CN110887554A - Stress sheet assembly and engineering vehicle - Google Patents

Stress sheet assembly and engineering vehicle Download PDF

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Publication number
CN110887554A
CN110887554A CN201911216229.8A CN201911216229A CN110887554A CN 110887554 A CN110887554 A CN 110887554A CN 201911216229 A CN201911216229 A CN 201911216229A CN 110887554 A CN110887554 A CN 110887554A
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CN
China
Prior art keywords
stress
flexible
substrate layer
flexible substrate
axle
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Pending
Application number
CN201911216229.8A
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Chinese (zh)
Inventor
张立安
黄采枫
黄海柔
张佳俊
李安兵
张�浩
李榕晓
黄东辉
张佳敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGZHOU DOARON INFORMATION TECHNOLOGY Co.,Ltd.
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Guangdong Lianda Technology Co Ltd
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Application filed by Guangdong Lianda Technology Co Ltd filed Critical Guangdong Lianda Technology Co Ltd
Priority to CN201911216229.8A priority Critical patent/CN110887554A/en
Publication of CN110887554A publication Critical patent/CN110887554A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01GWEIGHING
    • G01G19/00Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
    • G01G19/08Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for incorporation in vehicles
    • G01G19/12Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for incorporation in vehicles having electrical weight-sensitive devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention provides a stress sheet assembly and an engineering vehicle, wherein the stress sheet assembly comprises a flexible substrate layer, a flexible circuit board is arranged above the flexible substrate layer, a stress sensor and an electric contact are formed on the flexible circuit board through etching, and a temperature sensor is also arranged on the flexible circuit board; a flexible heat-conducting adhesive layer is arranged above the flexible circuit board, a rigid connecting plate is arranged above the flexible heat-conducting adhesive layer, and a wire clamp is arranged on the rigid connecting plate. The engineering vehicle is provided with the stress sheet assembly. The stress sheet assembly can be firmly adhered to an axle of a vehicle.

Description

Stress sheet assembly and engineering vehicle
Technical Field
The invention relates to the field of weight measurement devices, in particular to a stress sheet assembly and an engineering vehicle with the same.
Background
Urban construction requires a large amount of civil works such as constructing roads, bridges, drilling tunnels, constructing houses, etc., the civil works require the use of a muck truck to transport construction materials such as soil, sand, etc., and a large amount of construction waste is generated during construction, which is required to be transported from a construction site to a designated landfill site for landfill treatment.
Generally, large trucks are used for transporting construction materials and construction wastes, and the overload phenomenon is more in the transportation process of the large trucks at present, so that the safety of the trucks and other vehicles and pedestrians on roads is seriously threatened, and therefore, the load capacity of the trucks needs to be monitored to reduce the overload phenomenon of the large trucks.
The method for monitoring the loading capacity of a large truck generally comprises the steps of setting a plurality of monitoring points on a road, and weighing the large truck when the truck passes through the monitoring points. However, this method is inefficient, requires a large number of monitoring points, and requires a large amount of manpower and material resources. Therefore, people install the weight sensor on the large truck, the load weight of the large truck is measured through the weight sensor on the large truck, the numerical value acquired by the weight sensor is uploaded to the preset background server in a wireless transmission mode, the load weight of the large trucks is monitored by the background server, real-time and remote monitoring is achieved, and needed manpower and material resources are few.
The weight sensor commonly used at present is a weight sensor with a stress sheet, and the stress sheet which can deform is arranged in the weight sensor. Generally, the weight sensor is fixed on a front axle, a middle axle and a rear axle of a large truck, when the load capacity of the truck changes, the front axle, the middle axle and the rear axle deform to a certain degree, for example, the front axle, the middle axle and the rear axle bend or the rear axle slightly lengthens, a stress sheet on the weight sensor is fixed on the rear axle, the change of the length of the rear axle can be detected, and the change of the load capacity of the large truck can be calculated according to the proportional relation between the length change of the front axle, the middle axle and the rear axle and the voltage output of the stress sheet.
