CN110928340B - Active junction temperature control system and method for power device - Google Patents
Active junction temperature control system and method for power device Download PDFInfo
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- CN110928340B CN110928340B CN201811093735.8A CN201811093735A CN110928340B CN 110928340 B CN110928340 B CN 110928340B CN 201811093735 A CN201811093735 A CN 201811093735A CN 110928340 B CN110928340 B CN 110928340B
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- G05D23/19—Control of temperature characterised by the use of electric means
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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Abstract
The invention provides a power device active junction temperature control system and a power device active junction temperature control method. And the junction temperature control unit calculates and outputs a control quantity to the crusting temperature control link and the shell temperature control link according to the difference value of the real-time junction temperature of the power device and the given junction temperature. And the incrustation temperature control link calculates a traction control signal output to the power device according to the control quantity output by the junction temperature control unit and the traction control input signal, and actively controls the incrustation temperature of the power device. And the shell temperature control link calculates a control value output to the variable frequency water pump according to the control quantity output by the junction temperature control unit, and actively controls the thermal resistance of the radiator by adjusting the water outlet flow of the variable frequency water pump. By applying the invention, the technical problems of the reduction of the integral reliability and the service life of the converter caused by overhigh working average junction temperature level and overlarge junction temperature fluctuation amplitude of the power device can be solved.
Description
Technical Field
The invention relates to the technical field of power electronics, in particular to a power device active junction temperature control system and a power device active junction temperature control method which are used for realizing effective control over the active junction temperature level and the junction temperature fluctuation amplitude of a converter power device by combining incrustation temperature control and radiating link incrustation temperature control technologies.
Background
In recent years, traction converters, which are key equipment in the field of rail transit, have been rapidly developed domestically. A specific application area requires a high reliability of the converter, wherein the reliability of the power converter as a core component of the converter determines the safety of the application. At present, the statistical results of a large number of traction system faults from the rail transit application field show that the converter faults account for a large proportion of the faults of the whole traction system, and the converter faults are largely attributed to power devices of the converter, such as: failure of an Insulated Gate Bipolar transistor (IGBT, abbreviation).
The failure of power devices (such as IGBT) in the application process is eliminated under the influence of thermal cycle stress accumulation and impact in the working process, and the failure is reflected to the thermal characterization parameters of the power devices, corresponding to the working average junction temperature (T) of the devicesm/° c) and junction temperature fluctuation (Δ T)ja/K) range. The component materials of the power device (such as IGBT) are similar to a sandwich stack structure, and in the power output temperature circulation process of the converter, the thermal expansion coefficients of the materials of all layers are different, so that the joint of the materials bears different thermal stress, the performance of the device is degraded after long-term accumulation, and finally the device fails due to material fatigue. In summary, the reliability and the service life of the converter are mainly affected by factors such as a converter control strategy, heat dissipation system control, application conditions and the like. In the prior art, mainly the following documents are relevant to the present application:
the prior art is applied by Chongqing university at 14.01.2015, and is published at 20.05.2015, and the publication number is CN 104635806A. The invention discloses a junction temperature control circuit of a power device and an active thermal management method. The junction temperature of a power device in the converter is adjusted by utilizing the parameter adjustment of the buffer absorption circuit, the functions of temperature rise and temperature reduction can be realized at the same time, the response speed is high, and the junction temperature control of three time scale sections of a switching period, a power frequency period and a low-frequency power fluctuation period can be realized at the same time. The basic principle is as follows: at the moment of turning off the power device, the current originally flowing through the device is transferred to the buffer capacitor channel, so that the rising rate of the voltage of the collector and the emitter is changed, the turn-off loss of the device is reduced, and the junction temperature of the device is reduced. After the power device is switched on, the charges stored on the buffer capacitor are discharged through the absorption circuit and the power device, one part of energy is consumed on the absorption circuit, and the other part of energy is consumed on the device, so that the junction temperature of the device is increased, and the increase and decrease of the junction temperature energy of the power device are realized.
