CN110906053A - Gas flow regulating valve driven by phase change material based on micro-electro-mechanical system - Google Patents
Gas flow regulating valve driven by phase change material based on micro-electro-mechanical system Download PDFInfo
- Publication number
- CN110906053A CN110906053A CN201911100856.5A CN201911100856A CN110906053A CN 110906053 A CN110906053 A CN 110906053A CN 201911100856 A CN201911100856 A CN 201911100856A CN 110906053 A CN110906053 A CN 110906053A
- Authority
- CN
- China
- Prior art keywords
- sheet
- hole
- change material
- deformation
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012782 phase change material Substances 0.000 title claims abstract description 60
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 239000005388 borosilicate glass Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 230000004044 response Effects 0.000 abstract description 5
- 230000008859 change Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
- F16K31/005—Piezoelectric benders
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Temperature-Responsive Valves (AREA)
- Electrically Driven Valve-Operating Means (AREA)
Abstract
The invention provides a phase-change material driven gas flow regulating valve based on a micro-electro-mechanical system, which comprises a base, a heating sheet, a heater, a phase-change material, a deformation sheet, an outlet sheet and an electrode, wherein the outlet sheet, the deformation sheet, the phase-change material, the heater, the heating sheet and the base are sequentially connected; the base is provided with a base through hole, the heating sheet is provided with a heating sheet through hole, the deformation sheet is provided with a deformation sheet groove and a deformation sheet through hole, the outlet sheet is provided with a control space and a flow hole communicated with the control space, the base through hole, the heating sheet through hole, the deformation sheet through hole, the control space and the flow hole are sequentially communicated, and the phase-change material is expanded by electrifying the heater to drive the deformation sheet to elastically deform towards the direction close to the flow hole, so that the control of gas flow is realized. The invention has simple process, small volume, fast response time and small control voltage, and realizes automatic flow control.
Description
Technical Field
The invention relates to the technical field of gas flow regulating valves, in particular to a phase-change material driven gas flow regulating valve based on a micro-electro-mechanical system.
Background
The electric propulsion system has the advantages of higher thrust, light weight, less working medium consumption and the like, and is widely applied to satellite platforms of various countries. The application of space electric propulsion technology has gradually changed from control of stationary orbit position holding to multi-task direction during shaping life such as satellite transfer orbit transfer after separation of satellites and arrows, orbit position holding after satellite orbit entering, momentum wheel unloading and off-orbit. The change of the space task enables the electric propulsion system to have the capabilities of multiple modes and variable thrust, and the electric propulsion system can realize the multi-mode regulation of the xenon working medium flow by means of the flow regulation module so as to meet the task requirements of the multiple modes and variable thrust.
The micro-nano satellite can execute tasks such as technical demonstration, earth observation, communication and the like, has short development period, low cost, flexible emission and low carrying requirement, and has obvious military value and scientific value. The micro-nano satellite propulsion system is mainly used for tasks such as track position keeping, orbital transfer, formation flying and the like, the propulsion system is required to provide different ranges of thrust according to different task requirements, the propulsion system suitable for the tasks is a micro cold air propulsion system, and the thrust is in the magnitude of millinewton to newton. By means of the flow regulating module, the micro cold air propulsion system can realize thrust regulation in a larger range.
The traditional flow regulation module mainly realizes flow regulation through a proportional valve, such as an electromagnetic proportional valve, a hysteresis expansion proportional valve and a piezoelectric proportional valve, but the limitation of weight and volume causes that the traditional proportional valve cannot meet the large-range accurate regulation of gas flow under the miniaturization condition. Micro valves based on a micro electro mechanical system are designed aiming at a micro fluid system, such as micro electromagnetic valves, micro piezoelectric ceramic valves, micro shape memory alloy valves and the like, and although the micro valves meet the use scene of miniaturization, the micro valves also have the problems of complex process, overhigh driving voltage, overlong response time and the like.
