CN110936623B - Metal adhesive tape thermal compounding process and thermal compounding machine - Google Patents
Metal adhesive tape thermal compounding process and thermal compounding machine Download PDFInfo
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- CN110936623B CN110936623B CN201911292321.2A CN201911292321A CN110936623B CN 110936623 B CN110936623 B CN 110936623B CN 201911292321 A CN201911292321 A CN 201911292321A CN 110936623 B CN110936623 B CN 110936623B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/44—Joining a heated non plastics element to a plastics element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2029/00—Belts or bands
Abstract
The invention relates to a metal adhesive tape thermal compounding process, which comprises an intermediate base body, wherein the intermediate base body is made of a metal material, adhesive tapes are respectively thermally compounded on the upper surface and the lower surface of the intermediate base body through a thermal compounding process, in the compounding process, when the metal adhesive tape is placed in a heating mold, a gap is reserved between the adhesive tape on the metal adhesive tape and the heating mold on at least one side, so that the heating mold is firstly contacted with the intermediate base body on the metal adhesive tape to heat the intermediate base body in the hot melting compounding process of the metal adhesive tape, and then the intermediate base body conducts heat from inside to outside to the adhesive tape on the metal adhesive tape, so that the adhesive tape is thermally fused on the intermediate base body to form the thermal compounding of the metal adhesive tape. The metal adhesive tape thermal compounding process has the advantages of ingenious conception and simple structure, and can not generate the problems of over-pressure, over-dissolution and excessive glue overflow and corner overflow.
Description
Technical Field
The invention relates to the technical field of metal adhesive tape thermal compounding, in particular to a metal adhesive tape thermal compounding process and a thermal compounding machine.
Background
In order to ensure the connection stability of the lithium battery and the flexible package, the conventional flexible package lithium battery generally adopts a metal adhesive tape external thermal composite adhesive tape of the lithium battery, so that the lithium battery is hot-melted together when being connected with the flexible package.
Traditional lithium cell metal adhesive tape heat recombination area adopts traditional heat compounding machine to be in the same place upper and lower sticky tape and middle base member heat recombination, and traditional heat compounding machine includes that upper heating mould and lower heating mould, and the surface of upper heating mould and lower heating mould is the setting of flushing for heat recombination heats metal adhesive tape heat recombination.
In the thermal compounding process of the adhesive tape, the required composite materials are divided into an upper layer adhesive, a middle matrix and a lower layer adhesive, and the compounding process is carried out by adopting a thermal compounding machine. The quality of the thermal compounding of the adhesive tape is related to the temperature T, the pressure F of the die during compounding and the acting time S of the compounding force, and the three directly influence the quality of the compounding of the adhesive tape.
In the conventional thermal compounding process, as shown in fig. 8, three process parameters of temperature T, die pressure F during compounding and compounding force acting time S are parameters concerned in the control of the compounding process, technical indexes of products cannot be well controlled for a long time, stripping resistance tension N and melt adhesive thickness are controlled, the existing process adopts three-layer material compounding, an upper die is made of a horizontal metal material and provided with a heating tube and a temperature control thermocouple, a lower heat-conducting silica gel heat-conducting block is arranged on the lower die, the thickness difference between the compounding strips is eliminated when a plurality of metal strips are compounded by using high elasticity of silica gel, and the compounded acting force F can be uniformly acted on each compounding material. The quality characteristics of the adhesive tape are as follows: the glue overflow angle, the insufficient stripping tension N after 2 or more layers of adhesive tapes are compounded, and the sealing corrosion resistance and the insulation resistance after the adhesive tapes and the matrix are melted are poor, so that the indexes directly influence the quality of downstream customer products, and if the indexes do not reach the standard or have poor consistency, customer complaints and even claims are caused.
Disclosure of Invention
In order to solve the problem of optimal matching of temperature T, pressure F and acting time S of the composite force, the inventor still has discrete distribution of product detection performance under the condition of multiple groups of DOE experimental data, and still cannot obtain optimal product production composite process parameters.
Through a plurality of researches of the inventor, the reason that the index of the produced product does not reach the standard or the consistency of the product quality is poor is found to be as follows: the upper heating die and the lower heating die are contacted under the action of air cylinder pressure F, the temperature T is transmitted to the composite adhesive tape by the heating die, the composite adhesive tape is transmitted to the metal matrix, the composite adhesive of which the outer layer is firstly connected with the trigger heating die is over-melted, the edge of the composite layer is overflowed under the action of the pressure F, and the over-melted adhesive tape is easy to bring bubbles when being cooled, so that the anti-stripping tension N is reduced, and the corrosion resistance is poor.
After a plurality of tests and researches, the inventor finds that the contact surfaces of the upper heating die and the lower heating die and the composite adhesive tape are on the same plane, when the upper heating die and the lower heating die are contacted due to the action of air cylinder pressure F, the upper adhesive tape and the lower adhesive tape are contacted with the heating die firstly, and a heat conduction path is transmitted from outside to inside, so that the surface of the outer adhesive tape which is contacted with the heating die firstly is over-melted, and the product is expressed as follows at the rear section of a client: the composite stripping resistance tension N does not reach the standard, the corrosion resistance and the insulation resistance are poor, and the edge of the composite stripping resistance tension N overflows glue and overflows corners, so that downstream customer products are scrapped, and customer complaints are caused.
Therefore, the inventor introduces the parameter of the composite gap of the mold, under the condition of introducing the parameter of the composite gap of the mold, the DOE experimental data are basically in standard normal distribution, and another key parameter of the thermal composite process is found out: the die compounding gap provides a metal adhesive tape thermal compounding process and a thermal compounding machine.
In order to achieve the above purpose, the following technical solutions are provided.
The utility model provides a metal adhesive tape thermal recombination technology, metal adhesive tape includes middle base member, middle base member adopts the metal material to make, the upper and lower two sides of middle base member are through the thermal recombination technology respectively thermal recombination have the sticky tape, compound technology when metal adhesive tape is arranged in the heating mould, leave the clearance between the sticky tape on the metal adhesive tape and the heating mould of at least one side, ensure that metal adhesive tape in the hot melt recombination process, the heating mould contacts with the middle base member on the metal adhesive tape earlier and makes middle base member be heated, carries out heat-conduction by the sticky tape that middle base member from inside to outside on metal adhesive tape again to realize that sticky tape hot fusion forms the thermal recombination of metal adhesive tape on middle base member.
Furthermore, a groove is formed in one side, located on the metal adhesive tape, of the at least one heating mold, the width of the groove is larger than that of the adhesive tape, when the heating mold is in contact with the middle base body on the metal adhesive tape, the adhesive tape is located in the groove, and gaps are reserved between the outer end and two side faces of the adhesive tape and the inner wall of the groove.
Further, be equipped with heat conduction silica gel in the recess, heat conduction silica gel's thickness is less than the degree of depth of recess, heat conduction silica gel arranges the back in the recess in, leave the clearance between heat conduction silica gel's surface and the surface of heating mould, when guaranteeing that metal adhesive tape arranges the heating mould in, the sticky tape is located the recess, and forms a clearance between the heat conduction silica gel.
Furthermore, the metal adhesive tape comprises at least one middle base body, 2 or more adhesive tapes are distributed on the upper surface and the lower surface of the middle base body along the width direction for thermal compounding, and two ends of each adhesive tape respectively extend out of the outer sides of two middle base bodies located on the outermost sides for a certain distance.
A metal adhesive tape thermal compounding process comprises the following steps,
s1: preparing and treating raw materials of the metal adhesive tape, namely preparing more than one middle matrix and a plurality of adhesive tapes, and distributing 2 or more adhesive tapes for thermal compounding along the width direction of the middle matrix; after a thermal compounding process is completed, the base band feeding mechanism moves the base band for a distance, and then the next action cycle of thermal compounding is started.
S2: manufacturing a heating die, wherein the heating die comprises an upper die and a lower die, grooves matched with the adhesive tape are arranged on one sides of the upper die and the lower die, which are contacted with the metal adhesive tape, or grooves matched with the adhesive tape are arranged on one side of any one of the upper die or the lower die, which is contacted with the metal adhesive tape;
s3: mounting a heating die, wherein the upper die and the lower die which are manufactured in the step S2 are respectively mounted on a hot-pressing compound machine;
s4: and (4) performing hot-melt compounding treatment, and starting a hot-press compounding machine to perform hot-press compounding on the metal adhesive tape.
Furthermore, the middle base body is one, and 2 or more adhesive tapes are distributed on the upper surface and the lower surface of the middle base body along the width direction and used for thermal compounding.
Furthermore, the number of the middle matrixes is more than two, the more than two middle matrixes are distributed in parallel, and 2 or more adhesive tapes are distributed on the upper surface and the lower surface of the more than two middle matrixes along the width direction for thermal compounding.
The utility model provides a thermal compound machine, includes in the hot combined technology of above-mentioned metal adhesive tape heating mould, heating mould includes mould and lower mould, it has the heating tube all to embed in mould and the lower mould, thermal compound machine still includes upper fixed plate, bottom plate and fly leaf, the fly leaf is located between upper fixed plate and the bottom plate, upper fixed plate and bottom plate pass through the guide pillar and connect, the guide pillar passes the fly leaf, the fly leaf moves about the guide pillar from top to bottom along, go up the mould and pass through the fastener and install on the fly leaf, the lower mould passes through the fastener and installs on the bottom plate.
Furthermore, a pressure cylinder is installed on the upper fixing plate, a pressure rod of the pressure cylinder is connected with the movable plate, and the pressure cylinder drives the upper die to move up and down along the guide pillar along with the movable plate so as to drive the lower die to hot press the metal adhesive tape on the lower die.
Furthermore, the temperature control device also comprises an upper die temperature controller and a lower die temperature controller which are respectively used for controlling the temperature of the upper die and the temperature of the lower die.
The invention introduces the parameter of the composite clearance of the die, when the upper die and the lower die contact the metal adhesive tape due to the pressure F, the upper die and the lower die contact the metal base band firstly, the heat conduction is conducted to the composite adhesive tape through the metal band firstly, the innermost layer of the adhesive tape is melted by heating, the upper adhesive tape and the lower adhesive tape are melted together after coating the metal band under the action of the pressure F, and the problem of glue overflow and glue overflow angle is well controlled due to the clearance, thereby obviously improving the quality index of the product. The outer layer is basically only in a softening state, the optimal ideal melting state of thermal compounding is achieved, the base materials with the same material, the same thickness and different widths are produced under the matching of four parameters of temperature T, die pressure F during compounding, compounding force acting time S and compounding clearance, all performance indexes of the product are guaranteed to be good, and the consistency of the product is stable.
Compared with the prior art, the metal matrix composite adhesive tape has the following beneficial effects:
firstly, the design is ingenious, through set up the recess on the heating mould, make and form the clearance between heating mould and the sticky tape, and then make the heating mould at the heating hot melt in-process, the heating mould is earlier with the middle base member contact heating middle base member on the metal adhesive tape, because the heat conductivity of metal material is good, middle base member is by both sides to middle heat-conduction to the sticky tape position after, carry out heat-conduction heating sticky tape from inside to outside to the sticky tape that is located both sides by the middle base member that is located inside, make sticky tape hot melt accomplish the thermal recombination on middle base member, this kind of thermal recombination mode design is ingenious, the technical problem that outside-in heating sticky tape exists among the prior art has been overcome.
Secondly, the thermal compound is effectual, there is not excessive gluey angle of overflow, the excessive melting problem, let middle base member be heated earlier, the sticky tape that is located middle base member both sides is by interior to the outside conduction of heat for the sticky tape by middle base member again, the inlayer of sticky tape melts earlier than the skin, the outer not excessive melting of effective control sticky tape, and simultaneously, the setting in clearance between sticky tape and the heating mould, make the heating mould when the hot pressing is compound, can not produce excessive pressure, better assurance metal adhesive tape can not produce excessive gluey angle of overflow problem at thermal compound in-process, effectively promoted thermal compound product quality, the product uniformity is good.
