CN219903228U - Injection mold shaping cooling device - Google Patents
Injection mold shaping cooling device Download PDFInfo
- Publication number
- CN219903228U CN219903228U CN202320407983.5U CN202320407983U CN219903228U CN 219903228 U CN219903228 U CN 219903228U CN 202320407983 U CN202320407983 U CN 202320407983U CN 219903228 U CN219903228 U CN 219903228U
- Authority
- CN
- China
- Prior art keywords
- cooling
- liquid
- recovery
- cavity
- communicated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 154
- 238000002347 injection Methods 0.000 title claims abstract description 35
- 239000007924 injection Substances 0.000 title claims abstract description 35
- 238000007493 shaping process Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims abstract description 77
- 238000011084 recovery Methods 0.000 claims abstract description 37
- 238000001802 infusion Methods 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 239000002826 coolant Substances 0.000 claims description 28
- 238000005057 refrigeration Methods 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000110 cooling liquid Substances 0.000 abstract description 30
- 241001446646 Pseudobarbus Species 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 241000269799 Perca fluviatilis Species 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses an injection mold forming cooling device, which relates to the technical field related to injection molds and comprises a base, a cooling cabinet and a liquid storage tank, wherein a placing cavity is arranged in the cooling cabinet, a cooling mechanism for refrigerating the placing cavity is arranged on the base, the cooling mechanism comprises an infusion pump arranged at the top of the base and a cooling groove arranged outside the placing cavity, an infusion pipe and a liquid suction pipe are arranged at the end part of the infusion pump, one end of the liquid suction pipe is communicated with the liquid storage tank, a plurality of branch pipes are arranged at the tail end of the infusion pipe, a plurality of shunt pipes for conveying cooling liquid into the cooling groove are arranged on the branch pipes, a liquid leakage port is arranged at the bottom end of the cooling groove, and a recovery mechanism is communicated with the liquid leakage port; according to the utility model, the cooling mechanism arranged on the base is used for cooling the injection mold in the placing cavity, and the cooling liquid always keeps a lower temperature in the circulating working process through the heat dissipation red fins outside the transfer box and the refrigerating assembly in the liquid storage box.
Description
Technical Field
The utility model relates to the technical field related to injection molds, in particular to a molding cooling device of an injection mold.
Background
The injection mold is generally referred to as injection molding, and is a molding method of injection and molding, and is a molding method in which a plastic material which is completely melted by stirring with a screw is injected into a mold cavity by high pressure at a certain temperature, and is cooled and solidified.
The existing injection mold molding cooling device mostly adopts an air cooling or water cooling circulation mode to cool the injection mold, when the injection mold needs mass cooling, the cooling efficiency of the air cooling is obviously lower, the circulation water cooling is higher and lower due to the overhigh temperature and more batches of molds, the temperature of the cooling liquid can not be reduced in time in continuous operation, the cooling molding efficiency is lower and lower, and the normal operation of the cooling operation of the molds is influenced.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a molding cooling device of an injection mold.
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model relates to an injection mold forming cooling device which comprises a base, a cooling cabinet and a liquid storage tank, wherein a placing cavity is arranged in the cooling cabinet, a cooling mechanism for refrigerating the placing cavity is arranged on the base, the cooling mechanism comprises an infusion pump arranged at the top of the base and a cooling groove arranged outside the placing cavity, an infusion pipe and a liquid suction pipe are arranged at the end part of the infusion pump, one end of the liquid suction pipe is communicated with the liquid storage tank, a refrigerating assembly for refrigerating cooling liquid in multiple layers is arranged in the liquid storage tank, a plurality of branch pipes are arranged at the tail end of the infusion pipe, a plurality of shunt pipes for conveying cooling liquid into the cooling groove are arranged on the branch pipes, a liquid leakage port is arranged at the bottom end of the cooling groove, and a recycling mechanism is communicated with the liquid leakage port.
As a preferable technical scheme of the utility model, the recovery mechanism comprises a recovery branch pipe communicated with the liquid leakage port, the tail end of the recovery branch pipe is communicated with a recovery pipe, the recovery pipe is communicated with a transfer box, the tail end of the recovery pipe is communicated with a recovery pump, and the recovery pump is provided with a conveying pipe communicated with a liquid storage box.
As a preferable technical scheme of the utility model, a plurality of heat dissipation red fins for absorbing heat of the transfer box are arranged outside the transfer box.
As a preferable technical scheme of the utility model, the refrigeration assembly comprises a first cooling cavity, a second cooling cavity and a conveying cavity which are formed in the liquid storage tank, a semiconductor refrigeration sheet for refrigerating cooling liquid, a controller and a temperature sensor for controlling the refrigeration of the semiconductor refrigeration sheet are arranged in the first cooling cavity and the second cooling cavity, and a ball float valve is arranged in the second cooling cavity and the conveying cavity.
As a preferable technical scheme of the utility model, the outer wall of the placing cavity is provided with a plurality of cooling fins matched with the cooling mechanism.
As a preferable technical scheme of the utility model, the number of the liquid leakage ports at the bottom end of the cooling tank is multiple, and the liquid leakage ports are communicated with recovery branch pipes.
The beneficial effects of the utility model are as follows:
1. this kind of injection mold shaping cooling device, through the cooling mechanism of locating on the base, realize placing the cooling of intracavity injection mold, after cooling mechanism during operation, the transfer pump is sent into inside the cooling cabinet by the transfer line after drawing the coolant liquid from the liquid reserve tank, in the shunt tubes inflow cooling tank of seting up on the lateral conduit, make the coolant liquid absorb the heat of placing intracavity injection mold production, the coolant liquid of flowing flows by the weeping mouth of cooling tank bottom, and flow through the transfer case by retrieving the pipeline, the heat dissipation red fin that the transfer case outer wall was equipped with carries out the cooling treatment of first layer to the coolant liquid, the coolant liquid is equipped with in the first cooling chamber that is equipped with on the liquid reserve tank through retrieving the pump, the temperature sensor in the first cooling chamber discerns the temperature of coolant liquid, when the temperature of coolant liquid is higher, the semiconductor refrigeration piece begins work, realize the cooling treatment to the coolant liquid second floor, the coolant liquid in the second cooling chamber descends, the ball cock is opened, the coolant liquid after the second floor cooling treatment flows into the second cooling chamber, the coolant liquid in the second cooling chamber rises, the second cooling chamber is equipped with the ball cock, the second cooling chamber is equipped with the cooling assembly and carries out the cooling stability of cooling device in the cooling process of cooling device cooling down all the time, the improvement of cooling device of cooling device in the cooling device of cooling device.
2. This kind of injection mold shaping cooling device through placing the fin that the chamber outside was equipped with, supplementary coolant liquid to injection mold thermal absorption, makes the coolant liquid increase the temperature lower when flowing through the cooling tank, further guarantees the control of coolant liquid temperature in cooling circulation system, makes it can remain lower temperature throughout in continuous work, improves the fashioned efficiency of cooling.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of a molding cooling device for an injection mold according to the present utility model;
FIG. 2 is a side cross-sectional view of an injection mold molding cooling apparatus of the present utility model;
fig. 3 is a schematic side view of a cooling device for molding an injection mold according to the present utility model.
In the figure: 1. a base; 2. a cooling cabinet; 3. a liquid storage tank; 4. a placement cavity; 5. an infusion pump; 6. a cooling tank; 7. an infusion tube; 8. a pipette; 9. a branch pipe; 10. a shunt; 11. a liquid leakage port; 12. a recovery branch pipe; 13. a recovery pipe; 14. a transfer box; 15. a recovery pump; 16. a delivery tube; 17. heat dissipation red plate; 18. a first cooling chamber; 19. a second cooling chamber; 20. a delivery chamber; 21. a semiconductor refrigeration sheet; 22. a heat sink.
Detailed Description
The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.
Examples: as shown in fig. 1, fig. 2 and fig. 3, the injection mold molding cooling device of the utility model comprises a base 1, a cooling cabinet 2 and a liquid storage tank 3, wherein a placing cavity 4 is arranged in the cooling cabinet 2, a cooling mechanism for refrigerating the placing cavity 4 is arranged on the base 1, the cooling mechanism comprises an infusion pump 5 arranged at the top of the base 1 and a cooling tank 6 arranged outside the placing cavity 4, an infusion tube 7 and a liquid suction tube 8 are arranged at the end part of the infusion pump 5, one end of the liquid suction tube 8 is communicated with the liquid storage tank 3, a plurality of branch pipes 9 are arranged at the tail end of the infusion tube 7, a plurality of shunt tubes 10 for conveying cooling liquid into the cooling tank 6 are arranged on the branch pipes 9, a liquid leakage port 11 is arranged at the bottom end of the cooling tank 6, a recovery mechanism is communicated with the liquid leakage port 11, cooling of the injection mold in the placing cavity 4 is realized through the cooling mechanism arranged on the base 1, when the cooling mechanism works, after the infusion pump 5 sucks cooling liquid from the liquid storage tank 3, the infusion tube 7 is fed into the cooling cabinet 2, the cooling liquid flows into the cooling tank through the branch pipes 9, the cooling liquid flows into the cooling tank 6 through the branch pipes 10, and the cooling liquid leakage port 11 flows out of the cooling tank 6, and the cooling liquid flows out of the cooling tank 6 through the cooling tank 6.