In summary, the existing gas flow regulating module still has the following disadvantages to be improved:
1. the flow regulating module with the conventional size has limitations in weight and volume, and cannot meet the requirement of a miniaturized use scene;
2. the micro electromagnetic valve based on the micro electro mechanical system has more complex process;
3. the micro piezoelectric ceramic valve based on the micro electro mechanical system has overhigh driving voltage;
4. micro shape memory alloy valves based on micro-electromechanical systems have a long response time.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a phase-change material driven gas flow regulating valve based on a micro-electro-mechanical system.
The invention provides a phase-change material driven gas flow regulating valve based on a micro-electro-mechanical system, which comprises a base 1, a heating sheet 2, a heater 3, a phase-change material 4, a deformation sheet 5, an outlet sheet 6 and an electrode 8;
the outlet sheet 6, the deformation sheet 5, the phase-change material 4, the heater 3, the heating sheet 2 and the base 1 are connected in sequence;
the base 1 is provided with a base through hole 11, the heating plate 2 is provided with a heating plate through hole 21, the deformation plate 5 is provided with a deformation plate groove 51 and a deformation plate through hole 52, and the outlet plate 6 is provided with a control space 61 and a flow hole 62 communicated with the control space 61;
the base through hole 11, the heating plate through hole 21, the deformation plate through hole 52, the control space 61 and the flow hole 62 are communicated in sequence;
the deformation sheet 5 and the heating sheet 2 enclose a deformation sheet groove 51 into a sealed space, and the phase-change material 4 is filled in the deformation sheet groove 51;
a heater 3 is arranged between the phase-change material 4 and the heating sheet 2;
two ends of the heater 3 are respectively connected with the electrodes 8;
when the heater 3 is electrified for heating, the phase change material 4 expands to drive the deformation sheet 5 to elastically deform in the direction close to the flow hole 62.
Preferably, the base 1 is made of stainless steel material, and the base through hole 11 is a stepped through hole;
the base 1 is glued with the heating plate 2.
Preferably, the phase change material 4 is paraffin wax.
Preferably, the heating plate 2 is made of borosilicate glass material, and the heating plate through holes 21 are two arc-shaped through holes which are axisymmetric with each other.
Preferably, the heater 3 is made of platinum, and the heater 3 is of a snake-shaped structure formed by connecting a plurality of parallel equidistant resistance wires in series end to end;
the heating plate 2 is connected with the heater 3 by means of metal deposition.
Preferably, the flow rate of gas through the flow orifice 62 is controlled to be in the range of 0-2 g/s.
Preferably, the deformation sheet 5 is made of a silicon wafer, and the deformation sheet groove 51 is a cylindrical space;
the deformation sheet through holes 52 are arc-shaped through holes and the number of the deformation sheet through holes is two;
the two deformation sheet through holes 52 are symmetrically arranged at two sides of the deformation sheet groove 51.
Preferably, the outlet plate 6 is made of silicon wafer, and the control space 61 and the flow hole 62 are both cylindrical spaces.
Preferably, the device further comprises a valve cover 7, wherein the valve cover 7 is arranged on the outlet sheet 6;
the valve cover 7 is provided with a valve cover through hole 71, and the valve cover through hole 71 is communicated with the flow hole 62.
Preferably, the valve cover 7 is glued to the outlet sheet 6;
the valve cover 7 is made of stainless steel.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention realizes the control of gas flow by adopting the phase-change material, has simple process control, small volume, quick response time and small control voltage, realizes the automatic precise control and has strong practicability.
2. The invention can select various structural forms according to actual requirements, and has simple structure, flexibility and practicability.
3. Compact structure adopts multiple connection sealing mode, can realize the miniaturization of flowmeter.
4. The invention can realize the control range of the gas flow between 0 and 2g/s and realize the micro-flow control of the gas regulating valve.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is a schematic structural view of a deformation sheet 5 according to the present invention;
FIG. 5 is a schematic structural view of the heater 3 of the present invention;
fig. 6 is a schematic structural view of a heat patch 2 according to the present invention.
