CN110972460B - Tin coating device and method for component bonding pad - Google Patents

Tin coating device and method for component bonding pad Download PDF

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Publication number
CN110972460B
CN110972460B CN201911311957.7A CN201911311957A CN110972460B CN 110972460 B CN110972460 B CN 110972460B CN 201911311957 A CN201911311957 A CN 201911311957A CN 110972460 B CN110972460 B CN 110972460B
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bushing
mounting plate
tin
plate
fixing
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CN201911311957.7A
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CN110972460A (en
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张亮
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Beijing Institute of Radio Metrology and Measurement
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Beijing Institute of Radio Metrology and Measurement
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering

Abstract

The application discloses a device and a method for tin coating of a component bonding pad, wherein the device comprises a separable layer structure consisting of a bushing plate and a mounting plate and further comprises a fixing part; the mounting plate is provided with a groove, and the groove bottom or the groove wall has an elastic structure; the bushing plate is provided with an opening and is positioned in the notch; the fixing component is used for limiting the relative movement between the bushing and the mounting plate. The application also includes methods of testing with the devices. The tin coating method is high in tin coating efficiency, and a device can be prevented from being immersed in the solder.

Description

Tin coating device and method for component bonding pad
Technical Field
The application relates to the technical field of welding, especially, relate to a tin device is warded off to components and parts pad.
Background
In order to improve the reliability of the component soldering, tin coating or gold removing operation needs to be performed on a part of the bonding pad on which the component is attached, so as to improve the solderability or avoid the phenomenon of 'gold brittleness'. Because the surface-mounted components are small in size and the size of the bonding pad is smaller, the components are easily immersed into the solder during manual tin coating, and the components are damaged. In addition, tin coating can only be carried out singly, and the production efficiency is low.
Disclosure of Invention
The application provides a tin device is warded off to components and parts pad for when solving manual tin warding the component device body make easily dip in the solder and the problem that production efficiency is low.
The embodiment of the application provides a tin device is warded off to components and parts pad, including the separable layer structure that bushing plate and mounting panel constitute, still contain fixed part. The mounting plate is provided with a groove, a groove bottom and/or a groove wall elastic structure. The bushing is provided with an opening and is positioned in the notch. The fixing component is used for limiting the relative movement between the bushing and the mounting plate.
Preferably, the fixing part is a U-shaped part which clamps the bushing and the mounting plate.
Preferably, the fixing part further comprises a positioning hole and a positioning pin. The positioning holes are respectively positioned on the bushing plate and the mounting plate. The location holes on the bushing plate and the mounting plate are opposite.
Preferably, the bushing plate is a stainless steel plate.
Preferably, the mounting plate is polysulfone plastic or polytetrafluoroethylene plastic.
In another embodiment, the tin coating device further comprises a control rod, and the control rod comprises a connecting rod and a fixing plate. The fixing piece is installed on the installation plate. The connecting rod is vertically connected with the fixing plate into a whole.
In one embodiment, the resilient structure is a leaf spring, felt, rubber, foam or fabric cloth.
In another embodiment, the number of the positioning pins is two;
preferably, the number of the positioning holes on the bushing plate and the mounting plate is 2 respectively.
Preferably, the thickness of the bushing is 0.1mm to 0.15 mm.
In another embodiment of the present application, a tin-coating method using the apparatus is further provided, and the apparatus according to any one of the embodiments of the present application comprises the following steps:
placing the component to be tin-plated into the groove of the mounting plate, wherein the bonding pad to be tin-plated faces outwards;
covering the bushing plate on a mounting plate;
fixing with the fixing component;
and immersing the bushing plate into molten soldering tin for tin coating.
The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects: by adopting the tin-coating device for the component bonding pad, the component body can be protected from being immersed into solder in the tin-coating process, and simultaneously tin-coating operation can be simultaneously carried out on a plurality of components, so that the efficiency is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is an assembly view of a tin coating device;
FIG. 2(a) is a view from below of the bushing;
FIG. 2(b) is a cross-sectional view of a bushing;
FIG. 2(c) is a partial enlarged view of the bushing;
FIG. 3(a) is a lower view of the mounting plate;
FIG. 3(b) is a cross-sectional view of the mounting plate;
FIG. 4(a) is a side view of the fixing member;
FIG. 4(b) is a schematic view of a fixed installation;
FIG. 5(a) is a side view of the joystick;
FIG. 5(b) is a lower view of the joystick;
FIG. 6(a) the groove bottom is provided with an elastic component;
FIG. 6(b) the groove wall is provided with an elastic member;
FIG. 6(c) is an enlarged view of a portion of the groove wall fitted with a rubber pad below the notch surface.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Fig. 1 is an assembly drawing of a tin coating device, and provides a tin coating device for a bonding pad of a component, which comprises a separable layer structure with a first layer plate as a bushing plate 1 and a second layer plate as an installation plate 2, and further comprises a fixing part.
The mounting plate is provided with a groove 20 for mounting components. The groove bottom and the groove wall have elastic structures. The bushing is provided with an opening 10 which is positioned in the notch.
The fixing component is used for limiting the relative movement between the bushing and the mounting plate, namely when the bushing covers the mounting plate, the fixing component can prevent the bushing and the mounting plate from generating transverse relative displacement or longitudinal relative displacement, and the main function is to form a stable position relation.
The elastic structure limits the movement of the components in the groove, namely the components do not move transversely and vertically in the groove and are stably fixed in the groove.
For example, as shown in fig. 1, the fixing member is a U-shaped metal clip 3.
Fig. 2(a) to (c) show a bushing, in which fig. 2(a) is a lower view of the bushing, fig. 2(b) is a cross-sectional view of the bushing, and fig. 2(c) is a partially enlarged view of the bushing.
The bushing is provided with an opening, and when the bushing is assembled with the mounting plate, the opening is positioned in the notch. The opening is used for exposing a bonding pad of a component to be enameled with tin, and the position, size and shape of the opening correspond to the bonding pad. When the component is arranged on the bushing, the bonding pad can be exposed from the opening, and the component does not fall from the opening.
For example, laser openings are used according to the size of the component pads, the size of the openings being slightly smaller than the size of the pads. And polishing the edge of the hole to remove burrs. The cross section of the opening can be square or trapezoid, so that the bonding pad can be better exposed. When the section of the opening is trapezoidal, the opening surface 11 with smaller area faces the notch of the mounting plate when the bushing is assembled with the mounting plate.
The position of trompil corresponds with the pad position, and when referring to bushing and mounting panel assembly, the mounting groove position corresponds with the position of trompil, and when components and parts put into the mounting groove, the pad of components and parts corresponds with the position of trompil. It should be noted that the position correspondence includes a corresponding relationship in number, that is, 1 mounting groove corresponds to 1 group of pads of the component. If 1 group of pads of 1 component includes a plurality of pads of separation, then 1 mounting groove corresponds a plurality of trompils on the bushing. Comparing fig. 2(a) and fig. 3(a), 1 group of pads of 1 component includes 2 pads separated, and 1 mounting slot 20 corresponds to 2 openings 12 on the bushing.
Preferably, the bushing is a stainless steel plate. The bushing plate is used for being placed in a tin material and is made of a high-temperature-resistant stainless steel sheet.
The thickness of the bushing plate is 0.1mm to 0.15 mm. The plate thickness determines the depth of the tin coating device in the tin material, and in the prior art, the stainless steel sheet with the thickness of 0.1mm to 0.15mm is manufactured with high cost performance, so that the performance requirement of the device is met. For example, a thin stainless steel plate with a thickness of 0.1mm or a thin stainless steel plate with a thickness of 0.15mm can be used for the tin-plated bushing.
Fig. 3(a) to (b) show the mounting plate, in which fig. 3(a) is a lower view of the mounting plate and fig. 3(b) is a sectional view of the mounting plate.
The mounting panel includes the groove, and preferably, when components and parts are installed in the inslot, components and parts solder pad face with the mounting panel face flushes.
It should be noted here that the depth of the groove is not less than the thickness of the component to be tin-plated, and the width of the groove is not less than the width of the component.
When the groove bottom is attached with an elastic structure, the surface of the component soldering land can be higher than the surface of the mounting plate. When the mounting plate provided with the components is assembled with the bushing plate, the bushing plate presses the surfaces of the components to enable the welding disc surfaces to be flush with the mounting plate.
In order to facilitate grooving, the mounting plate is made of polysulfone plastic or polytetrafluoroethylene plastic. Dig the mounting groove according to the components and parts appearance on the mounting panel, make components and parts just pack into the mounting groove.
Fig. 4(a) to (b) show the fixing member, in which fig. 4(a) is a side view of the fixing member and fig. 4(b) is a schematic view of the fixing attachment.
The fixing means comprise a U-shaped member 3 for clamping the bushing and the mounting plate.
For example, the U-shaped member has expansion elasticity, and preferably, the U-shaped member is made of metal, and when the U-shaped member is elastically expanded, the opening width can be the same as the height and the width of the bushing plate and the mounting plate, and when the bushing plate and the mounting plate are embedded, the U-shaped member is used for stably clamping the bushing plate and the mounting plate. Preferably, there are 4 securing members, one for each side of the separable layer structure.
The fixing component can also comprise a positioning hole and a positioning pin. The positioning holes are respectively positioned on the bushing and the mounting plate, such as a positioning hole 41 positioned at the corner of the bushing in fig. 2(a) and a positioning hole 42 positioned at the corner of the mounting plate in fig. 3 (a). The positioning holes are matched with the positioning pins to limit the transverse and vertical movement of the bushing plate and the mounting plate. The positioning holes are matched with the positioning pins for use, and the positioning pins are inserted and fixed after the positioning holes in the bushing plate are aligned with the positioning holes in the mounting plate.
It should be noted that the positioning holes on the bushing plate and the positioning holes on the mounting plate are in a corresponding relationship, and the positioning holes can be located at any position on the laminate.
Preferably, the number of the positioning pins is 2 for better limiting the movement. Correspondingly, the number of the positioning holes on the bushing plate and the mounting plate is respectively 2. The number of the positioning pins and the positioning holes can be more, so that the movement of the two layers can be better limited.
Preferably, the positioning hole is a threaded hole; the positioning pin is a bolt.
Fig. 5(a) to (b) show the lever, in which fig. 5(a) shows a side view of the lever and fig. 5(b) shows a lower view of the lever, including the screw hole 53.
The tin coating device further comprises a control rod. The control rod is used for connecting the mounting plate, so that tin coating control is facilitated. Such as a hand-held or mechanically coupled joystick. The control rod can be used for holding and holding to carry out manual tin coating or connecting a mechanical device to carry out automatic tin coating.
For example, the lever includes a connecting rod 51 and a fixing plate 52. The fixing plate is positioned at the end part of the connecting rod and is vertical to the connecting rod. The fixing piece is installed at the back of the mounting plate and can be fixed by screws and nuts or other modes.
When the machine is operated, the tin coating device also comprises a lifter. The bushing and the mounting plate are assembled into a whole, the hole is downward, and the connecting rod is fixed on the elevator perpendicular to the ground to realize precise displacement.
Fig. 6(a) to (c) are schematic views of the elastic member in the groove.
In order to realize the best matching of the groove body and the component body, an elastic structure is attached to the bottom and/or the groove wall of the groove. The elastic structure has certain elastic object promptly, mainly used components and parts with change the groove tolerance when the groove is fixed, improve fixed stability, prevent to damage components and parts.
The resilient structure may be at least one of a spring pad, a felt pad, a rubber pad, a foam pad, and a fabric. Objects such as felt pad, rubber pad, foam pad or fabric can be better fixed components and parts, prevent components and parts and remove.
For example, FIG. 6(a) shows a spring or washer with a spring 21 mounted on the bottom of the groove; further, the walls of the groove may be fitted with rubber pads 22. Alternatively, the trough bottom shown in fig. 6(b) is fitted with a rubber or foam pad 23, and at least one side of the trough wall is fitted with another type of resilient structure, such as a spring-loaded washer 24.
When the slot walls are provided with a resilient structure, which is lower than the slot opening, as shown in fig. 6(c), the slot walls are provided with rubber pads 22, and the edges are located below the slot opening surface to avoid contact with the solder flowing into the bushing opening.
The embodiment of the application also provides a component tin-plating method using the tin-plating device, which comprises the following steps:
and step 100, placing the component to be tin-plated into the groove of the mounting plate, wherein the bonding pad to be tin-plated faces outwards.
And 200, covering the bushing plate on the mounting plate and fixing the bushing plate by using the fixing part.
For example, the bushing and the mounting template are clamped by the U-shaped members after aligning the positioning holes and inserting the positioning pins for positioning.
And 300, immersing the bushing plate into the molten soldering tin for tin coating.
And 400, after tin coating, after the bushing is cooled, dismantling the fixed part, removing the bushing and taking out the component.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (10)

1. A tin coating device for a component bonding pad is characterized by comprising a separable layer structure consisting of a bushing plate and a mounting plate, and a fixing component;
the mounting plate is provided with a groove;
the bushing plate is provided with an opening and is positioned in the notch;
the fixing component is used for limiting the relative movement between the bushing and the mounting plate;
the bottom of the groove is attached with an elastic structure, when the mounting plate provided with the components is assembled with the bushing plate, the bonding pad surface of the components is higher than the mounting plate surface, and the bushing plate presses the surface of the components to enable the bonding pad surface to be flush with the mounting plate; the groove wall is provided with an elastic structure which is lower than the notch.
2. The tin enameling apparatus according to claim 1, wherein the fixing member is a U-shaped member that clamps the bushing and the mounting plate.
3. The tin enameling apparatus according to claim 1 or 2, wherein the fixing member comprises a positioning hole, a positioning pin; the positioning holes are respectively positioned on the bushing plate and the mounting plate and are opposite in position.
4. The tin enameling apparatus according to claim 1, wherein the bushing is a stainless steel plate.
5. The tin enameling apparatus according to claim 1, wherein the mounting plate is polysulfone plastic or polytetrafluoroethylene plastic.
6. The tin enameling device according to claim 1, further comprising a control lever, wherein the control lever comprises a connecting rod and a fixing piece; the fixing sheet is arranged on the back surface of the mounting plate; the connecting rod is vertically connected with the fixing plate into a whole.
7. The tin enameling device according to claim 1, wherein the elastic structure is a spring piece, a felt pad, rubber, foam or fiber cloth.
8. The tin enameling apparatus according to claim 3,
the number of the positioning holes on the bushing plate and the mounting plate is respectively 2.
9. The tin enameling apparatus according to claim 4, wherein the bushing thickness is 0.1mm to 0.15 mm.
10. A component bonding pad tin-coating method is characterized in that the device of any one of claims 1 to 9 is used, and comprises the following steps:
placing the component to be tin-plated into the groove of the mounting plate, wherein the bonding pad to be tin-plated faces outwards;
covering the bushing plate on a mounting plate;
fixing with the fixing component;
and immersing the bushing plate into molten soldering tin for tin coating.
CN201911311957.7A 2019-12-18 2019-12-18 Tin coating device and method for component bonding pad Active CN110972460B (en)

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Application Number Priority Date Filing Date Title
CN201911311957.7A CN110972460B (en) 2019-12-18 2019-12-18 Tin coating device and method for component bonding pad

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Application Number Priority Date Filing Date Title
CN201911311957.7A CN110972460B (en) 2019-12-18 2019-12-18 Tin coating device and method for component bonding pad

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CN110972460B true CN110972460B (en) 2021-05-14

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CN114101833B (en) * 2021-12-13 2022-11-29 中国电子科技集团公司第十三研究所 Tin-coating gold-removing method for leadless ceramic device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
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US6852119B1 (en) * 2002-09-09 2005-02-08 Ramzi F. Abulhaj Adjustable disposable lancet and method
JP4586745B2 (en) * 2006-02-27 2010-11-24 住友電装株式会社 Terminal mounting structure on board
CN203109397U (en) * 2012-11-16 2013-08-07 中国航空工业第六一八研究所 Component tin enameling special tool
TWI465168B (en) * 2013-04-03 2014-12-11 Wistron Corp Testing apparatus and testing method
CN205789505U (en) * 2016-05-25 2016-12-07 深圳市科顺达电子有限公司 A kind of high temperature resistant supertension capillary electric capacity
CN206253893U (en) * 2016-11-22 2017-06-16 无锡职业技术学院 Cylindrical thin wall class part air clamper
CN206620355U (en) * 2016-12-28 2017-11-07 液化空气(中国)研发有限公司 A kind of printed circuit board (PCB) of wave-soldering
CN207883737U (en) * 2018-03-16 2018-09-18 江苏鸿利国泽光电科技有限公司 A kind of deep ultraviolet LED lamp bead inorganic encapsulated structure
CN209017356U (en) * 2018-08-24 2019-06-21 深圳市汇芯线路科技有限公司 A kind of anti-desoldering printed circuit board
CN108968343A (en) * 2018-09-30 2018-12-11 柳州市和润电子科技有限责任公司 A kind of equipment for computer software exploitation
CN209527069U (en) * 2018-11-30 2019-10-22 广州晶优电子科技有限公司 The bonding fixture of Miniature component
CN110449683B (en) * 2019-07-31 2021-02-09 嘉兴军胜电子科技有限公司 High-reliability printed circuit board assembly QFN (quad Flat No lead) assembling and welding pretreatment method

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