CN110948877A - Cooling device applied to LCD3D printer - Google Patents
Cooling device applied to LCD3D printer Download PDFInfo
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- CN110948877A CN110948877A CN201911341279.9A CN201911341279A CN110948877A CN 110948877 A CN110948877 A CN 110948877A CN 201911341279 A CN201911341279 A CN 201911341279A CN 110948877 A CN110948877 A CN 110948877A
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- fixedly connected
- air
- cooling
- heat dissipation
- pipe
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/379—Handling of additively manufactured objects, e.g. using robots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
- Liquid Crystal (AREA)
- Electronic Switches (AREA)
Abstract
The invention discloses a cooling device applied to an LCD3D printer, which comprises a printing platform, wherein a vertically arranged air cylinder is fixedly arranged on a base, the upper end of the air cylinder is fixedly connected with an annular cylinder body through a connecting rod, and the inner wall of the annular cylinder body is fixedly connected with a spiral air pipe and a spiral heat-conducting water pipe; the upper portion fixedly connected with air pump of connecting rod, the tracheal surface of circling is provided with the bleeder vent, and tracheal one end of circling is connected with the cooler bin, and the both sides of cooler bin run through respectively to be inlayed and are equipped with the semiconductor refrigeration piece. According to the invention, the annular cylinder body is driven to lift by the air cylinder, so that the printed product of the LCD3D printer is cooled in a surrounding manner, the spiral air pipe is used for driving air in the sealing cavity of the printing area to flow, the spiral heat-conducting water pipe is matched for quickly transferring heat out, and the cooling effect is good; and when the device is not needed to be used, the device retracts, the internal space of the printing cavity is not influenced, and the operation is convenient.
Description
Technical Field
The invention belongs to the technical field of LCD3D printers, and particularly relates to a cooling device applied to an LCD3D printer.
Background
3D printing (also known as additive manufacturing, additive manufacturing) is a technique that constructs objects by printing layer by layer using bondable materials, such as powdered metal or plastic, based on digital model files. The 3D printing is often used for manufacturing models in the fields of mold manufacturing, industrial design, etc., and then gradually used for direct manufacturing of some products, which has a profound influence on the traditional process flow, production line, factory model, and industrial chain combination, and is a typical subversive technology in the manufacturing industry.
The LCD3D printer is a laser cladding deposition 3D printing technology, and the LCD3D printer needs to cool down products after printing; in the process, the printing cavity is required to be kept in a sealed state, and inert gas is filled in the printing cavity, so that the product is prevented from being oxidized at high temperature and the quality of the product is prevented from being influenced; because the interior is in a sealed state, the effect of air cooling is poor, a plurality of pipelines can be paved by adopting water cooling, a large amount of space in the printing space is occupied, and the use is inconvenient; therefore, we propose a cooling device for use in an LCD3D printer.
Disclosure of Invention
The invention aims to provide a cooling device applied to an LCD3D printer, which solves the problem of inconvenient cooling of the LCD3D printer in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a cooling apparatus for use with an LCD3D printer, comprising:
the printing platform of the LCD3D printer body is characterized in that the bottom of the printing platform is fixedly connected with a base, a vertically arranged air cylinder is fixedly mounted on the base, the upper end of the air cylinder is fixedly connected with an annular cylinder through a connecting rod, a spiral air pipe and a spiral heat conducting water pipe are fixedly connected to the inner wall of the annular cylinder, the annular cylinder penetrates through the printing platform, and a first annular plate and a second annular plate are fixedly connected to the upper end and the lower end of the annular cylinder respectively;
the upper part of the connecting rod is fixedly connected with an air pump, air holes are formed in the surface of the spiral air pipe, the spiral air pipe is provided with two groups, one end of each group of spiral air pipes is communicated with an air inlet and an air outlet of the air pump respectively, one end of each spiral air pipe is connected with a cooling box, the spiral air pipe of a copper heat conduction structure communicated with the spiral air pipes is installed inside the cooling box, a filling layer is arranged inside the cooling box, and semiconductor refrigerating sheets are embedded in the two sides of the cooling box in a penetrating mode respectively;
one side fixedly connected with heat dissipation water storage box of base, the bottom one end intercommunication of heat dissipation water storage box has circulating water pump, circulating water pump's delivery port through water inlet hose with the one end intercommunication of the heat conduction water pipe spirals, the other end that spirals the heat conduction water pipe has a water outlet head through going out water hose connection, water outlet head sets up the top at heat dissipation water storage box.
Preferably, the upper portion fixedly connected with cover body of print platform forms the seal chamber in the printing district through the cover body on print platform's upper portion, and one side of the cover body is provided with sealing door, still fixed mounting has roast lamp on the inner wall of the cover body.
Preferably, the heat dissipation water storage tank is a copper water tank, the top of the heat dissipation water storage tank is an open opening, the inner wall of the heat dissipation water storage tank is fixedly connected with a baffle plate, the outer wall of the heat dissipation water storage tank is fixedly connected with a heat dissipation fin, and one side of the bottom of the heat dissipation water storage tank is communicated with a communication opening which is convenient to connect with a circulating water pump.
Preferably, still including the inert gas holder, the export of inert gas holder pass through communicating pipe with the cover body intercommunication, and one of communicating pipe is served and is still installed the valve.
Preferably, be provided with the annular step opening that the annular barrel of being convenient for passed on the print platform, print platform's middle part lower fixed surface is connected with the vertical support post that sets up, the lower extreme fixed connection of support post is on the base.
Preferably, the refrigerating surface of the semiconductor refrigerating sheet is arranged in the cooling box, the heat releasing surface of the semiconductor refrigerating sheet is arranged on the outer side of the cooling box, and the filling layer is a mixture filling layer of copper powder and silicone oil.
Preferably, the lower surface of the first annular plate is fixedly connected with a first sealing rubber gasket, and the upper surface of the second annular plate is fixedly connected with a second sealing rubber gasket.
Preferably, one side fixed mounting of print platform has the operation panel, install the operating button that is used for controlling the cylinder flexible and is used for controlling circulating water pump, air pump and semiconductor refrigeration piece power break-make on the operation panel respectively.
The invention has the technical effects and advantages that: compared with the prior art, the cooling device applied to the LCD3D printer has the following advantages that:
1. according to the invention, the annular cylinder body is driven to lift by the air cylinder, so that the printed product of the LCD3D printer is cooled in a surrounding manner, the spiral air pipe is used for driving air in the sealing cavity of the printing area to flow, the spiral heat-conducting water pipe is matched for quickly transferring heat out, and the cooling effect is good; the printing cavity can be retracted when not in use, the internal space of the printing cavity is not influenced, and the operation is convenient;
2. according to the printing platform, the annular step through hole is formed in the printing platform, so that the annular cylinder body can be conveniently lifted and moved, sealing can be performed, the internal sealing performance is kept, and inert gas cannot pass after being injected.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial schematic view of the present invention;
FIG. 3 is a schematic view of the internal structure of the heat dissipating water storage tank of the present invention;
FIG. 4 is a schematic view of the side view of the inside of the cooling box of the present invention.
In the figure: 1. a base; 2. a printing platform; 3. a cover body; 4. an inert gas storage tank; 5. a valve; 6. a communicating pipe; 7. a printing area sealing cavity; 8. baking a lamp; 9. a connecting rod; 10. a water inlet hose; 11. a cylinder; 12. a water circulating pump; 13. a heat dissipation water storage tank; 14. a heat dissipating fin; 15. a water outlet head; 16. a water outlet hose; 17. a first annular plate; 18. a first sealing rubber gasket; 19. circling the air pipe; 20. air holes are formed; 21. an annular step through opening; 22. a second annular plate; 23. a second sealing rubber gasket; 24. an air pump; 25. a cooling tank; 26. an operation panel; 27. an opening is formed; 28. a baffle plate; 29. a communication port; 30. a filling layer; 31. a helical gas pipe; 32. a semiconductor refrigeration sheet; 33. an annular cylinder; 34. spirally winding the heat-conducting water pipe; 35. and supporting the upright post.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present invention provides a cooling device for an LCD3D printer as shown in fig. 1-4, comprising:
the printing platform 2 of the LCD3D printer body is characterized in that the bottom of the printing platform 2 is fixedly connected with a base 1, a vertically arranged air cylinder 11 is fixedly installed on the base 1, the upper end of the air cylinder 11 is fixedly connected with an annular cylinder 33 through a connecting rod 9, a spiral air pipe 19 and a spiral heat conducting water pipe 34 are fixedly connected to the inner wall of the annular cylinder 33, the annular cylinder 33 penetrates through the printing platform 2, and the upper end and the lower end of the annular cylinder 33 are respectively fixedly connected with a first annular plate 17 and a second annular plate 22;
the upper part of the connecting rod 9 is fixedly connected with an air pump 24, the surface of the spiral air pipe 19 is provided with air holes 20, the spiral air pipe 19 is provided with two groups, one end of each of the two groups of spiral air pipes 19 is respectively communicated with an air inlet and an air outlet of the air pump 24, one end of each of the spiral air pipes 19 is connected with a cooling box 25, a spiral air pipe 31 of a copper heat conduction structure communicated with the spiral air pipe 19 is installed in each cooling box 25, a filling layer 30 is arranged in each cooling box 25, and semiconductor refrigerating sheets 32 are respectively embedded in two sides of each cooling box 25 in a penetrating manner;
one side fixedly connected with heat dissipation water storage box 13 of base 1, the bottom one end intercommunication of heat dissipation water storage box 13 has circulating water pump 12, circulating water pump 12's delivery port through intake hose 10 with the one end intercommunication of spiraling heat conduction water pipe 34, the other end of spiraling heat conduction water pipe 34 is connected with water outlet head 15 through going out water hose 16, water outlet head 15 sets up the top at heat dissipation water storage box 13.
The heat dissipation water storage tank 13 is a copper water tank, the top of the heat dissipation water storage tank 13 is an open port 27, the inner wall of the heat dissipation water storage tank 13 is fixedly connected with a baffle plate 28, the outer wall of the heat dissipation water storage tank 13 is fixedly connected with a heat dissipation fin 14, and one side of the bottom of the heat dissipation water storage tank 13 is communicated with a communication port 29 which is convenient to be connected with the circulating water pump 12. Last being provided with of print platform 2 is convenient for annular step opening 21 that annular barrel 33 passed, print platform 2's middle part lower surface fixed connection has the support post 35 of the vertical setting, support post 35's lower extreme fixed connection is on base 1.
The refrigeration surface of the semiconductor refrigeration piece 32 is arranged in the cooling box 25, the heat release surface of the semiconductor refrigeration piece 32 is arranged on the outer side of the cooling box 25, and the filling layer 30 is a mixture filling layer of copper powder and silicone oil. The lower surface of the first annular plate 17 is fixedly connected with a first sealing rubber gasket 18, and the upper surface of the second annular plate 22 is fixedly connected with a second sealing rubber gasket 23. An operation panel 26 is fixedly installed on one side of the printing platform 2, and operation buttons for controlling the expansion and contraction of the air cylinder 11 and controlling the on-off of the power supplies of the circulating water pump 12, the air pump 24 and the semiconductor refrigerating sheet 32 are respectively installed on the operation panel 26.
When the device is implemented, the air cylinder 11 drives the annular cylinder 33 to ascend and descend, so that the printed products of the LCD3D printer are cooled in a surrounding manner, the spiral air pipe 19 is used for driving air in the sealing cavity 7 of the printing area to flow, the spiral heat conducting water pipe 34 is matched to quickly transfer heat out, and the cooling effect is good; the printing cavity can be retracted when not in use, the internal space of the printing cavity is not influenced, and the operation is convenient; according to the invention, the printing platform 2 is provided with the annular step through hole 21, so that the annular cylinder 33 can be conveniently lifted and moved, sealing can be carried out, the internal sealing performance is kept, and inert gas cannot pass after being injected.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. A cooling apparatus for use with an LCD3D printer, comprising:
the printing platform (2) of the LCD3D printer body is characterized in that the bottom of the printing platform (2) is fixedly connected with a base (1), a vertically arranged air cylinder (11) is fixedly mounted on the base (1), the upper end of the air cylinder (11) is fixedly connected with an annular cylinder (33) through a connecting rod (9), a spiral air pipe (19) and a spiral heat conducting water pipe (34) are fixedly connected to the inner wall of the annular cylinder (33), the annular cylinder (33) penetrates through the printing platform (2), and the upper end and the lower end of the annular cylinder (33) are respectively and fixedly connected with a first annular plate (17) and a second annular plate (22);
the upper part of the connecting rod (9) is fixedly connected with an air pump (24), air holes (20) are formed in the surface of the spiral air pipe (19), the spiral air pipe (19) is provided with two groups, one end of each of the two groups of spiral air pipes (19) is communicated with an air inlet and an air outlet of the air pump (24), one end of each of the spiral air pipes (19) is connected with a cooling box (25), a spiral air pipe (31) of a copper heat conduction structure communicated with the spiral air pipe (19) is installed inside each cooling box (25), a filling layer (30) is arranged inside each cooling box (25), and refrigerating semiconductor sheets (32) are embedded in two sides of each cooling box (25) in a penetrating mode;
one side fixedly connected with heat dissipation water storage box (13) of base (1), the bottom one end intercommunication of heat dissipation water storage box (13) has circulating water pump (12), the delivery port of circulating water pump (12) through intake hose (10) with the one end intercommunication of heat conduction water pipe (34) spirals, the other end of heat conduction water pipe (34) spirals is connected with out faucet (15) through going out water hose (16), it sets up the top at heat dissipation water storage box (13) to go out faucet (15).
2. A cooling device as claimed in claim 1, which is used in an LCD3D printer, wherein: the upper portion fixedly connected with cover body (3) of print platform (2), form printing district seal chamber (7) on the upper portion of print platform (2) through the cover body (3), and one side of the cover body (3) is provided with sealing door, still fixed mounting has roast lamp (8) on the inner wall of the cover body (3).
3. A cooling device as claimed in claim 1, which is used in an LCD3D printer, wherein: the heat dissipation water storage tank (13) is arranged to be a copper water tank, the top of the heat dissipation water storage tank (13) is arranged to be an open opening (27), the inner wall of the heat dissipation water storage tank (13) is fixedly connected with a baffle plate (28), the outer wall of the heat dissipation water storage tank (13) is fixedly connected with a heat dissipation fin (14), and one side of the bottom of the heat dissipation water storage tank (13) is communicated with a communication opening (29) which is conveniently connected with a circulating water pump (12).
4. A cooling device as claimed in claim 2, which is used in an LCD3D printer, wherein: still including inert gas holder (4), the export of inert gas holder (4) through communicating pipe (6) with the cover body (3) intercommunication, and one of communicating pipe (6) is served and is still installed valve (5).
5. A cooling device as claimed in claim 1, which is used in an LCD3D printer, wherein: be provided with annular step opening (21) that annular barrel (33) of being convenient for passed on print platform (2), fixed surface is connected with support post (35) of the vertical setting under the middle part of print platform (2), the lower extreme fixed connection of support post (35) is on base (1).
6. A cooling device as claimed in claim 1, which is used in an LCD3D printer, wherein: the cooling surface of the semiconductor cooling piece (32) is arranged in the cooling box (25), the heat release surface of the semiconductor cooling piece (32) is arranged on the outer side of the cooling box (25), and the filling layer (30) is a mixture filling layer of copper powder and silicon oil.
7. A cooling device as claimed in claim 1, which is used in an LCD3D printer, wherein: the lower surface of the first annular plate (17) is fixedly connected with a first sealing rubber gasket (18), and the upper surface of the second annular plate (22) is fixedly connected with a second sealing rubber gasket (23).
8. A cooling device as claimed in claim 1, which is used in an LCD3D printer, wherein: one side fixed mounting of print platform (2) has operation panel (26), install the operating button that is used for controlling cylinder (11) flexible and is used for controlling circulating water pump (12), air pump (24) and semiconductor refrigeration piece (32) power break-make on operation panel (26) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911341279.9A CN110948877B (en) | 2019-12-24 | 2019-12-24 | Cooling device applied to LCD3D printer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911341279.9A CN110948877B (en) | 2019-12-24 | 2019-12-24 | Cooling device applied to LCD3D printer |
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| CN110948877A true CN110948877A (en) | 2020-04-03 |
| CN110948877B CN110948877B (en) | 2021-06-08 |
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| CN201911341279.9A Active CN110948877B (en) | 2019-12-24 | 2019-12-24 | Cooling device applied to LCD3D printer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111660561A (en) * | 2020-06-19 | 2020-09-15 | 陈金杰 | Novel 3D printing apparatus |
| CN112233545A (en) * | 2020-09-18 | 2021-01-15 | 深圳市盛景基因生物科技有限公司 | Cancer prevention propaganda device based on big data statistics system |
| CN112549542A (en) * | 2020-11-24 | 2021-03-26 | 合肥市阳德热能系统有限公司 | But stage cooling's facing production facility |
| CN114985777A (en) * | 2022-07-18 | 2022-09-02 | 西安赛隆金属材料有限责任公司 | Powder bed electron beam additive manufacturing device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111660561A (en) * | 2020-06-19 | 2020-09-15 | 陈金杰 | Novel 3D printing apparatus |
| CN112233545A (en) * | 2020-09-18 | 2021-01-15 | 深圳市盛景基因生物科技有限公司 | Cancer prevention propaganda device based on big data statistics system |
| CN112549542A (en) * | 2020-11-24 | 2021-03-26 | 合肥市阳德热能系统有限公司 | But stage cooling's facing production facility |
| CN112549542B (en) * | 2020-11-24 | 2022-06-10 | 合肥市阳德热能系统有限公司 | But stage cooling's facing production facility |
| CN114985777A (en) * | 2022-07-18 | 2022-09-02 | 西安赛隆金属材料有限责任公司 | Powder bed electron beam additive manufacturing device and method |
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| Publication number | Publication date |
|---|---|
| CN110948877B (en) | 2021-06-08 |
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