CN110961754A - Tin dipping device and tin dipping method - Google Patents
Tin dipping device and tin dipping method Download PDFInfo
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- CN110961754A CN110961754A CN202010011112.2A CN202010011112A CN110961754A CN 110961754 A CN110961754 A CN 110961754A CN 202010011112 A CN202010011112 A CN 202010011112A CN 110961754 A CN110961754 A CN 110961754A
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- tin
- tank
- dipping
- height
- storage tank
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
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Abstract
The tin sticky device comprises a tin material accommodating body and a material pushing piece, wherein the tin material accommodating body is provided with an accommodating groove and a spacer, the spacer is arranged in the accommodating groove and divides the accommodating groove into a tin sticky groove and a tin storage groove, a tin material circulation gap is arranged between the spacer and the side wall of the accommodating groove, and the tin material circulation gap is communicated with the tin sticky groove and the tin storage groove; the material pushing piece comprises a material pushing block, and the material pushing block corresponds to the tin storage tank; the pushing block enters the tin storage tank, and tin materials in the tin storage tank are supplemented into the tin dipping tank through the tin material circulation notch, so that the liquid level height of the tin materials in the tin dipping tank is equal to the full water height. The material pushing block can replenish the tin material in the tin storage tank to the tin dipping tank, so that the tin dipping tank can maintain the full water height, the tin dipping operation can be directly carried out in the tin dipping tank, the tin material cannot be far away from the tin dipping tank in the tin dipping process, the problem of cooling of the tin material is avoided, and the tin dipping quality is improved.
Description
Technical Field
The application relates to the technical field of tin pick-up, in particular to a tin pick-up device and a tin pick-up method.
Background
The solder tails of the electronic devices need to be wetted with tin for the subsequent soldering process. In the tin dipping process, in order to ensure that the tin dipping of each solder leg is uniform, the liquid level height of the tin material during tin dipping needs to be kept uniform. The tin furnace for tin pick-up at present is provided with a tin spoon which is always positioned in the tin furnace before tin pick-up operation, and before the tin pick-up operation is carried out, the tin furnace firstly scrapes off an oxidation layer on the liquid level of a tin material and then lifts the tin spoon to carry out the tin pick-up operation. Because the position that the tin spoon was lifted up can be fixed, after the tin spoon was filled with the tin material, the tin material liquid level height that can supply the tin sticky can keep unified. However, during the tin dipping operation, the tin spoon needs to be separated from the tin furnace to perform tin dipping, and because the tin spoon is separated from the tin furnace during the tin dipping process, the temperature of the tin material on the tin spoon is reduced, thereby affecting the tin dipping quality.
Disclosure of Invention
The embodiment of the application provides a tin pick-up device and a tin pick-up method, and solves the problem that the temperature of a tin material is reduced and the tin pick-up quality is influenced because the tin material of the existing tin pick-up device needs to be far away from the tin pick-up device in the tin pick-up process.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, a wicking device is provided, comprising: the tin material containing body is provided with a containing groove and a spacing piece, the spacing piece is arranged in the containing groove and divides the containing groove into a tin dipping groove and a tin storing groove, two opposite side edges of the spacing piece are connected with two side walls of the containing groove, the bottom edge of the spacing piece is connected with the bottom surface of the containing groove, a tin material flowing notch is arranged between the top edge of the spacing piece and the two side walls of the containing groove, and the tin material flowing notch is communicated with the tin dipping groove and the tin storing groove; the material pushing piece comprises a material pushing block, and the material pushing block corresponds to the tin storage tank; the pushing block is used for entering the tin storage tank, so that tin materials in the tin storage tank are supplemented into the tin dipping tank through the tin material circulation notch, and the liquid level height of the tin materials in the tin dipping tank is equal to the full water height.
In a second aspect, a method for tin dipping using the tin dipping device of the first aspect is provided, which includes: the pushing block enters the tin storage tank, so that the liquid level height of the tin material stained with the tin storage tank is equal to or greater than the full water height; the pushing block is separated from the tin storage tank, so that the liquid level height of the tin material stained with the tin storage tank is equal to the full water height; and (5) carrying out tin dipping on the workpiece to be dipped with tin in the tin dipping tank.
In this application embodiment, make the tin material of storing up the tin bath supply to the tin sticky groove through the pushing block in, make the tin sticky groove can maintain full water height, the tin sticky operation can directly go on in the tin sticky groove, so tin sticky groove can not be kept away from to tin material in the tin sticky process, avoids the tin material to have the problem of cooling, promotes the tin sticky quality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic view of a wicking apparatus according to a first embodiment of the present application;
FIG. 2 is a cross-sectional view of a solder receiving body according to a first embodiment of the present application;
fig. 3 is a top view of a tin solder receiving body according to a first embodiment of the present application;
FIG. 4 is a flow chart illustrating the operation of the wicking device according to the first embodiment of the present disclosure;
FIG. 5 is a first state of use diagram of a wicking device in accordance with a first embodiment of the present application;
FIG. 6 is a second state of use diagram of a wicking device in accordance with a first embodiment of the present application;
FIG. 7 is a third state of use diagram of a wicking device in accordance with a first embodiment of the present application;
FIG. 8 is a flow chart illustrating the operation of a wicking device according to a second embodiment of the present application;
FIG. 9 is a flow chart illustrating the operation of a tin wetting apparatus according to a third embodiment of the present application;
FIG. 10 is a top view of a tin pick-up device according to a fourth embodiment of the present application;
fig. 11 is a top view of a wicking device in accordance with a fifth embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Please refer to fig. 1, which is a schematic view illustrating a tin wetting apparatus according to a first embodiment of the present application; as shown in the figure, the tin wetting apparatus 1 of the present embodiment includes a tin material accommodating body 10 and a material pushing member 11, the tin material accommodating body 10 has an accommodating groove 101 and a spacer 102, and the accommodating groove 101 has an opening 1011. The spacer 102 of the present embodiment is a plate, the spacer 102 is disposed in the accommodating groove 101, a bottom edge of the spacer 102 is connected to a bottom surface of the accommodating groove 101, two opposite side edges of the spacer 102 are connected to two opposite side walls of the accommodating groove 101, so as to divide the accommodating groove 101 into the solder dipping groove 1012 and the solder storing groove 1013. The tin dipping tank 1012 is used for accommodating tin materials for tin dipping, and the tin storage tank 1013 is used for accommodating tin materials for supplementing the tin dipping tank 1012.
Please refer to fig. 2, which is a cross-sectional view of a solder receiving body according to a first embodiment of the present application; as shown in the figure, the vertical height of the spacer 102 is smaller than the depth of the receiving groove 101, a solder flow gap 1014 is formed between the top edge of the spacer 102 away from the bottom edge and the two opposite side walls of the receiving groove 101, the solder flow gap 1014 is communicated with the solder wetting tank 1012 and the solder storage tank 1013, and the receiving groove 101 is closely connected with the bottom edge and the two opposite side edges of the spacer 102, so that the solder wetting tank 1012 and the solder storage tank 1013 are not communicated between the receiving groove 101 and the bottom edge and the two opposite side edges of the spacer 102.
The pusher 11 includes a pusher block 111 and a pusher rod 112, and the pusher rod 112 is connected to the pusher block 111. The plunger 111 can be placed in the solder storage 1013 to discharge solder from the solder storage 1013 and the discharged solder is replenished to the wetting tank 1012 through the solder flow gap 1014, so that the solder level of the wetting tank 1012 is maintained at a full height H, wherein the full height H is the vertical height from the bottom edge to the top edge of the spacer 102. After the plunger 111 is placed in the tin storage tank 1013, the tin material discharged from the tin storage tank 1013 can be replenished into the tin dipping tank 1012 to make the liquid level height of the tin material of the tin dipping tank 1012 equal to or greater than the full water height H, in other words, the amount of the tin material discharged from the tin storage tank 1013 after the plunger 111 is placed in the tin storage tank 1013 is greater than the volume to be replenished by the tin dipping tank 1012 and also represents that the volume of the plunger 111 is greater than the volume to be replenished by the tin dipping tank 1012, wherein after the tin dipping tank 1012 is subjected to tin dipping for one or more times, the liquid level height of the tin material of the tin dipping tank 1012 is less than the full water height H, so the volume to be replenished by the tin dipping tank 1012 is the product of the height difference between the liquid level height of the tin material of the tin dipping tank 1012 and the full water height H and the bottom area of the tin dipping tank 1012.
