CN110920012B

CN110920012B - Temperature control device, recording medium, and temperature control method

Info

Publication number: CN110920012B
Application number: CN201910884090.8A
Authority: CN
Inventors: 永田勝史; 久田松润
Original assignee: Matsui Universal Joint Manufacturing Co
Current assignee: Matsui Universal Joint Manufacturing Co
Priority date: 2018-09-19
Filing date: 2019-09-19
Publication date: 2023-02-17
Anticipated expiration: 2039-09-19
Also published as: JP2020044739A; JP7118419B2; CN110920012A

Abstract

The invention provides a temperature control device, a recording medium and a temperature control method capable of quickly making the temperature of a mold reach a target temperature. The temperature control device includes: a first medium circulating unit (10) for circulating a first medium through a first pipe (11); an object temperature detection unit (61) for detecting the temperature of an object (60); a first medium temperature detection unit (13) that detects the temperature of the first medium; a medium target temperature calculation unit (56) for calculating a first target temperature of the first medium on the basis of the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulation unit; and a medium temperature control unit (57) that controls the temperature of the first medium circulated by the first medium circulation unit on the basis of the temperature of the first medium and a first target temperature of the first medium.

Description

Temperature control device, recording medium, and temperature control method

Technical Field

The application relates to a temperature control device, a recording medium, and a temperature control method.

Background

A mold is used in an injection molding machine for injection molding a molded article with a synthetic resin such as plastic. The injection molding mold includes a cavity, which is a space portion filled with molten plastic, and a flow path in which a medium for solidifying the molten plastic and controlling the temperature of the mold flows. In order to improve the accuracy of a molded product, a mold temperature adjusting device is used which accurately adjusts the mold temperature to a desired temperature by a medium.

Jp 2003-145599 a discloses a heating and cooling apparatus in which cold water and hot water are caused to flow through a medium flow path provided in a mold by switching valves, whereby hot water is caused to flow in an injection process, the mold is brought to a high temperature to form a skin layer and foam the skin layer, and the skin layer is solidified by switching the hot water to the cold water, thereby shortening a molding cycle.

Disclosure of Invention

However, in the device disclosed in japanese patent application laid-open No. 2003-145599, when hot water and cold water are switched, hot water and cold water are alternately fed to the temporary water storage tank, and therefore, when the hot water and cold water are switched, a sharp drop in temperature of the hot water and a rise in temperature of the cooling water are suppressed, and the switching can be performed smoothly.

Therefore, it is desirable that the temperature of the mold quickly reaches the set temperature (target temperature).

The present invention has been made in view of the above circumstances, and an object thereof is to provide a temperature control device, a recording medium, and a temperature control method that can quickly bring the temperature of a mold to a target temperature.

The temperature control device controls the temperature of a medium circulating through a pipeline on an object, and comprises a first medium circulating part for circulating a first medium through a first pipeline; an object temperature detection unit for detecting the temperature of the object; a first medium temperature detection unit that detects a temperature of the first medium; a medium target temperature calculating unit that calculates a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulating unit; and a medium temperature control unit that controls the temperature of the first medium circulated by the first medium circulation unit, based on the temperature of the first medium and a first target temperature of the first medium.

A computer-readable non-transitory recording medium of the present application, which records a computer program for causing a computer to control a temperature of a medium circulating through a pipeline on an object, the computer program causing the computer to execute: detecting a temperature of the object; detecting the temperature of the first medium circulating through the first pipeline in the first medium circulating part; calculating a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulation unit; the temperature of the first medium circulated by the first medium circulation unit is controlled based on the temperature of the first medium and a first target temperature of the first medium.

The temperature control method of the present application controls a temperature of a medium circulating through a pipeline in an object, and includes: detecting a temperature of the object; detecting the temperature of the first medium circulating through the first pipeline by the first medium circulating part; calculating a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulation unit; the temperature of the first medium circulated by the first medium circulation unit is controlled based on the temperature of the first medium and a first target temperature of the first medium.

According to the application, the temperature of the die can be quickly reached to the target temperature.

Drawings

Fig. 1 is an explanatory diagram showing an example of the configuration of a temperature control device according to the present embodiment;

fig. 2 is a block diagram showing an example of the configuration of the control unit;

FIG. 3 is a timing chart showing an example of the mold temperature and the opening/closing control of the solenoid valve;

FIG. 4 is a schematic view showing an example of a change in saturated vapor pressure of a medium;

fig. 5 is a timing chart showing an example of pressure control performed by the pressure control unit;

fig. 6 is a block diagram showing an example of mold temperature control performed by the control unit of the present embodiment;

FIG. 7 is a schematic diagram showing an example of calculation of the target medium temperature by the target temperature calculating unit;

FIG. 8 is a schematic view showing an example of temperature control when the temperature of the mold is raised to the holding temperature;

FIG. 9 is a schematic view showing an example of temperature control when the temperature of the mold is raised to a high temperature side temperature;

FIG. 10 is a schematic view showing an example of temperature control when the temperature of the mold is lowered to the holding temperature;

fig. 11 is a flowchart showing an example of a processing procedure of temperature control performed by the temperature control device according to the present embodiment;

fig. 12 is a flowchart showing an example of a processing procedure of temperature control performed by the temperature control device according to the present embodiment;

fig. 13 is a flowchart showing an example of a processing procedure of temperature control performed by the temperature control device according to the present embodiment.

Detailed Description

The present application will be described below with reference to the drawings showing embodiments of the present application. Fig. 1 is an explanatory diagram showing an example of the configuration of the temperature control device of the present embodiment. The temperature control device includes a temperature adjusting unit 100, a valve unit 110, a valve controller 40, and a control portion 50. The temperature control device is a device that rapidly heats and rapidly cools the mold 60 as an object and adjusts the temperature of the mold 60.

The thermostat unit 100 includes a maintaining thermostat 10 as a first medium circulating unit, a high-temperature thermostat 20 as a second medium circulating unit, and a cooling thermostat 30 as a third medium circulating unit. The maintenance thermostat 10 circulates the first medium through the die 60 via a pipe 11 as a first pipe. The temperature of the first medium (first target temperature) may be set to, for example, 60 ℃, but is not limited thereto. The high-temperature thermostat 20 circulates the second medium through the die 60 via a pipe 21 as a second pipe. The temperature of the second medium (second target temperature) may be set higher than the temperature of the first medium, for example, 160 ℃, but is not limited thereto. The cooling thermostat 30 circulates the third medium through the die 60 via a pipe 31 as a third pipe. The temperature of the third medium may be set lower than the temperature of the first medium, for example, 40 ℃, but is not limited thereto. The first medium, the second medium, and the third medium are not different in kind of the medium itself, but for convenience, indicate that the temperatures of the media are different. The medium is, for example, water, but is not limited to water, and may be other media such as oil, alcohol, etc.

The maintenance thermostat 10 includes a heater 14, a pump 16, a pressure sensor 12 that detects the pressure in the pipe passage 11, a temperature sensor 13 that is a first medium temperature detection portion that detects the first medium temperature, a water supply seed cooling solenoid valve 15, and the like. The pipeline 11 is communicated with a water drainage and seed cooling water outlet through a water supply, seed cooling and cooling electromagnetic valve 15. The maintaining temperature controller 10 can circulate a medium for maintaining the temperature of the mold 60 in the injection step.

The high-temperature controller 20 includes a heater 24, a pump 26, a pressure sensor 22 for detecting the pressure in the pipe line 21, a temperature sensor 23 serving as a second medium temperature detecting portion for detecting the temperature of the second medium, a water supply seed cooling electromagnetic valve 25, and the like. The pipeline 21 is communicated with a drainage seed cooling water outlet through a water supply seed cooling electromagnetic valve 25. The high-temperature thermostat 20 can circulate a medium for making the temperature of the mold 60 high to cure the resin (e.g., thermosetting resin) injected into the mold 60.

The cooling thermostat 30 includes a heat exchanger 34, a pump 36, a pressure sensor 32 for detecting the pressure in the pipe 31, a temperature sensor 33 as a third medium temperature detecting unit for detecting the temperature of the third medium, a water supply solenoid valve 35, and the like. The pipeline 31 is communicated with a drainage and seeding cooling water outlet through a water supply electromagnetic valve 35. The cooling thermostat 30 can circulate a medium for rapidly cooling the high-temperature mold 60. A pipeline 39 is connected to the primary side of the heat exchanger 34, and is in communication with the water supply seed cooling water inlet and the drainage seed cooling water outlet. A cooling solenoid valve 37 is provided in the middle of the pipe 39.

The valve controller 40 and the valve unit 110 have functions as a switching portion. The valve unit 110 includes solenoid valves 41 to 49. The electromagnetic valve 41 is provided in the middle of the medium delivery side of the pipe line 11 (the inlet side of the die 60). The electromagnetic valve 42 is provided midway on the medium return side (the outlet side of the die 60) of the pipe 11. The solenoid valve 43 is provided in the middle of the pipe line 18 communicating with the medium delivery side and the medium return side of the pipe line 11. The first medium is circulated in the mold 60 by the maintenance thermostat 10 by opening the

solenoid valves

41 and 42 and closing the solenoid valve 43. Further, by closing the

electromagnetic valves

41 and 42 and opening the electromagnetic valve 43, the supply of the first medium to the mold 60 by the maintenance thermostat 10 can be stopped.

The solenoid valve 44 is provided in the middle of the medium delivery side of the pipe line 21. The solenoid valve 45 is provided midway on the medium return side of the pipe line 21. The solenoid valve 46 is provided in the middle of the pipe line 28 communicating with the medium delivery side and the medium return side of the pipe line 21. The high temperature thermostat 20 circulates the second medium in the mold 60 by opening the

solenoid valves

44, 45 and closing the solenoid valve 46. Further, the supply of the second medium to the mold 60 by the high-temperature thermostat 20 can be stopped by closing the

electromagnetic valves

44 and 45 and opening the electromagnetic valve 46.

The solenoid valve 47 is provided in the middle of the medium delivery side of the pipe line 31. The solenoid valve 48 is provided midway on the medium return side of the pipe line 31. The solenoid valve 49 is provided in the middle of the pipe 38 communicating with the medium delivery side and the medium return side of the pipe 31. The cooling thermostat 30 circulates the third medium through the mold 60 by opening the solenoid valves 47 and 48 and closing the solenoid valve 49. Further, the supply of the third medium to the mold 60 by the cooling thermostat 30 can be stopped by closing the electromagnetic valves 47 and 48 and opening the electromagnetic valve 49.

The medium delivery sides of the

pipelines

11, 21, and 31 are branched into four systems, and the branched pipelines 62 are connected to the inlet sides of the molds 60. The branched pipes 62 are provided with medium delivery valves (not shown) respectively, and the flow rates of the media can be adjusted. Similarly, the medium return side of the

pipes

11, 21, and 31 is also branched into four pipes 63 on the outlet side of the die 60, and each pipe 63 is provided with a medium return valve (not shown) so that the flow rate of the medium can be adjusted. Further, a temperature sensor 65 and a pressure sensor 67 are provided on the medium delivery side of the

pipes

11, 21, 31, and a temperature sensor 66 and a pressure sensor 68 are provided on the medium return side of the

pipes

11, 21, 31. The mold 60 is provided with

temperature sensors

61 and 61 as object temperature detecting portions.

The valve controller 40 can control the opening and closing of the electromagnetic valves 41 to 49 under the control of the control unit 50.

The valve controller 40 can select any one of the line 11, the line 21, and the line 31 to switch the medium circulating in the die 60. For example, the state in which the first medium is circulated by the maintaining temperature controller 10 (mold temperature maintaining state), the state in which the second medium is circulated by the high temperature controller 20 (mold temperature high temperature state), the state in which the third medium is circulated by the cooling temperature controller 30 (mold temperature cooling state), and the state in which the first medium is circulated by the maintaining temperature controller 10 (mold temperature maintaining state) can be repeated in this order.

Thus, when the temperature of the mold 60 is returned from the high temperature (for example, 160 ℃) to the maintained temperature (60 ℃), the temperature of the mold 60 can be rapidly cooled by temporarily switching from the high-temperature adjustment device 20 to the cooling temperature adjustment device 30, and therefore the temperature of the mold 60 can be rapidly brought to the target temperature (maintained temperature).

The temperature adjustment unit 100 includes a pressurizing pump 70 as a pressure supply portion. The booster pump 70 may or may not be frequency-variable controlled. By using the variable frequency control pressurizing pump, the discharge pressure is feedback-controlled, which contributes to energy saving.

The inlet side of the pressure pump 70 is communicated with the feed water seed cooling water inlet, and a temperature sensor 74 and a pressure sensor 76 are provided on the inlet side of the pressure pump 70. The outlet side of the pressure pump 70 is connected to a bypass pipe 71 communicating with a drainage and seed cooling water outlet via a check valve 73. An on-off valve 72 is provided in the middle of the bypass pipe 71. The bypass pipe 71 communicates with the drainage and seeding cooling water outlet side of the

pipes

11, 21, 31.

The outlet side of the pressurizing pump 70 communicates with a pressure pipe 77 through a check valve 73. A pressure sensor 75 is provided on the pressure pipe 77. The pressure pipe 77 is branched into three paths, and the branched pressure pipe 77 communicates with the pipeline 11 (the pipeline 11 between the heater 14 and the pump 16), the pipeline 21 (the pipeline 21 between the heater 24 and the pump 26), and the pipeline 31 (the pipeline 31 between the heat exchanger 34 and the pump 36), respectively. That is, necessary pressures can be applied from one pressurizing pump 70 to the pipeline 11, the pipeline 21, and the pipeline 31 through the three pressure pipes 77, respectively.

Thus, for example, even when the temperature of the medium (for example, water) circulating through any of the pipe lines 11, 21, and 31 becomes high and the medium boils without being pressurized to a pressure equal to or higher than the saturated water vapor pressure of the medium, a required pressure (a pressure equal to or higher than the saturated water vapor pressure) can be applied to the pipe lines 11, 21, and 31 through the pressure pipe 77 by the pressurizing pump 70, and therefore, the medium can be prevented from boiling.

Further, if the pressure pumps are provided in the line 11, the line 21, and the line 31, respectively, the pressures applied to the line 11, the line 21, and the line 31 are different due to different pressure settings or individual differences of the respective pressure pumps, and a pressure difference or pressure fluctuation occurs in the line at the time of switching the media. Therefore, there is a risk that the medium may be instantaneously boiled during the medium switching or that the oxide scale may adhere to the heater or the pump and be damaged. In the present embodiment, since the required pressures are applied to the pipeline 11, the pipeline 21, and the pipeline 31 from one pressurizing pump 70 through the three pressure pipes 77, the pressures can be stabilized without generating a pressure difference or pressure fluctuation in the pipelines at the time of switching the medium. Further, there is no risk of instantaneous boiling of the medium during the switching of the medium, and scale does not adhere to the

heaters

14 and 24, and the

pumps

16, 26, and 36 are not damaged.

Fig. 2 is a block diagram showing an example of the configuration of the control unit 50. The control unit 50 includes a medium temperature acquisition unit 51, a mold temperature acquisition unit 52, a pressure control unit 53, a saturated vapor pressure calculation unit 54, a storage unit 55, a target temperature calculation unit 56, a medium temperature control unit 57, and a switching time adjustment unit 58. The medium temperature control unit 57 includes an electromagnetic valve control unit 571 and a heater control unit 572. The control unit 50 controls the operation of the temperature control device of the present embodiment. Specifically, the opening and closing of the electromagnetic valves 41 to 49 are controlled by the valve controller 40 to set the temperature of the mold 60 to a desired temperature, and the mold 60 is rapidly heated and rapidly cooled.

Fig. 3 is a timing chart showing an example of the temperature of the mold 60 and the open/close control of the electromagnetic valves 41 to 49. As shown in the upper part of fig. 3, the temperature of the mold 60 changes between three temperatures, i.e., a low temperature (e.g., room temperature), a medium temperature (maintenance temperature), and a high temperature. After the injection with the molten resin (for example, liquid resin) is performed at a medium temperature (maintenance temperature, for example, 60 ℃) after the temperature is raised from the low temperature, the solidification (thermosetting) of the molten resin is performed at a high temperature (for example, 160 ℃), and then the mold 60 is maintained at the maintenance temperature again, and the taking out, re-injection, and the like of the molded product are repeated. For convenience, fig. 3 shows a state in which the medium temperature changes and shifts to a low temperature.

At a time before time t1, the

solenoid valves

41, 42, 44, 45, 47, 48 are closed, and the

solenoid valves

43, 46, 49 are opened. In this state, for example, the mediums of the maintaining temperature controller 10, the high temperature controller 20, and the cooling temperature controller 30 are not circulated in the mold 60, and are maintained at a desired temperature.

At time t1, the

solenoid valves

41 and 42 are opened, and the solenoid valve 43 is closed. Thereby, the first medium is circulated in the mold 60 by the maintenance thermostat 10. When the temperature of the mold 60 is maintained at a desired temperature, an injection process is performed.

At time t2, when the injection ends, the

electromagnetic valves

41 and 42 are closed, and the electromagnetic valve 43 is opened. At the same time, the

solenoid valves

44, 45 are opened and the solenoid valve 46 is closed. Thereby, the temperature controller 10 for maintenance is switched to the temperature controller 20 for high temperature, and the temperature controller 20 for high temperature circulates the second medium through the mold 60. Thereby, the mold 60 is rapidly heated to cure the resin.

At time t3, when the resin is cured, the

solenoid valves

44, 45 are closed, and the solenoid valve 46 is opened. At the same time, the solenoid valves 47, 48 are opened and the solenoid valve 49 is closed. Thereby, the high-temperature thermostat 20 is switched to the cooling thermostat 30, and the cooling thermostat 30 circulates the third medium through the mold 60. Thereby, the mold 60 is rapidly cooled.

That is, when the temperature of the mold 60 is returned from the high temperature (second temperature) to the maintained temperature (first temperature), the temperature of the mold 60 can be rapidly cooled by temporarily switching to the cooling thermostat 30, and therefore the temperature of the mold 60 can be rapidly brought to the target temperature (maintained temperature).

At time t4, when the temperature of the mold 60 is in the vicinity of the maintenance temperature, the solenoid valves 47 and 48 are closed, and the solenoid valve 49 is opened. At the same time, the

solenoid valves

41, 42 are opened and the solenoid valve 43 is closed. Thereby, the cooling thermostat 30 is switched to the maintaining thermostat 10, and the maintaining thermostat 10 circulates the first medium through the mold 60. This can maintain the temperature of the mold 60 at the maintenance temperature. In the case of repeated injection molding, the same action is repeated thereafter.

At time t5, the

solenoid valves

41 and 42 are closed and the solenoid valve 43 is opened. Thereby, the temperature of the mold 60 is lowered toward room temperature.

Next, an example of pressurizing so as not to boil the medium will be described.

Fig. 4 is a schematic diagram showing an example of a change in saturated vapor pressure of a medium. In the figure, the vertical axis represents pressure (Pa) and the horizontal axis represents temperature (. Degree. C.). As shown in fig. 4, the saturated vapor pressure of the medium increases with an increase in temperature. For example, when the temperature of the medium rises from 100 ℃ to 160 ℃, since the saturated vapor pressure also increases, the medium (liquid) is about to become vapor and thus boil.

Fig. 5 is a timing chart showing an example of pressure control performed by the pressure control unit 53. The upper part of fig. 5 shows the temperature changes detected by the

temperature sensors

13, 23, and 33. The medium temperature acquisition unit 51 acquires temperature information detected by the

temperature sensors

13, 23, 33, 65, and 66. The mold temperature acquisition unit 52 acquires temperature information detected by the

temperature sensors

61 and 61. As shown in fig. 5, the temperature detected by the temperature sensor 13 is constant at T1, and the temperature detected by the temperature sensor 33 is constant at T3. The detected temperature of the temperature sensor 23 changes as follows: t21 before time T11, T22 at time T12, T22 from time T12 to T13, T23 at time T14, T23 from time T14 to T15, and T21 at time T16. The maximum temperature of the medium was Tmax.

The pressure control unit 53 controls the pressure supplied from the pressurizing pump 70. The pressure control unit 53 controls the pressure to be equal to or higher than the saturated vapor pressure corresponding to the highest temperature among the temperatures at which the respective media circulating through the pipe line 11, the pipe line 21, and the pipe line 31 boil. For example, when the saturated vapor pressure corresponding to the maximum temperature Tmax of the medium is Pmax, the pressure control unit 53 can control the pressure to be equal to or higher than Pmax. This prevents the medium from boiling regardless of the temperature of each medium circulated by the maintenance thermostat 10, the high-temperature thermostat 20, and the cooling thermostat 30.

The pressure control unit 53 can control the pressure to be equal to or higher than the saturated vapor pressure corresponding to the highest temperature among the temperatures of the media detected by the

temperature sensors

13, 23, and 33. For example, when the highest temperature among the temperatures detected by the temperature sensors is T22, the pressure control unit 53 can control the pressure to be equal to or higher than the saturated vapor pressure P22 corresponding to the temperature T22. Thus, the medium can be prevented from boiling regardless of the temperature of the medium circulated by the maintaining temperature controller 10, the high temperature controller 20, and the cooling temperature controller 30.

The saturated vapor pressure calculation unit 54 functions as a calculation unit that repeatedly calculates the maximum saturated vapor pressure among the saturated vapor pressures of the media based on the temperatures of the media repeatedly detected by the

temperature sensors

13, 23, and 33. In this case, the saturated vapor pressure corresponding to the highest temperature among the temperatures detected by the

temperature sensors

13, 23, and 33 may be calculated, or the maximum saturated vapor pressure among the saturated vapor pressures corresponding to the respective temperatures detected by the

temperature sensors

13, 23, and 33 may be calculated.

The pressure control unit 53 can control the pressure to be equal to or higher than the maximum saturated vapor pressure in accordance with the transition of the maximum saturated vapor pressure calculated by the saturated vapor pressure calculation unit 54. As shown in fig. 5, the calculated saturated vapor pressure changes as P21, P22, P23, and P21 according to the change in temperature of the temperature sensor 23. The pressure control unit 53 can control the pressure to a pressure equal to or higher than the maximum saturated vapor pressure of transition. By changing the maximum saturated vapor pressure in accordance with the temperature of the medium, for example, the applied pressure can be changed in accordance with the maximum saturated vapor pressure without always applying a pressure equal to or higher than the predetermined maximum saturated vapor pressure, so that it is not necessary to apply an unnecessary pressure exceeding a necessary pressure, and the safety of the apparatus can be improved.

In addition, when the pressure in the pipe line 11, the pipe line 21, and the pipe line 31 is to be reduced, the pressure can be reduced by the bypass pipe 71 by opening the on-off valve 72 without stopping the pressure pump 70. In addition, since water can also be circulated, the temperature of the pressure pipe 77 can be prevented from rising.

Next, a method of controlling the temperature of the mold 60 by the temperature control device of the present embodiment will be described.

Generally, the temperature of the mold is not controlled to be the temperature of the mold itself, but is controlled to be the temperature of the medium, and as a result, the temperature of the mold after temperature control is brought close to a desired temperature. However, since the response characteristic of the mold to temperature (for example, a temperature time constant is large), even if the temperature of the mold is changed, a delay occurs in the temperature change due to the temperature response characteristic of the mold, and a large temperature difference occurs between the temperature of the mold and the temperature of the medium, so that it is difficult to make the temperature of the mold a desired temperature, and it takes time. In addition, if the feedback control of the medium temperature is enhanced in order to enhance the temperature response characteristic of the die, there is a risk of generating excessive overshoot or undershoot. The present embodiment will be described below.

The target temperature calculation unit 56 has a function as a medium target temperature calculation unit, and calculates a first medium target temperature of the first medium based on the temperature (detected temperature) of the mold detected by the temperature sensor 61 and a first mold target temperature of the mold 60 when the first medium is circulated by the maintenance thermostat 10.

The medium temperature control unit 57 controls the temperature of the first medium circulated by the maintaining temperature regulator 10 based on the temperature of the first medium (medium return temperature) detected by the temperature sensor 66 and the first target medium temperature.

Fig. 6 is a block diagram showing an example of temperature control of the mold 60 by the control unit 50 according to the present embodiment. As shown in fig. 6, the temperature control performed by the control unit 50 uses a multi-loop control method (also referred to as cascade control). As shown in fig. 6, the target temperature calculation section 56 calculates a medium target temperature from the mold temperature (temperature detected by the temperature sensor 61) and the mold target temperature. The medium temperature control unit 57 performs heating of the medium by the

heaters

14 and 24 or cooling of the medium by opening the water supply seed

cooling solenoid valves

15 and 25, based on the target medium temperature and the medium temperature (medium return temperature detected by the temperature sensor 66) calculated by the target temperature calculation unit 56. Specifically, the solenoid valve control portion 571 controls the opening and closing of the water supply and seed cooling

solenoid valves

15 and 25, and the heater control portion 572 controls the opening and closing of the

heaters

14 and 24. Thereby, the medium temperature changes according to the response characteristics of the medium, and when the medium temperature changes, the temperature of the mold 60 changes according to the response characteristics of the mold 60.

In the present embodiment, as in the above-described configuration, the first medium target temperature of the first medium is calculated from the detected temperature of the mold 60 and the first mold target temperature of the mold 60, and the temperature of the first medium is brought close to the calculated first medium target temperature, and therefore, for example, the first medium target temperature of the first medium can be sequentially changed in consideration of the temperature response characteristic of the mold 60. This makes it possible to maintain the temperature of the die 60 at the first die target temperature quickly, without causing excessive overshoot or undershoot.

Fig. 7 is a schematic diagram showing an example of calculation of the target medium temperature by the target temperature calculation unit 56. In fig. 7, the upper graph shows the temperature difference between the mold temperature and the mold target temperature, the solid line shows the case where the mold temperature is higher than the mold target temperature, and the broken line shows the case where the mold temperature is lower than the mold target temperature. The lower graph shows an example of calculation of the target medium temperature, the solid line shows the target medium temperature when the mold temperature is higher than the target mold temperature, and the broken line shows the target medium temperature when the mold temperature is lower than the target mold temperature.

The target temperature calculation unit 56 calculates a medium target temperature that is lower as the temperature difference between the mold temperature shown by the solid line and the mold target temperature is larger, and calculates a medium target temperature that is higher as the temperature difference between the mold target temperature and the mold temperature shown by the broken line is larger. That is, the target temperature calculation unit 56 calculates a medium target temperature that is lower as the temperature difference between the mold temperature and the mold target temperature is larger when the mold temperature is higher than the mold target temperature, and calculates a medium target temperature that is higher as the temperature difference between the mold target temperature and the mold temperature is larger when the mold temperature is lower than the mold target temperature.

As shown in fig. 7, when the mold temperature is higher than the mold target temperature, the medium target temperature is set lower as the absolute value of the temperature difference between the mold temperature and the mold target temperature is larger. For example, when the temperature difference between the mold temperature and the mold target temperature is Δ T1, the target medium temperature is T11, and when the temperature difference between the mold temperature and the mold target temperature is Δ T2 (< Δ T1), the target medium temperature is T12 (> T11). Thereby, the temperature of the medium can be rapidly lowered, so that the temperature of the mold 60 can be rapidly lowered to the mold target temperature.

When the mold temperature is lower than the mold target temperature, the medium target temperature is set higher as the absolute value of the temperature difference between the mold temperature and the mold target temperature is larger. For example, when the temperature difference between the mold temperature and the mold target temperature is Δ T3, the target medium temperature is T13, and when the temperature difference between the mold temperature and the mold target temperature is Δ T4 (< Δ T3), the target medium temperature is T14 (< T13). This can quickly raise the temperature of the medium, and quickly raise the temperature of the mold 60 to the target mold temperature. This enables the temperature of the mold 60 to quickly reach the target temperature.

Next, temperature control when switching the medium supplied to the die 60 will be described.

Fig. 8 is a schematic diagram showing an example of the temperature control when the temperature of the mold 60 is raised to the holding temperature. In the figure, the vertical axis represents temperature, and the horizontal axis represents time. Fig. 8 shows a case where the mold 60 is raised from room temperature to a holding temperature (for example, 60 ℃). The solid line shows the transition of the medium temperature, and the broken line shows the transition of the mold temperature. At time t21, the temperature controller 10 for maintenance is turned from off to on. The high-temperature thermostat 20 and the cooling thermostat 30 are closed. Here, the open state refers to a state in which the medium is supplied to circulate through the mold 60, and the closed state refers to a state in which the medium is not circulated through the mold 60. Specifically, at time t21, the

solenoid valves

41 and 42 are opened, and the solenoid valve 43 is closed.

In the comparative example of fig. 8, a method is adopted in which the temperature of the medium is controlled to a set temperature, and as a result, the temperature of the mold after temperature control is brought close to a desired temperature. Therefore, as shown in fig. 8, although the medium temperature is close to the mold target temperature (maintenance temperature), the mold temperature does not reach the mold target temperature, and a relatively large temperature difference is continuously generated between the mold temperature and the mold target temperature. That is, the relationship between the medium temperature and the mold temperature is not clear, and the mold temperature does not reach the target temperature even if the medium temperature seems to be stable at a constant value.

On the other hand, in the present embodiment, since the medium temperature is cascade-controlled, the medium temperature rapidly reaches the mold target temperature as compared with the comparative example, and the mold temperature is stably maintained at the mold target temperature. That is, in the present embodiment, the relationship between the medium temperature and the mold temperature is clear, and when the medium temperature is stabilized at a constant value, the mold temperature is also stabilized at almost the same temperature.

The medium temperature control unit 57 can store the temperature of the first medium (medium) detected by the temperature sensor 66 in the storage unit 55 as a first medium maintaining temperature (medium maintaining temperature) when the temperature of the mold 60 is within a predetermined range including the mold target temperature. The medium temperature control unit 57 can control the temperature of the first medium to be maintained at the first medium maintaining temperature. It has been previously known how much the temperature of the mold becomes if the medium temperature is set to a certain value, but by storing the first medium maintaining temperature, it is possible to check and record the temperature of the medium required for setting the temperature of the mold 60 to the target temperature when controlling the temperature of the medium.

The medium temperature control unit 57 can control the temperature of the first medium to the first medium maintaining temperature when the maintaining temperature controller 10 circulates the mold in which the first medium is at a predetermined temperature (for example, room temperature). That is, it is sufficient to know how much the target temperature of the medium is set in the temperature raising step of raising the temperature of the mold 60 from the room temperature to the first mold target temperature, and an optimum temperature raising step can be realized. In addition, in the injection molding, if the temperature of the mold 60 is changed when the molten resin (liquid) is injected into the mold 60, the viscosity of the molten resin is changed and the quality of the molded product may be deteriorated.

Fig. 9 is a schematic diagram showing an example of temperature control when the temperature of the mold 60 is raised to the high temperature side temperature. Fig. 9 shows a case where the mold 60 is raised from the holding temperature to a high temperature side temperature (for example, 160 ℃). The solid line shows the transition of the medium temperature, and the broken line shows the transition of the mold temperature. At time t22, the temperature controller for maintenance 10 is turned from on to off, and the temperature controller for high temperature 20 is turned from off to on. Specifically, at time t21, the

solenoid valves

41 and 42 are closed, the solenoid valve 43 is opened, the

solenoid valves

44 and 45 are opened, and the solenoid valve 46 is closed. Even when the temperature of the mold 60 is raised to the high-temperature side temperature, the control unit 50 can use a control method illustrated in fig. 6 and 7, for example.

That is, the target temperature calculation unit 56 calculates the second medium target temperature of the second medium based on the temperature (detected temperature) of the mold detected by the temperature sensor 61 and the second mold target temperature of the mold 60 when the high-temperature regulator 20 circulates the second medium.

The medium temperature control unit 57 controls the temperature of the second medium circulated by the high-temperature regulator 20 based on the temperature of the second medium (medium return temperature) detected by the temperature sensor 66 and the second medium target temperature.

As in the above configuration, the second medium target temperature of the second medium is calculated from the detected temperature of the mold 60 and the second mold target temperature of the mold 60, and the temperature of the second medium is brought close to the calculated second medium target temperature, so that, for example, the second medium target temperature of the second medium can be sequentially changed in consideration of the temperature response characteristic of the mold 60. This makes it possible to maintain the temperature of the die 60 at the second die target temperature quickly, without causing excessive overshoot or undershoot.

As shown in fig. 9, since the medium temperature is cascade-controlled, the mold temperature quickly reaches the mold target temperature, and the mold temperature is stably maintained at the mold target temperature. In the present embodiment, the relationship between the medium temperature and the mold temperature is clear, and when the medium temperature is stabilized at a constant value, the mold temperature is also stabilized at almost the same temperature.

The maintaining thermostat 10 can maintain the temperature of the first medium at the first medium maintaining temperature stored in the storage unit 55, while bypassing the first medium through the pipe 18 and waiting for the first medium.

Fig. 10 is a schematic diagram showing an example of temperature control when the temperature of the mold 60 is lowered to the holding temperature. Fig. 10 shows a case where the mold 60 is rapidly cooled by using the cooling thermostat 30 when the temperature is lowered from the high-temperature side to the holding temperature. The solid line shows the transition of the medium temperature, and the broken line shows the transition of the mold temperature. At time t23, the high-temperature thermostat 20 is turned from on to off, and the cooling thermostat 30 is turned from off to on. Specifically, at time t23, the

solenoid valves

44 and 45 are closed, the solenoid valve 46 is opened, the solenoid valves 47 and 48 are opened, and the solenoid valve 49 is closed.

The valve controller 40 switches from the third medium to the first medium at the time when the required time has elapsed from the switching time. The switching time is a time (time t23 in the example of fig. 10) when the second medium is switched to the third medium.

The switching time adjustment unit 58 functions as an adjustment unit and adjusts the required time. That is, the mold 60 in a high temperature state can be rapidly cooled by switching the second medium of a high temperature (for example, 160 ℃) circulating in the mold 60 to the third medium for cooling (for example, 40 ℃).

The valve controller 40 can maintain the temperature of the mold 60 at the first mold target temperature by switching the third cooling medium circulating through the mold 60 to the first temperature maintaining medium at a timing after the elapse of the required time adjusted by the switching time adjustment unit 58. This makes it possible to maintain the temperature of the die 60 at the first die target temperature quickly and without causing excessive overshoot or undershoot.

Next, a method of adjusting the required time will be described.

In fig. 10, at time t31, the temperature detected by the temperature sensor 61 reaches the first mold target temperature or approaches the first mold target temperature, and the temperature is switched from the cooling thermostat 30 to the maintaining thermostat 10. The switching time adjustment unit 58 stores the temperature (first temperature, for example, indicated by T) of the mold 60 at time T31 in the storage unit 55. In this case, after time t31, a peak (extremely high temperature) of the temperature detected by the temperature sensor 61 occurs as indicated by reference character a. The peak of the temperature shown by reference character a is represented by (T + Δ T). The switching time adjustment unit 58 stores the peak value (T + Δ T) of the temperature of the mold 60 in the storage unit 55.

In the next cycle of the injection molding, the mold 60 in the high temperature state is rapidly cooled by switching the second medium of high temperature (for example, 160 ℃) circulating in the mold 60 to the third medium for cooling (for example, 40 ℃) again. In this case, the switching time adjustment section 58 adjusts the required time based on the temperature T and the peak value (T + Δ T) stored in the storage section 55.

For example, at time T31 when the temperature of the mold 60 in the cooling state in which the third medium for cooling circulates reaches T (for example, 60 ℃), the valve controller 40 switches from the third medium to the first medium for maintaining the temperature. Then, the temperature of the mold 60 reaches an extremely high temperature (T + Δ T) (e.g., 65 ℃). In this case, the switching time adjustment unit 58 adjusts the required time so that the next time the third medium is switched to the first medium is at time T33 when the temperature of the mold reaches (T- Δ T) (i.e., 55 ℃). As a result, as shown by reference character C, the temperature of the die 60 can be quickly brought close to the first die target temperature without generating excessive overshoot or undershoot, and can be maintained at the first die target temperature.

Similarly, at time T32 when the temperature of the mold 60 in the cooling state in which the third medium for cooling circulates reaches T (for example, 60 ℃), the valve controller 40 switches from the third medium to the first medium for maintaining the temperature. Then, the temperature of the mold 60 reaches an extremely low temperature (T- Δ T) (e.g., 55 ℃) as indicated by reference numeral B. In this case, the switching time adjustment unit 58 adjusts the required time so that the next time the third medium is switched to the first medium is at time T33 at which the temperature of the mold reaches (T + Δ T) (i.e., 65 ℃). As a result, as shown by reference character C, the temperature of the die 60 can be quickly brought close to the first die target temperature without generating excessive overshoot or undershoot, and can be maintained at the first die target temperature.

Fig. 11, 12, and 13 are flowcharts showing an example of the processing procedure of the temperature control performed by the temperature control device according to the present embodiment. Hereinafter, the processing main body will be described as the control unit 50 for convenience. The control unit 50 turns on the temperature controller 10 for maintenance (S11), acquires the temperature of the mold 60 (S12), and acquires the temperature of the medium (S13). The control unit 50 calculates a target medium temperature (S14) and performs medium temperature control (S15).

The control unit 50 determines whether or not the temperature of the mold 60 has reached the target temperature (S16), and if the temperature of the mold 60 has not reached the target temperature (no in S16), continues the processing from step S12 onward. When the temperature of the mold 60 reaches the target temperature (yes in S16), the control unit 50 stores the temperature of the medium (S17).

The control unit 50 determines whether or not the valve switching time is reached (S18), and if not (no in S18), continues the processing in step S18. If the valve switching time is "yes" (yes in S18), the control unit 50 closes the temperature controller for maintenance 10 and opens the temperature controller for high temperature 20 (S19).

The control unit 50 acquires the temperature of the mold 60 (S20) and the temperature of the medium (S21). The control unit 50 calculates a target medium temperature (S22) and performs medium temperature control (S23).

The control unit 50 determines whether the temperature of the mold 60 has reached the target temperature (S24), and if the temperature of the mold 60 has not reached the target temperature (no in S24), continues the processing from step S20 onward. When the temperature of the mold 60 reaches the target temperature (yes in S24), the control unit 50 stores the temperature of the medium (S25).

The control unit 50 determines whether or not the valve switching time is reached (S26), and if not (no in S26), continues the process in step S26. If it is the valve switching time (yes in S26), the control unit 50 closes the high temperature thermostat 20 and opens the cooling thermostat 30 (S27).

The control unit 50 determines whether or not the required time has elapsed (S28), and if the required time has not elapsed (no in S28), continues the process in step S28. When the required time has elapsed (yes in S28), the control unit 50 turns off the cooling thermostat 30 and turns on the maintaining thermostat 10 (S29).

The control unit 50 determines whether or not to end the process (S30), and if not (no in S30), continues the processes from step S18 onward. When the process is ended (yes in S30), the control unit 50 turns off the temperature controller 10 for maintenance (S31), and ends the process.

The control unit 50 of the present embodiment can also be implemented using a computer having a CPU (processor), ROM, RAM (memory), and the like. For example, a computer program recorded in a recording medium (for example, an optically readable disk storage medium such as a CD-ROM) can be read by a recording medium reading unit (not shown) and stored in the RAM. The program may be stored in a hard disk (not shown) and stored in the RAM when the computer program is executed. As shown in fig. 11 to 13, the control unit 50 can be realized on a computer by loading a computer program for specifying each processing step into a RAM (memory) included in the computer and executing the computer program by a CPU (processor).

In the above embodiment, the cooling thermostat 30 includes the heat exchanger 34, but is not limited thereto, and may include a heater as in the maintaining thermostat 10 or the high-temperature thermostat 20. In the present embodiment, three temperature control devices are used, but four temperature control devices may be included. Thereby, rapid heating and rapid cooling of the mold can be further achieved.

The temperature control device controls the temperature of a medium circulating through a pipeline on an object, and comprises a first medium circulating part for circulating a first medium through a first pipeline; an object temperature detection unit for detecting the temperature of the object; a first medium temperature detection unit that detects a temperature of the first medium; a medium target temperature calculation unit that calculates a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulation unit; and a medium temperature control unit that controls the temperature of the first medium circulated by the first medium circulation unit based on the temperature of the first medium and a first target temperature of the first medium.

The first medium circulation unit circulates the first medium through the first pipeline to the object. The object includes, for example, a mold. The object temperature detection unit is, for example, a temperature sensor and detects the temperature of the object. The first medium temperature detecting unit is, for example, a temperature sensor, and detects the temperature of the first medium.

The medium target temperature calculation unit calculates a first target temperature of the first medium based on a detected temperature (detected temperature) of the mold (object) and a first target temperature of the mold when the first medium is circulated by the first medium circulation unit. The medium temperature control unit controls the temperature of the first medium circulated by the first medium circulation unit based on the detected temperature (detected temperature) of the first medium and a first target temperature of the first medium.

Generally, the temperature of the mold is not controlled to be the temperature of the mold itself, but is controlled to be the temperature of the medium, and as a result, the temperature of the mold after temperature control is brought close to a desired temperature. However, due to the response characteristics of the mold to temperature (for example, a large temperature time constant), even if the temperature of the mold is changed, a delay occurs in the temperature change due to the temperature response characteristics of the mold, and a large temperature difference occurs between the temperature of the medium and the temperature of the mold. In addition, if the feedback control of the medium temperature is enhanced in order to enhance the temperature response characteristic of the die, there is a risk of generating excessive overshoot or undershoot.

In the present embodiment, as in the above-described configuration, the first target temperature of the first medium is calculated from the detected temperature of the mold and the first target temperature of the mold, and the temperature of the first medium is brought close to the calculated first target temperature of the first medium, so that, for example, the first target temperature of the first medium can be sequentially changed in consideration of the temperature response characteristic of the mold. Thus, the temperature of the die can be quickly brought close to the first target temperature of the die and maintained at the first target temperature without generating excessive overshoot or undershoot.

In the temperature control device according to the present application, the medium target temperature calculation unit calculates the first target temperature that is lower as the temperature difference between the temperature of the object and the first target temperature of the object is larger when the temperature of the object is higher than the first target temperature of the object, and calculates the first target temperature that is higher as the temperature difference between the first target temperature of the object and the temperature of the object is larger when the temperature of the object is lower than the first target temperature of the object.

The medium target temperature calculation unit calculates a first target temperature that is lower as a temperature difference between the temperature of the mold and the first target temperature of the mold is larger, and calculates a first target temperature that is higher as a temperature difference between the first target temperature of the mold and the temperature of the mold is larger. That is, in the case where the temperature of the mold is higher than the first target temperature of the mold, the first target temperature of the medium is set to a lower temperature as the absolute value of the temperature difference between the temperature of the mold and the first target temperature of the mold is larger, and thus the temperature of the medium is rapidly decreased so that the temperature of the mold is rapidly decreased to the target temperature. In addition, when the temperature of the mold is lower than the first target temperature of the mold, the first target temperature of the medium is set to a higher temperature as the absolute value of the temperature difference between the temperature of the mold and the first target temperature of the mold is larger, and thus the temperature of the medium is rapidly raised to rapidly raise the temperature of the mold to the target temperature. This enables the temperature of the mold to quickly reach the target temperature.

The temperature control device according to the present application includes a storage unit that stores the temperature of the first medium detected by the first medium temperature detection unit as a first medium maintaining temperature when the temperature of the object detected by the object temperature detection unit is within a predetermined range including a first target temperature of the object, and the medium temperature control unit controls the temperature of the first medium to be maintained at the first medium maintaining temperature.

When the temperature of the mold detected by the object temperature detection unit is within a predetermined range including a first target temperature of the mold, the temperature of the first medium detected by the first medium temperature detection unit is stored in the storage unit as a first medium maintaining temperature. The medium temperature control unit controls to maintain the temperature of the first medium at a first medium maintaining temperature. It has been known in the past how much the temperature of the mold becomes if the medium temperature is set to a certain value, but by storing the first medium maintaining temperature, it is possible to check and record the temperature of the medium required to set the temperature of the mold to the target temperature when controlling the temperature of the medium.

In the temperature control device according to the present application, the medium temperature control unit may control the temperature of the first medium to the first medium maintaining temperature when the first medium circulation unit circulates the object in which the first medium is at the predetermined temperature.

The medium temperature control unit controls the temperature of the first medium to a first medium maintaining temperature when the first medium circulation unit circulates a mold in which the first medium is at a predetermined temperature. The predetermined temperature is, for example, room temperature. That is, it is sufficient to know how much the target temperature of the medium is set in the temperature raising step of raising the temperature of the mold from the room temperature to the first target temperature, and an optimum temperature raising step can be realized.

The temperature control device of the present application includes: a second medium circulating section for circulating a second medium having a higher temperature than the first medium through a second line; a third medium circulating unit for circulating a third medium having a lower temperature than the first medium through a third line; and a switching unit configured to select one of the first line, the second line, and the third line and switch the medium circulating through the object, wherein the target medium temperature calculation unit calculates a second target temperature of the second medium based on the temperature of the object and the second target temperature of the object when the second medium is circulated in the second medium circulation unit, and the medium temperature control unit controls the temperature of the second medium based on the second target temperature of the second medium and the temperature of the second medium when the switching unit switches from the first medium to the second medium.

The second medium circulating unit circulates a second medium having a higher temperature than the first medium through a second pipe. The third medium circulating unit circulates a third medium having a temperature lower than that of the first medium through a third pipe. For example, it may be: the first medium circulating unit circulates a medium for maintaining the temperature of the mold in the injection step, the second medium circulating unit circulates a medium for maintaining the temperature of the mold at a high temperature in order to cure the injected resin (for example, a thermosetting resin), and the third medium circulating unit circulates a medium for rapidly cooling the high-temperature mold.

The switching unit selects any one of the first, second, and third lines to switch the medium circulating through the mold. For example, a state in which the first medium circulating unit circulates the medium (mold temperature maintaining state), a state in which the second medium circulating unit circulates the medium (mold temperature high-temperature state), a state in which the third medium circulating unit circulates the medium (mold temperature cooling state), and a state in which the first medium circulating unit circulates the medium (mold temperature maintaining state) may be repeated in this order.

The medium target temperature calculation unit calculates a second target temperature of the second medium based on the temperature of the mold and the second target temperature of the mold when the second medium is circulated by the second medium circulation unit. The medium temperature control unit controls the temperature of the second medium based on the second target temperature of the second medium and the temperature of the second medium when the switching unit switches from the first medium to the second medium.

As in the above configuration, the second target temperature of the second medium is calculated from the detected temperature of the mold and the second target temperature of the mold, and the temperature of the second medium is brought close to the calculated second target temperature of the second medium, so that, for example, the second target temperature of the second medium can be sequentially changed in consideration of the temperature response characteristic of the mold. This makes it possible to maintain the temperature of the die at the second target temperature by quickly approaching the second target temperature of the die without causing excessive overshoot or undershoot.

In the temperature control device according to the present invention, the switching unit switches from the third medium to the first medium at a time when a required time elapses from a switching time at which the second medium is switched to the third medium, and the temperature control device includes an adjusting unit that adjusts the required time.

The switching unit switches from the third medium to the first medium at a time when a required time has elapsed since a switching time when the second medium is switched to the third medium. The adjusting section adjusts the required time. That is, the medium circulating through the mold in the high temperature state (mold temperature high temperature state) in which the high temperature second medium circulates can be switched from the second medium to the third medium for cooling, and the mold can be rapidly cooled. At the time when the time required for adjustment has elapsed, the adjustment unit can switch the medium circulating in the mold in the cooling state in which the third medium for cooling circulates from the third medium to the first medium for maintaining the temperature, and maintain the mold at the maintenance temperature (mold temperature maintenance state). This makes it possible to quickly approach the temperature of the die to the first target temperature without causing excessive overshoot or undershoot, and to maintain the temperature at the first target temperature.

In the temperature control device according to the present invention, the switching unit repeats switching from the second medium to the third medium and switching from the third medium to the first medium, and the temperature control device includes: a storage unit that stores a first temperature of the object detected by the object temperature detection unit at a time when the switching unit switches from the third medium to the first medium; and a storage unit that stores the extremely high temperature or the extremely low temperature of the object detected by the object temperature detection unit after switching to the first medium, wherein the adjustment unit adjusts the required time based on the first temperature and a temperature difference between the first temperature and the extremely high temperature or between the first temperature and the extremely low temperature.

The switching unit repeatedly switches from the second medium to the third medium and from the third medium to the first medium. The first temperature of the mold detected by the object temperature detection unit at the time when the switching unit switches from the third medium to the first medium is stored in the storage unit. The extremely high temperature or the extremely low temperature of the mold detected by the object temperature detecting section after switching to the first medium is stored in the storage section. The adjustment unit adjusts the required time on the basis of the first temperature and a temperature difference between the first temperature and the extremely high temperature or between the first temperature and the extremely low temperature.

For example, when the temperature of the mold in a cooling state in which the third medium for cooling circulates reaches T (for example, 60 ℃), the switching unit switches from the third medium to the first medium for maintaining the temperature. The temperature of the mold then reaches an extremely high temperature (T + Δ T) (e.g., 65 ℃). In this case, the adjusting unit adjusts the required time such that the time when the third medium is switched to the first medium next time is the time when the temperature of the mold reaches (T- Δ T) (i.e., 55 ℃). The same applies to very low temperatures. Thus, the temperature of the die can be quickly brought close to the first target temperature of the die without generating excessive overshoot or undershoot, and can be maintained at the first target temperature.

The temperature control device of the present application includes a pressure supply portion that supplies a required pressure through pressure pipes that communicate with the first line, the second line, and the third line, respectively.

The pressure supply portion supplies a required pressure through pressure pipes communicating with the first line, the second line, and the third line, respectively. That is, the first line, the second line, and the third line can be respectively applied with desired pressures through the three pressure pipes from one pressure supply portion. The pressure supply unit is, for example, a pressure pump.

Thus, for example, even when the temperature of the medium (for example, water) circulating through any one of the first pipe line, the second pipe line, and the third pipe line becomes high and the medium boils if the medium is not pressurized to a pressure equal to or higher than the saturated water vapor pressure of the medium, a necessary pressure (a pressure equal to or higher than the saturated water vapor pressure) can be applied by the pressure supply unit, and therefore, the medium can be prevented from boiling.

At least some of the above embodiments may be arbitrarily combined.

Description of the reference numerals

10. Temperature regulator for maintenance

20. Temperature regulator for high temperature

30. Temperature regulator for cooling

34. Heat exchanger

35. Water supply electromagnetic valve

11. 21, 31 pipeline

12. 22, 32 pressure sensor

13. 23, 33 temperature sensor

14. 24 heater

15. Electromagnetic valve for 25 water supply and seed and cooling

16. 26, 36 pumps

18. 28, 38 pipeline

40. Valve controller

41. 42, 43, 44, 45, 46, 47, 48, 49 solenoid valves

50. Control unit

51. Medium temperature acquiring unit

52. Mold temperature acquiring unit

53. Pressure control unit

54. Saturated vapor pressure calculating part

55. Storage unit

56. Target temperature calculating section

57. Medium temperature control unit

571. Electromagnetic valve control unit

572. Heater control unit

58. Switching time adjustment unit

60. Die set

61. 65, 66 temperature sensor

62. 63 pipeline

67. 68 pressure sensor

70. Pressure pump

71. Bypass pipe

72. Opening and closing valve

73. Check valve

74. Temperature sensor

75. 76 pressure sensor

77. Pressure pipe

100. Temperature control unit

110. Valve unit

Claims

1. A temperature control device for controlling the temperature of a medium circulating through a conduit in an object, comprising:

a first medium circulating section for circulating the first medium through the first pipe;

a second medium circulating section for circulating a second medium having a higher temperature than the first medium through a second line;

a third medium circulating section for circulating a third medium having a lower temperature than the first medium through a third line;

a switching unit for selecting one of the first, second, and third pipelines to switch a medium circulating through the object;

an object temperature detection unit for detecting the temperature of the object;

a first medium temperature detection unit that detects a temperature of the first medium;

a medium target temperature calculating unit that calculates a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulating unit; and

a medium temperature control unit that controls a temperature of the first medium circulated by the first medium circulation unit, based on the temperature of the first medium and a first target temperature of the first medium;

controlling the temperature of the medium circulating through the object after temporarily switching the medium circulating through the object from the second medium to the third medium when the temperature of the object is returned from the temperature of the second medium to the temperature of the first medium;

a storage unit configured to store the temperature of the first medium detected by the first medium temperature detection unit as a first medium maintenance temperature when the temperature of the object detected by the object temperature detection unit is within a predetermined range including a first target temperature of the object after switching from the third medium to the first medium;

the medium temperature control unit controls to maintain the temperature of the first medium at the first medium maintaining temperature.

2. A temperature control device for controlling the temperature of a medium circulating through a conduit in an object, comprising:

a second medium circulating section for circulating a second medium having a higher temperature than the first medium through a second pipe;

a third medium circulating unit for circulating a third medium having a lower temperature than the first medium through a third line;

a medium target temperature calculation unit that calculates a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulation unit; and

the medium target temperature calculation unit calculates a second target temperature of the second medium based on the temperature of the object and a second target temperature of the object when the second medium is circulated by the second medium circulation unit;

the medium temperature control unit controls the temperature of the second medium based on the second target temperature of the second medium and the temperature of the second medium when the switching unit switches from the first medium to the second medium.

3. The temperature control device of claim 1,

the medium target temperature calculation unit calculates a first target temperature that is lower as a temperature difference between the temperature of the object and the first target temperature of the object is larger, when the temperature of the object is higher than the first target temperature of the object,

when the temperature of the object is lower than the first target temperature of the object, the medium target temperature calculation unit calculates the first target temperature which is higher as the temperature difference between the first target temperature of the object and the temperature of the object is larger.

4. The temperature control apparatus according to claim 2,

the temperature control device includes a storage unit that stores the temperature of the first medium detected by the first medium temperature detection unit as a first medium maintaining temperature when the temperature of the object detected by the object temperature detection unit is within a predetermined range including a first target temperature of the object,

5. The temperature control device of claim 1,

the medium temperature control unit controls the temperature of the first medium to the first medium maintaining temperature when the first medium circulation unit circulates the object in which the first medium is at the predetermined temperature.

6. The temperature control apparatus according to claim 1,

the switching unit switches from the third medium to the first medium at a time when a required time elapses from a switching time when the second medium is switched to the third medium,

the temperature control device includes an adjusting portion that adjusts the required time.

7. The temperature control apparatus of claim 6,

the switching unit repeats switching from the second medium to the third medium and switching from the third medium to the first medium,

the temperature control device includes:

a storage unit that stores a first temperature of the object detected by the object temperature detection unit at a time when the switching unit switches from the third medium to the first medium; and

a storage unit for storing the extremely high temperature or the extremely low temperature of the object detected by the object temperature detection unit after switching to the first medium,

the adjustment unit adjusts the required time based on the first temperature and a temperature difference between the first temperature and the extremely high temperature or between the first temperature and the extremely low temperature.

8. The temperature control device according to any one of claims 1 to 7,

a pressure supply portion is included that supplies a required pressure through pressure pipes that communicate with the first line, the second line, and the third line, respectively.

9. A non-transitory computer-readable recording medium having a computer program recorded thereon for causing a computer to control a temperature of a medium circulating through a conduit on an object,

the computer program causes a computer to execute:

selecting any one of a first pipe through which a first medium circulates, a second pipe through which a second medium circulates, the temperature of which is higher than that of the first medium, and a third pipe through which a third medium circulates, the temperature of which is lower than that of the first medium, to switch the medium circulating through the object;

detecting a temperature of the object;

detecting the temperature of the first medium circulating through the first pipeline in the first medium circulating part;

calculating a first target temperature of the first medium based on the temperature of the object and a first target temperature of the object when the first medium is circulated by the first medium circulation unit;

controlling the temperature of the first medium circulated by the first medium circulating section based on the temperature of the first medium and a first target temperature of the first medium;

storing the detected temperature of the first medium as a first medium maintaining temperature when the detected temperature of the object is within a predetermined range including a first target temperature of the object after switching from the third medium to the first medium;

to maintain the temperature of the first medium at said first medium maintaining temperature.

10. A non-transitory computer-readable recording medium having recorded thereon a computer program for causing a computer to control a temperature of a medium circulating through a conduit through an object,

the computer program causes a computer to execute:

detecting a temperature of the object;

detecting the temperature of the first medium circulating through the first pipeline by the first medium circulating part;

calculating a second target temperature of the second medium based on the temperature of the object and a second target temperature of the object when the second medium is circulated;

when switching from the first medium to the second medium, the temperature of the second medium is controlled in accordance with the second target temperature of the second medium and the temperature of the second medium.

11. A temperature control method for controlling the temperature of a medium circulating through a conduit in an object, comprising:

detecting a temperature of the object;

12. A temperature control method for controlling the temperature of a medium circulating through a conduit in an object, comprising:

detecting a temperature of the object;

controlling the temperature of the first medium circulated by the first medium circulation unit based on the temperature of the first medium and a first target temperature of the first medium;