CN110903700A - Photovoltaic ink composition and patterned transparent packaging backboard for ink-jet printing process - Google Patents
Photovoltaic ink composition and patterned transparent packaging backboard for ink-jet printing process Download PDFInfo
- Publication number
- CN110903700A CN110903700A CN201911145331.3A CN201911145331A CN110903700A CN 110903700 A CN110903700 A CN 110903700A CN 201911145331 A CN201911145331 A CN 201911145331A CN 110903700 A CN110903700 A CN 110903700A
- Authority
- CN
- China
- Prior art keywords
- ink composition
- ink
- transparent
- transparent substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000008569 process Effects 0.000 title abstract description 17
- 238000007641 inkjet printing Methods 0.000 title abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 57
- 239000011248 coating agent Substances 0.000 claims abstract description 50
- 239000011159 matrix material Substances 0.000 claims abstract description 15
- 239000000049 pigment Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 74
- 239000010408 film Substances 0.000 claims description 36
- -1 styrene-acrylic acid-hydroxyethyl methacrylate Chemical group 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 229920001897 terpolymer Polymers 0.000 claims description 8
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 7
- 239000012752 auxiliary agent Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920006267 polyester film Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920005672 polyolefin resin Polymers 0.000 claims description 6
- 239000008096 xylene Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229920003180 amino resin Polymers 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000002318 adhesion promoter Substances 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 4
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229940072049 amyl acetate Drugs 0.000 claims description 3
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 claims description 3
- 229920006284 nylon film Polymers 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 2
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 claims description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- 150000001555 benzenes Chemical class 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims description 2
- 235000011180 diphosphates Nutrition 0.000 claims description 2
- 239000005010 epoxy-amino resin Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001153 fluoro group Chemical group F* 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract description 12
- 239000007921 spray Substances 0.000 abstract description 11
- 238000003851 corona treatment Methods 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 6
- 239000000945 filler Substances 0.000 abstract description 3
- 238000009832 plasma treatment Methods 0.000 abstract description 2
- 238000002310 reflectometry Methods 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 77
- 239000010410 layer Substances 0.000 description 15
- 239000000047 product Substances 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000010248 power generation Methods 0.000 description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000010021 flat screen printing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000011056 performance test Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 4
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 3
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 3
- 239000005025 cast polypropylene Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010892 electric spark Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- WYRGOSDNPFGZFG-UHFFFAOYSA-K [bis(2-ethylhexoxy)-oxidophosphaniumyl] dihydrogen phosphate [bis(2-ethylhexoxy)-oxidophosphaniumyl] hydrogen phosphate [bis(2-ethylhexoxy)-oxidophosphaniumyl] phosphate propan-2-olate titanium(4+) Chemical compound [Ti+4].CC(C)[O-].CCCCC(CC)CO[P+]([O-])(OCC(CC)CCCC)OP(O)(O)=O.CCCCC(CC)CO[P+]([O-])(OCC(CC)CCCC)OP(O)([O-])=O.CCCCC(CC)CO[P+]([O-])(OCC(CC)CCCC)OP([O-])([O-])=O WYRGOSDNPFGZFG-UHFFFAOYSA-K 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000003889 chemical engineering Methods 0.000 description 2
- 230000001808 coupling effect Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000006223 plastic coating Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Abstract
The invention relates to a photovoltaic grade ink composition and a patterned transparent packaging back plate in an ink-jet printing process. The ink composition has the characteristics of long-acting stability, high pigment content, functionalized matrix components and the like, the prepared reflective coating has better reflectivity and weather resistance, is suitable for an ink-jet printing process, and solves the problems that the conventional ink has large particle size, is easy to stick a cavity in a flowing state or is easy to delaminate, crystallize, agglomerate pigment and filler and separate out under the condition that external factors fluctuate to cause easy blockage of a spray head and the like. The back plate optimizes the interface affinity and matching of the coating and packaging adhesive films such as EVA, POE and the like, obviously improves the bonding strength between the adhesive film of the non-polar component and the coating, and can meet the bonding performance requirement between the coating and the adhesive film even if no external corona or plasma treatment process is applied.
Description
Technical Field
The invention belongs to the technical field of photovoltaic packaging materials, and particularly relates to a photovoltaic ink composition and a patterned transparent packaging back plate for an ink-jet printing process.
Background
In recent years, photovoltaic power generation has been rapidly developed as a new energy industry supported by national policies. The loading capacity of photovoltaic power generation is in a situation of increasing year by year. At present, the photovoltaic industry changes the development emphasis from the expansion scale to the high-quality development by continuously consuming new technologies, and actively promotes the process of photovoltaic power generation on line at a low price. At present, the improvement of the power generation efficiency of the component is an important and effective method for reducing the power generation cost of the component and realizing the low-price internet surfing. The double-sided assembly is distinguished from many high-efficiency assembly technologies because of its many advantages. The photovoltaic module is different from the traditional photovoltaic module which can only utilize the illumination incident from the front side, the back side of the double-sided module also has the photoelectric conversion capability, the power generation gain can be increased by 13-20%, the power generation efficiency of the module is remarkably improved, and the power consumption cost is reduced. Therefore, double-sided components are gaining increasing popularity on both component manufacturers and plant operators.
At present, the front side and the back side of the double-sided component are generally packaged by using glass, but the process of glass packaging both at the front side and the back side has the phenomenon of low yield, and the manufactured component also has the problems of heavy weight, high transportation and installation breakage rate and the like. To address many of the problems that such double-sided glass packages expose, material suppliers have developed transparent packaging backplanes to replace the back-side packaging glass. The transparent packaging back plate has the advantages of light weight, high light transmittance, good weather resistance and water resistance and the like, and is generally concerned, tested and used by component manufacturers. Meanwhile, in order to further improve the power generation efficiency of the double-sided module, a patterned transparent packaging back plate is appeared on the market, and the patterned transparent packaging back plate is an upgraded product of the transparent packaging back plate. A white reflecting coating is printed at the position of a gap between the transparent packaging back plate and the adhesive film, so that the utilization efficiency of incident light is improved, and the power of the assembly is increased.
The patterned transparent packaging backboard product has high requirements on the production and development capacity of material suppliers, and is not supplied in large quantities in the market at present. From the information obtained, most of the samples reported and under development at present use a flat screen printing process. The flat screen printing is of a flat type, so that a scraper is lifted up and put down in each printing process, and the printing speed becomes a problem which cannot be broken through in the flat screen printing. When printing, the scraper is stopped and changed up and down, which also causes the uneven thickness of the ink layer, affects the quality of the product and results in unsatisfactory batch production effect. The final product is also in a separated sheet form, so that the continuous corona treatment cannot be realized, and the product delivery efficiency is low. Compared with the traditional flat screen printing process, the ink-jet printing process can greatly simplify the production and corona treatment of the products. For example, the production switching can be completed only by re-editing the imported drawing program for adjusting the product type, and the customization of a new web plate for flat screen printing is omitted. The yield is high, the control of the coating thickness is simplified, and continuous unattended production can be realized. These advantages help to drive the rapid commercialization of patterned transparent packaging backplanes.
The substrate for preparing the patterned transparent packaging backboard is mainly a plastic coating material, and materials which can be printed on the surface of the plastic coating material at present mainly comprise weak solvent/solvent type ink, UV curing ink and the like.
From the aspect of composition, the weak solvent/solvent type ink mainly comprises a solvent, a colorant and an additive, and does not contain or contains little functionalized matrix components which meet the long-term weather resistance of the coating. And for weak solvent based inks it is not white. Therefore, it is not suitable for the preparation of the reflective coating described above.
UV curable ink is used as a special solvent ink. The photosensitive pigment is composed of a pigment, a photopolymerizable prepolymer, a photosensitive monomer and a photopolymerization initiator. Although the ink has a certain content of matrix components forming the coating, and solves the defect that weak solvent ink cannot print white ink. It also exposes a number of problems: for example, the adhesion of printed coatings to substrates is poor. The coating has too high hardness, and large-area chap of the coating is caused by bending after the coating is laminated with adhesive films such as EVA, POE and the like. Easy delamination and pulverization in stretching, easy peeling and yellowing in damp heat and ultraviolet aging, etc. Based on the above considerations, UV inks also do not meet the requirements for use. Therefore, it is a problem to be solved urgently at present to develop a special ink different from the ink on the market, so that the ink can meet the requirements of the productivity of the ink-jet printing process and the 25-year service performance of the packaging back plate.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an improved ink composition and a preparation method thereof, wherein the ink composition can be used for ink-jet printing on a photovoltaic module packaging back plate, and overcomes the problems of nozzle blockage and the like, so that the ink composition can continuously work for a long time.
The invention also provides a patterned transparent packaging backboard.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
an ink composition comprises the following components in parts by weight:
further, the matrix resin is a mixture of one or more of hydroxyl acrylic resin, polyester resin, polyolefin resin, fluorine-containing resin, epoxy resin and amino resin. The matrix resin can be UracronCY472, GK-570, FB8718, VESTOPLAST 708, DYNAPOL L210, E54, WF-B012, HY8047, LR-7514, etc.
Preferably, the fluorine-containing resin is a mixture of one or more of polytetrafluoroethylene copolymer, polychlorotrifluoroethylene copolymer and polyvinylidene fluoride copolymer with hydroxyl groups. The polyester resin is linear saturated polyester. The epoxy resin is linear aliphatic epoxy. The polyolefin resin is one or a combination of polyethylene, polypropylene and some copolymers based on ethylene, such as ethylene-vinyl acetate copolymer, ethylene-acrylic acid and ethylene-acrylate copolymer.
Furthermore, the color paste is solvent type color paste, the pigment used in the color paste is one or a mixture of more of rutile titanium dioxide, nano calcium carbonate, nano ceramic powder and nano bentonite, and the solvent used in the color paste is one or a mixture of more of ketones, benzenes, esters and ethers. Such as white high-temperature resistant nano color paste of Xianshan Xian Yanghua chemical industry Co., Ltd, 9037 color paste of Ningbo Hua Yingsu pigment technology Co., Ltd and the like.
Furthermore, the adhesion promoter is acrylic acid modified resin with a polyhydroxy value and a polyacid value, and the molecular weight is 4000-20000. Such as LTW-B, LR-7514, HN-5562, etc.
Further, the compatibilizer is a styrene-acrylic acid-hydroxyethyl methacrylate terpolymer. Preferably, the addition amount of the compatibilizer accounts for 1-4% of the total mass of the ink composition.
Preferably, the styrene-acrylic acid-hydroxyethyl methacrylate terpolymer is prepared by mixing styrene, acrylic acid and hydroxyethyl methacrylate according to a mass ratio of 26-34: 3-8: 7-14, and the molecular weight of the styrene-acrylic acid-hydroxyethyl methacrylate terpolymer is 12000-35000.
Further preferably, the styrene-acrylic acid-hydroxyethyl methacrylate terpolymer is prepared by polymerizing styrene, acrylic acid and hydroxyethyl methacrylate in the presence of a solvent and an initiator.
The solvent is one or the combination of ethyl acetate and xylene. The initiator is BPO.
Further, the interface regulator is titanate and derivatives thereof. The addition amount of the interface regulator accounts for 0.5-2% of the total mass of the ink composition.
Preferably, the titanate and the derivative thereof comprise a monoalkoxy type and a monoalkoxy pyrophosphate type, and the functionality of titanate is 2-3. Such as NDZ-201, HY-102, HY-105, etc.
In the invention, the interface regulator and the compatibilizer in the ink composition supplement each other and are not necessary. On one hand, the interface regulator can be modified and wound on the surface of inorganic filler particles in the ink, and is beneficial to improving the coupling property of matrix resin and the inorganic filler particles. On the other hand, the cured coating and the packaging adhesive film EVA, especially the nonpolar POE adhesive film interface can be bridged, so that the coupling property between the coating and the packaging adhesive film is improved; in the molecular structure of the styrene-acrylic acid-hydroxyethyl methacrylate terpolymer, due to the existence of carboxyl and the action of hydrogen bonds, the crystallization of the polymer is inhibited, the linearity of the main chain is destroyed, and the melting point and the softening point of the polymer are reduced. The molecular structure of the prepared compatibilizer contains gradient polar segments, so that the compatibility of different resins and auxiliary agent systems in the ink composition can be obviously improved, and layering and sedimentation are eliminated.
Preferably, the ink auxiliary agent comprises a mixture of one or more of a dispersing agent, a leveling agent, a catalyst, an anti-settling agent and a viscosity reducer. Dispersants such as BYK-111, EFKA-4320, etc.; leveling agents such as WE-D8776CR, Flow 300, WE-D8776R, MOK8216, etc.; catalysts such as stannous octoate; viscosity reducing agents such as 3021.
Preferably, the curing agent is a mixture of one or more of blocked high-temperature-resistant aromatic isocyanate, blocked aliphatic isocyanate and blocked alicyclic isocyanate. Such as modified TPA-B80X, modified SBN-70D, Desmodur BL4265SN, BL3370MPA and the like.
Preferably, the diluent is one or more of xylene, propylene glycol methyl ether acetate, butyl acetate, amyl acetate, diisobutyl ketone, ethyl triethoxy propionate, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, dipropylene glycol methyl ether and dibasic ester mixture.
The other technical scheme adopted by the invention is as follows: the preparation method of the ink composition comprises the steps of uniformly mixing and dispersing matrix resin, an ink auxiliary agent, color paste, a bonding promoter, an interface regulator and a compatibilizer, adding a curing agent and a diluent after sanding treatment, and uniformly mixing and dispersing to obtain the ink composition.
The invention adopts another technical scheme that: a patterned transparent packaging back plate comprises a transparent substrate and a patterned reflective coating formed on the transparent substrate, wherein the patterned reflective coating is made of the ink composition.
Further, the patterned reflective coating is prepared by printing the ink composition onto the surface of the treated transparent substrate through ink jet, and then baking and curing.
Preferably, the baking temperature is 50-200 ℃, and the baking time is 1.5-5 min.
Preferably, the thickness of the transparent substrate is 100-500 μm, and the thickness of the patterned reflective coating is 4-60 μm.
Preferably, the transparent substrate is a transparent substrate, and the transparent substrate is composed of a transparent substrate and weather-resistant coatings coated on two surfaces of the transparent substrate, and is composed of a transparent substrate, a weather-resistant coating coated on one surface of the transparent substrate and a thin film layer bonded on the other surface of the transparent substrate through an adhesive, or is composed of a transparent substrate and thin film layers respectively bonded on two surfaces of the transparent substrate through adhesives.
More preferably, the transparent substrate is one of a polyester film, a polyimide film, a PVA film, a biaxially oriented polypropylene film, a nylon film, and a cast polypropylene film.
More preferably, the weather-resistant coating is formed by taking one or a mixture of more of epoxy resin, polyester resin, fluorocarbon resin, phenolic resin, hydroxyl acrylic resin, amino resin and polyolefin resin as a matrix.
More preferably, the film layer is a fluorine-containing transparent film, a polyolefin-based transparent film, a polyimide-based transparent film, or a nylon-based transparent film.
The preparation method of the patterned transparent packaging backboard comprises the following specific steps:
(1) importing a drawing program of a target version into an ink-jet printer;
(2) loading the ink composition into an ink jet printer, circulating, and heating a nozzle;
(3) and carrying out corona or plasma electric spark treatment on the surface of the transparent substrate, printing the printing ink on the surface of the transparent substrate into a liquid film according to a drawing program, and baking the liquid film for 1.5-5 minutes at 50-200 ℃ to obtain the patterned reflective coating.
Preferably, the inkjet printing conditions are: ignition frequency: 5-40 kHz, 40-100 pL of minimum ink drop, 40-90% of ink jet amount, 35-50 ℃ of spray head temperature, 100-140V of driving voltage and 10-65 m/min of substrate running linear speed.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
the ink composition is a single-component curing system and can be used for a photovoltaic ink composition in an ink-jet printing process, and through the matching use of a specific compatibilizer and an interface regulator and the matching use of other components in the ink composition, the problem that gel is generated due to reaction between a curing agent and ink in the printing working process of the ink composition is avoided, the phenomenon that the gel is adhered to the inner part of a spray head cavity and blocks the spray head due to filler separated out from a gel adsorption formula is avoided, and therefore the ink has the advantage of long-term continuous working (a conventional multi-component curing system contains one or more non-closed curing agents, and the defect that the curing agent and the ink slowly react to generate the final gel in a normal-temperature environment).
The ink composition disclosed by the invention overcomes the problems that a cavity is easy to stick under the flowing state of the conventional ink or a nozzle is blocked due to easy layering, crystallization, pigment and filler agglomeration, free precipitation and the like under the condition that external factors fluctuate, and realizes the effect of single pass high-speed lasting printing production up to 65 m/min.
The ink composition of the invention is different from the conventional ink-jet printing ink, the photovoltaic grade ink composition has high pigment content and functionalized matrix components, and the prepared reflective coating can meet the weather-proof requirement of the assembly in the long-term use process. The coating realizes the highest high reflectivity of 86% in the visible light and near infrared regions of 400-1000 nm.
Aiming at the problem of bonding risk of a common polarized coating and a non-polar packaging adhesive film, the invention optimizes the formula system of the ink composition, improves the interface affinity and matching tolerance of a reflecting coating and the adhesive film prepared from the ink composition, better solves the problem, and can meet the bonding performance requirement between the coating and the adhesive film even if no external corona or plasma treatment process is applied.
Drawings
FIG. 1 is a schematic front view of a transparent package backplane according to an embodiment of the present invention;
in the figure, the a area is a printed grid-like patterned reflective coating; the area B is a transparent substrate.
FIGS. 2-5 are schematic longitudinal cross-sectional views of transparent package backplates according to embodiments of the invention;
the transparent substrates in fig. 2 to 5 are transparent substrates with different structural forms.
Detailed Description
The patterned transparent packaging back plate shown in fig. 1 comprises a transparent substrate (region B) and a patterned reflective coating (region a) formed on the surface of the transparent substrate (region B), wherein the region a forms a grid-shaped pattern with the width of 2-4 mm and the adjustable length among the battery pieces. The size between the battery piece and the frame can be adjusted according to the size of the assembly, and the area B is a high-light-transmittance area and the size of the area B is consistent with that of the battery piece.
In some embodiments, the transparent substrate can be configured as shown in FIGS. 2-5.
The transparent substrate shown in fig. 2 is composed of a transparent substrate 2 and weather-resistant coatings 3 formed on two surfaces of the transparent substrate 2, wherein the weather-resistant coatings 3 on the two surfaces are respectively and independently selected from the coating types taking one or a mixture of more of epoxy resin, polyester resin, fluorocarbon resin, phenolic resin, hydroxyl acrylic resin, amino resin and polyolefin resin as a matrix. The patterned reflective coating 1 of the transparent encapsulating backsheet shown in fig. 2 is formed on one of two weatherable coatings 3.
The transparent substrate shown in fig. 3 comprises a transparent substrate 2, a weather-resistant coating 3 formed on one surface of the transparent substrate 2, and a film layer 5 bonded to the other surface of the transparent substrate 2 via an adhesive layer 4, wherein the film layer 5 is one of a fluorine-containing transparent film, a polyolefin-based transparent film, a polyimide-based transparent film, and a nylon-based transparent film. The patterned reflective coating 1 of the transparent back sheet for encapsulation shown in fig. 3 is formed on the weatherable layer 3.
The transparent substrate shown in fig. 4 comprises a transparent substrate 2, and film layers 5 respectively bonded to both surfaces of the transparent substrate 2 via adhesive layers 4, wherein the film layers 5 on both surfaces are independently selected from one of fluorine-containing transparent films, polyolefin transparent films, polyimide transparent films, and nylon transparent films. The patterned reflective coating 1 of the transparent encapsulating backplane shown in figure 4 is formed on one of two thin film layers 5.
The transparent substrate shown in fig. 5 is a transparent substrate 2, and the patterned reflective coating 1 of the transparent packaging back plate is formed on one of two surfaces of the transparent substrate 2.
The transparent substrate 2 shown in fig. 2 to 5 is a film having a single-layer or multi-layer structure, such as a polyester film (PET), a PVA film, a biaxially oriented polypropylene film (BOPP), a nylon film (PA), or a cast polypropylene film (CPP).
Specific embodiments of the present invention will be described in further detail with reference to specific examples, but the scope of the present invention is not limited thereto. The size of the pattern of the reflection area is designed, and the area is not covered by the battery piece. The patterned reflective coating region is the position of the gap between the cell and the frame, and can be determined according to the specific design of the cell and the photovoltaic module. Besides double-sided batteries, single-sided batteries, stack-tile batteries, half-cell modules can also be used.
Example 1
The transparent packaging back plate provided by the embodiment comprises a transparent substrate and a patterned reflective coating formed on the transparent substrate, the structure of the transparent substrate is shown in fig. 2, and the transparent substrate comprises a transparent substrate and weather-resistant coatings coated on two surfaces of the transparent substrate, specifically, the transparent substrate in the embodiment is a commercially available double-coated transparent back plate (from forster company, model BEC-301T.)
The formula of the photovoltaic ink composition used for the transparent packaging back plate in the embodiment is as follows (in parts by mass):
in this example, the compatibilizer was prepared by the following method: a four-necked flask equipped with a reflux condenser, a stirrer, a thermometer, and a dropping device was charged with a mixed solvent of 30g of ethyl acetate and 70g of xylene. Heating to reflux temperature, wherein the mass ratio of styrene to acrylic acid to hydroxyethyl methacrylate is 60: 15: and (3) dripping 100g of the monomer mixture prepared by 25 and 1g of initiator BPO into a reaction system, setting the polymerization temperature to be 110 ℃, setting the titration time to be 15min, carrying out heat preservation reaction for 70min after the titration is finished, naturally cooling to room temperature, and discharging to obtain the compatibilizer solution. The molecular weight of the detected compatibilizer is 20000.
The ink composition is prepared by the following method: mixing the matrix and the compatibilizer, dispersing and stirring for 30min, adding the adhesion promoter, dispersing and stirring for 15min, adding the ink auxiliary agent, dispersing and stirring for 30min, adding the color paste treated by the interface regulator, dispersing and stirring for 30min, then carrying out frosting treatment for 30min, then adding the curing agent and the diluent, dispersing and stirring for 30min, discharging, and filling into a sealed iron pipe for later use.
Preparing a transparent packaging back plate: and (3) standing the prepared ink composition for 1h, treating by using a butterfly filter, and draining into an ink box of a printer. Using a starFireSG1024 nozzle, the ink jet amount is 70%, the ink drop size is 85PL, the ignition frequency is 30KHZ, the nozzle temperature is 41 ℃, the printing speed is 25m/min, printing is carried out on a transparent substrate, and then baking is carried out in a drying tunnel at 100 ℃ for 3 min.
Example 2
The transparent packaging back plate provided by the embodiment comprises a transparent substrate and a patterned reflective coating formed on the transparent substrate, wherein the structure of the transparent substrate is shown in fig. 3, specifically, the transparent substrate in the embodiment is selected from a TPC (thermoplastic elastomer) structured transparent back plate purchased from the market (an inner layer is a transparent coating, an outer layer is a composite dupont transparent T film, and is purchased from new photovoltaic material ltd, suzhou, and the model is FFC-JW 30.), and the inner layer is processed by using plasma electric sparks.
The formula of the photovoltaic ink composition used for the transparent packaging back plate in the embodiment is as follows (in parts by mass):
40 portions of GK-570 (Japan gold)
5 parts of FB8718 (Shanghai weathercock chemical technology)
LR-7514 (Shanghai Zhongrong new material science and technology) 3.0 parts
3.60 parts of LTW-B (Yingchuangdegsa)
HY-105 (Hangzhou Jessica chemical engineering) 1.0 part
9.0 parts of compatibilizer
Color paste (Xian Yan chemical Co., Ltd., Fushan City) 80 parts
BYK-111 (German Bick chemical) 2.5 parts
Stannous octoate (Guangzhou zongfang trade Co., Ltd.) 0.2 parts
WE-D8776R (Anhui Xinnuo) 0.45 parts
3021(DIC)0.2 parts
25 parts of xylene (Shanghai Aotai Kogyo Co., Ltd.)
Dibasic ester (Wunstedt chemical industry) 40 portions
Modified SBN-70D (Asahi chemical) 18 parts.
In this example, the mass ratio of styrene, acrylic acid, hydroxyethyl methacrylate monomer of the compatibilizer is 70: 10: 20.
in the preparation method of the transparent packaging back plate in the embodiment, the size of the ink drop is 40PL, the ignition frequency is 35KHZ, the temperature of the spray head is 45 ℃, and the printing speed is 55 m/min.
Example 3
The transparent packaging back plate provided by the embodiment comprises a transparent substrate and a patterned reflective coating formed on the transparent substrate, wherein the structure of the transparent substrate is shown in fig. 5, specifically, the transparent substrate in the embodiment is selected from a transparent polyester film (PET) with a three-layer co-extrusion structure with hydrolysis resistance and ultraviolet resistance, and the surface of the transparent substrate is treated by plasma spark.
The formula of the photovoltaic ink composition used for the transparent packaging back plate in the embodiment is as follows (in parts by mass):
30 portions of VESSTOPLAST 708 (German winning creation)
5 portions of DYNAPOL L210 (Germany winning creation)
E54 (Sanmozu group) 5 parts
LR-7514 (Shanghai Zhongrong new material science and technology) 2.50 parts
NDZ-201 (Nanjing eosin photochemical) 1.0 part
9.0 parts of compatibilizer
Color paste (Ningbo Hua Ying pigment technology Co., Ltd.) 75 parts
BYK-111 (German Bick chemical) 2.5 parts
Stannous octoate (Guangzhou zongfang trade Co., Ltd.) 0.2 parts
Flow 300 (TEGO, Germany) 0.30 parts
MOK8216 (German merck) 0.25 part
3021(DIC)0.2 parts
35 parts of xylene (Shanghai Aotai Kogyo Co., Ltd.)
30 portions of amyl acetate (Changzhou Yuanfeng chemical industry)
Desmodur BL4265SN (Bayer Germany) 4 parts
BL3370MPA (German Bayer) 16 parts.
In this example, the mass ratio of styrene, acrylic acid, and hydroxyethyl methacrylate monomers of the compatibilizer is 55:15: 30.
In the preparation method of the transparent packaging back plate in the embodiment, the size of the ink drop is 25PL, the ignition frequency is 40KHZ, the temperature of the spray head is 45 ℃, and the printing speed is 65 m/min.
Example 4
The transparent packaging backboard provided by this embodiment includes a transparent substrate and a patterned reflective coating formed on the transparent substrate, the structure of the transparent substrate is shown in fig. 4, specifically, the transparent substrate in this embodiment is selected from a transparent backboard (fluorine film is transparent PVDF) with KPK structure, and the surface is processed by plasma electric spark.
The formula of the photovoltaic ink composition used for the transparent packaging back plate in the embodiment is as follows (in parts by mass):
20 portions of WF-B012 (Wuxi Wanbo paint chemical Co., Ltd.)
HY8047 (New Qingdao Jubang material) 20 parts
HN-5562 (Changzhou Haina) 3.50 parts
HY-102 (Hangzhou Jessica chemical engineering) 1.0 part
9.0 parts of compatibilizer
Color paste (Ningbo Hua Ying pigment technology Co., Ltd.) 80 parts
BYK-111 (German Bick chemical) 1.5 parts
EFKA-4320 (Pasteur) 1.5 parts
Stannous octoate (Guangzhou zongfang trade Co., Ltd.) 0.2 parts
WE-D8776R (Anhui Xinnuo) 0.5 parts
3021(DIC)0.2 parts
30 parts of dimethylbenzene (Shanghai AoSn industries Co., Ltd.)
20 parts of dipropylene glycol methyl ether (Yun warship import and export trade Co., Ltd.)
12.5 parts of modified TPA-B80X (Asahi chemical)
7.5 parts of BL3370MPA (German Bayer).
In this example, the mass ratio of styrene, acrylic acid, and hydroxyethyl methacrylate monomers of the compatibilizer is 65:12: 23.
In the preparation method of the transparent packaging back plate in the embodiment, the size of the ink drop is 85PL, the ignition frequency is 30KHZ, the temperature of the spray head is 45 ℃, and the printing speed is 27 m/min.
Comparative example 1
The transparent packaging back plate of the comparative example is the same as that of example 2 except that no compatibilizer is added to the selected ink composition.
Comparative example 2
The transparent back sheet for sealing of this comparative example was the same as example 2 except that the ink composition was selected without adding an interface modifier.
1. Performance testing
The ink compositions and the transparent packaging back sheet of examples 1 to 4 and comparative examples 1 to 2 were subjected to performance tests, and the results are shown in tables 1 to 4, wherein the test methods are as follows:
specific gravity: ASTM D1475-98 standard was performed.
