CN110927499A - Radio frequency integrated circuit near field electromagnetic compatibility test equipment and test method thereof - Google Patents
Radio frequency integrated circuit near field electromagnetic compatibility test equipment and test method thereof Download PDFInfo
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- CN110927499A CN110927499A CN201911258003.4A CN201911258003A CN110927499A CN 110927499 A CN110927499 A CN 110927499A CN 201911258003 A CN201911258003 A CN 201911258003A CN 110927499 A CN110927499 A CN 110927499A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
- G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention relates to a radio frequency integrated circuit near field electromagnetic compatibility test device and a test method thereof, comprising a near field probe, an electromagnetic shielding shell and a tested circuit mounting platform, wherein the electromagnetic shielding shell is in a rectangular cavity structure and is opened and closed by a top cover; the near-field probe is vertically fixed below a probe cable hole in the top cover and used for receiving or transmitting electromagnetic interference signals. Testing the near field emission electromagnetic interference of the integrated circuit to obtain the interference range and intensity of the tested radio frequency integrated circuit to the external radiation electromagnetic interference; and testing the near-field electromagnetic sensitivity of the radio frequency integrated circuit to obtain the interfered range and the sensitivity threshold of the tested radio frequency integrated circuit. The invention can be used for testing the near-field emission electromagnetic interference and the near-field electromagnetic sensitivity of the radio frequency integrated circuit.
Description
Technical Field
The invention relates to the field of electromagnetic compatibility test equipment, in particular to radio frequency integrated circuit near field electromagnetic compatibility test equipment and a test method thereof, which are used for testing near field emission electromagnetic interference and near field electromagnetic sensitivity of a radio frequency integrated circuit near field electromagnetic compatibility test.
Background
The radio frequency integrated circuit can generate electromagnetic interference to the outside during working due to higher working frequency, and can be influenced by other electromagnetic interference under the same environment. The electromagnetic compatibility of a radio frequency integrated circuit is used to evaluate the capability of the radio frequency integrated circuit to operate satisfactorily in its electromagnetic environment, and the generated electromagnetic interference does not interfere with any electronic devices and circuits in its environment.
With respect to electromagnetic compatibility testing of integrated circuits, the international electrotechnical commission recommends the use of IEC 61967 "integrated circuit electromagnetic emission test" and IEC 62132 "integrated circuit electromagnetic susceptibility test" standards. The IEC 61967 adopts a TEM/GTEM cell method and a near-field scanning method for radiation emission of an integrated circuit, and adopts a 1 omega/150 omega direct coupling method, a Faraday cage method and a magnetic field probe method for conducted emission. IEC 62132 radiation sensitivity to integrated circuits uses the TEM cell test method, the IC electromagnetic sensitivity test method with high current injection, and the IC conduction sensitivity test method with direct RF power injection and faraday cages.
Due to the small power and area of the rf integrated circuit, the electromagnetic interference on its electromagnetic sensitivity is mainly concentrated in the near field region. The standard test equipment only adopts a TEM/GTEM cell method, which has the capability of completing two tests of far-field emission electromagnetic interference and electromagnetic sensitivity, and the other test equipment can only complete one test of radiation or electromagnetic interference and electromagnetic sensitivity. At present, the near field test only uses a near field scanning method, and no test equipment and special test method capable of performing two tests of radio frequency integrated circuit near field transmission electromagnetic interference and near field electromagnetic sensitivity exist.
Disclosure of Invention
Aiming at the conditions and problems in the prior art, the invention provides a radio frequency integrated circuit near field electromagnetic compatibility test device and a test method thereof, which can be used for testing the near field emission electromagnetic interference and the near field electromagnetic sensitivity of the radio frequency integrated circuit.
The technical scheme adopted by the invention is as follows: a radio frequency integrated circuit near field electromagnetic compatibility test equipment, includes near field probe, its characterized in that: the electromagnetic shielding shell is of a rectangular cavity structure and is opened and closed by a top cover, a power supply line hole and a signal line hole are respectively arranged on the side surface of the electromagnetic shielding shell, and a probe cable hole is arranged in the center of the top cover of the electromagnetic shielding shell; the near-field probe is vertically fixed below a probe cable hole in the inner surface of the top cover and is used for receiving or transmitting an electromagnetic interference signal;
the tested circuit mounting table is rectangular and arranged at the bottom in the electromagnetic shielding shell and used for fixing the tested radio frequency integrated circuit board.
A test method for a radio frequency integrated circuit near field electromagnetic compatibility test device is characterized in that the step of testing the radio frequency integrated circuit near field emission electromagnetic interference is as follows:
the method comprises the following steps: opening a top cover of the electromagnetic shielding shell, placing a tested circuit mounting table at the bottom position in the electromagnetic shielding shell, placing a tested radio frequency integrated circuit board on the tested circuit mounting table, and moving the tested circuit mounting table to ensure that a near-field probe is over against the tested radio frequency integrated circuit during testing;
step two: according to the test target, the power line of the tested radio frequency integrated circuit board penetrates out of the power line hole to be connected with a power supply;
step three: covering the top cover of the electromagnetic shielding shell, and penetrating a connecting cable of the near field probe out of a probe cable hole of the top cover to be connected with an external oscilloscope or a frequency spectrograph;
step four: connecting the power supply of the tested radio frequency integrated circuit board and an external oscilloscope or a frequency spectrograph to ensure that the radio frequency integrated circuit works normally, wherein the oscilloscope or the frequency spectrograph receives electromagnetic interference signals radiated outwards by the tested radio frequency integrated circuit through connecting a near field probe;
step five: selecting tested circuit mounting platforms with different heights, changing the distance between the near-field probe and the tested radio frequency integrated circuit board, recording the distance between the near-field probe and the tested radio frequency integrated circuit board and the change of a display signal on an oscilloscope or a frequency spectrograph, and obtaining the interference range and the intensity of the tested radio frequency integrated circuit on the external radiation electromagnetic interference;
the steps for testing the near-field electromagnetic sensitivity of the radio frequency integrated circuit are as follows:
the method comprises the following steps: opening a top cover of the electromagnetic shielding shell, placing a tested circuit mounting table at the bottom position in the electromagnetic shielding shell, placing a tested radio frequency integrated circuit board on the tested circuit mounting table, and moving the tested circuit mounting table to ensure that a near-field probe is over against the tested radio frequency integrated circuit during testing;
step two: according to a test target, a power line of the tested radio frequency integrated circuit board penetrates out of a power line hole to be connected with a power supply, and a monitored cable of the tested radio frequency integrated circuit board penetrates out of a signal line hole to be connected with an oscilloscope or a frequency spectrograph;
step three: covering the top cover of the electromagnetic shielding shell, penetrating a connecting cable of the near field probe out of a probe cable hole of the top cover to be connected with an external radio frequency signal generator, and transmitting an electromagnetic interference signal to a radio frequency integrated circuit to be detected by the radio frequency signal generator;
step four: switching on the power supply of the tested radio frequency integrated circuit board and the oscilloscope or the frequency spectrograph, observing the oscilloscope or the frequency spectrograph, and recording a signal on the oscilloscope or the frequency spectrograph when no external electromagnetic interference exists;
step five: switching on an external radio frequency signal generator power supply, setting the frequency and power of a signal generated by a radio frequency generator, radiating electromagnetic interference to the radio frequency integrated circuit to be tested by a near field probe, observing a signal displayed by an oscilloscope or a frequency spectrograph, namely observing whether the signal characteristic of the oscilloscope changes or whether the signal frequency of the frequency spectrograph appears in the radio frequency signal frequency emitted by the near field probe, determining whether the radio frequency integrated circuit to be tested is interfered, and if the signal characteristic of the oscilloscope changes or the signal frequency spectrum of the frequency spectrograph appears in the radio frequency signal frequency emitted by the near field probe, determining that the radio frequency integrated circuit to be tested is interfered and recording;
step six: regulating the signal frequency and power of an external radio frequency signal generator according to the electromagnetic interference type existing in the environment where the radio frequency integrated circuit to be detected is located, and repeating the step five to obtain the near field electromagnetic sensitivity threshold of the radio frequency integrated circuit to be detected;
step seven: selecting the tested circuit mounting tables with different heights, changing the distance between the near-field probe and the tested radio frequency integrated circuit, repeating the steps from the first step to the sixth step, observing whether the signals on the oscilloscope or the frequency spectrograph are interfered, and determining the interfered range and the sensitivity threshold of the tested radio frequency integrated circuit.
The invention has the beneficial effects that:
the testing equipment provided by the invention adopts a near-field probe in an electromagnetic shielding shell according to the Faraday cage electromagnetic shielding principle, is used for shielding the influence of an external electromagnetic field on the test during the near-field emission electromagnetic interference test and the near-field electromagnetic sensitivity test of the radio frequency integrated circuit, provides a new testing environment for the electromagnetic compatibility test of the radio frequency integrated circuit, can complete the near-field emission electromagnetic interference test and the near-field electromagnetic sensitivity test of the radio frequency integrated circuit, and fills the defect of the near-field electromagnetic compatibility test of the radio frequency integrated circuit in the prior art.
The invention can test the near field electromagnetic compatibility of the radio frequency integrated circuit and is used for evaluating the electromagnetic compatibility problem of the structural design of the stacked three-dimensional integrated circuit; the electromagnetic sensitivity margin of the radio frequency integrated circuit can be determined, and the method is used for solving the problem of electromagnetic compatibility in the structural design of the stacked three-dimensional integrated circuit; the method can be used for testing and evaluating the electromagnetic compatibility of the radio frequency integrated circuit and verifying the airworthiness conformity of the electromagnetic compatibility of the general integrated circuit in airborne electronic hardware, and has good application prospect.
Drawings
FIG. 1 is a block diagram of a RF integrated circuit near field EMC test apparatus according to the present invention;
FIG. 2 is a schematic diagram of the connection of the apparatus for performing near field emission EMI testing of RF integrated circuits according to the present invention;
FIG. 3 is a schematic diagram of the connection of the apparatus for performing a near-field electromagnetic sensitivity test of a radio frequency integrated circuit according to the present invention;
FIG. 3 is a schematic diagram of the connection of the apparatus for performing a near-field electromagnetic sensitivity test of a radio frequency integrated circuit according to the present invention;
FIG. 4 is a spectrum diagram of a 74HC138 chip near-field transmission EMI test according to the present invention;
FIG. 5 is a spectrum diagram of a 74HC138 chip near-field electromagnetic sensitivity test according to the present invention.
Detailed Description
As shown in fig. 1, a near-field electromagnetic compatibility testing device for a radio frequency integrated circuit includes a near-field probe 2, an electromagnetic shielding housing 1, and a circuit-under-test mounting table 3.
The electromagnetic shielding shell 1 is of a rectangular cavity structure, the top end of the electromagnetic shielding shell 1 is connected with a top cover 1-1, and the top cover 1-1 is used for opening and closing the electromagnetic shielding shell 1.
The side surface of the electromagnetic shielding shell 1 is respectively provided with a power supply wire hole 1-2 and a signal wire hole 1-3, and the center of a top cover 1-1 of the electromagnetic shielding shell 1 is provided with a probe cable hole 1-4.
The near field probe 2 is arranged below a probe cable hole 1-4 in the top cover 1-1, a joint of the near field probe 2 for connecting a cable is clamped in the probe cable hole 1-4, and the near field probe 2 is vertically fixed on the inner surface of the top cover 1-1 through a probe card or an adhesive tape for receiving or transmitting electromagnetic interference signals.
The tested circuit mounting table 3 is rectangular and arranged at the bottom in the electromagnetic shielding shell 1 and used for fixing the tested radio frequency integrated circuit board 4.
As shown in figures 2 to 5 of the drawings,
a first test method of a near field electromagnetic compatibility test apparatus for a radio frequency integrated circuit,
the method for testing the near-field emission electromagnetic interference of the radio frequency integrated circuit comprises the following steps:
the method comprises the following steps: opening a top cover 1-1 of an electromagnetic shielding shell 1, placing a tested circuit mounting table 3 at the bottom position in the electromagnetic shielding shell 1, placing a tested radio frequency integrated circuit board 4 on the tested circuit mounting table 3, moving the tested circuit mounting table 3, and ensuring that a near-field probe 2 is right opposite to the tested radio frequency integrated circuit during testing;
step two: according to a test target, a power line of a tested radio frequency integrated circuit board 4 penetrates out of a power line hole 1-2 to be connected with a power supply;
step three: covering the top cover 1-1 of the electromagnetic shielding shell 1, and penetrating a connecting cable of the near field probe 2 out of a probe cable hole 1-4 of the top cover 1-1 to be connected with an external oscilloscope or a frequency spectrograph;
step four: connecting the power supply of the tested radio frequency integrated circuit board 4 and an external oscilloscope or a frequency spectrograph to ensure that the radio frequency integrated circuit 4 works normally, and the oscilloscope or the frequency spectrograph receives electromagnetic interference signals radiated outwards by the tested radio frequency integrated circuit through connecting the near field probe 2;
step five: selecting tested circuit mounting platforms 3 with different heights, changing the distance between the near-field probe 2 and the tested radio frequency integrated circuit board 4, recording the distance between the near-field probe 2 and the tested radio frequency integrated circuit board 4 and the change of a display signal on an oscilloscope or a frequency spectrograph, and obtaining the interference range and the intensity of the tested radio frequency integrated circuit on the external radiation electromagnetic interference;
secondly, the steps of testing the near-field electromagnetic sensitivity of the radio frequency integrated circuit are as follows:
the method comprises the following steps: opening a top cover 1-1 of an electromagnetic shielding shell 1, placing a tested circuit mounting table 3 at the bottom position in the electromagnetic shielding shell 1, placing a tested radio frequency integrated circuit board 4 on the tested circuit mounting table 3, moving the tested circuit mounting table 3, and ensuring that a near-field probe 2 is right opposite to the tested radio frequency integrated circuit during testing;
step two: according to a test target, a power line of a tested radio frequency integrated circuit board 4 penetrates out from a power line hole 1-2 to be connected with a power supply, and a monitored cable of the tested radio frequency integrated circuit board 4 penetrates out from a signal line hole 1-3 to be connected with an oscilloscope or a frequency spectrograph;
step three: covering the top cover 1-1 of the electromagnetic shielding shell 1, penetrating a connecting cable of the near field probe 2 out of a probe cable hole 1-4 of the top cover 1-1 to be connected with an external radio frequency signal generator, and transmitting an electromagnetic interference signal to a radio frequency integrated circuit to be tested by the radio frequency signal generator;
step four: switching on the power supply of the tested radio frequency integrated circuit board 4 and the oscilloscope or the frequency spectrograph, observing the oscilloscope or the frequency spectrograph, and recording a signal on the oscilloscope or the frequency spectrograph when no external electromagnetic interference exists;
step five: switching on an external radio frequency signal generator power supply, setting the frequency and power of a signal generated by a radio frequency generator, radiating electromagnetic interference to the radio frequency integrated circuit to be tested by the near field probe 2, observing a signal displayed by the oscilloscope or the frequency spectrograph, namely observing whether the signal characteristic of the oscilloscope changes or whether the signal frequency of the frequency spectrograph appears, wherein the radio frequency integrated circuit to be tested is interfered or not, and if the signal characteristic of the oscilloscope changes or the signal frequency spectrum of the frequency spectrograph appears, the radio frequency integrated circuit to be tested is interfered and recorded;
step six: regulating the signal frequency and power of an external radio frequency signal generator according to the possible electromagnetic interference type in the environment of the radio frequency integrated circuit to be detected, and repeating the step five to obtain the near field electromagnetic sensitivity threshold of the radio frequency integrated circuit to be detected;
step seven: selecting the tested circuit mounting platforms 3 with different heights, changing the distance between the near-field probe 2 and the tested radio frequency integrated circuit, repeating the steps from the first step to the sixth step, observing whether the signals on the oscilloscope or the frequency spectrograph are interfered, and determining the interfered range and the sensitivity threshold of the tested radio frequency integrated circuit.
Example 1:
the steps for testing the near-field emission electromagnetic interference of the radio frequency integrated circuit are as follows:
the method comprises the following steps: opening a top cover 1-1 of an electromagnetic shielding shell 1, placing a tested circuit installation table 3 at the bottom position in the electromagnetic shielding shell 1, placing a tested radio frequency integrated circuit board 4 on the tested circuit installation table 3, moving the tested circuit installation table 3, and ensuring that a near field probe 2 is opposite to a 74HC138 chip on the tested radio frequency integrated circuit board 4;
step two: the power line of the tested radio frequency integrated circuit board 4 and the input cable are both penetrated out from the power line hole 1-2, the power line is connected with an external power supply, and the input cable is connected with a signal generator;
step three: covering the top cover 1-1 of the electromagnetic shielding shell 1, and penetrating a connecting cable of the near field probe 2 out of a probe cable hole 1-4 of the top cover 1-1 to be connected with an external frequency spectrograph;
step four: switching on the power supply of the tested radio frequency integrated circuit board 4, the external frequency spectrograph and the signal generator, and adjusting the external signal generator to enable the input signal frequency of the tested 74HC138 chip to be 23MHz, when the working voltage is 5V, the frequency spectrograph receives the electromagnetic interference frequency spectrum data transmitted by the tested 74HC138 chip and converts the data as shown in FIG. 4, and the strongest frequency spectrum component of the working frequency of the chip 23MHz is 0.0034V;
step five: by changing the height of the tested circuit mounting table 3, namely changing the distance between the near-field probe 2 and the 74HC138 chip to be tested, the signal amplitude corresponding to the working frequency of the 74HC138 chip on the spectrometer is recorded, and the interference range and the intensity of the electromagnetic interference emitted by the 74HC138 chip in the near field can be evaluated.
The steps of testing the near field electromagnetic susceptibility of a radio frequency integrated circuit are as follows:
the method comprises the following steps: opening a top cover 1-1 of an electromagnetic shielding shell 1, placing a tested circuit installation table 3 at the bottom position in the electromagnetic shielding shell 1, placing a tested radio frequency integrated circuit board 4 on the tested circuit installation table 3, moving the tested circuit installation table 3, and ensuring that a near field probe 2 is opposite to a 74HC138 chip on the tested radio frequency integrated circuit board 4;
step two: the power line and the input cable of the tested radio frequency integrated circuit board 4 are both penetrated out from the power line hole 1-2, the power line is connected with an external power supply, the input cable is connected with a signal generator, and the output cable of the tested radio frequency integrated circuit board 4 is penetrated out from the signal line hole 1-3 to be connected with a frequency spectrograph;
step three: covering the top cover 1-1 of the electromagnetic shielding shell 1, penetrating a connecting cable of the near field probe 2 out of a probe cable hole 1-4 of the top cover 1-1 to be connected with an external radio frequency signal generator, and transmitting an electromagnetic interference signal to a 74HC138 chip to be tested by the radio frequency signal generator;
step four: switching on the power supplies of the tested circuit board 4, the external frequency spectrograph and the signal generator, and adjusting the external signal generator to enable the input signal frequency of the 74HC138 chip to be tested to be 23MHz, wherein when the working voltage is 5V, the strongest component of the working frequency 23MHz in the signal spectrogram output by the 74HC138 chip received by the frequency spectrograph is 0.0164V;
step five: the power supply of an external radio frequency signal generator is switched on, the frequency of an electromagnetic interference signal generated by the radio frequency generator is set to be 27MHz, the power is set to be 30dBm, electromagnetic interference is radiated to the 74HC138 chip to be detected by the near field probe 2, a 27MHz component in a signal spectrogram output by the 74HC138 chip to be detected is received by the spectrometer to be 0.0011V, and as shown in FIG. 5, the 74HC138 chip to be detected is interfered.
Step six: adjusting the signal frequency and power of an external radio frequency signal generator, and repeating the step five to obtain a near-field electromagnetic sensitivity threshold value of the 74HC138 chip to be tested;
step seven: selecting the tested circuit mounting tables 3 with different heights, changing the distance between the near-field probe 2 and the tested 74HC138 chip, repeating the steps from the first step to the sixth step, observing whether the signal spectrogram of the spectrometer is interfered, and determining the near-field interference range and the sensitivity threshold of the tested 74HC138 chip.
The height of the circuit installation platform 3 to be tested is determined by the size of the electromagnetic shielding shell 1 and the strength of the transmitting power and the electromagnetic sensitivity of the integrated circuit to be tested, and the height of the circuit installation platform 3 to be tested can be different due to different testing equipment electromagnetic shielding shells 1 and chips 4 to be tested.
Claims (2)
1. A radio frequency integrated circuit near field electromagnetic compatibility test equipment, includes near field probe (2), its characterized in that: the electromagnetic shielding device is characterized by further comprising an electromagnetic shielding shell (1) and a tested circuit mounting table (3), wherein the electromagnetic shielding shell (1) is of a rectangular cavity structure and is opened and closed by a top cover (1-1), a power supply line hole (1-2) and a signal line hole (1-3) are respectively formed in the side face of the electromagnetic shielding shell (1), and a probe cable hole (1-4) is formed in the center of the top cover (1-1) of the electromagnetic shielding shell (1); the near-field probe (2) is vertically fixed below a probe cable hole (1-4) in the inner surface of the top cover (1-1) and used for receiving or transmitting an electromagnetic interference signal;
the tested circuit mounting table (3) is rectangular and arranged at the bottom in the electromagnetic shielding shell (1) and used for fixing the tested radio frequency integrated circuit board (4).
2. A test method using the radio frequency integrated circuit near-field electromagnetic compatibility test apparatus according to claim 1,
the steps for testing the near-field emission electromagnetic interference of the radio frequency integrated circuit are as follows:
the method comprises the following steps: opening a top cover (1-1) of an electromagnetic shielding shell (1), placing a tested circuit mounting table (3) at the bottom position in the electromagnetic shielding shell (1), placing a tested radio frequency integrated circuit board (4) on the tested circuit mounting table (3), moving the tested circuit mounting table (3), and ensuring that a near-field probe (2) is right opposite to the tested radio frequency integrated circuit during testing;
step two: according to a test target, a power line of a tested radio frequency integrated circuit board (4) penetrates out of a power line hole (1-2) to be connected with a power supply;
step three: covering an electromagnetic shielding shell (1) and a top cover (1-1), and penetrating a connecting cable of a near field probe (2) out of a probe cable hole (1-4) of the top cover (1-1) to be connected with an external oscilloscope or a frequency spectrograph;
step four: the power supply of the tested radio frequency integrated circuit board (4) and an external oscilloscope or a frequency spectrograph is switched on, so that the radio frequency integrated circuit (4) works normally, and the oscilloscope or the frequency spectrograph receives electromagnetic interference signals radiated outwards by the tested radio frequency integrated circuit through connecting the near-field probe (2);
step five: selecting tested circuit mounting platforms (3) with different heights, changing the distance between the near-field probe (2) and the tested radio frequency integrated circuit board (4), recording the distance between the near-field probe (2) and the tested radio frequency integrated circuit board (4) and the change of a display signal on an oscilloscope or a frequency spectrograph, and obtaining the interference range and the intensity of the tested radio frequency integrated circuit to external radiation electromagnetic interference;
the steps for testing the near-field electromagnetic sensitivity of the radio frequency integrated circuit are as follows:
the method comprises the following steps: opening a top cover (1-1) of an electromagnetic shielding shell (1), placing a tested circuit mounting table (3) at the bottom position in the electromagnetic shielding shell (1), placing a tested radio frequency integrated circuit board (4) on the tested circuit mounting table (3), moving the tested circuit mounting table (3), and ensuring that a near-field probe (2) is right opposite to the tested radio frequency integrated circuit during testing;
step two: according to a test target, a power line of a tested radio frequency integrated circuit board (4) penetrates out from a power line hole (1-2) to be connected with a power supply, and a monitored cable of the tested radio frequency integrated circuit board (4) penetrates out from a signal line hole (1-3) to be connected with an oscilloscope or a frequency spectrograph;
step three: the electromagnetic shielding shell (1) is well covered by a top cover (1-1), a connecting cable of the near field probe (2) penetrates out of a probe cable hole (1-4) of the top cover (1-1) to be connected with an external radio frequency signal generator, and the radio frequency signal generator transmits an electromagnetic interference signal to a radio frequency integrated circuit to be detected;
step four: connecting a tested radio frequency integrated circuit board (4) and a power supply of the oscilloscope or the frequency spectrograph, observing the oscilloscope or the frequency spectrograph, and recording a signal on the oscilloscope or the frequency spectrograph when no external electromagnetic interference exists;
step five: switching on an external radio frequency signal generator power supply, setting the frequency and power of a signal generated by a radio frequency generator, radiating electromagnetic interference to the radio frequency integrated circuit to be tested by a near field probe (2), observing a signal displayed by an oscilloscope or a frequency spectrograph, namely observing whether the signal characteristic of the oscilloscope changes or whether the signal frequency of the frequency spectrograph appears, wherein the radio frequency integrated circuit to be tested is interfered or not, and if the signal characteristic of the oscilloscope changes or the signal frequency spectrum of the frequency spectrograph appears, the radio frequency integrated circuit to be tested is interfered and recorded;
step six: regulating the signal frequency and power of an external radio frequency signal generator according to the electromagnetic interference type existing in the environment where the radio frequency integrated circuit to be detected is located, and repeating the step five to obtain the near field electromagnetic sensitivity threshold of the radio frequency integrated circuit to be detected;
step seven: selecting the tested circuit mounting tables (3) with different heights, changing the distance between the near-field probe (2) and the tested radio frequency integrated circuit, repeating the steps from the first step to the sixth step, observing whether the signals on the oscilloscope or the frequency spectrograph are interfered, and determining the interfered range and the sensitivity threshold of the tested radio frequency integrated circuit.
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