CN110911517A - Novel interconnected material welds area - Google Patents
Novel interconnected material welds area Download PDFInfo
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- CN110911517A CN110911517A CN201911229237.6A CN201911229237A CN110911517A CN 110911517 A CN110911517 A CN 110911517A CN 201911229237 A CN201911229237 A CN 201911229237A CN 110911517 A CN110911517 A CN 110911517A
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- Prior art keywords
- pressure
- sensitive adhesive
- low
- tin
- temperature solder
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- 239000000463 material Substances 0.000 title claims abstract description 35
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 84
- 229910000679 solder Inorganic materials 0.000 claims abstract description 78
- 238000000576 coating method Methods 0.000 claims abstract description 54
- 239000011248 coating agent Substances 0.000 claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 8
- KHZAWAWPXXNLGB-UHFFFAOYSA-N [Bi].[Pb].[Sn] Chemical compound [Bi].[Pb].[Sn] KHZAWAWPXXNLGB-UHFFFAOYSA-N 0.000 claims abstract description 8
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- QKAJPFXKNNXMIZ-UHFFFAOYSA-N [Bi].[Ag].[Sn] Chemical compound [Bi].[Ag].[Sn] QKAJPFXKNNXMIZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- 229920003051 synthetic elastomer Polymers 0.000 claims abstract description 4
- 239000005061 synthetic rubber Substances 0.000 claims abstract description 4
- 239000011135 tin Substances 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 31
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 abstract description 3
- 238000005275 alloying Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- CCXYPVYRAOXCHB-UHFFFAOYSA-N bismuth silver Chemical compound [Ag].[Bi] CCXYPVYRAOXCHB-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
The invention discloses a novel interconnected material welding strip which comprises a conductive base material, wherein a low-temperature solder coating and a pressure-sensitive adhesive are sequentially connected to the outer side of the conductive base material, and release paper is connected to the outer side of the pressure-sensitive adhesive. The low-temperature solder coating is one of tin indium, tin lead bismuth and tin bismuth silver. The pressure-sensitive adhesive is composed of a polymer and conductive particles, the pressure-sensitive adhesive is arranged on a single surface or double surfaces, the polymer is one of organic silicon, acrylic acid and synthetic rubber, and the conductive particles are one of gold, silver, copper, tin, nickel, indium tin, bismuth silver tin and lead bismuth tin. According to the invention, the pressure-sensitive adhesive layer is added on the low-temperature solder coating, so that the cell string can be assembled at normal temperature, the damage to the cell caused by high-temperature welding is avoided, and the melting point parameter of the low-temperature solder coating is lower than 175 ℃, so that the photovoltaic cell string is subjected to alloying interconnection in the laminating process.
Description
Technical Field
The invention relates to the technical field of solar photovoltaic module packaging, manufacturing and application, in particular to a novel interconnected material welding strip.
Background
With the increasing consumption of conventional fossil energy such as global coal, oil, natural gas and the like, the ecological environment is continuously deteriorated, and particularly, the sustainable development of the human society is seriously threatened due to the increasingly severe global climate change caused by the emission of greenhouse gases. Considering that the stock of non-renewable energy is limited and the conventional fossil energy causes serious environmental pollution, countries in the world make respective energy development strategies to deal with the limitation of the conventional fossil energy resources and the environmental problems caused by development and utilization. Under the world trend, solar energy has become one of the most important renewable energy sources by virtue of the characteristics of reliability, safety, universality, longevity, environmental protection and resource sufficiency, and is expected to become a main pillar of global power supply in the future.
In the existing packaging process of the photovoltaic cell, a high-temperature welding strip (a substrate is copper and a coating is generally coated outside) is used between cells, and the interconnection between the cells and between cell strings is completed by adopting a high-temperature welding process.
However, the copper-based tin-lead welding strip used at present still has obvious defects to a certain extent, because the interconnection of the battery pieces needs high-temperature welding, on one hand, the battery pieces cannot be flaked (the high-temperature welding of the slices is easy to break), the process cost is high during packaging, and on the other hand, the interconnection process of the battery pieces is narrow in application range and is not suitable for large-scale use.
