CN110996541B - Multi-layer shelf for baking solder resist ink - Google Patents
Multi-layer shelf for baking solder resist ink Download PDFInfo
- Publication number
- CN110996541B CN110996541B CN201911135135.8A CN201911135135A CN110996541B CN 110996541 B CN110996541 B CN 110996541B CN 201911135135 A CN201911135135 A CN 201911135135A CN 110996541 B CN110996541 B CN 110996541B
- Authority
- CN
- China
- Prior art keywords
- frame
- grid
- layer
- vertical
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 26
- 238000007599 discharging Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 description 14
- 229910001220 stainless steel Inorganic materials 0.000 description 14
- 238000001816 cooling Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 238000004512 die casting Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 150000001844 chromium Chemical class 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H3/00—Storage means or arrangements for workshops facilitating access to, or handling of, work tools or instruments
- B25H3/04—Racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a solder resist ink baking multi-layer frame. The invention provides a welding-resistant ink baking multi-layer frame which comprises a base, a bracket, a discharging frame and a connecting assembly. The bracket comprises two parallel vertical frames arranged on the base; the discharging frames are arranged in multiple layers and are sequentially and horizontally stacked on the upper surface of the base, each layer of discharging frame comprises a grid frame and a supporting piece arranged at one end of the grid frame, and frame strips of the grid frame are connected in parallel and level to form a plane for placing the soft and hard combined plates; the connecting component is arranged at the other end of the discharging frame to connect the discharging frame on the vertical frame. Compared with the conventional grid frame woven by the staggered frame strips, the non-planar structure at the crossing points of the grid frame is formed, the frame strips of the welding-resistant ink baking multi-layer frame of the structure are connected in parallel, so that a plane for placing the soft and hard combined plate is formed, and the soft and hard combined plate cannot deform due to uneven part of the multi-layer frame when being placed on the multi-layer frame for baking, and the flatness of the soft and hard combined plate is improved.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a solder resist ink baking multi-layer frame.
Background
Along with the development of the electronic industry, the application of the camera module is more and more extensive, and along with the pursuit of people for more exquisite electronic products, the camera module is developed towards the direction of convenience and light weight. The camera module often adopts a soft and hard combined plate, and the soft and hard combined plate is used as a carrier plate of the camera of the electronic product, and the function and the performance of the soft and hard combined plate determine the quality of the whole product and the competitiveness of enterprises. For example, in daily life, people have higher requirements on photographing quality of a mobile phone and even have imaging capability of a single-lens reflex camera, but at present, the single-lens reflex camera of the mobile phone is limited by the size problem and cannot meet the requirements of people, more and more manufacturers develop in the double photographing direction, the requirement of double photographing on coaxiality of the two cameras is very high, and the flatness of the soft and hard combined plate is a key factor influencing the coaxiality of the cameras, so manufacturers of various components have higher flatness requirements on the soft and hard combined plate.
In the processing process of the rigid-flex board, the rigid-flex board subjected to spray coating or screen printing or curtain coating is required to be placed on a plugboard frame for airing or drying, and the traditional plugboard frame is vertically designed; because the sprayed ink is low in viscosity and strong in fluidity, when the soft and hard combined plate is placed on the plugboard frame, the ink can flow downwards under the self gravity, so that the defects of thin circuit oil, vertical flow and the like are caused, and the quality of the solder resist ink of the soft and hard combined plate is greatly influenced.
In order to solve the technical problem, chinese patent document CN 208977778U discloses a V-shaped multi-layer frame for placing a sprayed circuit board, the multi-layer frame is a mesh surface formed by stainless steel pipes, so that the contact area between the multi-layer frame and the circuit board is small, the ink sagging and the ink contact loss are reduced, and the V-shaped angle is adjustable to meet the size of the placed circuit board. However, when the rigid-flex board is placed on the multi-layer frame of the structure for airing or baking, the rigid-flex board and the multi-layer frame deform to different degrees when being subjected to thermal stress, so that the rigid-flex board is easy to generate plate warping and poor in flatness; in addition, the applicant also finds that in the cooling process, the cooling rate of the stainless steel pipe is faster than that of the soft and hard combined plate, and the deformation recovery degree of the stainless steel pipe and the soft and hard combined plate is inconsistent, so that the plate warping phenomenon generated by the soft and hard combined plate is not improved.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defects that the flatness of the rigid-flex board is poor and difficult to recover when the conventional multi-layer frame is used for baking the rigid-flex board, so as to provide the solder mask ink baking multi-layer frame which can reduce the plate warping phenomenon when the rigid-flex board is baked and is helpful for improving the flatness when the temperature is reduced.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a solder resist ink baking multi-layer frame, which comprises:
A base;
The bracket comprises two parallel vertical frames arranged on the base;
The discharging frames are arranged in multiple layers and are sequentially and horizontally stacked on the upper surface of the base, each layer of discharging frame comprises a grid frame and a supporting piece arranged at one end of the grid frame, and all frame strips forming the grid frame in an interweaving mode are connected in a flush mode to form a plane for placing the soft and hard combined plates;
the connecting component is arranged at the other end of the grid frame to connect the grid frame to the vertical frame;
each layer of supporting piece is abutted against the lower layer of supporting piece or the upper surface of the base, and forms a preset gap with the lower layer of discharging frame or the upper surface of the base together with the connecting component.
Preferably, the solder resist ink of the structure is baked into a multi-layer frame, and the grid frame is formed by die casting.
Preferably, the solder resist ink of the structure is used for baking the multi-layer frame, and the material of the grid frame is an alloy taking aluminum as a main material.
Further preferably, the solder resist ink of the structure toasts the multi-layered frame, the grid is rectangular, and the frame strips forming the grid are connected with each other vertically and horizontally.
Further preferably, the solder resist ink baking multi-layer frame of the structure, the cross section of the frame strip along the direction vertical to the length direction of the frame strip is rectangular.
Further preferably, the solder resist ink of the structure toasts the multi-layer frame, and the cross part of the frame strip is provided with a through hole.
Further preferably, the solder resist ink baking multi-layer frame of the structure is provided with a plurality of layers of opposite first bolt holes on two vertical frames along the height direction of the vertical frames;
opposite third bolt holes are formed in the outermost frame edge of the grid frame;
The connecting assembly comprises a cylindrical pin, a threaded sleeve and bolts matched with the threaded sleeve, wherein the outer diameter of one end of the cylindrical pin is not larger than the inner diameter of a first bolt hole, the outer diameter of the other end of the cylindrical pin is not larger than the inner diameter of a third bolt hole, the outer diameter of the threaded sleeve is not larger than the inner diameter of the third bolt hole, the outer diameter of the threaded sleeve is larger than the inner diameter of the first bolt hole, one end of a discharging frame extends into a gap between vertical frames and is pivoted with the two vertical frames through the cylindrical pin, the threaded sleeve and the bolts respectively.
Further preferably, the solder resist ink baking multi-layered frame of the structure comprises a first vertical plate and a second vertical plate which are vertically arranged to form an L shape, and the first bolt hole is arranged on the first vertical plate.
Further preferably, the solder resist ink baking multi-layer frame of the structure is provided with a plurality of layers of second bolt holes opposite to each other on the two second vertical plates along the height direction of the vertical frame;
The outermost frame edge of the grid frame is also provided with a fourth opposite keyhole;
The connection assembly further includes a perforated pin mated with the fourth keyhole and an elastic member connecting the perforated pin with the second keyhole.
Further preferably, the solder resist ink baking multi-layer frame of the structure, and the lower surface of the base is provided with universal wheels.