Since the conventional weight sensor is usually fixed to a large truck by welding or screws, a large number of special tools, such as welding equipment, are usually required for the installation of the weight sensor, and the installation of the weight sensor needs to be performed in a vehicle maintenance factory, which results in high installation cost and low installation efficiency.
Moreover, because the stress sheet of the existing weight sensor is arranged on the harder circuit board, but because the working environment of the engineering vehicle is very severe, the stress sheet is easy to fall off from the axle, namely the problem that the weight sensor is not firmly bonded occurs. Once the weight sensor falls off, the load capacity of the engineering vehicle cannot be detected, and then monitoring of whether the engineering vehicle is overloaded or not is influenced.
Disclosure of Invention
A first object of the present invention is to provide a stress beam assembly that can be securely bonded to a work vehicle.
The second purpose of the invention is to provide an engineering vehicle which effectively avoids the stress sheet component from falling off.
In order to achieve the first purpose, the stress sheet assembly provided by the invention comprises a flexible substrate layer, a flexible circuit board is arranged above the flexible substrate layer, a stress sensor and an electric contact are formed on the flexible circuit board through etching, and a temperature sensor is further arranged on the flexible circuit board; a flexible heat-conducting adhesive layer is arranged above the flexible circuit board, a rigid connecting plate is arranged above the flexible heat-conducting adhesive layer, and a wire clamp is arranged on the rigid connecting plate.
According to the scheme, the stress sensor is etched on the flexible circuit board, and the flexible circuit board is formed on the flexible base material layer, so that when the stress sheet assembly is adhered to an axle of an engineering vehicle, the stress sheet assembly is not warped due to the fact that the stress sheet assembly is a rigid circuit board, and the stress sheet assembly can be effectively prevented from falling off from the axle.
In addition, the temperature sensor is formed on the flexible circuit board in an etching mode, the temperature sensor is used for detecting the ambient temperature of the stress piece assembly, the measured data of the stress sensor are compensated, and the influence of the temperature on the detection accuracy of the stress sensor is avoided, so that the detection accuracy of the weight of the engineering vehicle can be improved.
One preferred scheme is that the flexible substrate layer, the flexible heat-conducting glue layer and the rigid connecting plate are wrapped with the protective glue layer.
Therefore, the flexible substrate layer, the flexible heat-conducting glue layer and the rigid connecting plate are protected through the protective glue layer, the protective glue layer can have the effects of being waterproof, dustproof and impact-proof, on one hand, the accuracy of the stress sheet assembly on weight detection can be improved, and on the other hand, the service life of the stress sheet assembly can be prolonged.
The stress sensor comprises a plurality of grid wires, and a gold plating layer is formed on the surfaces of the grid wires.
Therefore, the thickness of the grid wire can be improved through the gold-plated layer, the cross section area of the grid wire is further increased, the fatigue resistance of the stress sensor is better, and the service life of the stress sheet assembly is prolonged.
Further, the corner of the grid wire is set to be arc-shaped. Therefore, when the stress sheet assembly works, the grid wire is bent and deformed for a long time, the situation of breakage is easy to occur, the turning part of the grid wire is set to be arc-shaped, and the situation that breakage is caused because the turning part of the grid wire is a right angle can be effectively avoided.
In a further aspect, the flexible substrate layer is made of modified phenolic or polyimide. Because modified phenolic aldehyde or polyimide have good ductility, and rigidity is less, can effectively avoid stress piece subassembly to bond the problem that drops easily behind the axle.
In a further scheme, at least one pair of side edges of the flexible base material layer are provided with symmetrical adhesive holes, and the open ends of the adhesive holes face outwards.
Therefore, the plurality of adhesive holes are formed in the flexible substrate layer, when the adhesive is filled into the adhesive holes, the flexible substrate layer is bonded on the axle and other workpieces, the adhesive filled in the adhesive holes can fix the flexible substrate layer, the flexible substrate layer is prevented from extending along one direction, deformation of the stress piece assembly in the direction is avoided, and stress of the stress piece assembly in the direction is reduced.
In order to achieve the second object, the invention provides an engineering vehicle, which comprises a vehicle chassis, wherein an axle is arranged on the vehicle chassis, and a stress sheet assembly is adhered to the axle; the stress sheet assembly is provided with a flexible substrate layer, the flexible substrate layer is bonded on the axle through a flexible adhesive, a flexible circuit board is arranged above the flexible substrate layer, a stress sensor and an electric contact are formed on the flexible circuit board through etching, and the electric contact is connected with a communication data line; a flexible heat-conducting adhesive layer is arranged above the flexible circuit board, a rigid connecting plate is arranged above the flexible heat-conducting adhesive layer, a wire clamp is arranged on the rigid connecting plate, and the wire clamp fixes the end of the communication data wire.
It can be seen by above-mentioned scheme that the stress sensor is direct to be etched on the flexible circuit board, and the flexible circuit board forms on flexible substrate layer, like this, when gluing stress piece subassembly to engineering vehicle's axle, can not lead to the situation of warping to appear between stress piece subassembly and the axle because stress piece subassembly is rigid circuit board, consequently can effectively avoid stress piece subassembly to drop from the axle.
Preferably, the surface of the flexible substrate layer close to the flexible adhesive is provided with frosted lines or corona treatment.
Therefore, the flexible substrate layer is subjected to frosting or corona treatment, the surface area of the flexible substrate layer close to the surface of one side of the axle can be increased, the adhesive force of the flexible adhesive is increased, and the stress sheet assembly can be better bonded on the axle.
The further scheme is that at least one limiting protrusion is arranged on the surface, close to the flexible adhesive, of the flexible base material layer.
Therefore, the distance between the flexible substrate layer and the axle can be limited through the limiting protrusion, so that the flexible adhesive is ensured to have enough filling space, the situation that the flexible adhesive between the flexible substrate layer and the axle is too little is avoided, and the stress sheet assembly can be better bonded on the axle.
More than two groups of stress sheet assemblies are arranged on the axle, and the stress sheet assemblies are symmetrically arranged on the axle along the axis of the axle; and a temperature sensor is arranged on the axle close to the stress sheet assembly.
Therefore, the stress sheet assemblies are symmetrically arranged on the axle, the weight change of the engineering vehicle is accurately reflected through the data of the stress sheet assemblies, and the situation that the load capacity of the engineering vehicle is determined only by the data of the stress sheet assemblies is avoided. Therefore, even if one group of stress sheet assemblies is damaged or abnormal detection is carried out, the overall weight detection of the engineering vehicle is not influenced. In addition, set up temperature sensor in stress piece subassembly department, can detect the ambient temperature at stress piece subassembly place through temperature sensor, and then compensate stress sensor's measured data, avoid influencing the accuracy that stress sensor detected because of the temperature.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the engineering vehicle.
Fig. 2 is a schematic structural diagram of another perspective of the engineering vehicle according to the embodiment of the invention.
Fig. 3 is a partial block diagram of a first embodiment of a stress riser assembly of the present invention and an axle.
Fig. 4 is a partial block diagram of another perspective view of the first embodiment of the stress riser assembly of the present invention and an axle.
Fig. 5 is a partially enlarged view of fig. 4.
Fig. 6 is an exploded view of the first embodiment of the stress riser assembly of the present invention.
Fig. 7 is a structural diagram of a flexible substrate layer and a flexible circuit board in the first embodiment of the stress sheet assembly of the present invention.
Fig. 8 is a block diagram of a second embodiment of a stress beam assembly and a communication data cable according to the present invention.
Fig. 9 is an exploded view of a second embodiment of a stress beam assembly according to the present invention with a protective adhesive layer hidden and a communication data line.
Fig. 10 is an exploded view of a flexible substrate layer and a flexible circuit board of a second embodiment of a stress beam assembly according to the present invention.
Fig. 11 is a structural diagram of a flexible substrate layer and a flexible circuit board in a second embodiment of the stress sheet assembly of the present invention.
Fig. 12 is a diagram of a flexible substrate layer in a second embodiment of a stress patch assembly of the present invention.
The invention is further explained with reference to the drawings and the embodiments.
Detailed Description
The first embodiment:
referring to fig. 1 and 2, the stress beam assembly of the present invention is mounted on a large truck or other engineering vehicle, such as a dump truck, which has a frame 10, preferably, a plurality of tires are disposed below the frame 10, and the frame 10 includes a chassis, a girder, a front axle, a middle axle, a rear axle, etc. of the dump truck. A cab 11 is provided at one end of the vehicle body frame 10, a driver's seat, a passenger seat, and a plurality of passenger seats are provided in the cab 11, and a plurality of control buttons for controlling the operation of the dump truck are provided in the cab 11.
A bucket 12 is also provided on frame 10, preferably bucket 12 is hinged to frame 10 at the end near the rear of the dump truck, and bucket 12 is connected to hydraulic rod 13 at the end near cab 11. One end of hydraulic stem 13 is fixed on frame 10, and the other end of hydraulic stem 13 and the bottom fixed connection of goods fill 12 will drive goods fill 12 and rotate when hydraulic stem 13 extends, and the one end that this moment goods fill 12 is close to driver's cabin 11 upwards rotates to dump the goods in goods fill 12 to the discharge position, if dump to ground or in the predetermined landfill hole.
Referring to fig. 3 to 5, two girders 17 are provided on the rear axle 14, and in the present embodiment, a stress sheet assembly 20 is provided on the rear axle 14. Preferably, two stress sheet assemblies 20 are arranged on the rear axle 14 along the length direction of the rear axle 14, and the two stress sheet assemblies 20 are symmetrically arranged on the rear axle 14. Of course, in practical applications, more stress sheet assemblies may be disposed on the engineering vehicle, for example, a stress sheet assembly is also disposed on the front axle, or two stress sheet assemblies are disposed on each of the front axle, the middle axle and the rear axle 14, so that six stress sheet assemblies are disposed on the engineering vehicle. The front axle, the middle axle and the rear axle of the embodiment are all axles of the engineering vehicle.
As shown in fig. 5, the stress sheet assembly 20 is installed near the stirrup 19, and in particular, may be installed on a side or a plane near the symmetrical position near the stirrup 19, which may be beneficial to reduce external stress interference and improve the measurement accuracy of the stress sheet assembly 20. Preferably, a temperature sensor (not shown) is further disposed near the stress blade assembly 20, and transmits the detected temperature to a control chip of the stress blade assembly 20, and the control chip of the stress blade assembly 20 compensates the detection data of the stress blade assembly 20 according to the temperature collected by the temperature sensor, so as to reduce the influence on the detection accuracy of the stress blade assembly 20 due to temperature change.
Referring to fig. 6, the stress sheet assembly 20 includes a flat flexible substrate layer 25, a flexible circuit board 30 is disposed above the flexible substrate layer 25, and a stress sensor is formed by etching on the flexible circuit board 30. A waterproof rubber sheet 21 is disposed above the flexible circuit board 30, and preferably, the waterproof rubber sheet 21 is made of vulcanized rubber. The flexible heat-conducting glue layer 40 is arranged above the waterproof glue film 21, the rigid connecting plate 45 is arranged above the flexible heat-conducting glue layer 40, the wire clamp 46 is arranged at one end of the rigid connecting plate 45, and the end part of the communication data wire 18 can be clamped in the wire clamp 46. Above the rigid connection plate 45, a magnet 48 is arranged, preferably the magnet 48 is a permanent magnet, which generates a constant magnetic field.
In addition, the flexible substrate layer 25, the flexible circuit board 30, the waterproof adhesive sheet 21, the heat conductive adhesive layer 40, the rigid connecting plate 45, and the magnet 48 are wrapped by a protective adhesive layer (not shown), which may be a soft protective adhesive, and is formed by curing, for example, silicon gel or the like. Because the silica gel is soft, the impact force of the outside on the stress piece assembly 20 can be buffered, and the stress piece assembly 20 is prevented from being damaged.
The flexible substrate layer 25 is made of modified phenolic aldehyde or polyimide, a plurality of adhesive holes 26 are formed in the flexible substrate layer 25, the plurality of adhesive holes 26 are symmetrically arranged at two ends of the flexible substrate layer 25 along the x-axis direction, and in the embodiment, the x-axis direction is the width direction of the flexible substrate layer 25. It can be seen from fig. 6 that, in the x-axis direction, two edges of flexible substrate layer 25 all are provided with three viscose hole 26, and each viscose hole 26 is semicircular through-hole, and the opening direction of viscose hole 26 is towards the outside of flexible substrate layer 25, and each viscose hole 26 all runs through the upper and lower surface of flexible substrate layer 25, and the opening end of each viscose hole 26 sets up outwards.
When flexible substrate layer 25 is fixed at rear axle 14, at the lower surface coating one deck flexible adhesive of flexible substrate layer 25, because a plurality of viscose hole 26 are the symmetry setting, like this when flexible adhesive coating to flexible substrate layer 25's lower surface after, flexible adhesive will fill in a plurality of viscose hole 26. When flexible substrate layer 25 bonds rear axle 14, because a plurality of viscose holes 26 all fill flexible adhesive, the flexible adhesive in a plurality of viscose holes 26 is symmetrical to flexible substrate layer 25's power of exerting along the x axle direction like this, avoids on flexible substrate layer 25 along the stress inhomogeneous in the x axle direction.
Preferably, the flexible substrate layer 25 is provided with a frosted line or a corona treatment layer on the surface close to the flexible adhesive, that is, a frosted line or a corona treatment layer is formed on the lower surface along the z-axis direction, so that the surface area of the lower surface of the flexible substrate layer 25 can be increased, the contact area with the flexible adhesive is increased, and the flexible substrate layer 25 is better bonded on the rear axle 14.
In order to ensure that enough flexible adhesive is formed between the flexible substrate layer 25 and the rear axle 14, a plurality of limiting protrusions are formed on the surface of the flexible substrate layer 25 close to the rear axle 14, preferably, the limiting protrusions all protrude downwards from the lower surface of the flexible substrate layer 25, and the height of each limiting protrusion is equal. In this way, by the limitation of the limiting protrusion, a sufficient gap can be ensured between the flexible substrate layer 25 and the rear axle 14, so that the flexible adhesive can be sufficiently filled between the flexible substrate layer 25 and the rear axle 14.
The glue holes 22 symmetrically arranged in the x-axis direction are also formed in the waterproof glue piece 21, so that on one hand, the waterproof glue piece 21 and the two edges of the flexible substrate layer 25 in the x-axis direction can be consistent, on the other hand, part of flexible adhesive can be bonded into the glue holes 22, and the waterproof glue piece 21 can be balanced in stress in the x-axis direction.
Referring to fig. 7, the stress sensor is formed on the flexible circuit board 30 by etching, and in this embodiment, the stress sensor includes a plurality of grid wires 31 extending along the x-axis direction and a plurality of grid wires 32 extending along the y-axis direction, and in this embodiment, the grid wires 32 are measurement grid wires, and the grid wires 31 are reference grid wires. When the rear axle 14 deforms, the length of the rear axle 14 in the y-axis direction changes, and thus the length of the grid wires 32 changes. However, the length of the grid wires 31 extending in the x-axis direction hardly changes, and therefore, the grid wires 31 may be used as reference grid wires for providing a reference value for measurement to ensure that the measurement grid wires perform measurement on the basis of a stable measurement reference value.
Preferably, the plurality of grid wires form four portions arranged in a matrix, two sets of grid wires 31 extending in the x-axis direction are located on one diagonal line, and two sets of grid wires 32 extending in the y-axis direction are located on the other diagonal line.
Preferably, a gold plating layer is formed on the surface of each grid wire 31 or each grid wire 32, so that the cross-sectional area of the grid wires 31 and 32 is increased by gold plating, which can increase the fatigue resistance of the grid wires, thereby avoiding the problem that the grid wires 31 and 32 are easily broken. In addition, the grid wires 31 and 32 are arranged in a serpentine shape, so that the ends of the grid wires at two adjacent ends are provided with connecting parts, and the connecting parts form a corner.
In addition, the stress chip assembly 20 is produced without grinding the reference grid wire 31, and only the surface of the measurement grid wire 32 is ground to ensure that the nominal value of the reference grid wire 31 is not changed. And after the grid wire is subjected to gold plating treatment, the problem of current increase caused by local thinning caused by polishing of the copper coating layer can be reduced, and the grid wire is prevented from being damaged due to temperature rise, uneven stress and the like.
Furthermore, a plurality of electrical contacts 33 are etched into the flexible printed circuit 30, and the plurality of electrical contacts 33 can be electrically connected to the grid wires 31, 32 for forming current signals. The flexible base material layer 25 is also provided with a plurality of electrical contacts 34, and the electrical contacts 34 and the electrical contacts 33 are electrically connected by wires 35. Preferably, the electrical contact 34 is directly connected to the communication data line 18, and transmits the data detected by the stress sensor to the communication data line 18, and further transmits the data collected by the stress sheet assembly 20 to a controller disposed in the cab through the communication data line 18, and then the controller transmits the collected data to a preset background server.
The heat conduction glue film 40 covers in the top of flexible substrate layer 25, it is preferred, the heat conduction glue film 40 is made by the silica gel material that the thermal conductivity is good, on the one hand can protect flexible substrate layer 25, on the other hand, when will stress piece subassembly 20 bonds to rear axle 14, owing to need exert certain heat to stress piece subassembly 20 so that flexible adhesive solidifies as early as possible in order to shorten the bonding time of stress piece subassembly 20, therefore, set up heat conduction glue film 40 and can be with the heat from last quick conduction to flexible adhesive down, be favorable to stress piece subassembly 20's bonding.
As can be seen from fig. 6, the thickness of the thermal adhesive layer 40 is larger, but the outer contour substantially conforms to the outer contour of the flexible substrate layer 25. A rigid connection plate 45 is disposed above the thermal conductive adhesive layer 40, the rigid connection plate 45 is made of a metal material, for example, a steel plate, a clip 46 is disposed at one end of the rigid connection plate 45, and one end of the communication data line 18 is clamped on the clip 46 to fix the end of the communication data line 18 and prevent the end of the communication data line 18 from being disconnected from the electrical contact 34.
Be provided with magnet 48 in the top of rigid connection board 45, can guarantee like this that can produce a invariable magnetic attraction between stress piece subassembly 20 and the rear axle 14 that the steel was made for stress piece subassembly 20's deformation can resume in the short time, and like this, after the engineering vehicle unloads, stress piece subassembly 20 can be quick detect the change of engineering vehicle weight, also provides the basis for subsequent weight capacity detection.
Second embodiment:
referring to fig. 8 and 9, the stress sheet assembly 60 of the present embodiment is electrically connected to the communication data line 51, and the stress sheet assembly 60 includes an outermost protective adhesive layer, which may be a soft silica gel. The stress sheet assembly 60 comprises a flexible substrate layer 61 and a flexible circuit board 70 arranged above the flexible substrate layer 61, a heat conducting adhesive layer 85 is arranged above the flexible circuit board 70, a rigid connecting plate 88 is formed above the heat conducting adhesive layer 85, a wire clamp 89 is arranged at one end of the rigid connecting plate 88, and the end of the communication connecting wire 51 is clamped in the wire clamp 89. In this embodiment, the flexible substrate layer 61, the flexible circuit board 70, the thermal conductive adhesive layer 85, and the rigid connection plate 88 are all wrapped by a protective adhesive layer.
Referring to fig. 10 and 11, the flexible substrate layer 61 is made of modified phenolic or polyimide, a plurality of adhesive holes 62 are formed in the flexible substrate layer 61, and the adhesive holes 62 are symmetrically disposed at two ends of the flexible substrate layer 61 in the width direction. When flexible substrate layer 61 is fixed at the rear axle, at the lower surface coating one deck flexible adhesive of flexible substrate layer 61, because a plurality of viscose hole 62 symmetries set up, can be so that flexible adhesive fills in a plurality of viscose hole 62. When flexible substrate layer 61 bonds the rear axle, because a plurality of viscose holes 62 all fill flexible adhesive, the flexible adhesive in a plurality of viscose holes 62 is to flexible substrate layer 61 power of exerting oneself like this along width direction symmetry, avoids on flexible substrate layer 61 along the uneven atress of width direction.
Preferably, the flexible substrate layer 61 is provided with a frosted line or a corona treatment layer on the surface close to the flexible adhesive, and, referring to fig. 12, a plurality of limiting protrusions 68 are formed on the surface of the flexible substrate layer 61 close to the rear axle, in this embodiment, the limiting protrusions 68 all protrude downward from the lower surface of the flexible substrate layer 61, and the height of each limiting protrusion 68 is equal. In this way, the position limit 68 of the position limit protrusion can ensure that a sufficient gap is formed between the flexible substrate layer 61 and the rear axle, so as to ensure that the flexible adhesive can be sufficiently filled between the flexible substrate layer 61 and the rear axle.
The flexible substrate layer 61 is formed with a stress sensor bonding area 64 and an interposer bonding area 65, the stress sheet contact plate 76 is bonded to the stress sensor bonding area 64, and the interposer 78 is bonded to the interposer bonding area 65. The stress blade contact plate 76 is provided with a plurality of electrical contacts 77, the adapter plate 78 is also provided with a plurality of electrical contacts 79, and the adapter plate 78 is electrically connected with the electrical contacts on the stress blade contact plate 76 through a plurality of metal wires 80.
The flexible circuit board 70 is disposed on the flexible substrate layer 61, specifically, above the stress sheet contact plate 76 and the interposer 78. Referring to fig. 10, the stress sensor 71 is formed on the flexible circuit board 70 by etching, and the stress sensor 71 includes a plurality of grid wires 72 extending in a length direction of the flexible circuit board 70 and a plurality of grid wires 73 extending in a width direction of the flexible circuit board 70, and preferably, the plurality of grid wires form four portions arranged in a matrix, two sets of grid wires 72 are located on one diagonal line, and two sets of grid wires 73 are located on the other diagonal line.
Preferably, a gold plating layer is formed on the surface of each grid wire 72 or each grid wire 73, so that the cross-sectional area of the grid wires 72 and 73 is increased by gold plating, and thus the fatigue resistance of the grid wires can be increased, and the problem that the grid wires 72 and 73 are easy to break is avoided. Specifically, the grid wires 72 are measurement grid wires, and the grid wires 73 are reference grid wires, so that only the grid wires 72 are ground, and not the grid wires 73 are ground.
In addition, when the grid wires 72 and 73 are bent, arc transition is used, namely, each grid wire adopts the design of arc transition at the bent position, so that the problem that the grid wires 72 and 73 are easy to break can be avoided. In addition, a plurality of electrical contacts 74 are etched into the flexible printed circuit board 70, and the plurality of electrical contacts 74 may be electrically connected to the grid wires 72, 73 for forming the current signals.
Different from the first embodiment, in the present embodiment, the flexible circuit board 70 is further etched to form a temperature sensor 75 for acquiring the temperature of the stress sensor 71, so that the stress sensor 60 can perform temperature compensation on the data acquired by the stress sensor 71 according to the temperature acquired by the temperature sensor 75, thereby improving the accuracy of detection.
The heat-conducting adhesive layer 85 covers the flexible circuit board 70, in this embodiment, a through hole 86 is formed in the middle of the heat-conducting adhesive layer 85, a heat-conducting adhesive block 87 is placed in the through hole, the heat-conducting adhesive block 87 is located above the grid wires 72 and the grid wires 73, and the property of the heat-conducting adhesive block 87 is softer than that of the heat-conducting adhesive layer 85, so that the grid wires 72 and the grid wires 73 are protected.
According to the invention, the stress sensor is directly etched on the flexible circuit board, the flexible circuit board is arranged on the flexible substrate layer, and the flexible substrate layer is bonded on the axle through the flexible adhesive, so that the stress sensor is not fixed on the axle through a rigid device, and thus, even if violent vibration occurs in the driving process of an engineering vehicle, the stress sheet assembly is not easy to fall off from the axle, and the bonding reliability of the stress sheet assembly is improved.
Of course, the above-mentioned embodiments are only preferred embodiments of the present invention, and many modifications may be made in practical applications, for example, the material used for the flexible substrate layer may be changed, or the specific location or number of the adhesive holes on the flexible substrate layer may be changed, or the specific type of the flexible adhesive used may be changed, and these changes do not affect the implementation of the present invention, and should be included in the protection scope of the present invention.

Claims (10)

1. A stress beam assembly, comprising:
the flexible circuit board is arranged above the flexible substrate layer, a stress sensor and an electric contact are formed on the flexible circuit board through etching, and a temperature sensor is further arranged on the flexible circuit board;
a flexible heat-conducting adhesive layer is arranged above the flexible circuit board, a rigid connecting plate is arranged above the flexible heat-conducting adhesive layer, and a wire clamp is arranged on the rigid connecting plate.
2. The stress riser assembly of claim 1, wherein:
the flexible substrate layer, flexible heat-conducting glue layer and rigid connection board parcel has the protection glue film outward.
3. The stress riser assembly of claim 1 or 2, wherein:
the stress sensor comprises a plurality of grid wires, and a gold-plated layer is formed on the surfaces of the grid wires.
4. The stress beam assembly of claim 3, wherein:
and the corners of the grid wires are arc-shaped.
5. The stress riser assembly of claim 1 or 2, wherein:
the flexible substrate layer is made of modified phenolic aldehyde or polyimide.
6. The stress riser assembly of claim 1 or 2, wherein:
at least one pair of sides of flexible substrate layer is provided with the viscose hole of symmetry, the open end in viscose hole is outside.
7. An industrial vehicle comprising:
the vehicle comprises a vehicle chassis, wherein an axle is arranged on the vehicle chassis, and a stress sheet assembly is bonded on the axle;
the method is characterized in that:
the stress sheet assembly is provided with a flexible substrate layer, the flexible substrate layer is bonded on the axle through a flexible adhesive, a flexible circuit board is arranged above the flexible substrate layer, a stress sensor and an electric contact are formed on the flexible circuit board through etching, and the electric contact is connected with a communication data line;
the flexible communication data line is characterized in that a flexible heat-conducting adhesive layer is arranged above the flexible circuit board, a rigid connecting plate is arranged above the flexible heat-conducting adhesive layer, a wire clamp is arranged on the rigid connecting plate, and the wire clamp fixes the end part of the communication data line.
8. The work vehicle of claim 7, wherein:
the flexible substrate layer is close to the surface of flexible adhesive is provided with frosted lines or a corona treatment layer.
9. The work vehicle of claim 8, wherein:
the surface of the flexible substrate layer close to the flexible adhesive is provided with at least one limiting protrusion.
10. The work vehicle according to any one of claims 7 to 9, characterized in that:
more than two groups of stress sheet assemblies are arranged on the axle, and the stress sheet assemblies are symmetrically arranged on the axle along the axis of the axle;
and a temperature sensor is arranged on the axle close to the stress sheet assembly.
CN201911216229.8A 2019-12-02 2019-12-02 Stress sheet assembly and engineering vehicle Pending CN110887554A (en)

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Application Number Priority Date Filing Date Title
CN201911216229.8A CN110887554A (en) 2019-12-02 2019-12-02 Stress sheet assembly and engineering vehicle

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Application Number Priority Date Filing Date Title
CN201911216229.8A CN110887554A (en) 2019-12-02 2019-12-02 Stress sheet assembly and engineering vehicle

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CN110887554A true CN110887554A (en) 2020-03-17

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CN201911216229.8A Pending CN110887554A (en) 2019-12-02 2019-12-02 Stress sheet assembly and engineering vehicle

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