In some embodiments, the pushing block 111 enters the tin storage trough 1013 to discharge and replenish the tin material in the tin storage trough 1013 to the tin dipping trough 1012 each time the tin dipping is performed, so that the tin material in the tin dipping trough 1012 is replenished to the full water height H after each tin dipping. In some embodiments, before each time of the tin dipping, the liquid level of the tin material in the tin dipping tank 1012 is determined, and then whether the pushing block 111 enters the tin storage tank 1013 is determined, so that the tin material in the tin dipping tank 1012 is replenished to the full water level H. For example, a predetermined supplement volume of the wicking bath 1012, that is, a predetermined supplement height of the wicking bath 1012, which is less than the full height H, may be set, wherein the predetermined supplement volume of the wicking bath 1012 is a product of a height difference between the predetermined supplement height and the full height H and a bottom area of the wicking bath 1012, so that the volume of the plunger 111 is greater than the predetermined supplement volume of the wicking bath 1012. When the solder level of the wetting bath 1012 is equal to or less than the predetermined replenishment height, the pushing block 111 can be placed into the solder storage bath 1013, and the amount of solder discharged from the solder storage bath 1013 is equal to the volume of the pushing block 111 to fill the predetermined replenishment volume of the wetting bath 1012, so that the solder level of the wetting bath 1012 is maintained at the full water level. In some embodiments, the pusher block 111 can enter the tin storage trough 1013 after every two times of tin dipping or every predetermined number of times of tin dipping, so that the tin in the tin dipping trough 1012 can be replenished to the full water height H. For example, a predetermined number of times from the first time to the last time of the first time of the tin dipping may be set, and when the number of times of the tin dipping reaches the predetermined number of times, the pushing block 111 may be placed into the tin storage tank 1013 so as to maintain the liquid level of the tin material in the tin dipping tank 1012 at the full water level H.
In this embodiment, the volume of the wetting bath 1012 is the same as the volume of the tin storage bath 1013, and since the depth of the wetting bath 1012 and the depth of the wetting bath 1013 are both the vertical height of the spacer 102, the bottom area of the wetting bath 1012 is the same as the bottom area of the tin storage bath 1013. Please refer to fig. 3, which is a top view of the solder receiving body according to the first embodiment of the present application; as shown in the figure, the bottom surface of the wetting bath 1012 and the bottom surface of the solder storage bath 1013 of the present embodiment have the same shape, so the wetting bath 1012 and the solder storage bath 1013 are symmetrically disposed with respect to the spacer 102.
The surface of the pushing block 111 facing the tin storage trough 1013 is a flat surface, and when the pushing block 111 is placed in the tin storage trough 1013, the surface of the pushing block 111 facing the tin storage trough 1013 can push the tin in the tin storage trough 1013 uniformly. Of course, the surface of the pushing block 111 facing the solder storage trough 1013 may also be non-planar, the pushing block 111 of this embodiment is a quadrangular prism, but the pushing block 111 may also be a triangular prism, a pentagonal prism, a hexagonal prism, a polygonal prism, a triangular pyramid, a quadrangular pyramid, a polygonal pyramid, or a special-shaped body.
The end of the push rod 112 far away from the push block 111 can be held by hand and drives the push block 11 by manual means, or the end of the push rod 112 far away from the push block 111 is connected with a driver (such as a linear motor or an air cylinder) and drives the push block 11 by the driver, so that automatic operation is realized.
Please refer to fig. 4 to 7, which are a flow chart and a state diagram of a tin-wetting apparatus according to a first embodiment of the present application; as shown in the figure, the method for performing the tin wetting by using the tin wetting apparatus 1 of the present embodiment first executes step S10 to determine that the liquid level height of the tin solder in the tin wetting tank 1012 is less than the full water height H, and preferably, if the tin wetting tank 1012 has a predetermined replenishing height, this step can determine that the liquid level height of the tin solder in the tin wetting tank 1012 is less than or equal to the predetermined replenishing height. When the liquid level height of the tin dipping tank 1012 is judged to be less than the full water height H, it means that the tin dipping tank 1012 needs to be replenished with tin. In some embodiments, the step S10 can be omitted, i.e., the solder level of the dipping bath 1012 does not need to be determined. For example, before each tin dipping, a procedure of replenishing tin material to the tin dipping tank 1012 is performed: alternatively, the number of times of tin wetting may be accumulated, and when the predetermined number of times is reached, the procedure of replenishing the tin material to the tin wetting tank 1012 may be performed.
In addition, in the case that the pushing block 111 does not enter the tin storage tank 103, the liquid level height of the tin material of the tin pick-up device 1 should not be greater than the full water height H. If the pushing block 111 does not enter the tin storage tank 103, the tin level is already higher than the full water level, which means that the tin level is too high and inconsistent with the full water level H during tin dipping.
Next, step S11 is executed to determine that the tin storage 1013 is in a state of not requiring tin replenishment (as shown in fig. 5), in which the state of not requiring tin replenishment means that the height of the liquid level of the tin in the tin storage 1013 is substantially equal to the vertical height of the spacer 102, in other words, the liquid level of the tin in the tin storage 1013 is close to the top edge of the spacer 102; alternatively, the value obtained by subtracting the minimum amount required for filling the space between the pushing block 111 and the tin storage 1013 from the current remaining amount of the tin in the tin storage 1013 is greater than the difference between the amount of the tin in the tin-wetting bath 1012 at the full water height H and the current remaining amount of the tin in the tin-wetting bath 1012, which means that the tin storage 1013 is in a state of not requiring tin replenishment, and in this state, when the pushing block 111 completely enters the tin storage 1013, the tin in the tin storage 1013 can be replenished to the full water height H by the tin in the tin-wetting bath 1012. If it is determined that the tin storage tank 1013 is not in the state of requiring tin replenishment, step S111 is executed to replenish the tin material into the tin storage tank 1013 so as to make the tin storage tank 1013 in the state of not requiring tin replenishment. After the tin is replenished to the tin storage trough 1013, the step S10 is executed again. In some embodiments, the step S11 can be omitted, i.e., it is not necessary to determine whether the solder storage tank 1013 is in a state requiring solder replenishment. For example, the solder in the solder reservoir 1013 can be replenished to the top edge of the adjacent spacer 102 before the pusher block 111 is fed into the solder reservoir 1013 each time or every few times.
In some embodiments, either or both of step S10 or step S11 may be omitted. For example, step S10 may be omitted and step S12 may be directly executed in step S11; or step S10 can be executed first, followed by step S12; or step S11 is executed first, and then step S12 is executed.
Next, step S12 is executed, the pushing block 111 enters the tin storage trough 1013, so that the liquid level height of the tin material in the tin pick-up trough 1012 is equal to or greater than the full water height H (as shown in fig. 6), in this embodiment, the pushing block 111 enters the tin storage trough 1013, the pushing block 11 is driven by a hand or a driver to move towards the tin storage trough 1013, and the pushing rod 112 drives the pushing block 111 to enter the tin storage trough 1013. When the pushing block 111 enters the tin storage tank 1013, the volume of the tin storage tank 1013 capable of containing tin material gradually decreases, so that the liquid level height of the tin material of the tin storage tank 1013 gradually rises until the liquid level height of the tin material of the tin storage tank 1013 is greater than the vertical height of the spacer 102, and the tin material of the tin storage tank 1013 flows into the tin pick-up tank 1012 through the tin material flowing notch 1014, so that the liquid level height of the tin material of the tin pick-up tank 1012 is equal to or greater than the full water height H; alternatively, since the solder in the wetting tank 1012 and the solder in the solder storage tank 1013 are communicated, the liquid level height of the solder in the containing tank 101 is equal to or greater than the full water height H.
Then, step S14 is executed, the pushing block 111 is disengaged from the tin storage trough 1013, such that the liquid level height of the tin material in the tin wetting trough 1012 is equal to the full water height H (as shown in fig. 7), in this embodiment, the pushing block 111 enters the tin storage trough 1013 and the pushing block 11 is driven by a hand or a driver to move away from the tin storage trough 1013, and the pushing rod 112 drives the pushing block 111 to disengage from the tin storage trough 1013. Certainly, the liquid level of the solder in the solder dipping tank 1012 is greater than the full water level H, after the pushing block 111 is removed from the solder storage tank 1013, the solder exceeding the solder dipping tank 1012 flows back to the solder storage tank 1013 through the solder flowing notch 1014, and finally the liquid level of the solder in the solder dipping tank 1012 is equal to the full water level H.
Finally, step S16 is executed, the workpiece to be tin-dipped is tin-dipped in the tin-dipping tank 1012, and since the liquid level of the tin material in the tin-dipping tank 1012 is equal to the full water level H, the liquid level of the tin material can be kept uniform during tin-dipping. As can be seen from the above, the workpiece to be tin-dipped is directly tin-dipped in the tin dipping tank 1012, so the tin material will not be separated from the tin dipping device 1, and thus the temperature of the tin material will not be reduced during the tin dipping process, and the good tin dipping quality is maintained.
Please refer to fig. 8, which is a flowchart illustrating a tin wetting apparatus according to a second embodiment of the present application; as shown in the drawings, the tin wetting method of the tin wetting device of the present embodiment is different from the tin wetting method of the tin wetting device of the first embodiment in that after step S12 is executed, step S13 is executed to scrape an oxide layer on a liquid surface of a tin material in a tin wetting tank; alternatively, since the solder in the solder dipping tank and the solder in the solder storage tank are communicated and the height of the solder level is greater than the top edge of the spacer, step S13 can also be regarded as scraping the oxide layer on the entire solder level of the storage tank.
Please refer to fig. 9, which is a flowchart illustrating a tin wetting apparatus according to a third embodiment of the present application; as shown in the drawings, the tin wetting method of the tin wetting apparatus of the present embodiment is different from the tin wetting method of the tin wetting apparatus of the first embodiment in that after step S14 is executed, step S15 is executed to scrape an oxide layer on a liquid surface of a tin material in a tin wetting tank.
Referring to fig. 10, which is a top view of a tin pick-up device according to a fourth embodiment of the present application, as shown in the figure, a difference between the tin pick-up device 1 of the present embodiment and the tin pick-up device of the first embodiment is that a bottom area of the tin pick-up tank 1012 of the present embodiment is the same as a bottom area of the tin storage tank 1013, a bottom shape of the tin pick-up tank 1012 is different from a bottom shape of the tin storage tank 1013, the bottom shape of the tin pick-up tank 1012 is rectangular, and the bottom shape of the tin storage tank 1013 is square. Of course, the bottom surface of the solder dipping tank 1012 may be square, and the bottom surface of the solder storage tank 1013 may be rectangular.
Referring to fig. 11, which is a top view of a tin pick-up device according to a fifth embodiment of the present application, as shown in the drawing, a difference between the tin pick-up device 1 of the present embodiment and the tin pick-up device of the first embodiment is that a volume of a tin storage tank 1013 of the present embodiment is greater than a volume of a tin pick-up tank 1012, a depth of the tin pick-up tank 1012 is the same as the depth of the tin storage tank 1013, a bottom area of the tin storage tank 1013 is greater than the bottom area of the tin pick-up tank 1012, in the present embodiment, a width of a bottom surface of the tin storage tank 1013 is the same as a width of the bottom surface of the tin pick-up tank 1012, and a length of the bottom surface of the tin storage.
To sum up, the application provides a tin sticky device and tin sticky method, get into through the pushing block and make in the tin storage tank that tin storage tank exhaust tin material can supply to the tin sticky tank in, make the tin sticky tank's tin material liquid level can maintain in full water height, tin material liquid level when letting the tin sticky can keep unified, and the tin sticky operation can directly go on in being stained with the tin tank, so tin sticky tank in-process tin material can not keep away from the tin sticky tank, avoids the tin material to have the problem of cooling, promotes the tin sticky quality.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A wicking apparatus, comprising:
the tin material containing body is provided with a containing groove and a spacing piece, the spacing piece is arranged in the containing groove and divides the containing groove into a tin dipping groove and a tin storage groove, two opposite side edges of the spacing piece are connected with two side walls of the containing groove, the bottom edge of the spacing piece is connected with the bottom surface of the containing groove, a tin material circulation gap is arranged between the top edge of the spacing piece and the two side walls of the containing groove, and the tin material circulation gap is communicated with the tin dipping groove and the tin storage groove;
the material pushing piece comprises a material pushing block, and the material pushing block corresponds to the tin storage tank;
the pushing block is used for entering the tin storage tank, so that tin materials in the tin storage tank are supplemented into the tin dipping tank through the tin material circulation notch, and the liquid level height of the tin materials in the tin dipping tank is equal to the full water height.
2. The tin pick-up device as claimed in claim 1, wherein a vertical height from a bottom edge to a top edge of the spacer is less than a depth of the receiving groove, and the full water height is equal to the vertical height of the spacer.
3. The tin pick-up device as claimed in claim 1, wherein the pusher further comprises a pusher bar, the pusher bar being connected to the pusher block.
4. The wicking apparatus of claim 3, wherein the pusher block has a volume greater than a predetermined replenishment volume of the wicking bath.
5. The wicking apparatus of claim 1, wherein the pusher block is a corner post, pyramid, or profile.
6. The tin dipping device as recited in claim 1, wherein the volume of the tin dipping tank is the same as the volume of the tin storage tank, and the bottom area of the tin dipping tank is the same as the bottom area of the tin storage tank.
7. The tin dipping device as recited in claim 1, wherein the volume of the tin storage tank is larger than the volume of the tin dipping tank, and the bottom area of the tin storage tank is larger than the bottom area of the tin dipping tank.
8. A method of tin dipping using the tin dipping device as set forth in any one of claims 1 to 7, comprising:
the pushing block enters the tin storage tank, so that the liquid level height of the tin material in the tin dipping tank is equal to or greater than the full water height;
the pushing block is separated from the tin storage tank, so that the liquid level height of the tin material in the tin dipping tank is equal to the full water height;
and carrying out tin dipping on the workpiece to be dipped with tin in the tin dipping tank.
9. The method of tinning according to claim 8, further comprising:
and judging that the height of the liquid level of the tin solder of the tin dipping tank is less than or equal to a preset supplementing height of the tin dipping tank, wherein the preset supplementing height is less than the full water height.
10. The method of tinning according to claim 8, further comprising:
and judging that the tin storage tank is in a state of needing tin supplement, and supplementing tin materials to the tin storage tank.
11. The method as recited in claim 8, wherein said pushing block enters said tin storage tank such that a height of a liquid level of said tin dipping tank is equal to or greater than said full water height, and further comprising scraping an oxide layer from said liquid level of said tin dipping tank.
12. The method as recited in claim 8, wherein said stripping block is removed from said tin reservoir such that a height of a surface of said tin in said tin reservoir is equal to a height of said full volume of water, and further comprising scraping an oxide layer from a surface of said tin in said tin reservoir.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010011112.2A CN110961754A (en) | 2020-01-06 | 2020-01-06 | Tin dipping device and tin dipping method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010011112.2A CN110961754A (en) | 2020-01-06 | 2020-01-06 | Tin dipping device and tin dipping method |
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| CN110961754A true CN110961754A (en) | 2020-04-07 |
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| CN202010011112.2A Pending CN110961754A (en) | 2020-01-06 | 2020-01-06 | Tin dipping device and tin dipping method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589222A (en) * | 2020-12-16 | 2021-04-02 | 张慧 | Circuit pin soldering device |
| CN112719492A (en) * | 2020-12-16 | 2021-04-30 | 张慧 | Circuit pin tin soldering processing technology |
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| CN101518846A (en) * | 2008-02-25 | 2009-09-02 | 黎叶荣 | Online copper-removing device |
| CN203973009U (en) * | 2014-06-08 | 2014-12-03 | 厦门海普锐精密电子设备有限公司 | A kind of wetting device with tin liquor face height detection |
| DE102014211807A1 (en) * | 2014-06-20 | 2015-12-24 | Robert Bosch Gmbh | Soldering device and method for soldering |
| CN204248153U (en) * | 2014-11-17 | 2015-04-08 | 重庆三贵机械制造有限公司 | A kind of spark machined work nest |
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| CN112589222A (en) * | 2020-12-16 | 2021-04-02 | 张慧 | Circuit pin soldering device |
| CN112719492A (en) * | 2020-12-16 | 2021-04-30 | 张慧 | Circuit pin tin soldering processing technology |
| CN112719492B (en) * | 2020-12-16 | 2023-01-13 | 深圳天瑜电子有限公司 | Circuit pin tin soldering processing technology |
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Application publication date: 20200407 |