The technical scheme of the invention has the following advantages:
1. the invention provides a welding-resistant ink baking multi-layer frame which comprises a base, a bracket, a discharging frame and a connecting assembly. Wherein the bracket comprises two parallel vertical frames arranged on the base; the discharging frames are arranged in multiple layers and are sequentially and horizontally stacked on the upper surface of the base, each layer of discharging frame comprises a grid frame and a supporting piece arranged at one end of the grid frame, and frame strips of the grid frame are connected in parallel and level to form a plane for placing the soft and hard combined plates; the connecting component is arranged at the other end of the discharging frame to connect the discharging frame on the vertical frame.
Compared with a conventional grid frame woven by frame strips in a staggered manner, the frame strips at the crossing points are not on the same plane, and the frame strips of the welding-resistant ink baking multi-layer frame are connected in a flush manner to form a plane for placing a soft and hard combined plate, so that the soft and hard combined plate cannot deform due to uneven part of the multi-layer frame when the soft and hard combined plate is placed on the multi-layer frame of the structure for baking, and the flatness of the soft and hard combined plate is improved.
Simultaneously, every layer of support piece supports and leans on lower floor's support piece or base upper surface to form predetermined clearance with this layer of blowing frame and lower floor's blowing frame or base upper surface jointly with coupling assembling, the welding-resistant ink of this structure toasts the thousand layers frame and can supply multilayer soft or hard combination board to place to toast, and every layer separates, and each other does not influence, under the prerequisite of guaranteeing its roughness, is heated evenly, has improved and toasts efficiency.
2. The welding-resistant ink baking multi-layer frame provided by the invention has the advantages that the grid frame is formed by die casting, and compared with welded connection, the die casting has small dimensional tolerance and high precision, so that the surface of the grid frame of the structure is smoother, and the flatness of the rigid-flex board can be effectively improved.
3. According to the welding-resistant ink baking multi-layer frame, the grid frame is made of the alloy taking aluminum as the main material, compared with the conventional stainless steel material, the alloy taking aluminum as the main material is low in cooling rate in the cooling process and basically consistent with the cooling rate of the soft and hard combined plate, and the deformation recovery degree of the alloy is basically consistent in the cooling process, so that the plate warping phenomenon generated by the soft and hard combined plate is improved.
4. The welding-resistant ink baking multi-layer frame provided by the invention has the advantages that the grid frame is detachably connected with the vertical frame through the cylindrical pins, the threaded sleeves and the bolts, the assembly and the disassembly are convenient, the welding-resistant ink baking multi-layer frame is stable and durable, and the on-site adjustment is not needed.
5. The welding-resistant ink baking multi-layer frame provided by the invention has the advantages that the connecting component further comprises the pin with the hole, which is matched with the fourth bolt hole, and the elastic piece, which is used for connecting the belt Kong Zhuxiao with the second bolt hole, so that the material placing frame can be turned over conveniently, the rigid-flex board placed on the lower material placing frame is exposed in front of a worker, and the worker can take and place the rigid-flex board conveniently.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a baking multi-layered frame for solder resist ink according to embodiment 1 of the present invention;
Fig. 2 is a schematic diagram of a support structure provided in embodiment 1 of the present invention;
fig. 3 is a schematic view of a grid and bracket mounting structure according to embodiment 1 of the present invention;
Fig. 4 is a schematic view of a mounting structure of a grid and a connection assembly according to embodiment 1 of the present invention;
fig. 5 is a schematic diagram of a grid structure provided in embodiment 1 of the present invention;
Reference numerals illustrate:
1-a base; 11-a bottom plate; 12-rolling wheels;
2-a bracket; 21-a vertical frame; 211-a first riser; 2111-first peg holes; 212-a second riser; 2121-second peg holes; 22-a cross frame; 23-armrests;
3-a discharging frame; 31-a grid; 311-frame bars; 312-through holes; 313-third bolt holes; 314-fourth key holes; 32-a support;
a 4-connection assembly; 41-a cylindrical pin; 42-a screw sleeve; 43-bolts; 44-band Kong Zhuxiao; 45-elastic member.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Example 1
The embodiment provides a solder resist ink baking rack, which comprises a base 1, a bracket 2, a discharging rack 3 and a connecting component 4 as shown in figures 1, 2 and 3.
As shown in fig. 2, the base 1 includes a bottom plate 11 and rollers 12. The bottom plate 11 is a rectangular flat plate made of stainless steel, has the length of 690mm and the width of 650mm, and is used for bearing the soft and hard combined plate for baking; the bottom surface of the bottom plate 11 is provided with 4 rollers 12, which facilitate the movement of the base 1.
As shown in fig. 2, the stand 2 includes a vertical frame 21, a horizontal frame 22, and an armrest 23. As shown in fig. 4, two vertical frames 21 are provided, each vertical frame 21 includes a first vertical plate 211 and a second vertical plate 212, the first vertical plate 211 and the second vertical plate 212 are integrally formed and are in an L-shaped structure, the vertical frames 21 are made of stainless steel, and the length is 1410mm. The two first vertical plates 211 are oppositely arranged, the lower ends of the two first vertical plates are respectively attached and fixed on the side wall surface of the bottom plate 11, and the two vertical frames 21 are parallel and are perpendicular to the upper surface of the bottom plate 11; the first riser 211 is fixed to the side wall surface of the bottom plate 11 by welding or bolts, and in this embodiment, welding is selected. In the height direction, a plurality of layers of opposite first bolt holes 2111 are formed in the two first vertical plates 211, a plurality of layers of opposite second bolt holes 2121 are formed in the two second vertical plates 212, and the apertures of the first bolt holes 2111 and the second bolt holes 2121 are equal; with the upper surface of the bottom plate 11 as a zero height reference plane, N layers of first bolt holes 2111 and second bolt holes 2121 are arranged together, the height intervals of each layer are equal and are 19mm, and the heights of the first bolt holes 2111 and the second bolt holes 2121 belonging to the same layer are the same.
To increase the stability of the two vertical frames 21, a transverse frame 22 is disposed at the upper end and the middle end of the two vertical frames 21, and as shown in fig. 2, the transverse frame 22 is fixed on the two first vertical plates 211 by welding or bolts, in this embodiment, welding is selected; the cross frame 22 is made of stainless steel.
In order to facilitate the movement of the base 1 by the staff, an armrest 23 is further disposed between the two vertical frames 21, as shown in fig. 2, the armrest 23 is a cross bar, and two ends of the armrest are fixed on the two second vertical plates 212 by welding or bolts, in this embodiment, welding is selected; the armrest 23 is made of stainless steel.
As shown in fig. 1 and 2, the discharging frame 3 is horizontally placed on the upper surface of the base 1, and the upper surface is used for directly placing the soft and hard combined board to be dried. The soft and hard combined plate can produce ink sagging and plate warping phenomena in the baking process, so that the problem is avoided, the discharging frame 3 is required to be horizontally placed on the upper surface of the base 1, and the smooth and parallel level of the contact surface of the discharging frame 3 and the soft and hard combined plate is ensured, and the soft and hard combined plate is free from bulges and pits. The conventional discharging frame is formed by transversely and longitudinally weaving stainless steel wires, two stainless steel wires are staggered up and down at the crossing point and are not planar, and when the soft and hard combined plate is placed on the discharging frame for baking, the soft and hard combined plate is deformed due to the influence of a non-planar structure at the crossing point of the two stainless steel wires of the conventional discharging frame and has poor flatness; even if a woven structure is not adopted, a plurality of sections of stainless steel wires are welded into a grid structure, but due to the existence of welding spots, the structure is also non-planar, and the soft and hard combined plate is deformed.
As shown in fig. 4 and 5, the discharge rack 3 includes a grid 31 and a support 32. The grid frame 31 is formed by die casting, and a plurality of frame edges 311 are interwoven and flush and connected to form a plane for placing the soft and hard combined plate, so that the problem of local unevenness caused by conventional staggered connection and welding is solved, and the deformation degree of the soft and hard combined plate caused by baking is reduced to the minimum. Specifically, the grid 31 has a rectangular shape as a whole, and has a length of 670mm and a width of 640mm; the frame bars 311 forming the grid 31 are connected vertically and horizontally, and the frame bars 311 have a rectangular parallelepiped structure, i.e., a rectangular cross section along a direction perpendicular to the length direction thereof.
The applicant finds that deformation of the rigid-flex board caused by baking can be recovered in the cooling process, the grid frame 31 made of conventional stainless steel is adopted, the cooling rate of the stainless steel is higher than that of the rigid-flex board, and the deformation recovery degree of the rigid-flex board and the grid frame is inconsistent, so that the deformation of the rigid-flex board cannot be improved, and even secondary deformation occurs. Through multiple experiments, the applicant creatively discovers that the cooling rate of the grid frame 31 adopting aluminum as a main material is lower in the cooling process and the cooling process, and is basically consistent with that of the soft and hard combined plate, so that the deformation recovery degree of the grid frame 31 and the soft and hard combined plate is basically consistent in the cooling process, and the plate warping phenomenon generated by the soft and hard combined plate is improved. In this embodiment, the mesh 31 is AlSi12 (Fe).
In order to prevent the ink of the rigid-flex board from corroding the grid 31, the surface of the grid 31 made of aluminum as a main material is treated, such as galvanized or chromium salt.
In order to reduce the weight of the grid 31 itself, through holes 312 are provided at the intersections of the frame bars 311.
Sequentially and horizontally stacking a plurality of layers of grid frames 31 on the base 1 along the height direction of the support 2, wherein a support piece 32 is required to be arranged in order to ensure preset gaps between the first layer of grid frames 31 and the upper surface of the base 1 and between the upper layer of grid frames 31 and the lower layer of grid frames 31; meanwhile, in order to ensure the stability of the stacked arrangement of the grid frames 31 of each layer, each layer of grid frames 31 needs to be fixed on the support 2 one by one.
As shown in fig. 4, the supporting members 2 are provided at both corners of one end of each layer of the mesh frame 31, the first layer of the mesh frame 31 is abutted against the upper surface of the base 1 through the supporting members 32, and then the remaining layers of the mesh frame 31 are abutted against the lower layer of the supporting members 32 through the supporting members 32 of the layer, while the other end of each layer of the mesh frame 31 is fixed one by one to the support 2.
In order to stably fix the other end of the grid 31 to the bracket 2, the outermost frame strip 311 of the grid 31 is provided with a third and fourth opposed bolt holes 313 and 314.
As shown in fig. 4, the connection assembly 4 is provided at the third and fourth key holes 313 and 314 at the other end of the grid 31 to fix the grid 31 to the vertical frame 21, and the connection assembly 4 includes a cylindrical pin 41, a threaded sleeve 42, a bolt 43, a strap Kong Zhuxiao and an elastic member 45.
The cylindrical pin 41 has a cylindrical structure, one end of which has an outer diameter not larger than the inner diameter of the first bolt hole 2111 and the other end of which has an outer diameter not larger than the inner diameter of the third bolt hole 313; the threaded sleeve 42 is an internally threaded sleeve having an outer diameter no greater than the inner diameter of the third bolt hole 313 and greater than the inner diameter of the first bolt hole 2111; the bolt 43 is engaged with the nut 42. During installation, one end of the cylindrical pin 41 extends into one third bolt hole 313 of the grid frame 31, the threaded sleeve 42 extends into the other third bolt hole 313, then the grid frame 31 (one end provided with the third bolt hole 313) extends into a gap between the two vertical frames 21, the other end of the cylindrical pin 41 extends into one first bolt hole 2111 of one first vertical plate 211, the threaded sleeve 42 abuts against the inner side wall surface of the other first vertical plate 211, and finally the bolt 43 extends from the outer side of the first vertical plate 211 from the first bolt hole 2111 and is in threaded fit with the threaded sleeve 42, so that the grid frame 31 and the vertical frames 21 can be pivoted.