Solid content: the GB/T2793-1995 standard is implemented.
Particle size: the test is carried out by using an Oumeik laser particle size analyzer.
Viscosity: the GB/T22235-.
Surface tension: QB/T2730.1-2005 standard was performed with ink temperature controlled at 35 ℃.
pH: the QB/T2730.1-2005 standard is implemented.
Conductivity: the QB/T2730.1-2005 standard is implemented.
Yellowing index: implementing the GB/2409-80 standard.
Adhesive force performance: implementing the GB/T9286-1998 standard. The specification is 1 μm × 1 μm by adopting a check method for testing.
And (3) performing damp-heat aging according to the related regulations of IEC 61215-.
Peel strength: executing the GB/T2790-1995 standard, and adopting POE or EVA adhesive film.
Table 1 shows the results of performance tests on the ink compositions of examples 1 to 4
| Test items | Unit of | Example 1 | Example 2 | Example 3 | Example 4 |
| Specific gravity of | g/mL | 1.08 | 1.09 | 1.09 | 1.06 |
| Solid content | ％ | 48.07％ | 48.05％ | 46.34％ | 50.03％ |
| Collected particle size | μm | 0.43 | 0.43 | 0.43 | 0.43 |
| Viscosity of the oil | mPa·s | 14 | 14 | 13 | 15 |
| Surface tension | mN/m | 26.2 | 26.3 | 25.7 | 26.0 |
| PH | / | 6.7 | 6.5 | 6.2 | 6.8 |
| Electrical conductivity of | ms/cm | 4.3 | 4.0 | 3.8 | 4.1 |
Table 2 shows the results of the performance test of the ink compositions of comparative examples 1 to 2
Note: the ink compositions were tested immediately after formulation.
Table 3 shows the performance test results of the transparent package back plates of examples 1 to 4
Table 4 shows the performance test results of the transparent packaging back sheets of comparative examples 1 to 2
The product A and the product B of the company on the market are tested at the same time, and the results are as follows:
product of company a on the market: the initial coating has the peel strength with EVA of 17N/cm and the peel strength with POE of 12N/cm without corona treatment; the peel strength between the initial coating and POE after corona treatment was only 53N/cm.
Company B product: without corona treatment, the peel strength of the initial coating from EVA was 21N/cm and from POE was 14N/cm. The peel strength between the initial coating and POE after corona treatment was 72N/cm.
2. Evaluation of Effect
21) The ink compositions of example 2 and comparative examples 1 to 2 were sealed and allowed to stand at room temperature for 7 days, temperature: 27-35 ℃, humidity: 53 to 77 percent.
22) The ink is filled into the printing equipment and circularly flows in a spray head, a pipeline and an ink box loop, the temperature of the spray head is set to be 35 ℃, the spray head can spray ink once every 30 minutes, and the ink is circulated for 7 days (time is 2019.04.01-2019.04.07, place: shanghai). Taking the ink of example 2 as an example:
the above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (17)
1. The ink composition is characterized in that the raw material formula of the ink composition comprises the following components in parts by weight:
40-70 parts of matrix resin;
50-90 parts of color paste;
2-6 parts of an adhesion promoter;
0.5-2.5 parts of an interface regulator;
4-10 parts of a compatibilizer;
2-10 parts of an ink auxiliary agent;
15-22 parts of a curing agent;
40-80 parts of a diluent;
the compatibilizer is a styrene-acrylic acid-hydroxyethyl methacrylate terpolymer;
the interface regulator is titanate and its derivative.
2. The ink composition according to claim 1, characterized in that: the styrene-acrylic acid-hydroxyethyl methacrylate terpolymer is prepared by mixing styrene, acrylic acid and hydroxyethyl methacrylate according to a mass ratio of 26-34: 3-8: 7-14, and the molecular weight of the styrene-acrylic acid-hydroxyethyl methacrylate terpolymer is 12000-35000.
3. The ink composition according to claim 1, characterized in that: the titanate and the derivative thereof comprise a monoalkoxy type and a monoalkoxy pyrophosphate type, and the functionality of titanate is 2-3.
4. The ink composition according to claim 1, characterized in that: the matrix resin is a mixture consisting of one or more of hydroxyl acrylic resin, polyester resin, polyolefin resin, fluorine-containing resin, epoxy resin and amino resin.
5. The ink composition according to claim 1, characterized in that: the color paste is solvent type color paste, the pigment used in the color paste is one or a mixture of more of rutile titanium dioxide, nano calcium carbonate, nano ceramic powder and nano bentonite, and the solvent used in the color paste is one or a mixture of more of ketones, benzenes, esters and ethers.
6. The ink composition according to claim 1, characterized in that: the adhesion promoter is an acrylic acid modified resin with a polyhydroxy value and a polyacid value, and the molecular weight is 4000-30000.
7. The ink composition according to claim 1, characterized in that: the ink auxiliary agent comprises a mixture consisting of one or more of a dispersing agent, a flatting agent, a catalyst, an anti-settling agent and a viscosity reducer.
8. The ink composition according to claim 1, characterized in that: the curing agent is a mixture consisting of one or more of closed high-temperature-resistant aromatic isocyanate, closed aliphatic isocyanate and closed alicyclic isocyanate.
9. The ink composition according to claim 1, characterized in that: the diluent is one or more of xylene, propylene glycol methyl ether acetate, butyl acetate, amyl acetate, diisobutyl ketone, ethyl triethoxy propionate, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, dipropylene glycol methyl ether and dibasic ester mixture.
10. A method for preparing the ink composition according to any one of claims 1 to 9, characterized by: the preparation method comprises the steps of uniformly mixing and dispersing matrix resin, an ink auxiliary agent, color paste, a bonding promoter, an interface regulator and a compatibilizer, adding a curing agent and a diluent after sanding treatment, and uniformly mixing and dispersing to obtain the ink composition.
11. A patterned transparent packaging backboard comprises a transparent substrate and a patterned reflective coating formed on the transparent substrate, and is characterized in that: the patterned reflective coating is made from the ink composition of any one of claims 1-9.
12. The patterned transparent packaging backsheet according to claim 11, wherein: the patterned reflective coating is prepared by printing the ink composition on the surface of the treated transparent substrate through ink jet, and then baking and curing.
13. The patterned transparent packaging backsheet according to claim 11, wherein: the thickness of the transparent substrate is 100-500 mu m, and the thickness of the patterned reflective coating is 4-60 mu m.
14. The patterned transparent packaging backsheet according to claim 11, wherein: the transparent substrate is a transparent substrate and is composed of a transparent substrate and weather-resistant coatings coated on two surfaces of the transparent substrate, or is composed of a transparent substrate, a weather-resistant coating coated on one surface of the transparent substrate and a thin film layer bonded on the other surface of the transparent substrate through an adhesive, or is composed of a transparent substrate and thin film layers bonded on two surfaces of the transparent substrate through adhesives.
15. The patterned transparent packaging backsheet according to claim 14, wherein: the transparent base material is one of a polyester film, a polyimide film, a PVA film, a biaxial stretching polypropylene film, a nylon film and a casting polypropylene film.
16. The patterned transparent packaging backsheet according to claim 14, wherein: the weather-resistant coating is formed by taking one or a mixture of a plurality of epoxy resin, polyester resin, fluorocarbon resin, phenolic resin, hydroxyl acrylic resin, amino resin and polyolefin resin as a matrix.
17. The patterned transparent packaging backsheet according to claim 14, wherein: the film layer is a fluorine-containing transparent film, a polyolefin transparent film, a polyimide transparent film or a nylon transparent film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911145331.3A CN110903700B (en) | 2019-11-21 | 2019-11-21 | Photovoltaic ink composition and patterned transparent packaging backboard for ink-jet printing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911145331.3A CN110903700B (en) | 2019-11-21 | 2019-11-21 | Photovoltaic ink composition and patterned transparent packaging backboard for ink-jet printing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110903700A true CN110903700A (en) | 2020-03-24 |
| CN110903700B CN110903700B (en) | 2021-12-21 |
Family
ID=69818268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911145331.3A Active CN110903700B (en) | 2019-11-21 | 2019-11-21 | Photovoltaic ink composition and patterned transparent packaging backboard for ink-jet printing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110903700B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111674171A (en) * | 2020-06-11 | 2020-09-18 | 福耀玻璃工业集团股份有限公司 | Method for printing pattern on EVA (ethylene vinyl acetate) adhesive film |
| CN112480662A (en) * | 2020-11-23 | 2021-03-12 | 山东广垠新材料有限公司 | Transparent nylon capable of absorbing infrared rays and preparation method thereof |
| CN112635603A (en) * | 2021-01-08 | 2021-04-09 | 常州回天新材料有限公司 | Transparent grid backboard of photovoltaic module and preparation method thereof |
| CN112959771A (en) * | 2021-02-10 | 2021-06-15 | 北京东方雨虹防水技术股份有限公司 | High resistant modified asphalt waterproofing membrane of waiting with low heat-absorbing surface |
| CN113002096A (en) * | 2021-02-10 | 2021-06-22 | 南通金丝楠膜材料有限公司 | Special hot-melt film with metalloid luster |
| CN113299782A (en) * | 2021-06-09 | 2021-08-24 | 苏州明冠新材料科技有限公司 | Transparent backboard with high-reflectivity black grid and preparation method thereof |
| CN113403883A (en) * | 2021-05-19 | 2021-09-17 | 安徽集友新材料股份有限公司 | Anti-reverse light aluminizing transfer tipping paper, preparation method thereof and cigarette |
| CN113604107A (en) * | 2021-08-27 | 2021-11-05 | 浙江福斯特新材料研究院有限公司 | Water-based ink, adhesive film and application thereof |
| CN114649434A (en) * | 2020-12-21 | 2022-06-21 | 杭州福斯特应用材料股份有限公司 | Patterned adhesive film and photovoltaic module |
| CN114958075A (en) * | 2022-06-06 | 2022-08-30 | 东莞南玻太阳能玻璃有限公司 | Water-based reflective ink, preparation method thereof and application of water-based reflective ink in photovoltaic glass |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090101204A1 (en) * | 2007-10-22 | 2009-04-23 | Biosolar, Inc. | Photovoltaic laminated module backsheet, films and coatings for use in module backsheet, and processes for making the same |
| CN103467651A (en) * | 2013-10-09 | 2013-12-25 | 昆山天洋热熔胶有限公司 | Method for preparing anti-scratch coating material for solar cell backplanes |
| CN106010414A (en) * | 2016-06-30 | 2016-10-12 | 杭州福斯特光伏材料股份有限公司 | High-cohesiveness fluorocarbon coating and application |
| CN106960888A (en) * | 2017-03-03 | 2017-07-18 | 杭州福斯特应用材料股份有限公司 | A kind of high reflection gain-type photovoltaic encapsulation glued membrane and purposes |
| CN107408596A (en) * | 2015-03-31 | 2017-11-28 | 大金工业株式会社 | The backboard and solar cell module of solar cell module |
| CN109796806A (en) * | 2018-12-28 | 2019-05-24 | 苏州福斯特光伏材料有限公司 | A kind of patterning photovoltaic back and preparation method thereof |
-
2019
- 2019-11-21 CN CN201911145331.3A patent/CN110903700B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090101204A1 (en) * | 2007-10-22 | 2009-04-23 | Biosolar, Inc. | Photovoltaic laminated module backsheet, films and coatings for use in module backsheet, and processes for making the same |
| CN103467651A (en) * | 2013-10-09 | 2013-12-25 | 昆山天洋热熔胶有限公司 | Method for preparing anti-scratch coating material for solar cell backplanes |
| CN107408596A (en) * | 2015-03-31 | 2017-11-28 | 大金工业株式会社 | The backboard and solar cell module of solar cell module |
| CN106010414A (en) * | 2016-06-30 | 2016-10-12 | 杭州福斯特光伏材料股份有限公司 | High-cohesiveness fluorocarbon coating and application |
| CN106960888A (en) * | 2017-03-03 | 2017-07-18 | 杭州福斯特应用材料股份有限公司 | A kind of high reflection gain-type photovoltaic encapsulation glued membrane and purposes |
| CN109796806A (en) * | 2018-12-28 | 2019-05-24 | 苏州福斯特光伏材料有限公司 | A kind of patterning photovoltaic back and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 顾丽争等: "《光伏背板粘结涂层与封装胶膜粘结力的研究》", 《涂料工业》 * |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111674171B (en) * | 2020-06-11 | 2022-02-11 | 福耀玻璃工业集团股份有限公司 | Method for printing pattern on EVA (ethylene vinyl acetate) adhesive film |
| CN111674171A (en) * | 2020-06-11 | 2020-09-18 | 福耀玻璃工业集团股份有限公司 | Method for printing pattern on EVA (ethylene vinyl acetate) adhesive film |
| CN112480662A (en) * | 2020-11-23 | 2021-03-12 | 山东广垠新材料有限公司 | Transparent nylon capable of absorbing infrared rays and preparation method thereof |
| CN114649434B (en) * | 2020-12-21 | 2024-09-20 | 杭州福斯特应用材料股份有限公司 | Patterned adhesive film and photovoltaic module |
| CN114649434A (en) * | 2020-12-21 | 2022-06-21 | 杭州福斯特应用材料股份有限公司 | Patterned adhesive film and photovoltaic module |
| CN112635603A (en) * | 2021-01-08 | 2021-04-09 | 常州回天新材料有限公司 | Transparent grid backboard of photovoltaic module and preparation method thereof |
| CN112959771A (en) * | 2021-02-10 | 2021-06-15 | 北京东方雨虹防水技术股份有限公司 | High resistant modified asphalt waterproofing membrane of waiting with low heat-absorbing surface |
| CN113002096B (en) * | 2021-02-10 | 2023-11-07 | 南通金丝楠膜材料有限公司 | Special hot-melt film with metal-like luster |
| CN113002096A (en) * | 2021-02-10 | 2021-06-22 | 南通金丝楠膜材料有限公司 | Special hot-melt film with metalloid luster |
| CN113403883A (en) * | 2021-05-19 | 2021-09-17 | 安徽集友新材料股份有限公司 | Anti-reverse light aluminizing transfer tipping paper, preparation method thereof and cigarette |
| CN113403883B (en) * | 2021-05-19 | 2022-08-16 | 安徽集友新材料股份有限公司 | Anti-reverse light aluminizing transfer tipping paper, preparation method thereof and cigarette |
| CN113299782A (en) * | 2021-06-09 | 2021-08-24 | 苏州明冠新材料科技有限公司 | Transparent backboard with high-reflectivity black grid and preparation method thereof |
| CN113604107A (en) * | 2021-08-27 | 2021-11-05 | 浙江福斯特新材料研究院有限公司 | Water-based ink, adhesive film and application thereof |
| CN113604107B (en) * | 2021-08-27 | 2023-11-24 | 浙江福斯特新材料研究院有限公司 | Water-based ink, adhesive film and application thereof |
| CN114958075A (en) * | 2022-06-06 | 2022-08-30 | 东莞南玻太阳能玻璃有限公司 | Water-based reflective ink, preparation method thereof and application of water-based reflective ink in photovoltaic glass |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110903700B (en) | 2021-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110903700B (en) | Photovoltaic ink composition and patterned transparent packaging backboard for ink-jet printing process | |
| JP6241414B2 (en) | Solar cell backside sealing sheet and solar cell module | |
| CN102746785B (en) | Dual-cured coating composition and curing method thereof | |
| CN102765239B (en) | Releasing film with light releasing force and manufacture method of releasing film | |
| CN108546540B (en) | Preparation method of ultraviolet curing transfer adhesive for glass substrate | |
| CN102610680B (en) | Solar battery back plate adopting ultraviolet (UV) curing weather-proof coating and manufacture method of solar battery back plate | |
| CN103044996A (en) | Solvent-free ultraviolet (UV) curing photodiffusion coating material, preparation method and application of solvent-free UV curing photodiffusion coating material | |
| CN102199402A (en) | Ultraviolet curing adhesive for transfer printing film | |
| CN105102228A (en) | Multilayer film, back sheet for solar cell module, and solar cell module | |
| CN102473772A (en) | Backside protective sheet for solar cells and process for production of same | |
| CN104263229A (en) | Preparation method for antistatic UV (Ultraviolet) coating and film forming method of same | |
| CN105315736A (en) | Protective layer composition, preparation method and application thereof | |
| CN104178017A (en) | Optical-thermal double-solidified baikeding for tinplate and coating method thereof | |
| CN113604107B (en) | Water-based ink, adhesive film and application thereof | |
| CN103098232A (en) | Base material for solar cell module and method for producing same | |
| WO2023201778A1 (en) | Photovoltaic module composite backboard and preparation method therefor, and photovoltaic module | |
| CN104530789A (en) | Cationic photocureable coating for transfer printing film | |
| CN104766932A (en) | Biodegradable substrate for flexible optoelectronic device and method for manufacturing same | |
| CN104538491B (en) | Solar cell backsheet repair solution | |
| CN102311697A (en) | Ultraviolet light or electron beam radiation curing powder coating | |
| CN105440894B (en) | For Metal surface anti-corrosion light solidifying paint composition | |
| CN105153793A (en) | Resin composition ink, use thereof and circuit board using the same | |
| CN105576063B (en) | Solar cell backboard | |
| CN105140323A (en) | Efficient silicon solar module | |
| JP5949189B2 (en) | Easy-adhesive film and method for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |