CN110996630A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN110996630A CN110996630A CN201911374355.6A CN201911374355A CN110996630A CN 110996630 A CN110996630 A CN 110996630A CN 201911374355 A CN201911374355 A CN 201911374355A CN 110996630 A CN110996630 A CN 110996630A
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- China
- Prior art keywords
- flow
- accommodating cavity
- heat sink
- outlet
- flow equalizing
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- 239000002826 coolant Substances 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 239000012530 fluid Substances 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000008676 import Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of heat dissipation, and discloses a heat radiator which comprises a shell, a flow equalizing structure and a flow passage structure, wherein an inlet and an outlet are formed in the shell, a first accommodating cavity and a second accommodating cavity are formed in the shell, the first accommodating cavity is communicated with the second accommodating cavity, the flow equalizing structure is arranged in the first accommodating cavity, the flow passage structure is arranged in the second accommodating cavity, the inlet is communicated with the flow equalizing structure, and the flow equalizing structure is communicated with the outlet through the flow passage structure; the runner structure includes a plurality of heat dissipation runners, the structure that flow equalizes includes 3 at least spoilers of interval arrangement in proper order, and adjacent two form the passway mouth that is used for supplying coolant to pass through between the spoiler, after coolant got into the casing by the import, shunt through each passway mouth to coolant can divide to each heat dissipation runner relatively evenly, thereby be favorable to the heat dissipation evenly.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat radiator.
Background
The radiator is a device for exchanging heat with other equipment, at present, the existing radiator is generally provided with a plurality of radiating channels, and cooling media exchange heat with other equipment when passing through the plurality of radiating channels, so that the heat of other equipment is dissipated. However, when the cooling medium enters the heat dissipation channels, the flow rate of the cooling medium entering each heat dissipation channel is different, for example, the cooling medium is concentrated in the middle flow channel, and the flow rates of the flow channels on the two sides are less, thereby causing the problem of uneven heat dissipation.
Disclosure of Invention
The embodiment of the invention aims to provide a radiator, which can enable a cooling medium to be distributed to each radiating flow channel more uniformly, and avoid the problem of uneven radiating of the existing radiator.
In order to solve the technical problem, an embodiment of the present invention provides a heat sink, including a housing, a flow equalizing structure and a flow channel structure, where the housing is provided with an inlet and an outlet, the housing is provided with a first accommodating cavity and a second accommodating cavity, the first accommodating cavity is communicated with the second accommodating cavity, the flow equalizing structure is arranged in the first accommodating cavity, the flow channel structure is arranged in the second accommodating cavity, the inlet is communicated with the flow equalizing structure, and the flow equalizing structure is communicated with the outlet through the flow channel structure;
the flow channel structure comprises a plurality of heat dissipation flow channels, the flow equalizing structure comprises at least 3 spoilers which are sequentially arranged at intervals, and a channel opening for a cooling medium to pass through is formed between every two adjacent spoilers.
Preferably, the inlet is disposed at the right end of the housing, the outlet is disposed at the left end of the housing, and the inlet and the outlet are disposed opposite to each other.
As a preferred scheme, the number of the flow equalizing structures is multiple, the multiple groups of flow equalizing structures are sequentially arranged at intervals along the left and right direction of the shell, and the spoilers of two adjacent groups of flow equalizing structures are distributed in a staggered manner.
Preferably, the cross-sectional area of the first accommodating cavity is gradually increased from the right end of the first accommodating cavity to the left end of the first accommodating cavity, and the number of the spoilers of each group of the flow equalizing structures is gradually increased from the right end of the first accommodating cavity to the left end of the first accommodating cavity.
Preferably, a fluid concentration cavity is arranged in the shell and is arranged between the flow channel structure and the outlet.
Preferably, the cross-sectional area of the fluid concentration chamber gradually decreases from the right end of the fluid concentration chamber to the left end of the fluid concentration chamber.
Preferably, the fluid concentration cavity is communicated with the second accommodating cavity, and the inner wall of the fluid concentration cavity is connected with the inner wall of the second accommodating cavity through a fillet.
Preferably, the flow channel structure includes a plurality of flow channel plates, and the heat dissipation flow channel is formed between two adjacent flow channel plates.
Preferably, the heat sink further includes a cooling medium, and the cooling medium is a phase change medium.
Preferably, the cooling medium is a fluorinated liquid.
The embodiment of the invention provides a radiator, which comprises a shell, a flow equalizing structure and a flow channel structure, wherein an inlet is communicated with the flow equalizing structure, the flow equalizing structure is communicated with an outlet through the flow channel structure, the flow channel structure comprises a plurality of radiating flow channels, the flow equalizing structure comprises at least 3 spoilers which are sequentially arranged at intervals, a channel opening for a cooling medium to pass through is formed between every two adjacent spoilers, and after the cooling medium enters the shell from the inlet, the cooling medium is divided through each channel opening, so that the cooling medium can be uniformly distributed to each radiating flow channel, and the uniform radiation is facilitated.
Drawings
Fig. 1 is a schematic structural view of a heat sink in an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a heat sink in an embodiment of the invention;
FIG. 3 is a cross-sectional view of another angle of a heat sink in an embodiment of the present invention;
wherein, 1, a shell; 11. an inlet; 12. an outlet; 13. a first accommodating chamber; 14. a second accommodating chamber; 15. A fluid concentration chamber; 2. a flow channel structure; 21. a runner plate; 3. a current sharing structure; 31. a spoiler; 4. and (4) rounding.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, the descriptions of the top, bottom, left, right, front, back, and other orientations, as well as the top and bottom, are defined with respect to fig. 3, and when the placement manner of the heat sink is changed, the descriptions of the corresponding orientations, top, and bottom, will also be changed according to the change of the placement manner, and the description of the present invention is omitted here for brevity.
With reference to fig. 1 to 3, a heat sink according to a preferred embodiment of the present invention includes a housing 1, a flow equalizing structure 3, and a flow channel structure 2, where an inlet 11 and an outlet 12 are disposed on the housing 1, a first accommodating cavity 13 and a second accommodating cavity 14 are disposed in the housing 1, the first accommodating cavity 13 is communicated with the second accommodating cavity 14, the flow equalizing structure 3 is disposed in the first accommodating cavity 13, the flow channel structure 2 is disposed in the second accommodating cavity 14, the inlet 11 is communicated with the flow equalizing structure 3, and the flow equalizing structure 3 is communicated with the outlet 12 through the flow channel structure 2;
the flow channel structure 2 comprises a plurality of heat dissipation flow channels, the flow equalizing structure 3 comprises at least 3 spoilers 31 which are sequentially arranged at intervals, and a channel opening for a cooling medium to pass through is formed between every two adjacent spoilers 31.
In the embodiment of the invention, the heat sink includes a housing 1, a flow equalizing structure 3 and a flow channel structure 2, an inlet 11 is communicated with the flow equalizing structure 3, the flow equalizing structure 3 is communicated with an outlet 12 through the flow channel structure 2, the flow channel structure 2 includes a plurality of heat dissipation flow channels, the flow equalizing structure 3 includes at least 3 spoilers 31 arranged in sequence at intervals, a channel opening for a cooling medium to pass through is formed between two adjacent spoilers 31, and after the cooling medium enters the housing 1 from the inlet 11, the cooling medium is divided through each channel opening, so that the cooling medium can be distributed to each heat dissipation flow channel more uniformly, and uniform heat dissipation is facilitated.
In practical application, the heat radiator can be applied to high-power electronic equipment such as a converter valve, and the heat radiator can be attached to equipment needing heat radiation, such as wall-mounted contact. In addition, the heat dissipation plate structure of high-power electronic equipment such as a converter valve and the like usually adopts a cavity structure, the cross section utilization rate of the heat dissipation plate is generally improved by increasing the number of the inlet and the outlet 12, however, the increase of the number of the inlet and the outlet 12 causes the increase of the number of the heat dissipation plate and external joints, and on the equipment such as the converter valve and the like which is connected in series and in parallel, the faults such as liquid leakage and the like are easily caused by the large number of the joints, but the heat radiator provided by the embodiment of the invention integrates the current equalizing structure 3 in the shell 1, so that.
As shown in fig. 1 to 3, the flow channel structure 2 may include a plurality of flow channel plates 21, and the heat dissipation flow channel is formed between two adjacent flow channel plates 21. Of course, the heat dissipation channel may also be formed by other manners, which will not be further described herein.
Referring to fig. 1 to 3, the inlet 11 is disposed on the right end of the housing 1, the outlet 12 is disposed on the left end of the housing 1, and the inlet 11 and the outlet 12 are disposed opposite to each other. The number of the current-equalizing structures 3 is multiple, the multiple groups of the current-equalizing structures 3 are sequentially arranged at intervals along the left and right direction of the shell 1, and the spoilers 31 of the two adjacent groups of the current-equalizing structures 3 are distributed in a staggered manner. Referring to fig. 3, the spoilers 31 of two adjacent sets of the flow equalizing structures 3 are distributed in a staggered manner, rather than in an aligned manner, so that the channel openings of two adjacent sets of the flow equalizing structures 3 are not arranged in an opposite manner, so that the cooling medium can enter the heat dissipation channels more uniformly after being equally distributed for multiple times, and the heat dissipation is more uniform. In the middle of concrete implementation, the group number of the current equalizing structure 3 can be set according to actual requirements, the more the group number of the current equalizing structure 3 is, the better the current equalizing effect is, but the cost and the flow resistance are considered to be increased, and the group number of the current equalizing structure 3 can meet the actual requirements.
In an optional embodiment, the cross-sectional area of the first accommodating cavity 13 gradually increases from the right end of the first accommodating cavity 13 to the left end of the first accommodating cavity 13, and the number of the spoilers 31 of each group of the flow equalizing structures 3 gradually increases from the right end of the first accommodating cavity 13 to the left end of the first accommodating cavity 13, so that the cooling medium is gradually distributed into each heat dissipation flow channel after entering from the inlet 11, and the flow equalizing effect is better. Preferably, the first accommodating cavity 13 is of a V-shaped structure, and the second accommodating cavity 14 is of a rectangular structure.
Referring to fig. 2 and 3, a fluid concentration chamber 15 is provided in the housing 1, and the fluid concentration chamber 15 is provided between the flow channel structure 2 and the outlet 12. By arranging the fluid concentration chamber 15 between the flow channel structure 2 and the outlet 12, the cooling medium can be concentrated after passing through the flow channel structure 2, thereby improving the cross-sectional utilization of the radiator.
In a specific implementation, the heat sink further includes a cooling medium, in this embodiment, the cooling medium is a phase change medium, and preferably, the cooling medium is a fluorinated liquid. The fluoridized liquid is used as a phase change medium and has the characteristics of low boiling point and large phase change latent heat. In practical application, a cooling medium enters the radiator from the inlet 11, and after passing through the flow equalizing structure 3, the cooling medium can uniformly enter each heat dissipation flow channel, the cooling medium absorbs heat in the heat dissipation flow channels, can be boiled into gas to take away the heat, and the gaseous cooling medium is concentrated by the fluid concentration cavity 15 and then flows out through the outlet 12. Through the flowing direction, the problem of uneven heat dissipation distribution caused by uneven flow can be better solved, and the section utilization rate of the radiator is increased.
In addition, in the prior art, the existing water-cooling heat dissipation plate is generally an "S" type or spiral heat dissipation plate, and if the heat dissipation plate is used for phase change cooling, the inside of the heat dissipation plate is evaporated to dryness due to the difficulty that bubbles are not easy to overflow, so that heat dissipation cannot be performed. The fluid concentration chamber 15 of this embodiment improves the slope of the outlet 12 of the heat sink and increases the angle so that air bubbles are less likely to escape as a result of accumulating in an area.
Further, the cross-sectional area of the fluid concentration chamber 15 of the present embodiment gradually decreases from the right end of the fluid concentration chamber 15 to the left end of the fluid concentration chamber 15. Preferably, the fluid concentration chamber 15 has a V-shaped configuration. The fluid concentration chamber 15 further improves the slope of the outlet 12 of the radiator, increasing the angle so that air bubbles are less likely to escape as a result of accumulating in an area that is difficult to escape.
In addition, if the bubbles gather at a right angle, a drying area is easily generated, and the medium has a large flow resistance and is not easy to flow away from the right angle due to the right angle in the flowing process. In order to solve this problem, the fluid concentration chamber 15 of the present embodiment communicates with the second accommodating chamber 14, and an inner wall of the fluid concentration chamber 15 is connected to an inner wall of the second accommodating chamber 14 by a rounded corner. The inner wall of the fluid concentration cavity 15 and the inner wall of the second accommodating cavity 14 are in round angle transition, so that the joint of the two is smooth, the flow resistance is smaller, the cooling medium can flow away more easily, and the heat dissipation effect is further ensured.
To sum up, the embodiment of the present invention provides a heat sink, including a housing 1, a flow equalizing structure 3 and a flow channel structure 2, an inlet 11 is communicated with the flow equalizing structure 3, the flow equalizing structure 3 is communicated with an outlet 12 through the flow channel structure 2, the flow channel structure 2 includes a plurality of heat dissipation flow channels, the flow equalizing structure 3 includes at least 3 spoilers 31 arranged in sequence at intervals, a channel port for a cooling medium to pass through is formed between two adjacent spoilers 31, and after the cooling medium enters the housing 1 from the inlet 11, the cooling medium is divided by each channel port, so that the cooling medium can be distributed to each heat dissipation flow channel more uniformly, thereby facilitating uniform heat dissipation.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A radiator is characterized by comprising a shell, a flow equalizing structure and a flow passage structure, wherein an inlet and an outlet are arranged on the shell, a first accommodating cavity and a second accommodating cavity are arranged in the shell, the first accommodating cavity is communicated with the second accommodating cavity, the flow equalizing structure is arranged in the first accommodating cavity, the flow passage structure is arranged in the second accommodating cavity, the inlet is communicated with the flow equalizing structure, and the flow equalizing structure is communicated with the outlet through the flow passage structure;
the flow channel structure comprises a plurality of heat dissipation flow channels, the flow equalizing structure comprises at least 3 spoilers which are sequentially arranged at intervals, and a channel opening for a cooling medium to pass through is formed between every two adjacent spoilers.
2. The heat sink of claim 1, wherein the inlet is disposed on a right end of the housing and the outlet is disposed on a left end of the housing, the inlet and the outlet being disposed opposite one another.
3. The heat sink as claimed in claim 2, wherein the number of the flow equalizing structures is multiple, the multiple sets of the flow equalizing structures are sequentially arranged at intervals along the left-right direction of the housing, and the spoilers of two adjacent sets of the flow equalizing structures are distributed in a staggered manner.
4. The heat sink as claimed in claim 2, wherein the cross-sectional area of the first receiving cavity increases from the right end of the first receiving cavity to the left end of the first receiving cavity, and the number of the spoilers of each set of the flow equalizing structures increases from the right end of the first receiving cavity to the left end of the first receiving cavity.
5. The heat sink of claim 2, wherein a fluid focus chamber is provided in the housing, the fluid focus chamber being provided between the flow path structure and the outlet.
6. The heat sink of claim 5, wherein the cross-sectional area of the fluid focus chamber decreases from the right end of the fluid focus chamber to the left end of the fluid focus chamber.
7. The heat sink of claim 5, wherein the fluid concentration chamber is in communication with the second receiving chamber, and wherein an inner wall of the fluid concentration chamber is connected to an inner wall of the second receiving chamber by a fillet.
8. The heat sink of any one of claims 1-4, wherein the flow channel structure comprises a plurality of flow channel plates, and the heat dissipation flow channel is formed between two adjacent flow channel plates.
9. The heat sink of any one of claims 1-4, wherein the heat sink further comprises a cooling medium, the cooling medium being a phase change medium.
10. The heat sink of claim 9, wherein the cooling medium is a fluorinated liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911374355.6A CN110996630A (en) | 2019-12-26 | 2019-12-26 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911374355.6A CN110996630A (en) | 2019-12-26 | 2019-12-26 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110996630A true CN110996630A (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911374355.6A Pending CN110996630A (en) | 2019-12-26 | 2019-12-26 | Heat radiator |
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| Country | Link |
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| CN (1) | CN110996630A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113727589A (en) * | 2021-09-10 | 2021-11-30 | 常州微焓热控科技有限公司 | Water-cooling heat dissipation device |
| CN114294931A (en) * | 2021-11-16 | 2022-04-08 | 长沙汉创新材料科技有限公司 | Drying machine |
| CN114594837A (en) * | 2022-03-14 | 2022-06-07 | 英业达科技有限公司 | CPU liquid cooling plate |
| CN115727532A (en) * | 2022-11-22 | 2023-03-03 | 无锡恒业电热电器有限公司 | High-efficiency micro-channel heater |
| WO2024124624A1 (en) * | 2022-12-13 | 2024-06-20 | 湖北亿纬动力有限公司 | Liquid cooling module and battery pack |
-
2019
- 2019-12-26 CN CN201911374355.6A patent/CN110996630A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113727589A (en) * | 2021-09-10 | 2021-11-30 | 常州微焓热控科技有限公司 | Water-cooling heat dissipation device |
| CN114294931A (en) * | 2021-11-16 | 2022-04-08 | 长沙汉创新材料科技有限公司 | Drying machine |
| CN114594837A (en) * | 2022-03-14 | 2022-06-07 | 英业达科技有限公司 | CPU liquid cooling plate |
| CN114594837B (en) * | 2022-03-14 | 2024-04-16 | 英业达科技有限公司 | CPU liquid cooling plate |
| US12089367B2 (en) | 2022-03-14 | 2024-09-10 | Inventec (Pudong) Technology Corporation | Liquid-cooling plate for CPU |
| CN115727532A (en) * | 2022-11-22 | 2023-03-03 | 无锡恒业电热电器有限公司 | High-efficiency micro-channel heater |
| CN115727532B (en) * | 2022-11-22 | 2023-12-08 | 无锡恒业电热电器有限公司 | High-efficiency micro-channel heater |
| WO2024124624A1 (en) * | 2022-12-13 | 2024-06-20 | 湖北亿纬动力有限公司 | Liquid cooling module and battery pack |
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