CN110993575A - Display device - Google Patents
Display device Download PDFInfo
- Publication number
- CN110993575A CN110993575A CN201911310459.0A CN201911310459A CN110993575A CN 110993575 A CN110993575 A CN 110993575A CN 201911310459 A CN201911310459 A CN 201911310459A CN 110993575 A CN110993575 A CN 110993575A
- Authority
- CN
- China
- Prior art keywords
- heat
- metal frame
- display device
- transfer position
- tft substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Abstract
The invention discloses a display device for improving the heat dissipation effect. The display device of the embodiment of the invention comprises a drive IC, a TFT substrate, a backlight layer, a metal frame and a heat conducting film. The driving IC is arranged on the TFT substrate, the side face of the TFT substrate comprises a heat transfer position, and the heat transfer position is located on one side, back to the driving IC, of the TFT substrate. The heat generated by the driving IC may be conducted to the heat transfer locations. The backlight layer is internally provided with a light source. The metal frame is attached to the backlight layer, and the backlight layer is located between the metal frame and the TFT substrate. The heat conducting film is connected with the heat transfer position and the metal frame, so that the heat conducting film can be used for conducting heat conducted by the driving IC to the heat transfer position to the metal frame for heat dissipation. The metal frame has better radiating effect, can conduct the heat conduction of drive IC on the position of transferring heat to the metal frame through the heat conduction membrane to dispel the heat through the metal frame, can improve radiating effect like this.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a display device.
Background
The display device is used for displaying image signals, for example, an LCD display screen can display images, and a driving IC can be disposed on the display device and used for establishing a driving electric field to realize information display of liquid crystal. The driver IC generates heat during operation, and the heat of the driver IC needs to be dissipated in order to enable the display device to operate normally.
The conventional heat dissipation method for the driver IC is to dissipate heat by air flow. That is, a gap is provided around the driver IC to generate air flow on the surface of the driver IC, so that heat of the driver IC is taken away by the air to dissipate the heat of the driver IC.
However, since the air flow on the surface of the driver IC is weak, the heat dissipation effect by the air flow is poor.
Disclosure of Invention
The invention aims to provide a display device for improving the heat dissipation effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
a display device, comprising:
a driver IC;
the driving IC is arranged on the TFT substrate, the side surface of the TFT substrate comprises a heat transfer position, and the heat transfer position is positioned on one side of the TFT substrate, which faces away from the driving IC;
the backlight layer is internally provided with a light source;
the metal frame is attached to the backlight layer, and the backlight layer is positioned between the metal frame and the TFT substrate;
the heat conducting film is connected with the heat transfer position and the metal frame, and the heat conducting film is used for conducting heat conducted by the driving IC to the heat transfer position to the metal frame for heat dissipation.
Optionally, the heat conducting film is connected to the backlight layer, and the heat conducting film is further configured to conduct heat generated by the light source to the metal frame for heat dissipation.
Optionally, the heat transfer site is on the TFT substrate facing away from the driver IC;
the heat conduction film comprises a first heat conduction film, a second heat conduction film and a third heat conduction film;
the first heat conduction film is located between the heat transfer position and the light source, the first heat conduction film is connected with the heat transfer position, the first heat conduction film is connected with the backlight layer, the third heat conduction film is connected with the metal frame, and the second heat conduction film is connected with the first heat conduction film and the third heat conduction film.
Optionally, the first heat conducting membrane is connected with the heat transfer site through a heat conducting silica gel;
the heat conducting silica gel covers the heat transfer position.
Optionally, after the projection is performed on the plane where the heat transfer position is located, the projection surface of the driving IC is located within the projection surface of the heat transfer position, and a distance between an edge of the projection surface of the driving IC and an edge of the projection surface of the heat transfer position is greater than a preset value.
Optionally, the second heat conducting film is attached to an end of the backlight layer and an end of the metal frame.
Optionally, the heat conducting film is connected by an electrically conductive glue and the metal frame.
Optionally, the light source is an LED lamp;
the metal frame is an iron frame;
the heat conducting film is copper foil or aluminum foil.
Optionally, the driving IC is disposed near one end of the TFT substrate;
the number of the light sources is at least two;
the light sources are arranged in sequence along the end part of the backlight layer.
Optionally, the display device further comprises an upper polarizer, a filter, and a lower polarizer;
one side of the optical filter is attached to the upper-layer polaroid, and the other side of the optical filter is attached to the TFT substrate;
one side of the lower-layer polaroid is attached to the TFT substrate, and the other side of the lower-layer polaroid is attached to the backlight layer.
The invention has the beneficial effects that:
the display device of the embodiment of the invention comprises a drive IC, a TFT substrate, a backlight layer, a metal frame and a heat conducting film. The driving IC is arranged on the TFT substrate, the side face of the TFT substrate comprises a heat transfer position, and the heat transfer position is located on the side, back to the driving IC, of the TFT substrate. The heat generated by the driving IC may be conducted to the heat transfer locations. The backlight layer is internally provided with a light source. The metal frame is attached to the backlight layer, and the backlight layer is located between the metal frame and the TFT substrate. The heat conducting film is connected with the heat transfer position and connected with the metal frame, so that the heat conducting film can be used for conducting heat conducted by the driving IC to the heat transfer position to the metal frame for heat dissipation. The metal frame has better radiating effect, can conduct the heat conduction of drive IC on the position of transferring heat to the metal frame through the heat conduction membrane to dispel the heat through the metal frame, can improve radiating effect like this.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 3 is an enlarged view of a portion a of the display device shown in fig. 2.
In the figure:
1. a driver IC; 2. a TFT substrate; 3. a backlight layer; 4. a light source; 5. a metal frame; 6. a thermally conductive film; 7. a first thermally conductive film; 8. a second thermally conductive film; 9. a third thermally conductive film; 10. an upper polarizer; 11. an optical filter; 12. a lower polarizer; 13. thermally conductive silicone.
Detailed Description
The embodiment of the invention provides a display device, which is used for improving the heat dissipation effect.
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention, where the electronic device includes, but is not limited to, a mobile phone, a tablet computer, and other electronic devices.
The electronic device includes a display device for displaying image information. The Display device is, for example, a Liquid Crystal Display (LCD) screen.
Fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present invention, and fig. 3 is an enlarged view of a portion a of the display device shown in fig. 2. The display device shown in fig. 2 can be applied to the electronic device shown in fig. 1.
Referring to fig. 2 and 3, the display device according to the embodiment of the present invention includes a driving Integrated Circuit (IC) 1, a Thin Film Transistor (TFT) substrate 2, a backlight layer 3, a metal frame 5, and a heat conductive Film 6.
The driver IC1 may be an integrated circuit chip, and its functions include adjusting and controlling the phase, peak value, frequency, etc. of the potential signal on the electrode, and establishing a driving electric field to realize information display.
In the embodiment of the present invention, the drive IC1 is provided on the TFT substrate 2, specifically, fixed on the side of the TFT substrate 2. The side of the TFT substrate 2 includes a heat transfer site on the side of the TFT substrate 2 facing away from the driver IC 1. In other words, the heat transfer site and the drive IC1 are located on opposite sides of the TFT substrate 2, respectively.
The backlight layer 3 is provided with a light source 4, and the light source 4 is used for emitting light.
The metal frame 5 is attached to the backlight layer 3, wherein the metal frame 5 can protect the backlight layer 3 and prevent static electricity. The backlight layer 3 is located between the metal frame 5 and the TFT substrate 2.
In the present embodiment, the driver IC1 generates heat during operation. In order to maintain the normal operation of the display device, heat of the driver IC1 needs to be dissipated.
The heat conducting film 6 is connected to the heat transfer site, and the heat transfer site and the driving IC1 are respectively located on opposite sides of the TFT substrate 2, so that heat generated by the driving IC1 can be conducted to the heat transfer site through the TFT substrate 2 and transferred from the heat transfer site to the heat conducting film 6. The heat conductive film 6 is connected to the metal frame 5. In this way, the heat conductive film 6 serves to conduct the heat conducted by the driver IC1 to the heat conducting site to the metal frame 5 for heat dissipation.
Because the metal frame 5 has a good heat dissipation effect, the heat of the driving IC1 at the heat transfer position can be conducted to the metal frame 5 through the heat conductive film 6 to dissipate the heat through the metal frame 5, so that the heat dissipation effect can be improved.
In an embodiment of the present invention, the light source 4 in the backlight layer 3 may also generate heat, and in order to dissipate the heat, optionally, the heat conducting film 6 is connected to the backlight layer 3, and the light source 4 arranged in the backlight layer 3 generates heat, which is conducted to the heat conducting film 6 through the backlight layer 3. The heat conductive film 6 also serves to conduct heat generated by the light source 4 to the metal frame 5 for heat dissipation. In this way, the heat conductive film 6 can be used to conduct both the heat generated by the driver IC1 and the heat generated by the light source 4 to the metal frame 5 to dissipate the heat through the metal frame 5.
The heat conductive film 6 is disposed in various ways, for example, a part of the heat conductive film 6 is attached to the heat transfer site, another part of the heat conductive film 6 is connected to the backlight layer 3, and the other part of the heat conductive film 6 is attached to the metal frame 5.
In one particular implementation, as shown in fig. 2 and 3, heat is transferred on the TFT substrate 2 away from the driver IC 1. At this time, after the projection is performed on the plane where the heat transfer position is located, the projection surface of the driving IC1 and the projection surface of the heat transfer position have an overlapped part, so that more heat of the driving IC1 can be conducted to the heat transfer position to be absorbed by the heat conduction film 6, and heat dissipation is facilitated.
Optionally, the thermally conductive membrane 6 includes a first thermally conductive membrane 7, a second thermally conductive membrane 8, and a third thermally conductive membrane 9.
Wherein, the first heat conduction film 7 is positioned between the heat transfer position and the light source 4, the first heat conduction film 7 is connected with the heat transfer position, and the first heat conduction film 7 is connected with the backlight layer 3. Thus, the heat conducted from the driver IC1 to the heat transfer site and the heat generated by the light source 4 are absorbed by the first heat conductive film 7. The third heat conduction membrane 9 is connected with the metal frame 5, and the second heat conduction membrane 8 is connected with the first heat conduction membrane 7 and the third heat conduction membrane 9. The second heat-conducting film 8 conducts the heat on the first heat-conducting film 7 to the third heat-conducting film 9, and then the heat is conducted to the metal frame 5 through the third heat-conducting film 9, so that the heat is dissipated on the metal frame 5.
In order to allow more heat to be conducted to the metal frame 5, in some embodiments of the present invention, the bonding area of the heat conductive film 6 and the metal frame 5 may be as large as possible, for example, the bonding area of the third heat conductive film 9 and the metal frame 5 may be as large as possible.
One side of the first heat-conducting film 7 is connected with the heat transfer position, the other side of the first heat-conducting film 7 is connected with the backlight layer 3, and the first heat-conducting film 7 is positioned in a gap between the TFT substrate 2 and the backlight layer 3. In order to make the first heat-conducting film 7 closely fit to the heat-transfer position and the backlight layer 3, optionally, the first heat-conducting film 7 is connected to the heat-transfer position through a heat-conducting silica gel 13, and the heat-conducting silica gel 13 covers the heat-transfer position. In other words, the heat conductive silicone 13 is disposed between the first heat conductive film 7 and the heat transfer site, and the first heat conductive film 7 is attached to the heat transfer site through the heat conductive silicone 13. This facilitates the conduction of heat at the heat transfer site to the first heat conductive film 7. And heat conduction silica gel 13 easily produces the deformation, when assembling display device, the point goes up heat conduction silica gel 13 on first heat conduction membrane 7, laminates TFT base plate 2 and first heat conduction membrane 7 again, and heat conduction silica gel 13 presss from both sides between TFT base plate 2 and first heat conduction membrane 7, like this, can make heat transfer position and the contact of first heat conduction membrane 7 on the TFT base plate 2 good through heat conduction silica gel 13 to do benefit to and transfer heat.
In order to transfer as much heat generated by the driver IC1 to the heat conductive film 6 as possible, optionally, after projection onto the plane where the heat transfer site is located, the projection surface of the driver IC1 is located inside the projection surface of the heat transfer site, and the distance between the edge of the projection surface of the driver IC1 and the edge of the projection surface of the heat transfer site is greater than a preset value. Thus, the heat generated by the driver IC1 can be conducted more to the heat transfer site to be absorbed by the first heat conductive film 7.
The preset value may be 0.1mm (millimeter), 0.2mm, or 0.3mm, and the embodiment of the invention is not limited thereto.
When the heat conducting silicone 13 covers the heat transfer position, the area of the heat conducting silicone 13 is larger than that of the projection surface of the driver IC1, so that the heat conducting silicone 13 can absorb more heat generated by the driver IC 1.
In an example in which the heat conductive film 6 includes the first heat conductive film 7, the second heat conductive film 8, and the third heat conductive film 9, optionally, as shown in fig. 3, the second heat conductive film 8 is attached to an end of the backlight layer 3 and an end of the metal chassis 5. In this way, the heat generated by the light source 4 on the backlight layer 3 can be further conducted to the second heat-conducting film 8, and the heat on the second heat-conducting film 8 can be conducted to the metal frame 5, which is more beneficial to heat dissipation of the display device. Also, the gap between the second heat conductive film 8 and the backlight layer 3 and the metal frame 5 is reduced, thereby reducing the volume of the display device.
Alternatively, the heat conductive film 6 is connected by the conductive adhesive and the metal frame 5. For example, the third heat conductive film 9 is attached by an electrically conductive adhesive and a metal frame 5. Therefore, heat transfer between the heat-conducting film 6 and the metal frame 5 is facilitated, electric connection between the heat-conducting film 6 and the metal frame 5 is also achieved, and the metal frame 5 has an anti-static function, so that the heat-conducting film 6 and the metal frame 5 are electrically connected and then are beneficial to achieving anti-static. The thickness of the conductive adhesive is, for example, 0.05 mm.
It should be understood that in other embodiments of the present invention, a thermally conductive silicone gel may be used in place of the electrically conductive gel.
Alternatively, the driver IC1 is provided near one end of the TFT substrate 2. The number of the light sources 4 is at least two, and the light sources 4 are arranged in sequence along the end of the backlight layer 3. Since the heat of the display device mainly comes from the driver IC1 and the light source 4, the heat of the display device is mainly concentrated on a local portion, for example, the bottom of the display device. The heat conducting film 6 provided by the embodiment of the invention can conduct the locally concentrated heat of the display device to the metal frame 5 so as to dissipate the heat through the metal frame 5, thus reducing the local temperature of the display device.
For example, the heat source of the LCD panel is mainly a Light Emitting Diode (LED) lamp and a driving IC1, and in a mobile phone or a tablet computer, the LED lamp and the driving IC1 are usually concentrated at the bottom of the mobile phone or the tablet computer, and at this time, a local heating problem is likely to occur. The display device of the embodiment of the invention can guide the heat generated by the LED lamp and the drive IC1 to the metal frame 5 of the backlight through the heat conducting film 6, and the heat is radiated through the metal frame 5, thereby reducing the local temperature of the display screen. The display device provided by the embodiment of the invention can simultaneously solve the double problems of heat dissipation of the LED lamp and the drive IC1, and can be used together with other heat dissipation schemes to enhance the heat dissipation effect.
Some components of the embodiments of the present invention have various implementations, for example, the light source 4 is an LED lamp, the metal frame 5 is an iron frame, and the heat conductive film 6 is a copper foil or an aluminum foil.
It should be understood that the light source 4 may also be implemented in other ways, such as a cold cathode fluorescent lamp or the like. The metal frame 5 may be an aluminum frame or other material. The specific structure of the metal frame 5 may be a plate shape or a hollow frame, and the specific implementation manner of the light source 4, the metal frame 5 and the heat conducting film 6 is not particularly limited in the embodiment of the present invention.
The display device of the embodiment of the invention can be an LCD display screen. Alternatively, as shown in fig. 2 and 3, the display device further includes an upper polarizer 10, a filter 11, and a lower polarizer 12.
One side of the optical filter 11 is attached to the upper polarizer 10, and the other side of the optical filter 11 is attached to the TFT substrate 2. In other words, the filter 11 is located between the upper polarizer 10 and the TFT substrate 2. The filter 11 is, for example, a color filter.
One side of the lower-layer polaroid 12 is attached to the TFT substrate 2, and the other side of the lower-layer polaroid 12 is attached to the backlight layer 3. In other words, the lower polarizer 12 is located between the TFT substrate 2 and the backlight layer 3.
In this way, in the display device according to the embodiment of the present invention, the upper polarizer 10, the filter 11, the TFT substrate 2, the lower polarizer 12, the backlight layer 3, and the metal frame 5 are sequentially attached to each other.
In summary, the display device according to the embodiment of the invention includes the driving IC1, the TFT substrate 2, the backlight layer 3, the metal frame 5, and the heat conductive film 6. The driving IC1 is disposed on the TFT substrate 2, and the side of the TFT substrate 2 includes a heat transfer site, and the heat transfer site is located on a side of the TFT substrate 2 facing away from the driving IC 1. Heat generated by the driver IC1 may be conducted to the heat transfer locations. A light source 4 is arranged in the backlight layer 3. The metal frame 5 is attached to the backlight layer 3, and the backlight layer 3 is located between the metal frame 5 and the TFT substrate 2. The heat conductive film 6 is connected to the heat transfer site, and the heat conductive film 6 is connected to the metal frame 5, so that the heat conductive film 6 can be used to conduct the heat conducted by the driver IC1 to the heat transfer site to the metal frame 5 for heat dissipation. The metal frame 5 has a good heat dissipation effect, and heat of the driver IC1 at the heat transfer position can be conducted to the metal frame 5 through the heat conductive film 6 to be dissipated through the metal frame 5, so that the heat dissipation effect can be improved.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display device, comprising:
a driving integrated circuit IC;
the TFT substrate comprises a thin film field effect transistor (TFT), the drive IC is arranged on the TFT substrate, the side surface of the TFT substrate comprises a heat transfer position, and the heat transfer position is positioned on one side of the TFT substrate, which faces away from the drive IC;
the backlight layer is internally provided with a light source;
the metal frame is attached to the backlight layer, and the backlight layer is positioned between the metal frame and the TFT substrate;
the heat conducting film is connected with the heat transfer position and the metal frame, and the heat conducting film is used for conducting heat conducted by the driving IC to the heat transfer position to the metal frame for heat dissipation.
2. The display device according to claim 1,
the heat-conducting film is connected with the backlight layer and is also used for conducting heat generated by the light source to the metal frame for heat dissipation.
3. The display device according to claim 2,
the heat transfer position is arranged on the TFT substrate and faces away from the drive IC;
the heat conduction film comprises a first heat conduction film, a second heat conduction film and a third heat conduction film;
the first heat conduction film is located between the heat transfer position and the light source, the first heat conduction film is connected with the heat transfer position, the first heat conduction film is connected with the backlight layer, the third heat conduction film is connected with the metal frame, and the second heat conduction film is connected with the first heat conduction film and the third heat conduction film.
4. The display device according to claim 3,
the first heat-conducting film is connected with the heat transfer position through heat-conducting silica gel;
the heat conducting silica gel covers the heat transfer position.
5. The display device according to claim 3,
after the projection is carried out on the plane where the heat transfer position is located, the projection surface of the driving IC is located in the projection surface of the heat transfer position, and the distance between the edge of the projection surface of the driving IC and the edge of the projection surface of the heat transfer position is larger than a preset value.
6. The display device according to claim 3,
the second heat conduction film is attached to the end part of the backlight layer and the end part of the metal frame.
7. The display device according to claim 1,
the heat-conducting film is connected with the metal frame through conductive glue.
8. The display device according to claim 1,
the light source is a Light Emitting Diode (LED) lamp;
the metal frame is an iron frame;
the heat conducting film is copper foil or aluminum foil.
9. The display device according to claim 2,
the driving IC is arranged close to one end of the TFT substrate;
the number of the light sources is at least two;
the light sources are arranged in sequence along the end part of the backlight layer.
10. The display device according to claim 1,
the display device also comprises an upper-layer polaroid, an optical filter and a lower-layer polaroid;
one side of the optical filter is attached to the upper-layer polaroid, and the other side of the optical filter is attached to the TFT substrate;
one side of the lower-layer polaroid is attached to the TFT substrate, and the other side of the lower-layer polaroid is attached to the backlight layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310459.0A CN110993575A (en) | 2019-12-18 | 2019-12-18 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310459.0A CN110993575A (en) | 2019-12-18 | 2019-12-18 | Display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110993575A true CN110993575A (en) | 2020-04-10 |
Family
ID=70095382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911310459.0A Pending CN110993575A (en) | 2019-12-18 | 2019-12-18 | Display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110993575A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103591512A (en) * | 2013-11-15 | 2014-02-19 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display module with same |
| CN104730764A (en) * | 2013-12-18 | 2015-06-24 | 三星电子株式会社 | Display device |
| CN205581451U (en) * | 2016-04-29 | 2016-09-14 | 上海中航光电子有限公司 | Display device |
| CN110320693A (en) * | 2018-03-30 | 2019-10-11 | 夏普株式会社 | The manufacturing method of display device and display device |
-
2019
- 2019-12-18 CN CN201911310459.0A patent/CN110993575A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103591512A (en) * | 2013-11-15 | 2014-02-19 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display module with same |
| CN104730764A (en) * | 2013-12-18 | 2015-06-24 | 三星电子株式会社 | Display device |
| CN205581451U (en) * | 2016-04-29 | 2016-09-14 | 上海中航光电子有限公司 | Display device |
| CN110320693A (en) * | 2018-03-30 | 2019-10-11 | 夏普株式会社 | The manufacturing method of display device and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101777527B1 (en) | Backlight module and liquid crystal display module using same | |
| US10444557B2 (en) | Display module and display device | |
| WO2017080150A1 (en) | Liquid crystal module and display device | |
| JP2008026866A (en) | Display device | |
| EP2607949A1 (en) | Display module and display apparatus having the same | |
| JP2002350807A (en) | Liquid crystal display device | |
| JP4238921B2 (en) | LIGHTING DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE | |
| WO2016115815A1 (en) | Display panel and display device | |
| JP2006308738A (en) | Liquid crystal display device | |
| JP2014238578A (en) | Display device | |
| JP4912844B2 (en) | LIGHT EMITTING DEVICE AND DISPLAY DEVICE USING THE SAME | |
| KR20060124912A (en) | Integrated circuit chip package and a display device provided with the same | |
| JP2000214441A (en) | Liquid crystal display device | |
| CN110993575A (en) | Display device | |
| JP2008275803A (en) | Image display device | |
| JPH10232385A (en) | Heat radiating structure for liquid crystal display module | |
| KR101283068B1 (en) | The radiant heat circuit board unified blanket and the backlight unit having the same | |
| KR101311298B1 (en) | Liquid crystal display device | |
| JP2007279103A (en) | Liquid crystal device and electronic equipment | |
| CN217639863U (en) | Display module | |
| WO2012093626A1 (en) | Display device | |
| JP2006106064A (en) | Liquid crystal display | |
| KR101686670B1 (en) | Liquid crystal display device | |
| CN212808848U (en) | High heat dissipation module based on TFT | |
| KR101651292B1 (en) | Display device having cover bottom for heat radiating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |
|
| RJ01 | Rejection of invention patent application after publication |