The figures show that:
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
According to the phase-change material driven gas flow regulating valve based on the micro-electro-mechanical system, as shown in fig. 1, the phase-change material driven gas flow regulating valve comprises a base 1, a heating sheet 2, a heater 3, a phase-change material 4, a deformation sheet 5, an outlet sheet 6, a valve cover 7 and an electrode 8, wherein the valve cover 7, the outlet sheet 6, the deformation sheet 5, the phase-change material 4, the heater 3, the heating sheet 2 and the base 1 are sequentially connected; the base 1 is provided with a base through hole 11, the heating plate 2 is provided with a heating plate through hole 21, the deformation sheet 5 is provided with a deformation sheet groove 51 and a deformation sheet through hole 52, the outlet sheet 6 is provided with a control space 61 and a flow hole 62 communicated with the control space 61, the valve cover 7 is provided with a valve cover through hole 71, wherein, the base through hole 11, the heating plate through hole 21, the deformation plate through hole 52, the control space 61, the flow hole 62 and the bonnet through hole 71 are communicated in sequence, the deformation plate 5 and the heating plate 2 enclose the deformation plate groove 51 into a sealed space, the phase-change material 4 is filled in the deformation sheet groove 51, a heater 3 is arranged between the phase-change material 4 and the heating sheet 2, two ends of the heater 3 are respectively connected with the electrodes 8, when the heater 3 is electrified for heating, the phase change material 4 expands to drive the deformation sheet 5 to elastically deform in the direction close to the flow hole 62. The invention realizes the control of gas flow by adopting the phase-change material, has simple process control, small volume, quick response time and small control voltage, realizes the automatic precise control and has strong practicability.
Furthermore, the flow of the gas passing through the flow hole 62 is controlled by expanding the phase-change material 4 to drive the deformation sheet 5 to deform, so that the invention can realize the control range of the gas flow between 0 and 2g/s and realize the micro-flow control of the gas regulating valve.
Specifically, as shown in fig. 4, the deformation sheet 5 is made of a silicon wafer, the deformation sheet groove 51 is a cylindrical space, and the deformation sheet through hole 52 is an arc-shaped through hole. The material of the deformable sheet 5 adopts a conventional silicon wafer as a key component for regulating the gas channel, the micro-processing technology of the silicon wafer material is mature and has high processing precision, and the thickness of the regulating membrane 53 in the deformable sheet can be controlled in a micron order. In a preferred embodiment, the center of the deformable sheet 5 is provided with a deformable sheet groove 51, the depth of the deformable sheet groove 51 needs to ensure that the thickness of the adjusting membrane 53 meets the requirement of deformation, and the deformable sheet groove 51 is used for filling the phase-change material 4. Two arc-shaped through holes, namely the deformed sheet through hole 52, are symmetrically arranged on two sides of the deformed sheet groove 51, the deformed sheet through hole 52 is used for connecting the gas channels of the heating sheet through hole 21, the control space 61 and the flow hole 62, wherein the deformed sheet through hole 52 is arranged opposite to the arc-shaped through hole of the heating sheet through hole 21; in one variation, the deformed sheet through-hole 52 and the heater chip through-hole 21 are circular through-holes, respectively. The shapes of the deformation sheet through hole 52 and the heating sheet through hole 21 can be set to various forms, such as a triangular through hole, a quadrilateral through hole and the like, but an arc-shaped through hole can be selected for enabling the whole gas flow regulating valve to be smaller in volume, and the gas flow regulating valve is simple in structure, flexible and practical.
