CN110881242B - Circuit board and voltage measurement sensor protection device - Google Patents
Circuit board and voltage measurement sensor protection device Download PDFInfo
- Publication number
- CN110881242B CN110881242B CN201811039727.5A CN201811039727A CN110881242B CN 110881242 B CN110881242 B CN 110881242B CN 201811039727 A CN201811039727 A CN 201811039727A CN 110881242 B CN110881242 B CN 110881242B
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- Prior art keywords
- circuit board
- layers
- thickness
- layer
- insulating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0084—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring voltage only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Abstract
The invention provides a circuit board and a voltage measurement sensor protection device, wherein the circuit board comprises: the circuit board comprises a plurality of insulating layers and a plurality of conducting layers, wherein the insulating layers and the conducting layers are arranged at intervals, the upper surface and the lower surface of the circuit board are provided with the conducting layers, and the insulating layers are epoxy resin layers; arranging a deep control hole on the conductive layer, and arranging a screw joint device in the deep control hole so as to be electrically connected with an external component; the thickness of the circuit board is greater than or equal to a preset thickness threshold value. Because the insulating layer of circuit board adopts epoxy to make to the thickness of circuit board is enough thick, so under face high pressure, also can guarantee the stability ability of circuit board, can not take place protrusion, fracture or explosion phenomenon, avoid taking place the incident.
Description
Technical Field
The embodiment of the invention relates to the technical field of printed circuit boards, in particular to a circuit board and voltage measurement sensor protection device.
Background
The safety of power utilization receives more and more attention from people, and the damage of electrical equipment or the emergence of personal electric shock casualty accident not only take place in resident's daily life, more generally exist in the low voltage distribution network in the pit in colliery moreover. The underground coal mine power supply system can effectively ensure the safety and reasonability of the underground power grid and can also promote the economical efficiency of the arrangement of the underground coal mine power grid system. However, due to the underground humid environment of the coal mine, power supply equipment such as a transformer and a starter are prone to short-circuit and other faults, and the safety and reliability coefficient of the whole power supply system is reduced linearly. The reason is often caused by dangerous voltage carried by parts such as housings of electric equipment, metal bases and the like.
Therefore, aiming at potential safety hazards possibly caused by the electrification of the metal shell of the equipment, in order to avoid safety accidents occurring underground the coal mine to the maximum extent, the metal shell electrification detection equipment is provided, and the metal shell electrification detection equipment comprises a voltage measurement sensor protection device.
Existing voltage measurement sensor protection devices include a high voltage capacitor. When the high-voltage capacitor works under the condition that the voltage exceeds the rated voltage, the high-voltage capacitor is made of glass or common plastics, so that the high-voltage capacitor is easy to bulge, break or even explode, gas possibly exists in a coal mine at any time, and once the capacitor is exploded, immeasurable serious results can be caused.
Disclosure of Invention
The embodiment of the invention provides a circuit board and a voltage measurement sensor protection device, which solve the technical problem that when a high-voltage capacitor works under the condition that the voltage exceeds the rated voltage, the high-voltage capacitor is easily protruded, broken and even exploded because the high-voltage capacitor is made of glass or common plastic in the prior art.
In a first aspect, an embodiment of the present invention provides a circuit board, including: the circuit board comprises a plurality of insulating layers and a plurality of conducting layers, wherein the insulating layers and the conducting layers are arranged at intervals, the upper surface and the lower surface of the circuit board are provided with the conducting layers, and the insulating layers are epoxy resin layers;
arranging a deep control hole on the conductive layer, and arranging a screw joint device in the deep control hole so as to be electrically connected with an external device;
the thickness of the circuit board is greater than or equal to a preset thickness threshold value.
Further, the wiring board, as described above,
further, the circuit board as described above, further comprising an oil layer;
the oil layer coats the outer surface of the circuit board.
Further, as for the wiring board described above, the insulating layer includes three layers, and the conductive layer includes four layers.
Further, according to the wiring board, the thickness of the wiring board is greater than or equal to 29mm, the thickness of the conductive layer is 1oz, the thickness of the insulating layer adjacent to the upper surface and the insulating layer adjacent to the lower surface is greater than or equal to 14mm, and the thickness of the insulating layer located in the middle is 1 mm.
Further, as for the circuit board, the hole for controlling the depth of the conductive layers on the upper and lower surfaces is arranged at the center of the conductive layers on the upper and lower surfaces and extends into the adjacent insulating layers;
the depth control hole of the conducting layer in the middle part is arranged in the center of the side face of the conducting layer in the middle part and extends into the insulating layer inside the conducting layer in the middle part.
Further, according to the circuit board, the aperture of the deep control hole is 0.5mm, and the depth of the deep control hole is 2 mm.
Further, as for the circuit board, the screw connection device is a copper rivet.
Further, according to the wiring board, the insulating layer and the conductive layer are fixedly connected by adhesion.
In a second aspect, an embodiment of the present invention provides a voltage measurement sensor protection device, including: a sensor, an execution module and the circuit board of the first aspect;
the circuit board is electrically connected with the execution module and the sensor respectively.
Further, according to the voltage measurement sensor protection device, the circuit board is electrically connected with the sensor through the screw connection devices on the upper surface and the lower surface, and the circuit board is electrically connected with the execution module through the screw connection devices on the side surface.
The embodiment of the invention provides a circuit board and a voltage measurement sensor protection device, wherein the circuit board comprises: the circuit board comprises a plurality of insulating layers and a plurality of conducting layers, wherein the insulating layers and the conducting layers are arranged at intervals, the upper surface and the lower surface of the circuit board are provided with the conducting layers, and the insulating layers are epoxy resin layers; arranging a deep control hole on the conductive layer, and arranging a screw joint device in the deep control hole so as to be electrically connected with an external device; the thickness of the circuit board is greater than or equal to a preset thickness threshold value. Because the insulating layer of circuit board adopts epoxy to make to the thickness of circuit board is enough thick, so under face high pressure, also can guarantee the stability ability of circuit board, can not take place protrusion, fracture or explosion phenomenon, avoid taking place the incident.
It should be understood that what is described in the summary above is not intended to limit key or critical features of embodiments of the invention, nor is it intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board according to a first embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a circuit board according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a voltage measurement sensor protection device according to a third embodiment of the present invention.
Reference numerals
1-circuit board 11,111,112,113,114-conducting layer 12,121,122,123-insulating layer 13-screwed device 14-controlled deep hole 2-sensor 3-execution module
Detailed Description
Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and the embodiments of the present invention are illustrative only and are not intended to limit the scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, and in the above-described drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
An application scenario of the circuit board provided by the embodiment of the present invention is described below. Specifically, the circuit board can replace a high-voltage capacitor, so that the circuit board can be adopted to replace the circuit board in a circuit with the high-voltage capacitor. The protection device can be a household appliance, a transformer or a voltage measurement sensor protection device and the like.
Embodiments of the present invention will be described below with reference to the accompanying drawings.
Example one
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention, and as shown in fig. 1, the circuit board according to the embodiment includes: a plurality of insulating layers 12 and a plurality of conductive layers 11.
The insulating layer 12 and the conductive layer 11 are disposed at an interval, and the conductive layer 11 is disposed on the upper and lower surfaces of the circuit board. The insulating layer 12 is an epoxy layer.
Specifically, in this embodiment, the wiring board is arranged with a conductive layer 11 and an insulating layer 12 in this order from top to bottom, and the conductive layer 11 is located at the lowermost surface. The conductive layer 11 may be a copper-plated layer, and the insulating layer 12 may be an epoxy resin layer.
In this embodiment, the epoxy resin curing system mainly comprises epoxy resin, curing agent, diluent, plasticizer, reinforcing agent, filler, etc., and the epoxy resin is selected as the material of the insulating layer 12 for the circuit board because of its high electrical insulating property, dimensional stability and mold resistance. The electrical insulation performance is strong in that the cured epoxy resin system has good electrical insulation performance in a wide frequency and temperature range. It is an excellent insulating material with high dielectric property, surface leakage resistance and electric arc resistance. Dimensional stability is achieved in that the cured epoxy resin system has outstanding dimensional stability and durability. Mold resistance is manifested in cured epoxy systems that are resistant to most molds and can be used under harsh conditions.
In this embodiment, the number of the insulating layers 12 may be three, and correspondingly, the number of the conductive layers 11 may be four. Alternatively, the number of the insulating layers 12 and the number of the conductive layers 11 may be other values, and the present embodiment is not limited thereto.
In this embodiment, the thickness of each of the insulating layer 12 and the conductive layer 11 is not limited.
In this embodiment, a hole for controlling depth is provided in the conductive layer 11, and a screw device 13 is provided in the hole for controlling depth to electrically connect with an external device.
Specifically, in this embodiment, a deep hole is formed by drilling on each conductive layer 11 in a deep hole control manner, a screw connector 13 is disposed in the deep hole control, and the screw connector 13 is used for leading out an inner line to connect to other external components.
Wherein, the depth of the depth control hole is larger than the thickness of the conductive layer 11.
In this embodiment, the screwing device 13 may be a rivet, a stud, a bolt, etc., which is not limited in this embodiment.
In this embodiment, the thickness of the circuit board is greater than or equal to the preset thickness threshold.
Specifically, in this embodiment, in order to enable the circuit board to replace the high-voltage capacitor, the thickness of the circuit board needs to be greater than or equal to a preset thickness threshold, where the preset thickness threshold may be 29mm, or another suitable value, which is not limited in this embodiment.
The circuit board that this embodiment provided includes: the circuit board comprises a plurality of insulating layers and a plurality of conducting layers, wherein the insulating layers and the conducting layers are arranged at intervals, the upper surface and the lower surface of the circuit board are provided with the conducting layers, and the insulating layers are epoxy resin layers; arranging a deep control hole on the conductive layer, and arranging a screw joint device in the deep control hole so as to be electrically connected with an external component; the thickness of the circuit board is greater than or equal to a preset thickness threshold value. Because the insulating layer of circuit board adopts epoxy to make to the thickness of circuit board is enough thick, so also can guarantee the stability ability of circuit board under facing high pressure, can not take place protrusion, fracture or explosion phenomenon, avoid taking place the incident.
Example two
Fig. 2 is a schematic cross-sectional structure diagram of a circuit board according to a second embodiment of the present invention, and as shown in fig. 2, the circuit board according to the present embodiment further refines the circuit board on the basis of the circuit board according to the first embodiment of the present invention, and then the circuit board according to the present embodiment further includes the following solutions.
Further, in this embodiment, as shown in fig. 2, the insulating layer includes three layers, and the conductive layer includes four layers. The insulating layers are 121,122,123, respectively. The conductive layers are 111,112,113 and 114, respectively.
In this embodiment, the thickness of the circuit board is greater than or equal to 29mm, the thickness of the conductive layer is 1oz, the thicknesses of the insulating layers adjacent to the upper surface and the lower surface are greater than or equal to 14mm, and the thickness of the insulating layer located at the middle is 1 mm.
Therefore, in the present embodiment, the thicknesses of 111,112,113, and 114 can be set to 1 oz. The thickness of the insulating layers 121 and 123 was set to 14mm, and the thickness of the insulating layer 122 was set to 1 mm. The thickness of the entire circuit board was set to 29 mm.
Further, in this embodiment, the insulating layer and the conductive layer are fixedly connected by adhesion. The bonding method may be a resin bonding sheet bonding method or another bonding method, and this is not limited in this embodiment.
In this embodiment, the insulating layer is formed by press molding.
The insulating layer and the conducting layer of the circuit board provided by the embodiment are fixedly connected through bonding. Can guarantee the firmness of the circuit board and is not easy to be damaged.
Further, in the present embodiment, the hole 14 for controlling depth of the conductive layers on the upper and lower surfaces is disposed at the center of the conductive layers on the upper and lower surfaces and extends into the adjacent insulating layers; the controlled-depth hole 14 of the middle conductive layer is arranged in the center of the side face of the middle conductive layer and extends into the insulating layer inside the middle conductive layer.
Wherein, the middle conducting layer is an inner conducting layer of the circuit board. The inner conductive layer includes two. When the hole 14 is provided in the conductive layers of the upper and lower surface layers, the hole 14 is provided in the center position of the upper and lower surfaces of the wiring board, and when the hole 14 is provided in the conductive layer of the inner layer, the hole 14 is provided in the center position of each conductive layer of the inner layer on the side wall of the wiring board.
Wherein, the aperture of the depth control hole 14 is 0.5mm, and the depth is 2 mm.
In this embodiment, the thickness of the conductive layer is 1oz, the aperture of the controlled-depth hole 14 is 0.5mm, and the depth is 2mm, so that each controlled-depth hole 14 can extend through the conductive layer into the insulating layer.
Specifically, in this embodiment, the hole 14 for controlling the conductive layers on the upper and lower surfaces is disposed at the center of the conductive layers on the upper and lower surfaces, and the hole 14 for controlling the conductive layer in the middle is disposed at the center of the side of the conductive layer in the middle, so as to facilitate the electrical connection with the external device and increase the space for electrical connection with each external device.
Further, in the present embodiment, the screw member 13 is a copper rivet.
Specifically, in this embodiment, since the thickness of the circuit board is greater than or equal to 29mm, which exceeds the limit capability of the electro-coppering manufacture, the copper rivets are used to replace the hole walls of the deep hole control holes 14 for electro-coppering, so as to ensure the electrical connection between the circuit board and the external components.
Further, in this embodiment, the circuit board further includes an oil layer.
Wherein, the oil layer coats the outer surface of the circuit board.
Specifically, in this embodiment, in order to prevent the circuit board from being exposed to the outside and being easily affected by moisture, an oil layer is wrapped on the outer surface of the circuit board. The oil layer can be wrapped on the outer surface of the circuit board in a spray printing mode.
The oil layer may be a solder resist ink layer, and the color may be green, yellow, red, blue, white, black or other colors, which is not limited in this embodiment.
EXAMPLE III
Fig. 3 is a schematic structural diagram of a voltage measurement sensor protection device according to a third embodiment of the present invention, and as shown in fig. 3, the voltage measurement sensor protection device according to the third embodiment includes: sensor 2, execution module 3 and circuit board 1.
The circuit board 1 is electrically connected to the execution module 3 and the sensor 2, respectively.
Wherein, the sensor 2 at least comprises a humidity sensor and a gas concentration sensor, and the gas concentration sensor is a concentration sensor of gas.
In this embodiment, the structure and function of the circuit board 1 are the same as those of the circuit board provided in the first embodiment of the present invention or the circuit board provided in the second embodiment of the present invention, and are not described in detail herein.
Further, in this embodiment, the circuit board 1 is electrically connected to the sensor through the screw elements on the upper and lower surfaces, and the circuit board is electrically connected to the actuator module through the screw elements on the side surface.
The screwing device may be a copper rivet, or a bolt, a screw, or other screwing devices, which is not limited in this embodiment.
In practical application, the voltage measurement sensor protection device is arranged in the metal casing live-line measurement equipment, after the humidity sensor detects humidity, if the humidity exceeds a preset humidity threshold value, the circuit board of the execution module is combined, the power supply is controlled to be disconnected, and safety accidents are avoided. Or when the gas concentration sensor detects that the gas concentration exceeds a preset concentration threshold value, the execution module circuit board is combined to control the power supply to be disconnected, and safety accidents are avoided.
The voltage measurement sensor protection device provided by the embodiment comprises: the circuit board is electrically connected with the execution module and the sensor respectively, so that the performance of the voltage measurement sensor protection device can be ensured, and safety accidents are avoided.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A circuit board, comprising: the circuit board comprises a plurality of insulating layers and a plurality of conducting layers, wherein the insulating layers and the conducting layers are arranged at intervals, the upper surface and the lower surface of the circuit board are provided with the conducting layers, and the insulating layers are epoxy resin layers;
arranging a deep control hole on the conductive layer, and arranging a screw joint device in the deep control hole so as to be electrically connected with an external device;
the thickness of the circuit board is greater than or equal to a preset thickness threshold value;
the depth control holes of the conductive layers on the upper surface and the lower surface are arranged at the center positions of the conductive layers on the upper surface and the lower surface and extend into the adjacent insulating layers;
the depth control hole of the conducting layer in the middle part is arranged in the center of the side face of the conducting layer in the middle part and extends into the insulating layer inside the conducting layer in the middle part.
2. The wiring board of claim 1, further comprising an oil layer;
the oil layer coats the outer surface of the circuit board.
3. The wiring board of claim 1, wherein the insulating layer comprises three layers and the conductive layer comprises four layers.
4. The wiring board of claim 3, wherein the thickness of the wiring board is greater than or equal to 29mm, the thickness of the conductive layer is 1oz, the thickness of the insulating layer adjacent to the upper surface and the insulating layer adjacent to the lower surface is greater than or equal to 14mm, and the thickness of the insulating layer positioned in the middle is 1 mm.
5. The wiring board of claim 4, wherein the hole diameter of the controlled depth hole is 0.5mm and the depth is 2 mm.
6. The cord plate of claim 1, wherein the threaded means is a copper rivet.
7. The wiring board of claim 1, wherein the insulating layer and the conductive layer are fixedly connected by adhesion.
8. A voltage measurement sensor protection device, comprising: a sensor, an actuator module and a circuit board according to any one of claims 1-7;
the circuit board is electrically connected with the execution module and the sensor respectively.
9. The voltmeter sensor protection device of claim 8, wherein said circuit board is electrically connected to said sensor by means of screw-on means on upper and lower surfaces, and said circuit board is electrically connected to said actuating module by means of screw-on means on a side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811039727.5A CN110881242B (en) | 2018-09-06 | 2018-09-06 | Circuit board and voltage measurement sensor protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811039727.5A CN110881242B (en) | 2018-09-06 | 2018-09-06 | Circuit board and voltage measurement sensor protection device |
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| Publication Number | Publication Date |
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| CN110881242A CN110881242A (en) | 2020-03-13 |
| CN110881242B true CN110881242B (en) | 2021-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811039727.5A Active CN110881242B (en) | 2018-09-06 | 2018-09-06 | Circuit board and voltage measurement sensor protection device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5010641A (en) * | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
| US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| CN1082306A (en) * | 1992-08-08 | 1994-02-16 | 奇康公司 | Printed circuit board (PCB) with internal capacitor |
| CN103093906A (en) * | 2013-02-07 | 2013-05-08 | 北京国电四维电力技术有限公司 | High voltage casing pipe |
| CN103167721A (en) * | 2011-12-09 | 2013-06-19 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN105652064A (en) * | 2014-12-01 | 2016-06-08 | 三星电子株式会社 | Voltage measurement device and voltage sensor |
-
2018
- 2018-09-06 CN CN201811039727.5A patent/CN110881242B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5010641A (en) * | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
| US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| CN1082306A (en) * | 1992-08-08 | 1994-02-16 | 奇康公司 | Printed circuit board (PCB) with internal capacitor |
| CN103167721A (en) * | 2011-12-09 | 2013-06-19 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN103093906A (en) * | 2013-02-07 | 2013-05-08 | 北京国电四维电力技术有限公司 | High voltage casing pipe |
| CN105652064A (en) * | 2014-12-01 | 2016-06-08 | 三星电子株式会社 | Voltage measurement device and voltage sensor |
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| CN110881242A (en) | 2020-03-13 |
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Effective date of registration: 20230612 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |