CN110987809B - Circuit board detection device - Google Patents

Abstract

The application discloses circuit board detection device includes: the detection bracket is used for being detachably arranged on the transportation path of the circuit board, wherein an imaging place is arranged in a space area surrounded by the detection bracket; the imaging device comprises at least two imaging mounting assemblies, at least two imaging mounting assemblies and a detection support, wherein the at least two imaging mounting assemblies are respectively used for mounting imaging devices with different numbers, the at least two imaging mounting assemblies are arranged on the detection support in an adjustable position, and each imaging mounting assembly can be adjusted to an imaging position; and a controller for controlling the imaging device mounted on the imaging mounting assembly located at the imaging place to image the circuit board located on the transport path. The circuit board detection device provided by the application can save production cost.

Description

Circuit board detection device

Technical Field

The application relates to the technical field of circuit board detection, in particular to a circuit board detection device.

Background

In recent years, the development of information technology has led to rapid development of circuit boards as an important component of information technology, wherein in order to ensure that the output circuit boards are acceptable, the circuit boards need to be subjected to defect inspection in the production process. Meanwhile, with the increasing progress of artificial intelligence, the quality inspection of the circuit board by utilizing a visual algorithm is gradually replacing the traditional artificial quality inspection.

The inventor of the application finds that although the visual algorithm is rapidly developed in the aspect of quality inspection of the circuit board, the hardware matched with the visual algorithm is difficult to meet the requirements of easy replacement, maintenance free, low cost and the like.

Disclosure of Invention

The technical problem that this application mainly solves is to provide a circuit board detection device, can save manufacturing cost.

In order to solve the technical problems, one technical scheme adopted by the application is as follows: provided is a circuit board detection device including: the detection support is used for being detachably arranged on a transportation path of the circuit board, and an imaging place is arranged in a space area surrounded by the detection support; at least two imaging mounting assemblies for mounting different numbers of imaging devices, respectively, the at least two imaging mounting assemblies being adjustably positionable on the detection support, and each of the imaging mounting assemblies being adjustable to the imaging position; and a controller for controlling the imaging device mounted on the imaging mounting assembly at the imaging location to image the circuit board located on the transport path.

The beneficial effects of this application are: the circuit board detection device of the application includes two at least imaging installation components, and two at least imaging installation components are used for installing the imaging equipment of different quantity respectively, and every imaging installation component all can be adjusted to imaging department simultaneously to when the circuit board of different edition is imaged to the imaging equipment that needs to use different quantity, the imaging installation component that adjustable corresponds is to imaging department in order to install the imaging equipment that corresponds quantity, that is to say, the circuit board detection device of the application can satisfy the detection demand of the circuit board of various edition, realizes "one machine is multi-purpose", thereby can reduce the cost of production.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:

FIG. 1 is a schematic diagram of an embodiment of a circuit board inspection device according to the present application;

FIG. 2 is a schematic diagram of a portion of the circuit board inspection device of FIG. 1;

FIG. 3 is a schematic view of a portion of the circuit board inspection device of FIG. 1;

FIG. 4 is a schematic view of a portion of the circuit board inspection device of FIG. 1;

FIG. 5 is a schematic view of the assembly of FIG. 4 at another angle;

FIG. 6 is a schematic view of the assembly of FIG. 3 at another angle;

FIG. 7 is a schematic view of a portion of the circuit board inspection device of FIG. 1 with a first light source installed in an application scenario;

FIG. 8 is a schematic view of the assembly of FIG. 3 at another angle;

FIG. 9 is a schematic view of the structure of the docking block;

FIG. 10 is a schematic view of a portion of the circuit board detection device of FIG. 1 when a first light source is installed in another application scenario;

FIG. 11 is a schematic view of a portion of the circuit board inspection device of FIG. 1;

FIG. 12 is a schematic view of an exploded view of the positioning assembly of FIG. 11;

FIG. 13 is a schematic view of the positioning member of FIG. 12;

FIG. 14 is a schematic structural view of an imaging mounting plate;

FIG. 15 is a schematic view of the imaging mounting plate of FIG. 12 at another angle;

FIG. 16 is a schematic view of the structure of the installation fixture in an application scenario;

FIG. 17 is a schematic view of the mounting fixture of FIG. 16 with an imaging device mounted;

FIG. 18 is a schematic view of the structure of the installation fixture in another application scenario;

FIG. 19 is a schematic view of the mounting fixture of FIG. 18 with an imaging device mounted;

FIG. 20 is a schematic view of a part of a structure of a housing in an application scenario;

FIG. 21 is a schematic view of a portion of a housing in another application scenario;

fig. 22 is a schematic view of a part of the circuit board detection device in fig. 1 in operation.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Referring to fig. 1 to 3, the circuit board inspection apparatus 1000 includes an inspection bracket 1100, an image mounting assembly 1200, and a controller (not shown).

The inspection rack 1100 is detachably installed on the transportation path 1300 of the circuit board, wherein an imaging part 1101 is provided in a space area surrounded by the inspection rack 1100.

In this embodiment, as shown in fig. 2, two parallel rails 1310 are used to match with the transportation circuit board a, the detection bracket 1100 is detachably mounted on the two rails 1310, where the transportation path 1300 is formed between the two parallel rails 1310, the extending direction of the transportation path 1300 is consistent with the extending direction of the two rails 1310, and where the detection bracket 1100 is mounted on the two rails 1310 to construct a space region on one side of the transportation path 1300.

Specifically, when the inspection rack 1100 is mounted on the two rails 1310 without inspecting the circuit board a when the circuit board a on the transportation path 1300 is required, the inspection rack 1100 may be removed.

Of course, in other embodiments, the two rails 1310 for transporting the circuit board a may be disposed in a non-parallel manner, or may also be transported in other manners, such as a conveyor belt, where the detecting rack 1100 may be disposed adjacent to the conveyor belt, and in summary, the present application is not limited as to how the detecting rack 1100 is disposed on the transporting path 1300.

Meanwhile, the imaging area 1101 may be a specific position point or a position range, which is located in a space area surrounded by the detection frame 1100.

The number of imaging mounting assemblies 1200 is at least two, such as two, five or more (each illustrated in the figures as two imaging mounting assemblies 1200), and each imaging mounting assembly 1200 is configured to mount a different number of imaging devices, such as a normal camera, a CCD camera or other imaging-enabled device.

Wherein at least two imaging mount assemblies 1200 are adjustably positionable on the detection support 1100, and each imaging mount assembly 1200 is adjustable to an imaging position 1101.

While the controller controls the imaging device mounted on the imaging mounting assembly 1200 at the imaging location 1101 to image the circuit board. That is, when it is necessary to image a circuit board with an imaging device on a certain imaging mount assembly 1200, the imaging mount assembly 1200 needs to be adjusted to the imaging place 1101, wherein the imaging field of view of the imaging device is not blocked by any shielding when the imaging device is located at the imaging place 1101, and the quality of the final imaging can be ensured.

Specifically, the circuit boards a of different formats have different imaging requirements, for example, the circuit board a includes only one circuit board unit, while some circuit boards a include a plurality of circuit board units, or two circuit boards a also include only one circuit board unit have different sizes, and at this time, one imaging device has a limited imaging field of view, so that it is difficult to simultaneously meet multiple imaging requirements, and therefore, different numbers of imaging devices need to be set for the circuit boards a of different formats. In this embodiment, since at least two imaging mounting assemblies 1200 respectively used for mounting different numbers of imaging devices can be adjusted to the imaging position 1101, when detecting a circuit board a of a certain type, the imaging mounting assemblies 1200 capable of mounting a corresponding number of imaging devices can be adjusted to the imaging position 1101, and the imaging devices capable of mounting a corresponding number of imaging devices are mounted on the imaging mounting assemblies 1200, that is, the circuit board detecting device 1000 in this embodiment can simultaneously meet the detection requirements of the circuit boards a of various types, compared with the circuit board a of a single type which can be detected by one machine in the prior art, the cost can be greatly reduced in this embodiment.

Referring to fig. 3 and 4, the circuit board inspection apparatus 1000 further includes a connection assembly 1400.

The connection assembly 1400 is adjustably disposed on the detection support 1100, wherein at least two imaging mounting assemblies 1200 are respectively connected to the connection assembly 1400, and the at least two imaging mounting assemblies 1200 are respectively adjustable to the imaging position 1101 along with the adjustment of the position of the connection assembly 1400 relative to the detection support 1100.

Specifically, through the above arrangement, the positions of the plurality of imaging mounting assemblies 1200 can be adjusted simultaneously by adjusting the positions of the connecting assemblies 1400, when a certain imaging mounting assembly 1200 needs to be adjusted to the imaging position 1101, the positions of the connecting assemblies 1400 relative to the detecting bracket 1100 are correspondingly adjusted, so that the positions of at least two imaging mounting assemblies 1200 do not need to be respectively adjusted, that is, when a certain imaging mounting assembly 1200 needs to be adjusted to the imaging position 1101, the positions of the connecting assemblies 1400 need to be directly adjusted.

In an application scenario, the connection component 1400 is rotatably connected with the detection support 1100 to realize position-adjustable setting on the detection support 1100, and when a certain imaging installation component 1200 needs to be adjusted to the imaging position 1101, only the connection component 1400 needs to be rotated by a proper angle relative to the detection support 1100.

In another application scenario, the connection component 1400 is slidably connected with the detection support 1100 to be disposed on the detection support 1100 in a position adjustable manner, and when a certain imaging installation component 1200 needs to be adjusted to the imaging position 1101, only the connection component 1400 needs to be slid to a proper position relative to the detection support 1100.

In summary, the present application is not limited as to how the connection assembly 1400 is positionally adjustably disposed on the detection bracket 1100.

With continued reference to fig. 3, the inspection rack 1100 includes four supports 1110 and two first connectors 1120, wherein two groups of the four supports 1110 are symmetrically erected on two rails 1310 for transporting the circuit board a, and the two first connectors 1120 are respectively connected to the two supports 1110 erected on the same rail 1310.

Specifically, the arrangement of four supports 1110 and two first connectors 1120 can ensure the stability of the detection rack 1100. In other embodiments, the support 1110 and the first connector 1120 may have other structures such as a circular rod, and the like, which is not limited herein.

In other embodiments, the number of the supporting members 1110 may be more than 4, and the number of the first connecting members 1120 may be more than two, which is not limited herein.

In an application scenario, in order to be able to adjust the distance between two support members 1110 disposed on the same track 1310, the first connection member 1120 is provided with a plurality of connection portions 1121 arranged at intervals along the extending direction thereof, and the two support members 1110 are adjustably fixed on the first connection member 1120 by the plurality of connection portions 1121, wherein the connection portions 1121 may be through holes, and when the distance between the two support members 1110 on the same track 1310 needs to be adjusted, fasteners such as screws are used to pass through the corresponding through holes to lock the support members 1110 and the first connection member 1120.

With continued reference to fig. 3 and 4, the connection assembly 1400 includes two second connection members 1410, and the two second connection members 1410 are respectively rotatably connected to the two first connection members 1120, such that the connection assembly 1400 is rotatably connected to the detection frame 1100, wherein at least two imaging mounting assemblies 1200 are simultaneously connected to the two second connection members 1410.

Specifically, each of the imaging mounting assemblies 1200 is connected to two second connectors 1410, wherein one second connector 1410 may ensure mounting fixability of the imaging mounting assembly 1200 as well as smoothness of the adjustment position process as compared to two second connectors 1410.

Meanwhile, the rotation axes of the two second connecting members 1410 rotating relative to the first connecting member 1120 are located on the same horizontal line, the number of the at least two imaging mounting assemblies 1200 is two, and the two imaging mounting assemblies 1200 are respectively connected to the ends of the two second connecting members 1410 close to each other. For convenience of description, the two imaging mount assemblies 1200 are defined as a first imaging mount assembly 1210 and a second imaging mount assembly 1220, respectively, and in an application scenario, the first imaging mount assembly 1210 is capable of mounting one imaging device and the second imaging mount assembly 1220 is capable of mounting two imaging devices.

At this time, when the imaging mounting assembly 1200 located at the imaging position 1101 needs to be switched, the two second connectors 1410 are rotated together relative to the detection bracket 1100, so that the first imaging mounting assembly 1210 located at the imaging position 1101 can be switched to the second imaging mounting assembly 1220, or the second imaging mounting assembly 1220 located at the imaging position 1101 can be switched to the first imaging mounting assembly 1210.

In this embodiment, as shown in fig. 3, the second connecting members 1410 are in a straight plate structure, and at this time, the two second connecting members 1410 are rotated together by 180 degrees relative to the detecting frame 1100 to complete the switching of the imaging assembly 1200 located at the imaging position 1101, and at this time, the controller controls the imaging device located on the imaging assembly 1200 installed below to image the circuit board, that is, at this time, the imaging position 1101 is in the position range where the second imaging assembly 1220 in fig. 3 is located.

In other embodiments, the connection assembly 1400 may include only one second connection member 1410, where one second connection member 1410 may be rotatably connected to both first connection members 1120 at the same time, or only one first connection member 1120 may be rotatably connected, and the first imaging mounting assembly 1210 and the second imaging mounting assembly 1220 may be respectively connected to both ends of the second connection member 1410.

Referring to fig. 4 and 5, the first imaging mounting assembly 1210 and the second imaging mounting assembly 1220 each include an imaging mounting backplate 1211, a first imaging mounting slide rail 1212, and a first imaging mounting slide 1213.

The imaging mounting backplate 1211 includes a first backplate surface 12111 and a second backplate surface 12112 disposed opposite each other, and one end of the imaging mounting backplate 1211 is fixedly connected to a second connector 1410 for mounting the imaging device; the first imaging mounting slide rail 1212 is disposed on the first back plate surface 12111 of the imaging mounting back plate 1211, and the first imaging mounting slide block 1213 is slidably disposed on the first imaging mounting slide rail 1212 and fixedly coupled to the other second connector 1410, such that the first imaging mounting slide block 1213 slides along the first imaging mounting slide rail 1212 when the spacing between the two second connectors 1410 is adjusted.

In particular, the dimensions of the circuit board a are different for different versions, as is the spacing between the two rails 1310 for transportation. It will be appreciated that when the spacing between the two rails 1310 is different, the spacing between the two second connectors 1410 is required to be changed, so that in order to enable the circuit board a inspection device 1000 to meet the inspection requirements of circuit boards a of different models, the imaging mounting backboard 1211, the first imaging mounting slide rail 1212 and the first imaging mounting slide block 1213 are provided, so that the imaging apparatus can be mounted, and the adjustable spacing between the two second connectors 1410 can be ensured.

With continued reference to fig. 4 and 5, the first imaging mounting assembly 1210 and the second imaging mounting assembly 1220 further include a second imaging mounting slide 1214 and a second imaging mounting slide 1215.

The second imaging mounting rail 1214 is disposed on the second backplate surface 12112 of the imaging mounting backplate 1211; the second imaging mounting slide 1215 is slidably disposed on the second imaging mounting rail 1214 for mounting the imaging device and sliding the imaging device along the second imaging mounting rail 1214.

Specifically, when the position of the imaging device on the imaging mounting backplate 1211 needs to be adjusted, the second imaging mounting slide 1215 slides relative to the second imaging mounting slide rail 1214, thereby driving the imaging device to slide, and changing the imaging field of view of the imaging device.

In an application scenario, the second imaging mounting slide 1214 is an electronically controlled slide that is capable of controlling the distance the second imaging mounting slide 1215 slides.

Wherein a second imaging mounting slide 1215 is mounted to each second imaging mounting slide 1214, each second imaging mounting slide 1215 mounts an imaging device, such that, in an application scenario, as shown in fig. 5, the first imaging mounting assembly 1210 includes a second imaging mounting slide 1214, and the second imaging mounting assembly 1220 includes two second imaging mounting slides 1214.

In other embodiments, the second imaging mounting rail 1214 and the second imaging mounting slider 1215 may not be provided, and the imaging apparatus may be directly mounted on the imaging mounting backplate 1211.

Referring to fig. 3, two second connectors 1410 are detachably connected to two first connectors 1120, respectively.

Specifically, when the imaging mounting assembly 1200 at the imaging location 1101 needs to be switched, the two second connectors 1410 are separated from the two first connectors 1120, and then the two second connectors 1410 are turned 180 degrees, so that the positions of the first imaging mounting assembly 1210 and the second imaging mounting assembly 1220 are switched, and the switching of the imaging mounting assembly 1200 at the imaging location 1101 is realized.

In other embodiments, the connection between the two second connectors 1410 and the two first connectors 1120 may be non-detachable. For example, the two second links 1410 are rotatably coupled to the two first links 1120 by a rotation shaft that prevents the second links 1410 from being separated from the first links 1120, respectively, but during adjustment, the rotation shaft may be released to allow the second links 1410 to rotate about the rotation shaft relative to the first links 1120, while the rotation shaft may be locked to allow the second links 1410 to be fixed relative to the first links 1120, so that when it is desired to switch the imaging mount assembly 1200 at the imaging site 1101, the rotation shaft may be released and then locked.

In summary, the present application is not limited with respect to whether the second connector 1410 can be separated from the first connector 1120.

Referring to fig. 3 and 4, the circuit board inspection apparatus 1000 further includes a bending member 1500.

The number of the bending members 1500 is two, so that the two second connecting members 1410 are detachably connected to the two first connecting members 1120, and the bending members 1500 specifically include a first connecting plate 1510 and a second connecting plate 1520 connected at a certain angle (for example, 90 degrees), the first connecting plate 1510 is connected to the second connecting member 1410, and the second connecting plate 1520 is connected to the first connecting member 1120, where the bending member 1500 is detachably connected to at least one of the second connecting member 1410 and the first connecting member 1120.

In an application scenario, when the second connecting piece 1410 is rotated, the bending piece 1500 is separated from the first connecting piece 1120, then the second connecting piece 1410 is turned over, and then the bending piece 1500 is reconnected with the first connecting piece 1120, so that the whole rotation process is convenient and quick.

In other application scenarios, when the second connecting piece 1410 is rotated, the bending piece 1500 is separated from the second connecting piece 1410, then the second connecting piece 1410 is turned over, and then the bending piece 1500 is reconnected with the second connecting piece 1410.

In an application scenario, the first connecting plate 1510 and the second connecting plate 1520 are provided with a plurality of through holes, and the bending piece 1500 is connected to the second connecting piece 1410 and the first connecting piece 1120 respectively by means of screw locking.

In this embodiment, the length of the second connector 1410 is adjustable.

In particular, when the imaging mount assembly 1200 located at the imaging site 1101 is switched, since the number of imaging devices mounted at the imaging site 1101 is changed, the field of view of the imaging devices may need to be readjusted. The length of the second connecting piece 1410 is adjustable, so that the height of the imaging device positioned at the imaging position 1101 relative to the circuit board A can be adjusted according to different application scenes, and the field of view of the imaging device can be adjusted.

Referring to fig. 4 and 5, the second connector 1410 includes a first sub-connector 1411 and a second sub-connector 1412, one end of the first sub-connector 1411 is connected to the first imaging mounting assembly 1210, one end of the second sub-connector 1412 is connected to the second imaging mounting assembly 1220, and the other end of the first sub-connector 1411 is adjustably fixed to the second sub-connector 1412.

The other end of the first sub-link 1411 is provided to be adjustably fixed to the second sub-link 1412 to enable the length of the second link 1410 to be adjusted.

In an application scenario, as shown in fig. 4, the first sub-connector 1411 and the second sub-connector 1412 are respectively provided with a plurality of first through holes 14111 arranged at intervals along respective extending directions, so that the other end of the first sub-connector 1411 is fixed on the second sub-connector 1412 in an adjustable position.

Specifically, when it is necessary to adjust the field of view of the image forming apparatus, the first and second sub-connectors 1411 and 1412 are locked together by passing fasteners such as screws through the corresponding first through-holes 14111.

In other embodiments, the other end of the first sub-connector 1411 may be adjustably fixed to the second sub-connector 1412 by other structures, for example, the first sub-connector 1411 may be provided with a protrusion, and the second sub-connector 1412 may be provided with a plurality of through holes spaced along the extending direction thereof, at this time, the other end of the first sub-connector 1411 may be adjustably fixed to the second sub-connector 1412 by passing the protrusion through different through holes, or the first sub-connector 1411 may be slidably disposed on the second sub-connector 1412 by a sliding rail, and at this time, it is also possible to fix the first sub-connector 1411 to the second sub-connector 1412 in an adjustable position.

Referring to fig. 6 and 7, the circuit board inspection apparatus 1000 further includes a light source mounting assembly 1600.

The light source mounting assembly 1600 is connected to the detection bracket 1100 for mounting the first light source 1700.

The light source mounting assembly 1600 is located above the two rails 1310 and the extending direction of the light source mounting assembly 1600 is perpendicular to the extending direction of the two rails 1310, so that the first light source 1700 mounted on the light source mounting assembly 1600 is located between the imaging site 1101 and the transportation path 1300.

Specifically, when imaging the circuit board a, ambient light plays a decisive role in the quality of imaging, and when the ambient light is insufficient, imaging may be blurred, resulting in difficulty in detecting defects on the circuit board a, and thus when the light is dark, it is necessary to install the first light source 1700 for providing illumination for the circuit board detection device 1000.

In an application scenario, first light source 1700 is a coaxial light source in order to improve illumination uniformity and reduce reflection of light.

Meanwhile, the coaxial light source is generally in a cuboid structure, so that the extending direction of the light source mounting assembly 1600 and the extending directions of the two tracks 1310 are mutually perpendicular, the coaxial light source mounted on the light source mounting assembly 1600 can be guaranteed to be arranged opposite to the transmission path 1300, and then the light emitted by the coaxial light source can be guaranteed to be totally irradiated on the circuit board A.

With continued reference to fig. 6 and 7, the light source mounting assembly 1600 is provided with a plurality of first mounting portions 1601, and different types of first light sources 1700 are connected to the light source assembly 1600 by mating first mounting portions 1601.

For circuit boards a of different formats, the sizes of the circuit boards a are different, and the types of the first light sources 1700 are different, so that the light source mounting assembly 1600 is provided with a plurality of first mounting portions 1601 for detachably mounting the first light sources 1700 of different types, so that the circuit board detection device 1000 can meet the detection requirements of the circuit boards a of various formats, and the cost is saved.

With continued reference to fig. 6, the light source mounting assembly 1600 includes a first light source mounting plate 1610, where the first light source mounting plate 1610 is provided with a plurality of first mounting portions 1601, where the first light source mounting plate 1610 is disposed upright and connected with two support members 1110 in the detection stand 1100, and an extending direction of the first light source mounting plate 1610 is perpendicular to an extending direction of the track 1310.

Mounting of the first light source 1700 with the first light source mounting plate 1610 can ensure mounting stability of the first light source 1700 as compared to mounting of the first light source 1700 with a mounting rod.

In an application scenario, as shown in fig. 6, the plurality of first mounting portions 1601 includes a plurality of through holes disposed on the first light source mounting board 1610, and the apertures of the plurality of through holes and the intervals between the plurality of through holes may be completely identical or not completely identical according to the type of the first light source 1700 to be mounted. At this time, when the first light source 1700 is mounted, the first light source 1700 may be locked to the first light source mounting plate 1610 by passing fasteners such as screws through a plurality of through holes matched with the first light source 1700 according to the size of the first light source 1700.

It will be appreciated that different first light sources 1700 may be connected to first light source mounting plates 1610 by the same plurality of through holes, or may be connected to first light source mounting plates 1610 by different plurality of through holes, as the specific case may be, depending on the mounting portions on first light sources 1700.

In another application scenario, the plurality of first mounting portions 1601 includes a clamping groove (not shown) disposed on the first light source mounting board 1610, and similar to the plurality of through holes, the plurality of clamping grooves may or may not be identical in size and spacing therebetween, and at this time, when the first light source 1700 is mounted, the first light source 1700 may be clamped in a plurality of clamping grooves matching the plurality of clamping grooves according to the size of the first light source 1700.

In other application scenarios, the plurality of first mounting portions 1601 may include a plurality of through holes and a plurality of clamping grooves at the same time, or the plurality of first mounting portions 1601 may also be other structures capable of playing a role in fixing, and in summary, the structure of the first mounting portions 1601 is not limited in this application, as long as it enables all the different types of first light sources 1700 to be mounted on the first light source mounting board 1610.

Referring to fig. 6 and 8, the mounting assembly 1600 further includes a second light source mounting plate 1620 and a third light source mounting plate 1630.

The second light source mounting plate 1620 is disposed parallel to the first light source mounting plate 1610 and is connected to the other two supporting members 1110 not connected to the first light source mounting plate 1610 for mounting the first light source 1700 in cooperation with the first light source mounting plate 1610, while the third light source mounting plate 1630 is perpendicular to the second light source mounting plate 1620 and is connected to a side of the second light source mounting plate 1620 near the transportation path 1300 for supporting the first light source 1700.

Specifically, the arrangement of the second light source mounting plate 1620 and the third light source mounting plate 1630 can ensure the mounting stability of the first light source 1700. In order to ensure that the second light source mounting board 1620 and the third light source mounting board 1630 can be better matched with the first light source mounting board 1610 to mount the first light source 1700, a plurality of first mounting portions 1601 are also provided on the second light source mounting board 1620 and the third light source mounting board 1630, when different first light sources 1700 are mounted, the first light sources 1700 are mounted by using the first mounting portions 1601 matched with the first light sources 1700, wherein the first mounting portions 1601 provided on the second light source mounting board 1620 and the third light source mounting board 1630 may have various structures such as through holes and grooves, and the like, which are not limited herein.

In the present embodiment, the first light source mounting plate 1610 and/or the second light source mounting plate 1620 are adjustably coupled to the support 1110 in the extending direction of the support 1110 to adjust the height at which the first light source mounting plate 1610 and/or the second light source mounting plate 1620 is mounted on the support 1110.

In particular, by providing first light source mounting plate 1610 and/or second light source mounting plate 1620 adjustably coupled to support 1110, the height of first light source 1700 relative to circuit board a may be indirectly adjusted.

Referring to fig. 6, the support 1110 is provided with a plurality of second mounting portions 1111 spaced apart from each other along an extending direction thereof, and the first light source mounting plate 1610 and/or the second light source mounting plate 1620 are adjustably coupled to the support 1110 through the plurality of second mounting portions 1111.

Specifically, the second mounting portion 1111 is configured to enable the first light source mounting plate 1610 and/or the second light source mounting plate 1620 to move along the extending direction of the support 1110, and when the height of the first light source 1700 relative to the circuit board a needs to be adjusted, the first light source mounting plate 1610 and/or the second light source mounting plate 1620 is connected to the support 1110 through the appropriate second mounting portion 1111.

In an application scenario, the plurality of second mounting portions 1111 include through holes provided on the support 1110, and in other application scenarios, the plurality of second mounting portions 1111 include grooves provided on the support 1110, similar to the first mounting portions 1601, the structure of the second mounting portions 1111 is not limited in this application.

In this embodiment, the distance between the ends of the first light source mounting plate 1610 and/or the second light source mounting plate 1620 relative to the corresponding mating support 1110 is adjustable in the direction of extension of the light source mounting assembly 1600 to accommodate the adjustment of the distance between the two rails 1310.

When detecting circuit boards a of different formats, the spacing between the two tracks 1310 may need to be adjusted accordingly, so that the distance between the ends of the first light source mounting board 1610 and/or the second light source mounting board 1620 with respect to the corresponding matched support 1110 is adjustable, so as to meet the detection requirements of different circuit boards a.

Referring to fig. 6, in the present embodiment, a light source mounting rail 1602 is provided on a surface of the first light source mounting plate 1610 and/or the second light source mounting plate 1620, and a light source mounting slider 1603 is slidably provided on the light source mounting rail 1602. Meanwhile, one of the two supporting pieces 1110 connected with the first light source mounting plate 1610/the second light source mounting plate 1620 is fixedly connected with the first light source mounting plate 1610/the second light source mounting plate 1620, the other is fixedly connected with the light source mounting slide blocks 1603 on the first light source mounting plate 1610/the second light source mounting plate 1620, and when the distance between the two supporting pieces 1110 connected with the first light source mounting plate 1610/the second light source mounting plate 1620 is adjusted, the corresponding light source mounting slide blocks 1603 slide relative to the light source mounting slide rails 1602.

Specifically, when the interval between the two tracks 1310 needs to be adjusted, the light source mounting slider 1603 is slid relative to the light source mounting rail 1602, so that the light source mounting slider 1603 drives the support 1110 connected thereto away from the corresponding other support 1110, so that the two supports 1110 connected to the first light source mounting board 1610 and the second light source mounting board 1620 adapt to the adjustment of the distance between the two tracks 1310.

Referring to fig. 6 and 8, the surface area of the first light source mounting board 1610 is larger than the surface area of the second light source mounting board 1620, a first number of light source mounting rails 1602 are provided on the surface of the first light source mounting board 1610, and a second number of light source mounting rails 1602 are provided on the surface of the second light source mounting board 1620, the first number being equal to or larger than the second number.

Specifically, the surface area of the first light source mounting plate 1610 is larger than the surface area of the second light source mounting plate 1620, so that cost can be saved, when the first light source 1700 is mounted, the first light source mounting plate 1610 is used as a main mounting plate, the second light source mounting plate 1620 is used as an auxiliary mounting plate, that is, the first light source mounting plate 1610 plays a primary mounting and fixing role, and the second light source mounting plate 1620 plays a secondary mounting and fixing role. Meanwhile, the number of the light source mounting sliding rails 1602 corresponding to the first light source mounting plate 1610 is greater than or equal to the number of the light source mounting sliding rails 1602 corresponding to the second light source mounting plate 1620, so that stability of the first light source mounting plate 1610 and the second light source mounting plate 1620 can be ensured when the distance between the supporting pieces 1110 is adjusted.

In an application scenario, the first number is two and the second number is one.

As shown in fig. 7 and 10, in different application scenarios, the first light source 1700 may be installed using only the first light source mounting plate 1610, or the first light source 1700 may be installed using the first light source mounting plate 1610, the second light source mounting plate 1620, and the third light source mounting plate 1630 at the same time.

Referring to fig. 6 and 9, the circuit inspection device 1000 further includes a docking block 1800 for connecting the rail 1310 and the support 1110, respectively.

Wherein, the number of the connection blocks 1800 corresponds to the number of the supporting pieces 1110, the connection blocks 1800 are provided with a plurality of third installation parts 1810 which are arranged at intervals along the extending direction of the track 1310, and the supporting pieces 1110 are connected with the connection blocks 1800 in an adjustable position through the third installation parts 1810.

Specifically, the third mounting portion 1810 is configured to adjust the distance between two supporting members 1110 disposed on the same track 1310, so as to meet the detection requirements in different application scenarios.

In one application scenario, the plurality of third mounting portions 1810 includes mounting holes disposed on the docking block 1800, and in another application scenario, the plurality of third mounting portions 1810 includes grooves disposed on the docking block 1800, similar to the first mounting portions 1601 and the second mounting portions 1111, the structure of the third mounting portions 1810 is not limited in this application.

Referring to fig. 1, 11 and 12, the circuit board inspection apparatus 1000 further includes a positioning assembly 1900, and the positioning assembly 1900 is used for positioning the circuit board a, so as to facilitate subsequent installation of the imaging device according to the position of the circuit board a.

Wherein the imaging device mounted on the circuit board a positioned according to the positioning assembly 1900 functions differently from the imaging device mounted on the imaging mounting assembly 1200, the imaging device mounted on the imaging mounting assembly 1200 is defined as a first imaging device and the imaging device mounted on the circuit board a positioned according to the positioning assembly 1900 is defined as a second imaging device for the sake of distinction.

Specifically, the first imaging device is configured to image the first surface of the circuit board a to determine whether the circuit board a has a defect, the second imaging device is configured to image the second surface of the circuit board a, where the second surface of the circuit board a is provided with a mark point, and when the mark point exists in an image obtained by the second imaging device during detection, the trigger controller controls the first imaging device located at the imaging location 1101 to image the first surface of the circuit board a, and in short, the second imaging device is configured to detect the position of the circuit board a, specifically to detect whether the circuit board a is transported to a proper position.

Because the second imaging device is used for detecting the position of the circuit board a, the installation position of the second imaging device is extremely important, otherwise, when the installation position of the second imaging device deviates, the circuit board a is already at a proper position, but no mark point exists in an image obtained by the second imaging device, so that the embodiment locates the position of the circuit board a through the locating component 1900, and then installs the second imaging device according to the location of the circuit board a, so that the installation position of the second imaging device is ensured to be correct. In particular, the positioning assembly 1900 includes a positioning member 1910 and a positioning plate 1920.

The positioning piece 1910 is used for detachably abutting against the reference element and extends in a direction away from the reference element; the positioning plate 1920 abuts against one end of the positioning member 1910 away from the reference element, and a plurality of positioning portions 1921 are arranged on the surface of the positioning plate 1920, wherein when the target element is positioned, the surface of the positioning plate 1920 provided with the plurality of positioning portions 1921 faces the target element to determine the positioning portion 1921 corresponding to the target element.

In the present embodiment, the positioning member 1910 is detachably abutted against the inspection support 1100 as the reference member, that is, when the circuit board a needs to be positioned, one end of the positioning member 1910 may be brought into contact with the inspection support 1100 as the reference member, and when the circuit board a does not need to be positioned, the positioning member 1910 may be separated from the inspection support 1100 as the reference member.

At the same time, the positioning plate 1920 abuts against the end of the positioning member 1910 remote from the reference element, i.e., when positioned using the positioning assembly 1900, the positioning plate 1920 is in contact with the end of the positioning member 1910 remote from the reference element.

In an application scenario, as shown in fig. 11, the positioning member 1910 is removably abutted against the docking block 1800 as a specific reference element.

In other embodiments, the positioning member 1910 may also removably abut against the track 1310 as a reference element.

Meanwhile, in the present embodiment, the circuit board a as a target element is positioned by the positioning assembly 1900, and then the second imaging device is mounted according to the positioning of the circuit board a.

Specifically, when the positioning assembly 1900 is used to position the circuit board a, the positioning member 1910 abuts against the connection block 1800, the positioning plate 1920 is connected to one end of the positioning member 1910 away from the connection block 1800, the surface of the positioning plate 1920 provided with the positioning portion 1921 faces the circuit board a on the transportation path 1300, at this time, an orthographic projection exists on the positioning plate 1920 on the circuit board a, particularly on a mark point on the circuit board a, the positioning portion 1921 overlapping with the projection in the positioning portions 1921 is observed, and then the second imaging device is placed at the positioning portion 1921 overlapping with the projection, so that the installation position of the second imaging device is finally ensured.

Referring to fig. 12, the plurality of positioning portions 1921 include a plurality of positioning holes provided on the positioning plate 1920.

Positioning portion 1921 is configured as a positioning hole, so that positioning assembly 1900 can perform not only positioning but also mounting. Specifically, after the correct position of the second imaging device is found by the positioning assembly 1900, the second imaging device is placed in the corresponding position of the positioning plate 1920, and then the second imaging device is locked to the positioning plate 1920 through the positioning hole.

In an application scenario, the positioning holes are through holes, and then when the second imaging device is installed, the second imaging device can be locked on the positioning plate 1920 by using fasteners such as screws to pass through the corresponding through holes.

In other application scenarios, the positioning units 1921 include positioning marks disposed on the positioning board 1920, where the positioning assembly 1900 only performs a positioning function, and is a tool, specifically, after the installation position of the second imaging device is found by the positioning assembly 1900, the second imaging device is placed in a correct position, then the second imaging device is disposed to be connected with other elements, and finally the positioning assembly 1900 is removed.

It will be appreciated that when it is desired to mount the second imaging device via the positioning assembly 1900, the positioning member 1910 needs to be mounted with the reference element (e.g., the docking block 1800), at which point fasteners such as screws may be used to mount the positioning member 1910 with the reference element.

Wherein, locating part 1910 and locating plate 1920 can dismantle the connection, specifically, locating part 1910 and locating plate 1920 are two independent components, with locating plate 1910 and locating plate 1920 support together after being in the same place, can be through fastening clip such as screw with both sides connection, and this kind of setting is convenient for transport on the one hand, and on the other hand when one of two components takes place to damage, can dismantle, change the component of damage, reaches the purpose of saving the cost.

In one application scenario, the positioning element 1910 is detachably connected with the positioning plate 1920 through a fastener such as a screw, in another application scenario, the positioning element 1910 and the positioning plate 1920 are detachably connected through a clamping groove and a bump in a matching mode, in other application scenarios, the positioning element 1910 and the positioning plate 1920 are also detachably connected through glue and other modes, and the positioning element 1910 and the positioning plate 1920 are not limited herein.

Referring to fig. 13, the positioning member 1910 includes a first sub-positioning member 1911, a second sub-positioning member 1912, and a third sub-positioning member 1913.

The first sub-locator 1911 is configured to removably rest on a reference element (e.g., the docking block 1800); the second sub-positioning member 1912 is perpendicular to the first sub-positioning member 1911 and is connected to a side edge of the first sub-positioning member 1911 remote from the reference member; the third sub-positioning member 1913 is perpendicular to the second sub-positioning member 1912 and is connected to a side edge of the second sub-positioning member 1912 remote from the first sub-positioning member 1911, wherein the positioning plate 1920 abuts against the side edge of the third sub-positioning member 1913.

In an application scenario, the first sub-locator 1911 is detachably connected to the second sub-locator 1912, and the second sub-locator 1912 is detachably connected to the third sub-locator 1913. Similar to the above, the detachable structure can be realized by fastening elements such as screws, or can be realized by a clamping groove and a protruding block in a matching way.

Wherein, to facilitate positioning the positioning assembly 1900, a notch matching the reference element (e.g. the docking block 1800) is provided on a side edge of the first sub-positioning member 1911 abutting against the reference element, and a notch matching the positioning plate 1920 is provided on a side edge of the third sub-positioning member 1913 abutting against the positioning plate 1920, wherein, to distinguish between the two notches, the notch on the first sub-positioning member 1911 is defined as a first notch 19111, and the notch on the third sub-positioning member 1913 is defined as a second notch 19131.

Specifically, when the first sub-positioner 1911 abuts against the reference element, at least a portion of the reference element fits within the first notch 19111, and when the third sub-positioner 1913 is connected to the positioning plate 1920, at least a portion of the positioning plate 1920 fits within the second notch 19131.

In other embodiments, the mounting assembly 1900 may be provided with both the first notch 19111 and the second notch 19131, or only one of them may be provided.

Specifically, when positioning by using the positioning assembly 1900, the positioning element 1910 is attached to the reference element through the first notch 19111, and then the positioning plate 1920 is attached to the positioning element 1910 through the second notch 19131.

In order to facilitate the processing, the first notch 19111 and the second notch 19131 on the first sub-positioning member 1911 and the third sub-positioning member 1913 are all right angle notches, however, in other embodiments, the first notch 19111 and the second notch 19131 may be other opposite notches, specifically, the notches are set according to the shapes of the reference element and the positioning plate 1920, which is not limited herein.

In other embodiments, the positioning assembly 1900 may not only aid in mounting the second imaging device, but may also aid in mounting other components, that is, the positioning assembly 1900 may be used in other fields, without limitation.

In this embodiment, also for the purpose of image quality, the circuit board detection device 1000 further includes a second light source (not shown) that is used with the second imaging device, where in an application scenario, the second light source is a coaxial light source.

Referring to fig. 14, the circuit board inspection apparatus 1000 further includes an imaging mounting board 1010, and the imaging mounting board 1010 is used to mount an imaging device.

A plurality of different imaging mounting portions 1011 are provided on the mounting surface of the imaging mounting plate 1010, each imaging mounting portion 1011 being respectively matched to one corresponding type of imaging apparatus so that the different types of imaging apparatus are mounted and fixed on the imaging mounting plate 1010 by the different imaging mounting portions 1011, wherein any two of the different imaging mounting portions 1011 have partially overlapping regions.

In the prior art, manufacturers of all imaging devices only adapt to the mounting plates suitable for brands of the imaging devices at home, so that the original mounting plates are required to be detached in the process of adjusting the imaging devices, and the whole process is complex.

In this embodiment, the imaging mounting board 1010 is provided with different imaging mounting portions 1011, different imaging devices can select the imaging mounting portion 1011 matched with the imaging device to be mounted on the imaging mounting board 1010, that is, one imaging mounting board 1010 can be simultaneously suitable for different types of imaging devices, so that 'one-board-multipurpose' is realized, in the process of changing the imaging devices, the original imaging mounting board 1010 is not required to be dismounted, only the imaging devices are required to be dismounted directly, the operation is convenient, and when materials are purchased, the imaging devices corresponding to different types are also only required to be purchased, and the production cost can be reduced.

Meanwhile, any two different imaging mounting parts 1011 have partially overlapped areas, so that the surface area of the whole imaging mounting plate 1010 can be reduced, the occupied space of the imaging mounting plate 1010 is reduced, and finally the volume of the circuit board detection device 1000 is reduced.

With continued reference to fig. 14, the mounting surface of the imaging mounting plate 1010 is provided with a plurality of first mounting holes 10111 of different specifications, and the area defined by the first mounting holes 10111 of each specification constitutes a corresponding imaging mounting portion 1011.

In the present embodiment, the first mounting holes 10111 are through holes, and when the image forming apparatus is mounted, the image forming apparatus is locked to the image forming mounting plate 1010 by passing fasteners such as screws through the corresponding first mounting holes 10111. In other embodiments, the first mounting hole 10111 may be a blind hole, and at this time, the imaging device may be directly clamped in the corresponding blind hole during mounting. In other embodiments, the imaging mounting portion 1011 may have other structures, and is not limited thereto.

In an application scenario, the first mounting holes 10111 of different specifications have different pore sizes, for example, some of the first mounting holes 10111 have a pore size of 5.5mm, and some of the first mounting holes 10111 have a pore size of 6.5mm.

The first mounting holes 10111 of different apertures at this time are used to mount different types of image forming apparatuses, and the image forming mounting sections 1011 to mount different types of image forming apparatuses at this time do not include the same first mounting hole 10111.

In another application scenario, the shape or area of the area defined by the first mounting holes 10111 of different specifications is different.

Unlike the above application scenario, the image forming mounting portion 1011 on which different types of image forming apparatuses are mounted may include the same first mounting hole 10111, as shown in fig. 15, the first mounting hole 10111 of reference numeral 1 is fitted with a first type of image forming apparatus, the first mounting hole 10111 of reference numeral 2 is fitted with a second type of image forming apparatus, the first mounting hole 10111 of reference numeral 3 is fitted with a third type of image forming apparatus, and the first mounting hole 10111 of reference numeral 4 is fitted with a fourth type of image forming apparatus, wherein the image forming mounting portion 1011 on which the third type of image forming apparatus is mounted may include the same first mounting hole 10111 as the image forming mounting portion 1011 on which the second type of image forming apparatus is mounted.

Also in the present embodiment, the first mounting holes 10111 of each specification include four first mounting holes 10111 of the same specification or three first mounting holes 10111 of the same specification.

For example, in fig. 15, the image forming mounting portion 1011 to which the image forming apparatus of the first model is mounted includes four first mounting holes 10111 of the same specification, and the image forming mounting portion 1011 to which the image forming apparatus of the fourth model is mounted includes three first mounting holes 10111 of the same specification.

With continued reference to fig. 14, a plurality of second mounting holes 10112 are formed in a side surface of the imaging mounting plate 1010, wherein the imaging mounting plate 1010 is detachably mounted on other imaging mounting plates 1010 or the slide fixing plate through the second mounting holes 10112.

In an application scenario, referring to fig. 16 and 17, the imaging mounting board 1010 and the slide fixing board 1020, and the slider 1030 are matched to mount the imaging device, in the assembly process, the slider 1030 and the slide fixing board 1020 are connected, and then the imaging mounting board 1010 is mounted on the side of the slide fixing board 1020 far away from the slider 1030, wherein in the process of mounting the imaging mounting board 1010, fasteners such as screws are used to penetrate through the slide fixing board 1020 and extend into the second mounting hole 10112, so that the slide fixing board 1020 and the imaging mounting board 1010 are locked.

In other applications, when it is desired to mount the imaging device elsewhere, the imaging mounting plate 1010 may also be mounted to another imaging mounting plate 1010 through the second mounting holes 10112.

With continued reference to fig. 14, the mounting surface of the imaging mounting plate 1010 is further provided with a plurality of third mounting holes 10113, and the imaging mounting plate 1010 is detachably mounted with the second mounting holes 10112 on the second imaging mounting plate 2010 through the third mounting holes 10113, so that the imaging mounting plate 1010 is vertically mounted on the second imaging mounting plate 2010, wherein the imaging mounting plate 1010 has the same structure as the second imaging mounting plate 2010.

For an imaging apparatus having only one side provided with a mounting portion, when it is required to be rotated by 90 degrees, two imaging mounting plates 1010 are required to be used in cooperation, and at this time, vertical connection of the two imaging mounting plates 1010 is achieved through the second mounting hole 10112 and the third mounting hole 10113.

Specifically, with reference to fig. 18 and 19, the two imaging mounting plates 1010 and the slide fixing plates 1020, 1030 cooperate to mount the imaging apparatus, at which time the imaging apparatus can be adjusted from the state of fig. 17 to the state of fig. 19, i.e., 90-degree rotation is achieved.

In an application scenario, the number of the third mounting holes 10113 is multiple, the plurality of the third mounting holes 10113 are distributed on two opposite edges of the imaging mounting plate 1010, and the number of the third mounting holes 10113 arranged on each edge of the imaging mounting plate 1010 is also multiple, wherein two third mounting holes 10113 respectively arranged on two edges are a group (for example, four groups exist in fig. 14), and when two imaging mounting plates 1010 are connected, connection is realized through one group of the third mounting holes 10113, so that the connection stability of the two imaging mounting plates 1010 is ensured.

Simultaneously, corresponding to different types of imaging equipment, two third mounting holes 10113 matched with the imaging equipment can be selected according to the size of the imaging equipment, so that the two imaging mounting plates 1010 can be vertically connected.

It should be noted that, one imaging mounting board 1010 may be used to mount an imaging device separately, or may be used to mount an imaging device together with the slide fixing board 1020 and the slide 1030, or two imaging mounting boards 1010 may be used to mount an imaging device together with the slide fixing board 1020 and the slide 1030.

Specifically, the present application further provides a mounting fixture for mounting and fixing an imaging apparatus, which includes, in addition to the imaging mounting plate 1010, a slide fixing plate 1020 and a slider 1030 in an application scenario, where the imaging mounting plate 1010 is vertically detachably mounted on a first fixing plate surface 10201 of the slide fixing plate 1020 through a second mounting hole 10112, and the slider 1030 is disposed on a second fixing plate surface 10202 of the slide fixing plate 1020, where the first fixing plate surface 10201 and the second fixing plate surface 10202 are disposed opposite to each other, as shown in fig. 16. In another application scenario, as shown in a different manner from the above application scenario, the number of imaging mounting plates 1010 is two, as shown in fig. 18 and 19, an imaging device is mounted on one imaging mounting plate 1010, and the imaging mounting plate 1010 is vertically connected to two imaging mounting plates 1010 through a second mounting hole 10112 and a third mounting hole 10113 on a second imaging mounting plate 2010 (the same structure as the imaging mounting plate 1010), while the imaging mounting plate 1010 without the imaging device, i.e., the second imaging mounting plate 1010, is mounted on the first fixing plate surface 10201 of the slide fixing plate 1020 through the second mounting hole 10112 thereon, and the slider 1030 is mounted on the second fixing plate surface 10202 of the slide fixing plate 1020.

The imaging device can be mounted on the second imaging mounting rail 1214 mentioned above by the mounting fixture of the present application, specifically, in an application scenario, the slider 1030 and the second imaging mounting slider 1215 mentioned above are the same element, at this time, before the imaging device is mounted, the rail fixing plate 1020 is in a connection state with the second slider, and the imaging mounting plate 1010 is also in a connection state with the rail fixing plate 1020, so that when the imaging device is mounted, only the imaging device is required to be directly connected with the imaging mounting plate 1010, and then when the imaging mounting plate 1010 is replaced, due to the universality of the imaging mounting plate 1010, the imaging mounting plate 1010 is not required to be detached. In another application scenario, slider 1030 is not the same element as second imaging mounting slider 1215 mentioned above, where slider 1030 is mounted to second imaging mounting slider 1215 prior to mounting the imaging device, slide mount 1020 is then mounted to slider 1030, and imaging mounting plate 1010 is mounted to slide mount 1020, after which the imaging device is connected to imaging mounting plate 1010 at the time of mounting the imaging device.

The apertures of the first, second and third mounting holes 10111, 10112, 10113 may be the same or different, and are not limited herein.

With continued reference to fig. 2, the circuit board inspection device 1000 further includes a first cover 1040 and a second cover 1050.

The first cover plate 1040 is connected to the two first connection members 1120, and in particular, the first cover plate 1040 is formed by splicing a plurality of sub-cover plates (not shown), and after the switching of the image mounting assembly 1200 at the image place 1101 is completed, the first cover plate 1040 is mounted between the two first connection members 1120 for preventing the first light source 1700 mounted on the light source mounting assembly 1600 and the first image forming apparatus mounted on the image mounting assembly 1200 at the image place 1101 from sucking too much dust.

The second cover plate 1050 is connected to the imaging mounting assembly 1200 not at the imaging site 1101 for preventing the imaging apparatus mounted on the imaging mounting assembly 1200 from sucking too much dust, for example, in the application scenario of fig. 2, the second cover plate 1050 is connected to the first imaging mounting assembly 1210 when the first imaging mounting assembly 1210 is not at the imaging site 1101.

Wherein each time the image forming mounting assembly 1200 at the image forming location 1101 is switched, the first cover plate 1040 and the second cover plate 1050 are removed, then the image forming mounting assembly 1200 is switched, and after the switching is completed, the first cover plate 1040 and the second cover plate 1050 are mounted at the corresponding positions.

In other embodiments, the circuit board inspection device 1000 may include only one of the first cover plate 1040 and the second cover plate 1050, without limitation.

With continued reference to fig. 1, the circuit board inspection device 1000 further includes a housing 1060.

The housing 1060 is used to enclose all other components, to prevent dust and reduce the operator's injury from glare when the imaging device is imaging.

In an application scenario, the housing 1060 may include a plurality of acrylic plates, and the plurality of acrylic plates may be detachably connected to form the housing 1060. Meanwhile, in the application scenario, the positions of the acrylic plates may be adjusted relatively, specifically, as shown in fig. 20 and 21, the first acrylic plate 1061 and the second acrylic plate 1062 may be detachably connected (e.g. by screws 1063), when the relative positions of the first acrylic plate 1061 and the second acrylic plate 1062 are adjusted from fig. 20 to fig. 21 (i.e. the area of the overlapping portion of the two is reduced), the height of the circuit board detection device 1000 is changed, so as to meet different detection requirements in different application scenarios, and achieve the purpose of saving production cost.

It should be noted that, in the present embodiment, the imaging mounting assembly 1200, the light source mounting assembly 1600, the positioning assembly 1900, and the imaging mounting board 1010 may not exist in the circuit board detection device 1000 at the same time, for example, the circuit board detection device 1000 may include only the imaging mounting assembly 1200, and the assembly for mounting the first light source 1700 may be capable of mounting only one type of the first light source 1700, may be mounted by using other auxiliary tools when the second imaging device is mounted, and may be mounted in a conventional manner when the imaging device is mounted on the imaging mounting assembly 1200.

In order to further understand the circuit board detecting device 1000 in this embodiment, the operation of the circuit board detecting device 1000 of the present application will be described in detail with reference to fig. 1 to 22.

In the application scenario of fig. 22, the second imaging mounting assembly 1220 is pre-adjusted to be located at the imaging location 1101 in consideration of the layout of the circuit board a, and two first imaging devices B are mounted on the second imaging mounting assembly 1120 while the first light source 1700 of the appropriate size is mounted on the first light source mounting board 1610, and at this time the first imaging mounting assembly 1210 is not located at the imaging location 1101, which is in an idle state, on which the first imaging devices B do not need to be mounted.

When the circuit board detection device 1000 works, the second imaging device C installed on the positioning assembly 1900 firstly images the circuit board a transported by the two parallel tracks 1310, and when the mark point of the circuit board a exists in the image obtained by the second imaging device C, the trigger controller controls the two first imaging devices B located at the imaging position 1101 to image the circuit board a, and it can be understood that the first imaging device B and the second imaging device C respectively image two opposite surfaces of the circuit board a.

And then analyzing the images obtained by the two first imaging devices B by using a visual algorithm, and finally determining whether the circuit board A has defects.

When a new circuit board a needs to be tested, if only one first imaging device B is needed to image the circuit board a, the first cover plate 1040 and the second cover plate 1050 are detached, then the two second connecting pieces 1410 are separated from the two first connecting pieces 1120 respectively by detaching the bending piece 1500, then the two second connecting pieces 1410 are turned 180 degrees to adjust the first imaging assembly 1210 to the imaging position 1101, then the two second connecting pieces 1410 and the two first connecting pieces 1120 are reconnected by the bending piece 1500, and finally the first cover plate 1041 and the second cover plate 1050 are reinstalled.

Then, a first imaging device B is mounted on the first imaging mounting assembly 1210, and the original first light source 1700 is removed from the first light source mounting plate 1610, and the appropriate first light source 1700 is again mounted on the first light source mounting plate 1610.

After the circuit board inspection device 1000 is adjusted, a new circuit board a is inspected.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (5)

1. A circuit board detection device, comprising:

the detection support is used for being detachably arranged on a transportation path of the circuit board, and an imaging place is arranged in a space area surrounded by the detection support;

at least two imaging mounting assemblies for mounting different numbers of imaging devices, respectively, the at least two imaging mounting assemblies being adjustably positionable on the detection support, and each of the imaging mounting assemblies being adjustable to the imaging position;

a controller for controlling the imaging device mounted on the imaging mounting assembly at the imaging location to image the circuit board located on the transport path;

wherein, the circuit board detection device still includes:

the connecting assembly is arranged on the detection support in an adjustable mode, wherein the at least two imaging installation assemblies are respectively connected to the connecting assembly, and the at least two imaging installation assemblies can be respectively adjusted to the imaging positions along with the position adjustment of the connecting assembly relative to the detection support;

the connecting assembly comprises two second connecting pieces, wherein the at least two imaging installation assemblies are simultaneously connected with the two second connecting pieces; the at least two imaging installation components are respectively connected with the end parts, close to the two second connecting pieces, of the at least two imaging installation components;

Wherein, the imaging mounting assembly each includes:

one end of the imaging installation backboard is fixedly connected with one second connecting piece and used for installing the imaging equipment, wherein the imaging installation backboard comprises a first backboard surface and a second backboard surface which are oppositely arranged;

the first imaging installation sliding rail is arranged on the surface of the first backboard of the imaging installation backboard;

the first imaging installation sliding block is arranged on the first imaging installation sliding rail in a sliding manner and is fixedly connected with the other second connecting piece, and when the distance between the two second connecting pieces is adjusted, the first imaging installation sliding block slides along the first imaging installation sliding rail;

the second imaging installation sliding rail is arranged on the surface of the second backboard of the imaging installation backboard;

the second imaging installation sliding block is arranged on the second imaging installation sliding rail in a sliding manner and is used for installing the imaging equipment so as to enable the imaging equipment to slide along the second imaging installation sliding rail;

the detection bracket comprises at least four supporting pieces and at least two first connecting pieces, wherein two groups of the four supporting pieces are symmetrically erected on two parallel rails for transporting the circuit board respectively, and the two first connecting pieces are connected with the two supporting pieces erected on the same rail respectively;

Wherein the two second connecting pieces are respectively and rotatably connected with the two first connecting pieces so that the connecting component is rotatably connected to the detection bracket;

the first connecting piece is provided with a plurality of connecting parts which are arranged at intervals along the extending direction of the first connecting piece, and the two supporting pieces are fixed on the first connecting piece in an adjustable position through the connecting parts, so that the distance between the two supporting pieces is adjustable; the distance between the two rails is adjustable, and when the distance between the two rails is different, the distance between the two second connecting pieces is changed.

2. The circuit board inspection device of claim 1, wherein,

the two second connecting pieces are positioned on the same horizontal line relative to the rotating shafts of the first connecting pieces, the at least two imaging installation assemblies comprise two imaging installation assemblies, and the two imaging installation assemblies are respectively connected with the ends, close to the two second connecting pieces, of the two imaging installation assemblies.

3. The circuit board inspection device according to claim 1, wherein the two second connection members are detachably connected to the two first connection members, respectively.

4. The circuit board inspection device of claim 1, wherein the second connector is adjustable in length.

5. The circuit board inspection device of claim 1, further comprising:

and the light source installation assembly is connected with the detection bracket and used for installing a light source.