CN110887025A - Cooling system, light source system and cooling method of light source system - Google Patents
Cooling system, light source system and cooling method of light source system Download PDFInfo
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- CN110887025A CN110887025A CN201811053267.1A CN201811053267A CN110887025A CN 110887025 A CN110887025 A CN 110887025A CN 201811053267 A CN201811053267 A CN 201811053267A CN 110887025 A CN110887025 A CN 110887025A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D15/00—Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor
- B01D15/02—Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor with moving adsorbents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
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Abstract
The embodiment of the invention provides a cooling system, a light source system and a cooling method of the light source system. According to the cooling system, the light source system and the cooling method of the light source system, the adsorption device is arranged, impurities formed in the cooling liquid can be adsorbed, the cooling effect of the cooling system is guaranteed, the service life of the cooling system is prolonged, and the replacement times of the cooling liquid are reduced.
Description
Technical Field
The invention relates to the technical field of liquid cooling, in particular to a cooling system, a light source system and a cooling method of the light source system.
Background
In the process of light source luminescence, a large amount of heat can be generated, and meanwhile, the use of the laser also has certain temperature requirements. Under given operating conditions, this heat must diffuse into the atmosphere at the same rate as the heat sink process, achieving a relative thermal equilibrium, maintaining a certain operating temperature of the light source system. The heat dissipation is mainly performed by the cooling system, so that the cooling system is an indispensable part of the whole light source and power supply system.
At present, the light source is cooled mainly by adopting a liquid cooling mode, and cooling liquid circulates in the whole cooling system in a flowing mode to play a cooling role. The cooling liquid is a heat transfer medium in the cooling system and has the functions of cooling, corrosion prevention, freezing prevention and the like. The most commonly used coolants, classified by base fluid type, are ethylene glycol coolants and propylene glycol coolants. The cooling liquid consists, for example, of water, antifreeze and other additives. Since water has a low freezing point, begins to freeze at temperatures below 0 ℃ and expands in volume, a certain amount of antifreeze is usually added to the coolant. The antifreeze is, for example, an organic lower alcohol which has a good freezing point depressing effect and is very compatible with water, such as ethylene glycol, propylene glycol, and the like. The coolant is usually added with a preservative, a buffer, an antiscalant, an antifoaming agent, a coloring agent, and the like. After the cooling liquid is used for a long time, the phenomena of poor flowing effect, low cooling effect and the like occur, and the cooling liquid needs to be replaced periodically, so that the application of a cooling system is severely restricted.
Disclosure of Invention
The present application is directed to a cooling system, a light source system and a cooling method of the light source system, so as to ensure a cooling effect and prolong a service life of the cooling system.
In a first aspect, an embodiment of the present application provides a cooling system, which includes a circulation pipeline and an adsorption device, where the circulation pipeline is used for circulating a cooling liquid, the adsorption device is disposed on a pipeline path of the circulation pipeline, and the cooling liquid contacts with the adsorption device in a flowing process of the circulation pipeline.
In some embodiments, the cooling system further includes a cooling device disposed on or in the circulation duct and cooling the cooling liquid flowing through the circulation duct.
In some embodiments, the circulation duct includes a cooling liquid supply device and a cooling circulation duct, the cooling circulation duct is in communication with the cooling liquid supply device, the cooling liquid circulates between the cooling circulation duct and the cooling liquid supply device, and the adsorption device is disposed on a duct path of the cooling circulation duct or within the cooling liquid supply device.
In some embodiments, the adsorption device includes a housing shell and an adsorbent, the adsorbent being disposed inside the shell, the shell being disposed on a pipe path of the circulation pipe.
In some embodiments, the circulation pipeline includes a cooling liquid supply device, a cooling circulation pipe and an adsorption circulation pipe, the cooling circulation pipe and the adsorption circulation pipe are respectively communicated with the cooling liquid supply device, the cooling liquid selectively circulates between the cooling circulation pipe and the cooling liquid supply device or between the adsorption circulation pipe and the cooling liquid supply device, and the adsorption device is arranged on a pipeline path of the adsorption circulation pipe or on the cooling liquid supply device.
In some embodiments, a heat exchanger is disposed on a pipe path of the cooling circulation pipe.
In some embodiments, the adsorption device comprises an adsorbent, which is a resin or activated carbon.
In some embodiments, the adsorption device includes a positive electrode plate and a negative electrode plate, the positive electrode plate and the negative electrode plate are oppositely disposed at an interval and are positioned in the circulation duct, and a passage for flowing the cooling liquid is formed between the positive electrode plate and the negative electrode plate.
In a second aspect, the present application provides a light source system, which includes a light source and the cooling system described above, where the cooling system is used to cool the light source.
In a third aspect, an embodiment of the present application provides a cooling method for a light source system, which is applied to the cooling system described above, and the method includes the following steps: the cooling liquid is made to flow in the circulation pipe and to contact with the adsorption device provided on the pipe path of the circulation pipe during the flow.
Compared with the prior art, the cooling system, the light source system and the cooling method of the light source system provided by the application can adsorb impurities formed in the cooling liquid by arranging the adsorption device, so that the cooling effect of the cooling system is ensured, the service life of the cooling system is prolonged, and the replacement frequency of the cooling liquid is reduced.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a cooling system provided in a first embodiment of the present application;
FIG. 2 is a schematic structural diagram of an adsorption apparatus according to a first embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a cooling system according to another embodiment provided in the first embodiment of the present application;
FIG. 4 is a schematic structural diagram of a cooling system provided in a second embodiment of the present application;
FIG. 5 is a schematic structural diagram of an adsorption apparatus according to a second embodiment of the present application;
FIG. 6 is a schematic structural diagram of a cooling system provided in a third embodiment of the present application;
FIG. 7 is a schematic structural diagram of a cooling system according to a fourth embodiment of the present application;
fig. 8 is a schematic structural diagram of a light source system according to a fifth embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "middle", "upper", "lower", "front", "back", "vertical", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The inventor finds that many components are contained in the cooling liquid, and the cooling liquid can contact the environment such as metal pipes or plastic pipes in a water cooling system, so that chemical instability is easily caused, wherein the components are easily reacted with some metal ions, cations and anions in the environment (such as metal walls, non-distilled water and the like) to cause deterioration. The refrigeration performance of the deteriorated water cooling liquid is reduced and even lost, and meanwhile, a plurality of corrosion products, water scales and the like generated by chemical reaction can cause pipeline blockage, so that the whole heat dissipation system is collapsed or the service life of the heat dissipation system is reduced. After impurities in the cooling liquid are formed, the cooling liquid must be replaced and the water cooling system must be cleaned at the same time, and the two measures have great defects. The water cooling liquid is replaced, which not only causes resource waste, but also causes environmental pollution. In the cleaning process, in order to prevent the cooling liquid impurity from blocking the water cooling system, each part needs to be detached and cleaned independently, and the cleaning agent has an erosion effect on various metals of the cooling system, so that the cleaning frequency of the cooling system needs to be reduced as much as possible. Therefore, the inventors propose a cooling system, a light source system and a cooling method of the light source system of the embodiments in the present application to overcome the above-mentioned drawbacks.
First embodiment
The present embodiment provides a cooling system 10a, the cooling system 10a comprising a circulation line 100a and an adsorption apparatus 200a, wherein the circulation line 100a comprises a cooling liquid supply apparatus 110a, a cooling circulation pipe 120a and an adsorption circulation pipe 130 a. Wherein, the circulation pipe 100a is used for circulating the cooling liquid. The adsorption device 200a is disposed on a pipe path of the circulation pipe 100a so that the adsorption device 200a can contact the cooling liquid while the cooling liquid circulates and adsorb impurities such as scale formed in the cooling liquid. It is understood that the cooling liquid may be, for example, water or organic lower alcohol.
Specifically, referring to fig. 1, the cooling liquid supply device 110a is a container having a relatively large capacity for containing the cooling liquid, and has a first communication port 111 and a second communication port 112, and the first communication port 111 and the second communication port 112 are used for communicating with the adsorption circulation tube 130a to form a flow circulation of the cooling liquid.
The adsorption circulation tube 130a includes a first tube 131 and a second tube 132, the first tube 131 is in communication with the first communication port 111, the second tube 132 is in communication with the second communication port 112, and in some embodiments, an end of the first tube 131 remote from the first communication port 111 may be in direct communication with an end of the second tube 132 remote from the second communication port 112. The first pipe 131 and the second pipe 132 are respectively provided with a valve 141a and a valve 141b, and the valve 141a and the valve 141b are used for controlling the connection or disconnection of the adsorption circulation pipe 130 a. Meanwhile, the adsorption circulation pipe 130a is further provided with a pump 150, and the pump 150 is driven by a driving motor to provide power for the circulation of the cooling liquid in the adsorption circulation pipe 130 a.
Referring to fig. 2, in the present embodiment, the adsorption device 200a includes a housing 201 and an adsorbent 205, wherein the housing 201 is a container having a volume, the adsorbent 205 is accommodated in the housing 201, the housing 201 is provided with an inlet 202 and an outlet 203, the inlet 202 is communicated with an end of the first pipe 131 far away from the first communication port 111, and the outlet 203 is communicated with an end of the second pipe 132 far away from the second communication port 112. The adsorption device 200a is disposed on the pipeline path of the circulation pipeline 100a, and after the cooling liquid enters the housing 201 from the inlet 202, the cooling liquid can contact and form contact with the adsorbent 205, so as to adsorb impurities in the cooling liquid.
In some embodiments, the adsorbent 205 may be selected from a resin or activated carbon, in this embodiment, the adsorbent 205 is a macroporous adsorbent resin, and the macroporous adsorbent resin is an organic polymer copolymer with a macroporous structure, which is a type of artificially synthesized organic polymer adsorbent 205. It has a porous structure and is adsorptive through surface adsorption, surface electrical property or hydrogen bond formation. The adsorbent 205 is selected, for example, in the form of spherical particles having a particle size of, for example, 20 to 60 mesh. The macroporous adsorption resin has adsorption selectivity, and can adsorb granular, suspended and flocculated impurities (such as scale, corrosion products and the like) formed in the cooling liquid without adsorbing additives (such as preservatives, buffering agents, scale inhibitors, defoaming agents, coloring agents and the like) added in the cooling liquid. The cooling effect of the cooling liquid can be ensured, and the difficulty in flowing of the cooling liquid caused by impurity accumulation is also avoided.
The ability of the adsorbent 205 to adsorb certain substances is primarily due to the fact that atomic force fields on the surface of the adsorbent 205 are not saturated and have surface energies, and thus can adsorb certain molecules to reduce the surface energy. Adsorption is an interfacial phenomenon, in which the concentration of solute at the surface of the adsorption resin is higher than the concentration of solute in the solvent after adsorption on the surface of the adsorption resin, resulting in heat release and decrease in free energy in the system, and adsorption is automatically performed at a given temperature and pressure.
In some embodiments, the adsorbent 205 may be disposed directly in the first pipe 131 and/or the second pipe 132, and the adsorbent 205 may be packed in a filter screen/bag to prevent the adsorbent 205 from flowing along with the coolant circulation and blocking the cooling system 10 a. I.e., no special housing 201 is required for holding the adsorbent 205. In order to enhance the adsorption effect, the adsorbent 205 is preferably distributed along the cross section of the flow path of the cooling liquid, so that the flowing cooling liquid can more completely contact with the adsorbent 205 to complete the adsorption.
The cooling circulation pipe 120a is a pipe for heat exchange with the outside, and a heat exchanger 170 is provided on a pipe path of the cooling circulation pipe 120a, and the heat exchanger 170 is used for heat exchange. In the present embodiment, the cooling circulation pipe 120a communicates with the cooling liquid supply device 110a so that the cooling liquid can circulate between the cooling liquid supply device 110a and the cooling circulation pipe 120 a. In the present embodiment, the cooling circulation pipe 120a and the adsorption circulation pipe 130a are independently communicated with the cooling liquid supply device 110a, so that the cooling liquid can selectively circulate between the cooling circulation pipe 120a and the cooling liquid supply device 110a or between the adsorption circulation pipe 130a and the cooling liquid supply device 110 a. Namely: the coolant may be circulated only between the coolant circulation pipe 120a and the coolant supply device 110a, or may be circulated only between the adsorption circulation pipe 130a and the coolant supply device 110 a. The cooling circulation pipe 120a is provided with a valve and a liquid pump for controlling the circulation flow of the cooling liquid in the cooling circulation pipe 120 a.
The working principle of the cooling system 10a provided in the present embodiment is: when the impurity adsorption is required, the valves 141a and 141b of the adsorption circulation pipe 130a are opened, the pump 150 is opened, the cooling liquid circulates in the adsorption circulation pipe 130a, and when the cooling liquid flows into the housing 201 of the adsorption apparatus 200a, the cooling liquid contacts the adsorbent 205, and the impurity adsorption is completed. The entire process may continue and be interrupted by controlling the pump 150 and closing of the valves. In some embodiments, a cyclic flow adsorption mode may be used, i.e., the coolant is adsorbed by contacting the adsorbent 205 during the flow. Or a static adsorption mode can be adopted, namely, the cooling liquid is injected into the shell 201, is discharged from the outlet 203 after being kept for a certain time, and is completely discharged, and then the inlet 202 is opened again to inject the cooling liquid for adsorption treatment.
In other embodiments, the adsorption device 200a may be directly installed inside the coolant supply device 110a to adsorb the adsorption liquid during the circulation of the coolant.
The amount and capacity of the adsorbent 205 are inversely proportional to the temperature, and the higher the temperature, the more unfavorable the adsorption. The adsorption capacity of the adsorbent 205 increases and the adsorption amount increases at low temperatures. The adsorbent 205 can function to the maximum extent by adsorbing at low or normal temperature. Meanwhile, under the condition of low temperature, impurities such as water scales, floccules and the like in the cooling liquid are easier to settle, and the complete filtration is facilitated.
Referring to fig. 1, in the present embodiment, a cooling device 160 is disposed on the adsorption circulation tube 130 a. The cooling device 160 serves to cool down the cooling fluid flowing through the adsorption circulation pipe 130 a. The cooling device 160 may be disposed inside the adsorption circulation pipe 130a, or may be directly disposed on the adsorption circulation pipe 130a and in contact with the adsorption circulation pipe 130 a. The cooling device 160 may be, for example, a condensation pipe, and the condensation pipe may be disposed outside the adsorption circulation pipe 130a in a spiral winding manner. In some embodiments, the cooling device 160 may be disposed on all or part of the adsorption circulation tube 130a, and only needs to cool the cooling liquid circulating in the adsorption circulation tube 130 a.
The cooled coolant may be better adsorbed when it contacts the adsorbent 205 due to the reduced temperature. Therefore, more preferably, the cooling device 160 may be disposed at a position close to the adsorption device 200 a.
Referring to fig. 3, the cooling device 160 may be directly disposed on the housing 201 of the adsorption device 200a and located outside the housing 201 to directly cool the adsorption device 200 a. In some embodiments, the cooling device 160 may also be disposed directly within the housing 201.
In the cooling systems 10a and 10a 'provided in this embodiment, by providing the adsorption device 200a, impurities in the cooling liquid can be adsorbed when the cooling system 10a is in use, so that the impurities are prevented from being blocked in the circulation pipe 100a, the service lives of the cooling systems 10a and 10 a' are prolonged, and the replacement frequency of the cooling liquid is reduced.
Second embodiment
The present embodiment provides a cooling system 10b, which is different from the cooling system 10a provided in the first embodiment in the structure of the adsorption device 200b, and the same parts can be referred to the first embodiment.
Specifically, referring to fig. 4, in the present embodiment, the circulation line 100b includes a cooling liquid supply device 110b, a cooling circulation pipe 120b, and an adsorption circulation pipe 130 b. The direct connection relationship of the cooling liquid supply device 110b, the cooling circulation pipe 120b, and the adsorption circulation pipe 130b is the same as that of the first embodiment. Referring to fig. 5, the adsorption apparatus 200b includes a housing 201, a positive electrode plate 221 and a negative electrode plate 222, wherein the positive electrode plate 221 and the negative electrode plate 222 are disposed in the housing 201, the positive electrode plate 221 and the negative electrode plate 222 are substantially in the shape of a plate, the positive electrode plate 221 and the negative electrode plate 222 are disposed at an interval, and the positive electrode plate 221 and the negative electrode plate 222 are both flat plates. The housing 201 has an inlet 202 and an outlet 203, and the inlet 202 and the outlet 203 are respectively connected to the pipeline paths of the adsorption circulation pipe 130 b. The positive electrode plate 221 and the negative electrode plate 222 are electrically connected to the positive electrode and the negative electrode of a power supply, respectively, wherein the power supply may be an external power supply or a separate power supply module (such as a storage battery). A certain gap is left between the positive electrode plate 221 and the negative electrode plate 222 and the case 201 to prevent electric leakage. It will be appreciated that the channels 204 and gaps may both be through which cooling fluid may pass. The positive electrode plates 221 and the negative electrode plates 222 form passages 204 therebetween, and the passages 204 allow a cooling liquid to flow. When the positive plate 221 and the negative plate 222 are connected, an electric field is formed in the channel 204.
In some embodiments, the positive electrode plate 221 and the negative electrode plate 222 may be directly disposed in the pipe of the adsorption circulation pipe 130b, and both the positive electrode plate 221 and the negative electrode plate 222 may be disposed as arc-shaped plates engaged with the inner wall of the adsorption circulation pipe 130b to increase the plate area of the positive electrode plate 221 and the negative electrode plate 222, increasing the probability of impurities flowing with the coolant being adsorbed. The positive electrode plate 221 and the negative electrode plate 222 are respectively attached to the inner wall of the circulation duct 100b, so that the distance between the positive electrode plate 221 and the negative electrode plate 222 can be increased, the cross-sectional area of the passage 204 can be increased, the flowing speed of the cooling liquid can be increased, and the adsorption effect can be improved.
In some embodiments, the circulation pipe 100b may be made of an insulating material such as plastic to isolate the power supply. In other embodiments, the circulation duct 100b may be made of a conductor such as metal, and in this case, an insulating material may be provided between the positive electrode plate 221 and the inner wall of the circulation duct 100b and between the negative electrode plate 222 and the inner wall of the circulation duct 100 b.
The working principle of the cooling system 10b provided in the present embodiment is: when the coolant passes through the passage 204, the coolant is subjected to an electric field formed by the positive electrode plate 221 and the negative electrode plate 222, so that the impurity particles having positive charges are adsorbed to the negative electrode plate 222 and the impurity particles having negative charges are adsorbed to the positive electrode plate 221. An electric double layer is formed on the surface of the electrode plate, and the charged particles are adsorbed and temporarily stored in the electric double layer. When the adsorption process reaches equilibrium, the electric field is removed or the power supply is reversely connected, and the ions adsorbed on the electrode return to the solution to achieve the purpose of desorption, so that the positive plate 221 and the negative plate 222 can be repeatedly used. Compared with the traditional deionization technology, the electro-adsorption technology has the advantages of multiple aspects: (1) the electro-adsorption technology has little pollution and high energy utilization rate, does not generate by-products in the whole process, and is environment-friendly; (2) the electric adsorption process is simple to operate; (3) the electro-adsorption technology has high utilization rate of resources, and can separate substances with low content and difficult separation by a conventional method.
Third embodiment
The present embodiment provides a cooling system 10c, which is different from the cooling system 10a provided in the first embodiment in the structure of the circulation duct 100c, and the same portions are referred to the first embodiment.
Referring to fig. 6, in the present embodiment, the cooling system 10c includes a circulation line 100c and an adsorption device 200c, and the circulation line 100c includes a cooling liquid supply device 110c and a cooling circulation line 120 c. The cooling circulation pipe 120c is provided with a heat exchanger 170, a pump 150, a valve 141a, a valve 141b, and a valve 141c, and the heat exchanger 170 is used for exchanging heat with the outside. The adsorption apparatus 200c is provided on the pipe path of the cooling circulation pipe 120 c.
The structure of the adsorption device 200c is the same as that of the adsorption device 200c in the first embodiment, and the specific structure thereof can be found in reference to the first embodiment. The adsorption device 200c communicates with the cooling circulation pipe 120c in the same manner as the adsorption device 200a communicates with the adsorption circulation pipe 130a in the first embodiment. It is understood that the adsorption apparatus 200c may be replaced with the adsorption apparatus 200b of the second embodiment.
In some embodiments, the adsorbent 205 may be directly contained in the filter bag or the filter net and disposed in the coolant supply device 110c for adsorption, and in this case, the cooling device 160 may be disposed outside the coolant supply device 110c to cool the coolant supply device 110c, so as to improve the adsorption effect.
In some other embodiments, the adsorption device 200c may be directly disposed inside the coolant supply device 110c to adsorb the coolant during the circulation of the coolant.
The working principle of the cooling system 10c provided in the present embodiment is: during the cooling cycle of the cooling circulation pipe 120c, the cooling liquid may contact the adsorbent 205 in the adsorption apparatus 200c to complete adsorption, and impurities generated in the cooling liquid may be removed. Compared with an adsorption circulating pipe which is arranged independently, the adsorption circulating pipe can save pipelines and occupied space, and greatly reduce cost.
Fourth embodiment
The present embodiment provides a cooling system 10d, which is different from the cooling system 10a provided in the first embodiment in the structure of the circulation duct 100d, and the same portions are referred to the first embodiment.
Specifically, referring to fig. 7, in the present embodiment, the cooling system 10d includes a circulation line 100d and an adsorption device 200d, and the circulation line 100d includes a cooling liquid supply device 110d, an adsorption circulation pipe 130d, and a cooling circulation pipe 120 d. The cooling circulation pipe 120d is communicated with the cooling liquid supply device 110d, both ends of the adsorption circulation pipe 130d are communicated with the cooling circulation pipe 120d, the adsorption device 200d is disposed on a pipe path of the adsorption circulation pipe 130d, and the heat exchanger 170 is disposed on a pipe path of the cooling circulation pipe 120 d.
Both ends of the cooling circulation tube 120d are connected to the cooling liquid supply device 110d for the cooling liquid to flow circularly and to exchange heat with the outside during the flow, both ends of the adsorption circulation tube 130d are connected to the cooling circulation tube 120d, and both ends of the adsorption circulation tube 130d are respectively provided with a valve 142c and a valve 142d, and the cooling circulation tube 120d is provided with a valve 142a and a valve 142 b. Meanwhile, the cooling circulation pipe 120d is provided with a pump 150, and the pump 150 is located between the communication of the cooling circulation pipe 120d with the cooling liquid supply device 110d and the communication with the adsorption circulation pipe 130d, so that the pump 150 can send the cooling liquid from the cooling liquid supply device 110d to the adsorption circulation pipe 130 d. Meanwhile, the valves 142a and 142b are disposed between two communication points of the cooling circulation pipe 120d and the adsorption circulation pipe 130d, so that the cooling liquid delivered by the pump 150 enters the adsorption circulation pipe 130d when the valves 142a and 142b are closed.
The working principle of the cooling system 10d provided in the present embodiment is: when heat exchange with the outside is required, the pump 150 is turned on, the valves 142a and 142b are opened, and the valves 142c and 142d are closed, and the cooling fluid circulates along the cooling circulation pipe 120d and exchanges heat with the outside at the heat exchanger 170. When the adsorption impurity removal is required, the valves 142a and 142b are closed, the valves 142c and 142d are opened, and the cooling liquid is pumped out from the cooling liquid supply device 110d by the pump 150 and then enters the adsorption circulation pipe 130d through the cooling circulation pipe 120d, but does not pass through the heat exchanger 170 any more, so as to form a circulation flow.
Compared with the case where the adsorption circulation pipe 130d is separately provided, the two ends of the adsorption circulation pipe 130d are connected to the cooling circulation pipe 120d, so that the piping materials can be saved, and the space occupied by only providing one circulation pump 150 can be reduced.
In some other embodiments, the adsorption device 200d may be directly disposed inside the coolant supply device 110d to adsorb the coolant during the circulation of the coolant.
Fifth embodiment
Referring to fig. 8, the present embodiment provides a light source system 20, the light source system 20 includes a light source 210 and a cooling system 10c, wherein the cooling system 10c is used for cooling the light source 210. Specifically, referring to fig. 8, the cooling system employs a cooling system 10c provided in a third embodiment, and the specific structure thereof is referred to the third embodiment.
The light source 210 includes a color wheel, a red light source, a blue light source, and a green light source (not shown), a color wheel heat exchanger 211, a red light liquid cooling plate 212, a blue light liquid cooling plate 213, and a green light liquid cooling plate 214, wherein the color wheel heat exchanger 211, the red light liquid cooling plate 212, the blue light liquid cooling plate 213, and the green light liquid cooling plate 214 respectively correspond to the color wheel, the red light source, the blue light source, and the green light source.
The heat exchanger 170 is disposed on a pipeline path of the cooling circulation pipe 120c, wherein the color wheel heat exchanger 211, the red light liquid cooling plate 212, the blue light liquid cooling plate 213, and the green light liquid cooling plate 214 are matched with the heat exchanger 170 and perform heat exchange with each other, and when the cooling liquid circulates in the cooling circulation pipe 120c, heat generated by the color wheel, the red light source, the blue light source, and the green light source is taken away.
Meanwhile, during the flowing process of the cooling liquid, the cooling liquid contacts with the adsorbent 205 in the adsorption device 200c to remove impurities in the cooling liquid, so that the replacement period of the cooling liquid is prolonged. The light source system 20 provided by the embodiment does not need to change the cooling liquid frequently due to the cooling system 10c with the adsorption device 200c, and meanwhile, the service life of the light source system 20 is prolonged due to the fact that the content of impurities in the cooling liquid is low, and the cooling effect is better.
It is to be understood that the cooling system 10c in the present embodiment may be replaced with the cooling systems 10a, 10b, and 10d provided in the above-described embodiments.
With the light source system 20, the present embodiment further provides a cooling method for a light source system, which includes the following steps:
the coolant is made to flow through the circulation duct 100c of the light source system 20, and during the flow, the coolant is brought into contact with the adsorption device 200c provided on the pipe path of the circulation duct 100c, thereby removing impurities in the coolant.
When the adsorbent 205 is used for removing impurities, if the flow rate is too low, the adsorption is slow; too fast a flow rate will not complete the adsorption process and the adsorbent will not function well. In some embodiments, when the cooling system is a system for removing impurities by external circulation, such as 10a, 10b, the flow rate of the cooling liquid in the cooling operation of the light source system 20 is, for example, S, and preferably, the flow rate of the cooling liquid is preferably 6 to 8 times that of S.
The cooling method of the light source system can prolong the service life of the light source system and reduce the frequency of replacing the cooling liquid.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A cooling system, comprising:
the circulating pipeline is used for circulating the cooling liquid; and
and the adsorption device is arranged on a pipeline path of the circulating pipeline, and the cooling liquid is in contact with the adsorption device in the flowing process of the circulating pipeline.
2. The cooling system according to claim 1, further comprising a cooling device that is provided on or in the circulation duct and cools down the cooling liquid flowing through the circulation duct.
3. The cooling system according to claim 1, wherein the circulation duct includes a cooling liquid supply device and a cooling circulation pipe, the cooling circulation pipe is communicated with the cooling liquid supply device, the cooling liquid circulates between the cooling circulation pipe and the cooling liquid supply device, and the adsorption device is provided on a pipe path of the cooling circulation pipe or in the cooling liquid supply device.
4. The cooling system according to claim 1, wherein the adsorption device includes a housing case, and an adsorbent provided inside the case, the case being provided on a pipe path of the circulation pipe.
5. The cooling system according to claim 1, wherein the circulation line includes a cooling liquid supply device, a cooling circulation line, and an adsorption circulation line, the cooling circulation line and the adsorption circulation line being respectively communicated with the cooling liquid supply device, the cooling liquid selectively flowing between the cooling circulation line and the cooling liquid supply device or circulating between the adsorption circulation line and the cooling liquid supply device, the adsorption device being provided on a line path of the adsorption circulation line or in the cooling liquid supply device.
6. The cooling system according to claim 3, wherein a heat exchanger is provided on a pipe path of the cooling circulation pipe.
7. The cooling system according to any one of claims 1 to 6, wherein the adsorption device comprises an adsorbent, the adsorbent being a resin or activated carbon.
8. A cooling system according to any one of claims 1 to 6, wherein the adsorption means comprises positive and negative electrode plates disposed in spaced opposed relationship within the circulation duct, the positive and negative electrode plates defining a passage therebetween for the flow of cooling fluid.
9. A light source system, comprising:
a light source; and
the cooling system of any one of claims 1-8, wherein the cooling system is configured to cool the light source.
10. A method for cooling a light source, applied to the cooling system as claimed in claim 9, wherein the method comprises the following steps:
the cooling liquid is made to flow in the circulation pipe and is brought into contact with the adsorption device provided on the pipe path of the circulation pipe during the flow.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811053267.1A CN110887025A (en) | 2018-09-10 | 2018-09-10 | Cooling system, light source system and cooling method of light source system |
| PCT/CN2019/086936 WO2020052258A1 (en) | 2018-09-10 | 2019-05-15 | Cooling system, light source system, and cooling method for light source system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811053267.1A CN110887025A (en) | 2018-09-10 | 2018-09-10 | Cooling system, light source system and cooling method of light source system |
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| CN110887025A true CN110887025A (en) | 2020-03-17 |
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| CN201811053267.1A Pending CN110887025A (en) | 2018-09-10 | 2018-09-10 | Cooling system, light source system and cooling method of light source system |
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| CN (1) | CN110887025A (en) |
| WO (1) | WO2020052258A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021208825A1 (en) * | 2020-04-14 | 2021-10-21 | 深圳光峰科技股份有限公司 | Photoelectric device provided with anti-contamination appartus |
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