Specifically, as shown in fig. 1, the base 1 is made of stainless steel, the base through hole 11 is a step-shaped through hole, and is used for placing other components as a support body of the regulating valve, the heating plate 2 is placed on the base 1, and the heating plate 2 is used for fixing the heater 3, in a preferred embodiment, the base through hole 11 is a circular through hole which is provided with two steps along the axial direction of the base 1, the base 1 is glued with the heating plate 2, one section of the smaller diameter hole in the base through hole 11 is used as an upstream channel of gas, the gas enters the gas flow regulating valve from the upstream channel, one section of the larger diameter hole in the base through hole 11 is matched with the heating plate through hole 21 of the heating plate 2, and the gas enters the heating.
Further, as shown in fig. 1 and 6, the heater chip 2 serves as a substrate for depositing the heater 3, and borosilicate glass is used as a material, which facilitates the deposition process of the heater 3 on one hand and facilitates the subsequent wafer bonding process on the other hand. In a preferred embodiment, the heating plate 2 is provided with heating plate through holes 21, the heating plate through holes 21 are two arc-shaped through holes that are axisymmetrical with each other, the heating plate through holes 21 are arc-shaped, and the heating plate through holes 21 are used for connecting the base through holes 11 and the deformation plate through holes 52.
Specifically, as shown in fig. 1, the heater 3 is used for heating the phase change material 4, the heater 3 is made of platinum, the platinum has high resistivity and is resistant to oxidation, and the processing technology is mature, in a preferred embodiment, the heater 3 is a serpentine structure formed by connecting a plurality of parallel equidistant resistance wires in series end to end, as shown in fig. 5, the heater 3 adopts a design structure of a serpentine reciprocating resistance wire to enable the temperature distribution to be distributed along the center and outwards in an annular radiation manner, and meanwhile, the processing technology has high reliability. The heater 3 is arranged on the heating plate 2 and used for heating the phase change material 4, the phase change material 4 is arranged in the deformation plate groove 51, the other surface of the phase change material is in surface contact with the heater 3, the deformation plate 5 is arranged on the heating plate 2, and the heater 3 and the deformation plate 5 are matched in a concentric circle manner; the outlet sheet 6 is arranged on the deformation sheet 5, and the outlet sheet 6 and the deformation sheet 5 are matched in a concentric circle manner; the valve cover 7 is arranged on the outlet sheet 6, and the valve cover 7 and the outlet sheet 6 are in concentric circle fit. The heating plate 2 is connected with the heater 3 in a metal deposition mode, the heating plate 6 is hermetically connected with the deformation plate 5 and the deformation plate 5 is hermetically connected with the outlet plate 6 in a wafer bonding mode, and the base 1 is hermetically connected with the heating plate 2 and the outlet plate 6 is hermetically connected with the valve cover 7 in a plane sealant mode.
Specifically, as shown in fig. 4, the phase change material 4 is paraffin, which has a phase change volume expansion rate of about 10% and is a commonly used phase change volume expansion material, and is placed in the deformation sheet groove 51 in a cylindrical shape, and after the heating sheet 2 and the deformation sheet 5 are bonded, the paraffin is in surface contact with the heater 3, so that the heat transfer efficiency is increased.
Specifically, as shown in fig. 1 and 2, the outlet sheet 6 is made of a wafer, and the control space 61 and the flow hole 62 are both cylindrical spaces. In a preferred embodiment, the outlet plate 6 is made of a conventional silicon wafer, the control space 61 and the flow hole 62 are two stepped circular through holes arranged along the axis, the control space 61 with a larger diameter is matched with the deformable plate through hole 52 of the deformable plate 5, and gas enters the control space 61 of the outlet plate 6 from the deformable plate through hole 52, as shown in fig. 3, when the circular hole at the starting end of the flow hole 62 with a smaller diameter is in close contact with the regulating membrane 53 of the deformable plate 5, the closing of the gas flow regulating valve can be realized, so that the flow control is realized.
Specifically, as shown in fig. 1, the valve cover 7 is made of stainless steel, the valve cover 7 is glued to the outlet sheet 6, a valve cover through hole 71 is formed along the axial direction of the valve cover 7, the valve cover through hole 71 is a circular through hole, the valve cover through hole 71 serves as a downstream gas channel, and gas enters the next component for gas delivery through the valve cover 7.
