CN110945966A

CN110945966A - Device for producing a soldered connection on a glass pane and method therefor

Info

Publication number: CN110945966A
Application number: CN201980001552.5A
Authority: CN
Inventors: H.拉斯特加; K.维纳; B.鲁尔; M.拉德扎克
Original assignee: Saint Gobain Glass France SAS
Current assignee: Saint Gobain Glass France SAS; Compagnie de Saint Gobain SA
Priority date: 2018-07-20
Filing date: 2019-07-03
Publication date: 2020-03-31
Also published as: WO2020016010A1

Abstract

The invention relates to a device (1) for producing solder connections on a glass plate (GS), wherein the glass plate (GS) has a conductive layer (AG) on a surface at a point to be soldered, wherein a contact (K) to be applied to the point to be soldered has at least two partial regions (KB 1, KB 2) to be soldered, which are spaced apart from one another but are electrically connected to one another, wherein solder (L) is introduced between the conductive layer on the surface and the two contact regions (KB 1, KB 2) at the point to be soldered, wherein the device has a first contact electrode (KE 1) for contacting a first partial region (KB 1), wherein the device has a second contact electrode (KE 2) for contacting a second partial region (KB 2), wherein the first contact electrode (KE 1) and the second contact electrode (KE 2) are used for producing solder connections Soldering via an electrical connection of the first partial region (KB 1) to the second partial region (KB 2), -arranging contacts by applying a voltage for resistance welding such that the solder (L) is arranged below the two contact areas (KB 1, KB 2) for indirectly melting, wherein, applying a nozzle (D) in a space between the first contact electrode (KE 1) and the second contact electrode (KE 2), the nozzle is provided for the controlled discharge of a cooling medium in such a way that the surface of the contact (K) to be applied can be cooled directly, and the solder (L) between the partial regions (KB 1, KB 2) and the electrically conductive layer (AG) can be cooled indirectly, wherein the nozzle (D) has its discharge opening at a distance (D) from the end planes of the two contact regions (KB 1, KB 2). The invention also relates to a method for this purpose.

Description

Device for producing a soldered connection on a glass pane and method therefor

Technical Field

The invention relates to a device for producing a soldered connection on a glass pane and to a method therefor.

Background

It is known to arrange an electrically conductive layer on the glass or between two glasses in the case of a multiple glass. The layer is suitable for the function of a heater or an antenna or an electrode, for example for a display and/or a sensor.

These conductive layers must typically be connected to a controller and/or a power supply by means of cables.

For this purpose, the contacts should be applied at appropriate points.

It is shown here, however, that the production of the contact cannot be carried out meaningfully by means of conventional welding techniques based on lead/tin welding of plates.

One problem is the relatively high temperatures, which may damage the composite film, for example, in a composite glass sheet. Other problems arise from the materials used.

One solution that has proven to be feasible is soldering by means of indium-based solders, which have a relatively low melting point.

From chinese patent document CN 103990882B an apparatus is known for soldering the cables of a cable bundle to a unique joint by means of a unique soldering head. Furthermore, this document shows a safety device with a cooling device. However, this device has the disadvantage that it has a high energy consumption, since the welding head must be kept at a high temperature for a rapid welding process. Furthermore, the devices therein require safety elements adapted to the unique joint. The cooling device itself can only cool a partial region of a single solder. But a secure connection is not ensured thereby.

Another device is known from WO 2017/198703 a1 of the applicant. However, no active cooling of the welding site itself is provided in this device.

An electrical connector for automotive glass is known from US2009/0233119a 1. In order to avoid stresses due to differential heating, slow cooling is carried out there for a long time. However, this is not consistent with the desired cycle frequency. Furthermore, in the case of slow heat dissipation, further heat supply (even in smaller amounts) is required for a certain period of time. This results in further energy consumption.

However, it has been shown that with conventional welding methods, the cycle time for reliably producing an adhesive connection is relatively long and is, for example, 8 seconds. If the time is chosen shorter, slipping/separation may result. This has a negative effect on the production, since these glasses have to be rejected as defective.