Wherein the recovery mechanism comprises a recovery branch pipe 12 communicated with a liquid leakage port 11, the tail end of the recovery branch pipe 12 is communicated with a recovery pipe 13, the recovery pipe 13 is communicated with a transfer box 14, the tail end of the recovery pipe 13 is communicated with a recovery pump 15, the recovery pump 15 is provided with a conveying pipe 16 communicated with a liquid storage box 3, the outside of the transfer box 14 is provided with a plurality of heat dissipation red fins 17 absorbing heat to the transfer box 14, the refrigeration component comprises a first cooling cavity 18, a second cooling cavity 19 and a conveying cavity 20 which are arranged in the liquid storage box 3, a semiconductor refrigeration fin 21 for refrigerating cooling liquid, a controller and a temperature sensor for controlling the semiconductor refrigeration fin 21 to refrigerate are arranged in the first cooling cavity and the second cooling cavity, a ball valve is arranged in the second cooling cavity 19 and the conveying cavity 20, the heat dissipation red fins 17 absorbing heat to the transfer box 14 flow through the transfer box 14 through the recovery pipe 13, the heat dissipation red fin 17 that transfer case 14 outer wall was equipped with carries out the cooling treatment of first layer to the coolant liquid, the coolant liquid flows into the first cooling chamber 18 that is equipped with on the liquid reserve tank 3 through retrieving pump 15, the temperature sensor in the first cooling chamber 18 discerns the temperature of coolant liquid, when the temperature of coolant liquid is higher, semiconductor refrigeration piece 21 begins work, realize the cooling treatment to the coolant liquid second floor, coolant liquid in second cooling chamber 19 descends, the ball cock is opened, the coolant liquid after the cooling treatment of second floor flows into in second cooling chamber 19, the coolant liquid in the second cooling chamber 19 rises, the ball cock is closed, the refrigeration module that is equipped with in the second cooling chamber 19 carries out the cooling treatment of third layer to the coolant liquid, make the coolant liquid remain lower temperature throughout in the circulation course of working, improve injection mold's cooling shaping efficiency, improve cooling equipment's stability.
Wherein, place the outer wall in chamber 4 be equipped with a plurality of with cooling mechanism matched with fin 22, through placing the outside fin 22 that is equipped with in chamber 4, auxiliary cooling liquid is to injection mold heat's absorption, and the temperature that makes the coolant liquid increase when flowing through cooling tank 6 is lower, further guarantees the control of coolant liquid temperature in cooling circulation system, makes it can remain lower temperature throughout in continuous work, improves the efficiency of cooling shaping.
The number of the liquid leakage ports 11 at the bottom end of the cooling tank 6 is multiple, and the liquid leakage ports 11 are all communicated with recovery branch pipes 12 to realize unified management of cooling liquid recovery.
When the cooling mechanism works, the injection mold in the placing cavity 4 is cooled by the cooling mechanism arranged on the base 1, when the cooling mechanism works, the infusion pump 5 sucks cooling liquid from the liquid storage tank 3 and sends the cooling liquid into the cooling cabinet 2 through the infusion pipe 7, the cooling liquid flows into the cooling tank 6 through the shunt pipe 10 arranged on the branch pipe 9, so that the cooling liquid absorbs heat generated by the injection mold in the placing cavity 4, the flowing cooling liquid flows out from the liquid leakage port 11 at the bottom end of the cooling tank 6 and flows through the transfer tank 14 through the recovery pipe 13, the heat dissipation red fins 17 arranged on the outer wall of the transfer tank 14 perform first-layer cooling treatment on the cooling liquid, the cooling liquid flows into the first cooling cavity 18 arranged on the liquid storage tank 3 through the recovery pump 15, the temperature sensor in the first cooling cavity 18 recognizes the temperature of the cooling liquid, when the temperature of the cooling liquid is higher, the semiconductor refrigeration piece 21 starts to work, the cooling treatment of a second layer of the cooling liquid is realized, when the cooling liquid in the second cooling cavity 19 descends, the ball float valve is opened, the cooling liquid after the cooling treatment of the second layer flows into the second cooling cavity 19, the cooling liquid in the second cooling cavity 19 ascends, the ball float valve is closed, the refrigeration component arranged in the second cooling cavity 19 cools the cooling liquid of a third layer, the cooling liquid always keeps a lower temperature in the circulating working process, the cooling forming efficiency of the injection mold is improved, and the stability of cooling equipment is improved.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides an injection mold shaping cooling device, includes base (1), cooling cabinet (2) and liquid reserve tank (3), its characterized in that, the inside of cooling cabinet (2) is equipped with places chamber (4), be equipped with on base (1) to placing refrigerated cooling mechanism in chamber (4), cooling mechanism is including locating infusion pump (5) at base (1) top and locating place outside cooling tank (6) in chamber (4), the tip of infusion pump (5) is equipped with transfer line (7) and liquid suction pipe (8), the one end and the liquid reserve tank (3) of liquid suction pipe (8) are linked together, be equipped with the refrigeration subassembly to coolant liquid multilayer refrigeration in the liquid reserve tank, the end of transfer line (7) is equipped with a plurality of lateral pipes (9), be equipped with shunt tubes (10) to the interior transport coolant liquid of cooling tank (6) on lateral pipes (9), the bottom of cooling tank (6) is equipped with weeping mouth (11), the intercommunication has recovery mechanism on weeping mouth (11).
2. An injection mould forming and cooling device according to claim 1, characterized in that the recovery mechanism comprises a recovery branch pipe (12) communicated with the liquid leakage port (11), the tail end of the recovery branch pipe (12) is communicated with a recovery pipe (13), the recovery pipe (13) is communicated with a transfer box (14), the tail end of the recovery pipe (13) is communicated with a recovery pump (15), and the recovery pump (15) is provided with a conveying pipe (16) communicated with the liquid storage box (3).
3. An injection mold molding cooling device according to claim 2, wherein a plurality of heat dissipation fins (17) for absorbing heat to the transfer box (14) are provided outside the transfer box (14).
4. The injection mold forming and cooling device according to claim 1, wherein the refrigerating assembly comprises a first cooling cavity (18), a second cooling cavity (19) and a conveying cavity (20) which are formed in the liquid storage tank (3), semiconductor refrigerating sheets (21) and temperature sensors are arranged in the first cooling cavity (18) and the second cooling cavity (19), and ball float valves are arranged in the second cooling cavity (19) and the conveying cavity (20).
5. An injection mould cooling device according to claim 1, characterized in that the outer wall of the placement cavity (4) is provided with a plurality of cooling fins (22) cooperating with cooling means.
6. The injection mold forming and cooling device according to claim 1, wherein the number of the liquid leakage ports (11) at the bottom end of the cooling tank (6) is plural, and the liquid leakage ports (11) are all communicated with recovery branch pipes (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320407983.5U CN219903228U (en) | 2023-03-07 | 2023-03-07 | Injection mold shaping cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320407983.5U CN219903228U (en) | 2023-03-07 | 2023-03-07 | Injection mold shaping cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219903228U true CN219903228U (en) | 2023-10-27 |
Family
ID=88422619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320407983.5U Active CN219903228U (en) | 2023-03-07 | 2023-03-07 | Injection mold shaping cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219903228U (en) |
-
2023
- 2023-03-07 CN CN202320407983.5U patent/CN219903228U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022000910A1 (en) | Injection mold capable of quickly dissipating heat | |
| CN211389898U (en) | Injection mold for plastic products | |
| CN216153012U (en) | Cooling and shaping device of plastic pipe extruder | |
| CN219903228U (en) | Injection mold shaping cooling device | |
| CN217968029U (en) | Injection molding machine with cooling device | |
| CN218532749U (en) | Cooling device of die casting machine | |
| CN218314948U (en) | High-efficient cooling type injection mold | |
| CN214188328U (en) | Quick cooling and quick heating oil type mold temperature controller | |
| CN211363355U (en) | Cooling device of injection mold | |
| CN221212584U (en) | Refrigerator ice making box cover mould | |
| CN218717355U (en) | Circulating vacuum pump heat sink | |
| CN221336275U (en) | Multilayer split expansion die | |
| CN213564055U (en) | Quick refrigerated car steering wheel injection mold | |
| CN216968589U (en) | Heat radiation structure for injection mold | |
| CN220219569U (en) | Injection molding die with heat dissipation function | |
| CN221641689U (en) | Circulation cold flow heat sink that injection mold used | |
| CN215434895U (en) | PE pipe injection mold capable of achieving rapid demolding | |
| CN213873400U (en) | Automatic change water-cooling machine circulating water controlling means | |
| CN215431488U (en) | Copper pipe casting mould | |
| CN215825890U (en) | Circuit device for allowing cooling water to enter and exit from one side of injection mold | |
| CN212045855U (en) | Cooling device for glass glue bottle forming device | |
| CN213198483U (en) | Cooling mechanism for rubber product vulcanizing machine | |
| CN216400455U (en) | Injection mold capable of cooling circularly | |
| CN219381395U (en) | Router shell rapid prototyping mould | |
| CN208576158U (en) | Insulation rail distance keeper production injection molding machine cooling back installation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |