CN111002675B - Glue-resistant release film and preparation method and application thereof - Google Patents
Glue-resistant release film and preparation method and application thereof Download PDFInfo
- Publication number
- CN111002675B CN111002675B CN201911321794.0A CN201911321794A CN111002675B CN 111002675 B CN111002675 B CN 111002675B CN 201911321794 A CN201911321794 A CN 201911321794A CN 111002675 B CN111002675 B CN 111002675B
- Authority
- CN
- China
- Prior art keywords
- film layer
- release film
- methyl
- polypropylene
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/02—Conditioning or physical treatment of the material to be shaped by heating
- B29B13/022—Melting the material to be shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
- B32B2250/242—All polymers belonging to those covered by group B32B27/32
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to an adhesive-resistant release film and a preparation method and application thereof. The release film comprises a middle film layer, and an upper surface film layer and a lower surface film layer which are arranged on the upper surface and the lower surface of the middle film layer. Wherein, the raw material of the middle film layer is a mixture of 4-methyl-1-pentene polymer, polypropylene and polyethylene; the raw material of the upper surface film layer is 4-methyl-1-pentene polymer; the raw material of the lower surface film layer is 4-methyl-1-pentene polymer. The glue-blocking release film is simple in structure, and the three-layer structure forms the release film with stable performance. The 4-methyl-1-pentene polymer, the polypropylene and the polyethylene are matched for use, so that the release film has good high-temperature-resistant pressing performance, and the glue leakage phenomenon does not occur under the high-temperature pressing condition (such as the temperature of 180 ℃).
Description
Technical Field
The invention relates to the technical field of release films, in particular to an adhesive-resistant release film and a preparation method and application thereof.
Background
With the development of electronic technology, in the process of manufacturing electronic products, flexible circuit boards with high precision, good stability and high reliability are often used. Research and development of the flexible circuit board drives rapid development of the release film, and the release film also provides good performance support for manufacturing the flexible circuit board. However, the conventional release film has poor performance, and particularly, the phenomenon of glue leakage occurs in the pressing process at high temperature. In the course of working at flexible circuit board, when the phenomenon of leaking glue takes place, the cull can glue on the circuit board, is difficult to clear away, and at this moment, clear away the cull and can increase manufacturing cost. More seriously, the residual glue can cause poor contact of the golden fingers, which can bring serious adverse effects to the performance of the circuit board.
Disclosure of Invention
Therefore, the adhesive resistant release film with stable performance under high-temperature pressing and the preparation method and application thereof are needed to be provided.
The specific technical scheme is as follows:
one object of the invention is to provide an adhesive-resistant release film, which comprises a middle film layer, and an upper surface film layer and a lower surface film layer which are arranged on the upper surface and the lower surface of the middle film layer;
the raw material of the middle film layer is a mixture of 4-methyl-1-pentene polymer, polypropylene and polyethylene;
the raw material of the upper surface film layer is 4-methyl-1-pentene polymer;
the raw material of the lower surface film layer is 4-methyl-1-pentene polymer.
In one embodiment, the raw materials of the intermediate film layer are formed by mixing 4-methyl-1-pentene polymer, polypropylene and polyethylene according to a mass ratio of (1.3-5): 1-4): 1.
In one embodiment, the polypropylene is at least one of isotactic polypropylene, syndiotactic polypropylene, and atactic polypropylene.
In one embodiment, the polypropylene is formed by mixing isotactic polypropylene and syndiotactic polypropylene according to the mass ratio of (1.5-9): 1; and/or the presence of a gas in the gas,
the polypropylene is formed by mixing isotactic polypropylene and atactic polypropylene according to a mass ratio of (4-9) to 1; and/or the presence of a gas in the gas,
the polypropylene is formed by mixing isotactic polypropylene, syndiotactic polypropylene and atactic polypropylene according to the mass ratio of (5-8) to (1-4) to 1.
In one embodiment, the 4-methyl-1-pentene polymer comprises a 4-methyl-1-pentene homopolymer, a 4-methyl-1-pentene copolymer, and a mixture of a 4-methyl-1-pentene homopolymer and a 4-methyl-1-pentene copolymer.
In one embodiment, the upper surface film layer and the lower surface film layer are made of the same material.
In one embodiment, the thickness ratio of the upper surface film layer, the middle film layer and the lower surface film layer is (0.75-1): 4 (0.75-1).
Another object of the present invention is to provide a method for preparing the adhesive-resistant release film in any of the above embodiments, wherein the method comprises the following steps:
respectively granulating, melting and extruding the raw materials of the upper surface film layer, the middle film layer and the lower surface film layer, and then carrying out tape casting and sheet casting treatment to obtain a pre-formed product of the anti-sticking release film;
and carrying out heat setting on the pre-formed product of the glue-blocking release film.
In one embodiment, the melting temperature is 250 ℃ to 300 ℃; the heat setting temperature is 50-70 ℃.
It is still another object of the present invention to provide a flexible circuit board, which includes the adhesive-resistant release film described in any of the above embodiments.
The adhesive-resistant release film comprises a middle film layer, and an upper surface film layer and a lower surface film layer which are arranged on the upper surface and the lower surface of the middle film layer. Wherein, the raw material of the middle film layer is a mixture of 4-methyl-1-pentene polymer, polypropylene and polyethylene; the raw material of the upper surface film layer is 4-methyl-1-pentene polymer; the raw material of the lower surface film layer is 4-methyl-1-pentene polymer. The glue-blocking release film is simple in structure, and the three-layer structure forms the release film with stable performance. The 4-methyl-1-pentene polymer, the polypropylene and the polyethylene are matched for use, so that the release film has good high-temperature-resistant lamination performance, and the glue leakage phenomenon does not occur under the condition of high-temperature (such as 180 ℃) lamination.
The preparation method of the adhesive-resistant release film is simple to operate, the raw materials of the upper surface film layer, the middle film layer and the lower surface film layer are respectively placed in three extruders after being granulated, and then melting, foundation, tape casting and sheet casting are carried out to obtain a release film preform; and then the preformed product of the release film is subjected to heat setting, and finally the adhesive-resistant release film is obtained through the steps of cutting waste edges, rolling and the like, so that the operation is simple, convenient and easy to implement.
Drawings
Fig. 1 is a schematic structural view of an adhesive-resistant release film according to an embodiment of the invention.
The notation in the figure is:
10. a glue-blocking release film; 11. an intermediate film layer; 12. an upper surface film layer; 13. and the lower surface film layer.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the accompanying examples. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
An embodiment of the invention provides an adhesive-resistant release film, which comprises a middle film layer, and an upper surface film layer and a lower surface film layer which are arranged on the upper surface and the lower surface of the middle film layer.
As shown in fig. 1, in a specific example, the release film 10 is composed of an intermediate film layer 11, and an upper surface film layer 12 and a lower surface film layer 13 provided on upper and lower surfaces of the intermediate film layer 11.
The raw material of the intermediate film layer 11 is a mixture of 4-methyl-1-pentene polymer, polypropylene and polyethylene; the raw material of the upper surface film layer 12 is 4-methyl-1-pentene polymer; the raw material of the lower surface film layer 13 is 4-methyl-1-pentene polymer.
Further, the above-mentioned 4-methyl-1-pentene polymer includes a 4-methyl-1-pentene homopolymer, a 4-methyl-1-pentene copolymer, and a mixture of a 4-methyl-1-pentene homopolymer and a 4-methyl-1-pentene copolymer. The 4-methyl-1-pentene polymer is a polymer containing a 4-methyl-1-pentene monomer, and in the specific selection of raw materials, the 4-methyl-1-pentene polymer may be a homopolymer obtained by polymerizing 4-methyl-1-pentene, a copolymer obtained by polymerizing a 4-methyl-1-pentene monomer with another monomer, or a mixture of a 4-methyl-1-pentene homopolymer and a 4-methyl-1-pentene copolymer.
As a preferable scheme, in order to further optimize the structure of the adhesive-resistant release film and facilitate the processing and manufacturing, the raw materials of the upper surface film layer and the lower surface film layer are the same in the processing process. The raw materials of the upper surface film layer and the lower surface film layer are the same, so that the upper surface and the lower surface of the release film are more uniform, and the stability of the release film is further improved.
In a specific example, the raw materials of the intermediate film layer are 4-methyl-1-pentene polymer, polypropylene and polyethylene which are mixed according to the mass ratio of (1.3-5): 1-4): 1. Preferably, the raw materials of the intermediate film layer are 4-methyl-1-pentene polymer, polypropylene and polyethylene according to the mass ratio of 5:4: 1. The intermediate film layer is formed by mixing 4-methyl-1-pentene polymer, polypropylene and polyethylene in a proper mass ratio, and under the condition of the mass ratio, the three interact in the granulation and melting process, and can form a uniform dispersion system, so that the consistency of the glue-blocking release film is improved, and the stability of the release film is further improved.
Specifically, the polypropylene is at least one of isotactic polypropylene, syndiotactic polypropylene and atactic polypropylene.
In a specific example, when the polypropylene is formed by mixing isotactic polypropylene and syndiotactic polypropylene, the mass ratio of the isotactic polypropylene to the syndiotactic polypropylene is (1.5-9): 1.
in another specific example, when the polypropylene is formed by mixing isotactic polypropylene and atactic polypropylene, the mass ratio of the isotactic polypropylene to the atactic polypropylene is (4-9): 1. the polypropylene may be a mixture of isotactic polypropylene, syndiotactic polypropylene and atactic polypropylene. When the polypropylene is formed by mixing isotactic polypropylene, syndiotactic polypropylene and atactic polypropylene, the mass ratio of the isotactic polypropylene, the syndiotactic polypropylene and the atactic polypropylene is (5-8): (1-4): 1. preferably, the mass ratio of isotactic polypropylene, syndiotactic polypropylene and atactic polypropylene is 5:4: 1.
In order to enable the release film to have better performance, the thickness ratio of the upper surface film layer to the middle film layer to the lower surface film layer is (0.75-1) to 4 (0.75-1). Preferably, the thickness ratio of the upper surface film layer, the middle film layer and the lower surface film layer is 1:4: 1.
In a specific example, the thickness of the adhesive-resistant release film is 110 μm to 130 μm. Preferably, the thickness of the adhesive-resistant release film is 115-125 μm. Specifically, the thickness of the resist release film may be, but is not limited to, 118 μm, 120 μm, 122 μm, 124 μm.
The invention also provides a preparation method of the adhesive-resistant release film, which comprises the following steps:
respectively granulating, melting and extruding the raw material of the upper surface film layer, the raw material of the middle film layer and the raw material of the lower surface film layer, and then carrying out tape casting and cast sheet treatment to obtain a pre-formed product of the adhesive-blocking release film; and (4) performing heat setting on the pre-formed product of the glue-blocking release film. After heat setting, the preformed product is subjected to the steps of cutting waste edges, rolling and the like to obtain the glue-blocking release film.
In a specific example, when the raw materials of the upper surface film layer and the lower surface film layer are the same, in the preparation process, the raw material of the upper surface film layer (the raw material of the lower surface film layer) and the raw material of the intermediate film layer are respectively placed in two extruders for melting and extruding, and then casting and sheet casting are carried out, so as to obtain the pre-product of the adhesive-resistant release film. And then carrying out heat setting treatment on the glue-blocking prefabricated product, and then carrying out the steps of cutting off waste edges, rolling and the like to obtain the glue-blocking release film.
In a preferred scheme, the melting temperature is 250-300 ℃ in the preparation process of the adhesive-resistant release film; the temperature of heat setting is 50-70 ℃. Preferably, the melting temperature is 260 ℃ to 280 ℃, and more preferably, the melting temperature is 270 ℃. Preferably, the heat-setting temperature is 60 ℃.
Furthermore, three heat setting rollers are adopted in the heat setting process, and the setting is carried out for 3 seconds, so that the processing time is shortened, and the processing efficiency is improved.
In addition to the adhesive-resistant release film and the preparation method of the adhesive-resistant release film, an embodiment of the invention also provides a flexible circuit board, which comprises the adhesive-resistant release film.
The following are specific examples.
Example 1
In this embodiment, the raw materials of the upper surface film layer and the lower surface film layer of the photoresist release film are all 4-methyl-1-pentene homopolymer (TPX, polymerization degree range is 100-500 k). The raw material of the intermediate film layer is a mixture of 4-methyl-1-pentene homopolymer (TPX with a polymerization degree range of 100-500k), polypropylene (PP) and Polyethylene (PE), wherein in the intermediate film layer, the mass percent of the 4-methyl-1-pentene homopolymer is 50%, the mass percent of the polypropylene is 40% and the mass percent of the polyethylene is 10% in terms of the mass percent of the raw material of the intermediate film layer. The polypropylene is formed by mixing 24 mass percent of isotactic polypropylene (IPP) and 16 mass percent of syndiotactic polypropylene (SPP) in terms of mass percent of raw materials of the intermediate film layer.
The preparation method of the adhesive-resistant release film in the embodiment comprises the following steps:
(1) granulating the raw materials of the upper and lower surface film layers, and mixing and granulating the raw materials of the middle film layer.
(2) Adding the raw materials of the upper and lower surface film layers granulated in the step (1) into a first extruder, adding the raw materials of the mixed and granulated intermediate film layer into a second extruder, setting process parameters, wherein the extrusion temperature of the first extruder is set to be 80-300 ℃, the extrusion temperature of the second extruder is set to be 80-250 ℃, and then carrying out melting, extrusion, tape casting and sheet casting treatment to obtain the pre-formed product of the glue-blocking release film. Wherein the temperature of the melt was 270 ℃.
(3) And (3) performing heat setting on the pre-formed product of the anti-glue release film obtained in the step (2) at the temperature of 60 ℃.3 heat setting rollers are adopted in the heat setting process, and the heat setting time is 3 s. After heat setting, the adhesive-resistant release film is obtained through the steps of cutting off waste edges, rolling and the like.
The thickness of the glue-resistant release film in this embodiment is 120 μm. Wherein the thickness of the upper surface film layer is 20 μm, the thickness of the lower surface film layer is 20 μm, and the thickness of the middle film layer is 80 μm.
Example 2
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 36 mass percent of isotactic polypropylene and 4 mass percent of syndiotactic polypropylene in percentage by mass of raw materials of the intermediate film layer.
Example 3
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 32 mass percent of isotactic polypropylene and 8 mass percent of syndiotactic polypropylene in percentage by mass of raw materials of the intermediate film layer.
Example 4
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 32 mass percent of isotactic polypropylene and 8 mass percent of atactic polypropylene in percentage by mass of raw materials of the middle film layer.
Example 5
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 36 mass percent of isotactic polypropylene and 4 mass percent of atactic polypropylene in percentage by mass of the raw materials of the middle film layer.
Example 6
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 34 mass percent of isotactic polypropylene and 6 mass percent of atactic polypropylene in percentage by mass of the raw materials of the middle film layer.
Example 7
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 20 mass percent of isotactic polypropylene, 16 mass percent of syndiotactic polypropylene and 4 mass percent of atactic polypropylene (APP) in percentage by mass of raw materials of the intermediate film layer.
Example 8
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 32 mass percent of isotactic polypropylene, 4 mass percent of syndiotactic polypropylene and 4 mass percent of atactic polypropylene in percentage by mass of the raw materials of the intermediate film layer.
Example 9
The present embodiment is different from embodiment 1 in that: the polypropylene is formed by mixing 28 mass percent of isotactic polypropylene, 8 mass percent of syndiotactic polypropylene and 4 mass percent of atactic polypropylene in percentage by mass of raw materials of the intermediate film layer.
The release films of examples 1 to 9, and comparative example were subjected to a performance test. The test items are as follows:
(1) testing film forming property: in the casting sheet forming process, the pre-formed product of the glue-blocking release film is not broken, and the film forming property is good; if the pre-formed product of the anti-adhesive release film is broken, the film forming property is poor.
(2) Testing the glue resistance: the release film is used for laminating the flexible circuit board, the laminating condition is 180 ℃, preheating is carried out for 10s, laminating is carried out for 120s, the glue overflow amount is not more than 1%, and the glue resistance is good if the glue is qualified; the glue overflow amount is more than 1 percent, and the glue resistance is poor if the glue is unqualified.
(3) And (3) testing high-temperature resistance: the release film is used for laminating the flexible circuit board at 180 ℃, and no intermediate film layer substance flows out from the edge of the release film after lamination, so that the high-temperature resistance is good; after pressing, the material of the intermediate film layer flows out from the edge of the release film, so that the high temperature resistance is poor.
(4) And (3) testing release performance: the release film is used for laminating the flexible circuit board at 180 ℃, after lamination, the release film can be easily peeled off, and the surface of the circuit board has no residual glue, so that the release performance is good; after lamination, the release is difficult to peel or residual glue is on the surface of the circuit board, so that the release performance is poor.
(5) And (3) thickness testing: the thickness of the release film is regulated to be 120 mu m, the thickness of the release film is in the range of 115 mu m-125 mu m, and the thickness of the prepared release film is qualified; if the thickness of the release film is not within the range of 115-125 mu m, the thickness of the prepared release film is unqualified.
The test results of examples 1 to 9 are shown in table 1.
TABLE 1
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a hinder gluey from type membrane which characterized in that: the film comprises a middle film layer, and an upper surface film layer and a lower surface film layer which are arranged on the upper surface and the lower surface of the middle film layer;
the raw material of the middle film layer is a mixture formed by mixing 4-methyl-1-pentene polymer, polypropylene and polyethylene according to a mass ratio of 5:4: 1; the polypropylene is formed by mixing isotactic polypropylene, syndiotactic polypropylene and atactic polypropylene according to the mass ratio of 5:4: 1;
the raw material of the upper surface film layer is 4-methyl-1-pentene polymer;
the raw material of the lower surface film layer is 4-methyl-1-pentene polymer.
2. The adhesive-resistant release film according to claim 1, wherein: the 4-methyl-1-pentene polymer includes a 4-methyl-1-pentene homopolymer, a 4-methyl-1-pentene copolymer, and a mixture of a 4-methyl-1-pentene homopolymer and a 4-methyl-1-pentene copolymer.
3. The adhesive-resistant release film according to claim 1, wherein: the upper surface film layer and the lower surface film layer are made of the same raw materials.
4. The adhesive-resistant release film according to claim 1, wherein: the thickness ratio of the upper surface film layer to the middle film layer to the lower surface film layer is (0.75-1) to 4 (0.75-1).
5. The adhesive-resistant release film according to claim 4, wherein: the thickness ratio of the upper surface film layer, the middle film layer and the lower surface film layer is 1:4: 1.
6. The adhesive-resistant release film according to claim 1, wherein: the thickness of the glue-resistant release film is 110-130 μm.
7. The preparation method of the adhesive-resistant release film according to any one of claims 1 to 6, characterized by comprising the following steps: the method comprises the following steps:
respectively granulating, melting and extruding the raw materials of the upper surface film layer, the middle film layer and the lower surface film layer, and then carrying out tape casting and sheet casting treatment to obtain a pre-formed product of the anti-sticking release film;
and carrying out heat setting on the pre-formed product of the glue-blocking release film.
8. The method of claim 7, wherein: the melting temperature is 250-300 ℃; the heat setting temperature is 50-70 ℃.
9. The method of claim 8, wherein: the temperature of the melting is 270 ℃; the heat-setting temperature was 60 ℃.
10. A flexible circuit board, characterized in that: the adhesive-resistant release film comprises the adhesive-resistant release film according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911321794.0A CN111002675B (en) | 2019-12-20 | 2019-12-20 | Glue-resistant release film and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911321794.0A CN111002675B (en) | 2019-12-20 | 2019-12-20 | Glue-resistant release film and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111002675A CN111002675A (en) | 2020-04-14 |
| CN111002675B true CN111002675B (en) | 2022-03-08 |
Family
ID=70117264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911321794.0A Active CN111002675B (en) | 2019-12-20 | 2019-12-20 | Glue-resistant release film and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111002675B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112318985A (en) * | 2020-11-10 | 2021-02-05 | 烟台正海合泰科技股份有限公司 | Non-woven fabric with glue-blocking film and production method thereof |
| CN112622312A (en) * | 2020-12-29 | 2021-04-09 | 宁波长阳科技股份有限公司 | Release film and preparation method and application thereof |
| CN112810273B (en) * | 2020-12-31 | 2023-02-24 | 苏州市新广益电子股份有限公司 | Release film containing 4-methyl-1-pentene polymer and preparation method thereof |
| CN114603955B (en) * | 2022-05-11 | 2022-09-13 | 宁波长阳科技股份有限公司 | Three-layer composite release film for 3D printing process and preparation method thereof |
| CN114771068B (en) * | 2022-06-17 | 2022-09-13 | 宁波长阳科技股份有限公司 | Three-layer TPX release film based on reclaimed materials and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000263724A (en) * | 1999-03-19 | 2000-09-26 | Mitsui Chemicals Inc | Release film for manufacture of printed wiring board and manufacturing method thereof |
| US20180244024A1 (en) * | 2017-02-24 | 2018-08-30 | Toray Plastics (America), Inc. | Monoaxially or biaxially oriented polyolefin release film |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101555333A (en) * | 2008-04-10 | 2009-10-14 | 中山赛特工程塑料有限公司 | Acrylic resin with high toughness |
| CN102558668B (en) * | 2010-12-29 | 2014-04-30 | 上海普利特复合材料股份有限公司 | High-transparency, heat-resistant and impact-resistant modified polypropylene composite material and preparation method thereof |
| CN103183871A (en) * | 2011-12-31 | 2013-07-03 | 北京化工大学 | Polypropylene based resin composition for leather release paper, and preparation method and application thereof |
| CN204773911U (en) * | 2015-06-16 | 2015-11-18 | 深圳市领域实业有限公司 | Dull polish protection film |
| CN106042553B (en) * | 2016-06-13 | 2018-06-26 | 昆山致信天城电子材料有限公司 | A kind of high temperature resistant release film and manufacturing process |
| CN206374310U (en) * | 2017-01-05 | 2017-08-04 | 松本涂层科技（昆山）有限公司 | A kind of high temperature leather release liners |
| CN207290684U (en) * | 2017-07-07 | 2018-05-01 | 昆山致信天城电子材料有限公司 | A kind of high temperature release film |
-
2019
- 2019-12-20 CN CN201911321794.0A patent/CN111002675B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000263724A (en) * | 1999-03-19 | 2000-09-26 | Mitsui Chemicals Inc | Release film for manufacture of printed wiring board and manufacturing method thereof |
| US20180244024A1 (en) * | 2017-02-24 | 2018-08-30 | Toray Plastics (America), Inc. | Monoaxially or biaxially oriented polyolefin release film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111002675A (en) | 2020-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111002675B (en) | Glue-resistant release film and preparation method and application thereof | |
| CN102399504B (en) | Pressure-sensitive adhesive tape | |
| CN111002667B (en) | Release film and preparation method thereof | |
| TW201204553A (en) | Back sheet for solar cell module and manufacturing method thereof | |
| CN113122161B (en) | Composite hot-melt double-sided adhesive tape for lithium ion battery and preparation method thereof | |
| CN1787904B (en) | Fluororesin laminated film and method for producing same | |
| CN108790346B (en) | Release paper for fast pressing of flexible circuit board and manufacturing process thereof | |
| CN102729532B (en) | Multilayer porous membrane and preparation method thereof | |
| CN116160745B (en) | Polypropylene film, preparation method thereof and thermal composite sheet | |
| CN107234764B (en) | High-temperature release film resistant to high level difference and manufacturing process | |
| JPS6331367B2 (en) | ||
| JP2002079630A (en) | Mold release multilayered film and cover lay molding method | |
| CN106985396B (en) | Method for controlling glue flow of copper-clad plate | |
| CN202174778U (en) | Copper foil base plate with composite structure | |
| CN101597466B (en) | Bonding sheet of rigid-flex combined board and method for manufacturing same | |
| CN111993731B (en) | Foaming release film and preparation method thereof | |
| JPH11349703A (en) | Releasing film | |
| CN211808277U (en) | High-temperature-resistant release film for roll-to-roll lamination | |
| CN111993708A (en) | Release film and preparation method thereof | |
| WO2022088274A1 (en) | Metal plastic composite film, preparation method therefor and use thereof | |
| CN216528916U (en) | Solar cell backboard | |
| TWI824240B (en) | Hot melt tape and manufacturing and using method thereof | |
| CN105907301A (en) | High-film-forming performance anti-static release film | |
| CN115612142B (en) | Method for preparing prepreg by ultraviolet curing and thermal curing composite technology | |
| CN118144394B (en) | Release film and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |