CN110883888A - Bamboo board preparation process - Google Patents
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- CN110883888A CN110883888A CN201911068290.2A CN201911068290A CN110883888A CN 110883888 A CN110883888 A CN 110883888A CN 201911068290 A CN201911068290 A CN 201911068290A CN 110883888 A CN110883888 A CN 110883888A
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- 235000017166 Bambusa arundinacea Nutrition 0.000 title claims abstract description 237
- 235000017491 Bambusa tulda Nutrition 0.000 title claims abstract description 237
- 241001330002 Bambuseae Species 0.000 title claims abstract description 237
- 235000015334 Phyllostachys viridis Nutrition 0.000 title claims abstract description 237
- 239000011425 bamboo Substances 0.000 title claims abstract description 237
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 61
- 238000009966 trimming Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000011093 chipboard Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 230000009194 climbing Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 17
- 230000000694 effects Effects 0.000 description 5
- 238000002224 dissection Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27J—MECHANICAL WORKING OF CANE, CORK, OR SIMILAR MATERIALS
- B27J1/00—Mechanical working of cane or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27C—PLANING, DRILLING, MILLING, TURNING OR UNIVERSAL MACHINES FOR WOOD OR SIMILAR MATERIAL
- B27C1/00—Machines for producing flat surfaces, e.g. by rotary cutters; Equipment therefor
Abstract
A bamboo board preparation process comprises the following steps: cutting, namely identifying bamboo joints by arranging a camera on the cutting machine so as to execute avoiding operation; breaking bamboo, detecting the wall thickness of the cut bamboo tube after cutting, and judging whether the wall thickness of the cut bamboo tube is qualified or not; and (3) planing, namely detecting whether the thickness of the bamboo chips is qualified through a camera, performing planing operation by a planing machine after the thickness of the bamboo chips is qualified, performing planing operation on the upper surface and the lower surface of the bamboo chips until the target thickness is reached through three groups of upper and lower paired planing tool sets, and sequentially performing corner cutting, distance fixing and trimming operation on the bamboo chips by the three groups of planing tool sets to obtain the final bamboo board. The invention applies the advanced machine vision technology to the traditional bamboo board process, can be suitable for respectively judging whether bamboo joints exist or not, whether the wall thickness of a bamboo tube is qualified or not and whether the thickness of bamboo chips after bamboo breaking is qualified or not before cutting, bamboo breaking and planing off of the bamboo board process, can realize full-automatic operation and has high process efficiency.
Description
Technical Field
The invention relates to the field of bamboo boards, in particular to a bamboo board preparation process.
Background
The bamboo board has the advantages of small water absorption expansion coefficient, no crack, no deformation and the like, and is widely applied due to the excellent physical properties of the bamboo board. In the preparation process of the bamboo board, at least three main processes of cutting, breaking bamboo and planing are included, although the bamboo board industry develops for decades, the automation degree is still not high, and the production efficiency is low.
The main reasons for restricting the improvement of the efficiency include the following points: firstly, in the cutting stage, the existence of bamboo joints can influence the cutting quality, the prior art cannot automatically identify and avoid the bamboo joints, in the identification and avoidance of the bamboo joints, how to ensure the equal length of a cut bamboo tube is still the technical bottleneck of the current development, meanwhile, the wall thickness of the cut bamboo tube is gradually reduced from the root to the top, and how to select the bamboo tube with qualified wall thickness to enter the subsequent process is also a technical problem; secondly, in the bamboo breaking stage, due to the characteristics of the growth environment of the bamboo tube, the time duration of the sun and the sunlight receiving time duration at the shady part of the bamboo tube are different, the growth trends are different, the wall thickness of the bamboo tube is also uneven, and how to remove the bamboo chips with unqualified thickness after bamboo breaking is realized, so that the problem that the thickness of the bamboo chips entering the subsequent planing process is up to the standard is also solved urgently at present; third, in the removing stage, most of the prior removing machines only correspond to one removing amount, or must be manually adjusted to a certain removing amount, so that the single machine cannot be automatically adjusted to correspond to multiple or any removing amount within a certain range.
Therefore, the invention provides a bamboo board preparation process, and the defects of the prior art are overcome.
Disclosure of Invention
In light of the problems set forth in the background of the invention, the present invention provides a bamboo panel manufacturing process, which is further described below.
A bamboo board preparation process comprises the following steps:
cutting, namely identifying bamboo joints by arranging a camera on a cutting machine, further executing an avoiding operation, wherein one end of a bamboo clamped by a pushing mechanism is pushed forward to a preset position, the camera identifies whether the bamboo joints exist at the cutting position, if so, the avoiding operation is executed, and if not, the cutting operation is directly executed;
breaking bamboo, detecting the wall thickness of the cut bamboo tube after cutting, judging whether the wall thickness of the cut bamboo tube is qualified or not, if so, pushing one end of the bamboo tube clamped by a clamping mechanism to a cutting knife, planing the bamboo tube into bamboo chips with equal width by the cutting knife, and otherwise, rejecting the bamboo tube;
and (3) planing, namely detecting whether the thickness of the bamboo chips is qualified through a camera, performing planing operation by a planing machine after the thickness of the bamboo chips is qualified, performing planing operation on the upper surface and the lower surface of the bamboo chips until the target thickness is reached through three groups of upper and lower paired planing tool sets, and sequentially performing corner cutting, distance fixing and trimming operation on the bamboo chips by the three groups of planing tool sets to obtain the final bamboo board.
Further, in the cutting step, after the bamboo tube is scanned by the camera, whether bamboo joints exist is judged, if not, the control center controls the cutting machine to cut the bamboo tube, and if so, the control center controls the cutting machine to cut the bamboo tube: control center control advancing mechanism rolls back, rolls back and makes the terminal surface of thick bamboo tube expose the saw sword certain distance of cutting machine, and rethread camera scanning whether has the bamboo joint this moment, if exist, impels the certain distance forward with the bamboo, avoids the bamboo joint to accomplish dodging to the terminal surface bamboo joint, and control center control cutting machine is decided the bamboo, if do not exist, control center control cutting machine is direct to cut the bamboo.
Further, the wall thickness of the cut bamboo tube is detected before the bamboo breaking operation, the end face of the bamboo tube is scanned by a camera, the wall thickness of the tube wall is h-d-r, the wall thickness is displayed by a control center through machine vision, the outer diameter d and the inner diameter r of the end face of the bamboo tube are scanned by specific software, whether the wall thickness is required by a target or not is judged according to the difference value of the outer diameter and the inner diameter, and the thickness h determined by the target is determined0The wall thickness h of the cylinder wall is more than h0+δ0To pass, said delta0The surplus of the planing is reserved.
Further, before the step of removing, a camera detects whether the thickness of the bamboo chips is qualified, the camera scans the side walls of the bamboo chips, the side walls are displayed on a display through machine vision, the thickness h of the bamboo chips is scanned through specific software, and the thickness h determined for determining a target is determined0The wall thickness h of the cylinder wall is more than h0+δ0The product is qualified.
Furthermore, the planing machine used for planing operation comprises three planing tool sets, a platform and a jacking mechanism, wherein any planing tool set comprises an upper planing tool set and a lower planing tool set, the platform is arranged between the planing tool sets and on two sides of the planing tool sets, and the platform is connected with the jacking mechanism; the planer tool group pair and the jacking mechanism are connected with the control center.
Further, the planing quantities of the three planing blade group pairs are different, and the executed operation specifically includes:
the first planer tool group carries out chamfering operation on the bamboo chips with irregular cross sections, and the thickness of the planed bamboo chips is still larger than the target amount;
spacing, wherein the second planer tool set performs spacing operation on the bamboo chips subjected to chamfering, and the vertical distance of the second planer tool set is the thickness value of the target bamboo chip;
and trimming, namely trimming the bamboo chips which are trimmed at fixed intervals by the third planer tool set to obtain the finally required bamboo chip board.
Further, the planer tool passes through the flat band with the motor and is connected, adopts the flat band to replace current flat angle area, and simultaneously, the diameter of planer tool can enlarge to 200 millimeters, and the rotational speed of planer tool can be promoted to 10000r/min by current 3000r/min, and the excision effect of planer tool under the high rotational speed is better, and simultaneously, planer tool under the major diameter is when crossing the bamboo joint, and its stability also promotes by a wide margin.
Further, the climbing mechanism of the planing machine adopts the mode of cylinder transmission and pressing of the pressing wheel, the pressing wheel is jacked through the pneumatics of the cylinder, the pressing wheel jacks the platform, and the bamboo chips to be advanced are clamped between the platform and the machine table.
Has the advantages that: compared with the prior art, the invention applies the advanced machine vision technology to the traditional bamboo board process, can be suitable for respectively judging whether bamboo joints exist or not, whether the wall thickness of the bamboo tube is qualified or not and whether the thickness of bamboo chips after bamboo breaking is qualified or not before cutting, bamboo breaking and planing off of the bamboo board process, provides observable 'eyes' for the automation of the whole bamboo board process, and can greatly improve the production efficiency. Judging whether bamboo joints exist at the cutting position through machine vision of the camera to judge whether avoidance operation is executed or not, and driving the saw cutter to finish cutting work after completion; simultaneously controlling the lifting of any planer tool group in any planer tool group pair through a control center so as to achieve the control of the planing removal amount of the target plate, or automatically selecting the most economical planing removal amount according to the thickness of the bamboo chips; the planing tool set controlled by screw transmission sets three planing tool sets with inconsistent planing quantities, and sequentially carries out corner cutting, distance fixing and trimming operations on the bamboo chips to achieve high-quality bamboo boards. The process can realize full-automatic operation and has high process efficiency.
Drawings
FIG. 1: the process steps of the process of the invention are shown in the figure;
FIG. 2: a cutting step is used for avoiding the bamboo joint without the bamboo joint at the cut part after the backspacing;
FIG. 3: in the cutting step, a bamboo joint avoidance operation schematic diagram of a bamboo joint at the cut position after backspacing is obtained;
FIG. 4: scanning the end face of the bamboo tube before the bamboo breaking step;
FIG. 5: the schematic diagram of detecting the wall thickness by scanning the side wall of the bamboo chip by a camera;
FIG. 6: the planing machine is used for chamfering, spacing and trimming the bamboo chips.
Detailed Description
Specific embodiments of the present invention will be described in detail below with reference to fig. 1-6.
A process for preparing bamboo board includes such steps as preparing raw materials,
cutting, namely identifying bamboo joints by arranging a camera on a cutting machine, further executing an avoiding operation, wherein one end of a bamboo clamped by a pushing mechanism is pushed forward to a preset position, the camera identifies whether the bamboo joints exist at the cutting position, if so, the avoiding operation is executed, and if not, the cutting operation is directly executed;
breaking bamboo, detecting the wall thickness of the cut bamboo tube after cutting, judging whether the wall thickness of the cut bamboo tube is qualified or not, if so, pushing one end of the bamboo tube clamped by a clamping mechanism to a cutting knife, planing the bamboo tube into bamboo chips with equal width by the cutting knife, and otherwise, rejecting the bamboo tube;
and (3) planing, namely detecting whether the thickness of the bamboo chips is qualified through a camera, after the thickness of the bamboo chips is qualified, performing planing operation on the upper surface and the lower surface of the bamboo chips through three groups of upper planing tools and lower planing tools which are paired until the target thickness is reached, and sequentially performing corner cutting, distance fixing and trimming operation on the bamboo chips through the three groups of planing tools to obtain the final bamboo board.
To decide the operation, add the camera that is connected in control center on current cutting machine for whether there is the bamboo joint in the department of surveying waiting to cut, judge through machine vision's mode, concrete operation is as follows: after camera 1 scans thick bamboo tube 2, judges whether there is the bamboo joint 3, if exist, control center control advancing mechanism 6 rolls back, rolls back 5 certain distances of saw sword that makes the terminal surface 4 of thick bamboo tube expose the cutting machine, and whether there is the bamboo joint 3 in the scanning of rethread camera this moment: if the bamboo is present, referring to the attached figure 2, the bamboo tube is pushed forward for a certain distance to avoid bamboo joints 3, the distance is preferably 0.02 m, the avoidance of the end bamboo joints can be completed, the control center controls the cutting machine to cut the bamboo, and if the bamboo is not present, referring to the attached figure 3, the control center controls the cutting machine to directly cut the bamboo; then the control center controls the pushing mechanism to clamp the bamboo and move forward to a preset position, and the bamboo tube with the target length can be obtained after cutting.
For the bamboo breaking operation, firstly detecting the thickness of the end face of the bamboo tube obtained after cutting, ensuring that the bamboo tube with qualified wall thickness enters the bamboo breaking operation, referring to the attached figure 4, scanning the end face of the bamboo tube by a camera, displaying the end face in a control center through machine vision, scanning the outer diameter d and the inner diameter r of the end face of the bamboo tube through specific software, judging whether the bamboo tube is required by a target according to the difference between the outer diameter and the inner diameter, and determining the thickness h determined by the target according to the determined thickness h0The wall thickness h of the cylinder wall is more than h0+δ0To pass, said delta0The allowance for planing is set according to the process and the condition of the bamboo tube.
When breaking bamboo, the clamping mechanism clamps one end of the bamboo tube and pushes the bamboo tube towards the splitting knife, the splitting knife is determined according to the width of the bamboo chips to be obtained, the splitting knife is fixed, and the bamboo tube passing through the splitting knife is split into the bamboo chips 6 with equal width. The dissection knives with different widths are arranged on the rotating mechanism, and the rotating mechanism is controlled to rotate through the control center so as to rotate the specific dissection knife to the dissection position.
For the planing operation, due to the characteristics of the growth environment of the bamboo tube, the time length of the bamboo tube receiving the sunlight at the sunny place and the shady place is different, the growth trend is different, the wall thickness of the bamboo tube is also different, bamboo chips with unqualified thicknesses after bamboo breaking are removed before planing, and a camera scans the bamboo chipsThe side wall of the bamboo chip is displayed on a display through machine vision, and referring to figure 5, the thickness h of the bamboo chip is scanned through specific software, and the thickness h is determined for determining a target0The wall thickness h of the cylinder wall is more than h0+δ0To pass, said delta0And removing bamboo chips with insufficient wall thickness for reserving the planing allowance.
In the planing operation, the invention provides a planing machine which comprises three planing tool groups, a platform and a jacking mechanism, wherein any planing tool group comprises an upper planing tool group and a lower planing tool group, the platform is arranged between the planing tool groups and on two sides of the planing tool groups, and the platform is connected with the jacking mechanism; the planer tool group and the jacking mechanism are connected with the control center; and the three groups of planning cutter groups respectively carry out corner cutting, distance fixing and trimming operations on the fed bamboo chips under the control of the console to obtain the final bamboo board.
The upper planer tool set or the lower planer tool set in any one of the three planer tool sets are controlled to be adjusted and positioned vertically through screw transmission under the control of the control center, the control center controls the upper planer tool set to move downwards, and the lower planer tool set to move upwards, so that the upper planer tool set and the lower planer tool set can simultaneously plane the upper surface and the lower surface of the bamboo chip until the target thickness is reached.
For the bamboo chips with the thickness not set as the target thickness, the control console automatically selects the optimal planing amount according to the thickness of the bamboo chip feeding material to achieve the most energy-saving effect, and according to the practical situation, the planing amount is preferably 0.5 mm, for example, the feeding of the bamboo chips is 8 mm, the control console controls the upper planing tool set to move downwards, and the lower planing tool set to move upwards, so that the planed bamboo wood finally obtained is 7.5 mm.
Set up the upper and lower planer tool group that three groups correspond and for promoting the effect of removing, more importantly, for balanced each group's planer tool group removes the load and improves the effect of removing, carry out unbalanced arrangement to the volume of removing between the planer tool group to group pair, refer to figure 6, specifically include:
the first planer tool group carries out chamfering operation on the bamboo chips with irregular cross sections, and the thickness of the planed bamboo chips is still larger than the target amount;
spacing, wherein the second planer tool set performs spacing operation on the bamboo chips subjected to chamfering, and the vertical distance of the second planer tool set is the thickness value of the target bamboo chip;
and trimming, namely trimming the bamboo chips which are trimmed at fixed intervals by the third planer tool set to obtain the finally required bamboo chip board.
Further, the planer tool passes through the flat band with the motor and is connected, adopts the flat band to replace current flat angle area, and simultaneously, the diameter of planer tool can enlarge to 200 millimeters, and the rotational speed of planer tool can be promoted to 10000r/min by current 3000r/min, and the excision effect of planer tool under the high rotational speed is better, and simultaneously, planer tool under the major diameter is when crossing the bamboo joint, and its stability also promotes by a wide margin.
Further, the mode that the machine of removing adopted the compressing tightly of cylinder transmission and pinch roller, and pneumatic through the cylinder is with the pinch roller jacking, and the pinch roller is with the platform jacking, and the centre gripping is between bamboo chip to the board of marcing, replaces current spring mode of compressing tightly, and stability strengthens by a wide margin.
The bamboo chips sequentially pass through a first planer tool pair, a second planer tool pair and a third planer tool pair, edges raised at two ends of the bamboo chips are cut off by a planer tool under the action of the first planer tool pair, the bamboo chips enter the second planer tool pair after being subjected to corner cutting, and the second planer tool pair performs distance operation on the bamboo chips subjected to corner cutting, wherein the distance is the thickness value of the target bamboo chips; and the third planer tool group carries out trimming operation on the bamboo chips planed at the fixed distance to obtain the smooth bamboo board reaching the target thickness.
The invention applies the advanced machine vision technology to the traditional bamboo board process, can be suitable for respectively judging whether bamboo joints exist or not, whether the wall thickness of the bamboo tube is qualified or not and whether the thickness of bamboo chips after bamboo breaking is qualified or not before cutting, bamboo breaking and planing off of the bamboo board process, provides observable 'eyes' for the automation of the whole bamboo board process and can greatly improve the production efficiency.
Whether bamboo joints exist at the cutting position is judged through the machine vision of the camera to judge whether avoidance operation is executed or not, the saw cutter is driven to complete cutting work after the avoidance operation is completed, full-automatic operation can be realized, and the process efficiency is high.
Simultaneously controlling the lifting of any planer tool group in any planer tool group pair through a control center so as to achieve the control of the planing removal amount of the target plate, or automatically selecting the most economical planing removal amount according to the thickness of the bamboo chips; the planing tool set controlled by screw transmission sets three planing tool sets with inconsistent planing quantities, and sequentially carries out corner cutting, distance fixing and trimming operations on the bamboo chips to achieve high-quality bamboo boards.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A bamboo board preparation process is characterized by comprising the following steps:
cutting, namely identifying bamboo joints by arranging a camera on a cutting machine, further executing an avoiding operation, wherein one end of a bamboo clamped by a pushing mechanism is pushed forward to a preset position, the camera identifies whether the bamboo joints exist at the cutting position, if so, the avoiding operation is executed, and if not, the cutting operation is directly executed;
breaking bamboo, detecting the wall thickness of the cut bamboo tube after cutting, judging whether the wall thickness of the cut bamboo tube is qualified or not, if so, pushing one end of the bamboo tube clamped by a clamping mechanism to a cutting knife, planing the bamboo tube into bamboo chips with equal width by the cutting knife, and otherwise, rejecting the bamboo tube;
and (3) planing, namely detecting whether the thickness of the bamboo chips is qualified through a camera, performing planing operation by a planing machine after the thickness of the bamboo chips is qualified, performing planing operation on the upper surface and the lower surface of the bamboo chips until the target thickness is reached through three groups of upper and lower paired planing tool sets, and sequentially performing corner cutting, distance fixing and trimming operation on the bamboo chips by the three groups of planing tool sets to obtain the final bamboo board.
2. The bamboo board manufacturing process according to claim 1, wherein: in deciding the step, after the camera scans the thick bamboo tube, judge whether there is the bamboo joint, if do not exist, control center control cutting machine decides the thick bamboo tube, if exist, then: control center control advancing mechanism rolls back, rolls back and makes the terminal surface of thick bamboo tube expose the saw sword certain distance of cutting machine, and rethread camera scanning whether has the bamboo joint this moment, if exist, impels the certain distance forward with the bamboo, avoids the bamboo joint to accomplish dodging to the terminal surface bamboo joint, and control center control cutting machine is decided the bamboo, if do not exist, control center control cutting machine is direct to cut the bamboo.
3. A bamboo board manufacturing process according to any one of claims 1-2, characterized in that: detecting the wall thickness of the cut bamboo tube before the bamboo breaking operation, scanning the end face of the bamboo tube by a camera, displaying the wall thickness on a control center through machine vision, scanning the outer diameter d and the inner diameter r of the end face of the bamboo tube through specific software, judging whether the wall thickness is required by a target according to the difference value of the outer diameter and the inner diameter, and determining the thickness h determined by the target0The wall thickness h of the cylinder wall is more than h0+δ0To pass, said delta0The surplus of the planing is reserved.
4. A bamboo board manufacturing process according to any one of claims 1-3, characterized in that: before the planing step, a camera detects whether the thickness of the bamboo chips is qualified, the camera scans the side walls of the bamboo chips, the side walls are displayed on a display through machine vision, the thickness h of the bamboo chips is scanned through specific software, and the thickness h determined for determining a target is determined0The wall thickness h of the cylinder wall is more than h0+δ0The product is qualified.
5. A bamboo board manufacturing process according to any one of claims 1-4, characterized in that: the planing machine used for planing operation comprises three planing tool sets, a platform and a jacking mechanism, wherein any one planing tool set comprises an upper planing tool set and a lower planing tool set, the planing tool sets are arranged between the upper planing tool set and on two sides of the upper planing tool set, and the platform is connected with the jacking mechanism.
6. The bamboo board manufacturing process according to claim 5, wherein: the planing quantities of the three planing tool sets are different, and the executed operation specifically comprises the following steps:
the first planer tool group carries out chamfering operation on the bamboo chips with irregular cross sections, and the thickness of the planed bamboo chips is still larger than the target amount;
spacing, wherein the second planer tool set performs spacing operation on the bamboo chips subjected to chamfering, and the vertical distance of the second planer tool set is the thickness value of the target bamboo chip;
and trimming, namely trimming the bamboo chips which are trimmed at fixed intervals by the third planer tool set to obtain the finally required bamboo chip board.
7. Bamboo board manufacturing process according to any of claims 5-6, characterized in that: the planer tool is connected with the motor through the flat belt, and the diameter of the planer tool can be enlarged to 200 mm.
8. Bamboo board manufacturing process according to any of claims 5-7, characterized in that: the climbing mechanism of the planing machine adopts the mode of cylinder transmission and pressing of the pressing wheel, the pressing wheel is jacked through the pneumatics of the cylinder, the pressing wheel jacks the platform, and the bamboo chips to be advanced are clamped between the platform and the machine table.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113172716A (en) * | 2021-04-08 | 2021-07-27 | 欧雪娜 | Waterproof and antibacterial bamboo fiber non-woven fabric surface layer and preparation method thereof |
| CN114701028A (en) * | 2022-03-31 | 2022-07-05 | 福建呈祥机械制造有限公司 | Bamboo tube fixed-length cutting method and device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106738132A (en) * | 2016-12-17 | 2017-05-31 | 福建神采新材料科技有限公司 | A kind of producing device of the standard bamboo wood of low bamboo Kun losses |
| CN106926323A (en) * | 2017-03-10 | 2017-07-07 | 杨发明 | Double face planer for processing bamboo flattening board |
| CN107756578A (en) * | 2017-12-04 | 2018-03-06 | 东莞理工学院 | A kind of broken bamboo removes internal segment all-in-one |
| CN107803896A (en) * | 2017-09-21 | 2018-03-16 | 广德县泉村竹制品有限公司 | A kind of bamboo hacking extruding planing automatic processing device |
| CN108656225A (en) * | 2018-05-21 | 2018-10-16 | 王歆歆 | One kind is for processing double face planer |
| CN108748491A (en) * | 2018-08-29 | 2018-11-06 | 湖南省林业科学院 | A kind of saw bamboo equipment |
| CN108748405A (en) * | 2018-08-29 | 2018-11-06 | 国家林业局北京林业机械研究所 | A kind of intelligent saw bamboo equipment |
| CN108772927A (en) * | 2018-08-29 | 2018-11-09 | 湖南省林业科学院 | A kind of automation saw bamboo equipment |
| CN208557847U (en) * | 2018-06-28 | 2019-03-01 | 福建仁记竹业有限公司 | A kind of bamboo chip four sides automatic plane leveling device |
-
2019
- 2019-11-08 CN CN201911068290.2A patent/CN110883888B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106738132A (en) * | 2016-12-17 | 2017-05-31 | 福建神采新材料科技有限公司 | A kind of producing device of the standard bamboo wood of low bamboo Kun losses |
| CN106926323A (en) * | 2017-03-10 | 2017-07-07 | 杨发明 | Double face planer for processing bamboo flattening board |
| CN107803896A (en) * | 2017-09-21 | 2018-03-16 | 广德县泉村竹制品有限公司 | A kind of bamboo hacking extruding planing automatic processing device |
| CN107756578A (en) * | 2017-12-04 | 2018-03-06 | 东莞理工学院 | A kind of broken bamboo removes internal segment all-in-one |
| CN108656225A (en) * | 2018-05-21 | 2018-10-16 | 王歆歆 | One kind is for processing double face planer |
| CN208557847U (en) * | 2018-06-28 | 2019-03-01 | 福建仁记竹业有限公司 | A kind of bamboo chip four sides automatic plane leveling device |
| CN108748491A (en) * | 2018-08-29 | 2018-11-06 | 湖南省林业科学院 | A kind of saw bamboo equipment |
| CN108748405A (en) * | 2018-08-29 | 2018-11-06 | 国家林业局北京林业机械研究所 | A kind of intelligent saw bamboo equipment |
| CN108772927A (en) * | 2018-08-29 | 2018-11-09 | 湖南省林业科学院 | A kind of automation saw bamboo equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113172716A (en) * | 2021-04-08 | 2021-07-27 | 欧雪娜 | Waterproof and antibacterial bamboo fiber non-woven fabric surface layer and preparation method thereof |
| CN114701028A (en) * | 2022-03-31 | 2022-07-05 | 福建呈祥机械制造有限公司 | Bamboo tube fixed-length cutting method and device |
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Application publication date: 20200317 Assignee: Jiangxi Junjian Intelligent Equipment Co.,Ltd. Assignor: Jiangxi Shuangshuang Machinery Manufacturing Co.,Ltd. Contract record no.: X2023980047572 Denomination of invention: A Bamboo Board Preparation Process Granted publication date: 20220215 License type: Exclusive License Record date: 20231117 |
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