CN110944497A - Heat radiator for electronic product - Google Patents
Heat radiator for electronic product Download PDFInfo
- Publication number
- CN110944497A CN110944497A CN201911322763.7A CN201911322763A CN110944497A CN 110944497 A CN110944497 A CN 110944497A CN 201911322763 A CN201911322763 A CN 201911322763A CN 110944497 A CN110944497 A CN 110944497A
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- China
- Prior art keywords
- heat dissipation
- dissipation shell
- heat
- heat conduction
- contact
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of electronic product production, and particularly discloses a heat dissipation device for an electronic product, which comprises an installation cover, a heat dissipation shell, a fan and an air inlet; the air outlet end of the fan is communicated with an air blowing cover covering the outer wall of the heat dissipation shell, a plurality of air vents are uniformly formed in the side wall of the heat dissipation shell corresponding to the air blowing cover, and a plurality of contact heat conduction strip moving holes are uniformly formed in the other side wall of the heat dissipation shell; fixed mounting blocks are fixedly welded on the upper edges of the side walls of the heat dissipation shell; the contact heat conducting strip is arranged in the contact heat conducting strip moving hole in a clearance fit mode, and the end part of the contact heat conducting strip in the radiating shell is fixedly connected with a clinging supporting spring; the contact heat conduction strip contacts on electronic component after the installation, utilizes it to conduct heat, increases heat radiating area, improves the radiating efficiency, and the contact heat conduction strip is at the effect under bracing of spring, can adapt to the concave-convex change on different component surfaces, and application scope is extensive.
Description
Technical Field
The invention relates to the field of electronic product production, in particular to a heat dissipation device for an electronic product.
Background
The electronic product is a related product based on electric energy, and mainly comprises: watches, smart phones, telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, radio cassettes, combination speakers, compact disc players (CD), computers, games, mobile communication products, and the like. The early products were named electronic products mainly based on electronic tubes.
Electronic product is in the use, because internal circuit resistance can produce the heat, makes the inside temperature of electronic product rise, and the inside high temperature of electronic product can influence electronic product's performance, is unfavorable for electronic product's permanent use, consequently, electronic product inside often is equipped with heat abstractor. The existing heat dissipation device only has the installation of a fan, blows away air with heat inside, and enables the heat to be discharged out of an electronic product along with the air. Therefore, a heat dissipation device is needed to solve the above problems.
Disclosure of Invention
The present invention is directed to a heat dissipation device for electronic products, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a heat dissipating double-fuselage for electronic product, including installing the cover, heat-dissipating body, fan and air intake; the mounting cover is fixedly connected with the heat dissipation shell; the fan is arranged in the mounting cover; the air outlet end of the fan is communicated with an air blowing cover covering the outer wall of the heat dissipation shell, air blown out from the fan is blown out through the air blowing cover, and the area of the air blowing cover is equal to that of the connecting surface of the mounting cover and the heat dissipation shell, so that the air is uniformly distributed on the heat dissipation shell; a plurality of vent holes are uniformly formed in the side wall of the heat dissipation shell corresponding to the blowing cover, the vent holes are communicated in the heat dissipation shell, and air in the blowing cover uniformly enters the heat dissipation shell through the vent holes so as to be distributed in the heat dissipation shell; a plurality of contact heat conduction strip moving holes are uniformly formed in the other side wall of the heat dissipation shell, and air in the heat dissipation shell is blown out of the contact heat conduction strip moving holes and blown onto the electronic element towards the heat dissipation shell; the fixed mounting blocks are fixedly welded on the upper edges of the side walls of the heat dissipation shell, the fixed mounting blocks increase the distance between the side walls of the heat dissipation shell and the electronic element, and air blown out of the contact heat conduction strip moving holes can conveniently take away heat and flow outwards; contact heat conduction strip is installed at downthehole clearance fit of contact heat conduction strip removal, contact heat conduction strip slides from the heat dissipation casing and wears out, fixedly connected with pastes tight supporting spring on the contact heat conduction strip tip that is located the heat dissipation casing, the other one end fixed connection who pastes tight supporting spring is on the inner wall of heat dissipation casing, support contact heat conduction strip through pasting tight supporting spring, make contact heat conduction strip most stretch out in the outside of heat dissipation casing, when heat dissipation casing fixed mounting is on electronic component, on electronic component's the surface through contact heat conduction strip top, through contact heat conduction strip heat conduction, make on heat transfer to contact heat conduction strip, the rethread ventilation blows away the heat, and the radiating effect is improved.
Further: the mounting cover and the heat dissipation shell are made of metal.
Further: the inner wall of the mounting cover is covered with a sound insulation layer, so that the noise generated when the fan operates is reduced, and the requirements of the use environment of electronic products are met.
Further: the outside cover of fan is equipped with the shock attenuation cover of fixing on the installation cover inner wall, and the material of shock attenuation cover is rubber, reduces the vibrations that the fan operation produced, avoids the shake when making heat abstractor use, makes its operation more firm, avoids droing.
Further: the diameter of the vent hole is 5-10 mm.
Further: the contact heat conduction strip moving hole is a circular hole.
Further: the thickness of the fixed mounting block is 1/4-1/3 of the thickness of the heat dissipation shell.
Further: the adjustable air conditioner is characterized in that the fixed mounting block is provided with an adjusting hole, an internal thread is arranged on the inner wall of the adjusting hole, a gap adjusting bolt is arranged in a penetrating mode through the internal thread threaded connection, the gap adjusting bolt is in threaded connection with the fixed mounting block, the tail end of the gap adjusting bolt is connected to an electronic element in a rotating mode through a bearing, the position of the fixed mounting block is changed through rotating the gap adjusting bolt, therefore, the gap distance between the radiating shell and the electronic element is adjusted, and the ventilation volume is changed.
Further: the number of the contact heat conduction strips is 1/2-2/3 of the number of the contact heat conduction strip moving holes, and air in the heat dissipation shell is blown out through the rest contact heat conduction strip moving holes to dissipate heat.
Further: contact heat conduction strip is installed to equal clearance fit in every contact heat conduction strip shifting hole, and contact heat conduction strip is the hollow tube structure, has seted up the perpendicular hole of blowing of a plurality of on the lateral wall of contact heat conduction strip, makes the air in the heat dissipation casing enter into contact heat conduction strip through the heat dissipation casing, and the air is blown out to the other one end of rethread, makes the air that blows out shift on the horizontal direction, avoids the appearance at heat dissipation dead angle.
Compared with the prior art, the invention has the beneficial effects that: the fixed mounting block with a certain thickness is arranged and can be adjusted through the gap adjusting bolt, so that the gap between the radiating shell and the electronic element is changed, and the air can flow conveniently; the contact heat conduction strip contacts on electronic component after the installation, utilizes it to conduct heat, increases heat radiating area, improves the radiating efficiency, and the contact heat conduction strip is at the effect under bracing of spring, can adapt to the concave-convex change on different component surfaces, and application scope is extensive.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device for an electronic product.
Fig. 2 is a schematic structural diagram of a heat dissipation housing of a heat dissipation device for an electronic product.
Fig. 3 is a schematic structural diagram of a contact heat conduction strip in a heat dissipation device for an electronic product.
In the figure: 1-mounting cover, 2-radiating shell, 3-fan, 4-air inlet, 5-sound insulation layer, 6-damping sleeve, 7-contact heat conducting strip, 8-close supporting spring, 9-fixed mounting block, 10-gap adjusting bolt, 11-internal thread, 12-air vent, 13-contact heat conducting strip moving hole, 14-adjusting hole, 15-vertical air blowing hole and 16-air blowing cover.
Detailed Description
Example 1
Referring to the drawings, in the embodiment of the invention, a heat dissipation device for an electronic product includes an installation cover 1, a heat dissipation housing 2, a fan 3 and an air inlet 4; the mounting cover 1 is fixedly connected with the heat dissipation shell 2, and the mounting cover 1 and the heat dissipation shell 2 are made of metal, preferably stainless steel; the fan 3 is arranged in the installation cover 1, the inner wall of the installation cover 1 is covered with the sound insulation layer 5, noise generated when the fan 3 operates is reduced, the use environment requirement of an electronic product is met, the outer side of the fan 3 is sleeved with the damping sleeve 6 fixed on the inner wall of the installation cover 1, the damping sleeve 6 is made of rubber, vibration generated when the fan 3 operates is reduced, the heat dissipation device is prevented from shaking when in use, the heat dissipation device is firmer in operation, and falling off is avoided; an air blowing cover 16 covering the outer wall of the heat dissipation shell 2 is communicated with the air outlet end of the fan 3, air blown out from the fan 3 is blown out through the air blowing cover 16, the area of the air blowing cover 16 is equal to the area of the connecting surface of the mounting cover 1 and the heat dissipation shell 2, and therefore the air is uniformly distributed on the heat dissipation shell 2.
A plurality of vent holes 12 are uniformly formed in the side wall of the heat dissipation shell 2 corresponding to the air blowing cover 16, the vent holes 12 are communicated in the heat dissipation shell 2, the diameter of the vent holes 12 is 5-10mm, and air in the air blowing cover 16 uniformly enters the heat dissipation shell 2 through the vent holes 12 so as to be distributed in the heat dissipation shell 2; a plurality of contact heat conduction strip moving holes 13 are uniformly formed in the other side wall of the heat dissipation shell 2, preferably, the contact heat conduction strip moving holes 13 are circular holes, and air in the heat dissipation shell 2 is blown out from the contact heat conduction strip moving holes 13 and blown onto the electronic element towards the heat dissipation shell 2; the upper edges of the side walls of the heat dissipation shell 2 are fixedly welded with the fixed mounting blocks 9, the thickness of the fixed mounting blocks 9 is 1/4-1/3 of the thickness (distance between the left side and the right side of the attached drawing 1) of the heat dissipation shell 2, the fixed mounting blocks 9 increase the distance between the side walls of the heat dissipation shell 2 and the electronic elements, and air blown out of the contact heat conduction strip moving holes 13 can bring heat to flow outwards; the adjusting hole 14 has been seted up on fixed mounting piece 9, be provided with internal thread 11 on the 14 inner walls of adjusting hole, wear to be equipped with clearance adjusting bolt 10 through internal thread 11 threaded connection, clearance adjusting bolt 10 and fixed mounting piece 9 threaded connection, rotate through the bearing on clearance adjusting bolt 10's the end and connect on electronic component, change the position of fixed mounting piece 9 through rotatory clearance adjusting bolt 10, thereby adjust the clearance distance between heat dissipation casing 2 and the electronic component, change the air volume.
The contact heat conduction strip 7 is arranged in the contact heat conduction strip moving hole 13 in a clearance fit way, the contact heat conduction strip 7 slides out of the heat dissipation shell 2, the number of the contact heat conduction strips 7 is 1/2-2/3 of the number of the contact heat conduction strip moving holes 13, the end part of the contact heat conduction strip 7 positioned in the heat dissipation shell 2 is fixedly connected with a clinging support spring 8, the other end of the clinging support spring 8 is fixedly connected on the inner wall of the heat dissipation shell 2, the contact heat conduction strip 7 is supported by clinging to the supporting spring 8, so that the contact heat conduction strip 7 extends out of the outer side of the heat dissipation shell 2 for the most part, when the heat dissipation case 2 is fixedly mounted on the electronic component, the heat conduction strip 7 is pressed against the surface of the electronic component, heat is conducted through the contact heat conduction strips 7, so that heat is transferred to the contact heat conduction strips 7, the heat is blown away through ventilation, and the heat dissipation effect is improved.
Example 2
A heat dissipating double-fuselage for electronic product, including installing the cover 1, heat-dissipating body 2, fan 3 and air intake 4; the mounting cover 1 is fixedly connected with the heat dissipation shell 2, and the mounting cover 1 and the heat dissipation shell 2 are made of metal, preferably stainless steel; the fan 3 is arranged in the installation cover 1, the inner wall of the installation cover 1 is covered with the sound insulation layer 5, noise generated when the fan 3 operates is reduced, the use environment requirement of an electronic product is met, the outer side of the fan 3 is sleeved with the damping sleeve 6 fixed on the inner wall of the installation cover 1, the damping sleeve 6 is made of rubber, vibration generated when the fan 3 operates is reduced, the heat dissipation device is prevented from shaking when in use, the heat dissipation device is firmer in operation, and falling off is avoided; an air blowing cover 16 covering the outer wall of the heat dissipation shell 2 is communicated with the air outlet end of the fan 3, air blown out from the fan 3 is blown out through the air blowing cover 16, the area of the air blowing cover 16 is equal to the area of the connecting surface of the mounting cover 1 and the heat dissipation shell 2, and therefore the air is uniformly distributed on the heat dissipation shell 2.
A plurality of vent holes 12 are uniformly formed in the side wall of the heat dissipation shell 2 corresponding to the air blowing cover 16, the vent holes 12 are communicated in the heat dissipation shell 2, the diameter of the vent holes 12 is 5-10mm, and air in the air blowing cover 16 uniformly enters the heat dissipation shell 2 through the vent holes 12 so as to be distributed in the heat dissipation shell 2; a plurality of contact heat conduction strip moving holes 13 are uniformly formed in the other side wall of the heat dissipation shell 2, preferably, the contact heat conduction strip moving holes 13 are circular holes, and air in the heat dissipation shell 2 is blown out from the contact heat conduction strip moving holes 13 and blown onto the electronic element towards the heat dissipation shell 2; the upper edges of the side walls of the heat dissipation shell 2 are fixedly welded with the fixed mounting blocks 9, the thickness of the fixed mounting blocks 9 is 1/4-1/3 of the thickness (distance between the left side and the right side of the attached drawing 1) of the heat dissipation shell 2, the fixed mounting blocks 9 increase the distance between the side walls of the heat dissipation shell 2 and the electronic elements, and air blown out of the contact heat conduction strip moving holes 13 can bring heat to flow outwards; the adjusting hole 14 has been seted up on fixed mounting piece 9, be provided with internal thread 11 on the 14 inner walls of adjusting hole, wear to be equipped with clearance adjusting bolt 10 through internal thread 11 threaded connection, clearance adjusting bolt 10 and fixed mounting piece 9 threaded connection, rotate through the bearing on clearance adjusting bolt 10's the end and connect on electronic component, change the position of fixed mounting piece 9 through rotatory clearance adjusting bolt 10, thereby adjust the clearance distance between heat dissipation casing 2 and the electronic component, change the air volume.
Contact heat conducting strips 7 are arranged in each contact heat conducting strip moving hole 13 in a clearance fit mode, the contact heat conducting strips 7 slide out of the heat dissipation shell 2, the end parts of the contact heat conducting strips 7 in the heat dissipation shell 2 are fixedly connected with the clinging supporting springs 8, the other ends of the clinging supporting springs 8 are fixedly connected to the inner wall of the heat dissipation shell 2, and the contact heat conducting strips 7 are supported by the clinging supporting springs 8, so that most parts of the contact heat conducting strips 7 extend out of the heat dissipation shell 2; the contact heat conduction strip 7 is of a hollow pipe structure, a plurality of vertical air blowing holes 15 are formed in the side wall of the contact heat conduction strip 7, so that air in the heat dissipation shell 2 enters the contact heat conduction strip 7 through the heat dissipation shell 2, the air is blown out through the other end of the heat dissipation shell, the blown air moves in the horizontal direction, and the heat dissipation dead angle is avoided.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A heat dissipation device for electronic products comprises an installation cover (1), a heat dissipation shell (2), a fan (3) and an air inlet (4); the mounting cover (1) is fixedly connected with the heat dissipation shell (2); the fan (3) is arranged in the mounting cover (1), an air blowing cover (16) covering the outer wall of the heat dissipation shell (2) is communicated with the air outlet end of the fan (3), and the area of the air blowing cover (16) is equal to the area of the connecting surface of the mounting cover (1) and the heat dissipation shell (2); the side wall of the heat dissipation shell (2) corresponding to the air blowing cover (16) is uniformly provided with a plurality of vent holes (12), and the vent holes (12) are communicated in the heat dissipation shell (2), and the heat dissipation device is characterized in that the other side wall of the heat dissipation shell (2) is uniformly provided with a plurality of contact heat conduction strip moving holes (13); the upper edges of the side walls of the heat dissipation shell (2) are fixedly welded with fixed mounting blocks (9); contact heat conduction strip (7) are installed in the contact heat conduction strip moving hole (13) in a clearance fit mode, a tightly supporting spring (8) is fixedly connected to the end portion of the contact heat conduction strip (7) located in the heat dissipation shell (2), and the other end, close to the supporting spring (8), of the fixedly connected to the inner wall of the heat dissipation shell (2) is fixedly connected to the inner wall of the heat dissipation shell.
2. The heat dissipating device of claim 1, wherein: the mounting cover (1) and the heat dissipation shell (2) are made of metal.
3. The heat dissipating device of claim 1, wherein: the inner wall of the mounting cover (1) is covered with a sound insulation layer (5).
4. The heat dissipating device of claim 1, wherein: the outer side of the fan (3) is sleeved with a damping sleeve (6) fixed on the inner wall of the mounting cover (1), and the damping sleeve (6) is made of rubber.
5. The heat dissipating device of claim 1, wherein: the diameter of the vent hole (12) is 5-10 mm.
6. The heat dissipating device of claim 1, wherein: the contact heat conduction strip moving hole (13) is a circular hole.
7. The heat dissipating device of claim 1, wherein: the thickness of the fixed mounting block (9) is 1/4-1/3 of the thickness of the heat dissipation shell (2).
8. The heat sink device of claim 7, wherein: the fixed mounting block (9) is provided with an adjusting hole (14), the inner wall of the adjusting hole (14) is provided with an internal thread (11), and a gap adjusting bolt (10) is arranged in a penetrating manner through the internal thread (11) in a threaded connection manner.
9. The heat dissipating device for electronic products according to any one of claims 1 to 8, wherein: the number of the contact heat conduction bars (7) is 1/2-2/3 of the number of the contact heat conduction bar moving holes (13), and air in the heat dissipation shell (2) is blown out through the rest of the contact heat conduction bar moving holes (13).
10. The heat dissipating device for electronic products according to any one of claims 1 to 8, wherein: contact heat conduction strip (7) are installed in each contact heat conduction strip moving hole (13) in a clearance fit mode, the contact heat conduction strips (7) are of hollow tube structures, and a plurality of vertical air blowing holes (15) are formed in the side wall of each contact heat conduction strip (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911322763.7A CN110944497B (en) | 2019-12-20 | 2019-12-20 | Heat radiator for electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911322763.7A CN110944497B (en) | 2019-12-20 | 2019-12-20 | Heat radiator for electronic product |
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| CN110944497A true CN110944497A (en) | 2020-03-31 |
| CN110944497B CN110944497B (en) | 2021-08-31 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112717181A (en) * | 2020-12-19 | 2021-04-30 | 张家港华菱医疗设备股份公司 | Sterilization cabinet |
| CN115027042A (en) * | 2022-06-29 | 2022-09-09 | 江西荷花科技有限公司 | Energy-saving HDPE water feed pipe rapid cooling equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6184850U (en) * | 1984-11-12 | 1986-06-04 | ||
| CN106376219B (en) * | 2016-09-26 | 2017-09-29 | 郑州航空工业管理学院 | Heat abstractor for big data all-in-one |
| CN206907486U (en) * | 2017-01-13 | 2018-01-19 | 天津蓝波科技有限公司 | A kind of hard disc of computer |
| CN207053983U (en) * | 2017-06-14 | 2018-02-27 | 北京华北兴业技术有限公司 | A kind of floating type conductive structure of industrial chip |
| CN207718818U (en) * | 2018-02-07 | 2018-08-10 | 贾英莉 | A kind of heat radiating type hard disc of computer |
| CN108389776A (en) * | 2018-03-27 | 2018-08-10 | 南京亚欣照明有限公司 | A kind of temperature-sensitive scald preventing type stage illumination halogen lamp |
| CN208675362U (en) * | 2018-08-10 | 2019-03-29 | 佛山市凌骏金属制品有限公司 | A kind of easy-to-dismount head shell |
-
2019
- 2019-12-20 CN CN201911322763.7A patent/CN110944497B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112717181A (en) * | 2020-12-19 | 2021-04-30 | 张家港华菱医疗设备股份公司 | Sterilization cabinet |
| CN115027042A (en) * | 2022-06-29 | 2022-09-09 | 江西荷花科技有限公司 | Energy-saving HDPE water feed pipe rapid cooling equipment |
| CN115027042B (en) * | 2022-06-29 | 2024-03-29 | 江西荷花科技有限公司 | Quick cooling arrangement of energy-saving HDPE feed pipe |
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Inventor after: Huang Changbin Inventor after: Fu Zhonghui Inventor after: Xu Shang Inventor before: Xu Shang |
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Effective date of registration: 20210804 Address after: 518000 No. 3, FA FA Road, Nanshan District science and Technology Park, Guangdong, Shenzhen Applicant after: Huang Changbin Applicant after: Fu Zhonghui Address before: 330000 room 311, block C, Longshi building, 23 Dongsi Road, Donghu District, Nanchang City, Jiangxi Province Applicant before: Jiangxi nuochi Technology Consulting Co.,Ltd. |
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Effective date of registration: 20221226 Address after: 050000 No. 567, Hongqi Street, Yuanshi County, Shijiazhuang City, Hebei Province (No. 3, Jiacheng Road, Tianshan international manufacturing Industrial Park) Patentee after: SHIJIAZHUANG DONGCHANG MACHINERY MANUFACTURING Co.,Ltd. Address before: 518000 No. 3, FA FA Road, Nanshan District science and Technology Park, Guangdong, Shenzhen Patentee before: Huang Changbin Patentee before: Fu Zhonghui |