Disclosure of Invention

Against this background, the object of the present invention is to provide a device for producing a soldered connection on a glass pane and a method therefor, by means of which the cycle time can be reduced.

This object is achieved by an apparatus for producing a soldered connection on a glass pane. The glass plate has a conductive layer on the surface at the points to be soldered, wherein the contacts to be applied to the points to be soldered have at least two partial areas to be soldered which are spaced apart but electrically connected to one another, wherein solder is introduced between the conductive layer on the surface and the two contact areas at the points to be soldered. The device has a first contact electrode for contacting a first partial region and a second contact electrode for contacting a second partial region, wherein, for soldering via an electrical connection of the first partial region to the second partial region by means of the first contact electrode and the second contact electrode, a contact is provided by applying a voltage for resistance soldering such that solder is provided for indirectly melting below the two contact regions, wherein a nozzle is applied in a space between the first contact electrode and the second contact electrode, which nozzle is provided for the controlled discharge of a cooling medium such that the surface of the contact to be applied can be directly cooled and the solder located between the partial regions and the electrically conductive layer can be indirectly cooled, wherein the nozzle has its discharge opening at a distance from the end planes of the two contact regions.

By means of which the cycle time can be reduced. Thereby increasing manufacturing speed and reducing costs.

In one embodiment of the invention, the cooling medium is gaseous.

The gaseous cooling medium can be controlled particularly easily and can generally be provided at low cost.

In one embodiment of the invention, the cooling medium is air.

Compressed air systems are present in many enterprises and are also used in part in current manufacturing equipment, for example, to position contacts by means of pneumatically operated units.

In a further form of the invention, a method for producing a solder connection on a glass pane by means of the aforementioned apparatus is provided. The method has the steps of obtaining a glass plate with a conductive layer, and obtaining an electrical contact for electrical connection with the conductive layer. The contact to be applied to the area to be soldered has at least two partial areas to be soldered, which are spaced apart but electrically connected to one another, wherein solder (L) is introduced between the electrically conductive layer on the surface and the two contact areas at the area to be soldered. In a further step, the electrical contact is arranged relative to the glass plate at the location to be soldered, and then at least the location to be soldered of the arranged contact is heated by applying a voltage between a first contact electrode for contacting the first partial region and a second contact electrode for contacting the second partial region, so that the melting point of the solder is reached at the location to be soldered below both contact regions at least on the surface. In a further step, the region to be soldered is then actively cooled, wherein a nozzle is arranged in the space between the first contact electrode and the second contact electrode, wherein the nozzle has its outlet opening at a distance from the end planes of the two contact regions, so that the surface of the contact to be applied can be directly cooled and the solder between the partial region and the conductive layer can be indirectly cooled.

In one embodiment of the invention, the active cooling is carried out by means of a gas flow.

In one embodiment of the invention, the melting point of the solder is less than 200 ℃.

The low melting point solder can be heated with a small amount of energy. Cycle time and energy input can thereby be reduced. Thereby increasing manufacturing speed and reducing costs.

In one embodiment of the invention, the active cooling step lasts 4 seconds or less.

That is, the cycle time can be greatly reduced compared to the prior art.

In one embodiment of the invention, the step of active cooling is carried out by means of an air flow.

In one embodiment of the invention, the solder comprises indium.

Indium is a relatively low melting point metal and thus can reduce energy consumption.

In one embodiment of the invention, the temperature at the welding point is measured by measuring the electrical resistance between two partial regions of the electrical contact.

Thereby, an active control of the welding process may be provided, whereby the cycle time may be further reduced and/or the welding quality may be improved.

The object is also achieved by a glass pane obtained by the method according to the invention or by the use of such a glass pane in a vehicle.

Drawings

Embodiments of the invention are described, by way of example, with reference to the accompanying drawings, in which:

figure 1 shows a schematic cross-section of an element of the invention,

FIG. 2 shows a schematic view of a contact for use in the present invention, an

Fig. 3 shows a schematic flow diagram according to an embodiment of the invention.

Detailed Description

The invention will be explained in more detail below with reference to the drawings. It should be noted here that the different aspects described can be used separately or in combination. That is, each aspect may be used with a different embodiment of the invention, unless explicitly stated as a pure alternative.

Furthermore, in the following, for the sake of simplicity, only one entity is usually involved at all times. However, the invention may also have multiple associated entities, respectively, unless explicitly stated otherwise. Thus, use of the terms a, an, etc. should be taken only to indicate that at least one entity is used in a single embodiment.

In the case of the methods described below, the individual steps of the method can be arranged in any order and/or combined, as long as no deviations are explicitly obtained by their interrelationship. Further, these methods may be combined with each other unless otherwise specified.

Information having numerical values is generally not to be understood as precise values, but also to include tolerances of +/-1% up to +/-10%.

Reference to a standard or specification should be understood as a reference to a standard or specification which is valid at the time of filing and/or at the time of filing with priority (if priority is required). However, this should not be understood as a general exclusion of applicability to subsequent or alternative standards or specifications.

The elements of the invention are schematically shown in fig. 1 in connection with a glass plate GS.

The glass plate GS has a conductive layer AG on the surface at the site to be welded.

Here, the surface may be a recess (rueckspfrung). The conductive layer AG may be of various materials, such as copper and/or silver.

The electrically conductive layer AG can be arranged on a support layer and/or on a black-out (schwarzdrive) DS or the like, so that any number of (functional) intermediate layers can be arranged between the electrically conductive layer AG and the underlying glass pane GS.

As shown in fig. 2, the contact K to be applied has at least two partial regions KB1, KB2 to be soldered. Fig. 2 thus shows the (double-legged) contact K in fig. 1.

The two partial regions KB1, KB2 to be welded are spaced apart from one another. Since the first partial region KB1 and the second partial region KB2 can be integrally formed of a suitable material, for example, they are also electrically connected to each other. That is, the resistance can be measured between the two partial regions KB1, KB 2. The resistance is typically temperature dependent.

At the points to be soldered, solder L is introduced (in sections) between the conductive layer AG on the surface and the two contact regions KB1, KB 2.

The solder may also extend over a larger area, for example occupying the entire area under the contact K. Preferably, the solder L also provides electrical connection of the respective partial areas.

Now, the device 1 for producing a solder connection on a glass plate GS has a first contact electrode KE1 for contacting the first partial region KB1 and a second contact electrode KE2 for contacting the second partial region KB 2.

For soldering by means of the first contact electrode KE1 and the second contact electrode KE2, a voltage for resistance soldering can be applied via the electrical connection of the first partial region KB1 to the second partial region KB2, so that the solder L under the two contact regions KB1, KB2 is arranged to melt indirectly by self-heating as a result of the current passing through the solder L and/or by external heating as a result of the current passing through the partial regions KB1, KB2 of the contact K. Since only a small area, i.e. in particular the two contact areas KB1, KB2 and the area surrounding them, is heated up, there is also less thermal reserve which then hinders the solder solidification (and thus serves to permanently establish the electrical and mechanical connection of the contact K to the conductive layer AG).

In the space between the first contact electrode KE1 and the second contact electrode KE2, a nozzle D is applied, which is provided for the valve-controlled discharge of a cooling medium, so that the surface of the contact K to be applied can be cooled directly and the solder L located between the partial regions KB1, KB2 and the conductive layer AG can be cooled indirectly. The discharge openings of the nozzles D are arranged at a distance D from the end planes of the two contact regions KB1, KB 2. That is, the cooling medium may flow through the surface of the contact K. Since the soldering point is located between the contact K and the conductive layer, no negative effects are expected, since no liquefied solder is carried away by the flow of the cooling medium. That is to say that the flow of the cooling medium cools the contact K and the immediately surrounding area in a targeted manner. That is, substantially only the heated portion is cooled.

In one embodiment of the invention, the cooling medium is gaseous.

In one embodiment of the invention, the cooling medium is air.

Compressed air systems are present in many enterprises and are also used in part in current manufacturing equipment, for example, to position contacts by means of pneumatically operated units. In other words, existing infrastructure can be used at low cost.

With the aid of which the method according to the invention can be operated. This method is explained in detail with reference to fig. 3.

The method comprises a step 100 in which a glass plate GS with a conductive layer is obtained. In a temporally subsequent/preceding/simultaneous step 200, an electrical contact K is obtained for electrical connection with the conductive layer AG. The contact K to be applied to the region to be soldered has at least two partial regions KB1, KB2 to be soldered which are spaced apart but electrically connected to one another, wherein solder L is introduced on the region to be soldered between the conductive layer on the surface and the two contact regions KB1, KB 2.

The electrical contacts K thus obtained and the glass sheet GS thus obtained (with its further layers) are arranged with respect to one another in step 300 in such a way that the partial regions KB1, KB2 of the contacts K are arranged on the site to be welded.

Subsequently, in step 400, the to-be-soldered point of the arranged electrical contact K is heated by applying a voltage between the first contact electrode KE1 for contacting the first partial region KB1 and the second contact electrode KE2 for contacting the second partial region KB2, so that the melting point of the solder L is reached at least on the surface below the two contact regions KB1, KB2 at the to-be-soldered point. For this purpose, as described above, the device 1 is brought into contact with the partial regions KB1, KB2 of the contact K and a voltage is applied to the contact (and possibly to the solder L).

Then, in a further step, the region to be soldered is actively cooled in step 500, wherein a nozzle D is applied in the space between the first contact electrode KE1 and the second contact electrode KE2, wherein the nozzle D has its discharge opening at a distance D from the end plane of the two contact regions KB1, KB2, so that the surface of the contact K to be applied can be directly cooled and the solder L located between the partial regions KB1, KB2 and the conductive layer AG can be indirectly cooled.

Steps

400, 500 may be performed in a time-controlled manner. Alternatively or additionally, the steps may be controlled or the flow criteria may be created by measurements instead.

That is, the cycle time can be greatly reduced compared to the prior art.

In one embodiment of the invention, the solder L comprises indium.

In one embodiment of the invention, the temperature at the welding point is measured by measuring the electrical resistance between two partial regions of the electrical contact K.

For example, the resistance between the two partial regions KB1, KB2 of the contact K can be measured in step 50 before/after/during the arrangement of the contact K on the glass sheet GS. Depending on the shape of the soldering point, the resistance of the solder L below the contact K is also determined here (in the case of a solder "continuous" connection). This makes it possible, for example, to determine the resistance at a known "ambient temperature".

Alternatively or additionally, the electrical resistance during heating or cooling can also be determined in

steps

450 and 550. In a

corresponding step

475 or 575, the temperature at the weld site can be determined by means of the currently measured resistance (taking into account in some cases the measured resistance at the known "ambient temperature"). It may then be compared whether the determined target temperature for melting/solidifying the solder L is reached. If this is the case, the method may proceed corresponding to the arrow "yes". If this is not the case, heating 400 or cooling 500 may continue.

The object is also solved by a glass sheet obtained by the method according to the invention or by the use of such a glass sheet in a vehicle, in particular in a land vehicle (e.g. a car, a bus, a van, a work machine, a train, a tram), a marine vehicle (e.g. a ship, a ferry, a submarine), an aircraft (e.g. an airplane, a helicopter, a space shuttle).

Description of reference numerals:

device for producing a soldered connection on a glass pane

GS glass plate

AG conductive layer

K contact

KB1, KB2 partial regions to be welded

L-shaped solder

KE1, KE2 contact electrodes

D nozzle

DS capping layer

Method step

100 obtaining a glass sheet

200 obtain an electrical contact

300 arrangement of electrical contacts

400 heating

500 indirectly actively cooling the part to be welded

50 determining the resistance of the electrical contacts before welding

450 determining the resistance of an electrical contact when heated

475 compare whether a target temperature for the weld has been reached

550 determining the resistance of the electrical contacts upon cooling

575 a comparison is made as to whether the target temperature for ending the cooling is reached.

Claims

1. Device (1) for producing a soldered connection on a glass plate (GS),

wherein the glass plate (GS) has, at the location to be soldered, a conductive layer (AG) on the surface, wherein the contact (K) to be applied to the location to be soldered has at least two partial regions (KB 1, KB 2) to be soldered which are spaced apart but electrically connected to one another, wherein, at the location to be soldered, solder (L) is introduced between the conductive layer on the surface and the two contact regions (KB 1, KB 2),

wherein the device has a first contact electrode (KE 1) for contacting a first partial region (KB 1),

wherein the device has a second contact electrode (KE 2) for contacting a second partial region (KB 2),

wherein, for soldering by means of the first contact electrode (KE 1) and the second contact electrode (KE 2) via an electrical connection of the first partial region (KB 1) with the second partial region (KB 2), contacts are provided by applying a voltage for resistance soldering, such that the solder (L) is provided below the two contact regions (KB 1, KB 2) for indirectly melting,

wherein a nozzle (D) is applied in the space between the first contact electrode (KE 1) and the second contact electrode (KE 2), which nozzle is provided for the valve-controlled discharge of a cooling medium, such that the surface of the contact (K) to be applied can be cooled directly and the solder (L) located between the partial regions (KB 1, KB 2) and the conductive layer (AG) can be cooled indirectly,

wherein the nozzle (D) has its discharge opening at a distance (D) from the end planes of the two contact regions (KB 1, KB 2).

2. The apparatus of claim 1, wherein the cooling medium is gaseous.

3. The apparatus according to claim 1 or 2, characterized in that the cooling medium is air.

4. Method for producing a soldered connection on a Glass Sheet (GS) by means of an apparatus (1) according to any of the preceding claims, with the following steps:

obtaining (100) a glass plate (GS) having an electrically conductive layer (AG),

obtaining (200) an electrical contact (K) for electrical connection with the conductive layer, wherein the contact (K) to be applied to the site to be soldered has at least two partial regions (KB 1, KB 2) to be soldered which are spaced apart but electrically connected to one another, wherein solder (L) is introduced between the conductive layer on the surface and the two contact regions (KB 1, KB 2) at the site to be soldered,

-arranging (300) the electrical contacts (K) with respect to the Glass Sheet (GS) on the portions to be welded,

in contrast, at least the region to be soldered of the electrical contact (K) arranged is heated (400) by applying a voltage between a first contact electrode (KE 1) for contacting the first partial region (KB 1) and a second contact electrode (KE 2) for contacting the second partial region (KB 2) in such a way that the melting point of the solder (L) is reached at least on the surface below the two contact regions (KB 1, KB 2) at the region to be soldered,

-actively cooling (500) the site to be soldered, wherein a nozzle (D) is applied in the space between the first contact electrode (KE 1) and the second contact electrode (KE 2), wherein the nozzle (D) has its discharge opening at a distance (D) from the end planes of the two contact regions (KB 1, KB 2) such that the surface of the contact (K) to be applied can be directly cooled and the solder (L) located between the partial region (KB 1, KB 2) and the conductive layer (AG) can be indirectly cooled.

5. Method according to claim 4, characterized in that the active cooling is performed by means of a gas flow.

6. A method according to claim 4 or 5, characterized in that the melting point of the solder (L) is less than 200 ℃.

7. The method according to any of the preceding claims 4 to 6, characterized in that the step of actively cooling (500) lasts 4 seconds or less.

8. The method according to any of the preceding claims 4 to 7, characterized in that the step of active cooling (500) is performed by means of an air flow.

9. Method according to any of the preceding claims 4 to 8, characterized in that the solder has indium.

10. Method according to any of the preceding claims 4-9, characterized in that the temperature over the weld site is measured by measuring the electrical resistance of an electrical conductor between two part-areas.

11. Glass sheet obtained by the method according to any one of the preceding claims 4 to 10.

12. Use of a glass sheet according to claim 11 in a vehicle.