III
The embodiment provides a preferable polymer adhesive film for bonding plywood, which comprises the following raw materials in percentage by weight:
TABLE 3 raw material formulation of polymer film for plywood bonding
Example four
The embodiment provides a method for preparing a polymer adhesive film in the first to third embodiments, which includes the following steps:
fully mixing raw materials in a high-speed mixer according to a ratio;
and step two, extruding and granulating the mixture obtained in the step one by a double screw at the extrusion temperature of 150-200 ℃, and preparing the polymer adhesive film with the thickness of 0.02-0.08mm by film blowing or tape casting equipment.
Verification examples
In this verification example, the phenolic glue purchased in the market is used as a control group, and the performance of the boards prepared from the polymer glue films provided in the first to third examples and the phenolic glue of the control group is tested, and the test results are as follows:
table 4 test results of the performance of the polymer adhesive film prepared plate provided in the first to third embodiments
As can be seen from table 4, the bonding strength and the peeling length of the sheets prepared by the polymer adhesive films provided in the first to third examples are greater than those of the control group, and the boiling water resistance and the temperature difference resistance are better than those of the control group.
In conclusion, the high polymer adhesive film for bonding the plywood provided by the invention has the characteristics of high bonding strength, no volatile matters such as formaldehyde, benzene and esters, environmental friendliness, no pollution, excellent temperature resistance and water resistance, convenience in construction and the like.
The embodiments of the present invention have been described in detail, but the embodiments are merely examples, and the present invention is not limited to the embodiments described above. Any equivalent modifications and substitutions to those skilled in the art are also within the scope of the present invention. Accordingly, equivalent changes and modifications made without departing from the spirit and scope of the present invention should be covered by the present invention.
Claims (9)
1. A high polymer adhesive film for bonding plywood is characterized by comprising the following components in percentage by weight:
2. the adhesive polymer film for plywood bonding according to claim 1, wherein the polyethylene graft polymer is one or more of maleic anhydride grafted polyethylene, maleic anhydride grafted ethylene-vinyl acetate, and maleic anhydride grafted ethylene octene copolymer.
3. The adhesive polymer film for plywood bonding according to claim 1, wherein said polyethylene is one or more of LDPE, LLDPE and HDPE.
4. The adhesive polymer film for plywood bonding according to claim 1, wherein said ethylene copolymer is one or more of EVA, EEA, and ethylene terpolymer.
5. The adhesive polymer film for plywood bonding of claim 1, wherein the thermoplastic elastomer is one or more of POE, POP, SIS, SEBS, EPDM and SBR.
6. The adhesive polymer film for plywood bonding according to claim 1, wherein said tackifier is one or more selected from terpene resin, phenolic terpene resin, C5 hydrogenated petroleum resin, and C5/C9 copolymer resin.
7. The polymer adhesive film for plywood bonding according to claim 1, wherein the antioxidant is one or more of 1010 antioxidant, 1076 antioxidant, 168 antioxidant, 264 antioxidant and B215 antioxidant.
8. A method for preparing the polymer adhesive film for plywood bonding according to any one of claims 1 to 7, comprising the steps of:
weighing the polyethylene graft polymer, polyethylene, ethylene copolymer, thermoplastic elastomer, tackifier and antioxidant according to a ratio, and uniformly mixing in a high-speed mixer;
and step two, extruding and granulating the mixture obtained in the step two through a double screw at the extrusion temperature of 150-200 ℃, and then preparing the polymer adhesive film through film blowing or tape casting equipment.
9. The method for preparing a polymer adhesive film for plywood bonding according to claim 8, wherein the thickness of the polymer adhesive film prepared in the second step is 0.02-0.08 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911378167.0A CN111019573A (en) | 2019-12-27 | 2019-12-27 | High-polymer adhesive film for bonding plywood and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911378167.0A CN111019573A (en) | 2019-12-27 | 2019-12-27 | High-polymer adhesive film for bonding plywood and preparation method thereof |
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| CN111019573A true CN111019573A (en) | 2020-04-17 |
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| CN201911378167.0A Pending CN111019573A (en) | 2019-12-27 | 2019-12-27 | High-polymer adhesive film for bonding plywood and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114410246A (en) * | 2022-01-18 | 2022-04-29 | 江苏斯尔邦石化有限公司 | A kind of hot melt adhesive combination and its preparation method and application |
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| CN1401722A (en) * | 2002-08-29 | 2003-03-12 | 广州市鹿山化工材料有限公司 | Adhering resin for aluminium-plastic board |
| US20050106385A1 (en) * | 2003-11-17 | 2005-05-19 | Laura Lee Martin | Hot melt adhesives with improved performance window |
| CN101429413A (en) * | 2008-11-18 | 2009-05-13 | 广州市鹿山化工材料有限公司 | Double-layer composite hot melt adhesive film for bonding metal and plastic |
| CN109837040A (en) * | 2019-03-01 | 2019-06-04 | 广东聚益新材有限公司 | Adhesive and its preparation method and application, glued board |
-
2019
- 2019-12-27 CN CN201911378167.0A patent/CN111019573A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1401722A (en) * | 2002-08-29 | 2003-03-12 | 广州市鹿山化工材料有限公司 | Adhering resin for aluminium-plastic board |
| US20050106385A1 (en) * | 2003-11-17 | 2005-05-19 | Laura Lee Martin | Hot melt adhesives with improved performance window |
| CN101429413A (en) * | 2008-11-18 | 2009-05-13 | 广州市鹿山化工材料有限公司 | Double-layer composite hot melt adhesive film for bonding metal and plastic |
| CN109837040A (en) * | 2019-03-01 | 2019-06-04 | 广东聚益新材有限公司 | Adhesive and its preparation method and application, glued board |
Non-Patent Citations (1)
| Title |
|---|
| 丁绍兰主编: "《革制品材料学》", 31 January 2019, 中国轻工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114410246A (en) * | 2022-01-18 | 2022-04-29 | 江苏斯尔邦石化有限公司 | A kind of hot melt adhesive combination and its preparation method and application |
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