CN110896684B - Camera structure, cloud platform and unmanned aerial vehicle - Google Patents
Camera structure, cloud platform and unmanned aerial vehicle Download PDFInfo
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- CN110896684B CN110896684B CN201880014280.8A CN201880014280A CN110896684B CN 110896684 B CN110896684 B CN 110896684B CN 201880014280 A CN201880014280 A CN 201880014280A CN 110896684 B CN110896684 B CN 110896684B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
- B64U20/00—Constructional aspects of UAVs
- B64U20/80—Arrangement of on-board electronics, e.g. avionics systems or wiring
- B64U20/87—Mounting of imaging devices, e.g. mounting of gimbals
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C1/00—Measuring angles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/56—Accessories
- G03B17/561—Support related camera accessories
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
- B64U10/00—Type of UAV
- B64U10/10—Rotorcrafts
- B64U10/13—Flying platforms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
- B64U2101/00—UAVs specially adapted for particular uses or applications
- B64U2101/30—UAVs specially adapted for particular uses or applications for imaging, photography or videography
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Remote Sensing (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Radar, Positioning & Navigation (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Gyroscopes (AREA)
Abstract
A camera structure (10), a pan-tilt (100) and an unmanned aerial vehicle (1000). The camera structure (10) is formed with a back side (112) and a side (114) that are connected. The camera structure (10) includes a sensor circuit board (12), an inertial measurement circuit board (14), and an inertial measurement unit (15). An inertial measurement unit (15) is disposed on the inertial measurement circuit board (14) and is used to acquire attitude data of the camera. One of the sensor circuit board (12) and the inertia measurement circuit board (14) is disposed on the side surface (114), and the other is disposed on the back surface (112). In camera structure (10), cloud platform (100) and unmanned aerial vehicle (1000), one in sensor circuit board (12) and inertia measurement circuit board (14) sets up in side (114), and another sets up in back (112), and whole volume utilization is higher, has greatly saved installation space.
Description
Technical Field
The embodiment of the invention relates to the field of shooting, in particular to a camera structure, a holder and an unmanned aerial vehicle.
Background
The camera of the pan/tilt head requires an inertial measurement circuit board for setting an inertial measurement unit for acquiring attitude data of the camera, in addition to the sensor circuit board. However, the sensor circuit board and the inertia measurement circuit board are generally mounted on the camera independently, and occupy a large space.
Disclosure of Invention
The embodiment of the invention provides a camera structure, a holder and an unmanned aerial vehicle.
The camera structure of the embodiment of the present invention is formed with a back surface and a side surface which are connected, and includes:
a sensor circuit board;
an inertial measurement circuit board; and
the inertial measurement unit is arranged on the inertial measurement circuit board and is used for acquiring attitude data of the camera;
one of the sensor circuit board and the inertia measurement circuit board is disposed on the side surface, and the other is disposed on the back surface.
In some embodiments, the camera structure further comprises:
an image sensor disposed on the sensor circuit board.
In some embodiments, the sensor circuit board and the inertial measurement circuit board are connected by a flexible circuit board and camera internal components; or
The sensor circuit board and the inertia measurement circuit board are connected with each other through a flexible circuit board.
In some embodiments, the sensor circuit board, the inertial measurement circuit board, and the flexible circuit board are a unitary circuit board structure.
In some embodiments, the flexible circuit board is located on the back side; or
The flexible circuit board is positioned on the side face; or
The flexible circuit board is located on the back surface and the side surface.
In some embodiments, the back surface is a back surface of the lens, and the side surface is perpendicular to the back surface.
In some embodiments, the inertial measurement circuit board includes a mounting portion and an extension portion connected to the mounting portion in one direction.
In some embodiments, the camera structure further comprises a shock absorbing element located between the extension and the side face when the inertial measurement circuit board is disposed on the side face; when the inertia measurement circuit board is arranged on the back surface, the shock absorption element is positioned between the extension part and the back surface.
In some embodiments, when the inertia measurement circuit board is disposed on the side surface, the side surface is formed with a groove corresponding to the extension portion; when the inertia measurement circuit board is arranged on the back surface, a groove corresponding to the extension part is formed on the back surface;
the shock absorption element is filled in the groove.
The cloud platform of the embodiment of the invention comprises:
the holder body; and
the camera structure of any one of the above embodiments, wherein the camera structure is disposed on the holder body.
In some embodiments, the holder further includes an electrical adjusting plate, and the sensor circuit board and/or the inertia measuring circuit board are connected to the electrical adjusting plate.
In certain embodiments, a drone, comprising:
a body; and
the cloud platform of any above embodiment, the cloud platform sets up on the fuselage.
In the camera structure, the holder and the unmanned aerial vehicle, one of the sensor circuit board and the inertia measurement circuit board is arranged on the side surface, and the other one is arranged on the back surface, so that the overall volume utilization rate is high, and the installation space is greatly saved.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of embodiments of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic block diagram of a camera configuration according to some embodiments of the present invention;
fig. 2 is a partial structural schematic diagram of a camera structure according to some embodiments of the invention, wherein a circuit board structure of the camera structure has a first view angle;
fig. 3 is a partial structural diagram of a camera structure according to some embodiments of the invention, wherein a circuit board structure of the camera structure has a second view angle;
FIG. 4 is a schematic diagram of a portion of a camera structure according to some embodiments of the present invention;
FIG. 5 is a schematic structural diagram of a camera structure according to some embodiments of the invention;
FIG. 6 is a schematic diagram of a portion of a camera structure according to some embodiments of the present invention;
figure 7 is a schematic structural view of a drone according to some embodiments of the present invention;
figure 8 is a schematic view of a portion of the structure of a drone according to some embodiments of the invention;
figure 9 is a schematic view of a portion of the structure of a drone according to some embodiments of the invention;
figure 10 is a schematic view of a portion of the structure of a drone according to some embodiments of the invention;
description of the main elements and symbols:
the camera structure 10, the lens 11, the back 112, the side 114, the first side 1141, the second side 1142, the third side 1143, the fourth side 1144, the groove 1145, the light incident surface 116, the sensor circuit board 12, the image sensor 13, the inertia measurement circuit board 14, the mounting portion 142, the extension portion 144, the first side 1441, the second side 1442, the third side 1443, the fourth side 1444, the cut 1445, the inertia measurement unit 15, the screw 16, the flexible circuit board 17, the camera internal element 18, the shock-absorbing element 19, the cradle head body 30, the electrical tilt 50, the cradle head 100, the fuselage 200, the core board 300, and the unmanned aerial vehicle 1000.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining embodiments of the present invention, and are not to be construed as limiting the embodiments of the present invention.
In the description of the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations and positional relationships based on those shown in the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
The following disclosure provides many different embodiments or examples for implementing different configurations of embodiments of the invention. To simplify the disclosure of embodiments of the invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit embodiments of the invention. Furthermore, embodiments of the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, while embodiments of the invention provide examples of various specific processes and materials, one of ordinary skill in the art will recognize applications of other processes and/or uses of other materials.
Referring to fig. 1, a camera structure 10 according to an embodiment of the present invention is provided. The camera structure 10 is formed with a back side 112 and a side 114 that are connected. The back surface 112 is the back surface 112 of the lens 11 of the camera structure 10. The lens 11 further includes a light incident surface 116. The external light enters from the light incident surface 116 and passes through the lens assembly (not shown) of the lens 11. The input surface 116 and the back surface 112 are located on opposite sides of the lens assembly.
Referring to fig. 2 and 3, the camera structure 10 includes a sensor circuit board 12, an image sensor 13, an inertia measurement circuit board 14, and an inertia measurement unit 15.
The image sensor 13 is disposed on the sensor circuit board 12. The image sensor 13 may be a Complementary Metal-Oxide Semiconductor (CMOS) image sensor, a Charge Coupled Device (CCD) image sensor, or the like. The image sensor 13 is electrically connected to the sensor circuit board 12, and is configured to perform photoelectric conversion on light incident from the light incident surface 116 and then image the light to obtain image data, where the image data can be transmitted to the outside through the sensor circuit board 12.
