CN111007422A - Method for manufacturing highly integrated electronic frequency divider - Google Patents
Method for manufacturing highly integrated electronic frequency divider Download PDFInfo
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- CN111007422A CN111007422A CN201911311896.4A CN201911311896A CN111007422A CN 111007422 A CN111007422 A CN 111007422A CN 201911311896 A CN201911311896 A CN 201911311896A CN 111007422 A CN111007422 A CN 111007422A
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Abstract
The invention relates to a method for manufacturing a high-integration electronic frequency divider, which comprises a high-integration electronic frequency divider device, a pulse distributor, a trigger chip, a power supply (8) to be aged, a shell internal electrode (3) arranged in a packaging shell (1), a shell lead (2) and a gold wire (5), wherein the high-integration electronic frequency divider device comprises the packaging shell (1), a ceramic substrate (6) arranged on the packaging shell (1) through a bonding substrate adhesive film (4), a conductive adhesive (9) arranged on the ceramic substrate (6), the pulse distributor and trigger chip (7) which are distributed on the ceramic substrate (6) through the conductive adhesive (9) and are electrically connected with the ceramic substrate (6), the shell internal electrode (3) arranged in the packaging shell (1), the shell lead (2) which is arranged; the gold wire (5) is used for electrically connecting the pulse distributor and the trigger chip (7), the power supply (8) to be aged and the shell internal electrode (3), and the invention has reasonable design, compact structure and convenient use.
Description
Technical Field
The invention relates to a method for manufacturing a highly integrated electronic frequency divider.
Background
In recent years, the microelectronic technology is rapidly developed, the digital electronic technology has more and more importance in electronic equipment and daily industrial production, and the related range is wider and wider. Especially, the method plays a great role in the application and development of computer technology, and has profound influence on the production and daily life of people. Digital electronic technology has become an important link for measuring the state of industry development.
In digital electronics, digital frequency dividing circuits have important applications, and for a specific input frequency, the required output can be obtained after frequency division, which requires that the circuit has an integer multiple frequency dividing function. The pulse distributor and the trigger combination are used for better performing multiple frequency division such as frequency division by two, frequency division by four and the like on the input signal.
The electronics must be subjected to a 100% burn-in and back-biased burn-in screening test, which conventionally uses a 400Hz if power supply up to 380V. Along with the change of the market demand of military devices in recent years, the performance requirement of electronic parts is gradually improved, and the index of the withstand voltage of the device is improved from hundreds of volts to more than 1000V, even more than 2000V. Then, corresponding aging equipment must be matched according to the voltage withstanding requirement of the device, but the existing conventional intermediate frequency power supply cannot meet the current use requirement at all.
The design scheme is mainly used for the aging test of the direct-current power supply, the aging test of the existing small-batch electric devices is mainly realized through resistors, the manufacturing cost is high, the universality is poor, the size is large, and the current is not stable enough during aging. The scheme depends on the stm32 single-chip microcomputer to drive 1602 display screen, reference voltage value supply and keyboard scanning, and meanwhile, an interface can be provided for the upper computer to control the electronic load by the upper computer, semi-closed-loop control is realized by the operational amplifier, and a high-power MOS tube is used as a power device. The design universality is strong, the control ring is simple and reliable, the anti-interference capability is strong, and the capability of communicating with an upper computer is realized. In the prior art, most of the devices are built into simple closed-loop control, chips such as TL431 and the like are adopted to provide reference voltage signals, and a high-power MOS is used as a power device.
Nowadays, more and more enterprises apply the technology of internet of things to enterprise management and production process control. With the progress and development of society, part of the traditional management mode and the informatization thinking need to be upgraded together. The intelligent level of the aging center is improved, and process monitoring is carried out more efficiently.
At present, monitoring of the temperature of an oven and the power supply voltage in the aging process of products in a part of unit aging centers requires on-duty personnel to visit and observe, and real-time remote monitoring cannot be achieved. The real-time temperature of the oven cannot be recorded and filed, and the possible conditions of overtemperature, power failure and power supply voltage abnormity cannot be monitored, recorded and inquired. Therefore, a remote monitoring system is developed, so that an operator on duty can monitor the temperature of the oven and the power supply voltage in real time in a monitoring room.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for manufacturing a high-integration electronic frequency divider. The invention can highly integrate the pulse distributor, the trigger and the matched electronic device by using the thick film circuit technology in the hybrid integrated circuit, so that the pulse distributor, the trigger and the matched electronic device are integrated into a device with the packaging size of only one pulse distributor, thereby realizing the function of fixed multi-frequency division, and solving the technical problems that the integration level of the pulse distributor and the trigger is not high, the occupied area is large, the workload is more and the efficiency is lower due to the matched electronic device.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
a high-integration electronic frequency divider manufacturing method comprises a packaging shell, a ceramic substrate arranged on the packaging shell through a bonding substrate adhesive film, conductive adhesive arranged on the ceramic substrate, a pulse distributor, a trigger chip and a power supply to be aged, which are distributed on the ceramic substrate through the conductive adhesive and are electrically connected, a shell internal electrode arranged in the packaging shell, a shell lead arranged on the packaging shell and electrically connected with the shell internal electrode, and a gold wire; the gold wire is used for electrically connecting the pulse distributor, the trigger chip, the power supply to be aged and the internal electrode of the shell;
a method of making a highly integrated electronic frequency divider device; comprises the following steps;
step one, production and material preparation: preparing a packaging shell, a shell lead, a shell internal electrode, a substrate adhesive film, a gold wire, a ceramic substrate, a pulse distributor, a trigger chip, a power supply to be aged and conductive adhesive as preparation work before production;
step two, cleaning: cleaning the ceramic substrate;
step three, substrate printing: printing a functional layer on the ceramic substrate; the functional layer comprises a conduction band, a resistance layer and an insulating layer;
step four, laminating: firstly, mounting a shell lead and a shell internal electrode on a packaging shell; then, fixing the printed ceramic substrate in a packaging shell by using a substrate adhesive film;
step five, sticking the sheet: bonding the pulse distributor, the trigger chip and the power supply to be aged on the ceramic substrate by using conductive adhesive;
step six, gold wire pressure welding: electrically connecting the pulse distributor, the trigger chip and the power supply to be aged with the conduction band on the ceramic substrate;
step seven, an aging process: carrying out aging treatment on the packaging shell and the upper part thereof;
step eight, sealing a cap: packaging the packaging shell;
step nine, marking: printing a mark outside the packaging shell;
step ten, inspecting finished products.
As a further improvement of the above technical solution:
in the step seven, in the aging process, by means of the aging equipment, a power supply of the aging equipment comprises an intermediate frequency power supply, a step-up transformer, a current-limiting resistor, a voltmeter and an ammeter; the output end of the intermediate frequency power supply is connected with a step-up transformer to step up the input intermediate frequency power supply of the intermediate frequency power supply, and a secondary coil of the step-up transformer is output through a current-limiting resistor and then displays an output value through a voltmeter and an ammeter.
In the step seven, in the aging process, an aging device is used, and the aging device comprises an electronic load for aging the power supply to be aged; the electronic load comprises a single chip microcomputer, a timer, a second-order filter, a comparator, a sampling amplifier and a sampling resistor;
the single chip microcomputer adopts an STM32f103 series single chip microcomputer, the timer is controlled to work in a PWM output mode, and PWM waves output by the single chip microcomputer are filtered by a second-order filter to obtain a voltage value which changes according to the duty ratio;
the voltage value acquired from the sampling resistor is amplified and then fed back to the inverting input section of the operational amplifier as a feedback value according to the voltage value with the changed duty ratio as the reference value of the operational amplifier, so that closed-loop control is formed;
and the voltage value acquired from the sampling resistor is input into the singlechip for displaying the current value.
In the seventh step, with the help of the aging equipment, the aging equipment comprises a wireless monitoring system device which comprises a singlechip, a communication module, a computer, an AD module, a conversion circuit module, a voltage acquisition module, a temperature conversion module, a temperature acquisition module, a transformer, a display circuit and a key circuit;
the single chip microcomputer, the AD module, the conversion circuit module and the voltage acquisition module are sequentially in communication connection; the single chip microcomputer collects voltage signals through a conversion circuit module and an AD module in cooperation with the voltage collection module;
the single chip microcomputer, the temperature conversion module and the temperature acquisition module are sequentially in communication connection; the temperature conversion module is matched with the temperature acquisition module to acquire temperature;
the single chip microcomputer is in communication connection with a computer provided with monitoring software through a communication module; the single chip microcomputer, the transformer, the display circuit and the key circuit are sequentially in communication connection;
the single chip microcomputer carries out wireless local area network construction through a ZigBee wireless communication module taking CC2530 as a core so as to be convenient for the single chip microcomputer to transmit the acquired information to a computer;
the single chip microcomputer is provided with a display circuit and keys of a display screen through a transformer;
the programming language of the monitoring software is C language, and the KeiluVision4 is used as the programming software;
the computer receiving end software uses C + + programming language, the programming platform is QT, the database uses MySQL database management system;
the wireless temperature control system software comprises a user login interface, a software login interface, a main interface and a user main interface;
the main interface is divided into a monitoring center, a real-time query module, a product record query module and a history query module; a summary of the oven real-time in the main interface, including real-time temperature and real-time voltage; the monitoring center comprises over-temperature and over-pressure alarm.
And has voice warning prompt tone; clicking a single oven area will enter a detailed real-time query interface;
the real-time query interface is used for displaying the temperature of the oven, including set temperature, actual temperature, two paths of set voltage and actual voltage, and product screening items in the oven;
the product recording interface is used for adding product information including screening items, placing in an oven, starting time, ending time, temperature setting and voltage setting on a product recording page;
a product record inquiry interface, wherein in the inquiry interface, firstly, a user inputs an oven number or a product name; then selecting a time interval, searching the aging condition record, and clicking a lead-out button to lead out an excel form;
and the historical record interface is used for inquiring product screening records on a historical inquiry page, and the product screening records comprise historical temperature values, voltage values, set values and information of screening items.
The invention has the advantages of reasonable design, low cost, firmness, durability, safety, reliability, simple operation, time and labor saving, capital saving, compact structure and convenient use. The device has unique conception, is convenient and practical, and highly integrates the pulse distributor chip, the trigger chip and discrete devices matched with the pulse distributor chip and the trigger chip through a thick film integrated circuit technology. The device has high integration level, and can realize multiple frequency division modes (such as two-frequency division, four-frequency division, six-frequency division and the like) by changing discrete devices used in cooperation. The device has the same volume as a separately packaged pulse distributor, and the obtained effect is the same as that of a frequency dividing device consisting of the packaged pulse distributor, the trigger and the discrete devices matched with the packaged pulse distributor and the trigger, compared with the device, the volume of the device is probably only a fraction of that of the frequency dividing device consisting of the packaged pulse distributor, the trigger and the discrete devices matched with the trigger.
The invention can satisfy the power supply for outputting medium frequency and high voltage, and can satisfy the medium frequency power supply with 400Hz and up to 3000V. The invention solves the problem of power supply required by aging and reverse-bias aging screening tests of the high-voltage semiconductor discrete device.
The frequency dividing device has the advantages of simple structure, convenience in use, practical function, high automation, high integration level and cost saving, and can effectively improve the production efficiency.
The invention solves the problem of power supply needed by aging and reverse aging screening test of high-voltage discrete semiconductor devices by re-assembling and transforming the existing 400Hz intermediate frequency power supply. The power supply has unique concept and convenient use, improves the output voltage value by reforming the 400Hz intermediate frequency power supply, realizes the aging screening test power supply of the semiconductor discrete device with the highest voltage reaching 3000V, and meets the use requirement.
The invention has strong universality, strong later expandability, high reliability and the capability of communicating with an upper computer. The problem of prior art adopt discrete device to build more, the function is relatively fixed single, is difficult to realize the simultaneous control of multiplexed output power, later stage extended function is troublesome is solved.
The invention manufactures a wireless monitoring system, so that an operator on duty can monitor the temperature of the oven, the voltage of a power supply and the current in real time in a monitoring room. The monitoring record is archived and available for inspection. If necessary, the method can be further expanded, so that a product technician can monitor the aging state, the starting date and the arrival date of the product on line through a mobile phone. The design of the invention is beneficial to the improvement of the monitoring mode of the aging center of the company, and the remote monitoring, the macro management and the record searching are realized. The safety and reliability of the product screening process are improved from the management mode.
Drawings
Fig. 1 is a cross-sectional view of the interior of the electronic frequency divider pair device structure of the present invention.
FIG. 2 is a process flow diagram of the present invention.
Fig. 3 is a schematic diagram of the power supply of the present invention.
Fig. 4 is a schematic structural diagram of the power supply to be aged according to the present invention.
Fig. 5 is a schematic diagram of the monitoring structure of the present invention.
