CN110988767A - 一种基于熔融石英衬底的太赫兹在片校准件制造方法 - Google Patents
一种基于熔融石英衬底的太赫兹在片校准件制造方法 Download PDFInfo
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111983540A (zh) * | 2020-08-28 | 2020-11-24 | 中电科仪器仪表有限公司 | 一种高精度太赫兹超短波长校准件的制备方法及校准件 |
CN112649713A (zh) * | 2020-11-30 | 2021-04-13 | 中国电子科技集团公司第五十五研究所 | 一种太赫兹频段在片trl校准件及其制备方法 |
CN113391254A (zh) * | 2021-05-20 | 2021-09-14 | 中国电子技术标准化研究院 | 高低温在片散射系数校准件及其制造方法 |
CN114137379A (zh) * | 2021-11-01 | 2022-03-04 | 中国电子科技集团公司第十三研究所 | Lrrm校准件的制备方法及lrrm校准件 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101634672A (zh) * | 2009-07-10 | 2010-01-27 | 中国电子科技集团公司第五十五研究所 | 基于未知材料基板的微波在片测试方法 |
US20140340178A1 (en) * | 2013-04-15 | 2014-11-20 | California Institute Of Technology | Multi-step deep reactive ion etching fabrication process for silicon-based terahertz components |
CN104865453A (zh) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第十三研究所 | 太赫兹在片散射参数测量校准件及其制备方法 |
CN204832482U (zh) * | 2015-07-31 | 2015-12-02 | 中国电子科技集团公司第十三研究所 | 在片s参数共面波导trl校准件 |
CN106707134A (zh) * | 2016-11-28 | 2017-05-24 | 中国电子科技集团公司第五十五研究所 | 太赫兹频段功率放大芯片在片功率测试系统及测试方法 |
CN106772172A (zh) * | 2016-10-25 | 2017-05-31 | 中国电子科技集团公司第十三研究所 | 在片高低温s参数trl校准件的设计方法 |
CN107533122A (zh) * | 2015-04-08 | 2018-01-02 | 深谷波股份公司 | 用于微波分析或测量仪器的校准装置和方法 |
CN109959853A (zh) * | 2019-04-10 | 2019-07-02 | 嘉兴腓特烈太赫科技有限公司 | 基于直流检测筛选4管平衡式太赫兹三倍频器的方法 |
CN110286345A (zh) * | 2019-05-22 | 2019-09-27 | 中国电子科技集团公司第十三研究所 | 一种矢量网络分析仪在片s参数的校准方法、系统及设备 |
-
2019
- 2019-10-25 CN CN201911020208.9A patent/CN110988767A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101634672A (zh) * | 2009-07-10 | 2010-01-27 | 中国电子科技集团公司第五十五研究所 | 基于未知材料基板的微波在片测试方法 |
US20140340178A1 (en) * | 2013-04-15 | 2014-11-20 | California Institute Of Technology | Multi-step deep reactive ion etching fabrication process for silicon-based terahertz components |
CN107533122A (zh) * | 2015-04-08 | 2018-01-02 | 深谷波股份公司 | 用于微波分析或测量仪器的校准装置和方法 |
CN104865453A (zh) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第十三研究所 | 太赫兹在片散射参数测量校准件及其制备方法 |
CN204832482U (zh) * | 2015-07-31 | 2015-12-02 | 中国电子科技集团公司第十三研究所 | 在片s参数共面波导trl校准件 |
CN106772172A (zh) * | 2016-10-25 | 2017-05-31 | 中国电子科技集团公司第十三研究所 | 在片高低温s参数trl校准件的设计方法 |
CN106707134A (zh) * | 2016-11-28 | 2017-05-24 | 中国电子科技集团公司第五十五研究所 | 太赫兹频段功率放大芯片在片功率测试系统及测试方法 |
CN109959853A (zh) * | 2019-04-10 | 2019-07-02 | 嘉兴腓特烈太赫科技有限公司 | 基于直流检测筛选4管平衡式太赫兹三倍频器的方法 |
CN110286345A (zh) * | 2019-05-22 | 2019-09-27 | 中国电子科技集团公司第十三研究所 | 一种矢量网络分析仪在片s参数的校准方法、系统及设备 |
Non-Patent Citations (1)
Title |
---|
白浩 等: "太赫兹用石英基板微带电路制作工艺技术", 《太赫兹科学与电子信息学报》 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111983540A (zh) * | 2020-08-28 | 2020-11-24 | 中电科仪器仪表有限公司 | 一种高精度太赫兹超短波长校准件的制备方法及校准件 |
CN111983540B (zh) * | 2020-08-28 | 2024-02-02 | 中电科思仪科技股份有限公司 | 一种高精度太赫兹超短波长校准件的制备方法及校准件 |
CN112649713A (zh) * | 2020-11-30 | 2021-04-13 | 中国电子科技集团公司第五十五研究所 | 一种太赫兹频段在片trl校准件及其制备方法 |
CN112649713B (zh) * | 2020-11-30 | 2024-04-12 | 中国电子科技集团公司第五十五研究所 | 一种太赫兹频段在片trl校准件及其制备方法 |
CN113391254A (zh) * | 2021-05-20 | 2021-09-14 | 中国电子技术标准化研究院 | 高低温在片散射系数校准件及其制造方法 |
CN113391254B (zh) * | 2021-05-20 | 2023-03-14 | 中国电子技术标准化研究院 | 高低温在片散射系数校准件及其制造方法 |
CN114137379A (zh) * | 2021-11-01 | 2022-03-04 | 中国电子科技集团公司第十三研究所 | Lrrm校准件的制备方法及lrrm校准件 |
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