CN110911421A - Back plate for organic light-emitting display panel, manufacturing method and display panel - Google Patents
Back plate for organic light-emitting display panel, manufacturing method and display panel Download PDFInfo
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- CN110911421A CN110911421A CN201911198061.2A CN201911198061A CN110911421A CN 110911421 A CN110911421 A CN 110911421A CN 201911198061 A CN201911198061 A CN 201911198061A CN 110911421 A CN110911421 A CN 110911421A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention discloses a back plate for an organic light-emitting display panel, a manufacturing method of the back plate and the display panel. The back plate has a through hole penetrating through the back plate, a package area of the back plate has an edge surrounding the through hole, and the back plate includes: a substrate; the first planarization layer and the first passivation layer are positioned on the substrate, the first passivation layer is positioned on one side, away from the substrate, of the first planarization layer, and the first planarization layer and the first passivation layer extend to one side, close to the through hole, outside the packaging region; and the isolation groove is positioned on one side, close to the through hole, outside the packaging area on the substrate, and penetrates through the first passivation layer and extends into the first planarization layer. Therefore, the isolation grooves in the first passivation layer and the first planarization layer can better block water and oxygen invasion at the through hole, the service performance of the organic light-emitting diode on the back plate is improved, the service life of the organic light-emitting diode is prolonged, the isolation grooves are not arranged in a display area on the substrate, and wiring of the substrate is not affected.
Description
Technical Field
The invention relates to the technical field of display, in particular to a backboard for an organic light-emitting display panel, a manufacturing method and the display panel.
Background
The organic light emitting display device comprises an organic light emitting diode, wherein the organic light emitting diode comprises an anode, a cathode and an organic light emitting material positioned between the anode and the cathode, the cathode in the organic light emitting diode is usually an active metal and is easy to react with water vapor permeated in, and the water oxygen permeated in can also react with the organic light emitting material, and the service performance and the service life of the organic light emitting diode can be influenced by the reactions. At present, the organic light emitting diode is usually sealed by adopting packaging modes such as film packaging, dam filling packaging, end face sealant packaging and the like so as to improve the service performance of the organic light emitting diode and prolong the service life of the organic light emitting diode.
However, the current organic light emitting display panel still needs to be improved.
Disclosure of Invention
The present invention is based on the discovery and recognition by the inventors of the following facts and problems:
the inventors have found that the lifetime of display panels with through holes is generally low. For example, in order to increase the screen ratio of the display screen, it is often adopted to provide through holes in the display area of the display panel for providing other devices, such as a camera. However, since the package structure at the through hole is not properly disposed, external water and oxygen easily permeate into the organic light emitting diode from the through hole, and the package structure in the display panel cannot effectively block the water and oxygen from the through hole, thereby affecting the performance and the service life of the organic light emitting diode.
The present invention aims to alleviate or solve at least to some extent at least one of the above mentioned problems.
In one aspect of the present invention, a backplane for an organic light emitting display panel is presented. The backplate has a through-hole passing through the backplate, a package region of the backplate has an edge surrounding the through-hole, the backplate includes: a substrate; a first planarization layer and a first passivation layer on the substrate, the first passivation layer being on a side of the first planarization layer away from the substrate, the first planarization layer and the first passivation layer extending to a side outside the encapsulation area near the via; an isolation trench located on the substrate at a side of the substrate outside the encapsulation region near the through hole, the isolation trench penetrating through the first passivation layer and extending into the first planarization layer. Therefore, the isolation grooves in the first passivation layer and the first planarization layer can better block water and oxygen invasion at the through hole, the service performance of the organic light-emitting diode on the back plate is improved, the service life of the organic light-emitting diode is prolonged, the isolation grooves are not arranged in a display area on the substrate, and wiring of the substrate is not affected.
According to an embodiment of the invention, the back plate further comprises: a first source drain metal layer located between the substrate and the first planarization layer; the second source drain metal layer is positioned on one side, far away from the first planarization layer, of the first passivation layer; the second planarization layer is positioned on one side, far away from the first passivation layer, of the second source drain metal layer; the second passivation layer is positioned on one side, far away from the second source-drain metal layer, of the second planarization layer, the second planarization layer and the second passivation layer extend to one side, close to the through hole, outside the packaging area, and the isolation groove penetrates through the second passivation layer, the second planarization layer and the first passivation layer and extends into the first planarization layer. Therefore, for the back plate with the double-layer source drain metal layer, the isolation groove can be formed in the second passivation layer, the second planarization layer, the first passivation layer and the first planarization layer, the isolation groove is used for blocking water and oxygen permeation at the through hole, the service performance of the organic light-emitting diode on the back plate is improved, the service life of the organic light-emitting diode is prolonged, the isolation groove only extends to the planarization layer, and the arrangement of wiring on the substrate cannot be influenced.
According to an embodiment of the present invention, the backplane further comprises a second isolation slot, the second isolation slot being located within the encapsulation area. Therefore, the penetration of water and oxygen at the through hole can be further blocked, the service performance of the organic light-emitting diode is improved, and the service life of the organic light-emitting diode is prolonged.
According to the embodiment of the invention, along the plane of the substrate, the cross-sectional width of the part of the isolation groove in the passivation layer is smaller than that of the part of the isolation groove in the planarization layer. Therefore, the isolation groove has the eave structure, and when the organic light emitting material layer of the organic light emitting diode is manufactured, the structure can enable the organic light emitting material layer to be disconnected at the isolation groove, so that water and oxygen at the through hole are effectively blocked from permeating into the organic light emitting diode along the organic light emitting material layer.
According to an embodiment of the invention, the substrate is a flexible substrate. Therefore, the display panel applying the back plate can realize flexible display.
In another aspect of the present invention, a display panel is provided. According to an embodiment of the present invention, the display panel includes: a back plate, said back plate being as previously described; the organic light emitting diode is positioned on one side of the passivation layer away from the planarization layer; and the packaging structure is positioned on one side of the organic light-emitting diode, which is far away from the passivation layer, and the through hole in the back plate simultaneously penetrates through the packaging structure. Therefore, the display panel has all the features and advantages of the back panel described above, and will not be described herein again. In general, the display panel has good display effect and long service life.
According to an embodiment of the present invention, the encapsulation structure includes an inorganic layer, an organic layer, and a dam structure that can define a position of the organic layer, the dam structure is located at an edge of the encapsulation area, and the isolation groove is located at a side of the dam structure close to the through hole and a side of the dam structure far away from the through hole. Therefore, the display panel has good display effect and long service life.
In another aspect of the invention, the invention provides a method of making the aforementioned backing sheet. According to an embodiment of the invention, the method comprises: providing a substrate, wherein the substrate is provided with a through hole penetrating through the substrate, and a packaging area of the substrate is provided with an edge surrounding the through hole; sequentially arranging a first rough planarization layer blank and a first rough passivation layer blank on the substrate, wherein the first rough planarization layer blank and the first rough passivation layer blank extend to one side, close to the through hole, outside the packaging area; and sequentially carrying out dry etching on the first passivation layer rough blank and the first planarization layer rough blank to form an isolation groove which is positioned outside the packaging area, is close to one side of the through hole, penetrates through the first passivation layer rough blank and extends into the first planarization layer rough blank. Therefore, the method can form the isolation groove for blocking the water and oxygen invasion at the through hole in the back plate, and has the advantages of high speed, short period and high yield.
According to an embodiment of the invention, the dry etching comprises: arranging a photoresist mask on the surface of the first passivation layer rough blank; performing dry etching on the first passivation layer rough blank by using first gas based on the photoresist mask; and performing dry etching on the first planarization layer rough blank by using a second gas based on the photoresist mask to form the isolation groove. Thus, the isolation trench can be formed easily.
According to an embodiment of the invention, the dry etching comprises: arranging a photoresist mask on the surface of the first passivation layer rough blank; based on the photoresist mask, carrying out dry etching on the first passivation layer rough blank by using first gas, and stripping the photoresist mask to form a first passivation layer; and performing dry etching on the first planarization layer rough blank by using a second gas based on the first passivation layer to form the isolation groove. Thus, the isolation trench can be formed easily.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a schematic structural diagram of a back plate according to an embodiment of the present invention;
FIG. 2 shows a schematic structural diagram of a back plate according to another embodiment of the present invention;
FIG. 3 shows a schematic structural diagram of a back plate according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of a display panel according to an embodiment of the present invention;
FIG. 5 is an enlarged view of the structure of the dotted line portion A in FIG. 4;
FIG. 6 is an enlarged view of the structure of the dotted line portion B in FIG. 4;
FIG. 7 is a flow chart illustrating a method of fabricating a backplate according to one embodiment of the present invention.
Description of reference numerals:
100: a substrate; 110: a first flexible substrate; 120: a buffer layer; 130: a second flexible substrate; 140: a barrier layer; 200: a first planarizing layer; 300: a first passivation layer; 400: a first source drain metal layer; 500: a second source drain metal layer; 600: a second planarizing layer; 700: a second passivation layer; 810: a first inorganic layer; 830: a second inorganic layer; 820: an organic layer; 840: a dam structure; 900: a third planarizing layer; 10: a display area; 20: a packaging area; 30: a through hole; 40: an isolation trench; 50: a layer of organic light emitting material; 60: a second isolation trench.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In one aspect of the present invention, a backplane for an organic light emitting display panel is presented. According to an embodiment of the invention, referring to fig. 1, the backplane has a through-hole 30 running through the entire backplane, the package area 20 of the backplane having an edge (shown in phantom in fig. 1) surrounding the through-hole 30. The through hole 30 can be used for installing components such as a camera, and the frame at the position of the camera can be saved by the scheme of digging a hole in the display area 10 and arranging the camera, so that the screen occupation ratio of the display device utilizing the organic light-emitting display panel is improved. Due to the existence of the through hole 30, besides the package structure surrounding the edge of the backplane, a package structure surrounding the through hole is also needed to be disposed to package the periphery of the through hole, and the package structure surrounding the through hole is located at the edge of the package area 20 surrounding the through hole 30. The back plate includes: the semiconductor package structure comprises a substrate 100, a first planarization layer 200, a first passivation layer 300 and an isolation groove 40, wherein the first planarization layer 200 is located on the substrate 100, the first passivation layer 300 is located on a side of the first planarization layer 200 away from the substrate 100, the first planarization layer 200 and the first passivation layer 300 extend to a side, close to the through hole 30, outside an encapsulation area 20, the isolation groove 40 is located on the substrate 100, close to the through hole 30, outside the encapsulation area 20, and the isolation groove 40 penetrates through the first passivation layer 300 and extends into the first planarization layer 200. Therefore, the isolation grooves in the first passivation layer and the first planarization layer can better block water and oxygen invasion at the through hole, the service performance of the organic light-emitting diode on the back plate is improved, the service life of the organic light-emitting diode is prolonged, the isolation grooves do not penetrate through the substrate, only extend to the planarization layer, and wiring of the substrate is not affected.
According to an embodiment of the present invention, the first passivation layer 300 is positioned on a side of the first planarization layer 200 away from the substrate 100 by extending the first planarization layer 200 and the first passivation layer 300 to the outside of the edge of the encapsulation area 20 and providing the isolation trench 40 in the first passivation layer 300 and the first planarization layer 200. On one hand, as the first passivation layer is made of inorganic materials, the first planarization layer is made of organic materials, and the first passivation layer is positioned on the upper side of the first planarization layer, when the isolation groove is formed through etching, etching gas or etching liquid can be moderately diffused in the organic materials, and therefore, the formed isolation groove has an eave structure, namely the cross section width of the groove in the first passivation layer is smaller than that of the groove in the first planarization layer. Therefore, when the organic light-emitting material layer in the organic light-emitting diode is arranged subsequently, the organic light-emitting material layer can be broken at the isolation groove to form a discontinuous film layer. Therefore, on one hand, the part of the organic light-emitting material layer between the isolation groove and the through hole is disconnected with the part of the isolation groove far away from the through hole. On the other hand, the water and oxygen permeating from the through hole 30 to the inner side of the display area can be blocked by the isolation groove of the eave structure, so that the water and oxygen at the through hole can be effectively blocked from permeating into the organic light-emitting diode along the organic light-emitting material layer, the service performance of the organic light-emitting diode is improved, and the service life of the organic light-emitting diode is prolonged. On the other hand, because the substrate is provided with a plurality of wires for controlling the display of the display panel, and the wires are mostly arranged on the same layer with the electrodes of the elements such as the thin film transistors on the display substrate and are usually positioned between the passivation layer and the substrate. Therefore, in the invention, the isolation groove is located in the first planarization layer and the first passivation layer, and under the condition of enhancing the water and oxygen barrier effect, compared with the isolation groove structure extending to the substrate 100, the routing of the substrate can not be affected, that is, the existing substrate can be adopted, and additional routing on the substrate is not required to be designed.
The following detailed description of the various structures of the back sheet is provided in accordance with specific embodiments of the present invention:
the specific constituent materials of the first planarizing layer and the first passivation layer are not particularly limited, and those skilled in the art can design them according to the materials commonly used for the planarizing layer and the passivation layer in the display back plate.
According to an embodiment of the present invention, referring to fig. 2, a first source-drain metal layer 400 is disposed on the substrate 100, the first source-drain metal layer 400 is located between the substrate 100 and the first planarization layer 200, and the first passivation layer 300 is located on a side of the first passivation layer 200 away from the first source-drain metal layer 400. As is well known to those skilled in the art, in the conventional backplane, the passivation layer covers the source and drain metal layers, and the planarization layer is located on a side of the passivation layer away from the source and drain metal layers. According to the invention, the positions of the first planarization layer and the first passivation layer are exchanged, on one hand, an isolation groove with an eave structure can be formed in the first passivation layer and the first planarization layer to block water and oxygen from permeating into the through hole, on the other hand, a new film layer structure is not added, and the thickness of the back plate is not increased, and on the other hand, the inventor finds that the use of devices on the back plate is not influenced by the exchange of the positions of the passivation layer and the planarization layer.
According to an embodiment of the present invention, referring to fig. 3, the back plate may further include: a second source-drain metal layer 500, a second planarization layer 600 and a second passivation layer 700, wherein the second source-drain metal layer 500 is located on a side of the first passivation layer 300 away from the first planarization layer 200, the second planarization layer 600 is located on a side of the second source-drain metal layer 500 away from the first passivation layer 300, the second passivation layer 700 is located on a side of the second planarization layer 600 away from the second source-drain metal layer 500, and the second planarization layer 600 and the second passivation layer 700 extend to the outside of the edge (the dotted line position shown in fig. 3) of the encapsulation region 20 surrounding the via hole 30, and the isolation trench 40 penetrates through the second passivation layer 700, the second planarization layer 600, the first passivation layer 300 and extends into the first planarization layer 200. Therefore, aiming at the back plate with the double-layer source drain metal layer, the isolation groove can be formed in the second passivation layer, the second planarization layer, the first passivation layer and the first planarization layer, the water and oxygen permeation of the through hole is blocked by the isolation groove, the service performance of the organic light-emitting diode on the back plate is improved, the service life of the organic light-emitting diode is prolonged, and the arrangement of wiring on the substrate is not influenced.
According to an embodiment of the present invention, referring to fig. 2 and 3, a second isolation trench 60 may be further disposed on the backplane, the second isolation trench 60 being located inside the encapsulation region 20, the second isolation trench 60 penetrating the passivation layer and extending into the planarization layer. Therefore, the penetration of water and oxygen at the through hole can be further blocked, the service performance of the organic light-emitting diode is improved, and the service life of the organic light-emitting diode is prolonged.
According to an embodiment of the present invention, the cross-sectional width of the portion of the isolation trench 40 located in the passivation layer is smaller than the cross-sectional width of the portion located in the planarization layer along the plane of the substrate. Specifically, the cross-sectional width of the portion of the isolation trench 40 in the first passivation layer 300 is smaller than the cross-sectional width of the portion in the first planarization layer 200, and the cross-sectional width of the portion of the isolation trench 40 in the second passivation layer 700 is smaller than the cross-sectional width of the portion in the second planarization layer 600. Therefore, the isolation groove has the eave structure, and when the organic light emitting material layer of the organic light emitting diode is manufactured, the structure can enable the organic light emitting material layer to be disconnected at the isolation groove, so that water and oxygen at the through hole are effectively blocked from permeating into the organic light emitting diode along the organic light emitting material layer.
According to an embodiment of the present invention, the substrate 100 may be a flexible substrate. Specifically, the base plate 100 may include a first flexible substrate 110, a buffer layer 120, a second flexible substrate 130, and a barrier layer 140, which are sequentially stacked. Therefore, the display panel applying the back plate can realize flexible display.
In another aspect of the present invention, a display panel is provided. According to an embodiment of the present invention, referring to fig. 4, the display panel includes: a backplane, an organic light emitting diode, and an encapsulation structure, wherein the backplane is the backplane described above, the organic light emitting diode is located on a side (only the organic light emitting material layer 50 in the organic light emitting diode is shown in fig. 4) of the passivation layer (such as the first passivation layer 300 shown in fig. 4) away from the planarization layer (such as the first planarization layer 200 shown in fig. 4), the encapsulation structure (810, 820, and 830 shown in fig. 4) is located on a side of the organic light emitting diode away from the passivation layer, and the through hole 30 in the backplane penetrates through the encapsulation structure. Therefore, the display panel has all the features and advantages of the back plate described above, and will not be described herein again. In general, the display panel has good display effect and long service life.
According to an embodiment of the present invention, referring to fig. 4, the encapsulation structure includes inorganic layers (e.g., a first inorganic layer 810 and a second inorganic layer 830), an organic layer 820, and a dam structure 840 that may define the position of the organic layer 820: the organic layer 820 is located between the adjacent inorganic layers 810 and 830 and in a sealed space formed by the inorganic layers 810 and 830 and the dam structure 840, the dam structure 840 is located at the edge of the encapsulation area 20, and the isolation trench is located at a side of the dam structure 840 close to the through hole 30 and at a side of the dam structure 840 away from the through hole 30. Therefore, the display panel has good display effect and long service life.
According to an embodiment of the present invention, referring to fig. 4, the display panel may further include a third planarization layer 900, and the planarization layer 900 is located on a side of the inorganic layer 830 away from the organic layer 820. Thereby providing a flat surface for the display panel to combine with other structures.
According to the embodiment of the present invention, when the organic light emitting material of the organic light emitting diode is disposed on the backplane by evaporation, since the isolation grooves having an eave structure are disposed in the first passivation layer 300 and the first planarization layer 200, the formed organic light emitting material layer 50 is broken at the isolation grooves (refer to fig. 5 and 6), that is, a portion of the organic light emitting material layer 50 located between the isolation grooves and the through holes is disconnected from a portion of the isolation grooves located on a side far from the through holes, so that water and oxygen at the through holes can be effectively prevented from permeating into the organic light emitting diode along the organic light emitting material layer.
According to an embodiment of the present invention, referring to fig. 5, the isolation trench located inside the encapsulation region has sidewalls coated with the first inorganic layer 810 in the encapsulation structure, and the organic layer 820 fills the remaining portion of the isolation trench. Referring to fig. 6, the sidewall of the isolation trench located outside the encapsulation region and near one side of the via hole is sequentially coated with a first inorganic layer 810 and a second inorganic layer 830, and a third planarization layer 900 fills the remaining portion of the isolation trench. Therefore, the inorganic layer coats the isolation groove, so that the permeation of water and oxygen at the through hole can be further blocked, the service performance of the organic light-emitting diode is improved, and the service life of the organic light-emitting diode is prolonged. According to an embodiment of the present invention, the first inorganic layer 810 and the second inorganic layer 830 may be formed using a chemical vapor deposition method.
In another aspect of the invention, the invention provides a method of making the previously described back sheet. Referring to fig. 7, the method includes, according to an embodiment of the present invention:
s100: providing a substrate
According to an embodiment of the invention, in this step, a substrate is provided. According to an embodiment of the invention, the substrate has a through hole penetrating the substrate, and the encapsulation area of the substrate has an edge surrounding the through hole. The structure of the substrate and the position of the edge of the package region have been described in detail above, and are not described in detail herein.
S200: sequentially arranging a first planarization layer rough blank and a first passivation layer rough blank on a substrate
According to an embodiment of the invention, in this step, a first planarizing layer rough blank and a first passivation layer rough blank are provided in this order on the substrate. According to an embodiment of the invention, the first rough planarization layer blank and the first rough passivation layer blank extend to the outside of the edge of the encapsulation area surrounding the through hole. Thereby, the subsequent steps are facilitated to provide the isolation trenches in the first passivation layer rough blank and the first planarization layer rough blank.
S300: sequentially carrying out dry etching on the first passivation layer rough blank and the first planarization layer rough blank to form an isolation groove
According to the embodiment of the invention, in the step, the first passivation layer rough blank and the first planarization layer rough blank are sequentially subjected to dry etching to form the isolation groove. According to the embodiment of the invention, the formed isolation groove is positioned outside the packaging area and on one side close to the through hole, penetrates through the first passivation layer rough blank and extends into the first planarization layer rough blank. Therefore, the method can form the isolation groove for blocking the water and oxygen invasion at the through hole in the back plate, and has the advantages of high speed, short period and high yield.
According to the embodiment of the invention, the inside of the back plate packaging area can be further provided with the isolation groove so as to further enhance the barrier effect on water and oxygen at the through hole.
According to the embodiment of the invention, the sequentially performing dry etching on the first passivation layer rough blank and the first planarization layer rough blank comprises the following steps: firstly, arranging a photoresist mask on the surface of a first passivation layer rough blank, then, carrying out dry etching on the first passivation layer rough blank by using first gas based on the photoresist mask, and then, continuously carrying out dry etching on the first passivation layer rough blank by using second gas by using the photoresist mask as a mask plate to obtain an isolation groove.
Alternatively, according to further embodiments of the present invention, sequentially dry etching the first passivation layer rough blank and the first planarization layer rough blank comprises: firstly, a photoresist mask is arranged on the surface of a first passivation layer rough blank, then, on the basis of the photoresist mask, dry etching is carried out on the first passivation layer rough blank by using first gas, the photoresist mask is stripped to form a first passivation layer, and then, on the basis of the first passivation layer, dry etching is carried out on the first planarization layer rough blank by using second gas to obtain an isolation groove.
With regard to the specific composition of the first gas and the second gas, the design may be made according to the materials of the first passivation layer rough blank and the first planarization layer rough blank. For example, the first gas may be sulfur hexafluoride and the second gas may be oxygen.
According to the embodiment of the present invention, when two passivation layers and two planarization layers are disposed on the backplane, the isolation trench may be formed according to the above steps, which is not described herein again.
According to the embodiment of the invention, the isolation groove is formed in the passivation layer and the planarization layer through dry etching, compared with the isolation groove formed through laser etching, the isolation groove has the advantages of high speed, short period and high yield, and other devices on the back plate, such as a Thin Film Transistor (TFT), can also be formed through dry etching in the preparation process, so that the preparation of the isolation groove does not need to add extra processes and equipment, and the cost is lower.
In the description of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" in this specification are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (10)
1. A backplane for an organic light emitting display panel, the backplane having a through-hole extending therethrough, an encapsulation area of the backplane having an edge surrounding the through-hole, the backplane comprising:
a substrate;
a first planarization layer and a first passivation layer on the substrate, the first passivation layer being on a side of the first planarization layer away from the substrate, the first planarization layer and the first passivation layer extending to a side outside the encapsulation area near the via;
an isolation trench located on the substrate at a side of the substrate outside the encapsulation region near the through hole, the isolation trench penetrating through the first passivation layer and extending into the first planarization layer.
2. The back sheet for an organic light-emitting display panel according to claim 1, further comprising:
a first source drain metal layer located between the substrate and the first planarization layer;
the second source drain metal layer is positioned on one side, far away from the first planarization layer, of the first passivation layer;
the second planarization layer is positioned on one side, far away from the first passivation layer, of the second source drain metal layer;
the second passivation layer is positioned on one side, far away from the second source-drain metal layer, of the second planarization layer, the second planarization layer and the second passivation layer extend to one side, close to the through hole, outside the packaging area, and the isolation groove penetrates through the second passivation layer, the second planarization layer and the first passivation layer and extends into the first planarization layer.
3. The back sheet for an organic light-emitting display panel according to claim 1 or 2, further comprising a second isolation groove, the second isolation groove being located in the encapsulation region.
4. The backplane for organic light emitting display panel according to claim 1 or 2, wherein a cross-sectional width of a portion of the isolation trench in the passivation layer is smaller than a cross-sectional width of a portion in the planarization layer along a plane in which the substrate is located.
5. The back sheet for an organic light-emitting display panel according to claim 1 or 2, wherein the substrate is a flexible substrate.
6. A display panel, comprising:
a backsheet as described in any one of claims 1-5;
the organic light emitting diode is positioned on one side of the passivation layer away from the planarization layer;
and the packaging structure is positioned on one side of the organic light-emitting diode, which is far away from the passivation layer, and the through hole in the back plate simultaneously penetrates through the packaging structure.
7. The display panel of claim 6, wherein the encapsulation structure comprises an inorganic layer, an organic layer, and a dam structure defining the position of the organic layer, the dam structure is located at the edge of the encapsulation area, and the isolation trench is located at a side of the dam structure close to the through hole and a side of the dam structure far away from the through hole.
8. A method of making the backsheet of any one of claims 1-5, the method comprising:
providing a substrate, wherein the substrate is provided with a through hole penetrating through the substrate, and a packaging area of the substrate is provided with an edge surrounding the through hole;
sequentially arranging a first rough planarization layer blank and a first rough passivation layer blank on the substrate, wherein the first rough planarization layer blank and the first rough passivation layer blank extend to one side, close to the through hole, outside the packaging area;
and sequentially carrying out dry etching on the first passivation layer rough blank and the first planarization layer rough blank to form an isolation groove which is positioned outside the packaging area, is close to one side of the through hole, penetrates through the first passivation layer rough blank and extends into the first planarization layer rough blank.
9. The method of claim 8, wherein the dry etching comprises:
arranging a photoresist mask on the surface of the first passivation layer rough blank;
performing dry etching on the first passivation layer rough blank by using first gas based on the photoresist mask;
and performing dry etching on the first planarization layer rough blank by using a second gas based on the photoresist mask to form the isolation groove.
10. The method of claim 8, wherein the dry etching comprises:
arranging a photoresist mask on the surface of the first passivation layer rough blank;
based on the photoresist mask, carrying out dry etching on the first passivation layer rough blank by using first gas, and stripping the photoresist mask to form a first passivation layer;
and performing dry etching on the first planarization layer rough blank by using a second gas based on the first passivation layer to form the isolation groove.
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