CN110976202B

CN110976202B - Silicon chip processing is with all gluing machine

Info

Publication number: CN110976202B
Application number: CN201911256452.5A
Authority: CN
Inventors: 王尧
Original assignee: Wuhu Jiahao Electronics Co ltd
Current assignee: Wuhu Jiahao Electronics Co ltd
Priority date: 2019-12-10
Filing date: 2019-12-10
Publication date: 2022-10-11
Anticipated expiration: 2039-12-10
Also published as: CN110976202A

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a silicon wafer processing glue homogenizing machine which comprises a machine body, a cavity, a rack and a glue gun, wherein the cavity is installed at the top of the machine body, the rack is installed on the machine body, the glue gun is installed at the bottom of the rack, an injection cavity is formed in the glue gun, quick dissolving cavities are formed in two sides of the injection cavity, melting liquid is filled in the quick dissolving cavities, and the inner cavity of the injection cavity is connected with a piston in a sliding mode. Piston, screw rod and the cooperation between the gear, the flow that utilizes gluey rifle is poor, the outflow of liquid is melted in control, thereby melt the inside clean of gluey rifle, when the bottom of gluing the rifle appears micro-clean, the injection velocity of gluing the rifle is unchangeable, receive clean reason, the outflow velocity of photoresist slows down, liquid accumulates gradually, make the piston can be according to the capacity of liquid, corresponding displacement is made automatically, thereby control piston rebound, at the removal in-process, make the gear be circular motion, thereby the through-hole is opened gradually to the sealed pad of control.

Description

Silicon chip processing is with all gluing machine

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to a glue homogenizing machine for processing a silicon wafer.

Background

Before photoetching, a semiconductor silicon wafer needs to be coated with an adhesive layer uniformly by using a glue homogenizing machine, so that the thickness of the adhesive layer on the silicon wafer is ensured to be consistent.

The working principle of the existing photoresist homogenizer is that a silicon wafer is placed on a workbench, photoresist is dripped on the silicon wafer through a spray gun, a top cover is closed, a vacuum pump is started again to pump out air in a cavity, the photoresist homogenizer is started again to drive the silicon wafer to rotate, a photoresist layer is uniformly thrown on the silicon wafer by utilizing centrifugal force, photoresist components comprise three parts of resin, photosensitizer and solvent, the solvent is used for dissolving solid resin and photosensitizer, the photoresist is in a liquid state and is coated on the surface of the wafer in a spin coating mode, the solvent is volatile in actual use, after the residual photoresist in the spray gun is contacted with air, the solvent in the photoresist can be rapidly volatilized, so that the photoresist is crystallized, the actual flow of the photoresist gun is reduced, the output speed of the photoresist is slowed, the photoresist dripping time on the silicon wafer is accelerated, the gun mouth of the photoresist gun cannot flow out seriously, the crystallization degree is more serious, the subsequent use of the photoresist machine is influenced, meanwhile, various photoresist defects are generated, the surface tension of the photoresist after crystallization damages the photoresist, the photoresist can cause the phenomenon that the photoresist drips on the surface of the silicon wafer are not uniform, and the photoresist can cause uneven thickness.

Disclosure of Invention

Aiming at the defects of the background technology, the invention provides the glue homogenizing machine for processing the silicon wafer, which has the advantages of crystallization removal and smooth pipeline and solves the problems in the background technology.

The invention provides the following technical scheme: the utility model provides a silicon chip processing is with all machine of gluing, includes organism, cavity, frame, glues the rifle, the top at the organism is installed to the cavity, rack-mount is on the organism, it installs the bottom in the frame to glue the rifle, it has the injection chamber to have seted up in the rifle to glue, the both sides in injection chamber are provided with the instant chamber, the instant intracavity is filled there is melting liquid, the inner chamber sliding connection in injection chamber has the piston, fixedly connected with screw rod on the piston, the both sides meshing of screw rod has the gear, the top of gear is connected with the chamber wall rotation of gluing the rifle, install sealed the pad on the slide bar, set up the through-hole that is located sealed pad side on gluing the rifle.

Preferably, the outer wall intercommunication of gluing the rifle has the feed liquor pipe, glue the inner wall of rifle and install the weeping pipe that is located feed liquor pipe below, the bottom intercommunication of weeping pipe has the honeycomb duct, the tip and the top in instant chamber of honeycomb duct are linked together.

Preferably, the top fixedly connected with backup pad of screw rod, install the sliding block that is located the backup pad below on the screw rod, the outer wall and the inner wall sliding connection of injection chamber of sliding block, the both sides fixedly connected with of backup pad seals the piece, the width and the length of sealed piece are greater than the length and the width of feed liquor pipe opening part, the top fixedly connected with spring of sealed piece, the top fixedly connected with supporting shoe of spring, the tip of slide bar runs through and extends to the outside of supporting shoe, the supporting shoe rotates with the department of meeting of slide bar to be connected, the bottom fixedly connected with blotter of supporting shoe, the material of blotter is elastic rubber.

Preferably, the shape of the sealing gasket is rectangular, the through hole is completely covered by the sealing gasket in the initial state, and the sealing gasket is made of elastic rubber.

Preferably, a heat insulation layer is arranged outside the side wall of the instant cavity, the melting liquid is acetone liquid, and the temperature of the melting liquid is 30-40 ℃.

The invention has the following beneficial effects:

1. this silicon chip processing is with all gluing machine, through the piston, the cooperation between screw rod and the gear, utilize the flow difference of gluing the rifle, the outflow of control melt liquid, thereby melt the inside cleanness of gluing the rifle, when the bottom of gluing the rifle appears micro-clean, the injection velocity of gluing the rifle is unchangeable, receive clean reason, the outflow speed of photoresist slows down, liquid accumulates gradually, make the piston can be according to the capacity of liquid, corresponding displacement is made automatically, thereby control piston rebound, in the removal process, make the gear do the circular motion, thereby the through-hole is opened gradually to the control sealed pad, make the inside that melts the liquid inflow and glues the rifle melt the crystallization, the flow resumes gradually when the crystallization reduces, the piston receives the factor of flow difference, get back to the initial position, make the rifle in the use, utilize the reaction of acetone and photoresist, dissolve crystallized photoresist, automatically stop the appearance of crystallization, make the rifle in-use remain certain smoothness all the time.

2. This silicon chip processing is with all gluing machine, cooperation between through sealed piece and feed liquor pipe, make the injection capacity of melting liquid change according to the degree of crystallization of gluing the rifle, when the rifle crystallization is more serious, the piston is located the position after the removal all the time, make the backup pad drive sealed piece open the feed liquor pipe gradually, in addition the speed that acetone was alleviated slows down, melt liquid and constantly pour into, make crystallization photoresist constantly dissolved, make liquid pour into according to the degree of crystallization, the injection capacity of control liquid, reduce the contact of solvent and air, thereby reduce volatilizing of solvent, the effect through the spring simultaneously, make the rifle after resumeing bounce initial position by the spring, can repeatedly slow down the degree that the rifle appears crystallization.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the glue gun;

FIG. 3 is a left side schematic view of the glue gun;

fig. 4 is a right side structure diagram of the glue gun.

In the figure: 1. a body; 2. a chamber; 3. a frame; 4. a glue gun; 5. an injection cavity; 6. an instant cavity; 7. melting the liquid; 8. a heat-insulating layer; 9. a piston; 10. a screw; 11. a slider; 12. a gear; 13. a slide bar; 14. a gasket; 15. a through hole; 16. a liquid inlet pipe; 17. a liquid leakage pipe; 18. a flow guide pipe; 19. a support plate; 20. a sealing block; 21. a spring; 22. a supporting block; 23. a cushion pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a silicon wafer processing is with all glue machine, including organism 1, cavity 2, frame 3, glue gun 4, cavity 2 installs at the top of organism 1, frame 3 installs on organism 1, glue gun 4 installs in the bottom of frame 3, it has injection chamber 5 to open in glue gun 4, injection chamber 5 mainly is used for the storage of photoresist, the both sides of injection chamber 5 are provided with instant chamber 6, it has the rubber inlet pipe to communicate on glue gun 4, be convenient for the injection of photoresist, instant chamber 6 is filled with and melts liquid 7, the inner chamber sliding connection of injection chamber 5 has piston 9, piston 9 and the inner wall sliding connection of injection chamber 5, fixedly connected with screw rod 10 on piston 9, be equipped with the dogtooth with gear 12 looks adaptation on the screw rod 10, be convenient for the rotation of gear 12, the both sides meshing of screw rod 10 has gear 12, when screw rod 10 rotates to the top, gear 12 drives slide bar 13 and rotates 180 degrees, the top of gear 12 rotates with the chamber wall of glue gun 4 to be connected, install on slide bar 13 and be equipped with 14, sealed the side of the sealed pad 4 is equipped with the through-hole 15 that the sealed through-hole 15 that melts of gluing effect that the glue gun 15, is convenient for the outflow.

Wherein, the outer wall intercommunication of glue rifle 4 has feed liquor pipe 16, and the other end of feed liquor pipe 16 is connected with water pump or water tank, is convenient for melt liquid 7 and pours into the inside of instant chamber 6 into for melt liquid 7 and accumulate together, flow out through-hole 15 gradually, the inner wall of glue rifle 4 is installed and is located the weeping pipe 17 of feed liquor pipe 16 below, the bottom intercommunication of weeping pipe 17 has honeycomb duct 18, honeycomb duct 18's tip is linked together with the top of instant chamber 6, is convenient for melt liquid 7 and flows into the inside of instant chamber 6.

The top of the screw rod 10 is fixedly connected with a support plate 19, the joint of the support plate 19 and the screw rod 10 is in sliding connection, so that the support plate 19 can move to different positions, the screw rod 10 is provided with a sliding block 11 positioned below the support plate 19, the sliding block 11 has the function of increasing the stability of the screw rod 10 during movement, the outer wall of the sliding block 11 is in sliding connection with the inner wall of the injection cavity 5, two sides of the support plate 19 are fixedly connected with sealing blocks 20, the width and the length of the sealing blocks 20 are greater than the length and the width of the opening of the liquid inlet pipe 16, so that the liquid inlet pipe 16 is conveniently blocked, the capacity of liquid injected into the liquid inlet pipe 16 is determined according to the position of the movement of the sealing blocks 20, the top of the sealing blocks 20 is fixedly connected with a spring 21, the top of the spring 21 is fixedly connected with a support block 22, the support block 22 further increases the stability of the two sliding rods 13, the sliding phenomenon of the sliding rods 13 in the use process is prevented, the end of the sliding rods 13 penetrates through and extends to the outside of the support block 22, the support block 22 is rotatably connected with a cushion 23, the joint of the support plate 19 is fixedly connected with a rubber gun 19, and the support plate 19, so as to reduce the impact on the inner wall of the gun 4.

The shape of the sealing gasket 14 is rectangular, the sealing gasket 14 completely covers the through hole 15 in an initial state, the diameter of the through hole 15 is controlled by the sealing gasket 14, the outflow volume and the outflow speed of liquid are controlled, the sealing gasket 14 is made of elastic rubber, the attaching force between the sealing gasket 14 and the through hole 15 is further increased, and the sealing performance of the through hole 15 is improved.

The heat-insulating layer 8 is arranged outside the side wall of the instant cavity 6, so that the injected liquid is kept at a certain temperature, the melting liquid 7 is acetone liquid, the temperature of the melting liquid 7 is 30-40 ℃, and the clean melting is accelerated by utilizing the characteristics of the temperature and the liquid.

When the glue homogenizing machine is used, when the glue gun 4 is crystallized, photoresist is blocked by the crystallization, the flow rate begins to slow, then the photoresist continuously accumulates upwards, the piston 9 is jacked upwards, then the screw rod 10 is driven to move upwards, in the moving process, the gear 12 and the screw rod 10 are continuously meshed to drive the gear 12 to do circular motion, then the gear 12 drives the sliding rod 13 and the sealing gasket 14 to open the through hole 15, meanwhile, the screw rod 10 gradually drives the supporting plate 19 and the sealing block 20 to move upwards in the ascending process, the blockage of the liquid inlet pipe 16 is opened, then the molten liquid 7 flows into the liquid leakage pipe 17, then the molten liquid is continuously injected into the quick dissolving cavity 6 through the flow guide pipe 18, flows into the glue gun 4 through the through hole 15 to react with the crystallized photoresist, after the crystallized photoresist is eliminated, the spring 21 bounces the sealing block 20 and the supporting plate 19 to return to the initial position, then drives the screw rod 10 to move downwards, in the moving process, the gear 12 is gradually driven to do reverse operation, and then the sliding rod 13 and the sealing gasket 14 return to the initial position.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a silicon chip processing is with gluing machine, includes organism (1), cavity (2), frame (3), glues rifle (4), the top at organism (1) is installed in cavity (2), install on organism (1) frame (3), glue the bottom at frame (3) in rifle (4), its characterized in that: an injection cavity (5) is formed in the glue gun (4), two sides of the injection cavity (5) are provided with instant cavities (6), a melting liquid (7) is filled in the instant cavities (6), an inner cavity of the injection cavity (5) is connected with a piston (9) in a sliding manner, a screw rod (10) is fixedly connected onto the piston (9), gears (12) are meshed onto two sides of the screw rod (10), protruding teeth matched with the gears (12) are arranged on the screw rod (10), rotation of the gears (12) is facilitated, the piston (9) jacks upwards, then the screw rod (10) is driven to move upwards, in the moving process, the gears (12) and the screw rod (10) are constantly meshed to drive the gears (12) to do circular motion, the top end of the gears (12) is rotationally connected with the cavity wall of the glue gun (4), sliding rods (13) are arranged on the gears (12), sealing gaskets (14) are arranged on the sliding rods (13), and through holes (15) located on the side faces of the sealing gaskets (14) are formed in the glue gun (4);

glue the outer wall intercommunication of rifle (4) and have feed liquor pipe (16), glue the inner wall of rifle (4) and install weeping pipe (17) that are located feed liquor pipe (16) below, the bottom intercommunication of weeping pipe (17) has honeycomb duct (18), the tip of honeycomb duct (18) is linked together with the top in instant chamber (6).

2. The glue spreader for silicon wafer processing according to claim 1, wherein: the injection device is characterized in that a supporting plate (19) is fixedly connected to the top of the screw rod (10), a sliding block (11) located below the supporting plate (19) is installed on the screw rod (10), the outer wall of the sliding block (11) is connected with the inner wall of the injection cavity (5) in a sliding mode, sealing blocks (20) are fixedly connected to the two sides of the supporting plate (19), the width and the length of each sealing block (20) are larger than those of the opening of the liquid inlet pipe (16), a spring (21) is fixedly connected to the top of each sealing block (20), a supporting block (22) is fixedly connected to the top of each spring (21), the end of each sliding rod (13) penetrates through and extends to the outside of the corresponding supporting block (22), the connecting part of each supporting block (22) and each sliding rod (13) is rotatably connected, a buffering cushion (23) is fixedly connected to the bottom of each supporting block (22), and the buffering cushion (23) is made of elastic rubber.

3. The glue spreader for silicon wafer processing according to claim 1, wherein: the shape of sealed pad (14) is the rectangle, sealed pad (14) initial condition covers through-hole (15) completely, the material of sealed pad (14) is elastic rubber.

4. The glue spreader for silicon wafer processing as set forth in claim 1, wherein: the external mounting of instant cavity (6) lateral wall has heat preservation (8), melt liquid (7) and be the acetone liquid, the temperature that melts liquid (7) is 30-40 degrees centigrade.