Drawings
FIG. 1 is a schematic view of a layer structure of a metal tape in the metal tape thermal compounding process of the present invention;
FIG. 2 is a schematic view showing a positional relationship between a metal tape and a heating mold in the metal tape thermal compounding process of the present invention;
FIG. 3 is a schematic structural view of the heating mold of FIG. 2 with thermally conductive silica gel therein;
FIG. 4 is a schematic plan view of a metal tape in the thermal compounding process of the metal tape according to the present invention;
FIG. 5 is a front view of the thermal compound machine of the present invention;
FIG. 6 is a side view of the thermal compound machine of the present invention;
FIG. 7 is an enlarged view of portion A of FIG. 6;
FIG. 8 is an enlarged view of a heated mold in the prior art thermal compounding technique.
Detailed Description
The metal matrix composite tape of the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings.
Example 1
Referring to fig. 1 and 2, in the metal tape thermal compounding process, the metal tape 10 includes an intermediate substrate 11, the intermediate substrate 11 is made of a metal material, the upper and lower surfaces of the intermediate substrate 11 are respectively thermally compounded with tapes 12 through a thermal compounding process, in the compounding process, when the metal tape is placed in a heating mold 20, a gap 22 is left between the tape 12 on the metal tape 10 and the heating mold 20 on at least one side, and this gap 22 is called a mold compounding gap, so as to ensure that in the thermal compounding process of the metal tape 10, the heating mold 20 contacts with the intermediate substrate 11 on the metal tape 10 to heat the intermediate substrate 11, and then the intermediate substrate 11 conducts heat from inside to outside to the tapes 12 on the metal tape 10, so as to realize thermal compounding of the metal tape 10 by thermally fusing the tapes 12 on the intermediate substrate 11. According to the metal adhesive tape thermal compounding process, the die compounding clearance parameter is introduced, when the upper die and the lower die of the heating die 20 contact the metal adhesive tape due to the pressure F, the upper die and the lower die contact the middle base body 11 made of a metal material, namely the metal base band, the heat generated by the heating die 20 is conducted to the compound adhesive tape 12 through the metal base band, the innermost layer of the adhesive tape 12 is melted by heating, the upper layer of the adhesive tape 12 and the lower layer of the adhesive tape 12 are melted together after being coated on the base metal band in the middle under the action of the pressure F, the excessive pressure is avoided due to the clearance 22, the problem of the excessive glue angle is well controlled, and the product quality index is. In addition, the heat conduction mode from inside to outside enables the outer layer of the adhesive tape 12 to be basically only in a softening state, the optimal melting state of thermal compounding is achieved, the base materials with the same material, the same thickness and different widths are produced under the matching of four parameters of temperature T, die pressure F during compounding, compounding force action time S and die compounding clearance, all performance indexes of the product are guaranteed to be good, and the consistency of the product is stable.
Referring to fig. 1 and 2, the heating mold 20 comprises an upper heating mold and a lower heating mold, and during an actual thermal compounding process, at least one heating mold 20 of the upper heating mold and the lower heating mold is provided with a groove 21 on one side of the metal tape 10, the width of the groove 21 is greater than the width of the tape 12, the depth of the groove 21 is greater than the thickness of the tape 12, so that when the heating mold 20 contacts the intermediate substrate 11 on the metal tape, the tape 12 is in the groove 21, and gaps 22 are respectively left between the outer end and two side faces of the tape 12 and the inner wall of the groove 21, and the gap 22 is ensured to be formed between the tape 12 and the heating mold 20.
Referring to fig. 2 and 3, a heat-conducting silica gel 23 is arranged in the groove 21, the thickness of the heat-conducting silica gel 23 is lower than the depth of the groove 21, after the heat-conducting silica gel 23 is arranged in the groove 21, a gap 22 is left between the outer surface of the heat-conducting silica gel 23 and the outer surface of the heating mold 20, and when the metal adhesive tape is arranged in the heating mold 20, the adhesive tape 12 is located in the groove 21 and forms a gap 22 with the heat-conducting silica gel 23.
Referring to fig. 1 to 4, the metal tape 10 includes at least one middle substrate 11, 2 or more tapes 12 are distributed on the upper and lower surfaces of the middle substrate 11 along the width direction for thermal lamination, and both ends of the tapes 12 respectively extend out of the outer sides of two middle substrates 11 located at the outermost sides by a certain distance. Middle base member 11 is one at least, for effectively promoting the operating efficiency, middle base member 11 can once set up many, and it is whole that many middle base member 11 parallel distribution form the strap, and the two sides are compound many sticky tapes 12 of heat respectively about the strap is holistic, forms whole metal adhesive tape 10, and at the heat recombination in-process, can once compound many metal base member areas, effectively promote the operating efficiency.
Example 2
Referring to fig. 1 to 4, a metal tape thermal compounding process includes the following steps,
s1: preparing and treating raw materials of the metal adhesive tape, namely preparing more than one middle matrix 11 and a plurality of adhesive tapes 12, and distributing a plurality of adhesive tapes 12 along the length direction of the middle matrix 11; the number of the middle base body 11 is one, and 2 or a plurality of adhesive tapes 12 are uniformly distributed on the upper surface and the lower surface of the middle base body 11 along the width direction for thermal compounding; or more than two intermediate substrates 11 can be provided, the more than two intermediate substrates 11 are distributed in parallel, and 2 or more adhesive tapes 12 are distributed on the upper and lower surfaces of the more than two intermediate substrates 11 along the width direction for thermal compounding;
s2: manufacturing a heating die 20, wherein the heating die 20 comprises an upper die and a lower die, a groove 21 matched with the adhesive tape 12 is arranged on one side of the upper die and the lower die, which is contacted with the metal adhesive tape, or a groove 21 matched with the adhesive tape 12 is arranged on one side of any one of the upper die or the lower die, which is contacted with the metal adhesive tape;
s3: the installation of the heating die 20 is heated, and the upper die and the lower die manufactured in step S2 are respectively installed on a hot-press compound machine;
s4: and (4) performing hot-melt compounding treatment, and starting a hot-press compounding machine to perform hot-press compounding on the metal adhesive tape.
Example 3
Referring to fig. 5 and 6, a thermal compound machine includes the heating mold 20 in the metal tape thermal compound process, the heating mold 20 includes an upper mold and a lower mold, the heating tube 24 is disposed in both the upper mold and the lower mold, the thermal compound machine further includes an upper fixing plate 30, a lower fixing plate 40 and a movable plate 50, the movable plate 50 is located between the upper fixing plate 30 and the lower fixing plate 40, the upper fixing plate 30 and the lower fixing plate 40 are connected through a guide pillar 60, the guide pillar 60 passes through the movable plate 50, the movable plate 50 moves up and down along the guide pillar 60, the upper mold is mounted on the movable plate 50 through a fastener, and the lower mold is mounted on the lower fixing plate 40 through a fastener. The thermal compound machine further comprises an upper die temperature controller 80 and a lower die temperature controller 90 which are respectively used for controlling the temperature of the upper die and the temperature of the lower die. The upper fixing plate 30 is provided with a pressure cylinder 70, a pressure rod of the pressure cylinder 70 is connected with the movable plate 50, and the pressure cylinder 70 drives the upper die to move up and down along the guide pillar 60 along with the movable plate 50 to drive the upper die to hot press the metal adhesive tape 10 on the lower die.
Referring to fig. 7, grooves 21 are respectively formed in the upper die and the lower die, gaps 22 are formed between the adhesive tape 12 and the upper die and the lower die of the heating die in the hot pressing process of the upper die and the lower die, the adhesive tapes 12 on the upper surface and the lower surface of the metal intermediate substrate 11 are heated and then are conducted outwards from the metal base tape, and the thermal compounding effect of the metal adhesive tapes is optimal. Of course, the groove 21 can be only arranged on the upper die, or the groove 21 can be only arranged on the lower die, so that the gap is formed between the adhesive tape on any surface of the metal base band and any one of the heating dies in the upper die and the lower die in the heating die, the overflow angle and the over-melting problem can be avoided, the thermal compounding index can be achieved, and the consistency of products can be ensured.
The invention introduces the parameter of the composite clearance of the die, when the upper die and the lower die contact the metal adhesive tape due to the pressure F, the upper die and the lower die contact the metal base band firstly, the heat conduction is conducted to the composite adhesive tape 12 through the metal band firstly, the innermost layer of the adhesive tape 12 is melted by heating, the upper layer adhesive tape 12 and the lower layer adhesive tape 12 are melted together after being coated with the metal band under the action of the pressure F, the clearance 22 ensures no over-pressure, the problem of glue overflow and glue overflow angle is well controlled, and the product quality index is obviously improved. The outer layer is basically only in a softening state, the optimal ideal melting state of thermal compounding is achieved, the base materials with the same material, the same thickness and different widths are produced under the matching of four parameters of temperature T, die pressure F during compounding, compounding force acting time S and compounding gap 22, all performance indexes of the product are guaranteed to be good, and the consistency of the product is stable.
The invention introduces the parameter of the compound clearance of the die, so that in the process of the heat compound technology, the height difference exists between the adhesive tape on the metal base band and the heating die, the heat conduction path is skillfully changed according to the requirements of the heat compound technology, the heat heats the base metal band firstly and then is conducted to the adhesive tape 12, the adhesive tape 12 is melted from inside to outside, under the action of pressure F, the upper adhesive tape 12 and the lower adhesive tape 12 are melted together after the metal band is coated, the invention skillfully utilizes the thickness difference of the upper composite layer and the lower composite layer, as shown in figure 6, a height difference is processed between the lower heat-conducting silica gel 23 and the lower heat-conducting copper die, the value of the height difference is determined by the thickness of the adhesive tape 12, when the upper heat-conducting die and the lower heat-conducting die are contacted, the lower adhesive tape 12 is positioned in the clearance 22, the lower heat-conducting copper die is fully contacted with the base metal, when the compounding temperature is reached, the upper layer adhesive tape 12 and the lower layer adhesive tape 12 are fused together after being coated on the substrate under the action of the pressure F. Through the matching of the temperature T, the die pressure F, the composite force action time S, the gap 22 and four parameters, because of the existence of the gap 22, the height difference exists between the heating die and the adhesive tape, the metal tape is heated firstly and then is conducted to the composite adhesive tape 12, the inner layer adhesive tape 12 is melted before the outer layer adhesive tape 12, the outer layer adhesive tape 12 is controlled not to be over-melted, the gap 22 controls that the acting force F is not over-pressed under the action of the die pressure F during compounding, the glue overflow angle can not be generated, the parameters are easy to match, the optimal effect of product composite melting is achieved, and various composite indexes are obviously superior to the prior process.
In the description of the present invention, it is to be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. The metal adhesive tape thermal compounding process is characterized in that the metal adhesive tape comprises an intermediate base body, the intermediate base body is made of metal materials, adhesive tapes are respectively thermally compounded on the upper surface and the lower surface of the intermediate base body through the thermal compounding process, when the metal adhesive tape is placed in a heating mold in the compounding process, a groove is formed in one side, located on the metal adhesive tape, of at least one heating mold, the adhesive tape on the metal adhesive tape is located in the groove, a gap is reserved between the adhesive tape on the metal adhesive tape and the heating mold, it is ensured that the metal adhesive tape is in a hot melting compounding process, the heating mold is firstly contacted with the intermediate base body on the metal adhesive tape to enable the intermediate base body to be heated, and then heat conduction is carried out on the adhesive tape, located on the metal adhesive tape, from inside to outside.
2. The metal tape thermal compounding process of claim 1, wherein: the width of the groove is larger than that of the adhesive tape, so that when the heating die is in contact with the middle base body on the metal adhesive tape, the adhesive tape is positioned in the groove, and gaps are reserved between the outer end and two side faces of the adhesive tape and the inner wall of the groove respectively.
3. The metal tape thermal compounding process of claim 2, wherein: be equipped with heat conduction silica gel in the recess, heat conduction silica gel's thickness is less than the degree of depth of recess, back in the recess is arranged in to heat conduction silica gel, leave the clearance between heat conduction silica gel's surface and the surface of heating mould, when guaranteeing that metal adhesive tape arranges in the heating mould, the sticky tape is located the recess, and forms a clearance between the heat conduction silica gel.
4. The metal tape thermal compounding process of claim 3, wherein: the metal adhesive tape comprises at least one middle base body, wherein 2 or more adhesive tapes are respectively distributed on the upper surface and the lower surface of the middle base body along the width direction for thermal compounding, and two ends of each adhesive tape respectively extend out of the outer sides of two middle base bodies positioned on the outermost sides for a certain distance.
5. The metal tape thermal compounding process according to any one of claims 1 to 4, characterized in that: comprises the following steps of (a) carrying out,
s1: preparing and treating raw materials of the metal adhesive tape, namely preparing more than one middle matrix and a plurality of adhesive tapes, and distributing 2 or more adhesive tapes for thermal compounding along the width direction of the middle matrix;
s2: manufacturing a heating die, wherein the heating die comprises an upper die and a lower die, grooves matched with the adhesive tape are arranged on one sides of the upper die and the lower die, which are contacted with the metal adhesive tape, or grooves matched with the adhesive tape are arranged on one side of any one of the upper die or the lower die, which is contacted with the metal adhesive tape;
s3: mounting a heating die, wherein the upper die and the lower die which are manufactured in the step S2 are respectively mounted on a hot-pressing compound machine;
s4: and (4) performing hot-melt compounding treatment, and starting a hot-press compounding machine to perform hot-press compounding on the metal adhesive tape.
6. The metal tape thermal compounding process of claim 5, wherein: the middle base body is one, and 2 or more adhesive tapes are uniformly distributed on the upper surface and the lower surface of the middle base body in the width direction and used for thermal compounding.
7. The metal tape thermal compounding process of claim 5, wherein: the middle base member is more than two, and more than two middle base members are the parallel distribution, and the upper and lower two sides of more than two middle base members evenly distributes along the width direction has 2 or many sticky tapes to be used for the thermal recombination.
8. A thermal compound machine is characterized in that: the heating mold in the metal tape thermal compounding process according to any one of claims 1 to 7, wherein the heating mold comprises an upper mold and a lower mold, heating tubes are arranged in both the upper mold and the lower mold, the thermal compounding machine further comprises an upper fixing plate, a lower fixing plate and a movable plate, the movable plate is located between the upper fixing plate and the lower fixing plate, the upper fixing plate and the lower fixing plate are connected through guide pillars, the guide pillars penetrate through the movable plate, the movable plate moves up and down along the guide pillars, the upper mold is mounted on the movable plate through fasteners, and the lower mold is mounted on the lower fixing plate through fasteners.
9. The thermal compound machine of claim 8, wherein: and the upper fixing plate is provided with a pressure cylinder, a pressure rod of the pressure cylinder is connected with the movable plate, and the pressure cylinder drives the upper die to move up and down along the guide pillar along with the movable plate so as to drive the lower die to hot-press the metal adhesive tape positioned on the lower die.
10. The thermal compound machine of claim 9, wherein: the temperature control device also comprises an upper die temperature controller and a lower die temperature controller which are respectively used for controlling the temperature of the upper die and the temperature of the lower die.
Priority Applications (1)
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| JP2013193441A (en) * | 2012-03-22 | 2013-09-30 | Honda Motor Co Ltd | Method of joining metal plate material and thermoplastic resin plate material |
| CN104393226A (en) * | 2014-12-10 | 2015-03-04 | 连云港德立信电子科技有限公司 | Lithium battery tab hot press molding method |
| WO2015145253A1 (en) * | 2014-03-26 | 2015-10-01 | Toyota Jidosha Kabushiki Kaisha | Joining method |
| CN209512285U (en) * | 2018-11-05 | 2019-10-18 | 华帝股份有限公司 | Novel structure and water heater that anti-overflow was glued |
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|---|---|---|---|---|
| JP2013193441A (en) * | 2012-03-22 | 2013-09-30 | Honda Motor Co Ltd | Method of joining metal plate material and thermoplastic resin plate material |
| WO2015145253A1 (en) * | 2014-03-26 | 2015-10-01 | Toyota Jidosha Kabushiki Kaisha | Joining method |
| CN104393226A (en) * | 2014-12-10 | 2015-03-04 | 连云港德立信电子科技有限公司 | Lithium battery tab hot press molding method |
| CN209512285U (en) * | 2018-11-05 | 2019-10-18 | 华帝股份有限公司 | Novel structure and water heater that anti-overflow was glued |
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