CN110938404A - Heat-conducting structural adhesive and preparation method thereof - Google Patents
Heat-conducting structural adhesive and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/013—Additives applied to the surface of polymers or polymer particles
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a heat-conducting structural adhesive and a preparation method thereof, wherein the heat-conducting structural adhesive comprises the following raw material components in parts by mass: 10-50 parts of isocyanate-terminated polyurethane prepolymer, 1.2-6 parts of gamma-aminopropyltriethoxysilane (KH550), 50-90 parts of silane modified polyether (MS), 100-1500 parts of heat-conducting filler, 50-200 parts of flame-retardant filler, 1-10 parts of silane coupling agent, 0.2-1 part of catalyst, 0-15 parts of plasticizer, 0.2-0.5 part of antioxidant and 0.2-0.5 part of light stabilizer. The heat-conducting structural adhesive has the characteristics of good bonding strength and toughness, excellent heat-conducting and flame-retardant properties, capability of being cured at room temperature, excellent weather resistance and durability and the like, and can be applied to the fields of electronic industry, new energy automobile industry, aircraft manufacturing industry and the like.
Description
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to a heat-conducting structural adhesive and a preparation method thereof.
Background
The heat-conducting structure adhesive is a functional adhesive with bonding strength and heat-conducting property, and is used for bonding a heat-conducting part with a large volume or the bonded heat-conducting part with bearing force in a working environment. It is based on traditional structural adhesive and adds heat conductive powder filler to obtain heat conductive function.
The matrix of the heat-conducting structural adhesive is usually epoxy resin adhesive, polyurethane adhesive, acrylate adhesive and the like, and the heat-conducting filler is usually inorganic powder such as alumina, magnesia, zinc oxide, boron nitride, aluminum nitride and the like. In order to obtain the heat conductivity, usually, heat conductive powder with a volume fraction of more than 20% of the total amount of the adhesive needs to be filled in an adhesive matrix to form a heat conductive channel, and the addition of a large amount of heat conductive powder can greatly improve the viscosity of the adhesive, obviously increase the hardness of a cured product, greatly reduce the mechanical property, easily cause the problems of interface peeling and the like, so how to improve the dispersibility of the heat conductive powder and the compatibility of the heat conductive powder and matrix resin, thereby ensuring the good extrusion workability of the heat conductive structural adhesive, and having good mechanical property and bonding strength after curing, and being a technical key for preparing the heat conductive structural adhesive.
The invention selects a polyurethane structural adhesive system as a matrix adhesive of the heat-conducting structural adhesive. The polyurethane structural adhesive has excellent performances of high strength, good corrosion resistance, good insulation property, good processability, strong adhesive force, wide bonding surface and the like, and meanwhile, in order to overcome the increase of the hardness of a cured colloid caused by filling of heat-conducting powder and keep the toughness of the cured colloid, flexible silane modified polyether (MS glue) is added into matrix resin to be blended with the matrix resin.
For example, the invention patent with the publication number of CN106590501A discloses a single-component epoxy modified organic silicon sealant and a preparation method thereof, silane modified polyether resin (MS) and bisphenol A epoxy resin are mixed to prepare epoxy-MS glue, and organic silicon and epoxy resin respectively generate cross-linking reaction with water molecules and a cross-linking agent under the action of a catalyst to generate a three-dimensional space network structure. The epoxy-MS structural adhesive prepared by the method combines the advantages of epoxy resin and silane modified polyether resin, and the cured system has strong adhesion, excellent elasticity, mechanical property and weather resistance. However, because the compatibility of the two systems is poor and the curing mechanisms are different, the phenomenon that the mechanical properties of a cured material are affected because the phase separation is caused by asynchronous curing is easy to occur.
