CN110911462A

CN110911462A - Display panel and display device

Info

Publication number: CN110911462A
Application number: CN201911180143.4A
Authority: CN
Inventors: 张婷婷; 李威龙; 朱修剑; 张露; 胡思明; 韩珍珍
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2019-11-27
Filing date: 2019-11-27
Publication date: 2020-03-24
Anticipated expiration: 2039-11-27
Also published as: CN110911462B

Abstract

The embodiment of the invention relates to the technical field of display, and discloses a display panel, which comprises: a package region, a substrate located in the package region; a dielectric layer on the substrate; the heat conduction layer comprises a first heat conduction layer and a second heat conduction layer, wherein the first heat conduction layer is positioned on the surface of the part, far away from the substrate, of the medium layer, and the second heat conduction layer is positioned on one side, facing the substrate, of the medium layer, and the orthographic projection of the first heat conduction layer on the substrate is at least partially staggered with that of the second heat conduction layer on the substrate; the packaging layer is positioned on one side, far away from the substrate, of the first heat conduction layer, the packaging layer is also in contact with the surface, far away from the substrate, of part of the dielectric layer, and the orthographic projection of the packaging layer on the substrate is partially overlapped with the orthographic projection of the second heat conduction layer on the substrate. The display panel and the display device in the embodiment of the invention can protect devices in the display panel from being corroded by water and oxygen and can well and uniformly encapsulate heat during curing.

Description

Display panel and display device

Technical Field

The embodiment of the invention relates to the technical field of display, in particular to a display panel and a display device.

Background

Currently, in the flat panel display industry, compared with a conventional liquid crystal display, an Active-matrix organic light-emitting diode (AMOLED) has the advantages of fast response speed, no need of a backlight, higher contrast, lighter and thinner overall structure, wider viewing angle, capability of being made into a flexible product, and the like, and is widely applied to a display panel. However, the OLED devices in the display panel are particularly sensitive to oxygen and water vapor, and if the OLED devices are corroded by oxygen and water vapor, the display abnormality of the display panel is likely to be caused.

The display panel is usually encapsulated by an encapsulation layer, which is printed on a cover glass, and the encapsulation layer is moved and heated by a laser beam to be sintered to form a hermetic package.

Disclosure of Invention

An object of an embodiment of the present invention is to provide a display panel and a display device, which can protect devices in the display panel from water and oxygen and can uniformly cure a sealing layer with a good heat.

To solve the above technical problem, an embodiment of the present invention provides a display panel including: a package region, a substrate located in the package region; a dielectric layer on the substrate; the heat conduction layer comprises a first heat conduction layer and a second heat conduction layer, wherein the first heat conduction layer is positioned on the surface of the part, far away from the substrate, of the medium layer, and the second heat conduction layer is positioned on one side, facing the substrate, of the medium layer, and the orthographic projection of the first heat conduction layer on the substrate is at least partially staggered with that of the second heat conduction layer on the substrate; the packaging layer is positioned on one side, far away from the substrate, of the first heat conduction layer, the packaging layer is also in contact with the surface, far away from the substrate, of part of the dielectric layer, and the orthographic projection of the packaging layer on the substrate is partially overlapped with the orthographic projection of the second heat conduction layer on the substrate.

An embodiment of the present invention also provides a display device including: such as the display panel described above.

In addition, still include: a display area, the encapsulation area surrounding the display area; the first heat conduction layer is close to the display area, and the second heat conduction layer is far away from the display area; preferably, the corrosion resistance of the material of the second heat conducting layer is greater than the corrosion resistance of the material of the first heat conducting layer; or the first heat conduction layer is far away from the display area, and the second heat conduction layer is close to the display area; preferably, the corrosion resistance of the material of the first heat conducting layer is greater than the corrosion resistance of the material of the second heat conducting layer. Two design modes of the display panel are provided in the scheme, so that the diversified design of the display panel is facilitated.

In addition, the surface of the dielectric layer, which is far away from the substrate and is not covered by the first heat conduction layer, is flush with the surface of the first heat conduction layer, which is far away from the substrate. In the scheme, the surface of the medium layer, which is far away from the substrate and is not covered by the first heat conduction layer, is flush with the surface of the first heat conduction layer, which is far away from the substrate, so that the preparation of the packaging layer is facilitated.

In addition, the orthographic projection of the encapsulation layer on the substrate falls within the range of the orthographic projection of the first heat conduction layer and the second heat conduction layer on the substrate. According to the scheme, the first heat conduction layer and the second heat conduction layer can better and uniformly encapsulate heat generated when the layers are cured.

In addition, the dielectric layer includes: the first dielectric layer is positioned on the substrate, and the second dielectric layer is positioned on one side of the first dielectric layer, which is far away from the substrate; the second heat conduction layer is positioned between the first medium layer and the second medium layer; alternatively, the second thermally conductive layer is positioned between the first dielectric layer and the substrate.

In addition, the orthographic projection of the first heat conduction layer on the substrate is in contact with or partially overlapped with the orthographic projection of the second heat conduction layer on the substrate.

In addition, the dielectric layer includes: the first dielectric layer is positioned on the substrate, and the second dielectric layer is positioned on one side of the first dielectric layer, which is far away from the substrate; the second thermally conductive layer includes: the first sub heat conduction layer and the second sub heat conduction layer are respectively located on two opposite sides of the first medium layer, and the orthographic projection of the first sub heat conduction layer on the substrate is located between the orthographic projections of the second sub heat conduction layer and the first heat conduction layer on the substrate.

In addition, the first sub heat conduction layer is positioned between the substrate and the first medium layer, and the second sub heat conduction layer is positioned between the first medium layer and the second medium layer; or the first sub heat conduction layer is positioned between the first medium layer and the second medium layer, and the second sub heat conduction layer is positioned between the substrate and the first medium layer;

preferably, an orthographic projection of the first sub heat conduction layer on the substrate is in contact with or partially overlapped with an orthographic projection of the second sub heat conduction layer on the substrate, and/or an orthographic projection of the first sub heat conduction layer on the substrate is in contact with or partially overlapped with an orthographic projection of the first heat conduction layer on the substrate.

In addition, the material of the second heat conduction layer comprises a metal conductive material or a semiconductor conductive material; preferably, the second heat conducting layer is connected to ground. The second heat conduction layer which is conductive is grounded in the scheme, and the antistatic capacity of the display panel is improved.

Compared with the prior art, the embodiment of the invention provides the display panel, the packaging layer is positioned on one side of the first heat conduction layer, which is far away from the substrate, and the packaging layer is also contacted with the surface of part of the dielectric layer, which is far away from the substrate, so that water vapor in the air is prevented from entering the display panel, and devices in the display panel are protected from being corroded by the water vapor; and because the first heat conduction layer located on the partial surface of the dielectric layer far away from the substrate and the second heat conduction layer located on one side of the dielectric layer towards the substrate are arranged, the orthographic projection of the first heat conduction layer on the substrate is at least partially staggered with the orthographic projection of the second heat conduction layer on the substrate, and the orthographic projection of the packaging layer on the substrate is partially superposed with the orthographic projection of the second heat conduction layer on the substrate. The display panel in the embodiment can protect devices in the display panel from being corroded by water vapor, and can well and uniformly encapsulate heat generated during curing of the layer, so that the encapsulation reliability of the display panel is improved.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

FIG. 1 is a schematic diagram of a prior art display panel according to the present invention;

FIG. 2 is a cross-sectional view of a prior art display panel according to the present invention;

fig. 3 is a sectional view of a display panel according to a first embodiment of the present invention;

fig. 4 is still another cross-sectional view of the display panel according to the first embodiment of the present invention;

fig. 5 is still another cross-sectional view of the display panel according to the first embodiment of the present invention;

fig. 6 is a further cross-sectional view of the display panel according to the first embodiment of the present invention;

FIG. 7 is an alternative cross-sectional view of a display panel according to the first embodiment of the present invention;

fig. 8 is a sectional view of a display panel according to a second embodiment of the present invention;

fig. 9 is still another cross-sectional view of a display panel according to a second embodiment of the present invention;

fig. 10 is still another cross-sectional view of a display panel according to a second embodiment of the present invention;

fig. 11 is a further cross-sectional view of the display panel according to the second embodiment of the present invention;

fig. 12 is an alternative cross-sectional view of a display panel according to a second embodiment of the present invention;

FIG. 13 is yet another alternative cross-sectional view of a display panel according to a second embodiment of the present invention;

FIG. 14 is yet another alternative cross-sectional view of a display panel according to a second embodiment of the present invention;

FIG. 15 is a further alternative cross-sectional view of a display panel according to a second embodiment of the present invention;

fig. 16 is a sectional view of a display panel according to a third embodiment of the present invention;

fig. 17 is an alternative cross-sectional view of a display panel according to a third embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

As shown in fig. 1, the display panel includes an effective display area 01(AA area) and an encapsulation area 02 surrounding the effective display area 01, where the encapsulation area 02 is used for screen encapsulation to prevent moisture from invading and causing abnormal display. At present, a display panel is usually packaged by a glass Frit (Frit) packaging method, wherein Frit packaging is performed by printing glass Frit on cover glass, moving and heating the glass Frit by using a laser beam to melt the glass Frit to form a hermetic package, and the glass Frit is melted on a glass substrate 1 to form a layer of sealing body.

A cross-sectional view of a package region 02 of a conventional display panel is shown in fig. 2, and includes a substrate 1, a dielectric layer 2, a first heat conductive layer 31, and a package layer 4, which are sequentially stacked. For promoting the frat packaging and the screen body display effect, set up first heat-conducting layer 31 under frat packaging layer 4 for heat when even frat packaging layer 4 solidifies, for avoid steam to corrode first heat-conducting layer 31, get into display area 01 of display panel from the clearance that first heat-conducting layer 31 and dielectric layer 2 formed, the side of first heat-conducting layer 31 can not surpass frat packaging layer 4. As shown in fig. 2, the frit encapsulation layer 4 can be divided into two regions, and a heat conduction layer is arranged below the frit encapsulation layer 4 in the first region, so that the frit encapsulation layer can be heated uniformly; however, the inventors found that the frat encapsulating layer 4 in the second region has a weak water oxygen barrier ability and has a problem of encapsulation failure. The reason for the packaging failure is that the frat packaging layer 4 in the second area is close to the periphery of the display panel and has no heat conduction layer, so that the frat packaging layer 4 is heated unevenly when being cured, and the water and oxygen barrier capability of the frat packaging layer 4 heated unevenly is weakened, so that the packaging reliability is not high.