For convenience of the staff to turn the grid 31, as shown in fig. 3, two belts Kong Zhuxiao and 44 are respectively inserted into the fourth opposite bolt holes 314, then one end of an elastic member 45 is connected into the hole of the belt Kong Zhuxiao, and the other end is connected into the second bolt hole 2121 of the second riser 212 on the same side, so that the staff can conveniently turn the grid 31, the rigid-flex board placed on the lower grid 31 is exposed in front of the staff, and the staff can conveniently take and place the rigid-flex board.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (8)
1. A solder mask ink bake out multi-layered shelf comprising:
A base;
The bracket comprises two parallel vertical frames arranged on the base;
The discharging frames are arranged in multiple layers and are sequentially and horizontally stacked on the upper surface of the base, each layer of discharging frame comprises a grid frame and a supporting piece arranged at one end of the grid frame, and all frame strips forming the grid frame in an interweaving mode are connected in a flush mode to form a plane for placing the soft and hard combined plates; the material of the grid frame is AlSi12 (Fe);
the connecting component is arranged at the other end of the grid frame to connect the grid frame to the vertical frame;
each layer of supporting piece is abutted against the lower layer of supporting piece or the upper surface of the base, and forms a preset gap with the lower layer of discharging frame or the upper surface of the base together with the connecting component;
along the height direction of the vertical frames, a plurality of layers of opposite first bolt holes are arranged on the two vertical frames;
opposite third bolt holes are formed in the outermost frame edge of the grid frame;
The connecting assembly comprises a cylindrical pin, a threaded sleeve and bolts matched with the threaded sleeve, wherein the outer diameter of one end of the cylindrical pin is not larger than the inner diameter of a first bolt hole, the outer diameter of the other end of the cylindrical pin is not larger than the inner diameter of a third bolt hole, the outer diameter of the threaded sleeve is not larger than the inner diameter of the third bolt hole, the outer diameter of the threaded sleeve is larger than the inner diameter of the first bolt hole, one end of the discharging frame extends into a gap between the vertical frames and is pivoted with the two vertical frames through the cylindrical pin, the threaded sleeve and the bolts respectively;
The vertical frame comprises second vertical plates which are vertically arranged, and a plurality of layers of second bolt holes which are opposite are formed in the two second vertical plates along the height direction of the vertical frame;
The outermost frame edge of the grid frame is also provided with a fourth opposite keyhole;
The connection assembly further includes a perforated pin mated with the fourth keyhole and an elastic member connecting the perforated pin with the second keyhole.
2. The solder mask ink baked multi-layered rack of claim 1, wherein the mesh rack is die-cast.
3. The solder resist ink baking multi-layered frame according to claim 1 or 2, wherein the material of the mesh frame is an alloy based on aluminum.
4. A solder resist ink baking multi-layered rack according to claim 3, wherein the grid is rectangular, and frame strips forming the grid are connected vertically to each other.
5. The solder resist ink baking multi-layer frame as claimed in claim 4, wherein the frame strip has a rectangular cross section perpendicular to the length direction of the frame strip.
6. The solder resist ink baking multi-layer shelf of claim 5, wherein the cross of the frame strip is provided with a through hole.
7. The solder resist ink baking multi-layer frame as claimed in claim 1, wherein the vertical frame further comprises a first vertical plate vertically disposed, the first vertical plate and the second vertical plate forming an L-shape, the first stud hole being disposed on the first vertical plate.
8. The solder resist ink baking multi-layer shelf of claim 1, wherein the lower surface of the base is provided with rollers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911135135.8A CN110996541B (en) | 2019-11-19 | 2019-11-19 | Multi-layer shelf for baking solder resist ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911135135.8A CN110996541B (en) | 2019-11-19 | 2019-11-19 | Multi-layer shelf for baking solder resist ink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110996541A CN110996541A (en) | 2020-04-10 |
| CN110996541B true CN110996541B (en) | 2024-05-03 |
Family
ID=70085012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911135135.8A Active CN110996541B (en) | 2019-11-19 | 2019-11-19 | Multi-layer shelf for baking solder resist ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110996541B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100778665B1 (en) * | 2006-08-09 | 2007-11-23 | 주식회사 심텍 | Construction method for perimeter of thin plate rigid pcb |
| CN203523153U (en) * | 2013-09-24 | 2014-04-02 | 深圳诚和电子实业有限公司 | Flexible plate horizontally-placed baking jig |
| CN204031601U (en) * | 2014-07-19 | 2014-12-17 | 信丰福昌发电子有限公司 | A kind of removable heat radiation thousand laminated frame devices |
| CN204291608U (en) * | 2014-12-08 | 2015-04-22 | 东莞美维电路有限公司 | Thousand layers of frame |
| CN206585836U (en) * | 2017-03-15 | 2017-10-24 | 中山市文成电路板有限公司 | A kind of thousand layer frames toasted for wiring board |
| CN211378402U (en) * | 2019-11-19 | 2020-08-28 | 常熟东南相互电子有限公司 | Solder resist ink baking multi-layer rack |
-
2019
- 2019-11-19 CN CN201911135135.8A patent/CN110996541B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100778665B1 (en) * | 2006-08-09 | 2007-11-23 | 주식회사 심텍 | Construction method for perimeter of thin plate rigid pcb |
| CN203523153U (en) * | 2013-09-24 | 2014-04-02 | 深圳诚和电子实业有限公司 | Flexible plate horizontally-placed baking jig |
| CN204031601U (en) * | 2014-07-19 | 2014-12-17 | 信丰福昌发电子有限公司 | A kind of removable heat radiation thousand laminated frame devices |
| CN204291608U (en) * | 2014-12-08 | 2015-04-22 | 东莞美维电路有限公司 | Thousand layers of frame |
| CN206585836U (en) * | 2017-03-15 | 2017-10-24 | 中山市文成电路板有限公司 | A kind of thousand layer frames toasted for wiring board |
| CN211378402U (en) * | 2019-11-19 | 2020-08-28 | 常熟东南相互电子有限公司 | Solder resist ink baking multi-layer rack |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110996541A (en) | 2020-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9736963B2 (en) | Cold plate, forming in particular a structural part of an item of equipment having heat-generating components | |
| CN110996541B (en) | Multi-layer shelf for baking solder resist ink | |
| CN211378402U (en) | Solder resist ink baking multi-layer rack | |
| EP2674659A2 (en) | Holder for a display panel and display device including the same | |
| CN207589281U (en) | A kind of wiring board and camera module | |
| CN210868312U (en) | Circuit board that barrier propterty is strong | |
| CN218252045U (en) | PCBA board string bag basket formula fast-assembling washing frock | |
| CN108518057A (en) | A kind of scaffold board | |
| KR200463961Y1 (en) | Combination structure of vertical frame for communication rack | |
| CN202188012U (en) | Connecting device | |
| CN207763095U (en) | Cabinet air-conditioner | |
| CN209794819U (en) | Warped substrate convenient for surface mounting processing | |
| CN113993282A (en) | PCB pad design method, PCB pad and PCB | |
| US7107901B2 (en) | Method and apparatus for rapid cooling of metal screening masks | |
| CN216357440U (en) | Installation-convenient circuit board with multilayer plate structure | |
| CN110331364B (en) | Vapor plating metal mask plate | |
| CN109862696A (en) | A kind of circuit board preventing desoldering and installation easy to disassemble | |
| TWI662734B (en) | Battery holder and its side frame | |
| CN205529115U (en) | Heavy copper basket | |
| KR101209671B1 (en) | A Basket Device for Electrless of thin Printed Circuit Board | |
| CN205491461U (en) | Circuit board roast board frame | |
| CN219395121U (en) | Double-sided PCB circuit board with anti-warping structure | |
| CN221012661U (en) | Showcase | |
| CN218388370U (en) | Electromagnetic induction power cabinet | |
| CN217741976U (en) | Corrosion-resistant circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |