CN110993776A - LED support manufacturing method and LED support - Google Patents
LED support manufacturing method and LED support Download PDFInfo
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- CN110993776A CN110993776A CN201911266968.8A CN201911266968A CN110993776A CN 110993776 A CN110993776 A CN 110993776A CN 201911266968 A CN201911266968 A CN 201911266968A CN 110993776 A CN110993776 A CN 110993776A
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- main body
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- injection mold
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 97
- 229910052751 metal Inorganic materials 0.000 claims abstract description 97
- 239000004033 plastic Substances 0.000 claims abstract description 62
- 238000005520 cutting process Methods 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 57
- 238000009713 electroplating Methods 0.000 claims abstract description 51
- 238000002347 injection Methods 0.000 claims abstract description 47
- 239000007924 injection Substances 0.000 claims abstract description 47
- 238000001746 injection moulding Methods 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 40
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 239000007769 metal material Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 238000005406 washing Methods 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000007605 air drying Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 27
- 229910052709 silver Inorganic materials 0.000 abstract description 27
- 239000004332 silver Substances 0.000 abstract description 27
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000002585 base Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
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- 238000005260 corrosion Methods 0.000 description 2
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- 238000010891 electric arc Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a manufacturing method of an LED bracket, which comprises the following steps: and (3) stamping a terminal: stamping the metal material to obtain a metal terminal; injection molding; sealing the metal terminal in an injection mold, injecting a liquid thermosetting material into the injection mold, and heating the injection mold to cure and mold the thermosetting material on the metal terminal to obtain a plastic main body; cutting a water gap: cutting off a water gap on the plastic main body; cutting feet: cutting the pin part of the metal terminal extending out of the plastic main body to trim the shape; electroplating: and electroplating the surface of the metal terminal extending out of the plastic main body. The invention also provides the LED bracket obtained by the manufacturing method of the LED bracket. The invention has the beneficial effects that: after injection molding and pin cutting, electroplating is carried out, the electroplating area is reduced, the electroplating cost is reduced, a silver layer formed by electroplating is protected, the surface reflection degree of the metal terminal is protected, the binding force between the metal terminal and plastic is improved, and the air tightness of a product is improved.
Description
Technical Field
The invention relates to the technical field of LED production, in particular to a method for manufacturing an LED bracket and the LED bracket.
Background
An LED (Light Emitting Diode) is a common Light Emitting device, and the operating principle thereof is to emit Light by energy released by electron and hole recombination, and the LED has a wide application in the field of illumination. The LED can efficiently convert electric energy into light energy, and has wide application in modern society, such as lamp illumination, display screens, medical devices, or various light indicating tools and the like. Currently, in the field of lamp lighting, an LED chip is generally mounted on an LED support to form an LED lamp.
The LED mount is typically a plastic body that is injection molded over the metal terminals. The traditional LED bracket manufacturing process comprises the following steps: stamping terminal → electroplating → injection molding → cutting foot → finished product, its defect lies in: the hardware terminal is electroplated before injection molding, and the electroplating cost of the whole terminal surface is high; the contact between the mould core and the electroplating terminal in the injection molding process can damage the silver layer and influence the light reflection degree; the surface smoothness of the silver-plated terminal is larger than that of an unplated terminal, so that the bonding force between the terminal and plastic is insufficient, and the air tightness of a product is poor.
Disclosure of Invention
Based on the method, after injection molding and pin cutting, electroplating is carried out, the electroplating area is reduced, the electroplating cost is reduced, a silver layer formed by electroplating is protected, the surface reflection degree of a metal terminal is protected, the bonding force between the metal terminal and plastic is improved, and the air tightness of a product is improved.
A manufacturing method of an LED bracket comprises the following steps:
and (3) stamping a terminal: stamping the metal material to obtain a metal terminal;
injection molding; sealing the metal terminal in an injection mold, injecting a liquid thermosetting material into the injection mold, and heating the injection mold to cure and mold the thermosetting material on the metal terminal to obtain a plastic main body;
cutting a water gap: cutting off a water gap on the plastic main body;
cutting feet: cutting the pin part of the metal terminal extending out of the plastic main body to trim the shape;
electroplating: and electroplating the surface of the metal terminal extending out of the plastic main body.
According to the manufacturing method of the LED support, after the terminal is stamped, the metal terminal is subjected to injection molding, and the plastic main body is formed on the metal terminal in a thermosetting molding mode, so that the sealing performance of the product is enhanced. Then, after the water cutting opening and the pin cutting, electroplating treatment is carried out, at the moment, the surface of the metal terminal wrapped in the plastic main body does not need to be electroplated, the electroplating area can be reduced, and the cost is reduced. Electroplating after injection moulding and pin cutting, the silver layer of electroplating gained can not be because of injection moulding and pin cutting damage, and the surperficial reflection of light degree of metal terminal is not influenced to, when injection moulding, the surface of metal terminal can not reduce the cohesion of metal terminal and plastic because of the silver layer of electroplating, can improve the gas tightness of product. Through above-mentioned design, after injection moulding and pin cutting, electroplate, reduce the area of electroplating, reduce the electroplating cost, the silver layer of protection electroplating formation, the surperficial reflection of light degree of protection metal terminal improves the cohesion of metal terminal and plastic, improves the gas tightness of product.
In one embodiment, in the step of injection Molding, the thermosetting material is an SMC (Silicon Molding Compound) material and is in a liquid state at normal temperature. After the SMC material is subjected to high-temperature one-time compression molding, the SMC material has the advantages of high mechanical strength, light material weight, corrosion resistance, long service life, high insulating strength, electric arc resistance, strong flame retardance, good sealing performance, no water absorption and the like, improves the design flexibility of products, is easy for large-scale production, is safe and attractive, and can meet various outdoor severe environments. Besides, the SMC material is changed into a liquid state at normal temperature, has good fluidity when being injected into an injection mold, can better fill a cavity of the injection mold, can be tightly combined with the surface of the metal terminal after being cured and molded, and improves the sealing property of a product.
In one embodiment, in the step of injection molding, after the injection of the thermosetting material, the pressure in the cavity of the injection mold is maintained at 8kPa to 10 kPa.
In one embodiment, in the step of injection molding, after the injection of the thermosetting material, the injection mold is heated to 130 ℃ to 150 ℃.
In one embodiment, in the step of injection molding, after the metal terminals are sealed in the injection mold, and before the thermosetting material is injected, the injection mold is vacuumized. The vacuumizing treatment can reduce the resistance suffered by the thermosetting material during injection, ensure that the thermosetting material can fill the cavity of the injection mold and reduce the probability of air bubbles after thermosetting.
In one embodiment, in the step of punching the terminal, the punched metal terminal is plural and connected together in pieces; and, between the step of stamping the terminal and the step of injection molding, further comprising the steps of: slicing: and cutting the metal terminals which are connected together in a sheet mode, so that each cut metal terminal can be placed into the injection mold in a whole sheet mode. When the terminal is stamped, a large-area metal sheet can be stamped. And when injection moulding, the metal terminal that will become the piece is cut into slices and is cut apart, guarantees that every metal terminal can both be wrapped up by injection mold and sealed, is favorable to mass production.
In one embodiment, between the step of cutting the water gap and the step of cutting the foot, the method further comprises the following steps: cleaning: and cleaning the plastic main body to remove burrs on the surface of the plastic main body. After injection moulding, burrs may remain on the surface of the plastic main body, and because the volume of most of the existing LED supports is small, the burrs are difficult to remove by grinding, and therefore, cleaning and deburring can be adopted.
In one embodiment, the step of cleaning comprises the steps of: and carrying out chemical cleaning, electrolytic cleaning, high-pressure water spraying, ultrasonic water washing, hot water washing, air drying and drying treatment on the LED support in sequence.
In one embodiment, in the step of cutting the water gap, the water gap on the plastic body is cut by a cutting jig. Adopt and cut off the tool and can improve the efficiency of cutting the mouth of a river.
Meanwhile, the invention also provides an LED bracket.
An LED bracket is manufactured by adopting the manufacturing method of the LED bracket in any embodiment.
Above-mentioned LED support, at the in-process of preparation, after the punching press terminal, carry out injection moulding to the metal terminal earlier to adopt thermosetting shaping's mode, the plastic main part is gone up to shaping on the metal terminal, strengthens the leakproofness of product. Then, after the water cutting opening and the pin cutting, electroplating treatment is carried out, at the moment, the surface of the metal terminal wrapped in the plastic main body does not need to be electroplated, the electroplating area can be reduced, and the cost is reduced. Electroplating after injection moulding and pin cutting, the silver layer of electroplating gained can not be because of injection moulding and pin cutting damage, and the surperficial reflection of light degree of metal terminal is not influenced to, when injection moulding, the surface of metal terminal can not reduce the cohesion of metal terminal and plastic because of the silver layer of electroplating, can improve the gas tightness of product. Through above-mentioned design, after injection moulding and pin cutting, electroplate, reduce the area of electroplating, reduce the electroplating cost, the silver layer of protection electroplating formation, the surperficial reflection of light degree of protection metal terminal improves the cohesion of metal terminal and plastic, improves the gas tightness of product.
Drawings
Fig. 1 is a flowchart of a method for manufacturing an LED support according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Fig. 1 shows a method for manufacturing an LED support according to an embodiment of the present invention.
As shown in fig. 1, the method for manufacturing the LED support includes the steps of:
s10: and (3) stamping a terminal: and stamping the metal material to obtain the metal terminal.
The metal material is selected, generally sheet material, and is subjected to stamping forming through stamping equipment, wherein the stamping forming comprises bending and punching, so that the metal material is formed into the metal terminal.
S20: injection molding: the metal terminal is sealed in an injection mold, the liquid thermosetting material is injected into the injection mold, and the injection mold is heated so that the thermosetting material is cured and molded on the metal terminal to obtain the plastic main body.
After waiting for the metal terminal, the metal terminal is entirely put into the injection mold so that the metal terminal is sealed by the injection mold. Next, the liquid thermosetting material is injected into the injection mold, for example, into a cavity of the injection mold through a needle valve provided with a liquid flow passage. Different from a hot-melt material, the thermosetting material is formed by heating and curing, so that the liquid thermosetting material is filled in a cavity of the injection mold, the thermosetting material is contacted with the metal terminal in a flowing liquid state, and the bonding force between metal and plastic is improved. After the material is injected, the injection mold is heated, so that the thermosetting material reaches a preset curing temperature, the thermosetting material is changed from a liquid state to a solid state, and a plastic main body attached to the metal terminal is formed, namely the metal terminal is embedded in the plastic main body. It should be noted that, during injection molding, it is necessary to provide a portion of the metal terminal extending outside the plastic body, for example, corresponding to the electrical connection portion between the pin of the LED support and the bottom of the lamp cup.
In the present embodiment, as the thermosetting type material used in step S20, an SMC material is preferable and is liquid at ordinary temperature. After the SMC material is subjected to high-temperature one-time compression molding, the SMC material has the advantages of high mechanical strength, light material weight, corrosion resistance, long service life, high insulating strength, electric arc resistance, strong flame retardance, good sealing performance, no water absorption and the like, improves the design flexibility of products, is easy for large-scale production, is safe and attractive, and can meet various outdoor severe environments. Besides, the SMC material is changed into a liquid state at normal temperature, has good fluidity when being injected into an injection mold, can better fill a cavity of the injection mold, can be tightly combined with the surface of the metal terminal after being cured and molded, and improves the sealing property of a product. The SMC material is in a liquid state at normal temperature, so the SMC material is convenient to store at normal temperature.
Further, in step S20, after the thermosetting material is injected, the pressure in the cavity of the injection mold is maintained at 8kPa to 10 kPa. In order to prevent bubbles or cavities from being generated during the curing of the SMC material, the SMC material is subjected to thermosetting molding under a preset pressure in a pressure maintaining mode. For example, in the present embodiment, the preset pressure is 9kPa, and in other embodiments, the preset pressure may be 8kPa, 8.5kPa, 9.5kPa, or 10kPa, or another value within 8kPa to 10 kPa.
In step S20, the injection mold is heated to 130 to 150 ℃ after the thermosetting material is injected. For thermosetting molding of SMC material, the curing temperature can be set to 140 ℃, 130 ℃, 135 ℃, 145 ℃, or 150 ℃, or other values within 130 ℃ to 150 ℃.
In step S20, after the metal terminals are sealed in the injection mold, the injection mold is vacuumized before the thermosetting material is injected. The vacuumizing treatment can reduce the resistance suffered by the thermosetting material during injection, ensure that the thermosetting material can fill the cavity of the injection mold and reduce the probability of air bubbles after thermosetting.
Based on the requirement of mass production, in step S10, the punched metal terminals are plural and connected together in pieces; between the step S10 and the step S20, the method further includes the steps of: s12: slicing: and cutting the metal terminals which are connected together in a sheet mode, so that each cut metal terminal can be placed into the injection mold in a whole sheet mode. When the terminal is stamped, a large-area metal sheet can be stamped. And when injection moulding, the metal terminal that will become the piece is cut into slices and is cut apart, guarantees that every metal terminal can both be wrapped up by injection mold and sealed, is favorable to mass production.
S30: cutting a water gap: and cutting off the water gap on the plastic main body.
After injection molding, burrs may remain on the surface of the plastic body due to the presence of a closed seam or a connection seam of the structural member in the injection mold, and after injection molding, corresponding outward extending portions, i.e., burrs, remain.
In order to improve the efficiency, in the present embodiment, in step S30, a cutting jig may be used to cut off the nozzle on the plastic body. The cutting jig can be manufactured in advance according to the shape of the LED support, the LED support is placed into the cutting jig, and then the water gap in the plastic main body is cut off quickly by operating the cutting jig, so that the water gap cutting jig is particularly beneficial to batch water gap cutting treatment of the LED support.
S40: cutting feet: and cutting the pin part of the metal terminal extending out of the plastic main body to trim the shape.
After the water gap is cut, the pin part of the metal terminal extending out of the plastic main body needs to be trimmed, so that the pin part of the metal terminal is trimmed.
On the premise that the thermosetting material is an SMC material, in this embodiment, between step S30 and step S40, the method may further include the steps of: s34: cleaning: and cleaning the plastic main body to remove burrs on the surface of the plastic main body. After injection moulding, the surface of plastic main part may remain the burr, and because the volume of present most LED support is all less, is difficult to carry out the burring through the mode of polishing, consequently, after cutting the mouth of a river, and before cutting the foot, can adopt and wash the burring.
Further, for step S34, the method may include the steps of:
s341: and (5) chemically cleaning. And putting the LED bracket into an alkaline cleaning solution for soaking and cleaning, and saponifying and emulsifying the foreign matters based on alkali to remove the foreign matters attached to the surface of the product.
S342: and (4) electrolytic cleaning. In the process of electrolysis, gas is generated on the surface of the LED bracket to flush the product, and foreign matters and burrs are peeled off from the surface of the LED bracket.
S343: spraying water under high pressure. And peeling off foreign matters and burrs adhered to the surface of the LED support by using the impulsive force of high-pressure water.
S344: and (4) ultrasonic water washing. And soaking and cleaning the LED bracket, and adding ultrasonic waves to increase the cleaning effect.
S345: and (4) washing with hot water. And putting the LED bracket into hot water for soaking and cleaning, and further washing off chemical agents remained on the LED bracket.
S346: and (5) air drying. The product is air-dried, and the phenomenon that watermarks are remained on the surface of the LED support due to direct drying treatment is avoided.
S347: and (5) drying. And drying the product, such as heating wire drying or hot air drying.
Through a plurality of different cleaning processes, burrs and residual foreign matters on the plastic main body are removed, and the surface smoothness of the plastic main body is improved.
S50: electroplating; and electroplating the surface of the metal terminal extending out of the plastic main body.
After the pin is cut, the surface of the metal terminal extending out of the plastic main body needs to be electroplated, so that the surface of the part of the metal terminal exposed out of the plastic main body is covered with the silver layer.
In this embodiment, step S50 may include the steps of:
s51: the LED bracket is subjected to ultrasonic degreasing and electrolytic degreasing treatment, and the purpose is to clean oil stains on the surface of a base material. The product was then washed with water. And (3) after the washing is finished, the product is activated by acid, the oxide on the surface of the base material is removed, the smooth appearance is obtained, the binding force between the base material and the coating is enhanced, and then the washing is carried out.
S52: after the surface of the base material is treated by degreasing, activating and the like, a layer of bottom nickel can be electroplated on the surface of the metal terminal exposed outside the plastic main body, and then the surface is washed by pure water. After cleaning, a layer of copper is electroplated on the nickel layer, and then pure water washing is carried out. Then, a thin layer of acid copper is electroplated on the copper layer to improve the appearance of the product. Then washed with pure water. After cleaning, a layer of nickel is electroplated on the copper layer, and then pure water washing is carried out. After cleaning, before silver plating, the surface of the metal terminal can obtain better bonding force with the silver layer through nickel activation. After cleaning, pre-silvering is carried out, and then pure water washing is carried out. The pre-silver plating is used for plating a thin silver layer on the surface of a product, and is mainly used for helping a base material of a metal terminal and the silver layer to have good bonding force, so that a thick silver plating process is required according to the requirements of customers to meet the requirement of film thickness, and pure water washing is carried out after silver plating.
S53: after the product is washed by pure water, a silver layer is easily polluted in the air, so that a thin protective film is formed on the surface of the product by silver protection, and the performance of the product is improved. After silver protection, pure water washing is needed, and the liquid medicine residues on the surface of the product are cleaned and then dried, so that the defects of water stain, oil stain and the like are not easily generated in the product storage process.
According to the manufacturing method of the LED support, after the terminal is stamped, the metal terminal is subjected to injection molding, and the plastic main body is formed on the metal terminal in a thermosetting molding mode, so that the sealing performance of the product is enhanced. Then, after the water cutting opening and the pin cutting, electroplating treatment is carried out, at the moment, the surface of the metal terminal wrapped in the plastic main body does not need to be electroplated, the electroplating area can be reduced, and the cost is reduced. Electroplating after injection moulding and pin cutting, the silver layer of electroplating gained can not be because of injection moulding and pin cutting damage, and the surperficial reflection of light degree of metal terminal is not influenced to, when injection moulding, the surface of metal terminal can not reduce the cohesion of metal terminal and plastic because of the silver layer of electroplating, can improve the gas tightness of product. Through above-mentioned design, after injection moulding and pin cutting, electroplate, reduce the area of electroplating, reduce the electroplating cost, the silver layer of protection electroplating formation, the surperficial reflection of light degree of protection metal terminal improves the cohesion of metal terminal and plastic, improves the gas tightness of product.
Meanwhile, the invention also provides an LED bracket.
The LED bracket is manufactured by the LED bracket manufacturing method of the embodiment.
For example, in the present embodiment, the LED holder includes: metal terminal and the plastic main part of connecting metal terminal. Wherein, the SMC material of plastic main part for the thermosetting type adheres to on the metal terminal through the mode of injection moulding. And the surface of the metal terminal exposed outside the plastic body is plated to form a silver layer.
Above-mentioned LED support, at the in-process of preparation, after the punching press terminal, carry out injection moulding to the metal terminal earlier to adopt thermosetting shaping's mode, the plastic main part is gone up to shaping on the metal terminal, strengthens the leakproofness of product. Then, after the water cutting opening and the pin cutting, electroplating treatment is carried out, at the moment, the surface of the metal terminal wrapped in the plastic main body does not need to be electroplated, the electroplating area can be reduced, and the cost is reduced. Electroplating after injection moulding and pin cutting, the silver layer of electroplating gained can not be because of injection moulding and pin cutting damage, and the surperficial reflection of light degree of metal terminal is not influenced to, when injection moulding, the surface of metal terminal can not reduce the cohesion of metal terminal and plastic because of the silver layer of electroplating, can improve the gas tightness of product. Through above-mentioned design, after injection moulding and pin cutting, electroplate, reduce the area of electroplating, reduce the electroplating cost, the silver layer of protection electroplating formation, the surperficial reflection of light degree of protection metal terminal improves the cohesion of metal terminal and plastic, improves the gas tightness of product.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of an LED bracket is characterized by comprising the following steps: the method comprises the following steps:
and (3) stamping a terminal: stamping the metal material to obtain a metal terminal;
injection molding: sealing the metal terminal in an injection mold, injecting a liquid thermosetting material into the injection mold, and heating the injection mold to cure and mold the thermosetting material on the metal terminal to obtain a plastic main body;
cutting a water gap: cutting off a water gap on the plastic main body;
cutting feet: cutting the pin part of the metal terminal extending out of the plastic main body to trim the shape;
electroplating: and electroplating the surface of the metal terminal extending out of the plastic main body.
2. The method according to claim 1, wherein in the step of injection molding, the thermosetting material is an SMC material and is in a liquid state at normal temperature.
3. The method for manufacturing the LED support according to claim 2, wherein in the step of injection molding, after the thermosetting material is injected, the pressure in the cavity of the injection mold is kept between 8kPa and 10 kPa.
4. The method according to claim 2, wherein in the step of injection molding, the injection mold is heated to 130 ℃ to 150 ℃ after the thermosetting material is injected.
5. The method according to claim 2, wherein in the step of injection molding, after the metal terminals are sealed in an injection mold and before the thermosetting material is injected, the injection mold is vacuumized.
6. The method of manufacturing an LED holder according to claim 2, wherein in the step of punching the terminals, the punched metal terminals are plural and connected together in pieces; and, between the step of stamping the terminal and the step of injection molding, further comprising the steps of: slicing: and cutting the metal terminals which are connected together in a sheet mode, so that each cut metal terminal can be placed into the injection mold in a whole sheet mode.
7. The method for manufacturing the LED bracket according to claim 2, wherein between the step of cutting the water gap and the step of cutting the foot, the method further comprises the steps of: cleaning: and cleaning the plastic main body to remove burrs on the surface of the plastic main body.
8. The method for manufacturing the LED support according to claim 7, wherein the step of cleaning comprises the steps of: and sequentially carrying out chemical cleaning, electrolytic cleaning, high-pressure water spraying, ultrasonic water washing, hot water washing, air drying and drying treatment on the LED support.
9. The method for manufacturing an LED support according to claim 1, wherein in the step of cutting the water gap, the water gap on the plastic body is cut off by a cutting jig.
10. An LED support, characterized in that, the LED support is manufactured by the manufacturing method of the LED support of any one of claims 1 to 9.
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| CN201911266968.8A CN110993776B (en) | 2019-12-11 | 2019-12-11 | LED support manufacturing method and LED support |
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| CN112549428A (en) * | 2020-10-26 | 2021-03-26 | 东莞智昊光电科技有限公司 | Support production device |
| WO2022222212A1 (en) * | 2021-04-19 | 2022-10-27 | 东莞中呈智能科技有限公司 | Multifunctional waterproof electronic switch having lamp |
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| CN110993776B (en) | 2021-06-04 |
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