The working principle of the invention is as follows:
firstly, the heater 3 on the heating plate 2 is powered on, heat generated by the heater 3 is transferred to the phase-change material 4 through a heat conduction mode, the heated temperature of the phase-change material 4 is increased, when the temperature is increased to the phase-change temperature of the phase-change material 4, the phase-change material 4 generates phase change, and the volume changes, as shown in fig. 3, static pressure generated by the expanded phase-change material 4 makes the adjusting diaphragm 53 on the deformation plate 5 generate deformation, and the deformation makes the cross section of the gas channel in fig. 3 change compared with that of the gas channel in fig. 2, so that the gas channel entering the flow hole 62 is limited, the larger the current of the heater 3 is, the more heat is generated, the larger the volume of the phase-change material 4 is, the closer the adjusting diaphragm 53 is to the flow hole 62, and the. In the whole process, gas flows through the gas channels of the heating sheet 2, the deformation sheet 5 and the outlet sheet 6 successively through the base through hole 11 of the base 1 and finally enters the next component through the valve cover through hole 71 in the valve cover 7. The heating power of the heater 3 can be adjusted by adjusting the input power of the electrodes 8 at the two ends of the heater 3, so that the deformation of the phase-change material 4 and the deformation sheet 5 is controlled, and finally the adjustment of the gas flow is realized.
The invention adopts the phase-change material as the driving medium, utilizes the characteristic that the volume of the phase-change material (such as paraffin, hydrogel and the like) is obviously changed when the solid state and the liquid state are mutually converted under different heating powers, and adjusts the gas flow through the volume change of the phase-change material. When the heater 3 works, the temperature of the phase-change material is gradually increased to the phase-change temperature, then the phase-change material undergoes the phase-change process from a solid phase to a solid-liquid mixed phase and then to a liquid phase, and different heating powers correspond to different volume expansion rates in the heating process of the heater 3. Different volume expansion rates of the phase-change material are obtained by adjusting the heating power of the heater 3, and then the deflection of the adjusting diaphragm 53 is controlled to change the cross-sectional area of the gas channel, and finally the flow adjustment of the gas working medium is realized.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. A phase-change material driven gas flow regulating valve based on a micro-electro-mechanical system is characterized by comprising a base (1), a heating sheet (2), a heater (3), a phase-change material (4), a deformation sheet (5), an outlet sheet (6) and an electrode (8);
the outlet sheet (6), the deformation sheet (5), the phase change material (4), the heater (3), the heating sheet (2) and the base (1) are connected in sequence;
a base through hole (11) is formed in the base (1), a heating sheet through hole (21) is formed in the heating sheet (2), a deformation sheet groove (51) and a deformation sheet through hole (52) are formed in the deformation sheet (5), and a control space (61) and a flow hole (62) communicated with the control space (61) are formed in the outlet sheet (6);
the base through hole (11), the heating plate through hole (21), the deformation plate through hole (52), the control space (61) and the flow hole (62) are communicated in sequence;
the deformation sheet (5) and the heating sheet (2) enclose a deformation sheet groove (51) into a sealed space, and the phase-change material (4) is filled in the deformation sheet groove (51);
a heater (3) is arranged between the phase-change material (4) and the heating sheet (2);
two ends of the heater (3) are respectively connected with the electrodes (8);
when the heater (3) is electrified and heated, the phase-change material (4) expands to drive the deformation sheet (5) to elastically deform towards the direction close to the flow hole (62).
2. The MEMS based phase change material actuated gas flow regulator of claim 1, wherein the base (1) is made of stainless steel material, and the base through hole (11) is a stepped through hole;
the base (1) is connected with the heating sheet (2) in an adhesive mode.
3. The mems-based phase change material actuated gas flow regulator valve according to claim 1, wherein the phase change material (4) employs paraffin.
