CN110933877B - Four-layer circuit board with high production yield and manufacturing method thereof - Google Patents
Four-layer circuit board with high production yield and manufacturing method thereof Download PDFInfo
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- CN110933877B CN110933877B CN201911233980.9A CN201911233980A CN110933877B CN 110933877 B CN110933877 B CN 110933877B CN 201911233980 A CN201911233980 A CN 201911233980A CN 110933877 B CN110933877 B CN 110933877B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a four-layer circuit board with high production yield and a manufacturing method thereof, wherein one end of a positioning plate is provided with a plurality of light sources, the glue can be quickly semi-cured by the irradiation of the light sources after being coated by a needle cylinder through the arrangement of the light sources, the curing efficiency of the glue can be changed by the light sources, after the semi-curing, a second circuit board is placed on a first circuit board through a mechanical arm, so that the first circuit board and the second circuit board can be more easily fixed after the glue is semi-cured, the production yield of the four-layer circuit board is improved, one end of a fixing plate is fixedly provided with a bearing plate through a bolt, one end of the bearing plate is fixedly provided with a pressing cylinder through a bolt, one end of the pressing cylinder is movably provided with a push rod, the circuit board is pressed through the arrangement of the pressing cylinder, the semi-cured glue, thereby improving the production yield of the circuit board.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a four-layer circuit board with high production yield and a manufacturing method thereof, and belongs to the technical field of application of the four-layer circuit board and the manufacturing method thereof.
Background
The printed circuit board is developed from a single layer to a double-sided board, a multi-layer board and a flexible board, and is continuously developed towards high precision, high density and high reliability, the size is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products. The multilayer circuit board has three layers of routing layers at least, along with the development of electronic technology, tens layers can even be accomplished to current technology, wherein two-layer is at the surface, and remaining one deck is synthesized in the insulation board, current four-layer circuit board is in the manufacture process, need fall into a plurality of process shops, its manufacture process is complicated, it is longer to consume time, and in the manufacture process, the connection between layer adopts sticky mode usually, but in sticky process, glue need solidify earlier and handle, make and need the manual work to carry out the switching of light source and the upset of circuit board when four layers are sticky, just can accomplish, make the multilayer circuit board need the time of sticky combination improve greatly, and then greatly reduced the preparation efficiency of four-layer circuit board, and in manual operation's in-process, easily cause the damage of circuit board because of the human factor, influence production yield.
Disclosure of Invention
The invention aims to provide a four-layer circuit board with high production yield and a manufacturing method thereof, and aims to solve the technical problems that the existing four-layer circuit board needs to be divided into a plurality of process workshops in the manufacturing process, the manufacturing process is complex and takes a long time, in the manufacturing process, the connection between layers usually adopts an adhesive mode, but in the adhesive process, glue needs to be cured firstly, so that the four layers need to be manually switched over and turned over when being adhered, the time for the multilayer circuit board to be adhered and combined is greatly prolonged, the manufacturing efficiency of the four-layer circuit board is greatly reduced, and in the manual operation process, the circuit board is easily damaged due to human factors, and the production yield is influenced.
The purpose of the invention can be realized by the following technical scheme:
a high production yield four-layer circuit board comprising: the first circuit board, the second circuit board and the third circuit board are positioned at the bottom end, the second circuit board is a double-layer circuit board which is fixed by glue through a glue layer, the first circuit board is arranged at the bottom end of the second circuit board, an insulating layer is arranged between the second circuit board and the first circuit board, the second circuit board and the first circuit board are fixed by glue, the third circuit board is arranged at the top end of the second circuit board, the insulating layer is arranged between the third circuit board and the second circuit board, and the third circuit board and the second circuit board are fixedly connected by glue;
the four-layer circuit board is manufactured by the following steps: printing, punching, exposing, developing, etching, demoulding, assembling and laminating, wherein the process steps are as follows:
the method comprises the following steps: printing and punching, namely sequentially printing the pre-designed layout of a first circuit board, a second circuit board and a third circuit board on a film, sequentially placing the printed film on the corresponding circuit boards, and sequentially placing the first circuit board, the second circuit board and the third circuit board on which the film is stacked on a punching machine for punching;
step two: exposing and developing, namely covering a film layer for blocking electroplated and etched high molecular compounds on the surfaces of the second circuit board, the first circuit board and the third circuit board in sequence, and irradiating the second circuit board, the first circuit board and the third circuit board in sequence through a photosensitive machine to enable pre-designed circuit wiring to be attached to the corresponding circuit boards;
step three: etching and demoulding, namely etching the second circuit board, the first circuit board and the third circuit board processed in the step two in sequence to remove the metal layer of the non-circuit wiring, and demoulding the etched second circuit board, the etched first circuit board and the etched third circuit board in sequence to remove the film layer;
step four: equipment, pressfitting, through the manipulator with first circuit board remove to the locating plate on, accomplish equipment and pressfitting through moving mechanism and slewing mechanism, specifically do: starting the first air cylinder, driving the first sliding plate to move along the length direction of the first air cylinder by the first air cylinder, enabling the first sliding plate to drive the mounting plate to move along with the first sliding plate, further enabling the mounting plate to horizontally move along the length direction of the sliding rail through the first sliding plate and the sliding block, further enabling the mounting plate to drive the rib plate to move above the first circuit board, enabling the needle cylinder to glue the surface of the first circuit board, simultaneously starting the second air cylinder, driving the second sliding plate to move along the length direction of the second air cylinder by the second air cylinder, enabling the second sliding plate to drive the rib plate to move along the length direction of the second air cylinder, further enabling the needle cylinder to automatically move along the XY direction under the driving of the first air cylinder and the second air cylinder to finish the gluing of the first circuit board, after the gluing is finished, starting the light source to semi-cure the glue, starting the motor, enabling the motor to drive the laminated board, at the moment, the second circuit board is moved to the upper side of the first circuit board through the manipulator, the pressing cylinder is started, the pressing cylinder drives the pressing board to move downwards, the first circuit board and the second circuit board are pressed through the pressing board, the actions are repeated to assemble the third circuit board on the second circuit board, and the pressing of the four layers of circuit boards is completed.
Furthermore, the top of third circuit board and the bottom of first circuit board all are provided with spouts the tin layer, and the equidistant a plurality of louvres that are used for the heat dissipation that are provided with on the cross section of insulating layer and glue layer, and the vertical direction of first circuit board, second circuit board and third circuit board is run through and is provided with a plurality of through-holes.
Further, moving mechanism includes first cylinder, second cylinder and cylinder, first cylinder passes through bolt fixed mounting in the upper end of backup pad, the backup pad passes through bolt and workstation fixed connection, the upper end sliding connection of first cylinder has first slide, there is the upper end of mounting panel in the upper end of first slide through bolt fixed mounting, the mounting panel is perpendicular setting with first cylinder, bolt and slider fixed connection are passed through to the one end of mounting panel, the bottom and the slide rail sliding connection of slider, the slide rail passes through bolt and backup pad fixed connection, make the backup pad provide the support for first cylinder and mounting panel, there is the second cylinder in the upper end of mounting panel through bolt fixed mounting.
Furthermore, the upper end of the second cylinder is connected with a second sliding plate in a sliding mode, the upper end of the second sliding plate is fixedly provided with a rib plate through a bolt, one end of the rib plate is fixedly provided with a glue barrel through a bolt, and one end of the glue barrel is provided with a needle cylinder for gluing.
Further, slewing mechanism includes the third cylinder, motor and baffle, the third cylinder passes through bolt fixed mounting on the extension board, the extension board passes through bolt and backup pad fixed connection, the third cylinder is vertical setting, sliding connection has the third slide on the third cylinder, bolt fixed mounting has the support frame through the one end of third slide, the support frame is the U-shaped structure, bolt fixed mounting has the movable block through the one end of support frame, movable block and guide rail sliding connection, the one end symmetry of support frame is provided with the carousel, the carousel passes through the round pin axle and is connected with the support frame rotation, there is the fixed plate through bolt fixed mounting between the carousel, there is the baffle bottom of fixed plate through bolt fixed mounting.
Further, there is the motor one end of support frame through bolt fixed mounting, and the one end of motor is rotated and is connected with the axis of rotation, and the one end of axis of rotation is passed through the bearing and is rotated with the carousel and be connected for the motor passes through axis of rotation drive carousel and drives the fixed plate rotation.
Furthermore, the bearing plate is fixedly installed at one end of the fixing plate through a bolt, the press-fit cylinder is fixedly installed at one end of the bearing plate through a bolt, the push rod is movably installed at one end of the press-fit cylinder, and the press-fit plate used for press-fitting the circuit board is fixedly installed at one end of the push rod through a bolt.
Furthermore, the locating plate passes through bolt and workstation fixed connection, and the one end of locating plate is provided with a plurality of light sources, and a plurality of light sources all pass through mount table and diaphragm fixed connection, and the both ends of diaphragm are through brace table and workstation fixed connection.
The invention has the beneficial effects that:
1. one end of locating plate is provided with a plurality of light sources, a plurality of light sources all pass through mount table and diaphragm fixed connection, a supporting bench and workstation fixed connection are passed through at the both ends of diaphragm, through setting up the light source, after the cylinder rubber coating, through shining of light source, make glue can semi-solid fast, the solidification efficiency that can change glue of light source, after carrying out semi-solid, place the second circuit board on first circuit board through the manipulator, make glue fix first circuit board and second circuit board more easily after semi-solid, thereby the production yield of four layers of circuit boards has been improved.
2. The one end of support frame has the motor through bolt fixed mounting, and the one end of motor is rotated and is connected with the axis of rotation, and the motor passes through axis of rotation drive baffle and rotates for the baffle rotates the one end to first circuit board, and then when the light source solidifies glue on to first circuit board, makes the irradiation route of light source refract through blockking of baffle through rotating the baffle, and then the solidification efficiency of glue with higher speed.
3. The one end of fixed plate is passed through bolt fixed mounting loading board, and the one end of loading board has the pressfitting cylinder through bolt fixed mounting, and the one end movable mounting of pressfitting cylinder has the push rod, and the one end of push rod has the pressfitting board that is used for the pressfitting circuit board through bolt fixed mounting, through setting up the pressfitting cylinder, through carrying out the pressfitting with the circuit board for semi-solid glue can be complete adhesive fixation with the circuit board, more laminates between the circuit board, and then has improved the production yield of circuit board.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic view of the installation of a four-layer circuit board according to the present invention.
Fig. 2 is an isometric view of an assembly tool for a four-layer circuit board of the present invention.
Fig. 3 is a front view of an assembly fixture for a four-layer circuit board according to the present invention.
Fig. 4 is a schematic view of the installation of the moving mechanism of the present invention.
Fig. 5 is a schematic view of the installation of the rotating mechanism of the present invention.
Fig. 6 is a front view of the rotating mechanism of the present invention.
Fig. 7 is an enlarged view of a portion a of fig. 2 according to the present invention.
In the figure: 1. a work table; 2. positioning a plate; 3. a support plate; 4. a moving mechanism; 401. a first cylinder; 402. a first slide plate; 403. mounting a plate; 404. a slider; 405. a slide rail; 406. a second cylinder; 407. a second slide plate; 408. a rib plate; 409. a glue barrel; 410. a needle cylinder; 5. a rotating mechanism; 501. a third cylinder; 502. a third slide plate; 503. a support frame; 504. a guide rail; 505. a turntable; 506. a rotating shaft; 507. a motor; 508. a fixing plate; 509. a baffle plate; 510. a carrier plate; 511. pressing a cylinder; 512. a push rod; 513. pressing the plywood; 6. a support table; 7. a transverse plate; 8. an installation table; 9. a light source; 10. a first circuit board; 11. a second circuit board; 12. a third circuit board; 13. an insulating layer; 14. a glue layer; 15. spraying a tin layer; 16. a through hole; 17. and (4) heat dissipation holes.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, a four-layer circuit board with high production yield includes: the first circuit board 10 that is located the bottom, second circuit board 11 and the third circuit board 12 that is located the top, second circuit board 11 is the double-deck circuit board through 14 adhesive bonds of glue layer, the bottom of second circuit board 11 is provided with first circuit board 10, be provided with insulating layer 13 between second circuit board 11 and the first circuit board 10, and through adhesive bonds between second circuit board 11 and the first circuit board 10, the top of second circuit board 11 is provided with third circuit board 12, be provided with insulating layer 13 between third circuit board 12 and the second circuit board 11, and third circuit board 12 is crossed the glue with second circuit board 11 and is glued to fix and be connected.
The four-layer circuit board is manufactured by the following steps: printing, punching, exposing, developing, etching, demoulding, assembling and laminating, wherein the process steps are as follows:
the method comprises the following steps: printing and punching, namely sequentially printing the pre-designed layout of a first circuit board 10, a second circuit board 11 and a third circuit board 12 on a film, sequentially placing the printed film on the corresponding circuit boards, and sequentially placing the first circuit board 10, the second circuit board 11 and the third circuit board 12 on which the films are stacked on a punching machine for punching;
step two: exposing and developing, namely covering a film layer of a polymer compound for blocking electroplating and etching on the surfaces of the second circuit board 11, the first circuit board 10 and the third circuit board 12 in sequence, and irradiating the second circuit board 11, the first circuit board 10 and the third circuit board 12 in sequence by a photosensitive machine to enable pre-designed circuit wiring to be attached to the corresponding circuit boards;
step three: etching and demolding, namely sequentially etching the second circuit board 11, the first circuit board 10 and the third circuit board 12 processed in the second step to remove the metal layer of the non-circuit wiring, and sequentially performing demolding treatment on the etched second circuit board 11, the etched first circuit board 10 and the etched third circuit board 12 to remove the film layer;
step four: equipment, pressfitting, on moving first circuit board 10 to locating plate 2 through the manipulator, accomplish equipment and pressfitting through moving mechanism 4 and slewing mechanism 5, specifically do: starting the first air cylinder 401, the first air cylinder 401 driving the first sliding plate 402 to move along the length direction of the first air cylinder 401, so that the first sliding plate 402 drives the mounting plate 403 to move along with the first sliding plate 402, so that the mounting plate 403 moves horizontally along the length direction of the slide rail 405 through the first sliding plate 402 and the slide block 404, so that the mounting plate 403 drives the rib plate 408 to move above the first circuit board 10, so that the needle cylinder 410 coats the surface of the first circuit board 10 with glue, and simultaneously starting the second air cylinder 406, so that the second air cylinder 406 drives the second sliding plate 407 to move along the length direction of the second air cylinder 406, so that the second sliding plate 407 drives the rib plate 408 to move along the length direction of the second air cylinder 406, so that the needle cylinder 410 automatically moves along the XY direction under the driving of the first air cylinder 401 and the second air cylinder 406 to complete the glue coating on the first circuit board 10, after the glue coating is completed, the light source 9 is, and starting the motor 507 to enable the motor 507 to drive the pressing plate 513 to rotate right above the first circuit board 10, moving the second circuit board 11 to the upper side of the first circuit board 10 through the manipulator at the moment, starting the pressing cylinder 511 to enable the pressing cylinder 511 to drive the pressing plate 513 to move downwards, pressing the first circuit board 10 and the second circuit board 11 through the pressing plate 513, repeating the above actions to assemble the third circuit board 12 onto the second circuit board 11, and finishing the pressing of the four-layer circuit board.
Moving mechanism 4 includes first cylinder 401, second cylinder 406 and cylinder 410, first cylinder 401 passes through bolt fixed mounting in the upper end of backup pad 3, backup pad 3 passes through bolt and workstation 1 fixed connection, the upper end sliding connection of first cylinder 401 has first slide 402, the upper end of first slide 402 passes through bolt fixed mounting has the upper end of mounting panel 403, mounting panel 403 is perpendicular setting with first cylinder 401, bolt and slider 404 fixed connection are passed through to the one end of mounting panel 403, the bottom and the slide rail 405 sliding connection of slider 404, slide rail 405 passes through bolt and backup pad 3 fixed connection, make backup pad 3 provide the support for first cylinder 401 and mounting panel 403, there is second cylinder 406 in the upper end of mounting panel through bolt fixed mounting.
The upper end of the second cylinder 406 is slidably connected with a second sliding plate 407, the upper end of the second sliding plate 407 is fixedly provided with a rib plate 408 through a bolt, one end of the rib plate 408 is fixedly provided with a glue barrel 409 through a bolt, and one end of the glue barrel 409 is provided with a needle cylinder 410 for gluing.
One end of the supporting frame 503 is fixedly installed with a motor 507 through a bolt, one end of the motor 507 is rotatably connected with a rotating shaft 506, and one end of the rotating shaft 506 is rotatably connected with the turntable 505 through a bearing, so that the motor 507 drives the turntable 505 to drive the fixing plate 508 to rotate through the rotating shaft 506.
Bolt fixed mounting loading board 510 is passed through to the one end of fixed plate 508, and bolt fixed mounting has pressfitting cylinder 511 to the one end of loading board 510, and the one end movable mounting of pressfitting cylinder 511 has push rod 512, and the one end of push rod 512 has pressfitting board 513 that is used for the pressfitting circuit board through bolt fixed mounting, through setting up pressfitting cylinder 511, through carrying out the pressfitting with the circuit board for semi-solid glue can be glued fixedly completely with the circuit board, more laminates between the circuit board, and then has improved the production yield of circuit board.
Locating plate 2 passes through bolt and 1 fixed connection of workstation, the one end of locating plate 2 is provided with a plurality of light sources 9, a plurality of light sources 9 all pass through mount table 8 and diaphragm 7 fixed connection, support table 6 and 1 fixed connection of workstation are passed through at the both ends of diaphragm 7, through setting up light source 9, after cylinder 410 rubber coating, through shining of light source 9, make glue semi-solid fast, the solidification efficiency of glue can be changed to light source 9, after semi-solid carrying out, place second circuit board 11 on first circuit board 10 through the manipulator, make glue fix first circuit board 10 and second circuit board 11 more easily after semi-solid, thereby the production yield of four-layer circuit board has been improved.
When the motor 507 is started, the motor 507 drives the baffle 509 to rotate through the rotating shaft 506, so that the baffle 509 rotates to one end of the first circuit board 10, and further when the glue on the first circuit board 10 is cured by the light source 9, the irradiation path of the light source 9 is refracted through the blocking of the baffle 509 by rotating the baffle 509, and further the curing efficiency of the glue is accelerated.
The top of third circuit board 12 and the bottom of first circuit board 10 all are provided with tin spraying layer 15, the equidistant a plurality of louvres 17 that are used for the radiating that are provided with on the cross section of insulating layer 13 and glue layer 14, make the four-layer circuit board can dispel the heat through a plurality of louvres 17 fast in the use, the vertical direction of four-layer circuit board runs through and is provided with a plurality of through-holes 16, a plurality of through-holes 16 provide the positioning action for each circuit board in the assembling process of four-layer circuit board, through watering electrically conductive metal in a plurality of through-holes 16 after the equipment in order to improve the electric conductivity of four-layer circuit.
The first wiring board 10, the second wiring board 11, and the third wiring board 12 are all copper substrates.
When the semi-curing glue injection device is used, one end of the positioning plate 2 is provided with the plurality of light sources 9, the plurality of light sources 9 are fixedly connected with the transverse plate 7 through the mounting table 8, two ends of the transverse plate 7 are fixedly connected with the workbench 1 through the support table 6, the light sources 9 are arranged, after the needle cylinder 410 is coated with glue, the glue can be semi-cured quickly through irradiation of the light sources 9, the curing efficiency of the glue can be changed through the light sources 9, after the glue is semi-cured, the second circuit board 11 is placed on the first circuit board 10 through the manipulator, the first circuit board 10 and the second circuit board 11 can be fixed more easily after the glue is semi-cured, and therefore the production yield of the four-layer circuit board; one end of the supporting frame 503 is fixedly provided with a motor 507 through a bolt, one end of the motor 507 is rotatably connected with a rotating shaft 506, the motor 507 drives the baffle 509 to rotate through the rotating shaft 506, so that the baffle 509 rotates to one end of the first circuit board 10, when the light source 9 cures the glue on the first circuit board 10, the irradiation path of the light source 9 is refracted through the blocking of the baffle 509 by rotating the baffle 509, and the curing efficiency of the glue is further accelerated; bolt fixed mounting loading board 510 is passed through to the one end of fixed plate 508, and bolt fixed mounting has pressfitting cylinder 511 to the one end of loading board 510, and the one end movable mounting of pressfitting cylinder 511 has push rod 512, and the one end of push rod 512 has pressfitting board 513 that is used for the pressfitting circuit board through bolt fixed mounting, through setting up pressfitting cylinder 511, through carrying out the pressfitting with the circuit board for semi-solid glue can be glued fixedly completely with the circuit board, more laminates between the circuit board, and then has improved the production yield of circuit board.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. A four-layer circuit board with high production yield is characterized by comprising: the circuit board comprises a first circuit board (10) and a second circuit board (11) which are positioned at the bottom end and a third circuit board (12) which is positioned at the top end, wherein the second circuit board (11) is a double-layer circuit board which is fixed by gluing through a glue layer (14), the first circuit board (10) is arranged at the bottom end of the second circuit board (11), an insulating layer (13) is arranged between the second circuit board (11) and the first circuit board (10), the second circuit board (11) and the first circuit board (10) are fixed by gluing, the third circuit board (12) is arranged at the top end of the second circuit board (11), the insulating layer (13) is arranged between the third circuit board (12) and the second circuit board (11), and the third circuit board (12) and the second circuit board (11) are fixedly connected by gluing;
the four-layer circuit board is manufactured by the following steps: printing, punching, exposing, developing, etching, demoulding, assembling and laminating, wherein the process steps are as follows:
the method comprises the following steps: printing and punching, namely printing the pre-designed layout of a first circuit board (10), a second circuit board (11) and a third circuit board (12) on a film in sequence, placing the printed film on the corresponding circuit boards in sequence, and placing the first circuit board (10), the second circuit board (11) and the third circuit board (12) on which the films are stacked on a punching machine in sequence for punching;
step two: exposing and developing, namely covering a layer of film layer for blocking electroplated and etched high molecular compounds on the surfaces of the second circuit board (11), the first circuit board (10) and the third circuit board (12) in sequence, and irradiating the second circuit board (11), the first circuit board (10) and the third circuit board (12) in sequence through a photosensitive machine to enable pre-designed circuit wiring to be attached to the corresponding circuit boards;
step three: etching and demolding, namely sequentially etching the second circuit board (11), the first circuit board (10) and the third circuit board (12) processed in the step two to remove the metal layer of the non-circuit wiring, and sequentially demolding the etched second circuit board (11), the first circuit board (10) and the third circuit board (12) to remove the film layer;
step four: equipment, pressfitting, move first circuit board (10) to locating plate (2) through the manipulator on, accomplish equipment and pressfitting through moving mechanism (4) and slewing mechanism (5), specifically do: starting a first air cylinder (401), wherein the first air cylinder (401) drives a first sliding plate (402) to move along the length direction of the first air cylinder (401), so that the first sliding plate (402) drives a mounting plate (403) to move together with the first sliding plate (402), further the mounting plate (403) horizontally moves along the length direction of a sliding rail (405) through the first sliding plate (402) and a sliding block (404), further the mounting plate (403) drives a rib plate (408) to move above the first circuit board (10), so that a syringe (410) coats the surface of the first circuit board (10), and simultaneously starting a second air cylinder (406), so that the second air cylinder (406) drives a second sliding plate (407) to move along the length direction of the second air cylinder (406), so that the second sliding plate (407) drives the rib plate (408) to move along the length direction of the second air cylinder (406), and further the syringe (410) automatically moves along the XY direction under the driving of the first air cylinder (401) and the second air cylinder (406) to finish the first line XY direction Gluing the circuit boards (10), after gluing, turning on the light source (9) to semi-cure glue, starting the motor (507), enabling the motor (507) to drive the pressing plate (513) to rotate right above the first circuit board (10), moving the second circuit board (11) to the upper side of the first circuit board (10) through the manipulator, starting the pressing cylinder (511), enabling the pressing cylinder (511) to drive the pressing plate (513) to move downwards, pressing the first circuit board (10) and the second circuit board (11) through the pressing plate (513), repeating the above actions to assemble the third circuit board (12) on the second circuit board (11), and finishing pressing of four layers of circuit boards.
2. The four-layer circuit board with high production yield according to claim 1, wherein a tin-spraying layer (15) is disposed on both the top end of the third circuit board (12) and the bottom end of the first circuit board (10), a plurality of heat dissipation holes (17) for dissipating heat are disposed on the cross sections of the insulating layer (13) and the glue layer (14) at equal intervals, and a plurality of through holes (16) are disposed through the vertical direction of the first circuit board (10), the second circuit board (11) and the third circuit board (12).
3. The four-layer circuit board with high production yield according to claim 1, wherein the moving mechanism (4) comprises a first air cylinder (401), a second air cylinder (406) and a needle cylinder (410), the first air cylinder (401) is fixedly mounted at the upper end of the support plate (3) through a bolt, the support plate (3) is fixedly connected with the workbench (1) through a bolt, the upper end of the first air cylinder (401) is slidably connected with a first sliding plate (402), the upper end of the first sliding plate (402) is fixedly mounted with the upper end of the mounting plate (403) through a bolt, the mounting plate (403) is vertically arranged with the first air cylinder (401), one end of the mounting plate (403) is fixedly connected with the sliding block (404) through a bolt, the bottom end of the sliding block (404) is slidably connected with a sliding rail (405), the sliding rail (405) is fixedly connected with the support plate (3) through a bolt, so that the support plate (3) provides support for the first air cylinder (401) and the mounting plate, the upper end of the mounting plate (403) is fixedly provided with a second cylinder (406) through a bolt.
4. The four-layer circuit board with high production yield according to claim 1, wherein a second sliding plate (407) is connected to the upper end of the second air cylinder (406) in a sliding manner, a rib plate (408) is fixedly mounted at the upper end of the second sliding plate (407) through a bolt, a glue barrel (409) is fixedly mounted at one end of the rib plate (408) through a bolt, and a needle cylinder (410) for gluing is arranged at one end of the glue barrel (409).
5. The four-layer circuit board with high production yield according to claim 1, wherein the rotating mechanism (5) comprises a third cylinder (501), a motor (507) and a baffle (509), the third cylinder (501) is fixedly installed on a support plate through a bolt, the support plate is fixedly connected with the support plate (3) through a bolt, the third cylinder (501) is vertically arranged, a third sliding plate (502) is slidably connected onto the third cylinder (501), a support frame (503) is fixedly installed at one end of the third sliding plate (502) through a bolt, the support frame (503) is of a U-shaped structure, a moving block is fixedly installed at one end of the support frame (503) through a bolt, the moving block is slidably connected with the guide rail (504), rotating discs (505) are symmetrically arranged at one end of the support frame (503), the rotating discs (505) are rotatably connected with the support frame (503) through a pin shaft, and a fixing plate (508) is fixedly installed between the rotating discs (505, the bottom end of the fixed plate (508) is fixedly provided with a baffle (509) through a bolt.
6. The four-layer circuit board with high production yield according to claim 5, wherein a motor (507) is fixedly mounted at one end of the supporting frame (503) through a bolt, a rotating shaft (506) is rotatably connected to one end of the motor (507), and one end of the rotating shaft (506) is rotatably connected to the turntable (505) through a bearing, so that the motor (507) drives the turntable (505) through the rotating shaft (506) to drive the fixing plate (508) to rotate.
7. The four-layer circuit board with high production yield according to claim 6, wherein one end of the fixing plate (508) is fixedly installed with a bearing plate (510) through a bolt, one end of the bearing plate (510) is fixedly installed with a pressing cylinder (511) through a bolt, one end of the pressing cylinder (511) is movably installed with a push rod (512), and one end of the push rod (512) is fixedly installed with a pressing plate (513) for pressing the circuit board through a bolt.
8. The four-layer circuit board with high production yield according to claim 1, wherein the positioning plate (2) is fixedly connected with the workbench (1) through bolts, a plurality of light sources (9) are arranged at one end of the positioning plate (2), the plurality of light sources (9) are fixedly connected with the transverse plate (7) through the mounting table (8), and two ends of the transverse plate (7) are fixedly connected with the workbench (1) through the supporting table (6).
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| CN201911233980.9A CN110933877B (en) | 2019-12-05 | 2019-12-05 | Four-layer circuit board with high production yield and manufacturing method thereof |
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| CN110933877B true CN110933877B (en) | 2020-09-29 |
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| CN202035220U (en) * | 2011-04-25 | 2011-11-09 | 衢州威盛精密电子科技有限公司 | Laminated film leveling machine for resins of circuit board |
| US10518490B2 (en) * | 2013-03-14 | 2019-12-31 | Board Of Regents, The University Of Texas System | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices |
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