CN110865440B

CN110865440B - OSFP optical module and manufacturing method thereof

Info

Publication number: CN110865440B
Application number: CN201810978695.9A
Authority: CN
Inventors: 张超
Original assignee: Innolight Technology Suzhou Ltd
Current assignee: Innolight Technology Suzhou Ltd
Priority date: 2018-08-27
Filing date: 2018-08-27
Publication date: 2021-12-14
Anticipated expiration: 2038-08-27
Also published as: CN110865440A

Abstract

The OSFP optical module comprises a first optical module and a heat dissipation piece, wherein the first optical module comprises a shell which is arranged in a surrounding mode to form a closed containing space, when the heat dissipation piece and the first optical module are independent from each other, the first optical module serves as the OSFP optical module, and when the heat dissipation piece is matched with the shell, the first optical module and the heat dissipation piece are combined to serve as the OSFP optical module. The OSFP optical module of this application can only contain first optical module, or contain the integrated configuration of first optical module and radiating piece, so, can select different forms's OSFP optical module according to different demands, on the one hand, improved the selection degree of freedom of OSFP optical module, on the other hand, only need provide general first optical module and radiating piece this moment, assemble first optical module and radiating piece together again when having needs, can effectively reduce the die sinking quantity of mould, reduce the technology degree of difficulty, and can greatly reduced cost.

Description

OSFP optical module and manufacturing method thereof

Technical Field

The present application relates to the field of optical communications, and in particular, to an OSFP optical module and a manufacturing method thereof.

Background

With the continuous speed increase of the bandwidth in the field of optical communication, the bandwidth of an optical module is also upgraded.

The OSFP MSA aims to establish specifications for optical modules of up to 400Gbps (starting from 8X50 Gbps), aims to support 32 port module applications in a 1 RU-sized line card and supports the transmission distance application from a data center to a metropolitan area network, and has extremely high application value in the field of optical communication.

However, the product power is increased and the bulk thermal density is also increased, which leads to the increase of the product working temperature, and the high temperature reduces the product life and performance, which requires a more suitable product design to improve the heat dissipation problem.

In practical applications, taking the OSFP optical module as an example, the OSFP optical module has two heat dissipation forms: the OSFP optical module with the radiating piece and the OSFP optical module without the radiating piece are required to be produced separately in order to meet different delivery requirements, so that the mold opening quantity of the mold is greatly increased, the types of products are increased, the management and control of the products are not facilitated, and the cost is increased.

Disclosure of Invention

An embodiment of the application provides an OSFP optical module, it can reduce the technology degree of difficulty, and then reduce cost, and the OSFP optical module includes first optical module and radiating piece, first optical module is including enclosing to establish the casing that forms a confined accommodation space, works as the radiating piece with first optical module is when independent each other, first optical module is as the OSFP optical module, works as the radiating piece cooperation extremely during the casing, first optical module with the radiating piece combination is as the OSFP optical module.

In one embodiment, the housing includes an upper housing and a lower housing that are engaged with each other, and the heat sink is engaged with a side of the upper housing away from the lower housing.

In one embodiment, the upper housing and the heat sink are integrally formed, respectively.

In one embodiment, the heat sink and the housing are fixed by a heat conductive adhesive.

In one embodiment, the heat sink includes an upper plate, a lower plate and heat dissipation fins interposed between the upper plate and the lower plate, and the lower plate and the housing are engaged with each other.

An embodiment of the application provides an OSFP optical module, including first optical module and radiating piece, first optical module is including the casing that forms an accommodation space, the casing is including covering completely the last casing of at least an opening of accommodation space, go up the casing with radiating piece integrated into one piece respectively.

In one embodiment, the first light module and the heat dissipation member are configured to be selectively mated, and the heat dissipation member and the upper housing are fixed to each other when the first light module and the heat dissipation member are mated with each other.

An embodiment of the present application provides a method for manufacturing an OSFP optical module, including the steps of:

providing a first optical module and a heat dissipation piece;

judging the configuration states of the first optical module and the heat dissipation member;

when the heat sink and the first optical module are independent of each other, the first optical module serves as an OSFP optical module;

when the heat sink is mated to the first optical module, the first optical module is combined with the heat sink as an OSFP optical module.

In one embodiment, the manufacturing method specifically includes:

an upper shell and a heat radiating piece are respectively integrally formed;

the upper shell is matched with other components to form a first optical module;

when the heat dissipation member is fitted to the upper housing, the first optical module and the heat dissipation member are combined to serve as an OSFP optical module.

an upper shell and a heat radiating piece are respectively integrally formed;

and selectively assembling the heat dissipation piece and the first optical module to form an OSFP optical module, or taking the first optical module as the OSFP optical module.

Compared with the prior art, the OSFP optical module in the technical scheme of the application can only comprise the first optical module or comprises a combined structure of the first optical module and the radiating piece, so that OSFP optical modules in different forms can be selected according to different requirements, on one hand, the freedom of selection of the OSFP optical module is improved, on the other hand, only the first optical module and the radiating piece which are universal need to be provided at the moment, and the first optical module and the radiating piece are assembled together when needed, so that the die sinking number of dies can be effectively reduced, the process difficulty is reduced, and the cost can be greatly reduced.

Drawings

FIG. 1 is an exploded view of an OSFP optical module according to an embodiment of the present application;

fig. 2 is a schematic diagram of a first optical module as an OSFP optical module according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a first optical module and heat dissipation element combined as an OSFP optical module according to an embodiment of the present application;

fig. 4 is a step diagram of a method for manufacturing an OSFP optical module according to an embodiment of the present application.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those of ordinary skill in the art in light of these embodiments are intended to be within the scope of the present application.

In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.

Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Referring to fig. 1 to 3, an OSFP optical module 100 according to a first embodiment of the present invention includes a first optical module 10 and a heat dissipation member 20.

The first optical module 10 includes a housing 11 enclosing a closed receiving space S.

It should be noted that "the housing 11 enclosing to form a closed accommodating space S" means that the housing 11 defines a peripheral area of the accommodating space S, and an inner area and an outer area of the accommodating space S are isolated from each other, in practical use, the accommodating space S may be a completely closed space or a space with a certain gap, but in general, the housing 11 covers most of the accommodating space S.

Here, the first optical module 10 is an optical module that can be used independently, various optical components, such as a transmitting/receiving device, a coupling device, etc., are disposed in the accommodating space S, and the two opposite ends of the first optical module 10 are an electrical interface 101 and an optical interface 102, respectively.

One end of the electrical interface 101 is provided with a structure such as a gold finger, and the first optical module 10 is plugged into other access devices, such as a switch, through the electrical interface 101.

The optical interface 102 has a coupling portion, and the first optical module 10 is connected to an optical fiber connector through the optical interface 102, but not limited thereto.

When the heat sink 20 and the first optical module 10 are independent from each other, the first optical module 10 functions as an OSFP optical module, and when the heat sink 20 is fitted to the housing 11, the first optical module 10 and the heat sink 20 are combined as another OSFP optical module.

The OSFP optical module 100 in this embodiment may only include the first optical module 10, or may include a combination structure of the first optical module 10 and the heat sink 20, so that different types of OSFP optical modules 100 may be selected according to different requirements, on one hand, the freedom of selection of the OSFP optical module 100 is improved, on the other hand, only the first optical module 10 and the heat sink 20 that are universal need to be provided at this time, and the first optical module 10 and the heat sink 20 are assembled together when necessary, so that the mold opening number of a mold may be effectively reduced, the process difficulty is reduced, and the cost may be greatly reduced.

Specifically, taking different shipment requirements as an example, when the shipment requirement is the OSFP optical module 100 without the heat sink 20, the first optical module 10 may be directly shipped, and when the shipment requirement is the OSFP optical module 100 with the heat sink 20, a matching process of the first optical module 10 and the heat sink 20 is additionally added, and then shipment is performed, at this time, in a production stage before shipment, only independent production of the first optical module 10 and the heat sink 20 may be performed, and in a subsequent shipment stage, a shipment type may be flexibly selected according to requirements.

Compared with the prior art, in the production stage, only the first optical module 10 and the heat dissipation member 20 need to be produced independently, so that the mold opening number of the mold can be greatly reduced, the process difficulty is reduced, the product can be controlled conveniently, and the cost is greatly reduced.

In the present embodiment, the housing 11 includes an upper housing 111 and a lower housing 112, which are engaged with each other, and the heat sink 20 is engaged with a side of the upper housing 111 away from the lower housing 112.

Here, the upper case 111 and the lower case 112 have a cross section in a shape of a "door", the upper case 111 is positioned above the lower case 112, and the heat sink 20 is disposed on the upper surface of the upper case 111.

In other words, the first optical module 10 includes a housing 11 forming an accommodating space S, the housing 11 includes an upper housing 111 completely covering at least one opening of the accommodating space S, and the heat sink 20 is engaged with the upper housing 111.

The phrase "the upper case 111 completely covers at least one opening of the accommodating space S" means that the upper case 111 is disposed in the entire area of the at least one opening of the accommodating space S.

In the present embodiment, upper housing 111 and heat sink 112 are integrally formed, and then upper housing 111, lower housing 112 and other components are assembled to form first optical module 10.

First optical module 10 and heat sink 20 are configured to be selectively mated, and heat sink 20 is substantially fixed to upper housing 111 when first optical module 10 and heat sink 20 are mated to each other.

In a specific embodiment, the heat dissipation member 20 and the housing 11 are fixed by a heat conductive adhesive, on one hand, the thermal resistance between the heat dissipation member 20 and the housing 11 can be effectively reduced, and the heat dissipation effect is improved, and on the other hand, the size error of the first optical module 10 and the heat dissipation member 20 during production can be compensated by controlling the thickness of the heat conductive adhesive, so that the size of the finally formed OSFP optical module 100 meets the standard, and the performance of the OSFP optical module 100 is improved.

Of course, the heat sink 20 and the housing 11 may be interconnected by other means, such as welding, screwing, fastening, etc.

In the present embodiment, the heat sink 20 includes an upper plate 21, a lower plate 22, and heat dissipation fins 23 interposed between the upper plate 21 and the lower plate 22, and the lower plate 22 is engaged with the housing 11.

The upper plate 21 and the lower plate 22 have the same size, and the upper plate 21, the lower plate 22 and the heat dissipation fins 23 are matched to form a three-dimensional structure.

The heat sink 20 further includes two ribs 24 located at two sides of the three-dimensional structure, and the ribs 24 extend from the upper plate 21 and the lower plate 22 towards two sides.

Here, a first relief portion 241 and a second relief portion 242 are formed between the extending portions of the two ends of the rib 24 to adapt to the structural layout above the upper housing 111.

The first bit-skipping portion 241 is provided for the electrical interface 101, and the second bit-skipping portion 242 is provided for the optical interface 102.

The heat sink 20 is made of an aluminum alloy material, but not limited thereto.

The first positioning portion 241 near the electrical interface 101 of the first optical module 10 is provided with a guide portion 2411, the guide portion 2411 is substantially a guide slope located on the upper surface of the first positioning portion 241, and the guide portion 2411 is used for assisting the insertion of the electrical interface 101 into the access device.

An embodiment of the present invention further provides a manufacturing method of the OSFP optical module 100, which combines the description of the OSFP optical module 100 and fig. 4, and the manufacturing method includes the steps of:

s1: providing a first optical module 10 and a heat sink 20;

step S1 specifically includes:

the upper case 111 and the heat sink 20 are integrally formed, respectively;

the upper housing 111 is assembled with other components to form the first optical module 10.

S2: determining the configuration states of the first optical module 10 and the heat sink 20;

step S2 may be to determine the configuration states of the first optical module 10 and the heat sink 20 according to the shipment requirement.

S3: when the heat sink 20 and the first optical module 10 are independent from each other, the first optical module 10 functions as an OSFP optical module 100;

s4: when the heat sink 20 is fitted to the first optical module 10, the first optical module 10 is combined with the heat sink 20 as another kind of OSFP optical module.

In the production process of the OSFP optical module 100 in this embodiment, the independent first optical module 10 and the independent heat dissipation member 20 may be respectively formed, and then the OSFP optical module 100 in different forms is selected according to different requirements, on one hand, the freedom of selection of the OSFP optical module 100 is improved, on the other hand, only the first optical module 10 and the heat dissipation member 20 which are universal need to be provided at this time, and the first optical module 10 and the heat dissipation member 20 are assembled together when necessary, so that the mold opening number of molds can be effectively reduced, the process difficulty is reduced, and the cost can be greatly reduced.

In other words, the method for manufacturing the OSFP optical module 100 specifically includes:

the upper case 111 and the heat sink 20 are integrally formed, respectively;

assembling the upper housing 111 with other components to form the first optical module 10;

the heat sink 20 and the first optical module 10 are selectively assembled to form the OSFP optical module 100, or the first optical module 10 is used as the OSFP optical module 100.

For other descriptions of the method for manufacturing the OSFP optical module 100 in this embodiment, reference may be made to the description of the OSFP optical module 100, and no further description is given here.

In summary, the OSFP optical module 100 of the present invention may only include the first optical module 10, or include a combination structure of the first optical module 10 and the heat sink 20, so that different types of OSFP optical modules 100 can be selected according to different requirements, on one hand, the freedom of selection of the OSFP optical module 100 is improved, and on the other hand, only the first optical module 10 and the heat sink 20 which are universal are needed to be provided, and the first optical module 10 and the heat sink 20 are assembled together when needed, so as to effectively reduce the number of mold opening of the mold, reduce the process difficulty, and greatly reduce the cost.

It should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art will be able to make the description as a whole, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The above detailed description is merely illustrative of possible embodiments of the present application and is not intended to limit the scope of the present application, and equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.

Claims

1. The OSFP optical module is characterized by comprising a first optical module and a heat dissipation piece, wherein the first optical module comprises a shell which is arranged in a surrounding mode to form a closed containing space, when the heat dissipation piece and the first optical module are independent from each other, the first optical module serves as an OSFP optical module which can be used independently, when the heat dissipation piece is matched with the shell, the first optical module and the heat dissipation piece are combined to serve as the OSFP optical module, and the surface of the shell, on which the heat dissipation piece is mounted, is a continuous surface.

2. The OSFP optical module of claim 1, wherein the housing includes an upper housing and a lower housing that mate with each other, the heat sink being mated with a side of the upper housing remote from the lower housing.

3. The OSFP optical module of claim 2, wherein the upper housing and the heat sink are each integrally formed.

4. The OSFP optical module of claim 1, wherein the heat sink and the housing are secured together by a thermally conductive adhesive.

5. The OSFP optical module of claim 1, wherein the heat dissipation member includes an upper plate, a lower plate and heat dissipation fins interposed therebetween, the upper plate and the lower plate cooperating with each other, the lower plate and the housing cooperating with each other.

6. The OSFP optical module is characterized by comprising a first optical module and a heat dissipation piece, wherein the first optical module comprises a shell forming an accommodating space, the shell comprises an upper shell completely covering at least one opening of the accommodating space, the upper shell and the heat dissipation piece are respectively integrally formed, one side, away from the accommodating chamber, of the upper shell is a mounting surface for mounting the heat dissipation piece, and the mounting surface is a continuous surface.

7. The OSFP optical module of claim 6, wherein the first optical module and the heat dissipation member are configured to be selectively mateable and wherein the heat dissipation member and the upper housing are secured to each other when the first optical module and the heat dissipation member are mated to each other.

8. A manufacturing method of an OSFP optical module is characterized by comprising the following steps:

providing a first optical module and a radiating piece, wherein the first optical module comprises a shell which is surrounded to form a closed accommodating space, and the surface of the shell, which is used for mounting the radiating piece, is a continuous surface;

when the heat sink and the first optical module are independent from each other, the first optical module serves as an OSFP optical module which can be used independently;

9. The method for manufacturing the OSFP optical module according to claim 8, wherein the method specifically includes:

an upper shell and a heat radiating piece are respectively integrally formed;

10. A manufacturing method of an OSFP optical module is characterized by comprising the following steps:

an upper shell and a heat radiating piece are respectively integrally formed;

and selectively assembling the heat dissipation piece and the upper shell of the first optical module to form an OSFP optical module, wherein the surface of the upper shell on which the heat dissipation piece is installed is a continuous surface, or the first optical module is used as an independently-used OSFP optical module.