4. The mems-based phase change material actuated gas flow regulating valve according to claim 1, wherein the heater chip (2) is made of borosilicate glass material, and the heater chip through hole (21) is two arc-shaped through holes that are axisymmetric to each other.
5. The phase change material driven gas flow regulating valve based on the micro electro mechanical system as claimed in claim 1, wherein the heater (3) is made of platinum, and the heater (3) is of a serpentine structure formed by connecting a plurality of parallel equidistant resistance wires end to end in series;
the heating plate (2) is connected with the heater (3) in a metal deposition mode.
6. The MEMS based phase change material actuated gas flow regulator of claim 1, wherein the gas flow rate through the flow orifice (62) is controlled at 0-2 g/s.
7. The micro-electro-mechanical system (mems) -based phase change material actuated gas flow regulating valve according to claim 1, wherein the deformation plate (5) is made of a silicon wafer, and the deformation plate groove (51) is a cylindrical space;
the deformation sheet through holes (52) are arc-shaped through holes and the number of the deformation sheet through holes is two;
the two deformation sheet through holes (52) are symmetrically arranged on two sides of the deformation sheet groove (51).
8. The mems-based phase change material actuated gas flow regulator valve according to claim 1, wherein the outlet plate (6) is made of silicon wafer, and the control space (61) and the flow orifice (62) are both cylindrical spaces.
9. The micro-electro-mechanical system (mems) -based phase change material actuated gas flow regulator valve according to claim 1, further comprising a valve cover (7), the valve cover (7) being mounted on the outlet sheet (6);
the valve cover (7) is provided with a valve cover through hole (71), and the valve cover through hole (71) is communicated with the flow hole (62).
10. The mems-based phase change material actuated gas flow regulator valve according to claim 9, wherein the valve cover (7) is glued to the outlet piece (6);
the valve cover (7) is made of stainless steel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911100856.5A CN110906053A (en) | 2019-11-12 | 2019-11-12 | Gas flow regulating valve driven by phase change material based on micro-electro-mechanical system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911100856.5A CN110906053A (en) | 2019-11-12 | 2019-11-12 | Gas flow regulating valve driven by phase change material based on micro-electro-mechanical system |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110906053A true CN110906053A (en) | 2020-03-24 |
Family
ID=69817348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911100856.5A Pending CN110906053A (en) | 2019-11-12 | 2019-11-12 | Gas flow regulating valve driven by phase change material based on micro-electro-mechanical system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110906053A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112682834A (en) * | 2021-01-23 | 2021-04-20 | 北京嘉洁能科技股份有限公司 | Carbon fiber intelligent heat supply method and system based on phase change energy storage building envelope heat insulation |
CN113028095A (en) * | 2021-04-06 | 2021-06-25 | 常州天目智能科技有限公司 | Throttling device based on shape memory alloy and method for controlling opening degree of channel |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269917A (en) * | 2005-03-25 | 2006-10-05 | Kyocera Corp | Laminated wiring board and mounting method thereof |
CN102590398A (en) * | 2012-03-23 | 2012-07-18 | 电子科技大学 | Miniature gas enricher with membranes on double surfaces |
CN102671728A (en) * | 2012-05-07 | 2012-09-19 | 博奥生物有限公司 | Micro-flow controlled air operated valve chip |
CN205315780U (en) * | 2015-11-16 | 2016-06-15 | 中国科学院理化技术研究所 | Phase change valve device |
CN105940295A (en) * | 2013-12-06 | 2016-09-14 | 罗伯特·博世有限公司 | Semiconductor sensor having suspended structure and its manufacturing method |
CN107676542A (en) * | 2017-09-20 | 2018-02-09 | 北京工业大学 | A kind of contactless closed type phase transformation micro-valve based on resistance heating |
CN110367978A (en) * | 2019-06-26 | 2019-10-25 | 上海交通大学 | A kind of three-dimensional buckling structure flexibility nerve electrode and its preparation process |
-
2019
- 2019-11-12 CN CN201911100856.5A patent/CN110906053A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269917A (en) * | 2005-03-25 | 2006-10-05 | Kyocera Corp | Laminated wiring board and mounting method thereof |
CN102590398A (en) * | 2012-03-23 | 2012-07-18 | 电子科技大学 | Miniature gas enricher with membranes on double surfaces |
CN102671728A (en) * | 2012-05-07 | 2012-09-19 | 博奥生物有限公司 | Micro-flow controlled air operated valve chip |
CN105940295A (en) * | 2013-12-06 | 2016-09-14 | 罗伯特·博世有限公司 | Semiconductor sensor having suspended structure and its manufacturing method |
CN205315780U (en) * | 2015-11-16 | 2016-06-15 | 中国科学院理化技术研究所 | Phase change valve device |
CN107676542A (en) * | 2017-09-20 | 2018-02-09 | 北京工业大学 | A kind of contactless closed type phase transformation micro-valve based on resistance heating |
CN110367978A (en) * | 2019-06-26 | 2019-10-25 | 上海交通大学 | A kind of three-dimensional buckling structure flexibility nerve electrode and its preparation process |
Non-Patent Citations (1)
Title |
---|
王丰羽等: "基于MEMS技术的石蜡驱动气体微流量调节阀研究", 《节能技术》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112682834A (en) * | 2021-01-23 | 2021-04-20 | 北京嘉洁能科技股份有限公司 | Carbon fiber intelligent heat supply method and system based on phase change energy storage building envelope heat insulation |
CN112682834B (en) * | 2021-01-23 | 2021-09-17 | 北京嘉洁能科技股份有限公司 | Carbon fiber intelligent heat supply method and system based on phase change energy storage building envelope heat insulation |
CN113028095A (en) * | 2021-04-06 | 2021-06-25 | 常州天目智能科技有限公司 | Throttling device based on shape memory alloy and method for controlling opening degree of channel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5619177A (en) | Shape memory alloy microactuator having an electrostatic force and heating means | |
CN110906053A (en) | Gas flow regulating valve driven by phase change material based on micro-electro-mechanical system | |
CN111965742B (en) | Automatic zooming thin-film liquid lens based on temperature control and preparation method thereof | |
US8967545B2 (en) | Microsatellite comprising a propulsion module and an imaging device | |
Oh et al. | A review of microvalves | |
US7052594B2 (en) | Devices and methods for controlling fluid flow using elastic sheet deflection | |
Rossi et al. | Micropyrotechnics, a new technology for making energetic microsystems: review and prospective | |
US20040013536A1 (en) | Micro-fluidic pump | |
Bergstrom et al. | Thermally driven phase-change microactuation | |
JPH0681762A (en) | Micro pump | |
EP1753534A1 (en) | A valve for a microfluidic device | |
Henning | Microfluidic mems | |
CN102003560B (en) | Normally closed active micro valve for electrically driven shape memory alloy wire | |
Carlen et al. | Paraffin actuated surface micromachined valves | |
Zhao et al. | Microfluidic actuated and controlled systems and application for lab-on-chip in Space Life Science | |
Mueller | A review and applicability assessment of MEMS-based microvalve technologies for microspacecraft propulsion | |
Wei et al. | A novel PDMS diaphragm micropump based on ICPF actuator | |
Megnin et al. | Shape memory alloy based controllable multi-port microvalve | |
US7302970B2 (en) | Liquid delivery device | |
Hahm | Microfabricated, silicon spring biased, shape memory actuated microvalve | |
Hesketh et al. | Microvalve for fuel cells and miniature gas chromatographic system | |
US20050072147A1 (en) | Micro-fluidic actuator | |
CN2263720Y (en) | Silicon micro-machinery pump | |
CN114633902A (en) | Electric heating type MEMS micro thruster | |
CN213900100U (en) | Micro-flow plane sealing giant magnetostrictive proportional valve |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200324 |
|
RJ01 | Rejection of invention patent application after publication |