CN110933270A - Six-degree-of-freedom precision adjustment imaging chip assembly structure - Google Patents
Six-degree-of-freedom precision adjustment imaging chip assembly structure Download PDFInfo
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- CN110933270A CN110933270A CN201911164934.8A CN201911164934A CN110933270A CN 110933270 A CN110933270 A CN 110933270A CN 201911164934 A CN201911164934 A CN 201911164934A CN 110933270 A CN110933270 A CN 110933270A
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
Abstract
The invention relates to a six-dimensional precision adjusting mechanism of an imaging chip, which comprises: the six-dimensional adjustment of the imaging chip is converted into six-dimensional precise adjustment of a chip structural part, the chip structural part is positioned by a positioning pin and then is connected to a translational rotation adjusting part by a first three-dimensional adjusting screw and a second three-dimensional adjusting screw, the translational rotation adjusting part is connected to an imaging base by a translational rotation adjusting part fixing screw, and a light screen is connected to an imaging support plate by a light screen fixing screw; the imaging support plate is connected to the imaging base through an imaging support plate fixing screw; the three groups of first three-dimensional adjusting screws and the three groups of second three-dimensional adjusting screws are distributed in a triangular mode, three-dimensional movement of a chip structural part is achieved by adjusting one or more of the three groups of screws, the axes of the two positioning pins and the centers of the imaging chip are in the same plane and are used for limiting translation of an X axis and a Y axis in the plane and rotation around the Z axis, and the center position of the chip can be changed within a small bearable range during three-dimensional adjustment of the imaging chip through hole shaft fit gaps of the two positioning pins.
Description
Technical Field
The invention belongs to the technical field of photoelectricity. In particular to a six-freedom-degree precision adjustment imaging chip assembly structure.
Background
In recent years, the photoelectric imaging technology is widely applied to the fields of military, quasi-military and civil use. The requirements on imaging precision are continuously improved, and the requirements on the working of designing, assembling, debugging, testing and calibrating of an imaging system are also continuously improved. With the continuous development of the photoelectric technology, the requirements of miniaturization, higher imaging resolution and the like of the photoelectric system are increasingly improved.
The imaging chip assembly is a main component of an optoelectronic system, and is generally installed behind an optical system to form a complete imaging link. The existing imaging chip assembly is in a form that a chip is welded on a circuit board, and then the circuit board is fixed on an imaging base. Meanwhile, along with the increasing requirements of miniaturization, higher imaging resolution and the like of the photoelectric system, the precision requirement of the whole link of the imaging optical path is also increased continuously, and the requirements of the precision of rotation alignment, inclination adjustment and focal length adjustment between the image surface of the imaging chip and the optical lens barrel are increased increasingly.
In the whole link design and adjustment process of the imaging optical path, the structural type, the installation layout and the precise adjustment of the imaging chip assembly are key links of the imaging link, and are important means for ensuring the optical path and realizing an optical design result. The imaging chip component is designed in a structure and function integrated manner, so that the size and the weight of the imaging chip component can be effectively controlled, and high-precision assembly and adjustment work can be conveniently carried out. Therefore, the structure and the adjustment method of the structure and function integrated imaging chip assembly become the difficulty of the photoelectric system, and are the key link for realizing the performance index of the whole system.
Disclosure of Invention
The invention relates to a six-dimensional precision adjusting mechanism of an imaging chip, which is used for solving the problems in the prior art.
The invention relates to a six-dimensional precision adjusting mechanism of an imaging chip, which comprises: the imaging chip assembly (50) comprises a chip structural part (51), an imaging chip (52) and an imaging pretreatment circuit board (53), wherein the precise adjustment of the imaging chip (52) is the precise adjustment of the imaging chip assembly (50), the imaging chip (52) is connected with the chip structural part (51), the imaging chip (52) is connected to the imaging pretreatment circuit board (53) through a chip pin, the imaging pretreatment circuit board (53) is connected to the chip structural part (51), the imaging chip (52) and the imaging pretreatment circuit board (53) are connected together to form the imaging chip assembly (50), the imaging chip (52) is fixedly connected to the chip structural part (51), the six-dimensional adjustment of the imaging chip (52) is converted into the six-dimensional precise adjustment of the chip structural part (51), and the chip structural part (51) is positioned through a positioning pin (43), the device is connected to a translational rotary adjusting piece (40) through a first three-dimensional adjusting screw (41) and a second three-dimensional adjusting screw (42), the translational rotary adjusting piece (40) is connected to the imaging base (10) through 3 translational rotary adjusting piece fixing screws (44), and the light shielding plate (30) is connected to the imaging support plate (20) through 4 light shielding plate fixing screws (31); the imaging support plate (20) is connected to the imaging base (10) through 2 imaging support plate fixing screws (21); three groups of first three-dimensional adjusting screws (41) and second three-dimensional adjusting screws (42) are distributed in a triangular shape, three-dimensional movement of a chip structural member (51) is achieved by adjusting one or more groups of the three groups of screws, the axes of the two positioning pins (43) and the center of the imaging chip (52) are in the same plane and are used for limiting translation of an X axis and a Y axis and rotation around the Z axis in the plane, and the center position of the chip is guaranteed to be changed in a bearable small range during three-dimensional adjustment of the imaging chip through hole shaft fit gaps of the two positioning pins.
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, the imaging chip (52) six-dimensional space position adjustment is realized through three-dimensional adjustment of a chip structural member (51) and two-position translation and one-dimensional rotation adjustment of a translation and rotation adjusting member (40), the six-dimensional space position adjustment is decomposed into three-dimensional pose adjustment of the chip structural member (51) and three-dimensional pose adjustment of the translation and rotation adjusting member (40), and the chip structural member (51) and the translation and rotation adjusting member (40) are mutually connected in a series structure and are mutually independent.
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, the imaging support plate (20) and the imaging base (10) are integrally split, the internal and external features of the imaging support plate and the imaging base are conformal, and the light shielding plate (30) is installed to eliminate the influence of external stray light entering a light path on stable imaging of the imaging chip (52).
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, the imaging chip (52) is adhered to the chip structural member (51) through epoxy structural adhesive.
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, the imaging preprocessing circuit board (53) is connected to the chip structural member (51) through 4 circuit board fixing screws (55) and 4 circuit board support columns (56).
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, a chip structural component (51), an imaging chip (52) and an imaging preprocessing circuit board (53) are connected together through 2 imaging chip fixing screws (54) to form an imaging chip assembly (50).
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, three adjusting screws which are distributed in a triangular mode in a plane are adopted to achieve two-dimensional translation precision adjustment of the translation and rotation adjusting piece (40), and a threaded ejector rod type is adopted to achieve one-dimensional rotation precision adjustment of the translation and rotation adjusting piece (40) through two screws in an abutting mode.
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, a proper adjusting gap is radially reserved between the imaging base (10) and the translation and rotation adjusting piece (40). The imaging base is provided with three translation adjusting screws, a first rotation adjusting screw (14) and a second rotation adjusting screw (15), the imaging base (10) corresponds to a threaded hole, a rotation connecting piece (16) is arranged in the translation rotation adjusting piece (40) corresponds to the threaded hole, two-dimensional translation adjustment of the translation rotation adjusting piece (40) is realized by adjusting the combination of the three translation adjusting screws, one-dimensional rotation adjustment of the translation rotation adjusting piece (40) is realized by adjusting the first rotation adjusting screw (14) and the second rotation adjusting screw (15), and after the translation and rotation adjustment are in place, a fixing screw (44) of the translation rotation adjusting piece is locked.
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, the chip structural member (51) and the translational and rotational adjusting member (40) can be matched with each other through the shaft hole instead of the two positioning pins (43) to limit the imaging chip to translate within an acceptable range.
According to one embodiment of the imaging chip six-dimensional precision adjusting mechanism, structural glue is filled in a reserved glue groove between the chip structural member (51) and the translation and rotation adjusting member (40) after the imaging chip six-dimensional precision adjusting mechanism is adjusted in place.
The invention provides a six-degree-of-freedom precision adjustment imaging chip assembly structure, which can realize the structural installation layout of an imaging chip, has the advantages of space six-degree-of-freedom precision adjustment, convenient adjustment, high precision and simple structure. The six-degree-of-freedom adjustment comprises translation along an x axis, a y axis and a z axis and rotation around the x axis, the y axis and the z axis in a space rectangular coordinate system O-xyz. The imaging chip component mainly comprises an imaging chip, an imaging processing circuit and a structural support piece, and adopts a structural function integrated design, so that the size and the weight of the imaging chip component can be effectively controlled, and high-precision assembly and adjustment work can be conveniently carried out.
Drawings
FIG. 1 is a perspective view of a six-dimensional precision adjustment mechanism of an imaging chip;
FIG. 2 is a perspective view of an imaging chip assembly;
FIG. 3 is a schematic diagram of three-dimensional fine adjustment of an imaging chip;
FIG. 4 is a schematic diagram of fine adjustment of imaging translation and rotation;
FIG. 5 is a perspective view of a chip structure;
FIG. 6 is a perspective view of a translational rotational adjustment member;
FIG. 7 is a schematic view of the engagement between the chip structural member (51) and the axial hole of the translational and rotational adjustment member (40);
FIG. 8 is a perspective view of a translation adjustment screw;
FIG. 9 is a perspective view of an imaging base;
FIG. 10 is a perspective view of an imaging plate;
fig. 11 is a perspective view of the light shielding plate.
Detailed Description
In order to make the objects, contents, and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention will be made in conjunction with the accompanying drawings and examples.
Fig. 1 is a perspective view of an imaging chip six-dimensional precision adjustment mechanism, fig. 2 is a perspective view of an imaging chip assembly, fig. 3 is a schematic view of three-dimensional precision adjustment of an imaging chip, fig. 4 is a schematic view of imaging translation and rotation precision adjustment, fig. 5 is a perspective view of a chip structure, fig. 6 is a perspective view of translation and rotation adjustment, fig. 7 is a schematic view of matching between a chip structure (51) and a translation and rotation adjustment (40) with an axial hole, fig. 8 is a perspective view of a translation adjustment screw, fig. 9 is a perspective view of an imaging base, fig. 10 is a perspective view of an imaging support plate, fig. 11 is a perspective view of a light shielding plate, and as shown in fig. 1 to fig. 3, a six-degree-of-freedom precision adjustment: the imaging device comprises an imaging base (10), an imaging support plate (11), a light screen (12), a translational rotary adjusting piece (13), a rotary support rod (14), a translational adjusting screw (15), a rotary adjusting screw (16), a translational rotary adjusting piece fixing screw (44), a positioning pin (43), an adjusting gasket, a chip structural piece (51), an imaging chip (52), an imaging pretreatment circuit board (53), a chip fixing screw (54), a circuit board fixing screw (55), a circuit board support column (56), an optical filter, adhesive glue and a chip structural piece fixing screw.
As shown in fig. 1 to 3, the imaging apparatus includes an imaging base (10), an imaging support plate (20), a light shielding plate (30), a translational and rotational adjustment member (40), an imaging chip assembly (50) (including a chip structural member (51), an imaging chip (52), an imaging preprocessing circuit board (53), a chip fixing screw (54), a circuit board fixing screw (55), a circuit board pillar (56)), a first translational adjustment screw (11), a second translational adjustment screw (12), a third translational adjustment screw (13), a first rotational adjustment screw (14), a second rotational adjustment screw (15), a rotational connection member (16), an imaging support plate fixing screw (21), a light shielding plate fixing screw (31), a first three-dimensional adjustment screw (41), a second three-dimensional adjustment screw (42), a positioning pin (43), and a translational and rotational adjustment member fixing screw (44). The first translation adjusting screw (11), the second translation adjusting screw (12), the third translation adjusting screw (13), the first rotation adjusting screw (14), the second rotation adjusting screw (15) and the rotation connecting piece (16) belong to an adjusting tool, and the imaging chip is detached after being precisely adjusted.
As shown in fig. 2, the imaging chip assembly (50) is mainly composed of a chip structure (51), an imaging chip (52) and an imaging preprocessing circuit board (53), and the fine adjustment of the imaging chip (52) is the fine adjustment of the imaging chip assembly (50). Bonding formation of image chip (52) to chip structure spare (51) through epoxy structure glue, through the chip contact pin with formation of image chip (52) welding to formation of image preliminary treatment circuit board (53), through 4 circuit board set screw (55) and 4 circuit board pillar (56) with formation of image preliminary treatment circuit board (53) be connected to chip structure spare (51), through 2 formation of image chip set screw (54) with chip structure spare (51), formation of image chip (52) link together with formation of image preliminary treatment circuit board (53) and constitute formation of image chip subassembly (50). Thereby, the imaging chip (52) is fixedly connected to the chip structural member (51), and the six-dimensional adjustment of the imaging chip (52) is converted into the six-dimensional precise adjustment of the chip structural member (51). The chip structural part (51) is positioned by 2 positioning pins (43) and then connected to the translational rotary adjusting part (40) through three groups of first three-dimensional adjusting screws (41) and second three-dimensional adjusting screws (42). The pan and rotate adjustment (40) is connected to the imaging base (10) by 3 pan and rotate adjustment set screws (44). The light shield (30) is connected to the imaging support plate (20) through 4 light shield fixing screws (31); the imaging plate (20) is connected to the imaging base (10) by 2 imaging plate fixing screws (21).
As shown in fig. 1, 9, 10 and 11, in order to solve the problem of limited installation space in the opto-mechanical system, the imaging support plate (20), the light shielding plate (30) and other parts are designed, and the chip structural member (51) and the translational and rotational adjustment member (40) are made into an inclined surface feature, as shown in fig. 6. The imaging support plate (20) and the imaging base (10) are formed by integral separation, and the internal and external features of the imaging support plate and the imaging base are conformal. The light shield (30) is arranged to eliminate the influence of external stray light entering the light path on the stable imaging of the imaging chip (52),
the six-dimensional spatial position adjustment of the imaging chip (52) is realized by three-dimensional adjustment of a chip structural component (51) and two-position translation and one-dimensional rotation adjustment of a translation rotation adjusting component (40). Namely, the three-dimensional posture adjustment of the chip structural member (51) and the three-dimensional posture adjustment of the translational rotary adjusting member (40) are decomposed. The two are in series structure and independent of each other, and the adjustment sequence of the two can be arranged according to the specific situation of imaging of the imaging chip (52) in the light path.
The three groups of first three-dimensional adjusting screws (41) and the three groups of second three-dimensional adjusting screws (42) are distributed in a triangular mode to form a classic three-support three-pull structure layout, and three-dimensional movement of the chip structural member (51), namely rotation around an X axis and a Y axis and translation along a Z axis, is achieved by adjusting one or more of the three groups of screws, as shown in fig. 3. The axes of the two positioning pins (43) are in the same plane with the center of the imaging chip (52) and are used for limiting X-axis translation and Y-axis translation in the plane and rotation around the Z-axis. The size of the fit clearance of the hole shafts of the two positioning pins is selected, so that the central position of the imaging chip can be changed within a bearable small range during three-dimensional adjustment of the imaging chip. After the adjustment is in place, structural glue is filled in a reserved glue groove between the chip structural part (51) and the translation and rotation adjusting part (40), so that the connection between the chip structural part and the translation and rotation adjusting part is firm, and the position relation does not change along with the influence of vibration, high and low temperature and other environments.
The three groups of first three-dimensional adjusting screws (41) and second three-dimensional adjusting screws (42) are arranged in a triangular mode, and the axes of the two positioning pins (43) and the imaging center of the chip are in the same plane.
The chip structural member (51) and the shaft hole between the translation and rotation adjusting member (40) can be matched to replace two positioning pins (43) to limit the translation of the imaging chip within an bearable range, as shown in fig. 7.
Three adjusting screws which are distributed in a triangular mode in a plane are adopted to realize the precise adjustment of the two-dimensional translation of the translation and rotation adjusting piece (40), and a thread mandril type is adopted to realize the precise adjustment of the one-dimensional rotation of the translation and rotation adjusting piece (40) through the two screws in a butting mode. An appropriate adjusting gap is reserved between the imaging base (10) and the translation and rotation adjusting piece (40) in the radial direction. Three translational adjusting screws (11, 12, 13), a first rotary adjusting screw (14) and a second rotary adjusting screw (15) are arranged in corresponding threaded holes of the imaging base (10), and a rotary connecting piece (16) is arranged in corresponding threaded holes of the translational rotary adjusting piece (40). The two-dimensional translational adjustment of the translational and rotational adjusting piece (40) is realized by adjusting the combination of the three translational adjusting screws, and the one-dimensional rotational adjustment of the translational and rotational adjusting piece (40) is realized by adjusting the first rotational adjusting screw (14) and the second rotational adjusting screw (15). After the translational and rotational adjustment is in place, the translational and rotational adjustment member set screw (44) is locked. The three translation adjusting screws (11, 12 and 13), the first rotation adjusting screw (14), the second rotation adjusting screw (15) and the rotation connecting piece (16) belong to an adjusting tool, and are detached at the moment, so that the translation and rotation accurate adjustment and fixation of the imaging chip are finally realized.
The three translational adjusting screws are distributed in a triangular shape, the end parts of the three translational adjusting screws are spherical structures as shown in fig. 8, and the contact positions of the translational rotating adjusting pieces (40) and the adjusting screws are conical surfaces as shown in fig. 6. According to the force resolution, the force F applied to the translatory rotation structure is resolved into 2 force components, radial and axial, when the translatory adjustment screw is adjusted. The radial component Fx enables the translational and rotational adjustment piece (40) to translate along the radial direction, and the axial component Fz enables the translational and rotational adjustment piece (40) to be well attached to the imaging base (10), so that the imaging chip (52) cannot move axially when the translational and rotational adjustment is carried out, and mutual influence of coupling of position adjustment is avoided.
As shown in fig. 6, the particular included angle α is chosen so that it does not cause self-locking, i.e., the radial component of the force is greater than the friction caused by the axial component, ensuring translational motion.
Meanwhile, the two-dimensional translation, the one-dimensional rotation and the axial position adjustment are independent from each other, as shown in fig. 4. When the three translational adjusting screws are locked, a circle is positioned at three points in the plane, and the translational and rotational adjusting piece (40) can only rotate around the circle center positioned at the three points. The imaging chip (52) is adjusted in a two-dimensional translation manner and then in a rotation manner, and finally the purpose of accurate adjustment is achieved.
Particularly, when the imaging chip assembly is subjected to level adjustment test, the imaging base (10) is a special structural member, and a flange at the tail end of the optical lens barrel can be used as the imaging base (10) in an optical mechanical system, so that the effect of reducing structural components is achieved.
As shown in fig. 3, the processing circuit board (53), the chip fixing screws (54), the circuit board fixing screws (55), the circuit board support (56), etc. are removed, the length direction of the imaging chip (52) is defined as the X axis, the width direction of the imaging chip (52) is defined as the Y axis, the origin is the center point of the image plane of the imaging chip (52), and the Z axis is determined by the right-hand rule. The axes of the two positioning pins (43) and the imaging center of the chip are in the same plane, and the three groups of first three-dimensional adjusting screws (41) and second three-dimensional adjusting screws (42) are arranged in a triangle by taking the origin as the center.
As shown in fig. 4, the imaging chip assembly (50), the light shielding plate (30), etc. are removed, and the origin is defined as the center point of the image plane of the imaging chip (22), the axial direction of the rotary connector (16) is the X-axis, the axial direction of the third translational adjustment screw (13) is the Y-axis, and the Z-axis is determined by the right-hand rule. The three translational adjusting screws are distributed in a triangular shape, the end parts of the three translational adjusting screws are of spherical structures, and the contact positions of the translational rotary adjusting pieces (40) and the adjusting screws are conical surfaces. The rotary connecting piece (16) is arranged in a corresponding threaded hole of the translational rotary adjusting piece (40), and the two rotary adjusting screws are arranged in a butting mode.
As shown in fig. 5, the chip fixing position size of the chip structure (51) is determined according to the size of the imaging chip (22), and a proper gap is left for filling the structure glue.
As shown in fig. 6 and 8, the end of each translational adjusting screw is spherical, the contact position of the translational rotating adjusting piece (40) and the adjusting screw is conical, and the included angle α of the conical surface is reasonably selected so as not to cause self-locking, namely, the radial component of the force is larger than the friction force caused by the axial component, and the translational adjustment, namely the translational adjustment is ensured
FX＝F*sinα
FZ＝F*cosα
FZ*μ<FX
Wherein μ is the coefficient of friction, FZIs an axial component of force F, FXIs the radial component of the force F.
The invention has the beneficial effects that: the invention adopts 2 positioning pins for positioning, three groups of three-dimensional adjusting screws which are distributed in a triangular shape are adopted to realize three-dimensional precise adjustment of the position of the imaging chip, three adjusting screws which are distributed in a triangular shape in a plane are adopted to realize precise adjustment of two-dimensional translation of the imaging chip, and a threaded ejector rod type is adopted to realize precise adjustment of one-dimensional rotation of the imaging chip, thereby realizing six-dimensional precise adjustment of the imaging chip. After the imaging chip is adjusted in place, the glue groove is reserved between the chip structural member and the translation rotation adjusting member, structural glue is filled to ensure that the connection is firm and unchanged, and the imaging chip is firmly fixed in a light path. The invention provides the design of parts such as an imaging support plate, a light screen and the like, and solves the problem of limited installation space of an optical-mechanical system. The invention replaces the traditional adjusting method using the gasket, realizes stepless adjustment and greatly improves the adjusting operation efficiency. Meanwhile, the structure is simple, the adjustment is convenient, and the disassembly and the assembly are easy.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A six-dimensional precision adjusting mechanism of an imaging chip is characterized by comprising:
the imaging chip assembly (50) comprises a chip structural part (51), an imaging chip (52) and an imaging pretreatment circuit board (53), wherein the precise adjustment of the imaging chip (52) is the precise adjustment of the imaging chip assembly (50), the imaging chip (52) is connected with the chip structural part (51), the imaging chip (52) is connected to the imaging pretreatment circuit board (53) through a chip pin, the imaging pretreatment circuit board (53) is connected to the chip structural part (51), the imaging chip (52) and the imaging pretreatment circuit board (53) are connected together to form the imaging chip assembly (50), the imaging chip (52) is fixedly connected to the chip structural part (51), the six-dimensional adjustment of the imaging chip (52) is converted into the six-dimensional precise adjustment of the chip structural part (51), and the chip structural part (51) is positioned through a positioning pin (43), the device is connected to a translational rotary adjusting piece (40) through a first three-dimensional adjusting screw (41) and a second three-dimensional adjusting screw (42), the translational rotary adjusting piece (40) is connected to the imaging base (10) through 3 translational rotary adjusting piece fixing screws (44), and the light shielding plate (30) is connected to the imaging support plate (20) through 4 light shielding plate fixing screws (31); the imaging support plate (20) is connected to the imaging base (10) through 2 imaging support plate fixing screws (21);
three groups of first three-dimensional adjusting screws (41) and second three-dimensional adjusting screws (42) are distributed in a triangular shape, three-dimensional movement of a chip structural member (51) is achieved by adjusting one or more groups of the three groups of screws, the axes of the two positioning pins (43) and the center of the imaging chip (52) are in the same plane and are used for limiting translation of an X axis and a Y axis and rotation around the Z axis in the plane, and the center position of the chip is guaranteed to be changed in a bearable small range during three-dimensional adjustment of the imaging chip through hole shaft fit gaps of the two positioning pins.
2. The imaging chip six-dimensional precision adjustment mechanism according to claim 1, wherein the imaging chip (52) six-dimensional spatial position adjustment is realized by three-dimensional adjustment of the chip structural member (51) and two-dimensional translational and one-dimensional rotational adjustment of the translational and rotational adjustment member (40), which are decomposed into three-dimensional attitude adjustment of the chip structural member (51) and three-dimensional attitude adjustment of the translational and rotational adjustment member (40), and the chip structural member (51) and the translational and rotational adjustment member (40) are mutually connected in series and are mutually independent.
3. The imaging chip six-dimensional precision adjustment mechanism as claimed in claim 1, wherein the imaging support plate (20) and the imaging base (10) are formed by integral separation, the inner and outer features of the imaging support plate are conformal, and the light shielding plate (30) is installed to eliminate the influence of external stray light entering the light path on the stable imaging of the imaging chip (52).
4. The imaging chip six-dimensional precision adjustment mechanism according to claim 1, wherein the imaging chip (52) is bonded to the chip structure (51) by an epoxy structure adhesive.
5. The imaging chip six-dimensional fine adjustment mechanism according to claim 1, wherein the imaging pre-processing circuit board (53) is connected to the chip structural member (51) by 4 circuit board fixing screws (55) and 4 circuit board posts (56).
6. The imaging chip six-dimensional precision adjustment mechanism according to claim 1, wherein the imaging chip assembly (50) is formed by connecting the chip structure (51), the imaging chip (52) and the imaging preprocessing circuit board (53) together by 2 imaging chip fixing screws (54).
7. The imaging chip six-dimensional precision adjustment mechanism according to claim 1, wherein three adjustment screws distributed in a triangular manner in a plane are used for realizing precision adjustment of two-dimensional translation of the translational and rotational adjustment member (40), and a threaded mandril type is used for realizing precision adjustment of one-dimensional rotation of the translational and rotational adjustment member (40) by butting two screws.
8. The imaging chip six-dimensional precision adjustment mechanism according to claim 1, wherein a suitable adjustment gap is radially left between the imaging base (10) and the translational and rotational adjustment member (40). The imaging base is provided with three translation adjusting screws, a first rotation adjusting screw (14) and a second rotation adjusting screw (15), the imaging base (10) corresponds to a threaded hole, a rotation connecting piece (16) is arranged in the translation rotation adjusting piece (40) corresponds to the threaded hole, two-dimensional translation adjustment of the translation rotation adjusting piece (40) is realized by adjusting the combination of the three translation adjusting screws, one-dimensional rotation adjustment of the translation rotation adjusting piece (40) is realized by adjusting the first rotation adjusting screw (14) and the second rotation adjusting screw (15), and after the translation and rotation adjustment are in place, a fixing screw (44) of the translation rotation adjusting piece is locked.
9. The imaging chip six-dimensional precision adjustment mechanism according to claim 1, characterized in that the chip structural member (51) and the translational and rotational adjustment member (40) are matched with each other through an axial hole instead of the two positioning pins (43) to limit the imaging chip to translate within an acceptable range.
10. The six-dimensional precision adjustment mechanism for imaging chips as claimed in claim 1, wherein structural glue is filled in a pre-prepared glue groove between the chip structural member (51) and the translational and rotational adjustment member (40) after the adjustment is in place.
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| CN111766671A (en) * | 2020-07-21 | 2020-10-13 | 上海航天控制技术研究所 | Focal plane assembly adjusting device and method |
| CN112013299A (en) * | 2020-08-17 | 2020-12-01 | 长春理工大学 | Collimating system multidimensional adjusting mechanism for small solar simulator |
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