CN110896082A - 具有新型布局的图像传感器 - Google Patents

具有新型布局的图像传感器 Download PDF

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CN110896082A
CN110896082A CN201910455231.4A CN201910455231A CN110896082A CN 110896082 A CN110896082 A CN 110896082A CN 201910455231 A CN201910455231 A CN 201910455231A CN 110896082 A CN110896082 A CN 110896082A
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image sensor
transistor
pixel
floating diffusion
diffusion point
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徐辰
王欣
莫要武
邵泽旭
石文杰
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SmartSens Technology US Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
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    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/767Horizontal readout lines, multiplexers or registers
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    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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    • H01L27/144Devices controlled by radiation
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    • H01L27/14643Photodiode arrays; MOS imagers
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    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/766Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75Circuitry for providing, modifying or processing image signals from the pixel array

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Abstract

本发明提供一种具有新型布局结构的图像传感器。所述图像传感器包括由多个按行和列设置的像素单元构成的像素阵列,每个所述像素单元包括感光单元,所述感光单元包括光电二极管和传输晶体管;所述传输晶体管沿一倾斜角度设置于所述光电二极管的角部;所述传输晶体管的设置结构形成一开口,浮动扩散点设置于所述开口处;源极跟随晶体管设置于所述像素单元的角部位置,并靠近所述浮动扩散点。所述像素单元还可包括一转换增益控制晶体管,置于所述复位晶体管同一边侧。本发明提出的新型结构布局图像传感器,像素单元的浮动扩散点电容小,像素电路转换增益高,能有效提高图像传感器的性能。

Description

具有新型布局的图像传感器
技术领域
本发明涉及图像传感器技术,尤其涉及一种具有新型设计布局的图像传感器。
背景技术
CMOS图像传感器广泛应用于各领域,例如智能手机,监控设备,无人机,以及人工智能等多种使用环境,且其设计需求日趋小型化。随着技术发展,图像传感器像素单元尺寸的进一步降低,增加像素电路的转换增益及提高图像传感器的灵敏度是其发展及改进提高的方向。
图像传感器的设计上,采用合理的结构布局能有效提高图像传感器的性能。比如,布局设置结构紧凑,像素单元中各器件布置合理,可以增加感光单元的量子效率。通常的图像传感器采用4T结构,一个光电二极管加上一个传输晶体管,一个复位晶体管,一个源极跟随晶体管及一个行选择晶体管的像素电路结构。像素输出通过行选择控制信号通过行选择晶体管输出到相应的列线。申请公开号为CN102184931A,名称为“图像传感器”的专利中公开的图像传感器像素单元的排列方式,在多种排列设置方案中,其复位晶体管和源极跟随晶体管的设置会使得浮动扩散点FD点电容增加,像素电路的灵敏度降低。
本发明基于上述图像传感器像素电路布局结构中存在的问题,提出一种改进像素单元设置结构的新型布局,进一步提高图像传感器性能。
发明内容
本发明提供一种具有新型结构布局的图像传感器,所述图像传感器包括由多个按行和列平铺设置的像素单元构成的像素阵列,其特征在于,每个所述像素单元包括:
感光单元,其包括光电二极管和连接到所述光电二极管的传输晶体管;所述光电二极管沿一方向设置,所述传输晶体管沿一倾斜角度设置于所述光电二极管的角部,所述感光单元的传输晶体管的设置结构形成一开口;
浮动扩散点,连接到所述传输晶体管的输出端,并靠近所述开口;
源极跟随晶体管,所述源极跟随晶体管设置于所述像素单元的角部位置,并靠近所述浮动扩散点设置;所述源极跟随晶体管的栅极边缘,即所述栅极与所述浮动扩散点相对的边缘,与所述浮动扩散点的边缘之间的最近端距离小于0.25微米;优选地,所述距离小于0.15微米;
复位晶体管,所述复位晶体管位于所述像素单元边侧且靠近所述浮动扩散点设置;
可选的,所述像素单元还包括一转换增益控制晶体管,设置于所述像素单元边侧;与所述复位晶体管位于同一侧;
可选的,所述像素单元包括一行选择晶体管,其相邻设置于所述源极跟随晶体管一侧;
可选的,所述传输晶体管以约45度倾斜角度设置于所述光电二极管的角部;
可选的,所述复位晶体管通过掺杂硅连接到所述浮动扩散点;
可选的,所述行选择晶体管通过掺杂硅连接到所述源极跟随晶体管;
可选的,所述图像传感器为FSI(front side illumination,前照式)图像传感器或BSI(back side illumination,背照式)图像传感器。
本发明专利图像传感器的布局设计,像素阵列中平铺设置的每个共享像素单元布局设置紧凑,浮动扩散点设置在感光单元的开口处,源极跟随晶体管设置于所述像素单元的角部位置并靠近所述浮动扩散点设置,则源极跟随晶体管和浮动扩散点距离近,浮动扩散点的电容小,能有效提高像素电路的转换增益。本发明提出的布局设置对光电二极管的入射光遮挡影响小,开口率高,能有效提高像素单元的量子效率。同时,复位晶体管和浮动扩散点之间的连接采用掺杂硅替代金属线连接,能进一步降低对感光单元入射光的影响。
附图说明
图1为本发明提出的图像传感器一实施例的像素电路图;
图2为本发明提出的图像传感器一实施例中一个像素单元的结构布局示意图;
图3为包含图2像素单元的图像传感器的像素阵列结构布局示意图;
图4为本发明提出的图像传感器另一实施例的像素电路图;
图5为本发明提出的图像传感器另一实施例中一个像素单元的结构布局示意图;
图6A和6B为本发明提出的图像传感器第三和第四实施例图像传感器像素电路图;及
图7A和7B为图6A和6B给出的第三和第四实施例中图像传感器像素电路对应的像素单元结构布局示意图;
图8为本包含图图7A给出的结构布局像素单元的像素阵列;及
图9为本发明包含图7B给出的结构布局像素单元的像素阵列。
具体实施方式
以下结合各个附图对本发明专利提出的方案进行详细的说明。本发明的各个附图中的各器件及其标识是为了说明器件设置或布局结构的目的,并非对当前标示的各器件的具体形状,尺寸或具体角度构成限定。在具体电路设计中,可根据具体应用设计为相应的形状。
图1是本发明给出的具有新型结构布局图像传感器一个实施例的像素电路图,如图中所示,为3晶体管图像传感器结构。光电二极管PD与传输晶体管TX构成一感光单元,将光子转换成电子并传输到浮动扩散点FD。复位晶体RST连接到可变电压源Vref及浮动扩散点FD之间;源极跟随晶体管SF的漏极连接到固定电源VDD,将浮动扩散点FD的像素信号放大并输出到列线(Pout)。图1为图像传感器像素电路与通常的4T结构像素电路,为不包含行选择晶体管的电路设计。
图2为本发明给出的实施例一的图像传感器的一个像素单元的布局示意图,结合图1中的像素电路,光电二极管PD按一个方向设置,传输晶体管TX沿着光电二极管PD倾斜一定的角度设置,通常情况下以45度倾斜角度设置在光电二极管PD的角部。图2中传输晶体管TX的形状仅为示意性说明,在具体的电路布局中,传输晶体管TX的形状可根据设计为不同形状。传输晶体管TX的设置位置及结构使得像素单元形成一开口,浮动扩散点FD连接传输晶体管TX的输出端,并靠近该开口设置。源极跟随晶体管SF设置于像素单元的角部,并靠近浮动扩散点FD。在一应用例中,源极跟随晶体管SF的栅极与浮动扩散点对应的边缘,与浮动扩散点距离最近的边缘之间的间距不大于0.25微米。作为一优选的应用实施例,这个间距不大于0.15微米。这些应用实施例中针对不同的工艺技术平台,如0.13μm工艺技术,上述间距可设置在0.08~0.15微米范围,优选地,设置为0.12微米。对于0.11μm工艺技术平台,上述间距可设置在0.05~0.12微米范围,优选地,设置为0.10微米。根据不同的先进工艺技术平台,上述间距可以根据具体应用设计为0.08微米。这种设置方式浮动扩散点的电容小,像素电路中转换增益高。浮动扩散点电容大会影响图像传感器像素电路的灵敏度。复位晶体管RST设置在像素单元的边侧,即图像传感器像素阵列中两个像素单元之间。并且,复位晶体管RST设置在靠近浮动扩散点FD及源极跟随晶体管SF的一侧。图2中给出的各器件布局结构,同时可降低对光电二极管入射光的遮挡所带来的影响,提高像素单元的量子效率。
图2中给出的结构布局,复位晶体管RST和浮动扩散点FD的连接采用掺杂硅替代金属连线连接方式(图2中未示出各连接点及连接线),提高所述开口的开口率,降低对光电二极管PD的入射光的影响。
图3为本发明提出的图像传感器像素阵列结构布局示意图,该像素阵列包括多个平铺设置的图2中所示布局结构的像素单元。所述像素阵列输出的像素信号经控制电路进行读取控制及处理并输出。
图4为本发明给出另一实施例的图像传感器像素电路图。如图4中所示,像素电路中包括一增益控制单元,该增益控制单元包括转换增益控制晶体管DCG及电容C。电容C可以是复位晶体管RST和转换增益控制晶体管DCG连接点的寄生电容,或是采用器件电容连接至像素电路。像素电路设置增益控制单元可以在高、低增益模式之间转换以提升像素电路的动态范围。图5为图4所示像素电路相应的布局结构示意图,如图5中所示,转换增益控制晶体管DCG设置于所述像素单元的边侧,与复位晶体管RST位于同一侧设置。这种设置对感光单元的影响小,有利于提高图像传感器性能。
图6A和6B是本发明给出的第三和第四实施例的图像传感器基本像素电路图,图7A和7B分别为图6A和6B对应的像素电路的布局设置结构示意图。与之前的多个实施例中不同的是,图6A和6B及图7A和7B的像素单元中还包括一个行选择晶体管RS,相邻设置于源极跟随晶体管SF的同一侧位置,行选择晶体管RS连接到源极跟随晶体管SF的源极输出端。作为一种实施方案,行选择晶体管RS可通过掺杂硅连接到源极跟随晶体管SF,以降低对光电二极管PD的入射光的影响,提升像素电路中感光单元的量子效率。图6A给出的第三实施例为不包含转换增益控制晶体管DCG的情形,图6B给出的第四实施例为包含转换增益控制晶体管DCG的情形。设置包含行选择晶体管RS的像素单元,其布局设计结构中复位晶体管RST和源极跟随晶体管的漏极设置连接到同一固定电源。在包含图第三实施例或第四实施例中的像素单元的图像传感器,其包含按行和列排列的如图7A和7B中所示布局结构的像素单元构成的像素阵列如图8和图9中所示,在上述各像素阵列结构中仅示出各相关器件的布局及位置设置关系,包含各器件的连接点及连接线未示出,但不影响本发明给出的像素单元中各器件的布局设置结构。
本发明上述各实施例给出的具有新型布局的图像传感器可以设计为FSI图像传感器或者BSI图像传感器,两种形式的图像传感器均可以采用本所提供的像素单元布局结构,两种图像传感器形式均在本发明方案可实施保护的范围内。
本发明给出的各实施例及附图,是为了说明的目的,在不背离本发明更广泛的主旨和范围下,不同形式的等效修改是可行的。根据上述详细的说明可对本发明实施例进行修改。用于权利要求中的术语不应解释为限定于本发明具体实施内容和权利要求部分中所揭露的具体实施例。相反地,权利要求中完整确定的范围应解释为根据权利要求解释确立的声明。本发明的说明书和各附图应被看作是解释性的,而不是约束性的。

Claims (7)

1.一种具有新型布局的图像传感器,所述图像传感器包括由多个按行和列平铺设置的像素单元构成的像素阵列,其特征在于,每个所述像素单元包括:
感光单元,其包括光电二极管和连接到所述光电二极管的传输晶体管;所述光电二极管沿一方向设置,所述传输晶体管沿一倾斜角度设置于所述光电二极管的角部,所述感光单元的传输晶体管的设置结构形成一开口;
浮动扩散点,靠近所述开口设置;
源极跟随晶体管,所述源极跟随晶体管设置于所述像素单元的角部位置并靠近所述浮动扩散点设置;
所述源极跟随晶体管的栅极边缘与所述浮动扩散点的边缘之间的近端距离小于0.25微米。
2.根据权利要求1所述的具有新型布局的图像传感器,其特征在于,所述像素单元还包括一转换增益控制晶体管,相邻设置于所述复位晶体管同一边侧。
3.根据权利要求1或2所述的具有新型布局的图像传感器,其特征在于,所述像素单元还包括一行选择晶体管,相邻设置于所述源极跟随晶体管一侧。
4.根据权利要求1所述的具有新型布局的图像传感器,其特征在于,所述传输晶体管以45度倾斜角度设置于所述光电二极管的角部。
5.根据权利要求1所述的具有新型布局的图像传感器,其特征在于,所述图像传感器包括一复位晶体管,所述复位晶体管通过掺杂硅连接到所述浮动扩散点。
6.根据权利要求1或2所述的具有新型布局的图像传感器,其特征在于,所述复位晶体管连接到可变电压。
7.根据权利要求1所述的具有新型布局的图像传感器,其特征在于,所述图像传感器为FSI图像传感器或BSI图像传感器。
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