Although the invention can carry out active heat management by adjusting the junction temperature of the power device, the junction temperature of the power device cannot be roughly adjusted by a circuit control mode, and the control quality is not ideal. Meanwhile, the junction temperature control circuit of the power device comprises a buffer capacitor, a charging control circuit and a discharging control circuit, and the charging and discharging control of the buffer capacitor is carried out through the charging control circuit and the discharging control circuit respectively, so that the junction temperature control of the power device is realized. The method has the advantages of complex circuit structure, low junction temperature control precision, slow control speed and long response time.
Disclosure of Invention
In view of this, the present invention aims to provide a system and a method for controlling active junction temperature of a power device, so as to solve the technical problems of the reduction of the overall reliability and the service life of a converter caused by an excessively high working average junction temperature level and an excessively large junction temperature fluctuation amplitude of the power device.
In order to achieve the above object, the present invention specifically provides a technical implementation scheme of an active junction temperature control system of a power device, where the active junction temperature control system of the power device includes: junction temperature control unit, crusting temperature control link, shell temperature control link, power device and radiator. And the junction temperature control unit calculates and outputs control quantity to the crusting temperature control link and the shell temperature control link according to the difference value of the real-time junction temperature of the power device and the given junction temperature. The incrustation temperature control link calculates a traction control signal output to the power device according to the difference value of the real-time junction temperature and the given junction temperature of the power device and the traction control input signal, and reduces the average junction temperature and the junction temperature fluctuation amplitude of the power device by actively controlling the incrustation temperature of the power device. The power device is installed on the radiator, the shell temperature control link calculates and outputs a control value to the variable-frequency water pump according to a difference value between the real-time junction temperature and the given junction temperature of the power device, the heat resistance of the radiator is actively controlled by adjusting the water outlet flow of the variable-frequency water pump, and the average shell temperature and shell temperature fluctuation amplitude of the power device is reduced through shell temperature active control.
Further, the junction temperature control unit obtains and calculates the real-time junction temperature of the power device according to the working current, the working voltage and the shell temperature of the power device.
Further, the junction temperature control unit acquires the shell temperature of the power device by acquiring the substrate temperature of the power device.
Further, the crusting temperature control link further comprises a traction control unit and an SPWM unit, the traction control unit obtains a traction control signal of the power device according to a difference between a real-time junction temperature and a given junction temperature of the power device and a traction control input signal, and the SPWM unit performs SPWM modulation on the traction control signal and outputs the traction control signal to the power device.
Further, the shell temperature control link further comprises a low-pass filtering unit, a heat dissipation control unit and a variable-frequency water pump, the low-pass filtering unit performs curve smoothing on the difference value between the real-time junction temperature and the given junction temperature of the power device and outputs the difference value to the heat dissipation control unit, and the heat dissipation control unit controls the variable-frequency water pump according to the difference value between the real-time junction temperature and the given junction temperature after smoothing so as to adjust the water inflow rate of the heat radiator.
The invention also provides a technical implementation scheme of the active junction temperature control method of the power device, and the active junction temperature control method of the power device comprises the following steps:
s11) calculating a traction control signal output to the power device according to the difference value between the real-time junction temperature and the given junction temperature of the power device and the traction control input signal, and reducing the average junction temperature and the junction temperature fluctuation amplitude of the power device by controlling the active crusting temperature of the power device in the application process;
s12) calculating a control value output to the variable frequency water pump according to the difference value between the real-time junction temperature and the given junction temperature of the power device, actively controlling the thermal resistance of the radiator by adjusting the water outlet flow of the variable frequency water pump, and actively controlling the shell temperature to reduce the average shell temperature and shell temperature fluctuation amplitude of the power device;
the step S11) and the step S12) are executed in parallel and circularly.
Further, the steps S11) and S12) are preceded by:
and acquiring and calculating the real-time junction temperature of the power device according to the working current, the working voltage and the shell temperature of the power device.
Further, the step S11) includes:
and obtaining a traction control signal of the power device according to the difference value between the real-time junction temperature and the given junction temperature of the power device and a traction control input signal, carrying out SPWM (sinusoidal pulse width modulation) on the traction control signal, outputting the traction control signal to the power device, and carrying out rapid fine adjustment on the temperature between crusts of the power device through traction control.
Further, the step S12) includes:
and after curve smoothing is carried out on the difference value between the real-time junction temperature and the given junction temperature of the power device, the variable frequency water pump is controlled according to the difference value between the real-time junction temperature and the given junction temperature after smoothing so as to adjust the inflow rate of the radiator, and the real-time junction temperature of the power device is roughly adjusted through heat dissipation control.
Further, the shell temperature of the power device is obtained by collecting the substrate temperature of the power device.
By implementing the technical scheme of the power device active junction temperature control system and the power device active junction temperature control method provided by the invention, the following beneficial effects are achieved:
(1) the invention can solve the technical problems that the integral reliability and the service life of the converter are reduced due to overhigh working average junction temperature level and overlarge junction temperature fluctuation amplitude of the power device;
(2) the service life of the converter is prolonged from two aspects, on one hand, from the control angle of a TCU system, on the other hand, from the control angle of a converter heat dissipation system, the junction temperature fluctuation level of a power device can be reduced, and the overall reliability and the service life of the converter are improved;
(3) according to the invention, the junction temperature of the IGBT can be rapidly controlled through the control of the TCU system, the reaction is rapid, the adjusting time is short, the junction temperature is finely adjusted, the control quality can be further ensured through the heat dissipation system, and the junction temperature is coarsely adjusted;
(4) the invention not only optimizes the control strategy, but also carries out active intervention on junction temperature fluctuation of the power device in the application process in a mode of adjusting the thermal resistance of a heat dissipation link of the system from the control angle of a heat dissipation system of the converter, thereby reducing the fluctuation level of the shell temperature of the power device.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, from which other embodiments can be derived by a person skilled in the art without inventive effort.
FIG. 1 is a waveform diagram illustrating junction temperature fluctuations during operation of a prior art power device;
FIG. 2 is a schematic diagram of a life curve of a prior art power device;
fig. 3 is a block diagram of a system architecture of an embodiment of an active junction temperature control system of a power device of the present invention;
fig. 4 is a flowchart of the active junction temperature control method of the power device according to one embodiment of the present invention;
in the figure: the method comprises the following steps of 1-junction temperature control unit, 2-crusting temperature control link, 21-traction control unit, 22-SPWM unit, 3-crusting temperature control link, 31-low pass filtering unit, 32-heat dissipation control unit, 33-variable frequency water pump, 4-power device and 5-heat radiator.
Detailed Description
For reference and clarity, the terms, abbreviations or abbreviations used hereinafter are as follows:
IGBT: an Insulated Gate Bipolar transistor, abbreviated;
SPWM: sinussoid PWM, abbreviation for Sinusoidal pulse width modulation;
TCU: traction Control Unit, short for Traction Control Unit;
Tj: junction Temperature, Junction Temperature of the power device;
Tc: case Temperature, the Case Temperature of the power device;
Tjc: junction toCase Temperature, the Temperature between the crusts of the power device;
frequency conversion water pump: an energy-saving water pump driven by a variable-frequency speed-regulating motor.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, specific embodiments of the active junction temperature control system and method of a power device according to the present invention are shown, and the present invention is further described with reference to the drawings and the specific embodiments.
The reliability and the service life of a power device in the converter are mainly influenced by the comprehensive effects of electric stress, thermal stress and mechanical vibration stress in the working process of the converter. Among them, the thermal stress has the greatest influence on the reliability of the power device. When the converter realizes power output, if power loss exists in a power device (such as an IGBT element, or other power devices), the power loss is reflected as the change of the average junction temperature Tm and junction temperature fluctuation amplitude Δ T of the IGBT along with the change of the application condition, and a waveform schematic diagram thereof is shown in fig. 1. In the figure, the solid black line represents the junction temperature TjCurve as a function of Time (Time), Δ T representing the junction temperature T over a period of TimejOr in terms of temperature rise, TmRepresenting the junction temperature TjAverage value of (a).
High and low junction temperature (i.e. junction temperature T)jAverage value of (A) Tm) And its fluctuation size (i.e. junction temperature T)jFluctuation amplitude of) has a great influence on the reliability and life of the IGBT, TmWhen the control is within a reasonable range, the smaller the Delta T is, the more beneficial the IGBT is. The lifetime of an IGBT is generally characterized by a number of duty cycles. Mean junction temperature TmAnd the influence of the junction temperature fluctuation amplitude Δ T on the service life of the power device 4 can be illustrated by using a service life curve chart provided by an IGBT manufacturer, as shown in fig. 2. Wherein A is a curve of the change of the life cycle times of the power device 4 along with the junction temperature fluctuation amplitude when the average junction temperature value is 90 ℃; b is a curve of the life cycle times of the power device 4 along with the fluctuation amplitude of the junction temperature when the average junction temperature value is 80 ℃; c is a curve of the life cycle times of the power device 4 along with the variation of the junction temperature fluctuation amplitude when the average junction temperature value is 60 ℃; d is a curve of the cycle number of the service life 4 of the power device along with the fluctuation amplitude of the junction temperature when the average junction temperature value is 40 ℃; and E is a curve of the number of life cycles of the power device 4 along with the variation of the junction temperature fluctuation amplitude when the average junction temperature value is 20 ℃.
As can be seen from fig. 2, the average junction temperature T at which the power device 4 operatesmThe higher the number of life cycles Nf of the device. Meanwhile, when the working junction temperature fluctuation amplitude Delta T of the power device 4 is larger, the life cycle number of the device is smaller.
The following specific embodiments of the present invention mainly aim at the influence of thermal stress, and from the perspective of control and heat dissipation, actively intervene on the thermal stress borne by the power device 4, so as to reduce or reduce the influence of the thermal stress on the reliability of the power device 4, thereby prolonging the service life of the whole converter.
Example 1
By the embodiment as shown in fig. 3, the junction temperature fluctuation amplitude Δ T is reduced and the average junction temperature T is averagedmAnd controlling within a reasonable range. An active junction temperature control system of a power device specifically comprises: junction temperature controlThe device comprises a manufacturing unit 1, a crusting temperature control link 2, a crusting temperature control link 3, a power device 4 and a radiator 5. The junction temperature control unit 1 controls the junction temperature T according to the real-time junction temperature of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRAnd calculating and outputting control quantity to the crusting temperature control link 2 and the crusting temperature control link 3. The incrustation temperature control link 2 is used for controlling the link according to the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRAnd traction control input signal PREFCalculating a traction control signal output to the power device 4 by the inter-incrustation temperature T of the power device 4jc(i.e. the temperature of the power device 4 from the junction to the shell, for example, the junction temperature of the power device 4 is 70 ℃, the shell temperature is 50 ℃, the temperature from the junction to the shell is 20 ℃, and the temperature control between the shells is to control the temperature difference between the shells of the power device 4 to be 20 ℃) to carry out active control, so as to reduce the average junction temperature T of the power device 4mAnd junction temperature fluctuation amplitude Delta Tj. The power device 4 is arranged on the radiator 5, and the shell temperature control link 3 is used for controlling the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRCalculating a control value output to the variable frequency water pump 33, actively controlling the thermal resistance of the radiator 5 by adjusting the water outlet flow of the variable frequency water pump 33, and actively controlling the shell temperature to reduce the average shell temperature and shell temperature fluctuation amplitude Delta T of the power device 4c. In the figure, TcShell temperature, I, of IGBTcRepresenting the operating current, V, of the IGBTceRepresents the C-E (collector-emitter) voltage of the IGBT, i.e. the operating voltage of the IGBT, TjREFRepresenting the optimum running junction temperature, T, of the IGBT obtained by the experimentjERRRepresenting the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference of (A), PREFRepresenting the traction control input signal.
Wherein, the junction temperature control unit 1 obtains and feeds back the working current I of the power device 4cOperating voltage VceAnd shell temperature TcCalculating the real-time junction temperature T of the power device 4j. The junction temperature control unit 1 further acquires the shell temperature T of the power device 4 by acquiring the substrate temperature of the power device 4c. Real time junction temperature TjComputingThe specific method of (4) can adopt a table look-up method to pre-establish the corresponding working current I of the power device 4cOperating voltage VceAnd shell temperature TcCorresponding (real-time) junction temperature TjTable (2). When in specific application, the corresponding working current I of the power device 4 is inputcOperating voltage VceAnd shell temperature TcThe corresponding (real-time) junction temperature T of the power device 4 can be obtained by looking up the tablej。
The incrustation temperature control link 2 further comprises a traction control unit 21 and an SPWM unit 22, the traction control unit 21 being dependent on the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRAnd traction control input signal PREFAnd obtaining a traction control signal of the power device 4, and carrying out SPWM modulation on the traction control signal by the SPWM unit 22 and then outputting the traction control signal to the power device 4. The specific method of traction control may employ a real-time junction temperature T according to the power device 4jWith a given junction temperature TjREFDifference value T ofjERRCombined with traction control input signal PREFDynamically adjusting the switching frequency of the power device 4 to change the switching loss of the power device 4, thereby controlling the real-time junction temperature T of the power device 4jAnd through the operating current I of the power device 4cOperating voltage VceAnd shell temperature TcUntil the inter-incrustation temperature T of the power device 4 is continuously corrected and controlledjcAnd controlling the temperature within a preset range. In this embodiment, the inter-junction-shell temperature T of the IGBT element can be rapidly controlled by TCU (Traction Control Unit) system ControljcNot only has quick response and short regulation time, but also can regulate the temperature T between crusts of the IGBT elementjcFine tuning is performed.
The shell temperature control link 3 further comprises a low pass filtering unit 31 and a heat dissipation control unit 32, wherein the real-time junction temperature T of the low pass filtering unit 31 to the power device 4jWith a given junction temperature TjREFDifference value T ofjERRThe curve is smoothed and output to the heat dissipation control unit 32, and the heat dissipation control unit 32 outputs the smoothed real-time junction temperature T to the heat dissipation control unit 32jWith a given junction temperature TjREFDifference value T ofjERRTo frequency conversionThe water pump 33 controls the flow rate of the water supplied to the radiator 5 to adjust the heat radiation. The control quality can be ensured by controlling the heat dissipation system, and the real-time junction temperature T of the power device 4jAnd (4) carrying out coarse adjustment. Since the calculated IGBT junction temperature varies drastically, the curve can be smoothed by the Low Pass Filter unit 31 (i.e., LPF, Low Pass Filter). The temperature of the heat sink 5 is detected, fed back and used for junction temperature control of the power device 4. In this embodiment, the overall control is split into two branches, the goal being to make the real-time junction temperature T of the power device 4jOn one hand, the temperature T between crusts in the overall application process of the power device 4 is implemented through an optimized control strategy from the control angle of the TCU systemjcTo lower the average junction temperature TmAnd junction temperature fluctuation amplitude DeltaT. On the other hand, from the control angle of the converter heat dissipation system, active intervention is carried out on shell temperature fluctuation in the application process of the power device 4 in a mode of actively adjusting the thermal resistance of a system heat dissipation link, so that the average shell temperature and shell temperature fluctuation amplitude Delta T of the power device 4 is reducedc。
The active junction temperature control system of the power device described in this embodiment implements the inter-incrustation temperature T during the overall application of the power device through an optimization control strategyjcTo reduce the average junction temperature T of the power device 4mAnd junction temperature fluctuation amplitude DeltaT. In this embodiment, in addition to the optimization control strategy, active intervention is performed on the shell temperature fluctuation of the power device 4 in the application process in a manner of adjusting the thermal resistance of the system heat dissipation link from the control angle of the converter heat dissipation system, so as to reduce the average shell temperature of the power device 4 and the shell temperature fluctuation amplitude Δ Tc. The active junction temperature control system of the power device described in this embodiment achieves life improvement from two aspects, that is, from the perspective of TCU system control on the one hand and from the perspective of converter cooling system control on the other hand, the junction temperature fluctuation level of the power device 4 is reduced, and the overall reliability and life of the converter are improved.
Example 2
As shown in fig. 4, an embodiment of an active junction temperature control method for a power device specifically includes the following steps:
s11) depending on the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRAnd traction control input signal PREFCalculating the traction control signal output to the power device 4 by the temperature T between crusts in the process of applying the power device 4jcActive control is carried out to reduce the average junction temperature T of the power device 4mAnd junction temperature fluctuation amplitude Delta Tj；
S12) depending on the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRCalculating a control value output to the variable frequency water pump 33, actively controlling the thermal resistance of the radiator 5 by adjusting the water outlet flow of the variable frequency water pump 33, and actively controlling the shell temperature to reduce the average shell temperature and shell temperature fluctuation amplitude Delta T of the power device 4c；
Step S11) and step S12) are executed in parallel and in a loop.
Further comprising, before step S11) and step S12):
obtaining and according to the operating current I of the power device 4cOperating voltage VceAnd shell temperature TcCalculating the real-time junction temperature T of the power device 4j. As a typical embodiment of the present invention, the case temperature T of the power device 4 is further obtained by collecting the substrate temperature of the power device 4c。
Step S11) further includes:
according to the real-time junction temperature T of the power device 4jWith a given junction temperature TjREFDifference value T ofjERRAnd traction control input signal PREFObtaining a traction control signal of the power device 4, carrying out SPWM (sinusoidal pulse Width modulation) on the traction control signal, outputting the traction control signal to the power device 4, and controlling the temperature T between crusts of the power device 4 through tractionjcAnd performing rapid fine adjustment.
Step S12) further includes:
real-time junction temperature T for power device 4jWith a given junction temperature TjREFDifference value T ofjERRAfter curve smoothing, the real-time junction temperature T after the curve smoothing is carried outjWith a given junction temperature TjREFDifference value T ofjERRThe variable frequency water pump 33 is controlled to adjust the water inlet flow of the radiator 5, and the real-time junction temperature T of the power device 4 is controlled through heat dissipationjAnd (4) carrying out coarse adjustment.
When the converter adopts different traction strategies or heat dissipation control strategies, the control effect causes the power consumption, the real-time junction temperature and the junction temperature fluctuation amplitude of the power device to have larger difference, which directly influences the long-term reliability and the service life of the power device. The active junction temperature control method for the power device described in this embodiment can reduce the average junction temperature level of the power device during operation, and can improve the overall reliability and the service life of the converter especially in high-temperature seasons in summer. Meanwhile, the embodiment can reduce the junction temperature fluctuation amplitude of the power device, and particularly can further improve the overall reliability and service life of the converter aiming at the intermittent application scene of the converter and the seasons with large day-night temperature difference change. The embodiment integrates the incrustation temperature control and the heat dissipation link control technology, realizes effective control on the active junction temperature level and the junction temperature fluctuation amplitude of the converter power device, and improves the application reliability and the service life of the power device.
By implementing the technical scheme of the power device active junction temperature control system and method described in the specific embodiment of the invention, the following technical effects can be produced:
(1) the active junction temperature control system and method for the power device, which are described in the specific embodiment of the invention, can solve the technical problems that the overall reliability and the service life of a converter are reduced due to overhigh working average junction temperature level and overlarge junction temperature fluctuation amplitude of the power device;
(2) according to the active junction temperature control system and method for the power device, the service life is prolonged from two aspects, on one hand, from the control angle of a TCU system, on the other hand, from the control angle of a heat dissipation system of the converter, the junction temperature fluctuation level of the power device can be reduced, and the overall reliability and service life of the converter are improved;
(3) according to the power device active junction temperature control system and method described in the specific embodiment of the invention, the junction temperature of the IGBT can be quickly controlled through the control of the TCU system, the reaction is quick, the adjusting time is short, the junction temperature is finely adjusted, the control quality can be further ensured through the heat dissipation system, and the junction temperature is roughly adjusted;
(4) the active junction temperature control system and method for the power device described in the specific embodiment of the invention not only optimize the control strategy, but also implement active intervention on junction temperature fluctuation of the power device in the application process by adjusting the thermal resistance of a system radiating link from the control angle of a converter radiating system, thereby reducing the fluctuation level of the shell temperature of the power device.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner. Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or equivalent modifications, without departing from the spirit and scope of the invention, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (4)
1. A power device active junction temperature control system, comprising: the device comprises a junction temperature control unit (1), a crusting temperature control link (2), a crusting temperature control link (3), a power device (4) and a radiator (5); the junction temperature control unit (1) controls the junction temperature according to the real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) Calculating and outputting control quantity to the crusting temperature control link (2) and the shell temperature control link (3); the crusting temperature control link (2) is based on the real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) And a traction control input signal (P)REF) MeterCalculating a traction control signal to be output to the power device (4) by means of the inter-incrustation temperature (T) of the power device (4)jc) Performing active control to reduce the average junction temperature (T) of the power device (4)m) And junction temperature fluctuation amplitude (Delta T)j) (ii) a The power device (4) is arranged on the radiator (5), and the shell temperature control link (3) is used for controlling the real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) Calculating a control value output to the variable frequency water pump (33), actively controlling the thermal resistance of the radiator (5) by adjusting the water outlet flow of the variable frequency water pump (33), and actively controlling the shell temperature to reduce the average shell temperature and shell temperature fluctuation amplitude (delta T) of the power device (4)c)；
The junction temperature control unit (1) acquires and controls the junction temperature according to the working current (I) of the power device (4)c) Operating voltage (V)ce) And shell temperature (T)c) Calculating a real-time junction temperature (T) of the power device (4)j)；
The incrustation temperature control link (2) further comprises a traction control unit (21) and an SPWM unit (22), the traction control unit (21) being dependent on a real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) And a traction control input signal (P)REF) Obtaining a traction control signal of the power device (4), and carrying out SPWM modulation on the traction control signal by the SPWM unit (22) and then outputting the traction control signal to the power device (4);
the shell temperature control link (3) further comprises a low-pass filtering unit (31), a heat dissipation control unit (32) and a variable-frequency water pump (33), and the real-time junction temperature (T) of the low-pass filtering unit (31) to the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) Outputting the curve smoothed to a heat dissipation control unit (32), wherein the heat dissipation control unit (32) outputs the smoothed curve smoothed to a heat dissipation control unit (32) according to the smoothed real-time junction temperature (T)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) And controlling a variable frequency water pump (33) to adjust the water inlet flow of the radiator (5).
2. According to claimThe active junction temperature control system of the power device is characterized in that: the junction temperature control unit (1) acquires the shell temperature (T) of the power device (4) by acquiring the substrate temperature of the power device (4)c)。
3. A method for controlling the active junction temperature of a power device is characterized by comprising the following steps:
s11) according to the real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) And a traction control input signal (P)REF) Calculating a traction control signal output to the power device (4) by an inter-incrustation temperature (T) of the power device (4)jc) Performing active control to reduce the average junction temperature (T) of the power device (4)m) And junction temperature fluctuation amplitude (Delta T)j)；
S12) according to the real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) Calculating a control value output to the variable frequency water pump (33), actively controlling the thermal resistance of the radiator (5) by adjusting the water outlet flow of the variable frequency water pump (33), and actively controlling the shell temperature to reduce the average shell temperature and shell temperature fluctuation amplitude (delta T) of the power device (4)c)；
The step S11) and the step S12) are executed in parallel and circularly;
further comprising, before the step S11) and the step S12):
obtaining and depending on the operating current (I) of the power device (4)c) Operating voltage (V)ce) And shell temperature (T)c) Calculating a real-time junction temperature (T) of the power device (4)j)；
The step S11) further includes:
according to a real-time junction temperature (T) of the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) And a traction control input signal (P)REF) Obtaining a traction control signal of the power device (4), carrying out SPWM (sinusoidal pulse width modulation) on the traction control signal, outputting the traction control signal to the power device (4), and controlling the temperature (between crusts) of the power device (4) through tractionTjc) Performing rapid fine adjustment;
the step S12) further includes:
real-time junction temperature (T) to the power device (4)j) With a given junction temperature (T)jREF) Difference (T) ofjERR) After curve smoothing, the real-time junction temperature (T) after the curve smoothing is obtainedj) With a given junction temperature (T)jREF) Difference (T) ofjERR) Controlling a variable frequency water pump (33) to adjust the inflow of the heat sink (5), controlling the real-time junction temperature (T) of the power device (4) by heat dissipationj) And (4) carrying out coarse adjustment.
4. The active junction temperature control method of claim 3, wherein: acquiring the shell temperature (T) of the power device (4) by acquiring the substrate temperature of the power device (4)c)。
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