CN110988640B - Aging board of device - Google Patents
Aging board of device Download PDFInfo
- Publication number
- CN110988640B CN110988640B CN201911158282.7A CN201911158282A CN110988640B CN 110988640 B CN110988640 B CN 110988640B CN 201911158282 A CN201911158282 A CN 201911158282A CN 110988640 B CN110988640 B CN 110988640B
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- contact pin
- pin
- positioning hole
- board
- metal plate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
Abstract
The invention relates to a burn-in board for a device, comprising: the metal plate is provided with an installation position, and the installation position comprises a first positioning hole and a second positioning hole; the installation carrier, the installation carrier include with the carrier main part of the insulating material that the metal sheet is connected, locate in the carrier main part and mutual insulating first contact pin and second contact pin, first contact pin is located in the first locating hole and with the pore wall of first locating hole is connected, the second contact pin is located in the second locating hole and with insulating clearance has between the pore wall of second locating hole. First contact pin and second contact pin can be used for putting into two different pins of semiconductor device, and the mutual insulation of first contact pin and second contact pin can avoid two pins to take place the short circuit to electric connection's stability has been improved, and then the security in the test procedure has been improved.
Description
Technical Field
The invention relates to the technical field of semiconductor device production and processing, in particular to an aging board of a device.
Background
The transistor outline package (TO-CAN, TO tube for short) is one of the most common package forms of optoelectronic devices and sensing devices, and belongs TO the field of airtight coaxial package. The method is easy for scale production and low in cost, and is widely applied to packaging of optoelectronic chips. The metal tube cap with the lens and the metal tube seat with the lead realize air-tight packaging through a resistance welding process, optical signals are input into the photoelectronic device through the lens on the tube cap, and the lead on the tube seat realizes the communication of electric signals inside and outside the device. During the production and processing of the TO pipe, the performance of the TO pipe needs TO be tested in all aspects. TO determine the service life of the TO tube, the TO tube is subjected TO an aging test, which requires that the TO tube is kept in a high-temperature environment at 175 ℃ for 5000 hours. In order TO increase the accuracy of the test, a plurality of test samples need TO be set, that is, a plurality of TO tubes need TO be tested in a unified manner, an aging board is needed TO integrate the plurality of TO tubes for batch testing, most of the existing aging boards are PCB boards, however, the PCB boards are poor in high temperature resistance and generally can only withstand the temperature of 125 ℃, and in the testing process, the PCB boards can age gradually, the performance of all aspects is reduced, the TO tubes on the PCB boards cannot be stably supported, and the aging test of the TO tubes is affected.
Therefore, it is desirable to provide a burn-in board for a device that addresses the deficiencies of the prior art.
Disclosure of Invention
The invention provides an aging board of a device, aiming at solving the problem of poor high temperature resistance of the aging board in the prior art.
A burn-in board for a device, comprising:
the metal plate is provided with an installation position, and the installation position comprises a first positioning hole and a second positioning hole;
the installation carrier, the installation carrier include with the carrier main part of the insulating material that the metal sheet is connected, locate in the carrier main part and mutual insulating first contact pin and second contact pin, first contact pin is located in the first locating hole and with the pore wall of first locating hole is connected, the second contact pin is located in the second locating hole and with insulating clearance has between the pore wall of second locating hole.
Further, the mounting carrier further comprises a third contact pin arranged in the carrier body, the third contact pin is insulated from the first contact pin and the second contact pin, the first contact pin and the third contact pin are arranged on two opposite sides of the second contact pin, the first contact pin and the second contact pin have different polarities, and the first contact pin and the third contact pin have the same polarity;
the mounting position comprises a third positioning hole, and the third contact pin is arranged in the third positioning hole and connected with the hole wall of the third positioning hole.
Furthermore, the inner diameters of the first contact pin, the second contact pin and the third contact pin are equal, and the outer diameters of the first contact pin, the second contact pin and the third contact pin are equal;
the inner diameter of the first positioning hole is equal to that of the third positioning hole, and the inner diameter of the first positioning hole is smaller than that of the second positioning hole.
Further, the lead wire comprises a first lead end and a second lead end;
one end of the first contact pin penetrates through the carrier main body, and the other end of the first contact pin penetrates through the first positioning hole, then is bent and connected with the metal plate;
one end of the third contact pin penetrates through the carrier main body, and the other end of the third contact pin penetrates through the third positioning hole, then is bent and connected with the metal plate;
one end of the second contact pin penetrates through the carrier main body, and the other end of the second contact pin penetrates through the second positioning hole and then is connected with the resistor;
the first lead end is connected with the metal plate through a lead, and the second lead end is connected with the resistor through a lead.
Furthermore, the installation structure comprises a plurality of installation carriers, the metal plate is provided with a plurality of installation positions, and the installation carriers are installed on the installation positions in a one-to-one correspondence manner.
The metal plate is provided with a plurality of mounting positions, and the plurality of mounting carriers are mounted on the plurality of mounting positions in a one-to-one correspondence manner;
and the resistors of the plurality of mounting carriers are connected with the second lead ends in series in sequence.
Furthermore, the mounting device also comprises an auxiliary plate made of metal, the auxiliary plate and the metal plate are connected at intervals through a plurality of connecting pieces, and the mounting carrier is arranged on one side of the metal plate far away from the auxiliary plate.
Furthermore, the device also comprises a plurality of supporting legs which correspond to the connecting pieces one by one;
one end of the connecting piece penetrates through the metal plate, and the other end of the connecting piece penetrates through the auxiliary plate and then is connected with the supporting legs.
Furthermore, the device also comprises at least one positioning element, wherein each positioning element is sleeved on one of the connecting elements, one end of each positioning element is abutted against the metal plate, and the other end of each positioning element is abutted against the auxiliary plate.
Furthermore, the metal plate is one of a copper plate, an iron plate, an aluminum plate and an alloy plate, the auxiliary plate is made of one of copper, iron, aluminum and an alloy, and the mounting carrier is made of one of polyaryletherketone, polyetheretherketone and polyurethane.
Compared with the closest prior art, the technical scheme of the invention has the following advantages:
according to the aging board of the device, the metal board is used as a main body of the aging board, the metal board is provided with the mounting carrier for mounting the semiconductor device, the main body structure of the mounting carrier is made of insulating materials, so that the first contact pin and the second contact pin in the mounting carrier are mutually insulated, the metal board, the first contact pin and the second contact pin are all made of metal, the aging board can resist high temperature of more than 175 ℃, the stability is good, and aging can be avoided; the first contact pin is communicated with the metal plate through the first positioning hole, the supporting effect of the metal plate is utilized, the electrical performance of the metal plate is also utilized, the second contact pin penetrates through the second positioning hole, a gap exists between the second contact pin and the metal plate, and the insulating performance between the first contact pin and the second contact pin is further improved; first contact pin and second contact pin can be used for putting into two different pins of semiconductor device, and one of them pin is through first contact pin and just, one intercommunication in the negative pole, and wherein another pin is through second contact pin and just, another intercommunication in the negative pole, and the mutual insulation of first contact pin and second contact pin can avoid two pins to take place the short circuit to electric connection's stability has been improved, and then accuracy and security in the test procedure have been improved.
Drawings
FIG. 1 is a schematic structural diagram of a metal plate and an auxiliary plate of an aging board according to an embodiment of the present invention;
FIG. 2 is a top view of a metal plate provided in accordance with an embodiment of the present invention;
FIG. 3 is a top view of an auxiliary plate provided in accordance with an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second pin according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a first pin according to an embodiment of the present invention.
Wherein, 1-metal plate, 11-installation position, 111-first positioning hole, 112-second positioning hole, 113-third positioning hole, 12-connecting hole; 2-auxiliary plate, 21-auxiliary connecting hole; 3-a second contact pin; 4-first pin.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail with reference to the accompanying examples and figures 1-5.
The invention provides an aging board of a device, in particular to an aging board of a semiconductor device, which comprises: the positioning structure comprises a metal plate 1, wherein a mounting position 11 is arranged on the metal plate 1, and the mounting position 11 comprises a first positioning hole 111 and a second positioning hole 112; the mounting carrier comprises a carrier main body made of an insulating material and connected with the metal plate 1, and a first contact pin 4 and a second contact pin 3 which are arranged in the carrier main body and insulated from each other, wherein the first contact pin 4 is arranged in the first positioning hole 111 and connected with the hole wall of the first positioning hole 111, and the second contact pin 3 is arranged in the second positioning hole 112 and has an insulating gap with the hole wall of the second positioning hole 112. The first pin 4 and the second pin 3 can be set to different cross-sectional shapes according to requirements, such as square, round, polygonal and the like, preferably to be round to match with the pin shape of the semiconductor device, and the size of the pin also needs to match with the size of the pin; because the aging board is used for integrating a plurality of semiconductor devices to carry out batch aging tests, the number of the installation carriers arranged on the metal plate 1 is multiple, the metal plate 1 is provided with a plurality of corresponding installation positions 11, the installation carriers are arranged on the installation positions 11 in a one-to-one correspondence manner, and the specific arrangement of the number of the installation carriers can be specifically selected according to test requirements. A plurality of semiconductor devices can be placed on the plurality of mounting carriers simultaneously, and batch testing of the semiconductor devices is facilitated.
According to the aging board of the device, the metal board 1 is used as a main body of the aging board, the metal board 1 is provided with the mounting carrier for mounting the semiconductor device, the main body structure of the mounting carrier is made of insulating materials, so that the first contact pin 4 and the second contact pin 3 in the mounting carrier are mutually insulated, the metal board 1, the first contact pin 4 and the second contact pin 3 are all made of metal, the aging board can resist high temperature of more than 175 ℃, the stability is good, and aging can be avoided; the first pin 4 is communicated with the metal plate 1 through the first positioning hole 111, so that the supporting effect and the electrical performance of the metal plate 1 are utilized, the second pin 3 penetrates through the second positioning hole 112 and has a gap with the metal plate 1, and the insulating performance between the first pin 4 and the second pin 3 is further improved; first contact pin 4 and second contact pin 3 can be used for putting into two different pins of semiconductor device, and one of them pin is through first contact pin 4 and just, one intercommunication in the negative pole, and wherein another pin is through second contact pin 3 and just, another intercommunication in the negative pole, and two pins can be avoided taking place the short circuit in first contact pin 4 and second contact pin 3's mutual insulation to electric connection's stability has been improved, and then the security in the test procedure has been improved.
In some embodiments of the present invention, the mounting carrier further includes a third pin disposed in the carrier body, the third pin is insulated from the first pin 4 and the second pin 3, the first pin 4 and the third pin are disposed on two opposite sides of the second pin 3, the first pin 4 and the second pin 3 have different polarities, and the first pin 4 and the third pin have the same polarity; the mounting position 11 includes a third positioning hole 113, and the third pin is disposed in the third positioning hole 113 and connected to a wall of the third positioning hole 113. Because the first pin 4 and the second pin 3 are preferably in a circular shape, that is, cylindrical shape, in addition, the first pin 4 is connected with the hole wall of the first positioning hole 111, and an insulation gap exists between the second pin 3 and the hole wall of the second positioning hole 112, when the first pin 4 rotates in the first positioning hole 111, the second pin 3 will move in the second positioning hole 112 along with the first pin, and is easily connected with the hole wall of the second positioning hole 112, so that the mutual insulation between the second pin 3 and the metal plate 1 is damaged, that is, the mutual insulation between the first pin 4 and the second pin 3 is damaged; through the third contact pin connected with the hole wall of the third positioning hole 113, the first contact pin 4, the second contact pin 3 and the third contact pin are sequentially arranged in the carrier body on the same straight line, and under the mutual limiting action of the first contact pin 4 and the third contact pin, the first contact pin 4 and the third contact pin cannot rotate at all, so that the second contact pin 3 is prevented from moving in the second positioning hole 112, the mutual insulation between the second contact pin 3 and the metal plate 1 is also ensured, and the short circuit phenomenon between the first contact pin 4 and the second contact pin 3 is avoided.
In some embodiments of the present invention, the inner diameters of the first pin 4, the second pin 3, and the third pin are equal, and the outer diameters of the first pin 4, the second pin 3, and the third pin are equal; the inner diameter of the first positioning hole 111 is equal to the inner diameter of the third positioning hole 113, and the inner diameter of the first positioning hole 111 is smaller than the inner diameter of the second positioning hole 112. The three pins are used for mounting pins of a semiconductor device, and are consistent in size and shape due to the consistent pins, in order to enable the first pin 4 to be connected with the hole wall of the first positioning hole 111, the third pin is connected with the hole wall of the third positioning hole 113, the first positioning hole 111 and the third positioning hole 113 are matched with the inner diameter of the pins, and in order to enable an insulation gap to exist between the second pin 3 and the second positioning hole 112, the inner diameter of the second positioning hole 112 is larger than the inner diameter of the first positioning hole 111.
In some embodiments of the present invention, further comprising a first lead terminal and a second lead terminal; one end of the first pin 4 penetrates through the carrier body, and the other end of the first pin 4 penetrates through the first positioning hole 111 and then is bent and connected with the metal plate 1; one end of the third pin penetrates through the carrier main body, and the other end of the third pin penetrates through the third positioning hole 113, then is bent and connected with the metal plate 1; one end of the second pin 3 penetrates through the carrier body, and the other end of the second pin 3 penetrates through the second positioning hole 112 and then is connected with the resistor; the first lead end is connected with the metal plate 1 through a lead, and the second lead end is connected with the resistor through a lead. The polarity of the first contact pin 4 is the same as that of the third contact pin, the polarity of the second contact pin 3 is different from that of the first contact pin 4, the first contact pin 4 and the third contact pin penetrate through the metal plate 1 and then are bent, and then are connected with the metal plate 1, so that the electric connection stability between the first contact pin 4 and the metal plate 1 is further improved, the electric connection stability between the third contact pin and the metal plate 1 is improved, the first contact pin 4 and the third contact pin are both communicated with the positive pole or the negative pole of a power supply through the resistor of the metal plate 1, and the second contact pin 3 penetrates through the metal plate 1 and then is communicated with the other electrode of the power supply through the resistor; the first pin 4 and the third pin of being convenient for of first pin and power are connected to first lead terminal, and the second pin 3 of being convenient for of second lead terminal is connected with the power, through first lead terminal, metal sheet 1, a pin of first pin 4 intercommunication power and semiconductor device, through another pin of first lead terminal, metal sheet 1, third pin intercommunication power and semiconductor device, through second lead terminal, resistance, another pin of second pin 3 intercommunication power and semiconductor device.
In some embodiments of the present invention, the metal plate 1 includes a plurality of mounting locations 11, and the plurality of mounting locations 11 are correspondingly mounted on the plurality of mounting locations 11; the resistors of the plurality of mounting carriers are connected in series in sequence and then connected with the second lead terminals. The second pins 3 in each mounting carrier are connected with a resistor, all the resistors are connected in series, the voltage of each second pin 3 can be equal, the voltage of two ends of each semiconductor device is equal, and the consistency of test conditions is improved.
In some embodiments of the present invention, the mounting device further includes an auxiliary plate 2 made of a metal material, the auxiliary plate 2 and the metal plate 1 are connected at intervals by a plurality of connecting members, and the mounting carrier is disposed on a side of the metal plate 1 away from the auxiliary plate 2. The auxiliary plate 2 and the metal plate 1 are arranged in parallel, the connecting piece can select a connecting rod, the metal plate 1 is provided with a plurality of connecting holes 12, the auxiliary plate 2 is provided with a plurality of auxiliary connecting holes 21, the connecting holes 12 correspond to the auxiliary connecting holes 21 one by one, each connecting hole 12 and the corresponding auxiliary connecting hole 21 are provided with a connecting rod, the connecting rods and the connecting holes 12 can be connected through threads, and the connecting rods and the auxiliary connecting holes 21 can also be connected through threads; the metal plate 1 and the auxiliary plate 2 can protect the resistors and the wires provided therebetween and facilitate handling and movement of the burn-in board.
In some embodiments of the invention, the device further comprises a plurality of supporting feet in one-to-one correspondence with the plurality of connecting pieces; one end of the connecting piece penetrates through the metal plate 1, and the other end of the connecting piece penetrates through the auxiliary plate 2 and then is connected with the supporting legs. The supporting legs sets up in the outside of accessory plate 2, evenly sets up a plurality ofly moreover, for example when accessory plate 2 is the rectangle, four angle departments of accessory plate 2 all are provided with a supporting legs, and the supporting legs is convenient for placing of ageing board, makes accessory plate 2 and metal sheet 1 not with the bottom surface contact of high temperature environment, improves the temperature rise and fall uniformity of each installation carrier, has improved each semiconductor device's test condition uniformity, and then has improved the accuracy of test result.
In some embodiments of the present invention, the positioning device further comprises at least one positioning element, each positioning element is sleeved on one of the connecting elements, one end of each positioning element abuts against the metal plate 1, and the other end of each positioning element abuts against the auxiliary plate 2. The locating piece is the reference column, and it is equipped with the locating hole that runs through its axis, and the connecting piece runs through the locating hole, and the reference column can restrict rather than the distance between 2 accessory plates 1 of both ends counterbalance metal sheet, and the resistance between 2 accessory plates 1 of metal sheet of being convenient for and the holding of wire etc. avoid apart from the influence of the resistance and the wire of unstable meeting device.
In some embodiments of the present invention, the metal plate 1 is one of a copper plate, an iron plate, an aluminum plate and an alloy plate, the auxiliary plate 2 is made of one of copper, iron, aluminum and an alloy, and the metal is resistant to high temperature and has a high heat conduction rate; the material of the mounting carrier is one of Polyaryletherketone (PAEK), Polyetheretherketone (PEEK) and Polyurethane (PU), and the material has good insulating property and can resist high temperature in the aging test process.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A burn-in board for a device, comprising:
the metal plate (1) is provided with an installation position (11), and the installation position (11) comprises a first positioning hole (111) and a second positioning hole (112);
the mounting carrier comprises a carrier main body made of an insulating material and connected with the metal plate (1), and a first contact pin (4) and a second contact pin (3) which are arranged in the carrier main body and insulated from each other, wherein the first contact pin (4) is arranged in the first positioning hole (111) and connected with the hole wall of the first positioning hole (111), and the second contact pin (3) is arranged in the second positioning hole (112) and provided with an insulating gap with the hole wall of the second positioning hole (112); the mounting carrier further comprises a third contact pin arranged in the carrier body, the third contact pin is respectively insulated from the first contact pin (4) and the second contact pin (3), the first contact pin (4) and the third contact pin are respectively arranged on two opposite sides of the second contact pin (3), the polarities of the first contact pin (4) and the second contact pin (3) are different, and the polarities of the first contact pin (4) and the third contact pin are the same;
the mounting position (11) comprises a third positioning hole (113), and the third inserting pin is arranged in the third positioning hole (113) and connected with the wall of the third positioning hole (113).
2. Burn-in board for a device according to claim 1, characterized in that the first pin (4), the second pin (3) and the third pin have equal inner diameters, and the first pin (4), the second pin (3) and the third pin have equal outer diameters;
the inner diameter of the first positioning hole (111) is equal to that of the third positioning hole (113), and the inner diameter of the first positioning hole (111) is smaller than that of the second positioning hole (112).
3. The burn-in board of a device of claim 2, further comprising a first lead terminal and a second lead terminal;
one end of the first contact pin (4) penetrates through the carrier main body, and the other end of the first contact pin (4) penetrates through the first positioning hole (111), then is bent and connected with the metal plate (1);
one end of the third pin penetrates through the carrier main body, and the other end of the third pin penetrates through the third positioning hole (113), then is bent and connected with the metal plate (1);
one end of the second pin (3) penetrates through the carrier main body, and the other end of the second pin (3) penetrates through the second positioning hole (112) and then is connected with the resistor;
the first lead end is connected with the metal plate (1) through a lead, and the second lead end is connected with the resistor through a lead.
4. Burn-in board for a device according to any of claims 1 to 2, comprising a plurality of said mounting carriers, said metal plate (1) being provided with a plurality of said mounting locations (11), said plurality of mounting carriers being mounted on a plurality of said mounting locations (11) in a one-to-one correspondence.
5. Burn-in board for a device according to claim 3, comprising a plurality of said mounting carriers, said metal plate (1) being provided with a plurality of said mounting locations (11), a plurality of said mounting carriers being mounted on a plurality of said mounting locations (11) in a one-to-one correspondence;
and the resistors of the plurality of mounting carriers are connected with the second lead ends in series in sequence.
6. Burn-in board for a device according to claim 1, further comprising an auxiliary board (2) of a metal material, wherein the auxiliary board (2) is connected to the metal board (1) at a distance by a plurality of connectors, and wherein the mounting carrier is arranged on a side of the metal board (1) remote from the auxiliary board (2).
7. The burn-in board of a device of claim 6, further comprising a plurality of support feet in one-to-one correspondence with a plurality of said connecting members;
one end of the connecting piece penetrates through the metal plate (1), and the other end of the connecting piece penetrates through the auxiliary plate (2) and then is connected with the supporting legs.
8. The burn-in board of a device according to claim 6, further comprising at least one positioning member, each positioning member is sleeved on one of the connecting members, one end of the positioning member abuts against the metal plate (1), and the other end of the positioning member abuts against the auxiliary plate (2).
9. The burn-in board of a device according to any one of claims 6 to 8, wherein the metal plate (1) is one of a copper plate, an iron plate, an aluminum plate and an alloy plate, the auxiliary plate (2) is one of copper, iron, aluminum and an alloy, and the mounting carrier is one of polyaryletherketone, polyetheretherketone and polyurethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911158282.7A CN110988640B (en) | 2019-11-22 | 2019-11-22 | Aging board of device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911158282.7A CN110988640B (en) | 2019-11-22 | 2019-11-22 | Aging board of device |
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| CN110988640A CN110988640A (en) | 2020-04-10 |
| CN110988640B true CN110988640B (en) | 2022-03-11 |
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| CN201911158282.7A Active CN110988640B (en) | 2019-11-22 | 2019-11-22 | Aging board of device |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001067940A (en) * | 1999-08-25 | 2001-03-16 | Jsr Corp | Anisotropic conductive sheet |
| EP1744166A1 (en) * | 2004-04-27 | 2007-01-17 | JSR Corporation | Sheet-like probe, method of producing the probe, and application of the probe |
| US20110043239A1 (en) * | 2008-03-14 | 2011-02-24 | Fujifilm Corporation | Probe card |
| WO2012078944A1 (en) * | 2010-12-09 | 2012-06-14 | Wentworth Laboratories, Inc. | Probe card assemblies and probe pins including carbon nanotubes |
| CN102520280A (en) * | 2011-12-08 | 2012-06-27 | 台晶(宁波)电子有限公司 | Multi-temperature-point synchronous dynamic high-temperature aging acceleration test device |
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