The inertia measurement unit 15 is provided on the inertia measurement circuit board 14. The inertial measurement unit 15 may include at least one of a gyroscope, an accelerometer, a magnetometer, and a pressure sensor. The inertial measurement unit 15 is configured to acquire attitude data of the camera, such as euler angles, quaternions, matrices, shaft angles, and the like, and output the acquired attitude data through the inertial measurement circuit board 14 to implement attitude control.
One of the sensor circuit board 12 and the inertial measurement circuit board 14 is disposed on the side 114 and the other is disposed on the back 112. For example, the sensor circuit board 12 is disposed on the side 114, and the inertia measurement circuit board 14 is disposed on the back 112; alternatively, the sensor circuit board 12 is disposed on the back side 112 and the inertial measurement circuit board 14 is disposed on the side 114 (as shown in FIG. 1). Specifically, the sensor circuit board 12 and the inertia measurement circuit board 14 may be secured to the back side 112 or the side 114, respectively, by screws 16 or other means such as soldering, snapping, bonding, etc. Compared with the case where the sensor circuit board 12 and the inertia measurement circuit board 14 are stacked on the back surface 112 of the camera structure 10, or the sensor circuit board 12 and the inertia measurement circuit board 14 are stacked on the side surface 114 of the camera structure 10, in the camera structure 10 according to the embodiment of the present invention, one of the sensor circuit board 12 and the inertia measurement circuit board 14 is disposed on the side surface 114, and the other is disposed on the back surface 112, which does not result in an excessively thick camera body, and the overall volume utilization rate is high, thereby greatly saving the installation space.
In some embodiments, the side 114 is perpendicular to the back 112. Thus, the sensor circuit board 12 disposed on the back surface 112 (or the inertia measurement circuit board 14 disposed on the back surface 112) and the inertia measurement circuit board 14 disposed on the side surface 114 (or the sensor circuit board 12 disposed on the side surface 114) are arranged vertically, thereby further saving the installation space. The side surface 114 may be a ring-shaped structure and surrounds the lens group of the lens 11, and may be a substantially ring-shaped structure (as shown in fig. 1 and 4, the top and the bottom of the ring-shaped structure are both provided with notches) or a square ring-shaped structure (as shown in fig. 5 and 6, in this case, the side surface 114 includes four end-to-end side surfaces).
Referring to fig. 1 and 4 together, in some embodiments, the side surface 114 includes a first side surface 1141, a second side surface 1142, a third side surface 1143 and a fourth side surface 1144 which are connected in sequence. The first side 1141 is opposite to the third side 1143, and the second side 1142 is opposite to the fourth side 1144. The first side 1141, the second side 1142, the third side 1143, and the fourth side 1144 are perpendicular to the back surface 112. When the sensor circuit board 12 is disposed on the side surface 114, the sensor circuit board 12 may be disposed on the first side surface 1141, the second side surface 1142, the third side surface 1143, or the fourth side surface 1144; when the inertia measurement circuit board 14 is disposed on the side surface 114, the inertia measurement circuit board 14 may be disposed on the first side surface 1141, the second side surface 1142, the third side surface 1143, or the fourth side surface 1144.
Of course, in other embodiments, the side surface 114 and the back surface 112 may form an acute angle or an obtuse angle, and in this case, the lens 11 of the camera is in a circular truncated cone shape. For example, the side surface 114 and the back surface 112 form an angle of 80 degrees, so that the area of the light incident surface 116 of the lens 11 is smaller than the area of the back surface 112 of the lens 11; or the side surface 114 and the back surface 112 form an included angle of 100 degrees, so that the area of the light incident surface 116 of the lens 11 is larger than the area of the back surface 112 of the lens 11, and the like.
Referring to fig. 1, in some embodiments, sensor circuit board 12 and inertial measurement circuit board 14 may be interconnected by a flexible circuit board 17. The image data acquired by the image sensor 13 can be transmitted to the inertia measurement circuit board 14 through the sensor circuit board 12 and the flexible circuit board 17, and then the inertia measurement circuit board 14 transmits the image data and/or the attitude data to other processing modules for processing through a signal transmission line (such as an axis); or the attitude data acquired by the inertial measurement unit 15 can be transmitted to the sensor circuit board 12 through the inertial measurement circuit board 14 and the flexible circuit board 17, and then the sensor circuit board 12 transmits the image data and/or the attitude data to other processing modules for processing through the signal transmission line. In this way, the sensor circuit board 12 and the inertia measurement circuit board 14 do not need to be provided with signal transmission lines to transmit image data and attitude data, respectively, which is advantageous for reducing the volume of the camera structure 10. Of course, it may be: image data acquired by the image sensor 13 can be transmitted to the inertia measurement circuit board 14 through the sensor circuit board 12 and the flexible circuit board 17, and then the inertia measurement circuit board 14 transmits the image data and/or attitude data to other processing modules for processing through a wireless transmission module; or the attitude data acquired by the inertial measurement unit 15 can be transmitted to the sensor circuit board 12 through the inertial measurement circuit board 14 and the flexible circuit board 17, and then the sensor circuit board 12 transmits the image data and/or the attitude data to other processing modules for processing through the wireless transmission module. In this manner, the sensor circuit board 12 and the inertia measurement circuit board 14 do not need to be provided with wireless transmission modules to transmit image data and attitude data, respectively. In addition, the flexible circuit board 17 is used for connecting the sensor circuit board 12 on the back surface 112 and the inertia measurement circuit board 14 on the side surface 114 in a bending mode; or to facilitate bending connection of the inertia measurement circuit board 14 at the back side 112 and the sensor circuit board 12 at the side 114.
Further, referring to fig. 2 and 3, the sensor circuit board 12, the inertia measurement circuit board 14, and the flexible circuit board 17 may be an integrated circuit board structure. The Circuit Board structure may be a rigid-flex Board, the sensor Circuit Board 12 and the inertia measurement Circuit Board 14 are Printed Circuit Boards (PCBs) in the rigid-flex Board, and the Flexible Circuit Board 17 is a Flexible Circuit Board (FPC) in the rigid-flex Board. The flexible circuit board 17 may be located on the back side 112, or the flexible circuit board 17 may be located on the side 114; or flexible circuit board 17 spans back side 112 and side 114.
Of course, in other embodiments, the sensor circuit board 12 and the inertial measurement circuit board 14 may also be connected via the flexible circuit board 17 and the camera internal components 18 (shown in fig. 1). The camera internal element 18 may be, for example, a camera internal circuit, a motor, or the like. Specifically, the sensor circuit board 12 is connected to a first camera internal element, the inertial measurement unit 15 is connected to a second camera internal element, and the first camera internal element and the second camera internal element are connected by the flexible circuit board 17.
In the embodiment of the present invention, the sensor circuit board 12 and the inertia measurement circuit board 14 are connected to each other through the flexible circuit board 17, and the sensor circuit board 12 is disposed on the back surface 112 and the inertia measurement circuit board 14 is disposed on the side surface 114.
Referring to fig. 1 and 2, the inertia measurement circuit board 14 includes a mounting portion 142 and an extending portion 144. The mounting portion 142 is connected to the flexible circuit board 17 and fixed to the side surface 114 by the screw 16, the extending portion 144 extends from the mounting portion 142, the extending portion 144 is connected to the mounting portion 142 in one direction, and the other three directions are free ends to form a peninsula structure. The inertial measurement unit 15 is located at the extension 144. Thus, the peninsula structure is beneficial to reducing the stress influence on the inertial measurement unit 15 on the extension portion 144 caused by the deformation of each circuit board in the installation process (for example, when the screw 16 is screwed), so as to avoid that the attitude data acquired by the inertial measurement unit 15 has a large error. Referring to fig. 2, the extending direction of the mounting portion 142 includes a first direction (r), a second direction (r), a third direction (r), a fourth direction (r), a fifth direction (c), a sixth direction (c), a seventh direction (c), and an eighth direction (r) which are distributed counterclockwise. The first direction (I) and the fifth direction (II) are parallel to the optical axis direction of the lens group, and the third direction (III) and the seventh direction (III) are perpendicular to the optical axis direction of the lens group. The extension part 144 may be connected to the mounting part 142 in any one of the first direction (c), the second direction (c), the third direction (c), the fourth direction (c), the fifth direction (c), the sixth direction (c), the seventh direction (c), and the eighth direction (c). Preferably, the extension part 144 is connected to the mounting part 142 in the second direction (or eighth direction). The distance between the inertial measurement unit 15 on the extension portion 144 and the sensor circuit board 12 and the flexible circuit board 17 is relatively long, which is beneficial to further reducing the stress influence on the inertial measurement unit 15 when the circuit board deforms.
Referring to fig. 1, in some embodiments, the camera structure 10 further includes a shock absorbing element 19. The shock absorbing element 19 is sized to fit the extension 144. When the inertia measurement circuit board 14 is disposed on the side surface 114, the shock absorbing member 19 is located between the extension portion 144 and the side surface 114; when the inertia measurement circuit board 14 is disposed on the back surface 112, the shock absorbing member 19 is located between the extension portion 144 and the back surface 112. In the embodiment of the invention, the damping element 19 is made of damping grease, and the damping element 19 is used for playing a role in shock isolation and buffering so as to reduce the stress influence on the inertia measurement unit 15 when the circuit board deforms. Of course, in other embodiments, the material of the shock absorbing element 19 may be other shock absorbing materials, and is not limited herein.
In some embodiments, when the inertia measurement circuit board 14 is disposed on the side surface 114, the side surface 114 is formed with a groove 1145 (shown in fig. 4) corresponding to the extension portion 144; when the inertia measurement circuit board 14 is disposed on the back surface 112, the back surface 112 is formed with a groove 1145 corresponding to the extending portion 144. The shock absorbing member 19 is filled in the groove 1145. The extension 144 is partially received in the recess 1145 by the dampening member 19.
Specifically, the groove 1145 may be formed by the side surface 114 being recessed toward a direction close to the optical axis of the camera structure 10; or the groove 1145 is surrounded by a structure protruding from the side surface 114 in a direction away from the optical axis of the camera structure 10; or the groove 1145 is formed by recessing the back surface 112 toward the direction close to the light incident surface 116; or the groove 1145 is formed by a structure protruding from the back surface 112 in a direction away from the light incident surface 116.
Referring to fig. 2, in some embodiments, the extending portion 144 includes a first side 1441, a second side 1442, a third side 1443, and a fourth side 1444 connected in sequence, the first side 1441 is opposite to the third side 1443, the second side 1442 is opposite to the fourth side 1444, the second side 1442 and the third side 1443 are located in the groove 1145, the first side 1441 and the fourth side 1444 are connected to the mounting portion 142 and form a cut 1445 with the mounting portion 142, and the cut 1445 is engaged with the groove 1145.
Referring to fig. 7, an embodiment of the invention further provides a cradle head 100. The pan/tilt head 100 includes the pan/tilt head body 30 and the camera structure 10 of any of the above embodiments. The camera structure 10 is disposed on the pan/tilt head body 30.
Specifically, the pan/tilt head 100 may be a single-axis pan/tilt head, a two-axis pan/tilt head, or a three-axis pan/tilt head, etc. The cradle head 100 may be a handheld cradle head or a carrying cradle head used carried on the unmanned aerial vehicle 1000. When the camera structure 10 is mounted on the pan/tilt head body 30, the pan/tilt head body 30 can stabilize the camera structure 10 and change the orientation, angle, etc. of the camera structure 10, so that the camera structure 10 can stably shoot and adjust the shooting angle.
Referring to fig. 8-10, in some embodiments, head 100 further includes a power strip 50. The sensor board 12 and/or the inertial measurement board 14 are connected to the electrical tuning board 50. The electrical tuning board 50 is also connected to the core board 300 of the drone 1000 through a flexible wiring board.
Referring to fig. 8, when the sensor circuit board 12 is connected to the electrical tuning board 50, the attitude data acquired by the inertial measurement unit 15 may be transmitted to the sensor circuit board 12 through the inertial measurement circuit board 14 and the flexible circuit board 17, and then the sensor circuit board 12 transmits the attitude data and/or the image data to the electrical tuning board 50 through a signal transmission line or a wireless transmission module, and the electrical tuning board 50 is configured to process the attitude data and transmit the image data to the core board 300 of the unmanned aerial vehicle 1000 through the flexible circuit board for processing.
Referring to fig. 9, when the inertia measurement circuit board 14 is connected to the electrical adjustment board 50, the image data acquired by the image sensor 13 may be transmitted to the inertia measurement circuit board 14 through the sensor circuit board 12 and the flexible circuit board 17, and then the inertia measurement circuit board 14 transmits the attitude data and/or the image data to the electrical adjustment board 50 through the signal transmission line or the wireless transmission module, and the electrical adjustment board 50 is configured to process the attitude data and transmit the image data to the core board 300 of the unmanned aerial vehicle 1000 through the flexible circuit board for processing.
Referring to fig. 10, when the sensor circuit board 12 and the inertia measurement circuit board 14 are both connected to the electrical tilt board 50, the image data acquired by the image sensor 13 may be transmitted to the electrical tilt board 50 through a signal transmission line or a wireless transmission module, the attitude data acquired by the inertia measurement unit 15 may be transmitted to the electrical tilt board 50 through a signal transmission line or a wireless transmission module, and the electrical tilt board 50 is configured to process the attitude data and transmit the image data to the core board 300 of the unmanned aerial vehicle 1000 through a flexible circuit board for processing.
Referring to fig. 7, an embodiment of the invention further provides an unmanned aerial vehicle 1000. The drone 1000 comprises a fuselage 200 and the head 100 of any of the embodiments described above. The pan/tilt head 100 is disposed on the body 200.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
The logic and/or steps represented in the flowcharts or otherwise described herein, such as an ordered listing of executable instructions that can be considered to implement logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processing module-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (IPM overcurrent protection circuit) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of embodiments of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc.
Although embodiments of the present invention have been shown and described above, it is understood that the above-described embodiments are exemplary and should not be construed as limiting the embodiments of the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above-described embodiments within the scope of the embodiments of the present invention.
Claims (29)
1. A camera structure, characterized in that the camera structure is formed with a back and a side that are connected, the camera structure comprising:
a sensor circuit board;
an inertial measurement circuit board; and
the inertial measurement unit is arranged on the inertial measurement circuit board and is used for acquiring attitude data of the camera;
one of the sensor circuit board and the inertia measurement circuit board is arranged on the side surface, and the other is arranged on the back surface, wherein the side surface or the back surface on which the inertia measurement circuit board is arranged is relatively fixed with the inertia measurement circuit board.
2. The camera structure according to claim 1, characterized in that the camera structure further comprises:
an image sensor disposed on the sensor circuit board.
3. The camera structure according to claim 1, characterized in that the sensor circuit board and the inertial measurement circuit board are connected by a flexible circuit board and camera internal components; or
The sensor circuit board and the inertia measurement circuit board are connected with each other through a flexible circuit board.
4. The camera structure according to claim 3, characterized in that the sensor circuit board, the inertial measurement circuit board and the flexible circuit board are an integral circuit board structure.
5. The camera structure according to claim 3,
the flexible circuit board is positioned on the back surface; or
The flexible circuit board is positioned on the side face; or
The flexible circuit board is located on the back surface and the side surface.
6. The camera structure according to claim 1, wherein the back surface is a back surface of a lens, and the side surface is perpendicular to the back surface.
7. The camera structure according to claim 1, wherein the inertia measurement circuit board includes a mounting portion and an extension portion, the extension portion being connected to the mounting portion in one direction.
8. The camera structure according to claim 7, further comprising a shock absorbing element located between the extension portion and the side surface when the inertia measurement circuit board is disposed on the side surface; when the inertia measurement circuit board is arranged on the back surface, the shock absorption element is positioned between the extension part and the back surface.
9. The camera structure according to claim 8, wherein when the inertia measurement circuit board is disposed on the side surface, the side surface is formed with a groove corresponding to the extension portion; when the inertia measurement circuit board is arranged on the back surface, a groove corresponding to the extension part is formed on the back surface;
the shock absorption element is filled in the groove.
10. A head, comprising: the camera structure is arranged on the holder body; the camera structure is formed with continuous back and side, the camera structure includes:
a sensor circuit board;
an inertial measurement circuit board; and
the inertial measurement unit is arranged on the inertial measurement circuit board and is used for acquiring attitude data of the camera;
one of the sensor circuit board and the inertia measurement circuit board is arranged on the side surface, and the other is arranged on the back surface, wherein the side surface or the back surface on which the inertia measurement circuit board is arranged is relatively fixed with the inertia measurement circuit board.
11. A head according to claim 10, wherein said camera structure further comprises:
an image sensor disposed on the sensor circuit board.
12. A head according to claim 10, wherein said sensor circuit board and said inertial measurement circuit board are connected by means of a flexible circuit board and camera internal components; or
The sensor circuit board and the inertia measurement circuit board are connected with each other through a flexible circuit board.
13. A head according to claim 12, wherein said sensor circuit board, said inertial measurement circuit board and said flexible circuit board are of a unitary circuit board structure.
14. A head according to claim 12,
the flexible circuit board is positioned on the back surface; or
The flexible circuit board is positioned on the side face; or
The flexible circuit board is located on the back surface and the side surface.
15. A head according to claim 10, wherein said rear face is a rear face of the lens, said lateral faces being perpendicular to said rear face.
16. A head according to claim 10, wherein said inertial measurement circuit board comprises a mounting portion and an extension portion, said extension portion being connected to said mounting portion in one direction.
17. A head according to claim 16, wherein said camera structure further comprises a shock-absorbing element located between said extension and said side when said inertia measurement circuit board is arranged on said side; when the inertia measurement circuit board is arranged on the back surface, the shock absorption element is positioned between the extension part and the back surface.
18. A head according to claim 17, wherein when said inertia measurement circuit board is arranged on said lateral surface, said lateral surface is formed with a groove corresponding to said extension; when the inertia measurement circuit board is arranged on the back surface, a groove corresponding to the extension part is formed on the back surface;
the shock absorption element is filled in the groove.
19. A head according to any one of claims 10 to 18, wherein said head further comprises an electrical switchboard, to which said sensor circuit board and/or said inertial measurement circuit board are connected.
20. An unmanned aerial vehicle is characterized by comprising a machine body and a cloud deck, wherein the cloud deck is arranged on the machine body; the cloud platform includes:
the camera structure is arranged on the holder body; the camera structure is formed with continuous back and side, the camera structure includes:
a sensor circuit board;
an inertial measurement circuit board; and
the inertial measurement unit is arranged on the inertial measurement circuit board and is used for acquiring attitude data of the camera;
one of the sensor circuit board and the inertia measurement circuit board is arranged on the side surface, and the other is arranged on the back surface, wherein the side surface or the back surface on which the inertia measurement circuit board is arranged is relatively fixed with the inertia measurement circuit board.
21. The drone of claim 20, wherein the camera structure further comprises:
an image sensor disposed on the sensor circuit board.
22. The drone of claim 20, wherein the sensor circuit board and the inertial measurement circuit board are connected by a flexible circuit board and camera internal components; or
The sensor circuit board and the inertia measurement circuit board are connected with each other through a flexible circuit board.
23. The drone of claim 22, wherein the sensor circuit board, the inertial measurement circuit board, and the flexible circuit board are a unitary circuit board structure.
24. The drone of claim 22,
the flexible circuit board is positioned on the back surface; or
The flexible circuit board is positioned on the side face; or
The flexible circuit board is located on the back surface and the side surface.
25. The drone of claim 20, wherein the back face is a back face of a lens, the side face being perpendicular to the back face.
26. The drone of claim 20, wherein the inertial measurement circuit board includes a mounting portion and an extension portion, the extension portion connected with the mounting portion in one direction.
27. The drone of claim 26, wherein the camera structure further includes a shock absorbing element located between the extension and the side when the inertial measurement circuit board is disposed on the side; when the inertia measurement circuit board is arranged on the back surface, the shock absorption element is positioned between the extension part and the back surface.
28. The drone of claim 27, wherein when the inertial measurement circuit board is disposed on the side face, the side face is formed with a groove corresponding to the extension; when the inertia measurement circuit board is arranged on the back surface, a groove corresponding to the extension part is formed on the back surface;
the shock absorption element is filled in the groove.
29. An unmanned aerial vehicle according to any one of claims 20 to 28, wherein the pan/tilt head further comprises an electrical switchboard, the sensor circuit board and/or the inertial measurement circuit board being connected to the electrical switchboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110783959.7A CN113507551A (en) | 2018-05-31 | 2018-09-12 | Camera structure, cloud platform and unmanned aerial vehicle |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018208504147 | 2018-05-31 | ||
| CN201820850414.7U CN208297905U (en) | 2018-05-31 | 2018-05-31 | Camera structure, holder and unmanned plane |
| PCT/CN2018/105269 WO2019227768A1 (en) | 2018-05-31 | 2018-09-12 | Camera structure, pan-tilt and unmanned aerial vehicle |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110783959.7A Division CN113507551A (en) | 2018-05-31 | 2018-09-12 | Camera structure, cloud platform and unmanned aerial vehicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110896684A CN110896684A (en) | 2020-03-20 |
| CN110896684B true CN110896684B (en) | 2021-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820850414.7U Expired - Fee Related CN208297905U (en) | 2018-05-31 | 2018-05-31 | Camera structure, holder and unmanned plane |
| CN201880014280.8A Expired - Fee Related CN110896684B (en) | 2018-05-31 | 2018-09-12 | Camera structure, cloud platform and unmanned aerial vehicle |
| CN202110783959.7A Withdrawn CN113507551A (en) | 2018-05-31 | 2018-09-12 | Camera structure, cloud platform and unmanned aerial vehicle |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820850414.7U Expired - Fee Related CN208297905U (en) | 2018-05-31 | 2018-05-31 | Camera structure, holder and unmanned plane |
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| CN202110783959.7A Withdrawn CN113507551A (en) | 2018-05-31 | 2018-09-12 | Camera structure, cloud platform and unmanned aerial vehicle |
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| CN (3) | CN208297905U (en) |
| WO (1) | WO2019227768A1 (en) |
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| WO2022077365A1 (en) * | 2020-10-15 | 2022-04-21 | 深圳市大疆创新科技有限公司 | Stability-augmenting gimbal and movable platform |
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| KR102282458B1 (en) * | 2015-03-23 | 2021-07-27 | 한화테크윈 주식회사 | Method and Device for dewobbling scene |
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- 2018-05-31 CN CN201820850414.7U patent/CN208297905U/en not_active Expired - Fee Related
- 2018-09-12 CN CN201880014280.8A patent/CN110896684B/en not_active Expired - Fee Related
- 2018-09-12 WO PCT/CN2018/105269 patent/WO2019227768A1/en active Application Filing
- 2018-09-12 CN CN202110783959.7A patent/CN113507551A/en not_active Withdrawn
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| CN206181178U (en) * | 2016-08-31 | 2017-05-17 | 深圳零度智能飞行器有限公司 | Camera of taking photo by plane |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110896684A (en) | 2020-03-20 |
| CN208297905U (en) | 2018-12-28 |
| CN113507551A (en) | 2021-10-15 |
| WO2019227768A1 (en) | 2019-12-05 |
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