In view of the above, a first embodiment of the present invention relates to a display panel, and as shown in fig. 3, the core of the present embodiment is a display panel including: a package region 02, a substrate 1 located in the package region 02; a dielectric layer 2 on the substrate 1; the heat conduction layer comprises a first heat conduction layer 31 and a second heat conduction layer 32, wherein the first heat conduction layer 31 is positioned on the surface of the part, away from the substrate 1, of the medium layer 2, and the second heat conduction layer 32 is positioned on the side, towards the substrate 1, of the medium layer 2, and the orthographic projection of the first heat conduction layer 31 on the substrate 1 is at least partially staggered with that of the second heat conduction layer 32 on the substrate 1; the packaging layer 4 is positioned on the side, away from the substrate 1, of the first heat conduction layer 31, the packaging layer 4 is also in contact with the surface, away from the substrate 1, of part of the medium layer 2, and the orthographic projection of the packaging layer 4 on the substrate 1 is overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1. The packaging layer 4 is positioned on one side of the first heat conduction layer 31, which is far away from the substrate 1, and the packaging layer 4 is also contacted with the surface of part of the dielectric layer 2, which is far away from the substrate 1, so that water vapor in the air is prevented from entering the display panel, and devices in the display panel are protected from being corroded by the water vapor; and because the first heat conduction layer 31 located on the partial surface of the medium layer 2 far away from the substrate 1 and the second heat conduction layer 32 located on one side of the medium layer 2 facing the substrate 1 are arranged, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is at least partially staggered with the orthographic projection of the second heat conduction layer 32 on the substrate 1, and the orthographic projection of the encapsulation layer 4 on the substrate 1 is partially superposed with the orthographic projection of the second heat conduction layer 32 on the substrate 1, compared with the existing scheme that only the first heat conduction layer 31 is used for uniformly encapsulating heat during curing the layer 4, the first heat conduction layer 31 and the second heat conduction layer 32 which are at least partially staggered are projected, heat conduction layer materials of the uniform encapsulation layer 4 during curing are increased, therefore, the heat during curing the encapsulation layer 4 can be better uniform, and the encapsulation reliability of the display panel is improved. The display panel in the embodiment can protect devices in the display panel from being corroded by water vapor, and can well and uniformly encapsulate heat generated when the layer 4 is solidified, so that the encapsulation reliability of the display panel is improved.

The following description specifically describes implementation details of the display panel of the present embodiment, and the following description is provided only for the sake of understanding and is not necessary for implementing the present embodiment.

Specifically, in this embodiment, the encapsulation layer 4 may be a frit encapsulation layer 4, the encapsulation layer 4 is located on a side of the first heat conduction layer 31 away from the substrate 1, and the encapsulation layer 4 is further in contact with a portion of the surface of the dielectric layer 2 away from the substrate 1, and since the dielectric layer 2 is not easily corroded by water and oxygen, water vapor in air is prevented from entering the display panel, and devices in the display panel are protected from water vapor corrosion. In this embodiment, the second heat conduction layer 32 located on one side of the medium layer 2 facing the substrate 1 is provided, at least part of the orthographic projection of the first heat conduction layer 31 on the substrate 1 is staggered with the orthographic projection of the second heat conduction layer 32 on the substrate 1, and the orthographic projection of the encapsulation layer 4 on the substrate 1 is overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, therefore, compared with the existing scheme that only the first heat conduction layer 31 is used for heat during curing of the uniform encapsulation layer 4, the heat conduction layer material of heat during curing of the uniform encapsulation layer 4 is added to the first heat conduction layer 31 and the second heat conduction layer 32 which are at least partially staggered in projection, therefore, the heat during curing of the uniform encapsulation layer 4 can be better, and the encapsulation reliability of the display panel is improved. The display panel in the embodiment can protect devices in the display panel from being corroded by water vapor, and can well and uniformly encapsulate heat generated when the layer 4 is solidified, so that the encapsulation reliability of the display panel is improved.

As with the display panel shown in fig. 1 in the related art, the display panel in this embodiment also includes: the display area 01, the encapsulation area 02 surrounds the display area 01 (as shown in fig. 1).

As one way of achieving this, the first heat conductive layer 31 is close to the display area 01 and the second heat conductive layer 32 is far from the display area 01.

Since the orthographic projection of the first heat conduction layer 31 on the substrate 1 is at least partially staggered from the orthographic projection of the second heat conduction layer 32 on the substrate 1, at least three realizable modes are included, specifically as follows:

as shown in fig. 3, there is a gap between the orthographic projection of the first heat conducting layer 31 on the substrate 1 and the orthographic projection of the second heat conducting layer 32 on the substrate 1. That is, the first heat conductive layer 31 and the second heat conductive layer 32 are separated by the medium layer 2, the first heat conductive layer 31 and the second heat conductive layer 32 are not in contact, and there is no overlapping portion between the orthographic projection of the first heat conductive layer 31 on the substrate 1 and the orthographic projection of the second heat conductive layer 32 on the substrate 1. Due to the existence of the dielectric layer 2, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the dielectric layer 2 and enter the display panel, and therefore display devices in the display panel are protected from being corroded by water and oxygen.

Alternatively, as shown in fig. 4, the orthographic projection of the first heat conducting layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conducting layer 32 on the substrate 1. That is, the side edge of the first heat conductive layer 31 and the side edge of the second heat conductive layer 32 are in direct contact, and the orthographic projection of the first heat conductive layer 31 on the substrate 1 and the orthographic projection of the second heat conductive layer 32 on the substrate 1 are in contact. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that no gap exists, and the heat generated during curing of the packaging layer 4 can be better and uniformly distributed; and the medium layer 2 is directly divided into a first part arranged on the second heat conduction layer 32 and a second part which is arranged on one side of the first heat conduction layer 31 facing the substrate 1 and is on the same layer with the second heat conduction layer 32, so that the preparation is convenient.

Still alternatively, an orthographic projection of the first heat conductive layer 31 on the substrate 1 overlaps with an orthographic projection of the second heat conductive layer 32 on the substrate 1. There are two implementations, one implementation is shown in fig. 5: the first conductive layer 31 and the second conductive layer 32 are separated by the medium layer 2. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is partially overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that the heat of the packaging layer 4 during curing can be better and uniformly distributed; due to the existence of the dielectric layer 2, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the dielectric layer 2 and enter the display panel, and therefore display devices in the display panel are protected from being corroded by water and oxygen.

Another specific implementation is shown in fig. 6: the partial surface of the first heat conducting layer 31 facing the substrate 1 and the partial surface of the second heat conducting layer 32 facing away from the substrate 1 are in direct contact. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is partially overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that the heat of the packaging layer 4 during curing can be better and uniformly distributed; and the medium layer 2 is directly divided into a first part arranged on the second heat conduction layer 32 and a second part which is arranged on one side of the first heat conduction layer 31 facing the substrate 1 and is on the same layer with the second heat conduction layer 32, so that the preparation is convenient.

Preferably, the corrosion resistance of the material of the second heat conducting layer 32 is higher than the corrosion resistance of the material of the first heat conducting layer 31 in the above described implementation. Thereby protecting the second heat conductive layer 32 far from the display area 01 and near the periphery of the display panel from being corroded by water and oxygen. Due to the corrosion resistance of the material of the second heat conduction layer 32, even if the side edge of the second heat conduction layer 32 is exposed to the air, the water and oxygen resistance of the display panel is not reduced, so that when the display panel is cut, the display panel can be directly cut along the side edge of the packaging layer 4, and the narrow frame design is realized. It should be noted that the material of the second heat conduction layer 32 may be molybdenum metal or semiconductor polysilicon, which is not easily attacked by water and oxygen.

As another way of achieving this, as shown in fig. 7, the first thermally conductive layer 31 is far from the display area 01 and the second thermally conductive layer 32 is close to the display area 01 in this embodiment.

Specifically, since the orthographic projection of the first heat conduction layer 31 on the substrate 1 is at least partially staggered from the orthographic projection of the second heat conduction layer 32 on the substrate 1, there are three implementations: (1) a gap exists between the orthographic projection of the first heat conduction layer 31 on the substrate 1 and the orthographic projection of the second heat conduction layer 32 on the substrate 1; (2) the orthographic projection of the first heat conduction layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conduction layer 32 on the substrate 1; (3) the orthographic projection of the first heat conduction layer 31 on the substrate 1 is overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, wherein the scheme that the projections are overlapped is that (3.1) the first heat conduction layer 31 and the second heat conduction layer 32 are separated by the medium layer 2; (3.2) the first heat conducting layer 31 and the second heat conducting layer 32 are in direct contact with both embodiments.

In the present embodiment, only the (1) implementation is shown in fig. 7, that is, the first heat conduction layer 31 and the second heat conduction layer 32 are separated by the medium layer 2, the first heat conduction layer 31 and the second heat conduction layer 32 are not in contact, and there is no overlapping portion between the orthographic projection of the first heat conduction layer 31 on the substrate 1 and the orthographic projection of the second heat conduction layer 32 on the substrate 1. Due to the existence of the medium layer 2, even if the first heat conduction layer 31 is corroded by water and oxygen, water vapor is not easy to penetrate through the medium layer 2, so that the second heat conduction layer 32 is corroded by water and oxygen, and a display device in the display panel is protected from being corroded by water and oxygen.

Preferably, the corrosion resistance of the material of the first heat conducting layer 31 is greater than the corrosion resistance of the material of the second heat conducting layer 32. Thereby protecting the first heat conduction layer 31 far away from the display area 01 and near the periphery of the display panel from being corroded by water and oxygen to be damaged. Due to the corrosion resistance of the material of the first heat conduction layer 31, even if the side edge of the first heat conduction layer 31 is exposed to the air, the water and oxygen resistance of the display panel is not reduced, so that when the display panel is cut, the display panel can be directly cut along the side edge of the packaging layer 4, and the narrow frame design is realized. It should be noted that the material of the first heat conduction layer 31 may be a material that is not easily attacked by water and oxygen, such as molybdenum metal or polysilicon semiconductor.

It should be noted that the implementation (2) is similar to the implementation shown in fig. 4; the implementation (3.1) is similar to the implementation shown in fig. 5, and the implementation (3.2) is similar to the implementation shown in fig. 6, except that in the implementations in fig. 4, 5 and 6 the first heat conducting layer 31 is close to the display area 01 and the second heat conducting layer 32 is far from the display area 01; and in implementations (2), (3.1) and (3.2) the first heat conducting layer 31 is remote from the display area 01 and the second heat conducting layer 32 is close to the display area 01.

Further, the surface of the dielectric layer 2 away from the substrate 1 and not covered by the first heat conduction layer 31 is flush with the surface of the first heat conduction layer 31 away from the substrate 1.

Specifically, in the present embodiment, the thickness of the second heat conduction layer 32 is the same as that of the medium layer 2, so that the surface of the medium layer 2 away from the substrate 1 and not covered by the first heat conduction layer 31 is flush with the surface of the first heat conduction layer 31 away from the substrate 1, so that the encapsulation layer 4 is located in the same layer, and the preparation of the encapsulation layer 4 is facilitated.

Further, the orthographic projection of the encapsulation layer 4 on the substrate 1 falls within the range of the orthographic projection of the first heat conduction layer 31 and the second heat conduction layer 32 on the substrate 1, so that the first heat conduction layer 31 and the second heat conduction layer 32 can better homogenize the heat when the encapsulation layer 4 is cured.

It is worth mentioning that the material of the second heat conducting layer 32 comprises a metallic conductive material or a semiconductor conductive material; preferably, the second heat conducting layer 32 is connected to ground. Therefore, the static electricity of the display panel can be conducted to the grounding end, and the antistatic capacity of the display panel is improved. It should be noted that the material of the first heat conduction layer 31 in this embodiment also includes a metal conductive material or a semiconductor conductive material, and is connected to the ground terminal, so as to further improve the antistatic capability of the display panel.

It is realized that if the first heat conduction layer 31 is directly contacted with the second heat conduction layer 32, when the first heat conduction layer 31 is manufactured, the first heat conduction layer 31 extends out of the packaging area 02, and the extended first heat conduction layer 31 is connected with the ground terminal of the display panel. If the first heat conduction layer 31 and the second heat conduction layer 32 are not in direct contact, when the first heat conduction layer 31 and the second heat conduction layer 32 are manufactured, the first heat conduction layer 31 and the second heat conduction layer 32 extend out of the packaging area 02 to form a part, and the extended first heat conduction layer 31 is directly connected with the ground terminal of the display panel; and the dielectric layer 2 above the second heat conduction layer 32 is provided with a through hole, and is connected with the grounding end of the display panel by the through hole.

Compared with the prior art, the display panel provided by the embodiment of the invention has the following advantages:

(1) not only can protect the devices in the display panel from being corroded by water vapor, but also can well and uniformly package the heat generated when the layer 4 is cured, thereby improving the packaging reliability of the display panel. The packaging layer 4 is located the one side that the base plate 1 was kept away from to first heat-conducting layer 31, and packaging layer 4 still keeps away from the surface contact of base plate 1 with partial dielectric layer 2, because dielectric layer 2 is difficult to be corroded by water oxygen to in avoiding the air steam to get into display panel, protect the device in the display panel not to receive the steam to corrode. In this embodiment, the second heat conduction layer 32 located on one side of the medium layer 2 facing the substrate 1 is arranged, at least part of orthographic projection of the first heat conduction layer 31 on the substrate 1 is staggered with that of the second heat conduction layer 32 on the substrate 1, and part of orthographic projection of the encapsulation layer 4 on the substrate 1 is superposed with that of the second heat conduction layer 32 on the substrate 1, therefore, compared with the existing scheme that only the first heat conduction layer 31 is used for heat during curing of the uniform encapsulation layer 4, the first heat conduction layer 31 and the second heat conduction layer 32 which are at least partially staggered are projected, and heat conduction layer materials of heat during curing of the uniform encapsulation layer 4 are increased, therefore, heat during curing of the uniform encapsulation layer 4 can be better, and the encapsulation reliability of the display panel is improved.

(2) The antistatic capability of the display panel is improved. In this embodiment, the second heat conduction layer 32 is connected to the ground terminal, so that the static electricity of the display panel can be conducted to the ground terminal, thereby improving the antistatic capability of the display panel. And the first heat conduction layer 31 can also be connected to the ground terminal, thereby further improving the antistatic capability of the display panel.

(3) Narrow bezel designs can be implemented. In this embodiment, when the first heat conduction layer 31 is close to the display area 01 and the second heat conduction layer 32 is far from the display area 01, the corrosion resistance of the material of the second heat conduction layer 32 is greater than that of the material of the first heat conduction layer 31, and even if the side of the second heat conduction layer 32 is exposed to the air, the water and oxygen resistance of the display panel is not reduced due to the corrosion resistance of the material of the second heat conduction layer 32, so that when the display panel is cut, the display panel can be directly cut along the side of the encapsulation layer 4, and a narrow frame design can be realized. When the first heat conduction layer 31 is far away from the display area 01 and the second heat conduction layer 32 is close to the display area 01, the corrosion resistance of the material of the first heat conduction layer 31 is greater than that of the material of the second heat conduction layer 32, and even if the side edge of the first heat conduction layer 31 is exposed to the air, the water and oxygen resistance of the display panel cannot be reduced due to the corrosion resistance of the material of the first heat conduction layer 31, so that when the display panel is cut, the display panel can be directly cut along the side edge of the packaging layer 4, and the narrow-frame design can be realized.

A second embodiment of the present invention relates to a display panel. The second embodiment is an improvement of the first embodiment, and the main improvement lies in that the structure of the medium layer 2 is further defined in the scheme, and a specific arrangement mode of the second heat conduction layer 32 and the medium layer 2 is given.

In this embodiment, as shown in fig. 8, the dielectric layer 2 includes: a first dielectric layer 21 located on the substrate 1, and a second dielectric layer 22 located on one side of the first dielectric layer 21 far from the substrate 1. The first dielectric layer 21 may be made of silicon nitride, and the second dielectric layer 22 may be made of silicon oxide.

In a practical manner, the second heat conductive layer 32 is located between the first medium layer 21 and the second medium layer 22.

In this embodiment, the first heat conductive layer 31 is illustrated as being close to the display region 01 and the second heat conductive layer 32 is illustrated as being far from the display region 01. It is understood that the second heat conducting layer 32 is close to the display area 01, and the implementation of the first heat conducting layer 31 away from the display area 01 is within the protection scope of the present embodiment.

The specific implementation modes at least comprise three types:

as shown in fig. 8, there is a gap between the orthographic projection of the first heat conduction layer 31 on the substrate 1 and the orthographic projection of the second heat conduction layer 32 on the substrate 1. That is, the first heat conductive layer 31 and the second heat conductive layer 32 are separated by the second medium layer 22, the first heat conductive layer 31 and the second heat conductive layer 32 are not in contact, and there is no overlapping portion between the orthographic projection of the first heat conductive layer 31 on the substrate 1 and the orthographic projection of the second heat conductive layer 32 on the substrate 1. Due to the existence of the second dielectric layer 22, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the dielectric layer 2 to enter the display panel, so that a display device in the display panel is protected from being corroded by water and oxygen.

Alternatively, as shown in fig. 9, the orthographic projection of the first heat conducting layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conducting layer 32 on the substrate 1. That is, a partial surface of the first heat conductive layer 31 facing the substrate 1 and a partial surface of the second heat conductive layer 32 facing away from the substrate 1 are in direct contact. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that no gap exists, and the heat generated during curing of the packaging layer 4 can be better and uniformly distributed; and the second medium layer 22 is directly divided into a first part arranged on the second heat conduction layer 32 and a second part which is arranged on one side of the first heat conduction layer 31 facing the substrate 1 and is on the same layer with the second heat conduction layer 32, so that the preparation is convenient.

Still alternatively, an orthographic projection of the first heat conductive layer 31 on the substrate 1 overlaps with an orthographic projection of the second heat conductive layer 32 on the substrate 1.

There are two implementations, one implementation is shown in fig. 10: the first conductive layer 31 and the second conductive layer 32 are separated by the second dielectric layer 22. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is partially overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that the heat of the packaging layer 4 during curing can be better and uniformly distributed; and because of the existence of the second dielectric layer 22, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the dielectric layer 2 and enter the display panel, so that a display device in the display panel is protected from being corroded by water and oxygen.

Another specific implementation is shown in fig. 11: the partial surface of the first heat conducting layer 31 facing the substrate 1 and the partial surface of the second heat conducting layer 32 facing away from the substrate 1 are in direct contact. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is partially overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that the heat of the packaging layer 4 during curing can be better and uniformly distributed; and the second medium layer 22 is directly divided into a first part arranged on the second heat conduction layer 32 and a second part which is arranged on one side of the first heat conduction layer 31 facing the substrate 1 and is on the same layer with the second heat conduction layer 32, so that the preparation is convenient.

As another realisable approach, the second thermally conductive layer 32 is located between the first dielectric layer 21 and the substrate 1.

The specific implementation modes at least comprise three types:

as shown in fig. 12, there is a gap between the orthographic projection of the first heat conduction layer 31 on the substrate 1 and the orthographic projection of the second heat conduction layer 32 on the substrate 1. That is, the first heat conductive layer 31 and the second heat conductive layer 32 are separated by the first medium layer 21 and the second medium layer 22, the first heat conductive layer 31 and the second heat conductive layer 32 are not in contact, and there is no overlapping portion between an orthographic projection of the first heat conductive layer 31 on the substrate 1 and an orthographic projection of the second heat conductive layer 32 on the substrate 1. And because of the existence of the first medium layer 21 and the second medium layer 22, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the first medium layer 21 and the second medium layer 22 to enter the display panel, so that a display device in the display panel can be better protected from being corroded by water and oxygen.

Alternatively, as shown in fig. 13, the orthographic projection of the first heat conducting layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conducting layer 32 on the substrate 1. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is in contact with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that no gap exists, and the heat generated during curing of the packaging layer 4 can be better and uniformly distributed; the second medium layer 22 is directly divided into a first part arranged on the second heat conduction layer 32 and a second part which is arranged on one side of the first heat conduction layer 31 facing the substrate 1 and is on the same layer with the second heat conduction layer 32, so that the preparation is convenient; meanwhile, the first heat conduction layer 31 and the second heat conduction layer 32 are separated by the first medium layer 21, and even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the first medium layer 21 to enter the display panel, so that a display device in the display panel can be well protected from being corroded by water and oxygen.

There are two specific implementations, one is shown in fig. 14, the first conductive layer 31 and the second conductive layer 32 are separated by the first dielectric layer 21 and the second dielectric layer 22. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is partially overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that the heat of the packaging layer 4 during curing can be better and uniformly distributed; and because of the existence of the first medium layer 21 and the second medium layer 22, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the first medium layer 21 and the second medium layer 22 to enter the display panel, so that a display device in the display panel can be well protected from being corroded by water and oxygen.

Another specific implementation is shown in fig. 15 where the first conductive layer 31 and the second conductive layer 32 are separated by a first dielectric layer 21. In the scheme, the orthographic projection of the first heat conduction layer 31 on the substrate 1 is partially overlapped with the orthographic projection of the second heat conduction layer 32 on the substrate 1, so that the heat of the packaging layer 4 during curing can be better and uniformly distributed; the second medium layer 22 is directly divided into a first part arranged on the second heat conduction layer 32 and a second part which is arranged on one side of the first heat conduction layer 31 facing the substrate 1 and is on the same layer with the second heat conduction layer 32, so that the preparation is convenient; due to the existence of the first medium layer 21, even if the second heat conduction layer 32 is corroded by water and oxygen, water vapor is not easy to penetrate through the first medium layer 21 and the second medium layer 22 to enter the display panel, and therefore, a display device in the display panel can be well protected from being corroded by water and oxygen.

It should be noted that in this embodiment, the surface of the second dielectric layer 2 away from the substrate 1 and not covered by the first heat conducting layer 31 is flush with the surface of the first heat conducting layer 31 away from the substrate 1, so that the encapsulation layers 4 are located in the same layer, which facilitates the preparation of the encapsulation layers 4.

Compared with the prior art, the embodiment of the invention provides a display panel, and the dielectric layer 2 comprises: a first dielectric layer 21 positioned on the substrate 1, and a second dielectric layer 22 positioned on one side of the first dielectric layer 21 far away from the substrate 1; the second heat conduction layer 32 is positioned between the first medium layer 21 and the second medium layer 22; alternatively, the second heat conduction layer 32 is located between the first medium layer 21 and the substrate 1. The structure of the dielectric layer 2 is further limited in the scheme, and the specific arrangement mode of the second heat conduction layer 32 and the dielectric layer 2 is given, so that the diversified design of the display panel structure is realized.

A third embodiment of the present invention relates to a display panel. The third embodiment is an improvement of the first embodiment, and the main improvements are as follows: the structure of the dielectric layer 2, the structure of the second heat conduction layer 32 and the specific arrangement mode of the second heat conduction layer 32 and the dielectric layer 2 are provided in the scheme, so that the diversified design of the display panel structure is realized.

As shown in fig. 16 and 17, the dielectric layer 2 in the present embodiment includes: a first dielectric layer 21 located on the substrate 1, and a second dielectric layer 22 located on one side of the first dielectric layer 21 far from the substrate 1. The first dielectric layer 21 may be made of silicon nitride, and the second dielectric layer 22 may be made of silicon oxide.

As shown in fig. 16 and 17, the second heat conductive layer 32 in this embodiment includes: the first heat conduction sub-layer 321 and the second heat conduction sub-layer 322 are respectively located on two opposite sides of the first medium layer 21, and an orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is located between the orthographic projection of the second heat conduction sub-layer 322 and the orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

In this embodiment, the first heat conductive layer 31 is illustrated as being close to the display region 01 and the second heat conductive layer 32 is illustrated as being far from the display region 01.

In the present embodiment, an orthographic projection of the first heat conducting sub-layer 321 on the substrate 1, an orthographic projection of the second heat conducting sub-layer 322 on the substrate 1, and a gap from an orthographic projection of the first heat conducting sub-layer 31 on the substrate 1 are taken as an example for explanation.

In an implementation manner, as shown in fig. 16, the first sub-thermal conduction layer 321 is located between the substrate 1 and the first medium layer 21, and the second sub-thermal conduction layer 322 is located between the first medium layer 21 and the second medium layer 22. In this embodiment, the second sub-heat-conductive layer 322 and the first heat-conductive layer 31 are separated by the second medium layer 22, the first sub-heat-conductive layer 321 and the second sub-heat-conductive layer 322 are separated by the first medium layer 21, and the first sub-heat-conductive layer 321 and the first heat-conductive layer 31 are separated by the first medium layer 21 and the second medium layer 22. Due to the existence of the second dielectric layer 22, even if the second sub heat conduction layer 322 is corroded by water and oxygen, water vapor is not easy to penetrate through the second dielectric layer 22 and enter the display panel, so that the display device in the display panel can be well protected from being corroded by water and oxygen.

As another way of achieving this, as shown in fig. 17, the first sub-thermal conductive layer 321 is located between the first medium layer 21 and the second medium layer 22, and the second sub-thermal conductive layer 322 is located between the substrate 1 and the first medium layer 21. In this embodiment, the second sub-thermal conductive layer 322 and the first sub-thermal conductive layer 321 are separated by the first medium layer 21, and the first sub-thermal conductive layer 321 and the first thermal conductive layer 31 are separated by the second medium layer 22. Due to the existence of the second dielectric layer 22, even if the second sub heat conduction layer 322 is corroded by water and oxygen, water vapor is not easy to penetrate through the second dielectric layer 22 and enter the display panel, so that the display device in the display panel can be well protected from being corroded by water and oxygen.

In this embodiment, an orthogonal projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with or partially overlaps an orthogonal projection of the second heat conduction sub-layer 322 on the substrate 1, and/or an orthogonal projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with or partially overlaps an orthogonal projection of the first heat conduction sub-layer 31 on the substrate 1.

There may be several implementations:

1. an orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and a gap exists between the orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 and the orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

2. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and an orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with an orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

3. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and the orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is overlapped with an orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

4. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is overlapped with an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and a gap exists between the orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 and the orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

5. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is overlapped with an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and the orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with an orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

6. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 overlaps with an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and an orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 overlaps with an orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

7. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is separated from an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and an orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is separated from an orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

8. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is separated from an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and the orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is in contact with the orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

9. An orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is separated from an orthographic projection of the second heat conduction sub-layer 322 on the substrate 1, and the orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is overlapped with an orthographic projection of the first heat conduction sub-layer 31 on the substrate 1.

It should be noted that the specific implementation manners of the above-mentioned embodiments 1 to 9 are substantially the same as the arrangement manners of the third embodiment (with gaps, contacts or overlaps), and are not described again in this embodiment.

In this embodiment, since the first heat conduction layer 31 is close to the display region 01 and the second heat conduction layer 32 is far from the display region 01, the corrosion resistance of the material of the second heat conduction sub-layer 322 is higher than that of the material of the first heat conduction sub-layer 321. Thereby protecting the second sub-thermal conductive layer 322 near the periphery of the display panel from being corroded by water and oxygen. It should be noted that the material of the second sub-thermal conductive layer 322 may be molybdenum metal or semiconductor polysilicon, which is not easily attacked by water and oxygen.

If the first heat conduction layer 31 is far away from the display area 01 and the second heat conduction layer 32 is close to the display area 01, the corrosion resistance of the material of the first sub heat conduction layer 321 is set to be greater than that of the material of the second sub heat conduction layer 322, so that the first sub heat conduction layer 321 close to the periphery of the display panel is protected from being corroded by water and oxygen and damaged. It should be noted that the material of the first sub-thermal conductive layer 321 may be molybdenum metal or polysilicon semiconductor, which is not easily attacked by water and oxygen.

Compared with the prior art, the embodiment of the invention provides a display panel, which comprises: the dielectric layer 2 includes: the first dielectric layer 21 is positioned on the substrate 1, and the second dielectric layer 22 is positioned on one side of the first dielectric layer 21, which is far away from the substrate 1; the second heat conductive layer 32 includes: the first heat conduction sub-layer 321 and the second heat conduction sub-layer 322 are respectively located on two opposite sides of the first medium layer 21, and an orthographic projection of the first heat conduction sub-layer 321 on the substrate 1 is located between the orthographic projection of the second heat conduction sub-layer 322 and the orthographic projection of the first heat conduction sub-layer 31 on the substrate 1. The structure of the medium layer 2, the structure of the second heat conduction layer 32, and the specific arrangement of the second heat conduction layer 32 and the medium layer 2 are given.

A fourth embodiment of the present invention also provides a display device including the display panel in any one of the above embodiments.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.

Claims

1. A display panel, comprising:

a package region on the substrate;

a dielectric layer on the substrate;

the first heat conduction layer is positioned on the partial surface of the medium layer far away from the substrate, and the second heat conduction layer is positioned on one side of the medium layer facing the substrate, wherein the orthographic projection of the first heat conduction layer on the substrate is at least partially staggered with the orthographic projection of the second heat conduction layer on the substrate;

the packaging layer is positioned on one side, far away from the substrate, of the first heat conduction layer, the packaging layer is also in contact with the surface, far away from the substrate, of the medium layer, and the orthographic projection of the packaging layer on the substrate is overlapped with the orthographic projection of the second heat conduction layer on the substrate.

2. The display panel according to claim 1, further comprising: a display area, the encapsulation area surrounding the display area;

the first heat conduction layer is close to the display area, and the second heat conduction layer is far away from the display area;

preferably, the corrosion resistance of the material of the second heat conducting layer is greater than the corrosion resistance of the material of the first heat conducting layer;

or the first heat conduction layer is far away from the display area, and the second heat conduction layer is close to the display area;

preferably, the corrosion resistance of the material of the first heat conducting layer is greater than the corrosion resistance of the material of the second heat conducting layer.

3. The display panel of claim 1, wherein the surface of the dielectric layer remote from the substrate and not covered by the first thermally conductive layer is flush with the surface of the first thermally conductive layer remote from the substrate.

4. The display panel of claim 1, wherein an orthographic projection of the encapsulation layer on the substrate falls within a range of orthographic projections of the first thermally conductive layer and the second thermally conductive layer on the substrate.

5. The display panel of claim 1, wherein the dielectric layer comprises: the first dielectric layer is positioned on the substrate, and the second dielectric layer is positioned on one side of the first dielectric layer, which is far away from the substrate;

the second heat conduction layer is positioned between the first medium layer and the second medium layer;

or the second heat conduction layer is positioned between the first medium layer and the substrate.

6. The display panel of claim 1, wherein an orthographic projection of the first thermally conductive layer on the substrate is in contact with or partially overlaps an orthographic projection of the second thermally conductive layer on the substrate.

7. The display panel of claim 1, wherein the dielectric layer comprises: the first dielectric layer is positioned on the substrate, and the second dielectric layer is positioned on one side of the first dielectric layer, which is far away from the substrate;

the second thermally conductive layer includes: the first sub heat conduction layer and the second sub heat conduction layer are respectively located on two opposite sides of the first medium layer, and the orthographic projection of the first sub heat conduction layer on the substrate is located between the orthographic projection of the second sub heat conduction layer and the orthographic projection of the first heat conduction layer on the substrate.

8. The display panel according to claim 7,

the first sub heat conduction layer is positioned between the substrate and the first medium layer, and the second sub heat conduction layer is positioned between the first medium layer and the second medium layer;

or the first sub heat conduction layer is positioned between the first medium layer and the second medium layer, and the second sub heat conduction layer is positioned between the substrate and the first medium layer;

9. The display panel of claim 1, wherein the material of the second thermally conductive layer comprises a metallic conductive material or a semiconductor conductive material;

preferably, the second thermally conductive layer is connected to ground.

10. A display device, comprising: a display panel as claimed in any one of the claims 1 to 9.