CN110919122B - Reflow soldering machine for display card production - Google Patents
Reflow soldering machine for display card production Download PDFInfo
- Publication number
- CN110919122B CN110919122B CN201911100804.8A CN201911100804A CN110919122B CN 110919122 B CN110919122 B CN 110919122B CN 201911100804 A CN201911100804 A CN 201911100804A CN 110919122 B CN110919122 B CN 110919122B
- Authority
- CN
- China
- Prior art keywords
- preheating
- heat dissipation
- pipe
- heat
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a reflow soldering machine for producing a display card, which belongs to the technical field of display card production and comprises two soldering devices arranged side by side, wherein both ends of each soldering device are respectively provided with a preheating mechanism and a heat dissipation mechanism, each preheating mechanism comprises a first preheating component and a second preheating component, the first preheating component and the second preheating component are arranged adjacently, the second preheating component is positioned between the first preheating component and the corresponding soldering device, each heat dissipation mechanism comprises a first heat dissipation component and a second heat dissipation component, the first heat dissipation components and the second heat dissipation components are arranged in sequence, the first heat dissipation components are positioned between the second heat dissipation components and the corresponding soldering devices, a connection component is arranged between each adjacent preheating mechanism and each heat dissipation mechanism, and the upper ends of the two soldering devices are provided with heat storage boxes. The invention can absorb the heat energy of the processed product and preheat other products, thereby saving energy and simultaneously leading the heating of the product to avoid the damage gradually.
Description
Technical Field
The invention relates to the technical field of graphics card production, in particular to a reflow soldering machine for graphics card production.
Background
A reflow soldering machine is needed to be used for welding a circuit board in the production of graphics cards, and a cooling device of the reflow soldering machine is disclosed in Chinese patent No. CN106112191B, and belongs to the technical field of reflow soldering machines. The invention relates to a conveying track, an air cooling device arranged below the conveying track and a water cooling mechanism connected with the air cooling device, wherein the air cooling device comprises an air box, a plurality of fans, an air inlet and an air outlet, the fans are arranged at the air outlet, and the water cooling mechanism comprises a water storage tank, a plurality of cooling pipes, a backflow pipe and a backflow pump; the water storage tank is arranged on one side of the reflow soldering machine and is provided with a water inlet, a water outlet and a heat dissipation device arranged at the water inlet; the cooling pipes are arranged in the air box, one end of each cooling pipe is connected with the water outlet, and the other end of each cooling pipe is connected with the return pipe; the return pipe is connected with the cooling pipe and the water inlet; the heat dissipation device comprises a heat dissipation groove, a rotating shaft arranged at the notch of the heat dissipation groove and a plurality of heat dissipation fins arranged on the rotating shaft; the two side surfaces of the radiating fin are provided with radiating strips. The invention can effectively ensure the cooling speed of the PCB after welding, thereby ensuring the welding quality.
However, the above patent still has the following technical problems in use, and the first patent can rapidly cool the soldered product, but cannot utilize the residual heat energy on the product, thereby resulting in energy waste and failing to achieve the effects of energy saving and environmental protection; secondly, the product needs to enter the equipment before soldering to be heated, the product in a room temperature state directly enters the high-temperature equipment to cause certain influence on the quality of the product, even if the product is heated by partitioning the inside of the equipment step by step, the temperature of the product in each interval is also suddenly changed.
Disclosure of Invention
The invention aims to provide a reflow soldering machine for producing a display card, which aims to solve the technical problems of heat energy waste and sudden temperature change during product heating in the prior art.
The invention provides a reflow soldering machine for producing a display card, which comprises two soldering devices arranged side by side, wherein both ends of each soldering device are provided with a preheating mechanism and a heat dissipation mechanism, the preheating mechanism at one end of one soldering device is arranged side by side with the heat dissipation mechanism at one end of the other soldering device, the heat dissipation mechanism at the other end of the soldering device is arranged side by side with the preheating mechanism at the other end of the other soldering device, each preheating mechanism comprises a first preheating component and a second preheating component, the first preheating component and the second preheating component are arranged adjacently, the second preheating component is positioned between the first preheating component and the corresponding soldering device, each heat dissipation mechanism comprises a first heat dissipation component and a second heat dissipation component, the first heat dissipation component and the second heat dissipation component are arranged in sequence, and the first heat dissipation component is positioned between the second heat dissipation component and the corresponding soldering device, every adjacent preheating mechanism and heat dissipation mechanism all are equipped with coupling assembling between, two the upper end of soldering equipment is equipped with the heat storage tank.
Further, first radiator unit includes first heat dissipation shell, be equipped with first heat dissipation chamber in the first heat dissipation shell, be equipped with the heat absorption pipe in the first heat dissipation chamber, the one end and the heat storage box intercommunication of heat absorption pipe.
Furthermore, the heat absorption pipe comprises a water inlet end, a water outlet end and a plurality of water passing parts arranged from top to bottom, every two adjacent water passing parts are communicated with each other, the water inlet end is positioned outside the first heat dissipation shell, and the water outlet end is communicated with the heat storage tank.
Further, the second heat dissipation assembly comprises a second heat dissipation shell, a cooling pipe and a heat dissipation part, a second heat dissipation cavity is arranged in the second heat dissipation shell, the heat dissipation part is arranged at the upper part of the second heat dissipation cavity and comprises a heat dissipation motor, a driving gear and a driven gear, the heat dissipation motor is vertically arranged at the upper end of the second heat dissipation shell, the output end of the heat dissipation motor is vertically arranged downwards, the driving gear is sleeved on the output end of the heat dissipation motor, the upper part of the second heat dissipation cavity is provided with a heat dissipation frame, the middle part of the heat dissipation frame is provided with a heat dissipation shaft which is rotationally connected with the heat dissipation frame, the driven gear is sleeved at the upper end of the heat dissipation shaft and is in transmission connection with the driving gear through a chain, the lower extreme of heat dissipation axle is equipped with rather than fixed connection's radiator fan, the cooling tube is circuitous setting and the cooling tube is installed in radiator fan's below.
Further, the first preheating assembly comprises a first preheating shell, a first preheating cavity is arranged in the first preheating shell, a first preheating pipe is arranged at the upper end of the first preheating cavity, the first preheating pipe is arranged in a roundabout mode, one end of the first preheating pipe is communicated with one end of the cooling pipe, a first preheating part is arranged on the upper portion of the first preheating pipe, the first preheating part is located above the first preheating pipe, and the structure of the first preheating part is the same as that of the heat dissipation part.
Further, the second preheating assembly comprises a second preheating shell, a second preheating part and a second preheating pipe, a second preheating cavity is formed in the second preheating shell, the second preheating part is arranged on the upper portion of the second preheating cavity, the structure of the second preheating part is identical to that of the heat dissipation part, the second preheating pipe is arranged in a roundabout mode and is located below the second preheating part, one end of the second preheating pipe is communicated with the heat storage box, and the other end of the second preheating pipe extends to the outside of the second preheating shell.
Further, coupling assembling includes connecting pipe and control valve, the one end of connecting pipe and the first heat dissipation chamber intercommunication in the first heat dissipation shell, the other end and the second of connecting pipe preheat the second in the shell and preheat the chamber intercommunication, be equipped with the branch pipe rather than the intercommunication on the connecting pipe, the one end of branch pipe and the first preheating chamber intercommunication in the first shell of preheating, the control valve sets up on the connecting pipe.
Further, the bottom in the heat storage box is equipped with a plurality of heat conduction pole, every the lower extreme of heat conduction pole all contradicts with the soldering equipment that corresponds.
Compared with the prior art, the invention has the beneficial effects that:
firstly, two soldering devices are used simultaneously, a preheating mechanism and a heat dissipation mechanism beside one soldering device are respectively matched with a heat dissipation mechanism and a preheating mechanism beside the other soldering device, the heat dissipation mechanism helps the product to cool and store heat on the product in a heat storage tank, and the product in the preheating mechanism is preheated by the heat storage tank, so that the damage to the product caused by sudden change of the environmental temperature when the product enters the soldering device for heating is avoided; the first heat dissipation assembly and the second heat dissipation assembly are arranged to cool the product part step by step, on one hand, the absorbed temperature of the first heat dissipation assembly can be guaranteed to be higher, and on the other hand, the cooling effect of the product can be guaranteed through the second heat dissipation assembly.
Secondly, the multiple roundabout arrangement of each water passing part can prolong the length of the heat absorbing pipe in the first heat dissipation shell, so that the circulation path of the cooling liquid in the heat absorbing pipe is prolonged, the heat absorption time of the cooling liquid can be prolonged, and the cooling effect is improved.
Thirdly, the air flow blown out by the cooling fan during the operation of the second cooling assembly is firstly cooled through the cooling pipe, and the temperature in the equipment is higher, so that the initial air flow temperature blown out by the cooling fan is too high, and the cooling effect is poor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a partial cross-sectional view of the first embodiment of the present invention;
FIG. 5 is an enlarged view at B in FIG. 4;
fig. 6 is a partial sectional view of the second embodiment of the present invention.
Reference numerals:
the soldering apparatus 1, the preheating mechanism 2, the first preheating assembly 21, the first preheating housing 211, the first preheating chamber 212, the first preheating pipe 213, the second preheating assembly 22, the second preheating housing 221, the second preheating assembly 222, the second preheating pipe 223, the heat dissipation mechanism 3, the first heat dissipation assembly 31, the first heat dissipation housing 311, the first heat dissipation chamber 312, the heat absorption pipe 313, the water inlet 3131, the water outlet 3132, the water passing portion 3133, the second heat dissipation assembly 32, the second heat dissipation housing 321, the cooling pipe 322, the heat dissipation assembly 323, the heat dissipation motor 3231, the driving gear 3232, the driven gear 3233, the heat dissipation frame 3234, the heat dissipation shaft 3235, the heat dissipation fan 3236, the second heat dissipation chamber 324, the connection assembly 4, the connection pipe 41, the control valve 42, the branch pipe 43, the heat storage 5, and the heat conduction rod 6.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 6, an embodiment of the present invention provides a reflow soldering machine for graphics card production, including two soldering apparatuses 1 arranged side by side, where both ends of each soldering apparatus 1 are provided with a preheating mechanism 2 and a heat dissipation mechanism 3, the preheating mechanism 2 at one end of one soldering apparatus 1 is arranged side by side with the heat dissipation mechanism 3 at one end of the other soldering apparatus 1, the heat dissipation mechanism 3 at the other end of the soldering apparatus 1 is arranged side by side with the preheating mechanism 2 at the other end of the other soldering apparatus 1, each preheating mechanism 2 includes a first preheating component 21 and a second preheating component 22, the first preheating component 21 and the second preheating component 22 are arranged adjacently, and the second preheating component 22 is located between the first preheating component 21 and the corresponding soldering apparatus 1, each heat dissipation mechanism 3 includes a first heat dissipation component 31 and a second heat dissipation component 32, the first heat dissipation assembly 31 and the second heat dissipation assembly 32 are sequentially arranged, the first heat dissipation assembly 31 is located between the second heat dissipation assembly 32 and the corresponding soldering equipment 1, a connection assembly 4 is arranged between each adjacent preheating mechanism 2 and each adjacent heat dissipation mechanism 3, and the upper ends of the two soldering equipment 1 are provided with heat storage tanks 5; when the soldering device is used, two soldering devices 1 are used simultaneously, meanwhile, a preheating mechanism 2 and a heat dissipation mechanism 3 beside one soldering device 1 are matched with a heat dissipation mechanism 3 and a preheating mechanism 2 beside the other soldering device 1 respectively, the heat dissipation mechanism 3 helps to cool and store heat on a product in a heat storage box 5, and the product in the preheating mechanism 2 is preheated through the heat storage box 5, so that the damage to the product caused by sudden change of the environmental temperature when the product enters the soldering device 1 for heating is avoided, wherein the preheating mechanism 2 is divided into a first preheating assembly 21 and a second preheating assembly 22 to preheat the product step by step, the temperature of the product can be improved as much as possible by utilizing the absorbed heat energy, and meanwhile, the heating of the product can be gradual and gradual, and the product damage is avoided; the first radiator module 31 and the second radiator module 32 are arranged to cool the product part step by step, so that on one hand, the absorbed temperature of the first radiator module 31 can be higher, and on the other hand, the cooling effect of the product can be ensured through the second radiator module 32.
Specifically, the first heat dissipation assembly 31 includes a first heat dissipation shell 311, a first heat dissipation cavity 312 is disposed in the first heat dissipation shell 311, a heat absorption pipe 313 is disposed in the first heat dissipation cavity 312, and one end of the heat absorption pipe 313 is communicated with the heat storage tank 5; after soldering of the product is completed, the product enters the first heat dissipation cavity 312 in the first heat dissipation shell 311, at this time, the cooling liquid enters the heat absorption pipe 313 and flows in the first heat dissipation cavity 312 along the heat absorption pipe 313, meanwhile, heat exchange is performed with the residual heat on the product, and then the cooling liquid enters the heat storage box 5, so that the product can be cooled and the heat energy can be absorbed for storage.
Specifically, the heat absorbing pipe 313 includes a water inlet end 3131, a water outlet end 3132, and a plurality of water passing portions 3133 arranged from top to bottom, every two adjacent water passing portions 3133 are communicated with each other, the water inlet end 3131 is located outside the first heat dissipating shell 311, and the water outlet end 3132 is communicated with the heat storage tank 5; the many roundabout settings of every portion 3133 that leads to, can prolong the length that the heat-absorbing pipe 313 is located first heat dissipation shell 311, thereby the circulation route of extension coolant liquid in heat-absorbing pipe 313, can increase the heat absorption time of coolant liquid, thereby improve the cooling effect, the setting of a plurality of portions 3133 that lead to, and the coolant liquid flows gradually along a plurality of portions 3133 that lead to from the top down, steam in first heat dissipation shell 311 can wave upwards gradually, the coolant liquid gets into from the top, absorb the remaining heat energy in upper portion, flow downwards gradually after the heat, absorb the higher heat energy of temperature of below gradually, on the one hand, can further improve the refrigerated effect of cooling, on the other hand, can make the coolant liquid temperature after absorbing the heat energy reach the highest, be convenient for subsequent preheating.
Specifically, the second heat dissipation assembly 32 includes a second heat dissipation case 321, a cooling tube 322 and a heat dissipation part 323, a second heat dissipation cavity 324 is disposed in the second heat dissipation case 321, the heat dissipation part 323 is disposed on the upper portion of the second heat dissipation cavity 324, the heat dissipation part 323 includes a heat dissipation motor 3231, a driving gear 3232 and a driven gear 3233, the heat dissipation motor 3231 is vertically disposed on the upper end of the second heat dissipation case 321, an output end of the heat dissipation motor 3231 is vertically disposed downward, the driving gear 3232 is disposed on the output end of the heat dissipation motor 3231, the upper portion of the second heat dissipation cavity 324 is provided with a heat dissipation frame 3234, a heat dissipation shaft 3235 rotatably connected to the heat dissipation frame 3234 is disposed in the middle of the heat dissipation frame 3234, the driven gear 3233 is disposed on the upper end of the heat dissipation shaft 3235, the driven gear 3233 is connected to the driving gear 3232 through chain transmission, and a heat dissipation fan 3236 fixedly connected to the lower end of the heat dissipation shaft 3235 is disposed, the cooling pipe 322 is arranged in a roundabout manner, and the cooling pipe 322 is installed below the cooling fan 3236; when the product after the heat dissipation of first heat dissipation assembly 31 gets into in second heat dissipation shell 321, cooling tube 322 lets in the coolant liquid, and simultaneously, heat dissipation motor 3231 work drives driving gear 3232 and rotates, driving gear 3232 drives driven gear 3233 under the transmission of chain and rotates, and then drive heat dissipation axle 3235 and radiator fan 3236 and rotate, the air current that radiator fan 3236 blew out cools down earlier through cooling tube 322 department, this department is because the temperature is higher in the equipment, the initial air current temperature that radiator fan 3236 blew out can be too high, and then lead to the cooling effect not good, consequently, cool down through cooling tube 322 earlier, can improve the cooling effect when the product is blown to the air current.
Specifically, the first preheating assembly 21 includes a first preheating shell 211, a first preheating cavity 212 is arranged in the first preheating shell 211, a first preheating pipe 213 is arranged at the upper end of the first preheating cavity 212, the first preheating pipe 213 is arranged in a winding manner, one end of the first preheating pipe 213 is communicated with one end of the cooling pipe 322, a first preheating component is arranged at the upper part of the first preheating pipe 213, the first preheating component is located above the first preheating pipe 213, and the structure of the first preheating component is the same as that of the heat dissipation component 323; the cooling liquid that absorbs heat energy through cooling tube 322 enters into first preheating pipe 213 in, simultaneously, blows off the air current through the work of first preheating part towards the product, blows to the product with the heat energy drive of first preheating pipe 213 for the temperature of product improves, tentatively preheats.
Specifically, the second preheating assembly 22 includes a second preheating shell 221, a second preheating part 222 and a second preheating pipe 223, a second preheating cavity is provided in the second preheating shell 221, the second preheating part 222 is provided at the upper part of the second preheating cavity, the structure of the second preheating part 222 is the same as that of the heat radiating part 323, the second preheating pipe 223 is arranged in a winding manner and is located below the second preheating part 222, one end of the second preheating pipe 223 is communicated with the heat storage tank 5, and the other end of the second preheating pipe 223 extends to the outside of the second preheating shell 221; high temperature coolant liquid in the heat storage box 5 gets into the second from second preheating pipe 223 and preheats the intracavity, and the work of second preheating part 222 blows heat energy to the product and carries out further heating for the temperature of work piece further improves, preheats the step-by-step heating of subassembly 22 to the product through first preheating component 21 and second, and the ambient temperature suddenly changes and leads to causing the influence to the product when can avoiding the product to heat.
Specifically, the connection assembly 4 includes a connection pipe 41 and a control valve 42, one end of the connection pipe 41 is communicated with the first heat dissipation chamber 312 in the first heat dissipation shell 311, the other end of the connection pipe 41 is communicated with the second preheating chamber in the second preheating shell 221, a branch pipe 43 communicated with the connection pipe 41 is provided on the connection pipe 41, one end of the branch pipe 43 is communicated with the first preheating chamber 212 in the first preheating shell 211, and the control valve 42 is provided on the connection pipe 41; the connection of the connecting pipe 41 is controlled by the control valve 42, because the temperature in the first heat dissipation chamber 312 is higher than that in the first preheating chamber 212 and the second preheating chamber, and the first preheating assembly 21 and the second preheating assembly 22 in the first preheating chamber 212 and the second preheating chamber form negative pressure when working, so that the hot air in the first heat dissipation chamber 312 can enter the first preheating chamber 212 and the second preheating chamber along the connecting pipe 41 and the branch pipe 43, and the air with heat left in the first heat dissipation chamber 312 enters the first preheating chamber 212 and the second preheating chamber to heat the product.
Specifically, a plurality of heat conducting rods 6 are arranged at the bottom in the heat storage tank 5, and the lower end of each heat conducting rod 6 is abutted against the corresponding soldering equipment 1; the soldering equipment 1 has high surface temperature, can conduct through the heat conducting rod 6 and further absorbs heat and preserves heat through the heat storage tank 5.
The working principle of the invention is as follows: two tin soldering devices 1 work simultaneously, after soldering of a product is completed, the product enters a first heat dissipation cavity 312 in a first heat dissipation shell 311, at the moment, cooling liquid enters a heat absorption pipe 313 and flows in the first heat dissipation cavity 312 along the heat absorption pipe 313, meanwhile, heat exchange is carried out with residual heat on the product, then the cooling liquid enters a heat storage box 5, heat energy can be absorbed for storage while cooling and cooling the product, when the product after heat dissipation through a first heat dissipation assembly 31 enters a second heat dissipation shell 321, cooling liquid is introduced into a cooling pipe 322, meanwhile, a heat dissipation motor 3231 works to drive a driving gear 3232 to rotate, the driving gear 3232 drives a driven gear 3233 to rotate under the transmission of a chain, further, a heat dissipation shaft 3235 and a heat dissipation fan 3236 are driven to rotate, air flow blown by the heat dissipation fan 3236 is cooled firstly through the cooling pipe 322 and then is blown to the product for further cooling, and at the same time, preheating mechanism 2 of side is worked, coolant liquid through absorbing heat energy in cooling tube 322 enters into first preheating pipe 213 in, simultaneously, blow off the air current towards the product through the work of first preheating part, drive the heat energy of first preheating pipe 213 and blow to the product, make the temperature of product improve, carry out preliminary preheating, high temperature coolant liquid in the heat storage box 5 gets into the second from second preheating pipe 223 and preheats the intracavity, second preheating part 222 work is blown heat energy to the product and is carried out further heating, make the temperature of work piece further improve, preheat the step-by-step heating of subassembly 22 to the product through first preheating subassembly 21 and second, the ambient temperature sudden change that is located when can avoiding the product heating leads to causing the influence to the product.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (2)
1. A reflow soldering machine for display card production comprises two soldering devices (1) arranged side by side, and is characterized in that two ends of each soldering device (1) are respectively provided with a preheating mechanism (2) and a heat dissipation mechanism (3), wherein the preheating mechanism (2) at one end of one soldering device (1) is arranged side by side with the heat dissipation mechanism (3) at one end of the other soldering device (1), the heat dissipation mechanism (3) at the other end of the soldering device (1) is arranged side by side with the preheating mechanism (2) at the other end of the other soldering device (1), each preheating mechanism (2) comprises a first preheating component (21) and a second preheating component (22), the first preheating component (21) and the second preheating component (22) are arranged adjacently, and the second preheating component (22) is positioned between the first preheating component (21) and the corresponding soldering device (1), every heat dissipation mechanism (3) includes first radiator unit (31) and second radiator unit (32), first radiator unit (31) and second radiator unit (32) set gradually and first radiator unit (31) are located between second radiator unit (32) and the soldering equipment (1) that corresponds, every adjacent preheating mechanism (2) and heat dissipation mechanism (3) between all be equipped with coupling assembling (4), two the upper end of soldering equipment (1) is equipped with heat storage box (5), first radiator unit (31) includes first heat dissipation shell (311), be equipped with first heat dissipation chamber (312) in first heat dissipation shell (311), be equipped with heat absorption pipe (313) in first heat dissipation chamber (312), the one end and the heat storage box (5) of heat absorption pipe (313) communicate, second radiator unit (32) includes second heat dissipation shell (321), cooling pipe (322) and heat dissipation part (323), a second heat dissipation cavity (324) is arranged in the second heat dissipation shell (321), the heat dissipation part (323) is arranged on the upper portion of the second heat dissipation cavity (324), the heat dissipation part (323) comprises a heat dissipation motor (3231), a driving gear (3232) and a driven gear (3233), the heat dissipation motor (3231) is vertically arranged at the upper end of the second heat dissipation shell (321) and the output end of the heat dissipation motor (3231) is vertically and downwards arranged, the driving gear (3232) is sleeved on the output end of the heat dissipation motor (3231), a heat dissipation frame (3234) is arranged on the upper portion of the second heat dissipation cavity (324), a heat dissipation shaft (3235) rotatably connected with the heat dissipation frame (3234) is arranged in the middle of the heat dissipation frame (3234), the driven gear (3233) is sleeved on the upper end of the heat dissipation shaft (3235) and connected between the driven gear (3233) and the driving gear (3232) through chain transmission, and a heat dissipation fan (3236) fixedly connected with the lower end of the heat dissipation shaft (3235) is arranged at the lower end of the heat dissipation shaft, the cooling pipe (322) is arranged in a roundabout manner, the cooling pipe (322) is installed below a cooling fan (3236), the first preheating assembly (21) comprises a first preheating shell (211), a first preheating cavity (212) is formed in the first preheating shell (211), a first preheating pipe (213) is arranged at the upper end of the first preheating cavity (212), the first preheating pipe (213) is arranged in a roundabout manner, one end of the first preheating pipe (213) is communicated with one end of the cooling pipe (322), a first preheating component is arranged on the upper portion of the first preheating pipe (213), the first preheating component is located above the first preheating pipe (213), the structure of the first preheating component is identical to that of the cooling component (323), the second preheating assembly (22) comprises a second preheating shell (221), a second preheating component (222) and a second preheating pipe (223), and a second preheating cavity is formed in the second preheating shell (221), the second preheating part (222) is arranged at the upper part of the second preheating cavity, the structure of the second preheating part (222) is the same as that of the heat dissipation part (323), the second preheating pipe (223) is arranged in a winding manner, the second preheating pipe (223) is positioned below the second preheating part (222), one end of the second preheating pipe (223) is communicated with the heat storage tank (5), the other end of the second preheating pipe (223) extends to the outside of the second preheating shell (221), the connecting assembly (4) comprises a connecting pipe (41) and a control valve (42), one end of the connecting pipe (41) is communicated with the first heat dissipation cavity (312) in the first heat dissipation shell (311), the other end of the connecting pipe (41) is communicated with the second preheating cavity in the second preheating shell (221), a branch pipe (43) communicated with the connecting pipe (41) is arranged on the connecting pipe (41), one end of the branch pipe (43) is communicated with the first preheating cavity (212) in the first preheating shell (211), control valve (42) set up on connecting pipe (41), bottom in heat storage box (5) is equipped with a plurality of heat conduction pole (6), every the lower extreme of heat conduction pole (6) all contradicts with corresponding soldering equipment (1).
2. The reflow soldering machine for graphic card production as claimed in claim 1, wherein; the heat absorption pipe (313) comprises a water inlet end (3131), a water outlet end (3132) and a plurality of water passing parts (3133) arranged from top to bottom, every two adjacent water passing parts (3133) are communicated with each other, the water inlet end (3131) is located outside the first heat dissipation shell (311), and the water outlet end (3132) is communicated with the heat storage box (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911100804.8A CN110919122B (en) | 2019-11-12 | 2019-11-12 | Reflow soldering machine for display card production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911100804.8A CN110919122B (en) | 2019-11-12 | 2019-11-12 | Reflow soldering machine for display card production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110919122A CN110919122A (en) | 2020-03-27 |
| CN110919122B true CN110919122B (en) | 2021-10-26 |
Family
ID=69853820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911100804.8A Active CN110919122B (en) | 2019-11-12 | 2019-11-12 | Reflow soldering machine for display card production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110919122B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111360357B (en) * | 2020-04-19 | 2021-03-12 | 大连优迅科技股份有限公司 | Welding device and method for thermoelectric refrigerator with double-sided gold-tin solder |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909430A (en) * | 1988-02-23 | 1990-03-20 | Eightic Tectron Co., Ltd. | Reflow soldering method and the apparatus thereof |
| CN101102865A (en) * | 2005-01-18 | 2008-01-09 | 白光株式会社 | Baffle plate, hot air blower for solder treatment, and nozzle for the device |
| CN201529826U (en) * | 2009-10-22 | 2010-07-21 | 西安中科麦特电子技术设备有限公司 | Heating component of reflow welder |
| CN102015184A (en) * | 2008-04-28 | 2011-04-13 | 尔萨有限公司 | Device and method for thermally treating workpieces in particular by convective heat transfer |
| CN102111966A (en) * | 2010-12-31 | 2011-06-29 | 东莞市健时自动化设备有限公司 | High-temperature reflow soldering process for printed circuit board (PCB) |
| CN102485399A (en) * | 2010-12-06 | 2012-06-06 | 西安中科麦特电子技术设备有限公司 | Heat recycling backflow welding machine |
| CN106112169A (en) * | 2016-07-22 | 2016-11-16 | 安徽广晟德自动化设备有限公司 | A kind of adjustable reflow tin soldering machine |
| CN206442621U (en) * | 2016-11-14 | 2017-08-25 | 华天恒芯半导体（厦门）有限公司 | A kind of paster processes residual heat using device |
-
2019
- 2019-11-12 CN CN201911100804.8A patent/CN110919122B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909430A (en) * | 1988-02-23 | 1990-03-20 | Eightic Tectron Co., Ltd. | Reflow soldering method and the apparatus thereof |
| JPH06268B2 (en) * | 1988-02-23 | 1994-01-05 | エイティックテクトロン株式会社 | Reflow soldering method and device |
| CN101102865A (en) * | 2005-01-18 | 2008-01-09 | 白光株式会社 | Baffle plate, hot air blower for solder treatment, and nozzle for the device |
| CN102015184A (en) * | 2008-04-28 | 2011-04-13 | 尔萨有限公司 | Device and method for thermally treating workpieces in particular by convective heat transfer |
| CN201529826U (en) * | 2009-10-22 | 2010-07-21 | 西安中科麦特电子技术设备有限公司 | Heating component of reflow welder |
| CN102485399A (en) * | 2010-12-06 | 2012-06-06 | 西安中科麦特电子技术设备有限公司 | Heat recycling backflow welding machine |
| CN102111966A (en) * | 2010-12-31 | 2011-06-29 | 东莞市健时自动化设备有限公司 | High-temperature reflow soldering process for printed circuit board (PCB) |
| CN106112169A (en) * | 2016-07-22 | 2016-11-16 | 安徽广晟德自动化设备有限公司 | A kind of adjustable reflow tin soldering machine |
| CN206442621U (en) * | 2016-11-14 | 2017-08-25 | 华天恒芯半导体（厦门）有限公司 | A kind of paster processes residual heat using device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110919122A (en) | 2020-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109038953B (en) | A kind of motor for being easy to radiate | |
| CN209072358U (en) | A kind of hot guiding device of DC inverter | |
| CN110919122B (en) | Reflow soldering machine for display card production | |
| CN111029100A (en) | Oil-immersed transformer | |
| CN111412118A (en) | Heat dissipation mechanism for gearbox of wind driven generator | |
| CN115102319B (en) | Driving device for energy-saving new energy automobile | |
| CN218506110U (en) | Power device, propeller and water area movable equipment | |
| CN106112169B (en) | A kind of adjustable reflow tin soldering machine | |
| CN109014481B (en) | Energy-saving efficient reflow soldering machine | |
| CN114980545B (en) | PCB soldering tin cooling device | |
| CN215902885U (en) | Quick heat radiation structure of reflow soldering machine | |
| CN215267330U (en) | Power distribution control equipment with heat radiation structure | |
| CN214236657U (en) | Lead-free welding hot air reflow welding machine | |
| CN210980459U (en) | Modified asphalt continuous cooling treatment equipment | |
| CN110926251B (en) | Energy-saving efficient heat exchanger | |
| CN210287413U (en) | Be applied to automatic heat sink of well type annealing stove | |
| CN208333182U (en) | A kind of environment-friendly type copper-coated gas heat exchanger | |
| CN113260236A (en) | Heat dissipation device for general electrical equipment | |
| CN216432592U (en) | Radiator with multiple layers of radiating pipes | |
| CN220706133U (en) | Air cooling device for hydraulic oil station | |
| CN216977642U (en) | Cooling tower body heat sink | |
| CN216858655U (en) | Laser cutting head cooling device | |
| CN216370767U (en) | Automatic change cooling device for welding | |
| CN218206594U (en) | Cooling circulation system of electrically-driven horizontal directional drilling machine | |
| CN216869256U (en) | Oil cooler for tube cooler |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |