CN110892296B - Composition for forming infrared-transmitting film, method for forming infrared-transmitting film, protective plate for display device, and display device - Google Patents

Abstract

The invention aims to provide a composition for forming an infrared-transmitting film, a method for forming the infrared-transmitting film by using the composition, a protective plate for a display device and a display device, wherein the composition can form the infrared-transmitting film which can be synchronous with the color tone of a peripheral frame edge part while maintaining the infrared-transmitting property. The present invention is an infrared-ray-transmitting film-forming composition for forming an infrared-ray-transmitting film, which is provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device, and which contains: a dye A having a maximum absorption in a wavelength range of 400nm to 580 nm; dye B having maximum absorption in a wavelength range of 581nm to 700 nm; and a dye C having a maximum absorption in a wavelength region of 701nm to 800 nm.

Description

Composition for forming infrared-transmitting film, method for forming infrared-transmitting film, protective plate for display device, and display device

Technical Field

The present invention relates to a composition for forming an infrared-transmitting film, a method for forming an infrared-transmitting film, a protective plate for a display device, and a display device.

Background

In recent years, photoelectric conversion elements have been developed as optical sensors for various applications, and in particular, use of the photoelectric conversion elements in optical sensors using infrared rays has been studied. Since infrared light has a longer wavelength than visible light and is less likely to scatter, it is suitable for use in distance measurement, three-dimensional measurement, face authentication, and the like. In an optical sensor using near infrared rays, an infrared ray transmission filter that transmits infrared light while shielding visible light is applied in order to further improve the sensitivity of near infrared rays (see, for example, patent documents 1to 3). The infrared transmission filter is produced by, for example, applying a resin composition containing carbon black or the like which blocks visible light onto a glass substrate or the like to form a visible light blocking layer.

On the other hand, a display device such as a mobile phone is generally configured to have a front panel (cover glass) as a screen protection plate provided on the outermost surface (see, for example, patent document 4). The front panel is provided with a frame portion (frame) made of a material having high light-shielding properties for concealing peripheral wiring and the like. In addition, in mobile phones and the like, phones having an infrared communication unit for performing communication with another mobile phone, face authentication, and the like have been widely used, and in such a case, an opening for performing infrared communication is formed in a part of a frame portion.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2015-68945

Patent document 2: korean laid-open patent No. 2014-0147531

Patent document 3: japanese patent laid-open No. 2012-103340

Patent document 4: japanese patent laid-open No. 2009-69321

Disclosure of Invention

Problems to be solved by the invention

In general, a front panel of a mobile phone or the like has a black frame edge portion, and if an opening provided in the frame edge portion is conspicuous, it may be inferior in terms of design. Therefore, it is considered to form an infrared ray transmitting film having the same color tone as that of the frame portion in the opening portion for infrared ray communication. This makes it possible to synchronize the color tone of the peripheral frame portion with the infrared transmittance of the opening portion. On the other hand, in the conventional infrared ray transmitting film (infrared ray transmitting filter), there is a problem that the transmittance in the infrared region is also lowered due to the presence of an added absorbent or the like.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a composition for forming an infrared-transmitting film, which is provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device, and which can form an infrared-transmitting film that maintains infrared-transmitting properties and can synchronize with the color tone of the rim portion in the periphery, a method for forming an infrared-transmitting film using the same, a protective plate for a display device, and a display device.

Means for solving the problems

An invention made to solve the above problems is an infrared-ray-transmitting film-forming composition for forming an infrared-ray-transmitting film, the infrared-ray-transmitting film being provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device, the composition comprising: a dye A having a maximum absorption in a wavelength range of 400nm to 580 nm; dye B having maximum absorption in a wavelength range of 581nm to 700 nm; and a dye C having a maximum absorption in a wavelength region of 701nm to 800 nm.

Another invention to solve the above problem is a method for forming an infrared-transmitting film, including the following steps (1) and (2).

(1) A step (2) of forming a coating film in an opening for infrared communication formed in a frame portion of a protective plate for a display device using the composition for forming an infrared-transmitting film, wherein the coating film is heated or exposed

In order to solve the above-mentioned problems, a further aspect of the present invention is a protective plate for a display device, comprising a transparent substrate and a frame portion provided on one surface side of the transparent substrate, wherein an opening portion for infrared communication is formed in the frame portion, and the protective plate for a display device has an infrared-transmitting film provided in the opening portion, the infrared-transmitting film being formed from the composition for forming an infrared-transmitting film.

In order to solve the above problem, a further aspect of the present invention is a display device including the protective plate for a display device.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, there can be provided a composition for forming an infrared-transmitting film, which is provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device and which can form an infrared-transmitting film that maintains infrared transmittance and is capable of synchronizing with the color tone of the rim portion in the periphery, a method for forming an infrared-transmitting film using the same, a protective plate for a display device, and a display device.

Drawings

Fig. 1 is a plan view showing a protective plate for a display device according to an embodiment of the present invention.

Fig. 2 is a sectional view a-a' of the protective plate for the display device of fig. 1.

FIG. 3 is a graph showing the transmittance of the infrared-transmitting film obtained in example 1.

[ description of symbols ]

100: transparent substrate

110: rim part (rims)

120: infrared ray transmitting film

130: an opening portion.

Detailed Description

An embodiment of the present invention will be described in detail below.

< composition for Forming Infrared-ray-transmittable film >

An infrared-ray-transmitting film-forming composition (hereinafter, also simply referred to as "composition") according to an embodiment of the present invention is a composition for forming an infrared-ray-transmitting film provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device. The composition comprises: a dye A having a maximum absorption in a wavelength range of 400nm to 580 nm; dye B having maximum absorption in a wavelength range of 581nm to 700 nm; and a dye C having a maximum absorption in a wavelength region of 701nm to 800 nm. The composition preferably further comprises a binder component. In addition, the composition preferably further contains a polymerization initiator. Hereinafter, each component of the composition will be described in detail.

< adhesive component >

The binder component serves as a matrix of the infrared-transmitting film in the infrared-transmitting film, and is a component that holds each of the dyes and the like. The adhesive component comprises a transparent resin, a crosslinkable monomer, or a combination thereof. The binder component may be used alone or in combination of two or more.

(transparent resin)

The transparent resin is not particularly limited as long as the effect of the obtained infrared-transmitting film is not impaired. The transparent resin is preferably a resin having a glass transition temperature (Tg) of 110 to 380 ℃, more preferably 110 to 370 ℃, and even more preferably 120to 360 ℃, for example, in order to ensure thermal stability and solvent stability and to exhibit resistance to a heating production step of 100 ℃ or higher when applied to a display device.

Further, the glass transition temperature (Tg) can be set to a value obtained by using, for example, a differential scanning calorimeter (DSC6200) manufactured by seiko electronics Nanotechnologies (SII Nanotechnologies) ltd, in which the temperature rise rate: the values obtained were measured at 20 ℃ per minute under a nitrogen stream.

The transparent resin may have a total light transmittance (Japanese Industrial Standards (JIS) K7105) of preferably 75% to 95%, more preferably 78% to 95%, and even more preferably 80% to 95% at a thickness of 0.1 mm. When the total light transmittance is within the above range, the obtained infrared ray-transmitting film also exhibits good transparency in the near infrared ray region.

Examples of the transparent resin include: cyclic olefin-based resins, aromatic polyether-based resins, polyimide-based resins, fluorene polycarbonate-based resins, fluorene polyester-based resins, polycarbonate-based resins, polyamide (aramid) -based resins, polyarylate-based resins, polysulfone-based resins, polyethersulfone-based resins, polyparaphenylene-based resins, polyamideimide-based resins, polyethylene naphthalate-based resins, fluorinated aromatic polymer-based resins, (modified) acrylic resins, epoxy-based resins, allyl curing resins, polyester polyol-based resins, polyether-based resins, polyisocyanate-based resins, polyamine-based resins, urethane-based resins, silsesquioxane-based ultraviolet curing resins, and the like. These transparent resins may be used singly or in combination of two or more.

Hereinafter, a particularly preferable transparent resin will be described in more detail with respect to the transparent resin.

(1) Cycloolefin resin

The cycloolefin resin is a polymer containing a cycloolefin as a monomer. The cycloolefin resin is preferably a compound selected from the group consisting of the compounds represented by the following formula (X)₀) A monomer represented by the formula (Y)₀) A resin obtained from at least one monomer of the group consisting of the monomers shown, or by passing through the resin as necessaryA resin obtained by hydrogenating the resin in one step.

[ solution 1]

The formula (X)₀) In, R^x1～R^x4Each independently represents an atom or a group selected from the following (i) to (viii). k is a radical of^x、m^xAnd p^xEach independently represents 0 or a positive integer. k is a radical of^x、m^xAnd p^xThe upper limit of (b) may be, for example, 5, or 2 or 1, respectively.

(i) Hydrogen atom

(ii) Halogen atom

(iii) Trialkylsilyl group

(iv) A substituted or unsubstituted hydrocarbon group having 1to 30 carbon atoms and having a linking group containing an oxygen atom, a sulfur atom, a nitrogen atom or a silicon atom

(v) Substituted or unsubstituted hydrocarbon group having 1to 30 carbon atoms

(vi) Polar group (wherein, (iv) is excluded)

(vii) Represents R^x1And R^x2Or R^x3And R^x4Alkylene groups formed by bonding to each other, R not participating in said bonding^x1～R^x4Each independently represents an atom or a group selected from the above (i) to (vi).

(viii) Represents R^x1And R^x2Or R^x3And R^x4Monocyclic or polycyclic hydrocarbon rings or heterocycles formed by mutual bonding, R not participating in said bonding^x1～R^x4Each independently represents an atom or a group selected from the above (i) to (vi). Or represents R^x2And R^x3Monocyclic hydrocarbon or heterocyclic ring formed by bonding to each other, R not participating in said bonding^x1～R^x4Each independently represents an atom or a group selected from the above (i) to (vi).

[ solution 2]

Said formula (Y)₀) In, R^y1And R^y2Each independently represents an atom or a group selected from the above (i) to (vi), or (ix) below. k is a radical of^yAnd p^yEach independently represents 0 or a positive integer. k is a radical of^yAnd p^yThe upper limit of (b) may be, for example, 5, or 2 or 1, respectively.

(ix) Represents R^y1And R^y2A monocyclic or polycyclic alicyclic hydrocarbon, aromatic hydrocarbon or heterocyclic ring bonded to each other.

(2) Aromatic polyether resin

The aromatic polyether resin preferably has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2).

[ solution 3]

In the formula (1), R¹～R⁴Each independently represents a monovalent organic group having 1to 12 carbon atoms. a to d each independently represent an integer of 0to 4. In the present specification, the organic group means a group containing a carbon atom, and examples thereof include a hydrocarbon group, a halogenated hydrocarbon group, a carboxyl group, and a cyano group.

[ solution 4]

In the formula (2), R¹～R⁴And a to d are each independently of R in the formula (1)¹～R⁴And a to d are the same. Y represents a single bond, -SO₂-or > C ═ O. R⁷And R⁸Each independently represents a halogen atom, a monovalent organic group having 1to 12 carbon atoms, or a nitro group. g and h independently represent an integer of 0to 4. m represents 0 or 1. Wherein, when m is 0, R⁷Is not cyano.

The aromatic polyether resin preferably further has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (3) and a structural unit represented by the following formula (4).

[ solution 5]

In the formula (3), R⁵And R⁶Each independently represents a monovalent organic group having 1to 12 carbon atoms. Z represents a single bond, -O-, -S-, -SO₂-, > C ═ O, -CONH-, -COO-, or a divalent organic group having 1to 12 carbon atoms (except for C ═ O, -CONH-, and-COO-). e and f each independently represent an integer of 0to 4. n represents 0 or 1.

[ solution 6]

In the formula (4), R⁷、R⁸Y, m, g and h are each independently of R in the formula (2)⁷、R⁸Y, m, g and h are the same. R⁵、R⁶Z, n, e and f are each independently R in the formula (3)⁵、R⁶Z, n, e and f are the same.

(3) Polyimide resin

The polyimide-based resin is not particularly limited as long as it is a polymer compound having an imide bond in a repeating unit. The polyimide-based resin can be synthesized, for example, by the method described in Japanese patent laid-open Nos. 2006-199945 and 2008-163107.

(4) Fluorene polycarbonate-based resin

The fluorene polycarbonate-based resin is not particularly limited as long as it is a polycarbonate resin containing fluorene moieties. The fluorene polycarbonate-based resin can be synthesized, for example, by the method described in Japanese patent application laid-open No. 2008-163194.

(5) Fluorene polyester resin

The fluorene polyester resin is not particularly limited as long as it is a polyester resin containing fluorene moieties. The fluorene polyester resin can be synthesized, for example, by the method described in japanese patent application laid-open No. 2010-285505 or japanese patent laid-open No. 2011-197450.

(6) Fluorinated aromatic polymer-based resin

The fluorinated aromatic polymer-based resin is not particularly limited, and examples thereof include polymers containing: an aromatic ring having at least one fluorine, and a repeating unit comprising at least one bond selected from the group consisting of an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond, and an ester bond. The fluorinated aromatic polymer resin can be synthesized, for example, by the method described in Japanese patent laid-open No. 2008-181121.

(7) Commercially available product

The transparent resin may also be obtained by purchase. As a commercially available product of the transparent resin preferable for the constitution of the composition, the following commercially available products and the like can be mentioned. Examples of commercially available products of the cycloolefin-based resin include: "Arton (Arton)" manufactured by JSR corporation, "Zeonar (ZEONOR)" manufactured by Nippon Rukuwa (ZEON) corporation, "Apel (APEL)" manufactured by Mitsui chemical corporation, and "Topas (TOPAS)" manufactured by Polyplastics corporation, and the like. Examples of commercially available products of the polyethersulfone resin include "Sumikaexcel" PES manufactured by Sumitomo chemical Co., Ltd. Examples of commercially available products of polyimide-based resins include "Neopulim (Neopulim) L" manufactured by Mitsubishi Gas Chemical, Inc. Examples of commercially available products of the polycarbonate-based resin include "Pure-Ace" manufactured by imperial corporation. Examples of commercially available fluorene polycarbonate-based resins include "Lupizeta (Lupizeta) EP-5000" manufactured by Mitsubishi Gas Chemical Co., Ltd. Examples of commercially available fluorene polyester resins include "OKP 4 HT" manufactured by Osaka Gas chemical (Osaka Gas Chemicals) corporation. Examples of commercially available acrylic resins include AcryviewｃA (AcryviewｃA) manufactured by Nippon catalyst Co., Ltd, "Matrofu (MARPROOF) G-0105 SA" manufactured by Nippon oil Co., Ltd, "Light Acrylate (DCP-A) manufactured by Kyoto chemical Co., Ltd. Examples of commercially available polyester polyol resins include "Polylite OD-X-2585" manufactured by DIC GmbH. Examples of commercially available products of polyether resins include "T5650J" manufactured by Asahi Kasei corporation. Examples of commercially available products of the polyisocyanate-based resin include "Panoks (Bumock) D-750" manufactured by DIC corporation. Examples of commercially available epoxy resins include "JER-828" manufactured by Mitsubishi chemical corporation. Examples of commercially available products of the urethane resin include "UA-306H" manufactured by Kyork chemical Co., Ltd, "Baroke (Bumock) DF-407" manufactured by DIC Co., Ltd. Examples of commercially available silsesquioxane-based UV curable resins include "siplus" manufactured by nippon iron chemicals, inc.

The molecular weight of the transparent resin is not particularly limited, but the weight average molecular weight is, for example, 1,000 or more and 1,000,000 or less, and preferably 2,000 or more and 200,000 or less. The number average molecular weight is, for example, 1,000 or more and 1,000,000 or less, preferably 10,000 or more and 300,000 or less.

The molecular weight of the transparent resin can be measured by the following method (a) or (b) in consideration of the solubility of each resin in a solvent, and the like.

(a) The weight average molecular weight (Mw) and the number average molecular weight (Mn) in terms of standard polystyrene were measured using a Gel Permeation Chromatography (GPC) apparatus (150C type, column: H type column manufactured by Tosoh corporation, column: o-dichlorobenzene as a developing solvent) manufactured by Waters corporation.

(b) The weight average molecular weight (Mw) and the number average molecular weight (Mn) in terms of standard polystyrene were measured using a GPC apparatus (HLC-8220 type, column: TSKgel. alpha. -M, developing solvent: Tetrahydrofuran (THF)) manufactured by Tosoh corporation.

When the transparent resin is polyimide, the logarithmic viscosity is, for example, 0.5 or more and 2 or less. In the case of polyimide, the logarithmic viscosity is a measured value obtained by the following method (c).

(c) A part of the polyimide resin solution was put into anhydrous methanol to precipitate the polyimide resin, and the polyimide resin was separated from the unreacted monomer after filtration. 0.1g of polyimide obtained by vacuum drying at 80 ℃ for 12 hours was dissolved in 20mL of N-methyl-2-pyrrolidone, and the logarithmic viscosity (. mu.) at 30 ℃ was determined by the following formula using Kannon-Fenske viscometer.

μ＝{In(t_s/t₀)}/C

t₀: flow-down time of solvent

t_s: flow down time of thin polymer solution

C：0.5g/dL

(Compound having two or more polymerizable groups in one molecule)

The binder component is preferably a compound containing two or more polymerizable groups in one molecule. By using the compound, the heat resistance, light resistance, and the like of the obtained infrared transmitting film can be improved.

The binder component may be a mixture of a compound having two or more polymerizable groups in one molecule and a compound having no polymerizable group. The compound having two or more polymerizable groups in one molecule may be either one of the transparent resin and the crosslinkable monomer. That is, as the transparent resin, a transparent resin having two or more polymerizable groups in one molecule can be used. The crosslinkable monomer corresponds to a compound having two or more polymerizable groups in one molecule. In the following specific examples of the compound, a compound having two or more polymerizable groups per molecule other than the transparent resin having two or more polymerizable groups per molecule may be used as the crosslinkable monomer. The crosslinkable monomer may be, for example, a compound having a molecular weight of less than 1,000.

Examples of the polymerizable group include: epoxy groups, alicyclic epoxy groups, (meth) acryloyl groups, vinyl groups, hydroxyl groups, thiol groups, amino groups, carboxyl groups, acid anhydride groups, isocyanate groups, or combinations thereof.

Examples of the compound having two or more polymerizable groups in one molecule include: a compound having a radical polymerizable group as a polymerizable group (radical polymerizable compound), a compound having a cation polymerizable group (cation polymerizable compound), and a compound having a nucleophilic addition reactive group (nucleophilic addition reactive compound). Examples of the radical polymerizable group include a (meth) acryloyl group and a vinyl group, examples of the cationic polymerizable group include an epoxy group and an alicyclic epoxy group, and examples of the nucleophilic addition reactive group include: hydroxyl group, thiol group, carboxyl group, acid anhydride group (carboxylic acid anhydride group, etc.), epoxy group, isocyanate group, and the like. The epoxy group represents a cyclic ether group having 2 or more carbon atoms and includes an oxetanyl group and an oxetanyl group.

(radical polymerizable Compound)

The radical polymerizable compound is, for example, a compound that is crosslinked by a polymerization reaction of radicals generated by irradiation with ultraviolet rays in the presence of a photoradical generator.

Since the radical polymerizable compound has good polymerizability, the crosslinking density of the obtained infrared ray transmitting film can be increased. Therefore, an infrared ray transmitting film having excellent strength can be formed. One kind of the radical polymerizable compound may be used alone, or two or more kinds may be used.

Examples of the radical polymerizable compound include a polyfunctional (meth) acrylate obtained by reacting an aliphatic polyhydroxy compound with (meth) acrylic acid, a caprolactone-modified polyfunctional (meth) acrylate, an alkylene oxide-modified polyfunctional (meth) acrylate, a polyfunctional (meth) acrylate urethane obtained by reacting a hydroxyl group-containing (meth) acrylate with a polyfunctional isocyanate, and a polyfunctional (meth) acrylate having a carboxyl group obtained by reacting a hydroxyl group-containing polyfunctional (meth) acrylate with an acid anhydride.

In the present specification, the term "(meth) acrylic group" refers to an acrylic group and/or a methacrylic group.

Specific examples of the radical polymerizable compound include: 1, 3-butanediol di (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, butanediol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, bisphenol A bis (acryloyloxyethyl) ether, bisphenol A bis (meth) acryloyloxymethyl ethyl ether, bisphenol A bis (meth) acryloyloxyethyl ether, ethoxylated bisphenol A di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, propoxylated bisphenol A di (meth) acrylate, propylene glycol di (meth) acrylate, and propylene glycol di (meth) acrylate, Difunctional acrylates such as ethoxy-propoxy modified bisphenol a di (meth) acrylate, propoxy modified bisphenol F di (meth) acrylate, ethoxylated neopentyl glycol di (meth) acrylate, 3-methylpentanediol di (meth) acrylate, trimethylolpropane di (meth) acrylate, tris (2-hydroxyethyl) isocyanurate di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, and epoxy (meth) acrylate in which (meth) acrylic acid is added to diglycidyl ether of bisphenol a;

trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetramethylolpropane tetra (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol hepta (meth) acrylate, tripentaerythritol octa (meth) acrylate, a reaction product of pentaerythritol tri (meth) acrylate and an acid anhydride, a reaction product of pentaerythritol tri (meth) acrylate and an acid anhydride, a reaction product of pentaerythritol tri (meth) acrylate, a reaction product of pentaerythritol hexa (2-hydroxyethyl) isocyanurate and a reaction product of a pentaerythritol hexa (pentaerythritol tetra (meth) acrylate, a reaction product of pentaerythritol tetra (meth) and a reaction product of a pentaerythritol tetra (meth) acrylate, a pentaerythritol penta (meth) acrylate, a compound, a pentaerythritol hexa (meth) acrylate, a pentaerythritol penta (meth) acrylate, a pentaerythritol hexa (meth) acrylate, and a pentaerythritol hexa (meth) acrylate, a reactant of dipentaerythritol penta (meth) acrylate and an acid anhydride, a reactant of tripentaerythritol hepta (meth) acrylate and an acid anhydride, propoxy-modified pentaerythritol tetra (meth) acrylate, propoxy-modified dipentaerythritol poly (meth) acrylate, butoxy-modified pentaerythritol tetra (meth) acrylate, butoxy-modified dipentaerythritol poly (meth) acrylate, caprolactone-modified trimethylolpropane tri (meth) acrylate, caprolactone-modified pentaerythritol tri (meth) acrylate, caprolactone-modified tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, caprolactone-modified pentaerythritol tetra (meth) acrylate, caprolactone-modified dipentaerythritol penta (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, caprolactone-modified tripentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, and mixtures thereof, Caprolactone-modified tripentaerythritol penta (meth) acrylate, caprolactone-modified tripentaerythritol hexa (meth) acrylate, caprolactone-modified tripentaerythritol hepta (meth) acrylate, caprolactone-modified tripentaerythritol octa (meth) acrylate, a reactant of caprolactone-modified pentaerythritol tri (meth) acrylate and acid anhydride, a reactant of caprolactone-modified dipentaerythritol penta (meth) acrylate and acid anhydride, a reactant of caprolactone-modified tripentaerythritol hepta (meth) acrylate and acid anhydride, and the like, a compound obtained by reacting an epoxy (meth) acrylate with a carboxylic acid such as oxalic acid, malonic acid, succinic acid, or hydrogenated phthalic acid, an alcoholic compound, a phenolic compound, or the like, or a reactant of an alkylene glycol diglycidyl ether or polyalkylene glycol diglycidyl ether with (meth) acrylic acid.

Among these compounds, in terms of the strength of the infrared ray transmitting film, trifunctional or higher acrylate esters such as dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxy-modified dipentaerythritol poly (meth) acrylate, butoxy-modified pentaerythritol tetra (meth) acrylate, butoxy-modified dipentaerythritol poly (meth) acrylate, and caprolactone-modified tripentaerythritol hexa (meth) acrylate are preferable.

The content ratio of the radical polymerizable compound in the binder component contained in the composition is preferably 1to 60% by mass, more preferably 5 to 40% by mass, and still more preferably 10 to 25% by mass.

(cationic polymerizable Compound)

The cationically polymerizable compound is preferably a compound that is crosslinked by a reaction of cations generated by irradiation with ultraviolet rays in the presence of a photo cation generator, for example. The cationic polymerizable compound may be used alone or in combination of two or more.

Examples of the cationically polymerizable compound include: compounds having an active methylene group such as compounds having a hydroxymethylated amino group, compounds having an alkyletherated amino group, aromatic compounds containing a hydroxymethyl group, and alkyletherated aromatic compounds; an oxazoline compound; cyclic ether compounds such as oxirane ring-containing compounds (epoxy compounds), oxetane ring-containing compounds, and cyclic thioether compounds; an isocyanate group-containing compound (including a blocked compound); a phenol compound containing an aldehyde group; a vinyl ether compound; a dipropenyl ether compound. Among these compounds, a cyclic ether compound (compound having an epoxy group) is preferable, and a compound having an oxirane ring and a compound having an oxetane ring are more preferable, in terms of forming an infrared-transmitting film excellent in strength, adhesiveness, and the like.

The oxirane ring-containing compound may contain an oxirane ring (also referred to as an oxetanyl group) in a molecule, and examples thereof include: phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol type epoxy resins, triphenol type epoxy resins, tetraphenol type epoxy resins, phenol-xylylene type epoxy resins, naphthol-xylylene type epoxy resins, phenol-naphthol type epoxy resins, phenol-dicyclopentadiene type epoxy resins, alicyclic epoxy resins, aliphatic epoxy resins, and the like.

Specific examples of the oxirane ring-containing compound include: resorcinol diglycidyl ether, trimethylolpropane polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, ethylene/polyethylene glycol diglycidyl ether, propylene/polypropylene glycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, sorbitol polyglycidyl ether, propylene glycol diglycidyl ether, (3',4' -epoxycyclohexane) methyl-3, 4-epoxycyclohexyl carboxylate (trade name "Celloxide) 2021P", manufactured by cellosolve).

The oxetane ring-containing compound may be any compound as long as it contains an oxetane ring (also referred to as an oxetanyl group) in the molecule, and specific examples thereof include: 1, 4-bis { [ (3-ethyloxetan-3-yl) methoxy ] methyl } benzene (trade name "OXT-121", manufactured by Toyo Synthesis (Ltd.)), 3-ethyl-3- { [ (3-ethyloxetan-3-yl) methoxy ] methyl } oxetane (trade name "OXT-221", manufactured by Toyo Synthesis (Ltd.)), 4' -bis [ (3-ethyl-3-oxetanyl) methoxymethyl ] biphenyl (manufactured by Yukoxing, trade name "ETERNACOLL (ETERNACOLL) OXBP"), bis [ (3-ethyl-3-oxetanylmethoxy) methyl-phenyl ] ether, bis [ (3-ethyl-3-oxetanylmethoxy) methyl-phenyl ] propane, Bis [ (3-ethyl-3-oxetanylmethoxy) methyl-phenyl ] sulfone, bis [ (3-ethyl-3-oxetanylmethoxy) methyl-phenyl ] ketone, bis [ (3-ethyl-3-oxetanylmethoxy) methyl-phenyl ] hexafluoropropane, tris [ (3-ethyl-3-oxetanylmethoxy) methyl ] benzene, tetrakis [ (3-ethyl-3-oxetanylmethoxy) methyl ] benzene, and oxetane oligomer (trade name "Oligopo) -OXT", manufactured by Tokya synthesis (Kogyo), and the like.

As the compound having two or more epoxy groups, a polymer obtained by polymerizing a monomer having an epoxy group such as glycidyl (meth) acrylate or vinyl glycidyl ether, a copolymer of a monomer having an epoxy group and another monomer, or the like can be used.

The content of the cationically polymerizable compound in the binder component contained in the composition is usually 10 to 80% by mass, preferably 20to 60% by mass, and more preferably 30 to 50% by mass.

(nucleophilic addition reactive Compound)

The nucleophilic addition reactive compound is generally a compound that undergoes a nucleophilic addition reaction with heating, light irradiation, or the like. The nucleophilic addition reactive compound may be used alone or in combination of two or more.

As the nucleophilic addition reactive compound, there may be mentioned: a polyol having a plurality of hydroxyl groups, a polyol having a plurality of thiol groups (-SH), a polyamino resin having a plurality of amino groups, a polycarboxylic acid having a plurality of carboxyl groups, a compound having one or more acid anhydride groups (such as a carboxylic anhydride group), an epoxy resin having a plurality of epoxy groups, a polyisocyanate having a plurality of isocyanate groups, and the like. Further, for example, a resin having a plurality of epoxy groups is a nucleophilic addition reactive compound and a cationic polymerizable compound. In this manner, there are also compounds classified into two or more of radical polymerizable compounds, cationic polymerizable compounds and addition reactive compounds.

Specific examples of the nucleophilic addition reactive compound include polyols having a plurality of hydroxyl groups, such as polyether polyols, polyester polyols, acrylic polyols, polycarbonate polyols, and other polyols. These polyols may be used alone or in combination of two or more. Specific examples of the polyol compound include: polypropylene ether glycols, polyethylene ether glycols, polytetramethylene glycols, polyethylene glycols, polypropylene glycols, polyoxyethylene glycols, polyoxypropylene triols, polyoxybutylene glycols, polytetramethylene ether glycols, polymeric polyols, poly (ethylene adipate), poly (diethylene adipate), poly (propylene adipate), poly (tetramethylene adipate), poly (hexamethylene adipate), poly (neopentyl adipate), poly-epsilon-caprolactone, poly (hexamethylene carbonate), silicone polyols, and the like. Further, a natural polyol compound such as castor oil can be used. These polyol compounds may be used singly or in combination of two or more.

Examples of the polyol having a plurality of thiol groups include: aliphatic thiols such as hexane-1, 6-dithiol, decane-1, 10-dithiol, dimercaptodiethyl ether and dimercaptodiethyl sulfide, and aromatic thiols such as xylylene dithiol, 4' -dimercaptodiphenyl sulfide and 1, 4-benzenedithiol; poly (thioglycolates) of polyhydric alcohols such as ethylene glycol bis (thioglycolate), polyethylene glycol bis (thioglycolate), propylene glycol bis (thioglycolate), glycerol tris (thioglycolate), trimethylolethane tris (thioglycolate), trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), and dipentaerythritol hexa (thioglycolate); poly (3-mercaptopropionates) of polyhydric alcohols such as ethylene glycol bis (3-mercaptopropionate), polyethylene glycol bis (3-mercaptopropionate), propylene glycol bis (3-mercaptopropionate), glycerol tris (3-mercaptopropionate), trimethylolethane tris (mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), and dipentaerythritol hexa (3-mercaptopropionate); poly (mercaptobutanoates) such as 1, 4-bis (3-mercaptobutanoyloxy) butane, 1,3, 5-tris (3-mercaptobutoxyethyl) -1,3, 5-triazine-2, 4,6(1H,3H,5H) -trione, pentaerythritol tetrakis (3-mercaptobutanoate).

Examples of commercially available products of these include: BMPA, MPM, EHMP, NOMP, MBMP, STMP, TMMP, PEMP, DPMP, and TEMPIC (made by Sakai chemical industry Co., Ltd.), Carontz (Karenz) MT-PE1, Carontz (Karenz) MT-BD1, and Carontz (Karenz) -NR1 (made by Showa electrician Co., Ltd.), and the like.

Examples of the polycarboxylic acid having a plurality of carboxyl groups include: aliphatic polycarboxylic acids such as itaconic acid, maleic acid, succinic acid, citraconic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, cyclopentanetetracarboxylic acid, and cyclohexanetricarboxylic acid; aromatic polycarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid, trimellitic acid, pyromellitic acid, and benzophenonetetracarboxylic acid.

Examples of the compound having one or more acid anhydride groups include: aromatic carboxylic acid anhydrides such as phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, 3',4,4' -benzophenonetetracarboxylic dianhydride, 4,4' -oxydiphthalic dianhydride, ethylene glycol bis (trimellitic anhydride), glycerol bistrimellitic anhydride monoacetate, and diphenylsulfonetetracarboxylic dianhydride; aliphatic carboxylic acid anhydrides such as succinic anhydride, maleic anhydride, dodecenylsuccinic anhydride and butanetetracarboxylic dianhydride; tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl-5-norbornene-2, 3-dicarboxylic anhydride (methylnadic anhydride), 5-norbornene-2, 3-dicarboxylic anhydride (endomethyltetrahydrophthalic anhydride (trade name) produced by Hitachi chemical reaction), hydrogenated trimellitic anhydride, alicyclic carboxylic anhydrides such as 5- (2, 5-dioxotetrahydro-3-furyl) -3-methyl-3-cyclohexene-1, 2-dicarboxylic anhydride and 3, 4-dicarboxy-1, 2,3, 4-tetrahydro-1-naphthalene succinic dianhydride, and styrene-maleic anhydride copolymers.

Examples of the epoxy resin having a plurality of epoxy groups include: phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol type epoxy resins, triphenol type epoxy resins, tetraphenol type epoxy resins, phenol-xylylene type epoxy resins, naphthol-xylylene type epoxy resins, phenol-naphthol type epoxy resins, phenol-dicyclopentadiene type epoxy resins, alicyclic epoxy resins, aliphatic epoxy resins, and copolymers of glycidyl methacrylate and a double-bond monomer such as styrene.

Examples of the polyisocyanate having a plurality of isocyanate groups include aromatic polyisocyanate, aliphatic polyisocyanate, and alicyclic polyisocyanate. Specific examples of the aromatic polyisocyanate include: 4,4' -diphenylmethane diisocyanate, 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, naphthalene-1, 5-diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate and 2, 4-toluene diisocyanate. Specific examples of the aliphatic polyisocyanate include: tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4-methylenebis (cyclohexyl isocyanate) and isophorone diisocyanate. Specific examples of the alicyclic polyisocyanate include bicycloheptane triisocyanate. And adduct bodies, biuret bodies and isocyanurate bodies of the isocyanate compounds listed above can be listed.

The isocyanate group of the polyisocyanate may be a blocked isocyanate group blocked with a blocking agent. The blocked isocyanate group is a group which is temporarily deactivated by protecting an isocyanate group by a reaction with a blocking agent. When heated to a predetermined temperature, the blocking agent is dissociated from the blocked isocyanate groups to generate isocyanate groups.

As the blocked isocyanate compound having a blocked isocyanate group, an addition reaction product of an isocyanate compound and an isocyanate blocking agent can be used. Examples of the isocyanate compound which can be reacted with the blocking agent include: isocyanurate type, biuret type, adduct type, and the like. As the isocyanate compound, for example, aromatic polyisocyanate, aliphatic polyisocyanate, or alicyclic polyisocyanate can be used. Specific examples of the aromatic polyisocyanate, the aliphatic polyisocyanate and the alicyclic polyisocyanate include the compounds exemplified above.

Examples of the blocking agent for an isocyanate group include: phenol-based blocking agents such as phenol, cresol, xylenol, chlorophenol, and ethylphenol; lactam-based blocking agents such as epsilon-caprolactam, delta-valerolactam, gamma-butyrolactam and beta-propiolactam; an active methylene-based blocking agent such as ethyl acetoacetate or acetylacetone; alcohol-based blocking agents such as methanol, ethanol, propanol, butanol, pentanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, benzyl ether, methyl glycolate, butyl glycolate, diacetone alcohol, methyl lactate, and ethyl lactate; oxime blocking agents such as formaldoxime, acetaldoxime, acetoxime, methylethylketoxime, diacetyl monooxime, and cyclohexane oxime; thiol-based blocking agents such as butyl mercaptan, hexyl mercaptan, t-butyl mercaptan, thiophenol, methyl thiophenol, and ethyl thiophenol; acid amide-based blocking agents such as acetic acid amide and benzamide; imide-based terminal-blocking agents such as succinimide and maleimide; amine-based blocking agents such as xylidine, aniline, butylamine, and dibutylamine; imidazole-based capping agents such as imidazole and 2-ethylimidazole; and imine-based blocking agents such as methylene imine and propylene imine.

The blocked isocyanate compound may be a commercially available product, and examples thereof include: sumidur (Sumidur) BL-3175, BL-4165, BL-1100, BL-1265, Desmodium Multiplex (Desmodur) TPLS-2957, TPLS-2062, TPLS-2078, TPLS-2117, Desmodium Sovitta (Desmodium) 2170, Desmodium Sovitta (Desmodium Sovitta) 2265 (above, the trade name manufactured by Sumitomo Bayer polyurethane Co., Ltd.), Crosstide (Coronat) 2512, Crosstide (Coronat) 2513, Crosstide (Coronat) 2520 (above, the trade name manufactured by Nippon polyurethane industries Co., Ltd.), B-830, B-815, B-846, B-870, B-874, B-882 (above, the trade name manufactured by Mitsui Wutian chemical Co., Ltd.), TPA-B80E, 17B-60, and PX-402-B80T (above, the trade name manufactured by Asahi chemical Co., Ltd.), and the like. Sumido (Sumidur) BL-3175 and BL-4265 are those obtained by using methyl ethyl oxime as a blocking agent.

The compound having a plurality of isocyanate groups or blocked isocyanate groups in one molecule may be used singly or in combination of two or more.

The content of the nucleophilic addition reactive compound in the binder component contained in the composition is usually 1to 100% by mass, preferably 50to 100% by mass, and more preferably 80 to 100% by mass.

The lower limit of the content of the compound having two or more polymerizable groups in one molecule in the binder component contained in the composition is preferably 1% by mass, more preferably 5% by mass, even more preferably 10% by mass, even more preferably 20% by mass, and even more preferably 30% by mass, 50% by mass, and 80% by mass. On the other hand, the upper limit of the content ratio may be 100% by mass, and may be preferably 80%, 60%, 50%, 40% and 25% by mass.

The lower limit of the content of the binder component in the solid content of the composition is, for example, 50 mass%, preferably 70 mass%, more preferably 80 mass%, and sometimes even more preferably 90 mass%. On the other hand, the upper limit of the content of the binder component is preferably 99 mass%, more preferably 97 mass%, and still more preferably 95 mass%. The solid component is all components other than the solvent in the composition.

< pigment >

Next, three kinds of dyes shown below will be described. The coloring matter in the present invention is a substance that imparts color by absorption or emission of visible light, and is a concept including any of an inorganic compound and an organic compound, and includes any of a dye and a pigment.

The composition comprises: a dye A having a maximum absorption in a wavelength range of 400nm to 580 nm; dye B having maximum absorption in a wavelength range of 581nm to 700 nm; and a dye C having a maximum absorption in a wavelength region of 701nm to 800 nm. According to the composition, the infrared transmitting film obtained by containing the three types of coloring matters can continuously realize shielding in a visible light region (wavelength of 400nm to 700nm), and can perform excellent sensing with less noise by suppressing fluctuation in transmittance at wavelength of 400nm to 700 nm. Further, according to the composition, by using the three kinds of coloring matters, an infrared-transmitting film which can synchronize with the color tone of the peripheral frame portion while maintaining the infrared-transmitting property can be formed.

(pigment A)

The dye A having the maximum absorption in the wavelength range of 400nm to 580nm will be described below.

Examples of the pigment a include: xanthene compounds, triarylmethane compounds, cyanine compounds, anthraquinone compounds, porphyrazine compounds, coumarin compounds, and indigo compounds, and these compounds may be dyes or pigments. One or two or more kinds of the pigments A may be used in combination.

Among the above-mentioned pigments a, cyanine compounds, coumarin compounds, anthraquinone compounds and tetraazaporphyrin compounds are preferable, and cyanine compounds and coumarin compounds are particularly preferable, from the viewpoints of heat resistance, absorption characteristics and solubility.

The cyanine compound has a structure in which a conjugated double bond is formed between two hetero rings by a plurality of methines (methines) in a molecule. The structure of the cyanine compound as the dye a is not particularly limited as long as it has a maximum absorption in a region of 400nm to 580nm wavelength, and examples thereof include compounds represented by the following formulae (C1) and (C2).

[ solution 7]

In the formula (C1), Z¹Each independently represents an alkyl group having 1to 12 carbon atoms or a phenyl group. Z²Represents an alkyl group having 1to 12 carbon atoms, a phenyl group or a naphthyl group, wherein one or more hydrogen atoms of the phenyl group or the naphthyl group may be substituted with a halogen or an alkyl group having 1to 12 carbon atoms. D represents an oxygen atom, a sulfur atom, -CR₂-or-NR-group (R represents an alkyl group having 1to 12 carbon atoms).

In the formula (C2), Z³And Z⁴Each independently represents a hydrogen atom, an alkyl group having 1to 12 carbon atoms or a phenyl group. D independently represents an oxygen atom, a sulfur atom or-CR₂-or-NR-group (R represents an alkyl group having 1to 12 carbon atoms). X^-Denotes a counter anion.

As X^-Examples of the counter anion include: halide ion, ClO₄ ^-、OH^-Organic carboxylic acid anions, organic sulfonic acid anions, Lewis acid anions, organic metal complex anions, pigment-derived anions, organic sulfonyl imide acid anions, organic sulfonyl methylated acid anions, and the like.

As the halide ion, Cl may be mentioned^-、Br^-、I^-And the like.

Examples of organic carboxylic acid anions include: benzoic acid ions, alkanoic acid ions, trihaloalkanoic acid ions, nicotinic acid ions, and the like.

Examples of the organic sulfonic acid anion include: benzene sulfonic acid ion, naphthalene sulfonic acid ion, p-toluene sulfonic acid ion, alkane sulfonic acid ion, etc.

As Lewis acid anions there may be mentioned: tetrafluoroborate ion, hexafluoroantimonate ion, tetrakis (pentafluorophenyl) boron anion, and the like.

Specific examples of the compound represented by the above formula (C1) or formula (C2) include compounds represented by the following formulae (C1-1), (C1-2), (C1-3), (C2-1), (C2-2) and (C2-3). The maximum absorption (. lamda.max) of the compound (C1-1) was 466nm, the maximum absorption (. lamda.max) of the compound (C1-2) was 472nm, the maximum absorption (. lamda.max) of the compound (C1-3) was 475nm, the maximum absorption (. lamda.max) of the compound (C2-1) was 549nm, the maximum absorption (. lamda.max) of the compound (C2-2) was 556nm, and the maximum absorption (. lamda.max) of the compound (C2-3) was 551 nm.

[ solution 8]

The structure of the coumarin-based compound as the dye A is not particularly limited as long as it has a maximum absorption in a wavelength region of 400nm to 580nm, and examples thereof include compounds represented by the following formulae (C3-1), (C3-2) and (C3-3). The maximum absorption (. lamda.max) of the (C3-1) compound was 423nm, the maximum absorption (. lamda.max) of the (C3-2) compound was 479nm, and the maximum absorption (. lamda.max) of the (C3-3) compound was 451 nm.

[ solution 9]

The lower limit of the maximum absorption of the dye A may be 420nm, and may be 440 nm. On the other hand, the upper limit of the maximum absorption of the dye A may preferably be 560 nm. The dye A may be a combination of two dyes having a wavelength difference of maximum absorption of, for example, 40nm to 120 nm. Further, as the dye A, a dye having a maximum absorption in a region of wavelengths of 400nm to 500nm may be used in combination with a dye having a maximum absorption in a region of wavelengths of more than 500nm to 580 nm.

In the composition, the content of the pigment a is usually 0.1 to 20 parts by mass, preferably 0.5 to 10 parts by mass, and more preferably 1to 5 parts by mass, based on 100 parts by mass of the binder component. By using the dye A in the above range, an infrared-transmitting film having a low transmittance in the visible light region and a high transmittance in the near infrared region can be formed.

(pigment B)

Next, dye B having the maximum absorption in the range of from 581nm to 700nm will be described.

Examples of the pigment B include: squarylium compounds, triarylmethane compounds, cyanine compounds, phthalocyanine compounds, porphyrazine compounds, and the like, and these compounds may be dyes or pigments. One or two or more kinds of the pigments B may be used in combination. The dye B is preferably a triarylmethane compound, a cyanine compound, or a phthalocyanine compound, and particularly preferably a triarylmethane compound or a cyanine compound, from the viewpoints of heat resistance, absorption characteristics, solubility, and the like.

The structure of the triarylmethane compound is not particularly limited as long as it has a maximum absorption in a wavelength region of 581nm to 700nm, and examples thereof include compounds represented by the following formula (C4).

[ solution 10]

In the formula (C4), Z⁵Each independently represents a hydrogen atom, an alkyl group having 1to 12 carbon atoms or a phenyl group. Ring T represents an optionally substituted groupAn aromatic group or heterocyclic group having 3 to 10 carbon atoms. X^-Denotes a counter anion.

As X^-Specific examples of the counter anion include: halide ions, perchloric acid ions, hydroxide ions, organic carboxylic acid anions, organic sulfonic acid anions, Lewis acid anions, organometallic complex anions, anions derived from pigments, organic sulfonyl imide acid anions, organic sulfonyl methide acid anions, and the like.

Specific examples of the compound represented by the above formula (C4) include compounds represented by the following formulae (C4-1), (C4-2) and (C4-3). The maximum absorption (. lamda.max) of the compound (C4-1) was 604nm, the maximum absorption (. lamda.max) of the compound (C4-2) was 605nm, and the maximum absorption (. lamda.max) of the compound (C4-3) was 608 nm.

[ solution 11]

The structure of the cyanine compound as dye B is not particularly limited as long as it has a maximum absorption in a region having a wavelength of 581nm to 700nm, and examples thereof include compounds represented by the following formula (C5).

[ solution 12]

In the formula (C5), Z³And Z⁴、D、X^-And Z in the formula (C2)³And Z⁴、D、X^-Are the same meaning. Y is¹And Y³Each independently represents a hydrogen atom or an alkyl group having 1to 12 carbon atoms, and may be bonded to each other to form a ring having 5 or 6 carbon atoms. Y is²Represents a hydrogen atom, a halogen atom, an alkyl group having 1to 12 carbon atoms, a phenyl group or an amino group, and any number of hydrogen atoms of the phenyl group and the amino group may be substituted with an alkyl group having 1to 12 carbon atoms or a phenyl group.

Specific examples of the compound represented by the above formula (C5) include compounds represented by the following formulae (C5-1), (C5-2) and (C5-3). The maximum absorption (. lamda.max) of the compound (C5-1) was 644nm, the maximum absorption (. lamda.max) of the compound (C5-2) was 645nm, and the maximum absorption (. lamda.max) of the compound (C5-3) was 653 nm.

[ solution 13]

The lower limit of the maximum absorption of the dye B may be preferably 600 nm. The upper limit of the maximum absorption of the dye B may be 680nm, and more preferably 660 nm.

In the composition, the content of the pigment B is usually 0.1 to 20 parts by mass, preferably 0.5 to 10 parts by mass, and more preferably 1to 5 parts by mass, based on 100 parts by mass of the binder component. By using the dye B in the above range, an infrared-transmitting film having a low transmittance in the visible light region and a high transmittance in the near infrared region can be formed.

(pigment C)

Next, dye C having the maximum absorption in the wavelength region of 701nm to 800nm will be described.

Examples of the pigment C include: squarylium compounds, cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, perylene compounds, oxonium compounds, and the like, and these compounds may be dyes or pigments. One or two or more kinds of the pigments C may be used in combination. The dye C is preferably a squarylium compound, a phthalocyanine compound, and a naphthalocyanine compound, and particularly preferably a squarylium compound and a phthalocyanine compound, from the viewpoint of absorption characteristics and the like.

The squarylium compound as the dye C is not particularly limited as long as it has a maximum absorption in a wavelength region of 701nm to 800nm, and examples thereof include compounds represented by the following formula (C6).

[ solution 14]

In the formula (C6), X independently represents a methylene group in which one or more hydrogen atoms may be substituted by an alkyl group or an alkoxy group having 1to 12 carbon atoms, or an alkylene group having 2 to 12 carbon atoms. Z⁶、Z⁷And Z⁸Each independently represents a hydrogen atom, an alkyl group having 1to 12 carbon atoms or a phenyl group. Z⁹Represents an alkyl group having 1to 12 carbon atoms, a fluorinated alkyl group having 1to 12 carbon atoms or a phenyl group.

Specific examples of the compound represented by the above formula (C6) include compounds represented by the following formulae (C6-1), (C6-2) and (C6-3). The maximum absorption (. lamda.max) of the compound (C6-1) was 712nm, the maximum absorption (. lamda.max) of the compound (C6-2) was 704nm, and the maximum absorption (. lamda.max) of the compound (C6-3) was 709 nm.

[ solution 15]

The phthalocyanine-based compound as the dye C is not particularly limited as long as it has a maximum absorption in a region of a wavelength of 701nm to 800nm, and examples thereof include compounds represented by the following formula (C7).

[ solution 16]

In the formula (C7), Z¹⁰Each independently represents a hydrogen atom, an alkyl group having 1to 12 carbon atoms or a phenyl group. M represents a metal-free form (a form in which two hydrogen atoms are bonded), a metal, or a metal oxide. Examples of the metal include Zn, Mg, Si, Sn, Rh, Pt, Pd, Mo, Mn, Pb, Cu, Ni, Co, Fe, etc., and examples of the metal oxide include VO, TiO, etc.

Specific examples of the compound represented by the above formula (C7) include compounds represented by the following formulae (C7-1), (C7-2) and (C7-3). The maximum absorption (. lamda.max) of the compound (C7-1) was 738nm, the maximum absorption (. lamda.max) of the compound (C7-2) was 703nm, and the maximum absorption (. lamda.max) of the compound (C7-3) was 725 nm.

[ solution 17]

The upper limit of the maximum absorption of the dye C may be 780nm, and may be 760 nm. The dye C may be a combination of two dyes having a wavelength difference of maximum absorption of, for example, 10nm to 60 nm.

In the composition, the content of the pigment C is usually 0.1 to 20 parts by mass, preferably 0.5 to 10 parts by mass, and more preferably 1to 5 parts by mass, based on 100 parts by mass of the binder component. By using the dye C in the above range, an infrared-transmitting film having a low transmittance in the visible light region and a high transmittance in the near infrared region can be formed.

Preferably, the difference between the maximum absorption wavelengths of the dye A and the dye B is 40nm to 200nm, and the difference between the maximum absorption wavelengths of the dye B and the dye C is 80nm to 200 nm. The lower limit of the difference between the maximum absorption wavelengths of the dye A and the dye B is more preferably 60nm, still more preferably 80nm, and yet more preferably 100 nm. On the other hand, the upper limit of the difference between the maximum absorption wavelengths of the dye A and the dye B is more preferably 180 nm. The lower limit of the difference between the maximum absorption wavelengths of the dye B and the dye C is more preferably 90nm, and the upper limit thereof is more preferably 180nm, and still more preferably 160 nm. By using the dye a, the dye B, and the dye C in the above ranges, the visible light region can be continuously shielded at a high level without using more than necessary dyes, and the transmittance in the near infrared region can be improved.

In the case where two or more different maximum absorption wavelengths are used for each of the dye a, the dye B, and the dye C, at least one of the difference between the maximum absorption wavelengths of the dye a and the dye B and the difference between the maximum absorption wavelengths of the dye B and the dye C may be a combination of a plurality of dyes, so long as the above-described condition is satisfied.

The composition may or may not contain one or more other pigments other than the three pigments A to C. The upper limit of the content of the other pigment is preferably 10 parts by mass, more preferably 1 part by mass, and still more preferably 0.1 part by mass, based on 100 parts by mass of the total of the pigments a to C. When the coloring matter contained in the composition is substantially composed of only the coloring matters a to C, the infrared-transmitting film formed can have better infrared transmittance, and can more effectively synchronize with the color tone of the peripheral frame portion.

< polymerization initiator >

Examples of the polymerization initiator include a photopolymerization initiator and a thermal polymerization initiator. Examples of the photopolymerization initiator include photosensitizers such as photoradical generators and photocation generators. Examples of the thermal polymerization initiator include a thermal radical generator, a thermal cation generator, a urethanization catalyst, and other thermal curing catalysts.

(photo radical generator)

The photo radical generator is a compound that generates radicals by irradiation with light and starts radical polymerization of a radical polymerizable compound. In the exposure of the 1 st stage by ultraviolet exposure, the maximum absorption wavelength of the photo radical generator is preferably 150nm to 380 nm. The photo-radical generators may be used singly or in combination of two or more.

Examples of the photo-radical generating agent include compounds described in Japanese patent laid-open Nos. 2008-276194, 2003-241372, 2009-519991, 2009-531730, 2010/001691, 2010/146883, 2011-132215, 2008-506749 and 2009-519904.

Examples of the photo radical generator include: a bisimidazole compound, an acylphosphine oxide compound, a phenone compound, an oxime compound, a benzoin compound, a benzophenone compound, a thioxanthone compound.

Examples of the biimidazole compound include: 2,2 '-bis (2, 4-dichlorophenyl) -4,5,4',5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2-chlorophenyl) -4,5,4',5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2,4, 6-trichlorophenyl) -4,4',5,5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2, 4-dimethylphenyl) -4,5,4',5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2-methylphenyl) -4,5,4',5 '-tetraphenyl-1, 2' -biimidazole, 2,2 '-diphenyl-4, 5,4',5 '-tetraphenyl-1, 2' -biimidazole, and the like.

As the acylphosphine oxide compound, there can be mentioned: 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, phenylbis (2,4, 6-trimethylbenzoyl) phosphine oxide, and the like.

As the phenone compound, there can be mentioned: diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl ] -2-methylpropan-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 1-hydroxycyclohexyl-phenyl-one, 1-hydroxy-4-methoxyphenyl-phenyl-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, 2- (2-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone 2- (3-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (4-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-ethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-propylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-butylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, and the like.

Examples of oxime compounds include: n-benzoyloxy-1- (4-phenylmercapto (sulfonyl) phenyl) butan-1-one-2-imine, N-ethoxycarbonyloxy-1-phenylpropan-1-one-2-imine, N-benzoyloxy-1- (4-phenylmercapto (sulfonyl) phenyl) octan-1-one-2-imine, N-acetoxy-1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] ethane-1-imine, N-acetoxy-1- [ 9-ethyl-6- { 2-methyl-4- (3, 3-dimethyl-2, 4-dioxopentylmethoxy) benzoyl } -9H-carbazol-3-yl ] ethane-1-imine, 1, 2-octanedione, 1- [4- (phenylsulfanyl) phenyl ] -,2- (O-benzoyloxime), ethanone, 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -,1- (O-acetyloxime), ethanone, 1- [ 9-ethyl-6- (2-methyl-4-tetrahydrofuranylmethoxybenzoyl) -9H-carbazol-3-yl ] -,1- (O-acetyloxime), Ethanone, 1- [ 9-ethyl-6- { 2-methyl-4- (2, 2-dimethyl-1, 3-dioxolanyl) methoxybenzoyl } -9H-carbazol-3-yl ] -,1- (O-acetyloxime), (5-p-toluenesulfonyloxyimino-5H-thiophen-2-ylidene) - (2-methylphenyl) acetonitrile, and the like.

Examples of benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and the like.

As the benzophenone compound, there can be exemplified: benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4 '-methyldiphenyl sulfide, 3',4,4 '-bis (diethylamino) benzophenone, 4,4' -tetrakis (t-butylperoxycarbonyl) benzophenone, 2,4, 6-trimethylbenzophenone, and the like.

Examples of the thioxanthone compound include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2, 4-dichlorothioxanthone, 2, 4-dimethylthioxanthone, 2, 4-diethylthioxanthone, 2, 4-diisopropylthioxanthone, and the like.

Among these compounds, preferred are benzophenone compounds such as (5-p-toluenesulfonyloxyimino-5H-thiophen-2-ylidene) - (2-methylphenyl) acetonitrile, 1-hydroxycyclohexyl-phenyl-ketone, and 1-hydroxy-4-methoxyphenyl-phenyl-ketone.

The content of the photo radical generator in the composition is usually 0.1 to 40 parts by mass, preferably 0.5 to 30 parts by mass, and more preferably 1to 20 parts by mass, based on 100 parts by mass of the binder component. When the content ratio of the photo radical generator is within the above range, an infrared ray transmitting film having a sufficient intensity can be formed.

(photo cation generator)

The photo cation generator is a compound that generates cations by irradiation with light and initiates crosslinking of a cation-reactive compound by a reaction of the cations.

The photo cation generator may be used alone or in combination of two or more.

Examples of the photo cation generator include: onium salt compounds, halogen-containing compounds, sulfone compounds, sulfonic acid compounds, sulfonimide compounds, diazomethane compounds.

Examples of the onium salt compound include: iodonium salts, sulfonium salts, phosphonium salts, diazonium salts, and pyridinium salts. Specific examples of preferred onium salts include: iodonium trifluoromethanesulfonate, diphenyliodonium p-toluenesulfonate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluorophosphate, diphenyliodonium tetrafluoroborate, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfonium hexafluoroantimonate, 4-tert-butylphenyl diphenylsulfonium trifluoromethanesulfonate, 4-tert-butylphenyl diphenylsulfonium p-toluenesulfonate, 4, 7-di-n-butyloxynaphthyltetrahydrothiophenium trifluoromethanesulfonate, 4, 7-di-n-butyloxynaphthyltetrahydrothiophenium nonafluorobutanesulfonate, 4- (phenylthio) phenyldiphenylsulfonium tris (pentafluoroethyl) trifluorophosphate, 4- (phenylthio) phenyldiphenylsulfonium hexafluorophosphate.

Examples of the halogen-containing compound include: hydrocarbon compounds containing halogenated alkyl groups, heterocyclic compounds containing halogenated alkyl groups. Specific examples of preferable halogen-containing compounds include: 1, 10-dibromo-n-decane; 1, 1-bis (4-chlorophenyl) -2,2, 2-trichloroethane; s-triazine derivatives such as phenyl-bis (trichloromethyl) -s-triazine, 4-methoxyphenyl-bis (trichloromethyl) -s-triazine, styryl-bis (trichloromethyl) -s-triazine, naphthyl-bis (trichloromethyl) -s-triazine, and 2- [2- (5-methylfuran-2-yl) vinyl ] -4, 6-bis- (trichloromethyl) -1,3, 5-triazine.

Examples of the sulfone compound include: beta-ketosulfone compounds, beta-sulfonyl sulfone compounds and alpha-diazo compounds of these compounds. Specific examples of preferable sulfone compounds include: 4-tribenzoyl methyl sulfone, mesitylphenyl benzoyl methyl sulfone, bis (benzoylmethylsulfonyl) methane.

Examples of the sulfonic acid compound include: alkyl sulfonates, halogenated alkyl sulfonates, aryl sulfonates, and imino sulfonates. Specific examples of preferred sulfonic acid compounds include: benzoin tosylate, pyrogallol tris-triflate, o-nitrobenzyl p-toluenesulfonate.

Examples of the sulfonimide compound include: n- (trifluoromethylsulfonyloxy) succinimide, N- (trifluoromethylsulfonyloxy) phthalimide, N- (trifluoromethylsulfonyloxy) diphenylmaleimide, N- (trifluoromethylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2, 3-dicarboximide, N- (trifluoromethylsulfonyloxy) naphthylimide, N- (trifluoromethylsulfonyloxy) -1, 8-naphthalimide.

Examples of the diazomethane compound include: bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane.

Among these compounds, a sulfonimide compound and an onium salt compound are preferable from the viewpoint of having sufficient strength.

In the composition, the content of the photo cation generator is usually 0.1 to 40 parts by mass, preferably 0.5 to 30 parts by mass, and more preferably 1to 20 parts by mass, based on 100 parts by mass of the binder component. When the concentration is within the above range, an infrared-transmitting film having sufficient strength can be formed.

(thermal curing catalyst)

When a compound having an epoxy group is used as the nucleophilic addition reactive compound as the binder component, it is preferable to use a thermosetting catalyst as a polymerization initiator in combination. Examples of the thermosetting catalyst include: imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; amine compounds such as dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine, and 4-methyl-N, N-dimethylbenzylamine, hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; phosphorus compounds such as triphenylphosphine, and the like. Examples of commercially available products include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ and 2P4MHZ (both trade names of imidazole compounds) manufactured by chemical industries, U-CAT (registered trademark) 3503N, U-CAT3502T (both trade names of blocked isocyanate compounds of dimethylamine), DBU, DBN, U-CATA SA102 and U-CAT5002 (both bicyclic amidine compounds and salts thereof) manufactured by Sanpporo. The epoxy resin and the oxetane compound are not particularly limited as long as they are thermosetting catalysts for epoxy resins and oxetane compounds, or substances which promote the reaction of an epoxy group and/or an oxetane group with a carboxyl group, and two or more of them may be used alone or in combination. Further, S-triazine derivatives such as guanamine, acetoguanamine, benzoguanamine, melamine, 2, 4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2, 4-diamino-S-triazine, 2-vinyl-4, 6-diamino-S-triazine-isocyanurate adduct, and 2, 4-diamino-6-methacryloyloxyethyl-S-triazine-isocyanurate adduct may be used, and it is preferable to use these compounds also functioning as an adhesion imparting agent in combination with the above-mentioned thermosetting catalyst.

In the composition, the content of the thermosetting catalyst is usually 0.01 to 10 parts by mass, preferably 0.05 to 3 parts by mass, per 100 parts by mass of the binder component, and an infrared-transmitting film having sufficient strength can be formed within the above range.

(Carbamate esterification catalyst)

When a compound having an isocyanate group is used as the nucleophilic addition reactive compound as the binder component, a urethanization catalyst may be added as a polymerization initiator. The urethane-forming catalyst is preferably at least one selected from the group consisting of tin-based catalysts, metal chlorides, metal acetylacetonates, metal sulfates, amine compounds, and amine salts.

Examples of the tin-based catalyst include organic tin compounds such as stannous octoate (stannous octoate) and dibutyltin dilaurate, and inorganic tin compounds.

The metal chloride is a chloride of a metal containing Cr, Mn, Co, Ni, Fe, Cu, or Al, and examples thereof include cobalt chloride, nickel chloride, and iron chloride.

The metal acetylacetonate is a metal acetylacetonate containing Cr, Mn, Co, Ni, Fe, Cu or Al, and examples thereof include cobalt acetylacetonate, nickel acetylacetonate, iron acetylacetonate, and the like.

The metal sulfate is a sulfate of a metal containing Cr, Mn, Co, Ni, Fe, Cu, or Al, and examples thereof include copper sulfate.

Examples of the amine compound include conventionally known triethylenediamine, N, N, N ', N' -tetramethyl-1, 6-hexanediamine, bis (2-dimethylaminoethyl) ether, N, N, N ', N' -pentamethyldiethylenetriamine, N-methylmorpholine, N-ethylmorpholine, N, N-dimethylethanolamine, dimorpholinodiethylether, N-methylimidazole, dimethylaminopyridine, triazine, N '- (2-hydroxyethyl) -N, N, N' -trimethyl-bis (2-aminoethyl) ether, N, N-dimethylhexanolamine, N, N-dimethylaminoethoxyethanol, N, N, N '-trimethyl-N' - (2-hydroxyethyl) ethylenediamine, N, N '-dimethylaminoethoxyethanol, N, N, N' -dimethylethoxyethanol, N, N, N '-dimethyl-N' - (2-hydroxyethyl) ethylenediamine, N '-dimethylethoxyethanol, N, N, N' -diethylenetriamine, N, N '-dimethyldiguanide, N, N, N' -dimethyldiguanide, N, N, n- (2-hydroxyethyl) -N, N ' -tetramethyldiethylenetriamine, N- (2-hydroxypropyl) -N, N ' -tetramethyldiethylenetriamine, N, N ' -trimethyl-N ' - (2-hydroxyethyl) propanediamine, N-methyl-N ' - (2-hydroxyethyl) piperazine, bis (N, N-dimethylaminopropyl) amine, bis (N, N-dimethylaminopropyl) isopropanolamine, 2-aminoquinine, 3-aminoquinine, 4-aminoquinine, 2-quinine diol, 3-quinine diol, 4-quinine diol, 1- (2' -hydroxypropyl) imidazole, 1- (2' -hydroxypropyl) -2-methylimidazole, 1- (2' -hydroxyethyl) imidazole, 1- (2' -hydroxyethyl) -2-methylimidazole, 1- (2' -hydroxypropyl) -2-methylimidazole, 1- (3' -aminopropyl) imidazole, 1- (3' -aminopropyl) -2-methylimidazole, 1- (3' -hydroxypropyl) imidazole, 1- (3' -hydroxypropyl) -2-methylimidazole, N-dimethylaminopropyl-N ' - (2-hydroxyethyl) amine, N-dimethylaminopropyl-N ', N ' -bis (2-hydroxypropyl) amine, N ' -hydroxypropyl-N ' -methyl-imidazole, N ' -hydroxypropyl-imidazole, N ' -imidazole, N ' -methyl-2-imidazole, N ' -dimethylaminopropyl-N ' -imidazole, N ' -bis (2-hydroxyethyl) amine, N ' -imidazole, N ' -imidazole, N ' -imidazole, N ' -imidazole, N ' -bis (2-N ' -bis (2-N ' -imidazole, N ' -amino, N ' -bis (2-methyl-2-N ' -amino, N ' -bis (2-methyl-2-methyl-2-amino, N ' -bis (2-N, N ' -bis (2-N, N ' -bis (2-methyl-N, N ' -bis (2-N, N ' -bis (2-N, N ' -bis (2-N, n, N-dimethylaminoethyl-N ', N' -bis (2-hydroxyethyl) amine, N-dimethylaminoethyl-N ', N' -bis (2-hydroxypropyl) amine, melamine and/or benzoguanamine, and the like.

Examples of the amine salt include amine salts of organic acid salts of 1,8-Diaza-bicyclo [5,4,0] undecene-7 (1,8-Diaza-bicyclo [5,4,0] undecene-7, DBU).

The content ratio of these urethane-forming catalysts is a ratio of a usual amount and is sufficient, and for example, is preferably 0.01 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, based on 100 parts by mass of the compound having an isocyanate group.

The lower limit of the content of the polymerization initiator in the composition is preferably 0.01 part by mass, more preferably 0.05 part by mass, even more preferably 0.1 part by mass, and even more preferably 0.5 part by mass or 1 part by mass, based on 100 parts by mass of the binder component. On the other hand, the upper limit of the content ratio is preferably 40 parts by mass, more preferably 30 parts by mass, still more preferably 20 parts by mass, still more preferably 10 parts by mass, and yet more preferably 3 parts by mass.

< solvent >

The composition typically contains a vehicle. The solvent used in the composition is not particularly limited as long as it is a dispersion medium in which a pigment, a binder component, and the like can be stably dispersed or a solvent in which these components can be dissolved. In the present specification, the term "solvent" is used in a concept including a dispersion medium. Examples of the solvent include: alcohols such as isopropyl alcohol, N-butanol, ethyl cellosolve and methyl cellosolve, glycols such as ethylene glycol, diethylene glycol and propylene glycol, ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone and cyclohexanone, amides such as N, N-dimethylformamide, N-dimethylacetamide and N-methyl-2-pyrrolidone, ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol butyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate and ethylene glycol monobutyl ether acetate, esters such as methyl acetate, ethyl acetate and butyl acetate, aromatics such as benzene, toluene and xylene, aliphatic hydrocarbons such as N-hexane and N-heptane, fluorine-based solvents such as tetrafluoropropanol and pentafluoropropanol, fluorine-based solvents such as methanol, ethylene glycol, diethylene glycol and propylene glycol, ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether acetate, and ethylene glycol monobutyl ether acetate, esters such as toluene, and the like, Tetrahydrofuran, water, and the like. These solvents may be used alone or in combination of two or more.

The amount of the solvent is preferably 10 to 5,000 parts by mass, and more preferably 30 to 2,000 parts by mass, based on 100 parts by mass of the binder component.

The solid content concentration of the composition is preferably 1to 90% by mass, more preferably 3 to 30% by mass, and still more preferably 5 to 15% by mass.

The viscosity of the composition is preferably in the range of 1to 2000 mPa.sec, more preferably in the range of 5 to 500 mPa.sec, further preferably in the range of 10 to 100 mPa.sec, particularly in the range of 20to 50 mPa.sec at 25 ℃. When the viscosity is within the above range, the coating property and the storage stability of the composition can be both maintained at a high level. When the infrared-transmitting film is used as the frame edge portion (frame), a high viscosity of 10mPa · sec or more can be suitably used.

The composition may contain any component other than the binder component, the pigment, the polymerization initiator and the solvent. Examples of the optional components include: color tone correction pigment, leveling agent, antistatic agent, heat stabilizer, light stabilizer, antioxidant, silane coupling agent, dispersant, flame retardant, lubricant, plasticizer, transparent nano particle, surfactant and the like. Any of the above components may be used alone or in combination of two or more.

As the antioxidant, there may be mentioned: hindered phenol compounds, phosphorus compounds, sulfur compounds, amine compounds, and the like. Among these, from the viewpoint of infrared light transmittance, a hindered phenol compound is preferable. The hindered phenol compound has substituents at both the 2-position and the 6-position with respect to the phenolic hydroxyl group. As the substituent, methyl or tert-butyl is preferable. The hindered phenol compound may be any one of monophenol, bisphenol and polyphenol.

As the light stabilizer, for example, a hindered amine compound can be used. The hindered amine compound is preferably a 2,2',6,6' -tetraalkylpiperidine derivative. The substituent on the nitrogen atom is preferably a hydrogen atom, an alkyl group, or an alkoxy group. The substituents at the 2-and 6-positions are preferably alkyl groups or phenyl groups.

In addition, nanoparticles of an inorganic oxide material transparent in the infrared wavelength region may be included in order to adjust the refractive index or increase the hardness of the infrared ray transmitting film. As the material, there can be mentioned: al (Al)₂O₃、SiO₂、GeO₂、Y₂O₃、La₂O₃、CeO₂、TiO₂、ZrO₂、Nb₂O₅、Ta₂O₅And the like.

The silane coupling agent may be contained to improve the adhesion to a substrate or the like. The silane coupling agent has an effect of improving adhesion to other constituent members. Examples of the silane coupling agent include: 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3- (methacryloxypropyl) trimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, N-2-aminoethyl-3-aminopropyltrimethoxysilane, N-2-aminoethyl-3-aminopropylmethyldiethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, vinyltrimethoxysilane and the like.

The composition may also contain a surfactant. By containing the surfactant, the appearance, particularly, voids due to fine bubbles, depressions due to adhesion of foreign matters and the like, and shrinkage in the drying step can be improved. The surfactant is not particularly limited, and known surfactants such as cationic, anionic, and nonionic surfactants can be used as desired.

The upper limit of the content of other components (components other than the binder component, the coloring matter, and the polymerization initiator) in the solid content of the composition may be preferably 10% by mass, more preferably 1% by mass, and still more preferably 0.1% by mass. The infrared transmittance can be further improved by reducing the content ratio of other components.

< Infrared ray transmitting film >

An infrared-transmitting film can be formed from the composition. The infrared-transmitting film is provided in an opening for infrared communication formed in a frame edge portion (frame) of the protective plate for a display device. The protective plate for a display device is a cover for protecting a screen of a display device such as a smartphone, and is provided on a surface of the screen. The protective plate is also referred to as a front panel or the like. The protective plate for a display device is not limited to the protective plate provided on the "front surface" of the display device. The protective plate has a transparent substrate; and a frame portion disposed on a peripheral edge portion of one surface of the transparent substrate. The frame portion (frame) is a member that protects the peripheral edge of a display device such as a display and also has a function of hiding wirings and the like. As for the protective plate for a display device, details will be described below.

The resin composition for forming an infrared-transmitting film of the present invention can be used as a filler for an opening (hole) formed in a rim. The composition may be used to form a coating film directly on the peripheral edge of a transparent substrate (cover glass) of a display device, and the infrared-transmitting film may be used as a frame edge (bezel). The composition for forming an infrared-transmitting film may be used to form an infrared-transmitting film and a frame portion (frame) together.

The infrared ray transmission film may be an unpatterned flat film or a patterned film (pattern).

In the infrared-transmitting film formed using the composition, it can be said that the effect of reducing visible light which becomes sensing noise is more excellent as the maximum transmittance at a wavelength of 400nm to 700nm corresponding to visible light is lower. Further, the infrared transmitting film is more synchronized with the frame portion. The maximum transmittance at a wavelength of 400nm to 700nm when an infrared ray transmitting film is formed is preferably 10% or less, more preferably 7% or less, and particularly preferably 5% or less. The infrared-transmitting film to be formed preferably has a near-infrared transmission band having a transmittance of 85% or more in a continuous wavelength region of 100nm or more in a near-infrared region having a wavelength of 801nm to 1100 nm. The maximum transmittance in the near-infrared transmission band is preferably 87% or more, and particularly preferably 90% or more. Further, it is preferable that the near infrared region at a shorter wavelength side of 701nm to 800nm has a light shielding region having a transmittance of 10% or less, and the light shielding region is particularly preferably a continuous wavelength region of 15nm or more. In the case of the infrared transmitting film having the above characteristics, it is possible to perform sensing with good sensitivity while suppressing noise when used for infrared communication.

< method for forming infrared ray transmitting film >

The method for forming an infrared-transmitting film according to an embodiment of the present invention includes the following steps (1) and (2).

(1) A step (2) of forming a coating film in an opening for infrared communication formed in a frame portion of a protective plate for a display device using the composition for forming an infrared-transmitting film, wherein the coating film is heated or exposed

[ step (1) ]

In the step (1), the composition for forming an infrared-transmitting film is applied to the inside of the opening for infrared communication formed in the rim portion of the protective plate for a display device, and the solvent is preferably removed by prebaking (prebake), thereby forming a coating film. Typically, the frame portion is formed on a transparent substrate. Therefore, the composition is applied to the surface of the transparent substrate to form a coating film. Examples of the transparent substrate used in step (1) include: glass substrates, silicon wafers, plastic substrates, and substrates having various metals formed on the surfaces of these substrates. Examples of the plastic substrate include substrates containing a plastic as a main component, such as Polyethylene Terephthalate (PET), polybutylene Terephthalate, polyethersulfone, polycarbonate, or polyimide.

As a method for applying the composition for forming an infrared transmission film, for example, a suitable method such as a spray method, a roll coating method, a spin coating method (spin coat) method, a slit die coating method, a bar coating method, a screen printing method, an ink jet method, and the like can be used. Among these coating methods, a spin coating method, a screen printing method, and an ink jet method are preferable. The pre-baking conditions vary depending on the kind and content ratio of the components contained in the infrared-transmitting film-forming composition, but may be, for example, about 30 seconds to 10 minutes at 60 ℃ to 100 ℃. The film thickness of the coating film is preferably 1 μm as the lower limit after the prebaking. The upper limit is preferably 30 μm, more preferably 20 μm, and still more preferably 10 μm.

[ (2) step ]

In the case of performing step (2) by exposure, for example, the coating film formed in step (1) is irradiated with radiation through a mask having a predetermined pattern. Examples of the radiation at this time include: ultraviolet rays, far ultraviolet rays, X-rays, charged particle beams, and the like. Further, the entire surface of the coating film may be exposed.

Examples of the ultraviolet rays include g rays (wavelength: 436nm) and i rays (wavelength: 365 nm). Examples of the far ultraviolet ray include KrF excimer laser and the like. Examples of the X-ray include synchrotron radiation. Examples of the charged particle beam include an electron beam. Of these radiations, ultraviolet rays are preferable, and among the ultraviolet rays, radiation including g rays and/or i rays is particularly preferable. The exposure amount is preferably, for example, 100J/m²Above, 10,000J/m²The following.

In the case of performing step (2) by heating, the coating film formed in step (1) is subjected to a heating and baking treatment (post-baking treatment) using a heating device such as a hot plate or an oven, thereby curing the coating film. The lower limit of the calcination temperature is preferably 120 ℃. On the other hand, the upper limit is preferably 200 ℃, more preferably 180 ℃, and still more preferably 150 ℃. The calcination time may vary depending on the type of heating equipment, and may be, for example, 5 minutes to 40 minutes when the heating treatment is performed on a hot plate, or 30 minutes to 80 minutes when the heating treatment is performed in an oven. In particular, it is preferably 30 minutes or less when the heat treatment is performed on a hot plate, and 60 minutes or less when the heat treatment is performed in an oven.

In the case where the step (2) is performed by exposure, the heating may be performed after the exposure. Further, development may be performed before heating as necessary to remove the irradiated portion of the radiation, thereby forming a desired pattern. As the developer used in the development treatment, an alkaline aqueous solution (alkaline developer) can be used. Examples of the base include: sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, diethylaminoethanol, di-n-propylamine, triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole, piperidine, 1, 8-diazabicyclo [5,4,0] -7-undecene, 1, 5-diazabicyclo [4,3,0] -5-nonane, and the like.

The developing solution may be an aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant to the alkaline aqueous solution, or a developing solution containing a small amount of various organic solvents in which the composition for forming an infrared-transmitting film is dissolved. In addition, as the developing solution, an organic solvent may be used. Further, as the developing method, for example, a liquid coating method, a dipping (dipping) method, a shaking dipping method, a shower method, or the like can be used.

Protective plate for display device

The protective plate for a display device of fig. 1 and 2 includes a transparent substrate 100; and a frame portion 110 disposed on a peripheral portion of one surface of the transparent substrate 100. An opening 130 for infrared communication is formed in the frame 110. An infrared ray transmitting film 120 is provided in the opening 130. That is, the infrared ray transmitting film 120 is laminated on the surface of the transparent substrate 100 where the opening 130 of the window portion for transmitting infrared rays is formed.

The protective plate for a display device is provided on the surface of a screen of a display device such as a smartphone. That is, the protective plate for a display device is a cover that protects the screen of the display device.

(transparent substrate)

The transparent substrate 100 is a substrate formed of a transparent material. Examples of the transparent substrate 100 include: glass substrates, silicon wafers, plastic substrates, substrates having various metals formed on the surfaces of these substrates, and the like. Examples of the plastic substrate include substrates containing a plastic as a main component, such as polyethylene terephthalate, polybutylene terephthalate, polyethersulfone, polycarbonate, or polyimide. As the transparent substrate 100, a glass substrate is preferable among these substrates.

The average thickness of the transparent substrate 100 is, for example, 0.1mm to 1.5 mm.

(rim part)

The frame 110 is disposed on the peripheral edge of one surface of the transparent substrate 100. The frame 110 serves to hide the peripheral wiring, and is usually black in most cases.

The black frame 110 usually contains black pigment and resin. As the black pigment, graphite and the like can be cited. Examples of the resin of the frame edge portion 110 include: acrylic resins, cycloolefin resins, polyimides, polyethers, polyester resins, polyurethane resins, and the like. The frame portion 110 can be formed by, for example, applying a resin composition containing resin and graphite to the surface of the transparent substrate 100 and heating the resin composition. Alternatively, the photosensitive resin composition may be coated and exposed to light and heated. In addition, the frame portion 110 separately manufactured may be laminated on the surface of the transparent substrate 100.

(opening part)

The opening 130 is a through hole formed in the rim 110. The opening 130 is provided in the infrared communication.

When the protective plate for a display device is disposed in the display device, the opening 130 is provided at a position facing the infrared communication unit of the display device. Examples of the shape of the opening 130 include a circular shape, an elliptical shape, and a rectangular shape. The size of the opening 130 is preferably 1mm or more and 10mm or less, more preferably 1mm or more and 5mm or less, and further preferably 2mm or more and 4mm or less, as the length of the oval shape, the major axis in the case of the circular shape, and the longitudinal or lateral length in the case of the rectangular shape.

(Infrared ray transmitting film)

The infrared ray transmitting film 120 is provided on the surface of the transparent substrate 100 in a region where the opening 130 is formed. The infrared ray transmitting film 120 is formed to fill the region of the opening 130. That is, the infrared ray transmitting film 120 covers a region of the surface of the transparent substrate 100 where the opening 130 is provided.

The infrared-transmitting film 120 is formed from the composition for forming an infrared-transmitting film according to one embodiment of the present invention. The infrared ray transmitting film 120 can be suitably formed by the method for forming an infrared ray transmitting film according to the above-described embodiment of the present invention.

The lower limit of the average thickness of the infrared-transmitting film 120 is preferably 1 μm, more preferably 3 μm, and still more preferably 5 μm. On the other hand, the upper limit of the average thickness is preferably 1,000 μm, more preferably 100 μm, and still more preferably 30 μm. When the average thickness of the infrared ray transmitting film 120 is within the above range, both the infrared ray transmittance and the visible light absorption can be achieved in a more favorable state.

The protective plate for a display device comprises an infrared-transmitting film 120 formed from the composition for forming an infrared-transmitting film, and the infrared-transmitting film 120 has good infrared-transmitting properties. The infrared-transmitting film 120 has low visible light transmittance and can synchronize with the color tone of the black frame portion 110. Therefore, the protective plate for a display device is also excellent in design.

The protective plate for a display device preferably further comprises a coating layer laminated on the infrared ray transmitting film. The coating layer is laminated on the upper surface (the surface opposite to the transparent substrate 100) of the infrared-transmitting film 120 in fig. 1 and 2, for example. Examples of the coating layer include an antireflection layer, an oxygen shielding layer, and an ultraviolet absorbing layer. The protective plate for a display device may have an intermediate layer between the transparent substrate 100 and the infrared-transmitting film 120 in fig. 1 and 2, for example. Examples of the intermediate layer include an ultraviolet absorbing layer.

(protective plate with antireflection layer)

The protective plate for a display device according to one embodiment of the present invention is a protective plate having a structure in which the protective plate for a display device of fig. 1 and 2 further includes an antireflection layer formed on the surface side (upper surface side) of the infrared-transmitting film 120 opposite to the transparent substrate 100. The antireflection layer is a layer that suppresses light reflection in the near infrared region. The anti-reflective layer is selected from an inorganic anti-reflective layer or an organic anti-reflective layer formed from a composition containing an organic binder.

The inorganic anti-reflective layer is, for example, a multilayer film of a plurality of metal oxides. The inorganic anti-reflection layer is formed by a vacuum deposition method, an ion-assisted deposition method, a sputtering method, or the like. The vapor deposition material used for vapor deposition for forming the inorganic anti-reflective layer is not particularly limited as long as it exhibits anti-reflective properties when a high refractive index material and a low refractive index material are laminated in appropriate film thicknesses, and it is preferable to use a metal oxide such as silicon oxide, aluminum oxide, magnesium oxide, zirconium oxide, titanium oxide, tantalum oxide, or niobium oxide, a metal fluoride such as magnesium fluoride, a metal sulfide such as zinc sulfide, or a mixture thereof as a material exhibiting particularly excellent anti-reflective properties.

The inorganic anti-reflective layer is generally formed by a dry plating method (PVD (Physical Vapor Deposition) method) such as a vacuum Deposition method (including an ion assist method), a sputtering method, an ion plating method, and an arc discharge method. One or more of the anti-reflective layers may be ion-assisted and deposited (film-formed). When a specific vapor deposited film is formed on an infrared-transmitting film, it is preferable to place the film in a vacuum vessel heated to less than 180 ℃ and introduce O into the film as needed₂Gas or air (air), adjusted to 5.0X 10 on one side^-1Pa～5.0×10^-3Heating under Pa pressure, and further using an ion gun while using O₂Gas, Ar gas or O₂The film formation was carried out while ion-supporting with the/Ar mixed gas.

When the specific vapor deposition film is formed on the infrared-transmitting film, the heating temperature in the vacuum vapor deposition chamber is preferably set to 25 to 180 ℃ (preferably 50to 120 ℃). By setting the temperature to 25 ℃ or higher, the density of the film after film formation can be increased, and sufficient film durability can be obtained. On the other hand, deterioration of the underlayer can be suppressed by setting the temperature to 180 ℃ or lower.

The resin used for the organic anti-reflective layer is not particularly limited as long as it exhibits anti-reflective properties in the near infrared region when laminated in an appropriate thickness, but a fluororesin is preferably used as the resin exhibiting particularly excellent anti-reflective properties. Such a fluororesin includes a compound having at least one polymerizable unsaturated double bond and at least one fluorine atom, and specific examples thereof include: (1) fluoroolefins such as tetrafluoroethylene, hexafluoropropylene, 3,3, 3-trifluoropropene, chlorotrifluoroethylene and the like; (2) alkyl perfluorovinyl ethers or alkoxyalkyl perfluorovinyl ethers; (3) perfluoro (alkyl vinyl ethers) such as perfluoro (methyl vinyl ether), perfluoro (ethyl vinyl ether), perfluoro (propyl vinyl ether), perfluoro (butyl vinyl ether), and perfluoro (isobutyl vinyl ether); (4) perfluoro (alkoxyalkyl vinyl ethers) such as perfluoro (propoxypropyl vinyl ether); (5) fluorine-containing (meth) acrylates such as trifluoroethyl (meth) acrylate, tetrafluoropropyl (meth) acrylate, octafluoropentyl (meth) acrylate, and heptadecafluorodecyl (meth) acrylate; other compounds. These compounds may be used alone or in combination of two or more. Specific examples of the coating material for forming an antireflection film include ostar (opsar) TU2205 marketed by JSR corporation.

In order to obtain an excellent antireflection effect, the antireflection layer is preferably an organic film containing particles. The particles are preferably hollow particles. That is, particles (preferably hollow particles) such as polysiloxane, hollow silica, magnesium fluoride, and fluororesin as a low refractive material can be uniformly mixed into a matrix component such as a resin for forming an antireflection layer.

The thickness of the anti-reflective layer is not particularly limited, and is usually about 80nm to 1,000nm, but it is preferably adjusted as appropriate depending on the application used. For example, the reflectance is generally adjusted to 80nm to 100nm in applications where importance is placed on the reflectance and the hue, and is generally adjusted to 90nm to 120nm in applications where importance is placed on the reflectance rather than the hue. In addition, in the application where the transmittance in the near infrared region is particularly important, the transmittance can be adjusted to 150nm to 1,000 nm.

The antireflection layer may contain, as other components, an ionizing radiation curing resin, organic particles, inorganic particles, a leveling agent, an antifoaming agent, a lubricant, an ultraviolet absorber, a light stabilizer, a polymerization inhibitor, a wetting dispersant, a rheology control agent, an antioxidant, an antifouling agent, an antistatic agent, a conductive agent, and the like, as long as the effects thereof are not impaired.

As a specific example of the material for forming the organic anti-reflective layer, a photocurable material containing a fluorine-based resin, metal oxide particles, hollow silica particles, a photocurable monomer, a photoinitiator, and the like is preferably used. Examples of the material for forming the organic anti-reflective layer include ostar (opsar) TU2361 manufactured by seikagawa chemical industry, inc.

(protective sheet with oxygen-Shielding layer)

The protective plate for a display device according to one embodiment of the present invention is a protective plate having a structure in which the protective plate for a display device of fig. 1 and 2 further includes an oxygen shielding layer formed on the surface side (upper surface side) of the infrared ray transmitting film 120 opposite to the transparent substrate 100. The oxygen-shielding layer may be inorganic or organic.

In the case of the inorganic oxygen barrier layer, the target material used for forming the inorganic oxygen barrier layer by vacuum deposition, ion-assisted deposition, sputtering or the like is not particularly limited as long as it exhibits a gas barrier property, and it is preferable to use a metal oxide such as silicon oxide, aluminum oxide, magnesium oxide, zirconium oxide, titanium oxide, tantalum oxide, or niobium oxide, a metal fluoride such as magnesium fluoride, a metal sulfide such as zinc sulfide, silicon nitride, or a mixture thereof as the target material exhibiting a particularly excellent oxygen barrier property.

In the case of the organic oxygen barrier layer, it can be formed by a coating method such as vacuum evaporation of an organic monomer or printing of an organic composition. Examples of the organic monomer for vacuum vapor deposition include a polyfunctional amine and a polyfunctional isocyanate monomer for vapor deposition polymerization. Examples of the coating material include Macseph (MAXIVE) manufactured by Mitsubishi Gas Chemical (Mitsubishi Gas Chemical).

The thickness of the oxygen shielding layer is not particularly limited, and is preferably 10nm to 1,000nm, for example.

(protective plate with ultraviolet ray absorption layer)

The protective plate for a display device according to one embodiment of the present invention is a protective plate having a structure in which the protective plate for a display device of fig. 1 and 2 further includes an ultraviolet absorbing layer formed on at least one surface side of the infrared transmitting film 120. That is, the ultraviolet absorbing layer may be formed on the front side (upper side in fig. 2) of the infrared transmitting film 120 or may be formed on the back side (lower side in fig. 2) of the infrared transmitting film 120 in the protective plate for display device in fig. 1 and 2.

The ultraviolet absorbing layer may be a material that absorbs ultraviolet rays, and in the case of an organic material, it is preferable to contain an ultraviolet absorber or a resin-side chain type ultraviolet absorbing polymer in the composition. For example, Harrussian Braid (registered trademark) UV-G13 manufactured by Japanese catalyst may be mentioned.

The thickness of the ultraviolet absorbing layer is not particularly limited, and is preferably 10nm to 100 μm, for example.

< display device >

A display device according to an embodiment of the present invention is a display device including the protective plate for a display device. In the protective plate provided in the display device, the infrared-ray transmitting film provided in the opening for infrared communication has high infrared-ray transmittance and low visible-light transmittance. Therefore, the opening for infrared communication is inconspicuous, and the design (appearance) is excellent.

The display device includes a display device main body and a protective plate for the display device. A known display device having a display function, such as a liquid crystal display device or a flat panel display, is used as the display device main body. In addition, the protective plate for the display panel is provided on the outermost surface to cover the display screen of the display apparatus main body.

The display device preferably includes an infrared communication unit. The infrared communication unit is provided at a position facing the opening for infrared communication in the protective plate for display device.

As the display device, specifically, there are mentioned: mobile phones including smart phones, portable information terminals, tablet computers, personal computers and monitors thereof, televisions, portable game machines, and the like.

Examples

The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to these examples at all. Unless otherwise specified, "part" in the description means "part by mass". The measurement methods of the respective physical property values are as follows. The number average molecular weight, weight average molecular weight, glass transition temperature, and logarithmic viscosity of the synthesized resin were measured by the methods described in the above embodiments.

< example 1 of resin Synthesis

An 8-methyl-8-methoxycarbonyltetracyclo [4.4.0.1 ] represented by the following formula (a)^2,5.1^7,10]100 parts of dodec-3-ene (hereinafter also referred to as "DNM"), 18 parts of 1-hexene (molecular weight modifier) and 300 parts of toluene (solvent for ring-opening polymerization) were charged in a reaction vessel purged with nitrogen, and the solution was heated to 80 ℃. Then, 0.2 part of a toluene solution of triethylaluminum (0.6mol/L) and 0.9 part of a toluene solution of methanol-modified tungsten hexachloride (concentration: 0.025mol/L) were added to the solution in the reaction vessel as polymerization catalysts, and the solution was heated and stirred at 80 ℃ for 3 hours to perform a ring-opening polymerization reaction, thereby obtaining a ring-opening polymer solution. The polymerization conversion in the polymerization reaction was 97%.

[ solution 18]

1000 parts of the ring-opened polymer solution obtained in the manner described above was charged into an autoclave, and 0.12 part of RuHCl (CO) [ P (C) was added to the ring-opened polymer solution₆H₅)₃]₃At a hydrogen pressure of 100kg/cm²And the reaction temperature was 165 ℃ and the mixture was stirred with heating for 3 hours to effect hydrogenation.

After the obtained reaction solution (hydrogenated polymer solution) was cooled, the pressure of hydrogen gas was released. The reaction solution was poured into a large amount of methanol, and then a coagulated product was separated and recovered, and dried to obtain a hydrogenated polymer (hereinafter also referred to as "resin a"). The obtained resin A had a number average molecular weight (Mn) of 32000, a weight average molecular weight (Mw) of 137000 and a glass transition temperature (Tg) of 165 ℃.

< example 2 of resin Synthesis

To a 3L four-necked flask were added 35.12g (0.253mol) of 2, 6-difluorobenzonitrile, 87.60g (0.250mol) of 9, 9-bis (4-hydroxyphenyl) fluorene, 41.46g (0.300mol) of potassium carbonate, 443g of N, N-dimethylacetamide (hereinafter, also referred to as "DMAc"), and 111g of toluene. Then, a thermometer, a stirrer, a three-way cock with a nitrogen inlet, a Dean-Stark tube, and a cooling tube were placed in the four-necked flask.

Then, after the flask was purged with nitrogen, the resulting solution was reacted at 140 ℃ for 3 hours, and the produced water was removed from the dean-stark tube as needed. At a point of time when no water generation was observed, the temperature was slowly raised to 160 ℃ and reacted at the temperature for 6 hours.

After cooling to room temperature (25 ℃), the formed salt was removed by filter paper, and the filtrate was put into methanol to reprecipitate, and the filtrate (residue) was separated by filtration. The resulting filtrate was vacuum-dried at 60 ℃ overnight to obtain a white powder (hereinafter also referred to as "resin B") (yield 95%). The obtained resin B had a number average molecular weight (Mn) of 75000, a weight average molecular weight (Mw) of 188000, and a glass transition temperature (Tg) of 285 ℃.

< example 3 of resin Synthesis

27.66g (0.08 mol) of 1, 4-bis (4-amino-. alpha.,. alpha. -dimethylbenzyl) benzene and 4,4' -bis (4-Aminophenoxy) biphenyl 7.38g (0.02 mol) was dissolved in 68.65g of γ -butyrolactone and 17.16g of N, N-dimethylacetamide. The resulting solution was cooled to 5 ℃ using an ice water bath, and 22.62g (0.1 mol) of 1,2,4, 5-cyclohexanetetracarboxylic dianhydride and 0.50g (0.005 mol) of triethylamine as an imidization catalyst were added together while maintaining the temperature at the same level. After the addition, the temperature was raised to 180 ℃ and the mixture was refluxed for 6 hours while distilling off the distillate as needed. After the reaction was completed, the reaction mixture was cooled with air until the internal temperature reached 100 ℃, and then 143.6g of N, N-dimethylacetamide was added to dilute the mixture, and the mixture was cooled while stirring, whereby 264.16g of a polyimide resin solution having a solid content of 20% by weight was obtained. A part of the polyimide resin solution was poured into 1L of methanol to precipitate polyimide. The polyimide separated by filtration was washed with methanol and then dried in a vacuum dryer at 100 ℃ for 24 hours to obtain a white powder (hereinafter also referred to as "resin C"). When the Infrared (IR) spectrum of the obtained resin C was measured, 1704cm was observed, which was unique to the imide group^-1、1770cm^-1Absorption of (2). The glass transition temperature (Tg) of resin C was 310 ℃ and the logarithmic viscosity was measured to be 0.87.

< example 4 of resin Synthesis

9.167kg (20.90 mol) of 9, 9-bis (4- (2-hydroxyethoxy) phenyl) fluorene, 4.585kg (20.084 mol) of bisphenol A, 9.000kg (42.01 mol) of diphenyl carbonate and 0.02066kg (2.459X 10 mol) of sodium bicarbonate were added^-4Moles) was added to a 50L reactor equipped with a stirrer and a distillation apparatus, and heated to 215 ℃ under 760Torr for 1 hour under a nitrogen atmosphere and stirred. Then, the degree of reduced pressure was adjusted to 150Torr for 15 minutes, and the reaction mixture was held at 215 ℃ and 150Torr for 20 minutes to perform the ester exchange reaction. Further, the temperature was raised to 240 ℃ at a rate of 37.5 ℃ C./Hr, and the mixture was held at 240 ℃ and 150Torr for 10 minutes. Then, the temperature was adjusted to 100Torr for 10 minutes, and the temperature was maintained at 240 ℃ and 120Torr for 70 minutes. Then, the temperature was adjusted to 100Torr for 10 minutes, and the temperature was maintained at 240 ℃ and 100Torr for 10 minutes. Further, the reaction mixture was stirred at 240 ℃ and 1Torr for 10 minutes to conduct polymerization reaction, with the temperature set to 1Torr or less for 40 minutes. Inverse directionAfter completion of the reaction, nitrogen gas was introduced into the reactor and pressurized, and the produced polycarbonate resin (hereinafter also referred to as "resin D") was taken out while being pelletized. The weight-average molecular weight of the obtained resin D was 41,000, and the glass transition temperature (Tg) was 152 ℃.

< example 5 of resin Synthesis

To a reactor, 0.8 mol of 9, 9-bis {4- (2-hydroxyethoxy) -3, 5-dimethylphenyl } fluorene, 2.2 mol of ethylene glycol and 1.0 mol of dimethyl isophthalate were added, and the mixture was gradually heated and melted with stirring to effect transesterification, followed by addition of 20X 10 parts of germanium oxide^-4While gradually raising the temperature and reducing the pressure until the temperature reaches 290 ℃ and the pressure is reduced to 1Torr or less, ethylene glycol is removed. Then, the contents were taken out from the reactor, and pellets of a polyester resin (hereinafter also referred to as "resin E") were obtained. The number average molecular weight of the resin E obtained was 40000 and the glass transition temperature was 145 ℃.

< example 6 of resin Synthesis

16.74 parts of 4,4' -bis (2,3,4,5, 6-pentafluorobenzoyl) diphenyl ether (BPDE), 10.5 parts of 9, 9-bis (4-Hydroxyphenyl) Fluorene (HF), 4.34 parts of potassium carbonate and 90 parts of DMAc were charged into a reactor equipped with a thermometer, a cooling tube, a gas introduction tube and a stirrer. The mixture was warmed to 80 ℃ and reacted for 8 hours. After the reaction was completed, the reaction solution was added to a 1% acetic acid aqueous solution while vigorously stirring the reaction solution with a stirrer. The precipitated reaction product was separated by filtration, washed with distilled water and methanol, and dried under reduced pressure to obtain a fluorinated polyether ketone (hereinafter also referred to as "resin F"). The number average molecular weight of the obtained resin F was 71000, and the glass transition temperature (Tg) was 242 ℃.

< example 7 of resin Synthesis

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2' -azobis- (2, 4-dimethylvaleronitrile) and 200 parts by mass of methyl 3-methoxypropionate were charged. Then, 30 parts by mass of glycidyl methacrylate and 70 parts by mass of styrene were charged and replaced with nitrogen, and then stirring was started slowly. The temperature of the solution was raised to 70 ℃, and the temperature was maintained for 5 hours, thereby obtaining a polymer solution (hereinafter, also referred to as "resin G") containing a copolymer. The number average molecular weight of the resulting resin G was 3500.

[ example 1]

(preparation of composition)

In a vessel, 100 parts by mass of the resin a obtained in synthesis example 1 as a binder component was dissolved in ethyl acetate to obtain a resin solution having a resin concentration of 8 mass%. Then, 2.2 parts by mass and 1.1 parts by mass of (C1-1) and (C2-1) of the pigment A, 2.1 parts by mass of (C4-1) of the pigment B, 1.4 parts by mass of (C6-1) of the pigment C and 1.5 parts by mass of the pigment C (C7-1) were added to the obtained resin solution, and tetrahydrofuran was further added thereto to dissolve the pigment A. Thus, an infrared-ray-transmitting film-forming composition (S-1) having a solid content concentration of 8.8% by mass and a viscosity of 26 mPasec (25 ℃) was obtained.

(formation of Infrared ray transmitting film)

The composition (S-1) for forming an infrared-transmitting film was applied to a smooth glass substrate, dried at 23 ℃ for 8 hours, and then the coated film was dried at50 ℃ under reduced pressure for 3 hours to obtain an infrared-transmitting film having a thickness of 10 μm.

Examples 2 to 14 and comparative examples 1to 4

An infrared ray-transmitting film was formed by preparing an infrared ray-transmitting film-forming composition in the same manner as in example 1, except that the binder component and the coloring matter were used in the kinds and amounts shown in tables 1to 2. In the case of the compositions (examples 10 to 12) comprising a compound having two or more polymerizable groups in one molecule and a photosensitizer, the entire surface of the coating film was exposed to light using an exposure machine ("MPA-600 FA" from canon corporation using an ultra-high pressure mercury lamp without a mask after drying, and an infrared-transmitting film was produced. In the case of the composition containing a compound having two or more polymerizable groups in one molecule and a polymerization initiator (examples 13 to 14), an infrared-transmitting film was produced by drying and then heating at 150 ℃ for 30 minutes.

The binder components, coloring matters, and polymerization initiators used in the examples and comparative examples are the following compounds.

(adhesive component)

A to G: resins A to G (transparent resins) obtained in resin Synthesis examples 1to 7

CS-1: kayarad (KAYARAD) DPHA (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate) from Japan Chemicals

CS-2: "Aron Oxetane (Aron Oxetane) OXT-191" (resin having two or more oxetanyl groups) of Toyo Synthesis

CS-3: dicidol diacrylate ester of Dicidol from Nomura chemical industries, Ltd

CS-4: "JER-828" (bisphenol A type epoxy resin) by Mitsubishi chemical corporation

CS-5: DIC corporation "Polylite OD-X-2585" (polyols)

CS-6: "Panoka (Bumock) D-750" (polyisocyanate) by DIC corporation

CS-7: mitsubishi Gas Chemical (Mitsubishi Gas Chemical) Co., Ltd. "trimellitic anhydride"

The following compounds were used as the dye a.

[ solution 19]

C1-1: a compound represented by the formula (C1-1) (maximum absorption wavelength 466nm)

C1-2: a compound represented by the formula (C1-2) (maximum absorption wavelength 472nm)

C1-3: a compound represented by the formula (C1-3) (maximum absorption wavelength of 475nm)

C2-1: a compound represented by the formula (C2-1) (maximum absorption wavelength 549nm)

C2-3: a compound represented by the formula (C2-3) (maximum absorption wavelength 551nm)

C3-2: a compound represented by the formula (C3-2) (maximum absorption wavelength 479nm)

The following compounds were used as the dye B.

[ solution 20]

C4-1: a compound represented by the formula (C4-1) (maximum absorption wavelength 604nm)

C4-2: a compound represented by the formula (C4-2) (maximum absorption wavelength 605nm)

C5-1: a compound represented by the formula (C5-1) (maximum absorption wavelength 644nm)

The following compounds were used as the dye C.

[ solution 21]

C6-1: a compound represented by the formula (C6-1) (maximum absorption wavelength 712nm)

C6-2: a compound represented by the formula (C6-2) (maximum absorption wavelength 704nm)

C6-3: a compound represented by the formula (C6-3) (maximum absorption wavelength 709nm)

C7-1: a compound represented by the formula (C7-1) (maximum absorption wavelength 738nm)

C7-3: a compound represented by the formula (C7-3) (maximum absorption wavelength 725nm)

As the polymerization initiator, the following compounds were used.

CT-1: radical polymerization initiator

"Yanjiaguo (IRGACURE) 819" (phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide) by BASF corporation

CT-2: cationic polymerization initiator

"NAI-105" (N- (trifluoromethylsulfonyloxy) -1, 8-naphthalimide) of Green chemical Co

CT-3: radical polymerization initiator

"Yanjiaguo (IRGACURE) PAG 121" ((5-p-toluenesulfonyloxyimino-5H-thiophen-2-ylidene) - (2-methylphenyl) acetonitrile) from BASF corporation

CT-4: epoxy-acid anhydride curing catalyst (thermal polymerization initiator)

"2E 4 MZ" (2-ethyl-4-methylimidazole) from four national chemical industries Co., Ltd

CT-5: carbamate reaction catalyst (thermal polymerization initiator)

Dibutyltin dilaurate from Co., Ltd "

EXAMPLE 15 production of laminate of glass substrate, Infrared ray-transmitting film and antireflection layer D-1

A dielectric multilayer film (total thickness of 250nm as a multilayer body) for preventing reflection of near infrared rays was formed as an antireflection layer D-1 on the same infrared ray-transmitting film as in example 14 at a deposition temperature of 100 ℃. The anti-reflection layer D-1 is made of silicon dioxide (SiO)₂: film thickness 240nm) layer and titanium dioxide (TiO)₂: film thickness 10nm) of 2 layers. Thus, a laminate in which the glass substrate, the infrared-transmitting film, and the antireflection layer D-1 were laminated in this order was obtained.

The dielectric multilayer film was designed as follows.

The thickness and number of layers of each layer are optimized by using optical Film design software (manufactured by Thin Film Center, inc.) of mclaud (Essential mechanical lens) in combination with the wavelength dependence of the refractive index of the substrate or the absorption characteristics of the infrared ray transmitting Film so as to achieve the anti-reflection performance in the near infrared region.

EXAMPLE 16 production of laminate of glass substrate, Infrared ray transmitting film and antireflection layer D-2

A coating-type low refractive index layer was formed as an organic anti-reflection layer (anti-reflection layer D-2) on the infrared ray-transmitting film in the same manner as in example 14. Thus, a laminate in which the glass substrate, the infrared-transmitting film, and the antireflection layer D-2 were laminated in this order was obtained.

The coating type low refractive index layer is formed by using an Osta (OPSTAR) TU2361 (trade name, manufactured by Mitsukawa chemical industries, Ltd., refractive index: 1.33, solid content: 10%) was formed into a thin film. Specifically, the coating type low refractive index layer is formed as follows. The ostar (opsar) TU2361 was diluted so that the solid concentration became 4%, to obtain a curable composition for a low refractive index layer. Further, as a diluting solvent, methyl isobutyl ketone (MIBK)/t-butyl alcohol/Propylene Glycol Monomethyl Ether Acetate (PGMEA) 40/25/35 (mass ratio) was used. The prepared curable composition for a low refractive index layer was applied to an infrared-transmitting film using a three-bar coater so that the cured film thickness became 230nm, dried in an oven at 80 ℃ for 1 minute, and then subjected to a high-pressure mercury lamp (600 mJ/cm) under a nitrogen flow²) The resultant was hardened to form an antireflection layer D-2.

EXAMPLE 17 production of laminate of glass substrate, Infrared ray-transmitting film and oxygen Shielding layer D-3

An oxygen-shielding inorganic deposited film [ alumina (Al) was formed on the same infrared-transmitting film as in example 14 at a deposition temperature of 100 ℃₂O₃: film thickness 100nm) as the oxygen shielding layer D-3. Thus, a laminate was obtained in which the glass substrate, the infrared ray-transmitting film, and the oxygen-shielding layer D-3 were sequentially laminated.

EXAMPLE 18 production of laminate of glass substrate, Infrared ray transmitting film and oxygen Shielding layer D-4

A coating type oxygen-shielding layer was formed as an oxygen-shielding layer D-4 on the same infrared-transmitting film as in example 14. Specifically, Michelia (MAXIVE) M-100/C-93 manufactured by Mitsubishi Gas chemistry (Mitsubishi Gas Chemical) was first mixed at a ratio of 5: 16 was diluted in isopropyl alcohol to prepare a composition having a solid content of 20%. The prepared composition was applied to an infrared-transmitting film using a triple bar coater in such a manner that the cured film thickness became 500 nm. Then, the resultant was dried in an oven at 80 ℃ for 1 minute and hardened in an oven at 100 ℃ for 30 minutes, thereby obtaining an oxygen-shielding layer D-4. Thus, a laminate was obtained in which the glass substrate, the infrared ray-transmitting film, and the oxygen-shielding layer D-4 were sequentially laminated.

EXAMPLE 19 preparation of laminate of glass substrate, ultraviolet absorbing layer D-5 and Infrared transmitting film

Before forming the infrared ray transmitting film on the glass substrate, the ultraviolet ray absorbing layer D-5 was formed. Specifically, first, an ultraviolet-cut coating agent (halohybrid UV-G13) produced by a japanese catalyst was applied using a triple bar coater so that the cured film thickness became 5000nm, and then dried in an oven at 80 ℃ for 10 minutes. Then, the cured product was cured in an oven at 150 ℃ for 30 minutes, thereby obtaining an ultraviolet absorbing layer D-5. An infrared-transmitting film similar to that of example 14 was formed on the ultraviolet-absorbing layer D-5. Thus, a laminate in which the glass substrate, the ultraviolet absorbing layer D-5 and the infrared transmitting film were laminated in this order was obtained.

< evaluation of transmittance of Infrared ray-transmitting film >

The infrared transmission films obtained in examples 1to 14 and comparative examples 1to 4 were subjected to spectral transmittance measurement using a glass substrate as an evaluation reference. That is, the internal transmittance of the infrared ray-transmitting film was measured. Based on the measurement results, the width of a wavelength region (hereinafter referred to as a wavelength region X) in which the maximum transmittance in the visible light region (400nm to 700nm) and the transmittance in the wavelength region from 701nm to 800nm are continuously 10% or less, and the maximum transmittance in the wavelength region from 801nm to 1100nm were obtained. The evaluation results are shown in tables 1to 2.

FIG. 3 shows the transmission spectrum of an infrared-transmitting film obtained by using the composition (S-1) for forming an infrared-transmitting film of example 1. It was confirmed that the infrared-transmitting film formed in the opening for infrared communication exhibited excellent characteristics, with a maximum transmittance in the visible light region (400nm to 700nm) of 4%, a width of the wavelength region X of 53nm, and a maximum transmittance in the wavelength region 801nm to 1100nm of 100%.

Tables 1to 2 show the difference in the maximum absorption wavelengths of the dye a and the dye B and the difference in the maximum absorption wavelengths of the dye B and the dye C. When two or more pigments a are used, the difference between the maximum absorption of the pigment a on the short wavelength side and the maximum absorption of the pigment B is shown, and when two or more pigments C are used, the difference between the maximum absorption of the pigment C on the long wavelength side and the maximum absorption of the pigment B is shown.

< evaluation of storage stability >

The viscosity (V) of each of the compositions for forming an infrared-transmitting film of examples 1to 14 and comparative examples 1to 4 was measured₁) Each of the infrared ray transmission film-forming compositions was placed in an oven at 40 ℃ for 1 week. Measuring the viscosity (V) after warming₂) The viscosity change rate (%) was calculated from the following formula and used as an index of storage stability.

Viscosity change rate (%) { (V)₂-V₁)/V₁}×100(％)

The viscosity change rate is measured as A: viscosity change rate less than 5%, B: viscosity change rate of 5% or more and less than 10%, C: the viscosity change rate was 10% or more, and the storage stability was evaluated as good in the case of A or B, and as poor in the case of C. The viscosity was measured at 25 ℃ using an E-type viscometer ("Viscocouc (VISCONIC) eld.r" by eastern industries. The evaluation results are shown in tables 1to 2.

< evaluation of Heat resistance >

The infrared-transmitting films (laminates of glass substrates and infrared-transmitting films) obtained in examples 1to 14 and comparative examples 1to 4 and the laminates obtained in examples 15 to 19 were measured for their average transmittances (average transmittances before heating) of 400nm to 700nm with reference to a glass substrate. Then, the plate was heated at 180 ℃ for 30 minutes with a hot plate, and the average transmittance (average transmittance after heating) of 400nm to 700nm was measured again. Heating was performed using a hot plate ("gigahot plate GEC-7050" by ASONE). The absolute value of the difference (%) between the average permeability (%) before heating and the average permeability (%) after heating (heat resistance) was evaluated according to the following criteria. The evaluation results are shown in tables 1to 3. Example 14 is shown in tables 1 and 3 for comparison.

A: less than 1 percent

B: more than 1 percent and less than 5 percent

C: more than 5 percent and less than 15 percent

D: over 15 percent

< evaluation of light resistance >

The infrared-transmitting films (laminates of glass substrates and infrared-transmitting films) obtained in examples 1to 14 and comparative examples 1to 4 and the laminates obtained in examples 15 to 19 were measured for their average transmittances (average transmittances before light irradiation) of 400nm to 700nm with reference to a glass substrate. Then, the film was irradiated with light at 60 ℃ for 100 hours using an ultraviolet fadeometer, and the average transmittance (average transmittance after light irradiation) of 400nm to 700nm was measured again. The light irradiation was carried out using an ultraviolet fadeometer ("ultraviolet fadeometer U48" manufactured by Suga Tester Co., Ltd.). The absolute value (light resistance) of the difference (%) between the average transmittance (%) before light irradiation and the average transmittance (%) after light irradiation was evaluated according to the following criteria. The evaluation results are shown in tables 1to 3.

A: less than 1 percent

B: more than 1 percent and less than 5 percent

C: more than 5 percent and less than 15 percent

D: over 15 percent

< evaluation of reflectance >

The lowest reflectance in the wavelength range of 900nm to 1000nm was measured for the infrared ray-transmitting film obtained in example 14 and the laminates obtained in examples 15 to 19. Specifically, first, in order to reduce the back surface reflectance, a black acrylic plate (manufactured by Mitsubishi Rayon) was bonded to the obtained infrared-transmitting film on the opposite side through a pressure-sensitive adhesive so as to have a thickness of 2.0mm, with a glass substrate interposed therebetween, to prepare a measurement sample. The reflectance of the measurement sample in the visible light region with regular reflection at5 ° was measured using a spectrophotometer U4100 (manufactured by Hitachi High-technologies). The evaluation results are shown in table 3.

From the results in tables 1to 2, it is understood that the infrared ray-transmitting films formed from the compositions for forming an infrared ray-transmitting film of the examples have a low transmittance in the visible light region and a high transmittance in the near infrared region. Further, from the results in tables 1to 3, it is understood that the heat resistance and the light resistance of each of the infrared ray-transmitting films and the laminates each formed from the composition for forming an infrared ray-transmitting film of the examples are also good.

Industrial applicability

The composition for forming an infrared-transmitting film of the present invention can be used for forming an infrared-transmitting film provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device.

Claims (16)

1. An infrared ray transmission film forming composition for forming an infrared ray transmission film which is provided in an opening for infrared communication formed in a rim portion of a protective plate for a display device and has a high transparency

The composition for forming an infrared-transmitting film comprises: a dye A having a maximum absorption in a wavelength range of 400nm to 580 nm; dye B having maximum absorption in a wavelength range of 581nm to 700 nm; and a dye C having a maximum absorption in a wavelength region of 701nm to 800nm, wherein

The difference between the maximum absorption wavelengths of the dye A and the dye B is 40nm to 200nm, and the difference between the maximum absorption wavelengths of the dye B and the dye C is 80nm to 200 nm.

2. The composition for forming an infrared-transmitting film according to claim 1, wherein the dye A is a xanthene-based compound, triarylmethane-based compound, cyanine-based compound, anthraquinone-based compound, tetraazaporphyrin-based compound, coumarine-based compound, indigo-based compound, or a combination thereof,

the pigment B is a squarylium compound, a triarylmethane compound, a cyanine compound, a phthalocyanine compound, a porphyrazine compound, or a combination thereof,

the pigment C is a squarylium compound, a cyanine compound, a phthalocyanine compound, a naphthalocyanine compound, a perylene compound, a krolonium compound, or a combination thereof.

3. The composition for forming an infrared-transmitting film according to claim 1, further comprising a binder component containing a transparent resin, a crosslinkable monomer, or a combination thereof.

4. The composition for forming an infrared-transmitting film according to claim 3, wherein the binder component comprises a compound having two or more polymerizable groups in one molecule.

5. The composition for forming an infrared-transmitting film according to claim 4, wherein the polymerizable group is an epoxy group, an alicyclic epoxy group, an acryl group, a methacryl group, a vinyl group, a hydroxyl group, a thiol group, an amino group, a carboxyl group, an acid anhydride group, an isocyanate group, or a combination thereof.

6. The composition for forming an infrared-transmitting film according to claim 1, further comprising a polymerization initiator.

7. The composition for forming an infrared-transmitting film according to claim 3, wherein the transparent resin is a cycloolefin-based resin, an aromatic polyether-based resin, a polyimide-based resin, a fluorene polycarbonate-based resin, a fluorene polyester-based resin, a polycarbonate-based resin, a polyamide-based resin, a polyarylate-based resin, a polysulfone-based resin, a polyethersulfone-based resin, a polyparaphenylene-based resin, a polyamideimide-based resin, a polyethylene naphthalate-based resin, a fluorinated aromatic polymer-based resin, an acrylic-based resin, a modified acrylic-based resin, an epoxy-based resin, an allyl-based curing resin, a polyester polyol-based resin, a polyether-based resin, a polyisocyanate-based resin, a polyamine-based resin, a urethane-based resin, a silsesquioxane-based ultraviolet curing resin, or a combination thereof.

8. The composition for forming an infrared-transmitting film according to claim 1, wherein the viscosity at 25 ℃ is in the range of 1to 2000 mPa-sec.

9. A method for forming an infrared-transmitting film, comprising the steps of (1) and (2) below:

(1) the step of forming a coating film in the opening for infrared communication formed in the rim portion of the protective plate for display device using the composition for forming an infrared-transmitting film according to any one of claims 1to 8

(2) And heating or exposing the coating film.

10. A protective plate for a display device, comprising a transparent substrate and a frame edge part provided on one surface side of the transparent substrate, wherein an opening part for infrared communication is formed in the frame edge part

The protective plate for a display device has an infrared ray transmitting film provided in the opening,

the infrared ray-transmitting film is formed from the composition for forming an infrared ray-transmitting film according to any one of claims 1to 8.

11. The protective plate for a display device according to claim 10, further comprising an antireflection layer formed on a surface side of the infrared-transmitting film opposite to the transparent substrate.

12. The protective plate for a display device according to claim 11, wherein the antireflection layer is a multilayer film of a plurality of metal oxides.

13. The protective plate for a display device according to claim 11, wherein the antireflection layer is an organic film containing hollow particles.

14. The protective plate for a display device according to any one of claims 10 to 13, further comprising an oxygen shielding layer formed on a surface side of the infrared-transmitting film opposite to the transparent substrate.

15. The protective plate for a display device according to any one of claims 10 to 13, further comprising an ultraviolet absorbing layer formed on at least one surface side of the infrared transmitting film.

16. A display device having the protective plate for a display device as claimed in any one of claims 10 to 15.

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