Wherein: 1. a package housing; 2, a housing lead; 3. an outer shell inner electrode; 4. bonding a substrate adhesive film; 5. gold wire; 6. a ceramic substrate; 7. a pulse distributor and a trigger chip; 8. a power supply to be aged; 9. and (3) conductive adhesive.
Detailed Description
As shown in fig. 1-5, the highly integrated electronic frequency divider device includes a package housing (1), a ceramic substrate (6) disposed on the package housing (1) by bonding a substrate adhesive film (4), a conductive adhesive (9) disposed on the ceramic substrate (6), a pulse distributor and trigger chip (7) disposed on the ceramic substrate (6) by the conductive adhesive (9) and electrically connected to the ceramic substrate (6), a power supply (8) to be aged, a housing internal electrode (3) disposed in the package housing (1), a housing lead (2) disposed on the package housing (1) and electrically connected to the housing internal electrode (3), and a gold wire (5);
the gold wire (5) is used for electrically connecting the pulse distributor and the trigger chip (7), the power supply (8) to be aged and the shell internal electrode (3);
a method of making a highly integrated electronic frequency divider device; comprises the following steps;
step one, production and material preparation: preparing a packaging shell (1), a shell lead (2), a shell internal electrode (3), a substrate adhesive film (4), a gold wire (5), a ceramic substrate (6), a pulse distributor and trigger chip (7), a power supply (8) to be aged and conductive adhesive (9) as preparation work before production;
step two, cleaning: cleaning the ceramic substrate (6);
step three, substrate printing: printing a functional layer on the ceramic substrate (6); the functional layer comprises a conduction band, a resistance layer and an insulating layer;
step four, laminating: firstly, a shell lead (2) and a shell internal electrode (3) are arranged on a packaging shell (1); then, fixing the printed ceramic substrate (6) in the packaging shell (1) by using a substrate adhesive film (4);
step five, sticking the sheet: a pulse distributor, a trigger chip (7) and a power supply (8) to be aged are bonded on a ceramic substrate (6) by using conductive adhesive (9);
step six, pressure welding of the gold wire (5): electrically connecting the pulse distributor, the trigger chip (7) and the power supply (8) to be aged with the conduction band on the ceramic substrate (6);
step seven, an aging process: carrying out aging treatment on the packaging shell (1) and the upper parts thereof;
step eight, sealing a cap: packaging the packaging shell (1);
step nine, marking: printing a mark outside the packaging shell (1);
step ten, inspecting finished products.
In the step seven, in the aging process, by means of the aging equipment, a power supply of the aging equipment comprises an intermediate frequency power supply, a step-up transformer, a current-limiting resistor, a voltmeter and an ammeter; the output end of the medium-frequency power supply is connected with a step-up transformer to step up the input medium-frequency power supply of the medium-frequency power supply, and a secondary coil of the step-up transformer outputs a value through a current-limiting resistor and displays the output value through a voltmeter and an ammeter;
in the step seven, in the aging process, an aging device is used, and the aging device comprises an electronic load for aging the power supply (8) to be aged; the electronic load comprises a single chip microcomputer, a timer, a second-order filter, a comparator, a sampling amplifier and a sampling resistor;
the single chip microcomputer adopts an STM32f103 series single chip microcomputer, the timer is controlled to work in a PWM output mode, and PWM waves output by the single chip microcomputer are filtered by a second-order filter to obtain a voltage value which changes according to the duty ratio;
the voltage value acquired from the sampling resistor is amplified and then fed back to the inverting input section of the operational amplifier as a feedback value according to the voltage value with the changed duty ratio as the reference value of the operational amplifier, so that closed-loop control is formed;
the voltage value collected from the sampling resistor is input into the singlechip for displaying the current value;
in the seventh step, with the help of the aging equipment, the aging equipment comprises a wireless monitoring system device which comprises a singlechip, a communication module, a computer, an AD module, a conversion circuit module, a voltage acquisition module, a temperature conversion module, a temperature acquisition module, a transformer, a display circuit and a key circuit;
the single chip microcomputer, the AD module, the conversion circuit module and the voltage acquisition module are sequentially in communication connection; the single chip microcomputer collects voltage signals through a conversion circuit module and an AD module in cooperation with the voltage collection module;
the single chip microcomputer, the temperature conversion module and the temperature acquisition module are sequentially in communication connection; the temperature conversion module is matched with the temperature acquisition module to acquire temperature;
the single chip microcomputer is in communication connection with a computer provided with monitoring software through a communication module; the single chip microcomputer, the transformer, the display circuit and the key circuit are sequentially in communication connection;
the single chip microcomputer carries out wireless local area network construction through a ZigBee wireless communication module taking CC2530 as a core so as to be convenient for the single chip microcomputer to transmit the acquired information to a computer;
the single chip microcomputer is provided with a display circuit and keys of a display screen through a transformer;
the programming language of the monitoring software is C language, and the KeiluVision4 is used as the programming software;
the computer receiving end software uses C + + programming language, the programming platform is QT, the database uses MySQL database management system;
the wireless temperature control system software comprises a user login interface, a software login interface, a main interface and a user main interface;
the main interface is divided into a monitoring center, a real-time query module, a product record query module and a history query module; a summary of the oven real-time in the main interface, including real-time temperature and real-time voltage; the monitoring center comprises over-temperature and over-pressure alarm. After alarming, the corresponding oven progress bar can display red color and has voice warning prompt tone; clicking a single oven area will enter a detailed real-time query interface;
the real-time query interface is used for displaying the temperature of the oven, including set temperature, actual temperature, two paths of set voltage and actual voltage, and product screening items in the oven;
the product recording interface is used for adding product information including screening items, placing in an oven, starting time, ending time, temperature setting and voltage setting on a product recording page;
a product record inquiry interface, wherein in the inquiry interface, firstly, a user inputs an oven number or a product name; then selecting a time interval, searching the aging condition record, and clicking a lead-out button to lead out an excel form;
and the historical record interface is used for inquiring product screening records on a historical inquiry page, and the product screening records comprise historical temperature values, voltage values, set values and information of screening items.
Referring to fig. 3, the invention selects the corresponding if power according to the range of the aging voltage value required by the device; boosting the existing 400Hz medium-frequency power supply to a required high-voltage value by using a medium-frequency power supply; and a current meter and a voltage meter are additionally arranged for displaying output values.
As shown in fig. 4, the present invention uses an STM32f103 or STC89C52RC serial single chip microcomputer to make the timer work in a PWM output mode, a voltage value varying according to a duty ratio can be obtained after a PWM wave output by the single chip microcomputer is filtered by a second order filter as a reference value of an operational amplifier, the voltage value collected from a sampling resistor is amplified and then fed back as a feedback value to an inverting input section of the operational amplifier, thereby forming a closed-loop control, and the voltage value collected from the sampling resistor is input into the single chip microcomputer to display a current value. Because STM32F103 series have abundant timer resources, a single chip microcomputer can control up to 10 paths of electronic loads, and a multi-output programmable electronic load system can be formed by copying the same circuit structure into 10 paths.
After being filtered by a timer PWM output mode of the singlechip, the filtered signal is output to an operational amplifier as a reference value, constant-current electronic load is realized after the closed loop of the amplifier, and meanwhile, multiple paths can be expanded to realize the electronic load system with multiple output paths. The invention has simple and reliable structure, can realize the multi-path output controlled by one single chip microcomputer, has small volume, and has rich STM32 interfaces for the upper computer to realize the control of the upper computer on the electronic load system.
In the aspect of monitoring hardware, as shown in fig. 5, an STC89C52 single chip microcomputer is selected as a control core, a conversion circuit module LM358 is used to perform voltage acquisition in cooperation with an AD module XPT2046, and a temperature conversion module MAX6675 is used to perform temperature acquisition in cooperation with a temperature acquisition module K-type thermocouple. And finally, constructing a wireless local area network by using a ZigBee wireless communication module taking the CC2530 as a core so as to transmit the acquired information to a PC (personal computer) terminal. The terminal is provided with an LCD1602 display screen and keys, so that temperature and display temperature and voltage are conveniently set. The STC89C52 single chip microcomputer is a low-power-consumption and high-performance CMOS 8-bit microcontroller produced by STC company and is provided with an 8K byte system programmable Flash memory. The programming language of the project is C language, and the programming software uses KeiluVision 4. And (3) AD acquisition: the XPT2046 chip is a 4-wire touch screen controller and internally comprises a 12-bit resolution 125KHz conversion rate gradual approximation type A/D converter. XPT2046 supports low voltage I/O interfaces from 1.5V to 5.25V. XPT2046 is often used for resistive display screen drives, and can detect the location of the screen being pressed by performing two A/D conversions, and in addition, can measure the pressure applied to the touch screen. XPT2046 can only gather the voltage signal below 5V, therefore, has added LM358 proportion operation amplifier circuit at its front end, carries out the lifting transform through going on-40V voltage to 40V voltage, and the voltage signal that AD can gather is finally programmed. And then carrying out correction identification through a software algorithm. Temperature transformation: the MAX6675 chip is an automobile electronic component and can convert K-type thermocouple signals into digital signals. MAX6675 cold junction temperature compensation, thermocouple digital converter can carry on the temperature compensation of cold junction, and change the thermocouple signal of K type into the digital signal. The data output is 12-bit resolution and SPI compatible. The resolution of the converter temperature is 0.25 ℃, and the temperature can be read to +1024 ℃. The ZigBee communication module is a two-way wireless communication technology with short distance, low complexity, low power consumption, low speed and low cost. The method is mainly used for data transmission among various electronic devices with short distance, low power consumption and low transmission rate and is typically applied to periodic data transmission, intermittent data transmission and low-reaction-time data transmission. It has the following characteristics: (1) the ZigBee device has low power consumption because the ZigBee has low transmission rate, the transmission power is only 1mW, and the ZigBee device adopts a sleep mode and has low power consumption. According to estimation, the ZigBee device can maintain the service time of about 6 months to 2 years only by two No. 5 batteries, which is the best for other wireless devices. (2) The cost is low: the initial cost of the ZigBee module is around $ 6, which is estimated to quickly fall to $ 1.5-2.5, and the ZigBee protocol is exempt from royalties. Low cost is also a key factor for ZigBee. (3) The time delay is short, the communication time delay and the time delay of activation from the dormant state are both very short, the time delay of a typical searching device is 30ms, the time delay of activation from the dormant state is 15ms, and the time delay of channel access of an active device is 15 ms. Therefore, the ZigBee technology is suitable for wireless control (such as industrial control occasions and the like) with harsh time delay requirements. (4) The network capacity is large: the Zigbee network with the star structure can accommodate 254 slave devices and a master device at most, and 100 Zigbee networks can exist in one area at most simultaneously, and the network composition is flexible. (5) The method is reliable, adopts a collision avoidance strategy, reserves a special time slot for the communication service needing fixed bandwidth, and avoids the competition and the collision of the transmitted data. The MAC layer employs a fully acknowledged data transfer mode, and each transmitted packet must wait for an acknowledgement from the receiver. Retransmissions can be performed if problems arise during transmission. (6) Safety: ZigBee provides a data packet integrity check function based on Cyclic Redundancy Check (CRC), supports authentication and authentication, adopts an AES-128 encryption algorithm, and can flexibly determine the security attribute of each application. The PCB board is designed by adopting a double-layer wiring and double-sided surface mounting process to achieve attractive appearance and small size to the maximum extent. The overall dimensions are only 50mm x 35 mm. The intelligent temperature control system comprises a singlechip minimum system circuit, an AD conversion circuit, a temperature conversion circuit, a display circuit, a ZigBee communication circuit, an MAX232 serial port programming circuit and the like. A built-in patch buzzer is used for over-temperature alarm. The hardware terminal uses a finished black aluminum profile as a main body, and the price is low. And opening holes as required after returning. The overall dimensions were 100mm by 80mm by 28 mm. Meets the index set at the time of 15cm multiplied by 15 cm. The software design of the computer receiving end uses C + + programming language and programming platform as QT. The database uses a MySQL database management system. Qt was a cross-platform C + + gui application development framework developed by Qt Company in 1991. It can be used to develop both GUI (graphical user interface) programs and non-GUI programs such as console tools and servers. Qt is an object-oriented framework that is easily extended using special code generation extensions called Meta object compiler (moc) and some macros, and allows true component programming. In 2008, the Qt company technology was purchased by Nokia corporation, and Qt was therefore a programming language tool under Nokia flags. In 2012, Qt was purchased by Digia. In 4 months of 2014, a cross-platform integrated development environment Qt Creator 3.1.0 is formally released, complete support for iOS is realized, plug-ins such as WinRT and Beautifier are newly added, GDB debugging support without a Python interface is abandoned, a C/C + + code module based on Clang is integrated, Android support is adjusted, and accordingly, iOS, Android and WP are comprehensively supported, and all functions required by an application program developer for establishing an artistic-level graphical user interface are provided. MySQL is a relational database management system developed by MySQL AB, Sweden, and currently belongs to the product under Oracle flag. MySQL is one of the most popular Relational Database Management systems, and is the best RDBMS (Relational Database Management System) application software in terms of WEB applications. The wireless temperature control system software comprises a user login interface, a software login interface, a main interface and a user main interface.
The main interface is divided into four pages of 'monitoring center', 'real-time query', 'product record' and 'historical query'. The real-time outline of the oven can be listed in the main interface, and the real-time outline comprises real-time temperature, real-time voltage (two paths) and the like. The system comprises over-temperature and over-pressure alarm. After the alarm, the corresponding oven progress bar can display red color and has voice warning prompt tone. Clicking on a single oven zone will enter a detailed real-time query interface.
The real-time query interface can display the temperature of the oven in detail, including the set temperature, the actual temperature, the two paths of set voltage and actual voltage, and the product screening items recently carried out in the oven. The user only needs to input the oven number and then click to inquire.
Product record: the product records the interface, in "product records" page, the user can add product information, including screening items, which oven to place in, start time, end time, temperature setting and voltage setting. These items will be saved as records for later examination. The voltage setting parameter will be used as an alarm reference value. After the addition is finished, the query interface can be accessed by clicking the query button at the upper left corner.
And (3) a product record query interface, wherein in the query interface, a user only needs to input keywords such as an oven number, a product name and the like, and then selects a time interval to find the aging condition record. The excel form can be exported after clicking an export button.
And in a history record interface, on a history query page, a user can query detailed product screening records including information such as historical temperature values, voltage values, set values and screening items. Historical temperature and voltage can be plotted and exported as PDF files.
The invention utilizes the thick film circuit technology in the hybrid integrated circuit to highly integrate the device. Firstly, printing a conduction band, a resistor and an insulating protection layer on a ceramic substrate, fixing the substrate on a packaging shell by using an adhesive film, then integrating a pulse distributor chip, a trigger chip and required electronic devices on the ceramic substrate by using conductive adhesive, and finally electrically connecting each device with the shell by using a gold wire pressure welding technology.
The invention integrates the pulse distributor chip, the trigger chip and the discrete devices matched with the pulse distributor chip on the ceramic substrate by a thick film circuit technology, then integrates the substrate into a shell with the size of only one pulse distributor package, and has the same function as a frequency division device formed by the packaged pulse distributor, the trigger and the discrete devices matched with the trigger chip, but the volume of the device is far smaller than that of the frequency division device formed by the packaged pulse distributor, the trigger and the discrete devices.
The present invention has been fully described for a clear disclosure and is not to be considered as an exemplification of the prior art.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; it is obvious as a person skilled in the art to combine several aspects of the invention. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (4)
1. A method for manufacturing a highly integrated electronic frequency divider is characterized by comprising the following steps: the high-integration electronic frequency divider device comprises a packaging shell (1), a ceramic substrate (6) arranged on the packaging shell (1) through a bonding substrate adhesive film (4), conductive adhesive (9) arranged on the ceramic substrate (6), a pulse distributor and trigger chip (7) which is distributed on the ceramic substrate (6) through the conductive adhesive (9) and is electrically connected with a power supply to be aged (8), a shell internal electrode (3) arranged in the packaging shell (1), a shell lead (2) which is arranged on the packaging shell (1) and is electrically connected with the shell internal electrode (3), and gold wires (5); the gold wire (5) is used for electrically connecting the pulse distributor and the trigger chip (7), the power supply (8) to be aged and the shell internal electrode (3);
a method of making a highly integrated electronic frequency divider device; comprises the following steps;
step one, production and material preparation: preparing a packaging shell (1), a shell lead (2), a shell internal electrode (3), a substrate adhesive film (4), a gold wire (5), a ceramic substrate (6), a pulse distributor and trigger chip (7), a power supply (8) to be aged and conductive adhesive (9) as preparation work before production;
step two, cleaning: cleaning the ceramic substrate (6);
step three, substrate printing: printing a functional layer on the ceramic substrate (6); the functional layer comprises a conduction band, a resistance layer and an insulating layer;
step four, laminating: firstly, a shell lead (2) and a shell internal electrode (3) are arranged on a packaging shell (1); then, fixing the printed ceramic substrate (6) in the packaging shell (1) by using a substrate adhesive film (4);
step five, sticking the sheet: a pulse distributor, a trigger chip (7) and a power supply (8) to be aged are bonded on a ceramic substrate (6) by using conductive adhesive (9);
step six, pressure welding of the gold wire (5): electrically connecting the pulse distributor, the trigger chip (7) and the power supply (8) to be aged with the conduction band on the ceramic substrate (6);
step seven, an aging process: carrying out aging treatment on the packaging shell (1) and the upper parts thereof;
step eight, sealing a cap: packaging the packaging shell (1);
step nine, marking: printing a mark outside the packaging shell (1);
step ten, inspecting finished products.
2. The method for manufacturing a highly integrated electronic frequency divider according to claim 1, wherein in step seven, in the aging process, by means of an aging apparatus, a power supply of the aging apparatus includes an intermediate frequency power supply, a step-up transformer, a current-limiting resistor, a voltmeter, and an ammeter; the output end of the intermediate frequency power supply is connected with a step-up transformer to step up the input intermediate frequency power supply of the intermediate frequency power supply, and a secondary coil of the step-up transformer is output through a current-limiting resistor and then displays an output value through a voltmeter and an ammeter.
3. The method for manufacturing a highly integrated electronic frequency divider according to claim 1, wherein in step seven, in the aging process, the aging apparatus comprises an electronic load for aging the power supply (8) to be aged by means of an aging apparatus; the electronic load comprises a single chip microcomputer, a timer, a second-order filter, a comparator, a sampling amplifier and a sampling resistor;
the single chip microcomputer adopts an STM32f103 series single chip microcomputer, the timer is controlled to work in a PWM output mode, and PWM waves output by the single chip microcomputer are filtered by a second-order filter to obtain a voltage value which changes according to the duty ratio;
the voltage value acquired from the sampling resistor is amplified and then fed back to the inverting input section of the operational amplifier as a feedback value according to the voltage value with the changed duty ratio as the reference value of the operational amplifier, so that closed-loop control is formed;
and the voltage value acquired from the sampling resistor is input into the singlechip for displaying the current value.
4. The method for manufacturing a highly integrated electronic frequency divider according to claim 1, wherein in the seventh step, with the aid of the aging device, the aging device comprises a wireless monitoring system device including a single chip, a communication module, a computer, an AD module, a conversion circuit module, a voltage acquisition module, a temperature conversion module, a temperature acquisition module, a transformer, a display circuit, and a key circuit;
the single chip microcomputer, the AD module, the conversion circuit module and the voltage acquisition module are sequentially in communication connection; the single chip microcomputer collects voltage signals through a conversion circuit module and an AD module in cooperation with the voltage collection module;
the single chip microcomputer, the temperature conversion module and the temperature acquisition module are sequentially in communication connection; the temperature conversion module is matched with the temperature acquisition module to acquire temperature;
the single chip microcomputer is in communication connection with a computer provided with monitoring software through a communication module; the single chip microcomputer, the transformer, the display circuit and the key circuit are sequentially in communication connection;
the single chip microcomputer carries out wireless local area network construction through a ZigBee wireless communication module taking CC2530 as a core so as to be convenient for the single chip microcomputer to transmit the acquired information to a computer;
the single chip microcomputer is provided with a display circuit and keys of a display screen through a transformer;
the programming language of the monitoring software is C language, and the KeiluVision4 is used as the programming software;
the computer receiving end software uses C + + programming language, the programming platform is QT, the database uses MySQL database management system;
the wireless temperature control system software comprises a user login interface, a software login interface, a main interface and a user main interface;
the main interface is divided into a monitoring center, a real-time query module, a product record query module and a history query module; a summary of the oven real-time in the main interface, including real-time temperature and real-time voltage; the monitoring center comprises over-temperature and over-pressure alarm. After alarming, the corresponding oven progress bar can display red color and has voice warning prompt tone; clicking a single oven area will enter a detailed real-time query interface;
the real-time query interface is used for displaying the temperature of the oven, including set temperature, actual temperature, two paths of set voltage and actual voltage, and product screening items in the oven;
the product recording interface is used for adding product information including screening items, placing in an oven, starting time, ending time, temperature setting and voltage setting on a product recording page;
a product record inquiry interface, wherein in the inquiry interface, firstly, a user inputs an oven number or a product name; then selecting a time interval, searching the aging condition record, and clicking a lead-out button to lead out an excel form;
and the historical record interface is used for inquiring product screening records on a historical inquiry page, and the product screening records comprise historical temperature values, voltage values, set values and information of screening items.
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