Disclosure of Invention
The invention aims to provide a novel interconnected material solder strip to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a novel interconnected material welding strip comprises a conductive base material, wherein a low-temperature solder coating and a pressure-sensitive adhesive are sequentially connected onto the conductive base material;
the conductive substrate is one of copper, silver and aluminum;
the low-temperature solder coating is one of tin indium, tin lead bismuth and tin bismuth silver, and the melting point temperature of the low-temperature solder coating is lower than 175 ℃;
the pressure-sensitive adhesive is composed of a polymer and conductive particles, wherein the polymer is one of organic silicon, acrylic acid and synthetic rubber, and the conductive particles are one of gold, silver, copper, tin, nickel, tin indium, tin bismuth silver and tin lead bismuth.
Preferably, the conductive substrate is round, and the low-temperature solder coating and the pressure-sensitive adhesive are sequentially wrapped on the outer surface of the conductive substrate.
Preferably, the conductive substrate is flat, the single surface of the low-temperature solder coating is arranged on one side of the conductive substrate, and the pressure-sensitive adhesive is arranged on the low-temperature solder coating.
Preferably, the conductive substrate is flat, and the two surfaces of the low-temperature solder coating are arranged on the two sides of the conductive substrate.
Preferably, the pressure-sensitive adhesive is arranged on the low-temperature solder coating in a single surface.
Preferably, the pressure-sensitive adhesive is arranged on the low-temperature solder coating in a double-sided manner.
Preferably, the pressure sensitive adhesive is disposed continuously.
Preferably, the pressure-sensitive adhesive is arranged in a horizontally spaced discontinuous manner, the horizontal distance between the horizontally adjacent pressure-sensitive adhesives is more than or equal to 0.1mm, and the length of the pressure-sensitive adhesive is less than or equal to that of the battery piece.
Preferably, the pressure-sensitive adhesive is arranged intermittently at intervals up and down, the horizontal distance between the pressure-sensitive adhesive adjacent up and down is more than or equal to 0.1mm, and the length of the pressure-sensitive adhesive is less than or equal to that of the battery piece.
Preferably, the outer side of the pressure-sensitive adhesive is connected with release paper, and the release paper is arranged to be single-sided or double-sided.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the low-temperature solder coating is adopted, the pressure-sensitive adhesive is arranged outside the coating, the battery piece is assembled and strung under the normal temperature condition, then the assembly packaging process link is adopted, the novel interconnection material and the battery piece grid line are completed to complete the metallization interconnection, and the interconnection among the battery pieces can be completed through pressing at normal temperature through the welding strip made of the interconnection material, so that the loss of high-temperature welding on the battery pieces is avoided, the battery piece is favorably flaked, the packaging process is realized, the cost is reduced, and the interconnection process is more widely applicable on the other side.
According to the invention, the pressure-sensitive adhesive layer is added on the low-temperature solder coating, so that the cell string can be assembled at normal temperature, the damage to the cell caused by high-temperature welding is avoided, and the melting point parameter of the low-temperature solder coating is lower than 175 ℃, so that the photovoltaic cell string is subjected to alloying interconnection in the laminating process.
Drawings
FIG. 1 is a schematic cross-sectional view of a circular solder strip in accordance with the present invention;
FIG. 2 is a schematic view of a circular solder ribbon with continuous pressure sensitive adhesive thereon according to the present invention;
FIG. 3 is a schematic structural view of the circular solder strip with intermittent pressure sensitive adhesive of the present invention;
FIG. 4 is a schematic structural diagram of the flat solder strip of the present invention with low temperature solder coating and pressure sensitive adhesive on both sides and with pressure sensitive adhesive continuously disposed;
FIG. 5 is a schematic structural view showing that the low-temperature solder coating and the pressure-sensitive adhesive are arranged on both sides of the flat solder strip and the pressure-sensitive adhesive is intermittently arranged
FIG. 6 is a schematic structural view of the flat solder strip of the present invention with low temperature solder coatings on both sides and pressure sensitive adhesive on one side, and with the pressure sensitive adhesive continuously disposed;
FIG. 7 is a schematic structural view of the flat solder strip of the present invention with low temperature solder coatings on both sides and pressure sensitive adhesive on one side and with intermittent pressure sensitive adhesive arrangement
FIG. 8 is a schematic structural view of the flat solder strip of the present invention with a low temperature solder coating and a pressure sensitive adhesive disposed on a single side thereof, with the pressure sensitive adhesive disposed continuously;
FIG. 9 is a schematic structural view of a flat solder strip with a low temperature solder coating and a pressure sensitive adhesive disposed on a single side thereof, wherein the pressure sensitive adhesive is disposed intermittently;
FIG. 10 is a schematic view of the configuration of the intermittent pressure sensitive adhesive of the present invention;
fig. 11 is a schematic structural view of the arrangement of the horizontal discontinuous pressure sensitive adhesive of the present invention.
In the figure: 1 conductive substrate, 2 low-temperature solder coating, 3 pressure-sensitive adhesive and 4 release paper.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-11, the present invention provides a technical solution:
a novel interconnected material solder strip comprises a conductive substrate 1, a low-temperature solder coating 2, a pressure-sensitive adhesive 3 and release paper 4 which can be selectively used, wherein the release paper 4 can be selectively arranged into a single surface or double surfaces.
The conductive substrate 1 is made of a material with relatively low resistivity, such as copper, silver, aluminum and other related alloy materials, preferably a copper material, and the conductive substrate 1 can be made into a flat shape or a round shape, so that flat and round solder strip structures as shown in the accompanying drawings 4 and 1 in the specification are obtained, and the interconnection effect is better.
The melting point temperature of the low-temperature solder coating 2 is required to be less than 175 ℃, such as alloys of tin indium, tin lead bismuth, tin bismuth silver and the like.
The polymer of the pressure-sensitive adhesive 3 is organic silicon, acrylic acid, synthetic rubber or the like, the conductive particles are gold, silver, copper, tin, nickel, indium tin, bismuth silver, tin lead bismuth and the like, and can be made into a single surface or double surfaces according to requirements.
A manufacturing method of a novel interconnected material welding strip comprises the following steps: firstly, a copper substrate with the thickness specification of 0.1mm-0.3mm, namely a conductive substrate 1, is adopted, a tin-lead-bismuth alloy layer with the thickness of 0.02-0.1mm is formed through electroplating or spraying, namely a low-temperature solder coating 2, then an acrylic acid, conductive particles, a solvent and the like are manufactured into a conductive band with a pressure-sensitive adhesive 3 on the surface on a solder strip in a coating mode, then release paper 4 for protection is pasted on the surface, a low-temperature coating is adopted, the pressure-sensitive adhesive is counted outside the coating, the battery piece is assembled through pressing under the normal temperature condition, then, the assembly packaging process link is adopted, the metallization interconnection of a new interconnection material on a battery piece grid line is completed, the loss of high-temperature welding on the battery piece is avoided, the battery piece is favorably flaked, the packaging process is realized, the cost is reduced.
The first embodiment is as follows: as shown in the attached figure 2 of the specification, the welding strip is circularly arranged, the conductive substrate 1 is circularly arranged, the low-temperature solder coating 2 and the pressure-sensitive adhesive 3 are sequentially wrapped on the outer surface of the conductive substrate 1, the pressure-sensitive adhesive 3 is continuously arranged, and the release paper 4 is directly and uninterruptedly wrapped on the outer side of the pressure-sensitive adhesive 3.
Example two: as shown in the attached drawing 3 in the specification, the welding strip is circularly arranged, the conductive substrate 1 is circularly arranged, the low-temperature solder coating 2 and the pressure-sensitive adhesive 3 are sequentially wrapped on the outer surface of the conductive substrate 1, the pressure-sensitive adhesive 3 is arranged at intervals, and the release paper 4 is intermittently wrapped on the outer side of the pressure-sensitive adhesive 3.
Example three: as shown in the attached figure 4 in the specification, in the arrangement of the flat solder strip, the conductive substrate 1 is arranged to be flat, the low-temperature solder coatings 2 are arranged on two sides of the conductive substrate 1, the pressure-sensitive adhesive 3 is arranged on the outer sides of the low-temperature solder coatings 2 on the two sides, the pressure-sensitive adhesive 3 is arranged to be continuous, and the release paper 4 is also arranged outside the pressure-sensitive adhesive 3 in a continuous manner.
Example four: as shown in the accompanying drawing 5 of the specification, the flat solder strip is arranged, the conductive substrate 1 is arranged to be flat, the low-temperature solder coatings 2 are arranged on two sides of the conductive substrate 1, the pressure-sensitive adhesive 3 is arranged on the outer sides of the low-temperature solder coatings 2 on the two sides, the pressure-sensitive adhesive 3 is arranged to be intermittently arranged up and down, the release paper 4 is also intermittently arranged outside the pressure-sensitive adhesive 3, the upper and lower spaced positions are staggered, the horizontal distance between the upper and lower adjacent pressure-sensitive adhesives 3 is greater than or equal to 0.1mm, namely the length of W1 in the drawing 10 is explained, the length of the pressure-sensitive adhesive 3 is less than or equal to the length of a battery piece, namely the length of W2 in the drawing is less than or equal to the length of the battery piece, and the interconnection effect when the battery piece is connected can be facilitated.
Example five: as shown in the attached figure 6 of the specification, the flat solder strip is arranged, the conductive substrate 1 is arranged to be flat, the low-temperature solder coating 2 is arranged on two sides of the conductive substrate 1, but the pressure-sensitive adhesive 3 is arranged on the outer side of the low-temperature solder coating 2 on only one side, the pressure-sensitive adhesive 3 is arranged to be continuous, and the release paper 4 is also arranged outside the pressure-sensitive adhesive 3 in a continuous manner.
Example six: as shown in the attached figure 7 of the specification, in the arrangement of the flat solder strip, the conductive substrate 1 is arranged to be flat, the low-temperature solder coatings 2 are arranged on two sides of the conductive substrate 1, but the pressure-sensitive adhesive 3 is arranged on the outer side of the low-temperature solder coating 2 on only one side, the pressure-sensitive adhesive 3 is arranged to be horizontally arranged in a left-right interval manner, the release paper 4 is also arranged outside the pressure-sensitive adhesive 3 in an interval manner, the horizontally-spaced positions are mutually spaced, the horizontal distance between the left-right horizontally adjacent pressure-sensitive adhesive 3 is more than or equal to 0.1mm, namely the length of W1 in the attached figure 11 of the specification, and the length of the pressure-sensitive adhesive 3 is less than or equal to the length of a battery piece, namely the length.
Example seven: as shown in the attached figure 8 in the specification, the flat solder strip is arranged, the conductive substrate 1 is arranged to be flat, the low-temperature solder coating 2 is arranged on one side of the conductive substrate 1, the pressure-sensitive adhesive 3 is arranged on the outer side of the low-temperature solder coating 2, the pressure-sensitive adhesive 3 is arranged to be continuous, and the release paper 4 is also arranged outside the pressure-sensitive adhesive 3 in a continuous manner.
Example eight: as shown in the accompanying drawing 9 of the specification, in the arrangement of the flat solder strip, the conductive substrate 1 is arranged to be flat, the low-temperature solder coating 2 is arranged on one side of the conductive substrate 1, the pressure-sensitive adhesive 3 is arranged on the outer side of the low-temperature solder coating 2, the pressure-sensitive adhesive 3 is arranged in a horizontal left-right spaced intermittent arrangement, and the release paper 4 is also arranged outside the pressure-sensitive adhesive 3 in an intermittent arrangement.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A novel interconnected material solder strip, includes electrically conductive substrate (1), its characterized in that: the conductive base material (1) is sequentially connected with a low-temperature solder coating (2) and a pressure-sensitive adhesive (3);
the conductive base material (1) is one of copper, silver and aluminum;
the low-temperature solder coating (2) is one of tin indium, tin lead bismuth and tin bismuth silver, and the melting point temperature of the low-temperature solder coating (2) is lower than 175 ℃;
the pressure-sensitive adhesive (3) is composed of a polymer and conductive particles, wherein the polymer is one of organic silicon, acrylic acid and synthetic rubber, and the conductive particles are one of gold, silver, copper, tin, nickel, indium tin, silver tin bismuth and tin lead bismuth.
2. The novel solder strip of interconnection material as claimed in claim 1, wherein: the conductive base material (1) is round, and the low-temperature solder coating (2) and the pressure-sensitive adhesive (3) are sequentially wrapped on the outer surface of the conductive base material (1).
3. The novel solder strip of interconnection material as claimed in claim 1, wherein: the conductive base material (1) is flat, the single surface of the low-temperature solder coating (2) is arranged on one side of the conductive base material (1), and the pressure-sensitive adhesive (3) is arranged on the low-temperature solder coating (2).
4. The novel solder strip of interconnection material as claimed in claim 1, wherein: the conductive base material (1) is flat, and the two sides of the low-temperature solder coating (2) are arranged on the two sides of the conductive base material (1).
5. The novel solder strip of interconnected materials as defined in claim 4, wherein: the pressure-sensitive adhesive (3) is arranged on the low-temperature solder coating (2) in a single-sided manner.
6. The novel solder strip of interconnected materials as defined in claim 4, wherein: the pressure-sensitive adhesive (3) is arranged on the low-temperature solder coating (2) in a double-sided manner.
7. The novel solder strip of interconnection material according to any one of claims 1 to 6, wherein: the pressure-sensitive adhesive (3) is arranged continuously.
8. A novel solder strip of interconnect material as claimed in claim 2, 3 or 5 wherein: the pressure-sensitive adhesive (3) is arranged horizontally at intervals, the horizontal distance between the horizontally adjacent pressure-sensitive adhesives (3) is more than or equal to 0.1mm, and the length of the pressure-sensitive adhesive (3) is less than or equal to that of the battery piece.
9. The novel solder strip of interconnection material of claim 6, wherein: the pressure-sensitive adhesive (3) is arranged at intervals up and down, the horizontal distance between the pressure-sensitive adhesive (3) which is adjacent up and down is more than or equal to 0.1mm, and the length of the pressure-sensitive adhesive (3) is less than or equal to that of the battery piece.
10. The novel solder strip of interconnection material as claimed in claim 1, wherein: the outer side of the pressure-sensitive adhesive (3) is connected with release paper (4), and the release paper (4) is arranged to be single-sided or double-sided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911229237.6A CN110911517A (en) | 2019-12-04 | 2019-12-04 | Novel interconnected material welds area |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911229237.6A CN110911517A (en) | 2019-12-04 | 2019-12-04 | Novel interconnected material welds area |
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| CN110911517A true CN110911517A (en) | 2020-03-24 |
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| CN201911229237.6A Pending CN110911517A (en) | 2019-12-04 | 2019-12-04 | Novel interconnected material welds area |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112599642A (en) * | 2020-12-18 | 2021-04-02 | 泰州隆基乐叶光伏科技有限公司 | Welding method of battery piece and photovoltaic module |
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2019
- 2019-12-04 CN CN201911229237.6A patent/CN110911517A/en active Pending
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| US20030047206A1 (en) * | 2001-09-10 | 2003-03-13 | Elias Kawam | Photovoltaic array and method of manufacturing same |
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| CN108010979A (en) * | 2017-12-30 | 2018-05-08 | 苏州宇邦新型材料股份有限公司 | A kind of welding and stacked tile type photovoltaic module for stacked tile type photovoltaic module |
| CN110055007A (en) * | 2019-03-21 | 2019-07-26 | 苏州微邦材料科技有限公司 | Application and application method of the Multi-layer composite pressure-sensitive conductive adhesive film in photovoltaic imbrication battery component |
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| CN112599642A (en) * | 2020-12-18 | 2021-04-02 | 泰州隆基乐叶光伏科技有限公司 | Welding method of battery piece and photovoltaic module |
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