CN110951425A - Acid and alkali resistant heat-seal adhesive, preparation method thereof and adhesive tape prepared from same - Google Patents
Acid and alkali resistant heat-seal adhesive, preparation method thereof and adhesive tape prepared from same Download PDFInfo
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- CN110951425A CN110951425A CN201911081666.3A CN201911081666A CN110951425A CN 110951425 A CN110951425 A CN 110951425A CN 201911081666 A CN201911081666 A CN 201911081666A CN 110951425 A CN110951425 A CN 110951425A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to an acid and alkali resistant heat-seal adhesive, a preparation method thereof and an adhesive tape prepared from the same, wherein the adhesive comprises the following raw materials in parts by weight:
Description
Technical Field
The invention relates to a preparation method of a temperature-sensitive adhesive, in particular to an acid-alkali-resistant heat-seal adhesive, a preparation method thereof and an adhesive tape prepared from the same.
Background
The main feature of heat-seal adhesives is that the systems exhibit high adhesive forces below a certain temperature and low adhesive forces above this temperature. The adhesive is suitable for fixing elements at room temperature, can be peeled off when the peeling is needed, and has high reusability. Has important application in the fields of electronic parts, semiconductor wafers, liquid crystals and the like.
Disclosure of Invention
The invention aims to provide an adhesive with good heat resistance, high cohesive force and uniform viscosity, and an adhesive tape containing the adhesive, and the specific technical scheme is as follows:
an acid and alkali resistant thermal adhesive comprises the following raw materials in parts by weight:
the linear alkyl (meth) acrylate having 1 to 6 carbon atoms is one or more selected from methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and hexyl (meth) acrylate.
Further, the perfluoroalkyl (meth) acrylate with 6-12 carbon atoms is one or more of dodecafluoroheptyl methacrylate, N-methyl perfluorohexyl sulfonamide ethyl acrylate, perfluorooctanol acrylate, perfluorohexyl ethyl acrylate, perfluorooctyl ethyl acrylate and perfluorooctyl methacrylate.
Further, the hydroxyl-containing functional polar monomer is one or more of hydroxyethyl (meth) acrylate, 2-2 hydroxypropyl (meth) acrylate and 2-hydroxyhexyl (meth) acrylate.
Further, the copolymerization initiator is one of benzoyl peroxide, dimethyl ethyl ketone peroxide, 2-azobisisobutyronitrile and azobisisoheptonitrile.
The preparation method of the acid and alkali resistant thermal adhesive comprises the following steps:
step one, preparing an acrylic pressure-sensitive adhesive (I): performing copolymerization reaction on 60-90 parts of alkyl (methyl) acrylate with 1-6 carbon atoms, 5-30 parts of functional polar monomer containing hydroxyl and 1-10 parts of (methyl) acrylic acid under the action of an initiator to prepare the pressure-sensitive adhesive;
step two, preparing a fluorine-containing acrylic acid adhesive (II): the acid and alkali resistant thermal adhesive is prepared by performing copolymerization reaction on 50-70 parts of alkyl (methyl) acrylate with 1-6 carbon atoms, 10-20 parts of perfluoroalkyl (methyl) acrylate with 6-12 carbon atoms and 1-10 parts of (methyl) acrylic acid under the action of an initiator.
When in use, the acrylic pressure-sensitive adhesive (I) prepared in the first step and the fluorine-containing acrylic adhesive (II) prepared in the second step are mixed in any proportion.
50-100 parts of acrylic pressure-sensitive adhesive (I) and 10-50 parts of fluorine-containing acrylic adhesive (II) are added into a toluene solvent, 0.5-4 parts of isocyanate curing agent are added, the mixture is fully and uniformly stirred and then coated on a substrate film, and the substrate film is thermally treated to remove the solvent and thermally set to obtain the adhesive tape.
Further, the isocyanate compound is one or more of an isophorone diisocyanate polymer, a (hydrogenated) toluene diisocyanate polymer, a hexamethylene diisocyanate polymer, a naphthalene diisocyanate polymer, and a (hydrogenated) xylylene diisocyanate polymer.
Further, the substrate film is one of a polyethylene film, a polyvinyl chloride film, a polypropylene film, a polycarbonate film and a polyethylene terephthalate film.
Further, the thickness of the adhesive tape is 30-50 mm.
The invention has the beneficial effects that: the acrylic acid sub-sensitive adhesive can generate better adhesive force at low temperature under the condition of applying pressure; the fluorine-containing acrylic adhesive is prepared by copolymerizing fluorine-containing carbon long side chains on a molecular chain, spontaneous aggregation between the fluorocarbon side chains can form a crystalline region at low temperature, the influence on the adhesive force of an acrylic pressure-sensitive adhesive system is reduced to the maximum extent, and the fluorocarbon side chains are freely diffused into the system after the temperature is raised, so that the adhesive force of the system is reduced, and the peeling is easy. In addition, the acrylic acid main chain is used as a mutual solubility component with the pressure-sensitive adhesive, so that the compatibility of the acrylic acid main chain and the pressure-sensitive adhesive can be effectively improved. Due to the existence of the fluorine-containing chain segment, the acid and alkali resistance of the adhesive is effectively improved.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific examples.
Example 1
(1) Preparation of acrylic pressure-sensitive adhesive
70 parts of hexyl methacrylate, 20 parts of hydroxyethyl methacrylate and 10 parts of methacrylic acid are mixed thoroughly, stirred uniformly in a N2 bubbling device, and 0.3 part of initiator benzoyl peroxide is added. And stirred at 80 ℃ for 6 h. Finally, the acrylic pressure-sensitive polymer I is prepared.
(2) Preparation of fluorine-containing acrylic acid adhesive
75 parts of hexyl methacrylate, 15 parts of dodecafluoroheptyl methacrylate and 10 parts of methacrylic acid are mixed thoroughly, stirred uniformly in a N2 bubbling system, and 0.3 part of benzoyl peroxide initiator is added. And stirred at 80 ℃ for 6 h. Finally, the fluorine-containing acrylic polymer II is prepared.
(3) Preparation of adhesive tape
Mixing 60 parts of polymer I and 40 parts of polymer II in 20 parts of toluene solvent, adding 3 parts of toluene diisocyanate curing agent (such as commercially available L-75), uniformly mixing, coating on a polyethylene terephthalate film, drying at 100 ℃ for 5min to remove the solvent, and carrying out thermosetting treatment to obtain the adhesive tape.
Example 2
(1) Preparation of acrylic pressure-sensitive adhesive
60 parts of butyl methacrylate, 20 parts of hydroxyethyl methacrylate and 10 parts of methacrylic acid are mixed thoroughly, stirred uniformly in a N2 bubbling system, and 0.25 part of initiator benzoyl peroxide is added. And stirred at 80 ℃ for 6 h. Finally, the acrylic pressure-sensitive polymer I is prepared.
(2) Preparation of fluorine-containing acrylic acid adhesive
70 parts of butyl methacrylate, 20 parts of perfluorooctyl methacrylate and 10 parts of methacrylic acid were thoroughly mixed, stirred uniformly in a N2 bubble, and 0.3 part of initiator benzoyl peroxide was added. And stirred at 80 ℃ for 6 h. Finally, the fluorine-containing acrylic polymer II is prepared.
(3) Preparation of adhesive tape
Mixing 60 parts of polymer I and 40 parts of polymer II in 20 parts of toluene solvent, adding 3 parts of toluene diisocyanate curing agent (such as commercially available L-75), uniformly mixing, coating on a polyethylene terephthalate film, drying at 100 ℃ for 5min to remove the solvent, and carrying out thermosetting treatment to obtain the adhesive tape.
Example 3
(1) Preparation of acrylic pressure-sensitive adhesive
60 parts of butyl methacrylate, 30 parts of hydroxyhexyl methacrylate and 10 parts of methacrylic acid are fully mixed, stirred uniformly in a N2 bubbling process, and 0.25 part of initiator 2, 2-azobisisobutyronitrile is added. And stirred at 70 ℃ for 6 h. Finally, the acrylic pressure-sensitive polymer I is prepared.
(2) Preparation of fluorine-containing acrylic acid adhesive
60 parts of methyl methacrylate, 20 parts of dodecafluoroheptyl methacrylate and 20 parts of methacrylic acid are thoroughly mixed, stirred uniformly in a N2 bubbling process, and 0.25 part of initiator 2, 2-azobisisobutyronitrile is added. And stirred at 70 ℃ for 6 h. Finally, the fluorine-containing acrylic polymer II is prepared.
(3) Preparation of adhesive tape
70 parts of polymer I and 30 parts of polymer II are mixed in 20 parts of toluene solvent, 3 parts of (hydrogenated) toluene diisocyanate polymer is added, the mixture is uniformly mixed and then coated on a polyethylene terephthalate film, and the polyethylene terephthalate film is dried for 5min at 100 ℃ to remove the solvent and subjected to thermosetting treatment to obtain the adhesive tape.
Example 4
(1) Preparation of acrylic pressure-sensitive adhesive
85 parts of butyl methacrylate, 10 parts of hydroxyethyl methacrylate and 5 parts of methacrylic acid are fully mixed, stirred uniformly in a N2 bubbling process, and 0.35 part of initiator 2, 2-azobisisobutyronitrile is added. And stirred at 70 ℃ for 6 h. Finally, the acrylic pressure-sensitive polymer I is prepared.
(2) Preparation of fluorine-containing acrylic acid adhesive
65 parts of butyl methacrylate, 20 parts of perfluorooctyl ethyl acrylate and 5 parts of methacrylic acid are fully mixed, stirred uniformly in a N2 bubbling process, and 0.3 part of initiator 2, 2-azobisisobutyronitrile is added. And stirred at 70 ℃ for 6 h. Finally, the fluorine-containing acrylic polymer II is prepared.
(3) Preparation of adhesive tape
75 parts of polymer I and 35 parts of polymer II are mixed in 20 parts of toluene solvent, 4 parts of toluene diisocyanate curing agent (such as commercially available L-75) is added, the mixture is uniformly mixed and coated on a polyethylene terephthalate film, and the polyethylene terephthalate film is dried at 100 ℃ for 5min to remove the solvent and subjected to thermosetting treatment to obtain the adhesive tape.
Example 5
(1) Preparation of acrylic pressure-sensitive adhesive
70 parts of butyl methacrylate, 20 parts of hydroxyethyl methacrylate and 10 parts of methacrylic acid are mixed thoroughly and stirred uniformly in a N2 bubbling, and 0.25 part of initiator benzoyl peroxide is added. And stirred at 80 ℃ for 6 h. Finally, the acrylic pressure-sensitive polymer I is prepared.
(2) Preparation of fluorine-containing acrylic acid adhesive
70 parts of methyl methacrylate, 20 parts of perfluorooctyl methacrylate and 10 parts of methacrylic acid were thoroughly mixed and stirred in a N2 bubble, and 0.3 part of initiator benzoyl peroxide was added. And stirred at 80 ℃ for 6 h. Finally, the fluorine-containing acrylic polymer II is prepared.
(3) Preparation of adhesive tape
Mixing 80 parts of polymer I and 20 parts of polymer II in 20 parts of toluene solvent, adding 3 parts of toluene diisocyanate curing agent (such as commercially available L-75), uniformly mixing, coating on a polyethylene terephthalate film, drying at 100 ℃ for 5min to remove the solvent, and carrying out thermosetting treatment to obtain the adhesive tape.
The adhesive tapes prepared in examples 1 to 5 were subjected to performance tests, and the specific test results are shown in table 1:
note: the peel strength of 180 ° and stainless steel plates at different temperatures was tested against the resulting cold-shut adhesive tape;
and (3) acid and alkali resistance test: soaking the adhesive tape into a NaOH aqueous solution with the mass fraction of 10% and a HCl aqueous solution with the mass fraction of 10% for 15min at room temperature, and observing whether swelling and other problems occur;
the test result shows that: the heat resistance of the adhesive is effectively improved; the tensile strength of the adhesive tape is obviously improved; the high-temperature adhesive force of the adhesive tape is obviously improved; the adhesive tape has uniform viscosity distribution and thickness.
The technical means disclosed by the scheme of the invention are not limited to the technical means disclosed by the technical means, and also comprise the technical scheme formed by equivalent replacement of the technical features. The present invention is not limited to the details given herein, but is within the ordinary knowledge of those skilled in the art.
Claims (10)
1. The acid and alkali resistant thermal adhesive is characterized by comprising the following raw materials in parts by weight:
2. the acid-and alkali-resistant thermal adhesive according to claim 1, wherein said straight-chain alkyl (meth) acrylate having 1 to 6 carbon atoms is one or more selected from methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and hexyl (meth) acrylate.
3. The acid and alkali resistant thermal adhesive according to claim 1, wherein the perfluoroalkyl (meth) acrylate with 6-12 carbon atoms is one or more of dodecafluoroheptyl methacrylate, N-methylperfluorohexyl sulfonamide group) ethyl acrylate, perfluorooctanol acrylate, perfluorohexylethyl acrylate, perfluorooctylethyl acrylate, and perfluorooctylmethyl acrylate.
4. The acid and alkali resistant thermal adhesive according to claim 1, wherein the functional polar monomer containing hydroxyl group is one or more of hydroxyethyl (meth) acrylate, 2-2 hydroxypropyl (meth) acrylate, and 2-hydroxyhexyl (meth) acrylate.
5. The acid-and alkali-resistant thermal adhesive according to claim 1, wherein the copolymerization initiator is one of benzoyl peroxide, dimethyl ethyl ketone peroxide, 2-azobisisobutyronitrile, and azobisisoheptonitrile.
6. The method for preparing the acid-and-alkali-resistant thermal adhesive according to any one of claims 1 to 5, comprising the steps of:
step one, preparing an acrylic pressure-sensitive adhesive (I): mixing C1-6 alkyl (meth) acrylate 60-90 parts, hydroxyl-containing functional polar monomer 5-30 parts, and (meth) acrylic acid 1-10 parts, and adding N2Stirring uniformly in bubbling, then adding an initiator, and stirring for 6 hours at 80 ℃ to prepare the acrylic acid type pressure-sensitive adhesive (I);
step two, preparing a fluorine-containing acrylic acid adhesive (II): fully mixing 50-70 parts of alkyl (methyl) acrylate with 1-6 carbon atoms, 10-20 parts of perfluoroalkyl (methyl) acrylate with 6-12 carbon atoms and 1-10 parts of (methyl) acrylic acid, uniformly stirring in N2 bubbling, adding an initiator, and stirring at 80 ℃ for 6 hours to prepare the fluorine-containing acrylic adhesive (II);
when in use, the acrylic pressure-sensitive adhesive (I) prepared in the first step and the fluorine-containing acrylic adhesive (II) prepared in the second step are mixed in any proportion.
7. An adhesive tape made of the acid and alkali resistant thermal adhesive prepared by the preparation method of claim 6, characterized in that 50-100 parts of acrylic pressure sensitive adhesive (I) and 10-50 parts of fluorine-containing acrylic adhesive (II) are added into toluene solvent, 0.5-4 parts of isocyanate curing agent are added, the mixture is coated on a substrate film after being fully and uniformly stirred, and the solvent is removed by heat treatment and the mixture is thermoset, so that the adhesive tape is obtained.
8. The adhesive tape according to claim 7, wherein the isocyanate compound is one or more of an isophorone diisocyanate polymer, a (hydrogenated) toluene diisocyanate polymer, a hexamethylene diisocyanate polymer, a naphthalene diisocyanate polymer, and a (hydrogenated) xylylene diisocyanate polymer.
9. The adhesive tape of claim 7, wherein said substrate film is one of a polyethylene film, a polyvinyl chloride film, a polypropylene film, a polycarbonate film, and a polyethylene terephthalate film.
10. The adhesive tape of claim 7, wherein said adhesive tape has a thickness of 30 to 50 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911081666.3A CN110951425A (en) | 2019-11-07 | 2019-11-07 | Acid and alkali resistant heat-seal adhesive, preparation method thereof and adhesive tape prepared from same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911081666.3A CN110951425A (en) | 2019-11-07 | 2019-11-07 | Acid and alkali resistant heat-seal adhesive, preparation method thereof and adhesive tape prepared from same |
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| Publication Number | Publication Date |
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| CN110951425A true CN110951425A (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911081666.3A Pending CN110951425A (en) | 2019-11-07 | 2019-11-07 | Acid and alkali resistant heat-seal adhesive, preparation method thereof and adhesive tape prepared from same |
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| JP2019119766A (en) * | 2017-12-28 | 2019-07-22 | 積水化学工業株式会社 | Adhesive composition and adhesive tape |
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2019
- 2019-11-07 CN CN201911081666.3A patent/CN110951425A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190991A (en) * | 2011-03-24 | 2011-09-21 | 昆山博益鑫成高分子材料有限公司 | PET (poly(ethylene terephthalate)) protection film pressure-sensitive adhesive used for manufacture process of flat panel display, and production method thereof |
| CN102504717A (en) * | 2011-11-07 | 2012-06-20 | 北京天山新材料技术股份有限公司 | Adhesive tape for bonding low-surface-energy material and preparation method thereof |
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| CN106398563A (en) * | 2016-08-30 | 2017-02-15 | 泰兴联创绝缘材料有限公司 | Multi-interface diffusion alleviation acid-resistant protection film structure and production method thereof |
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| JP2019119766A (en) * | 2017-12-28 | 2019-07-22 | 積水化学工業株式会社 | Adhesive composition and adhesive tape |
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