The invention patent with publication number CN102816549A discloses a silyl-terminated polyether modified polyurethane adhesive and a preparation method and application thereof, wherein silyl-terminated polyether is added into the polyurethane adhesive to prepare PU-MS adhesive, the main chain structures of the silyl-terminated polyether and polyurethane prepolymer comprise polyether chain segments, the compatibility is good, the wide addition range of the silyl-terminated polyether can be realized, the provided adhesive can have a large hardness variation range, and the advantages of the silyl-terminated polyether and polyurethane are achieved. Although the compatibility of PU-MS systems is better than that of epoxy-MS systems, curing is also problematic in that it involves two different chemical reaction processes.
Disclosure of Invention
Aiming at the technical problems, the invention provides a heat-conducting structural adhesive and a preparation method thereof.
In the invention, the SPU-MS structural adhesive is prepared by blending the siloxy terminated polyurethane (SPU) and the silane modified polyether (MS), and the system is subjected to heat conduction modification treatment, after the heat conduction powder is added, the hardness and toughness of the adhesive are balanced, and the adhesive has the characteristics of polyurethane and silane modified polyether, thereby effectively solving the problems of poor toughness and easy interface stripping of the heat conduction structural adhesive.
The heat-conducting structural adhesive provided by the invention comprises the following raw material components in parts by mass: 10-50 parts of isocyanate-terminated polyurethane prepolymer, 1.2-6 parts of gamma-aminopropyltriethoxysilane (KH550), 50-90 parts of silane modified polyether (MS), 100-1500 parts of heat-conducting filler, 50-200 parts of flame-retardant filler, 1-10 parts of silane coupling agent, 0.2-1 part of catalyst, 0-15 parts of plasticizer, 0.2-0.5 part of antioxidant and 0.2-0.5 part of light stabilizer.
According to the heat-conducting structural adhesive provided by the invention, under the action of an amine catalyst, an isocyanate-terminated polyurethane prepolymer and KH560 are used for preparing a silicon-alkoxy-terminated polyurethane (SPU) prepolymer according to the following reaction formula:
the isocyanate-terminated (-NCO) polyurethane prepolymer is a prepolymer which is prepared from polyether polyol, an isocyanate compound and a micromolecule chain extender and is terminated by-NCO, wherein the content of the-NCO is 1-5%, and the specific content can be adjusted according to the requirements of the required molecular weight, hardness and the like. In order to ensure the complete reaction of-NCO in the system, the KH550 needs to be slightly excessive and the dosage is 1.2-6 parts. The polyether glycol is polyoxypropylene glycol (PPG) or polytetrahydrofuran glycol (PTMG), the isocyanate compound is Toluene Diisocyanate (TDI) or diphenylmethane diisocyanate (MDI), and the small-molecular chain extender is ethylene glycol, 1, 4-butanediol, hexanediol or diethylene glycol.
According to the heat-conducting structural adhesive provided by the invention, the silane modified polyether (MS) is trimethoxy silane terminated polypropylene oxide ether or methyl dimethoxy silane terminated polypropylene oxide ether, and the structural formula is as follows:
(CH3O)3Si(CH2)3O(CHCH3CH2O)m(CH2)3Si(OCH3)3
or
(CH3O)2CH3Si(CH2)3O(CHCH3CH2O)n(CH2)3SiCH3(OCH3)2
Wherein m and n are integers more than 1, and the molecular weight of the silane modified polyether is 2000-10000.
The terminal groups of the SPU prepolymer and the MS are both siloxane groups, and the curing mechanisms are water vapor curing, namely: the terminal group-Si-OR is hydrolyzed and condensed under the action of water vapor to obtain a cross-linked network structure, and the terminal groups of the terminal group-Si-OR and the terminal group-OR can react with each other to form Si-O-Si cross-linking points besides the respective reaction, so that an SPU-MS mixed system has good compatibility and can realize molecular level blending. In addition, the adhesive strength, hardness, toughness and other properties of the adhesive matrix can be adjusted by adjusting the proportion of the SPU prepolymer to the MS.
According to the heat-conducting structural adhesive provided by the invention, the heat-conducting filler is one or a combination of more than two of aluminum oxide, magnesium oxide, zinc oxide, boron nitride, aluminum nitride and silicon carbide, and the particle size range D501 to 50 μm and 100 to 1500 parts. The flame-retardant filler is one or the combination of two of aluminum hydroxide and magnesium hydroxide, and the particle size range D501 to 30 μm and 50 to 200 parts by weight. Because the curing mechanism of the SPU-MS system is water vapor curing, the heat-conducting filler and the flame-retardant filler need to be dried before being added, so that the influence of water vapor on the system is eliminated.
According to the heat-conducting structural adhesive provided by the invention, the silane coupling agent is n-octyl trimethoxy silane or gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane (KH 560). On one hand, the silane coupling agent can be used as water vapor in a water removal agent consumption system; on the other hand, the silane coupling agent can be used as a surface treatment agent of the inorganic filler to improve the compatibility of the inorganic filler and a system.
According to the heat-conducting structural adhesive provided by the invention, the catalyst is an organic tin catalyst and/or a tertiary amine catalyst. Organic tin catalysts which may be selected include dibutyltin dilaurate, stannous octoate, dibutyltin diacetate, dibutyltin dioctoate or ethyl acetoacetate organotin chelate, while tertiary amine catalysts include triethylenediamine, N-alkylmorpholine or bis (2-methyloxyethyl) ether.
According to the heat-conducting structural adhesive provided by the invention, the plasticizer is diisodecyl phthalate, diisononyl phthalate or polyoxypropylene glycol (the molecular weight is 1000-4000).
According to the heat-conducting structural adhesive provided by the invention, the antioxidant is antioxidant 1010, antioxidant 264 or a combination of the two.
According to the heat-conducting structural adhesive provided by the invention, the light stabilizer is a salicylate compound, a benzophenone compound, a benzotriazole compound or a triazine compound.
The heat-conducting structural adhesive provided by the invention is prepared by the following steps:
(1) adding the isocyanate-based polyurethane prepolymer into a three-port reactor provided with a stirrer and a thermometer, stirring under nitrogen atmosphere, adding gamma-aminopropyltriethoxysilane (KH550), and reacting for 1-3 h under stirring to obtain the siloxane-based end-capped polyurethane prepolymer (SPU).
(2) And then, sequentially adding silane modified polyether (MS), a silane coupling agent, a plasticizer, a light stabilizer and an antioxidant, vacuumizing, heating to 60-80 ℃, and stirring for 2-4 hours.
(3) And cooling to room temperature, adding a heat-conducting filler and a flame-retardant filler (the heat-conducting filler and the flame-retardant filler are placed in a drying box at 110 ℃ for heat preservation for at least 3 hours before adding) under the protection of nitrogen, continuously stirring for 1-2 hours, adding a catalyst, and continuously stirring for 0.5-1 hour under vacuum to obtain the heat-conducting structural adhesive.
Compared with the prior art, the heat-conducting structural adhesive provided by the invention has the beneficial effects that: (1) the SPU-MS-based adhesive system selected has the advantages of polyurethane and silane modified polyether, and has the characteristics of good bonding strength and toughness, room-temperature curing, excellent weather resistance and durability and the like; (2) the SPU-MS system is used as the base adhesive to prepare the heat-conducting structural adhesive, the balance between the hardness and the toughness of the heat-conducting structural adhesive can be achieved by adjusting the proportion of the SPU and the MS in the base adhesive system, and the problems that the conventional heat-conducting structural adhesive is poor in toughness and easy to generate interface peeling are effectively solved.
Detailed Description
The following further describes embodiments of the present invention with reference to examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example 1
The heat-conducting structural adhesive comprises the following components in parts by mass:
the preparation process of the heat-conducting structural adhesive comprises the following steps:
according to the formula, adding an isocyanate-based polyurethane prepolymer (-NCO content of 2.08%, and the raw materials are PPG, TDI and BDO with the molecular weight of 4000) into a three-neck flask provided with a stirrer and a thermometer, starting stirring under a nitrogen atmosphere, adding KH550, and reacting for 2 hours under stirring to obtain a siloxane-based polyurethane prepolymer (SPU); then, sequentially adding a silane coupling agent, a plasticizer, a light stabilizer and an antioxidant, vacuumizing and heating to 80 ℃, and stirring for 2 hours; cooling to room temperature, adding a heat-conducting filler and a flame-retardant filler (which are required to be placed in a drying box at the temperature of 110 ℃ for heat preservation for 3 hours before adding) under the protection of nitrogen, continuously stirring for 1 hour, then adding a catalyst, and continuously stirring for 1 hour under vacuum to obtain the heat-conducting structural adhesive. Samples were prepared and tested for relevant performance, and the test data are shown in table 1.
Example 2
A thermally conductive structural adhesive was prepared according to the following formulation, following the method of example 1, and the data of the test is shown in table 1.
Example 3
Using SPU from example 1, a thermally conductive adhesive was prepared according to the following formulation, as in example 1, and the data of the test is shown in table 1.
Example 4
Using SPU from example 1, a thermally conductive adhesive was prepared according to the following formulation, as in example 1, and the data of the test is shown in table 1.
Example 5
Using SPU from example 1, a thermally conductive adhesive was prepared according to the following formulation, as in example 1, and the data of the test is shown in table 1.
Comparative example 1
The heat-conducting filler and the flame-retardant filler in the formula of the embodiment 1 are removed, and other formulas and processes are unchanged.
And preparing a sample strip from the obtained structural adhesive according to related test standards, and performing related tests, wherein the performance test method of all the experiments is as follows:
coefficient of thermal conductivity: with reference to ASTM D5470, the thermal conductivity of the samples was tested using a steady-state thermal flow method thermal conductivity tester (Hunan Tan instruments Ltd., DRL-type III).
Flame retardant rating: the specimens were 125mm by 13mm by 1.6mm, as tested by the method provided in the U.S. Standard UL94 fire Standard using a UL94 conventional horizontal vertical burner.
Hardness: reference is made to GB/T531.1-2008 "vulcanized rubber or thermoplastic rubber indentation hardness test method part I: shore durometer method (shore hardness), a shore durometer (shanghai kurton electronics and image machinery factory, CYX-a type) was used to test the hardness of cured structural adhesives.
Tensile strength and elongation at break: with reference to GB/T1040.1-2006 method for testing tensile properties of plastics, tensile strength and elongation at break were tested using a tensile tester (Zwick, model Zwick Z010, Germany).
Bonding strength: with reference to GB/T7124-. The distance between the clamps of the drawing machine is 120mm during drawing, the drawing speed is 5mm/min, and the testing temperature is 25 ℃.
The test results are summarized in table 1.
Table 1: comprehensive performance data of cured product
As can be seen from table 1, (1) the heat-conducting structural adhesive examples 1 to 3 filled with the heat-conducting powder have a greatly increased heat-conducting coefficient and a flame retardance of V-0 with an increase in the addition amount of the heat-conducting powder, and meanwhile, the hardness of a cured product is significantly increased, the bonding strength is reduced, the bonding force between the adhesive and a base material is reduced, and the bonding failure mode is reduced from 90% to 85%, 80% and 74% of the interface failure of the base adhesive; (2) it can be seen from the test data of example 2, example 4, and example 5 that increasing the amount of MS added to the base adhesive significantly decreases the hardness of the cured product, and increases the adhesive strength and elongation at break, indicating that the heat-conductive structural adhesive of the present invention can adjust the hardness of the cured product by adjusting the contents of SPU prepolymer and MS in the base adhesive, and improve the adhesive strength and toughness of the heat-conductive structural adhesive, thereby achieving the balance between the hardness and toughness of the heat-conductive structural adhesive.
Claims (12)
1. The heat-conducting structural adhesive is characterized by comprising the following raw material components in parts by mass: 10-50 parts of isocyanate-terminated polyurethane prepolymer, 1.2-6 parts of gamma-aminopropyltriethoxysilane (KH550), 50-90 parts of silane modified polyether (MS), 100-1500 parts of heat-conducting filler, 50-200 parts of flame-retardant filler, 1-10 parts of silane coupling agent, 0.2-1 part of catalyst, 0-15 parts of plasticizer, 0.2-0.5 part of antioxidant and 0.2-0.5 part of light stabilizer.
2. The heat-conducting structural adhesive as claimed in claim 1, wherein the isocyanate group (-NCO) terminated polyurethane prepolymer is an-NCO terminated prepolymer prepared from polyether polyol, an isocyanate compound and a small molecular chain extender, the-NCO content is 1-5%, wherein the polyether polyol is polyoxypropylene glycol (PPG) or polytetrahydrofuran glycol (PTMG) with a molecular weight of 1000-4000, the isocyanate compound is Toluene Diisocyanate (TDI) or diphenylmethane diisocyanate (MDI), and the small molecular chain extender is ethylene glycol, 1, 4-butanediol, hexanediol or diethylene glycol.
3. The structural heat-conducting adhesive according to claim 1, wherein the gamma-aminopropyltriethoxysilane (KH550) is used in an amount of 1.2-6 parts.
4. The structural heat-conducting adhesive according to claim 1, wherein the silane-modified polyether (MS) is a trimethoxy silane-terminated polyoxypropylene ether or a methyl dimethoxy silane-terminated polyoxypropylene ether, and the structural formula thereof is as follows:
(CH3O)3Si(CH2)3O(CHCH3CH2O)m(CH2)3Si(OCH3)3
or
(CH3O)2CH3Si(CH2)3O(CHCH3CH2O)n(CH2)3SiCH3(OCH3)2
Wherein m and n are integers more than 1, and the molecular weight of the silane modified polyether is 2000-10000.
5. The structural adhesive according to claim 1, wherein the thermal conductive filler is one or a combination of two or more of aluminum oxide, magnesium oxide, zinc oxide, boron nitride, aluminum nitride and silicon carbide, and has a particle size range D501 to 50 μm.
6. The method of claim 1The heat-conducting structural adhesive is characterized in that the flame-retardant filler is one or the combination of two of aluminum hydroxide and magnesium hydroxide, and the particle size range D501 to 30 μm.
7. The structural heat-conducting adhesive as claimed in claim 1, wherein the silane coupling agent is
N-octyltrimethoxysilane or gamma- (2, 3-glycidoxy) propyltrimethoxysilane (KH 560).
8. The structural heat-conducting adhesive according to claim 1, wherein the catalyst is an organotin catalyst and/or a tertiary amine catalyst.
9. The heat-conducting structural adhesive as claimed in claim 1, wherein the plasticizer is diisodecyl phthalate, diisononyl phthalate or polyoxypropylene glycol (molecular weight 1000-4000).
10. The structural heat-conducting adhesive according to claim 1, wherein the antioxidant is 1010 or 264 or a combination thereof.
11. The structural heat-conducting adhesive according to claim 1, wherein the light stabilizer is a salicylate, a benzophenone, a benzotriazole or a triazine.
12. The heat-conducting structural adhesive as claimed in claim 1, which is prepared by the following steps:
(1) adding the end-terminated isocyanate-based polyurethane prepolymer into a three-port reactor provided with a stirrer and a thermometer, starting stirring under nitrogen atmosphere, adding gamma-aminopropyltriethoxysilane (KH550), and reacting for 1-3 h under stirring to obtain the end-terminated siloxane-based polyurethane prepolymer (SPU).
(2) And then, sequentially adding silane modified polyether (MS), a silane coupling agent, a plasticizer, a light stabilizer and an antioxidant, vacuumizing, heating to 60-80 ℃, and stirring for 2-4 hours.
(3) And cooling to room temperature, adding a heat-conducting filler and a flame-retardant filler (the heat-conducting filler and the flame-retardant filler are placed in a drying box at 110 ℃ for heat preservation for at least 3 hours before adding) under the protection of nitrogen, continuously stirring for 1-2 hours, adding a catalyst, and continuously stirring for 0.5-1 hour under vacuum to obtain the heat-conducting structural adhesive.
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|---|---|---|---|---|
| CN112265330A (en) * | 2020-11-05 | 2021-01-26 | 杭州盛得新材料有限公司 | Fabric laminate with recycled modified PVB and preparation method thereof |
| CN113528056A (en) * | 2021-06-29 | 2021-10-22 | 深圳市金菱通达电子有限公司 | Heat-conducting structural adhesive for new energy power battery and manufacturing method thereof |
| CN114891432A (en) * | 2022-04-28 | 2022-08-12 | 深圳市科美新创科技有限公司 | Environment-friendly heat dissipation coating for LED display screen and preparation method thereof |
| CN115093826A (en) * | 2022-03-26 | 2022-09-23 | 深圳市希顺有机硅科技有限公司 | High-thermal-conductivity low-specific-gravity adhesive and preparation method thereof |
| CN115678481A (en) * | 2022-10-25 | 2023-02-03 | 湖南浩森胶业有限公司 | Preparation method of heat-conducting structural adhesive |
| WO2023216153A1 (en) * | 2022-05-11 | 2023-11-16 | Rohm and Haas Electronic Materials (Shanghai) Ltd. | Two-component polyurethane adhesive composition |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102449033A (en) * | 2009-05-25 | 2012-05-09 | 赢创高施米特有限公司 | Curable compositions containing silyl groups, and use thereof |
| US20140158398A1 (en) * | 2012-12-10 | 2014-06-12 | Hitachi Metals, Ltd. | Adhesive resin composition, adhesive film using the same and flat cable |
| CN106634769A (en) * | 2016-12-19 | 2017-05-10 | 广州市白云化工实业有限公司 | High-intensity transparent bonding agent and preparation method thereof |
| CN107841277A (en) * | 2017-12-11 | 2018-03-27 | 山东北方现代化学工业有限公司 | A kind of fast solidification, the preparation method of high intensity single-component silane modified polyurethane sealant |
| CN108659767A (en) * | 2018-05-22 | 2018-10-16 | 江苏卓奇新材料科技有限公司 | A kind of silane-modified fluid sealant of coating character |
-
2019
- 2019-12-18 CN CN201911307211.9A patent/CN110938404A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102449033A (en) * | 2009-05-25 | 2012-05-09 | 赢创高施米特有限公司 | Curable compositions containing silyl groups, and use thereof |
| US20140158398A1 (en) * | 2012-12-10 | 2014-06-12 | Hitachi Metals, Ltd. | Adhesive resin composition, adhesive film using the same and flat cable |
| CN106634769A (en) * | 2016-12-19 | 2017-05-10 | 广州市白云化工实业有限公司 | High-intensity transparent bonding agent and preparation method thereof |
| CN107841277A (en) * | 2017-12-11 | 2018-03-27 | 山东北方现代化学工业有限公司 | A kind of fast solidification, the preparation method of high intensity single-component silane modified polyurethane sealant |
| CN108659767A (en) * | 2018-05-22 | 2018-10-16 | 江苏卓奇新材料科技有限公司 | A kind of silane-modified fluid sealant of coating character |
Non-Patent Citations (2)
| Title |
|---|
| 曹云来: "《密封胶：技术 配方 应用》", 30 September 2001, 化学工业出版社 * |
| 李红强: "《胶粘原理、技术及应用》", 31 January 2014, 华南理工大学出版社 * |
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