CN110864846A - Pressure sensor and preparation method thereof - Google Patents
Pressure sensor and preparation method thereof Download PDFInfo
- Publication number
- CN110864846A CN110864846A CN201911331986.XA CN201911331986A CN110864846A CN 110864846 A CN110864846 A CN 110864846A CN 201911331986 A CN201911331986 A CN 201911331986A CN 110864846 A CN110864846 A CN 110864846A
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- pressure
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- pressure sensor
- pressure sensing
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- 238000002360 preparation method Methods 0.000 title abstract description 7
- 230000003321 amplification Effects 0.000 claims description 30
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 30
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- 239000000565 sealant Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000004382 potting Methods 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 5
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- 239000003292 glue Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 1
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a pressure sensor and a preparation method thereof, and the pressure sensor comprises a main body structure, a signal output terminal arranged at one end of the main body structure, and a pressure sensing assembly arranged in the main body structure and connected with the signal output terminal, wherein an accommodating cavity is arranged in the main body structure, a medium inlet channel communicated with the accommodating cavity is arranged at one end of the main body structure, which is far away from a connector, the pressure sensing assembly is arranged in the accommodating cavity and prevents a medium from entering the accommodating cavity, and the pressure sensing assembly comprises a pressure sensing chip arranged in the medium inlet channel. According to the invention, the medium inlet channel is formed on the main body structure, and the pressure sensing chip is directly arranged in the medium inlet channel to directly sense the medium pressure, so that a metal diaphragm and pressure transmission oil are not required to be arranged to transmit the pressure, the size of the pressure sensor is reduced, the preparation process is simplified, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a pressure sensor and a preparation method thereof.
Background
The sensor is an important component in an industrial automatic control system, and is used for sensing measured information and converting the measured information into an electric signal or other information in a required form according to a certain rule to be output. The pressure sensor belongs to one of the most common sensors, and is mainly used for measuring the pressure of a medium (such as gas and liquid) and converting the pressure into an electric signal to be output.
The pressure sensor that uses at present is oil-filled sensor mostly, adopts the structural style of oil-filled core promptly, and this kind of structure adopts metal diaphragm and glass sintering base to encapsulate usually, and the inside encapsulation has pressure transmission oil and the pressure chip of transmission pressure, and the metal diaphragm receives external pressure to take place to warp, and then gives the pressure chip with pressure signal through pressure transmission oil transmission, and the pressure chip output pressure signal.
The pressure sensor has the defects that the whole volume is large, the pressure sensor is not suitable for being integrally embedded into a fine instrument or equipment, in addition, the whole manufacturing process of the sensor needs various complex processes such as welding, glass sintering, vacuum oil filling and the like, and the whole cost is high.
Disclosure of Invention
Based on this, the present invention provides a pressure sensor and a method for manufacturing the same, so as to solve the technical problem of large volume of the pressure sensor in the prior art.
According to the embodiment of the invention, the pressure sensor comprises a main body structure, a signal output terminal arranged at one end of the main body structure, and a pressure sensing assembly arranged in the main body structure and connected with the signal output terminal, wherein an accommodating cavity is arranged in the main body structure, a medium inlet channel communicated with the accommodating cavity is arranged at one end of the main body structure, which is far away from a connector, the pressure sensing assembly is arranged in the accommodating cavity and used for blocking a medium from entering the accommodating cavity, and the pressure sensing assembly comprises a pressure sensing chip arranged in the medium inlet channel.
Further, the pressure sensing assembly further comprises a signal amplification board, the pressure sensing chip is arranged on the signal amplification board, and the signal amplification board is connected with the signal output terminal.
Furthermore, a sealant is arranged between the signal amplification plate and the inner wall of the accommodating cavity to prevent the medium from entering the accommodating cavity.
Further, the pressure sensing chip is flip-chip bonded on the signal amplification board.
Furthermore, the pressure sensing assembly is connected with the signal output terminal through a lead, and the lead is contained in the containing cavity.
Furthermore, a pouring sealant for fixing the pressure sensing assembly in the accommodating cavity in a packaging manner is arranged in the accommodating cavity.
Further, the major structure includes the casing and connects casing one end advances the pressure head, the casing encloses into a cavity, advance the pressure head with the terminal surface of the one end that the casing is connected inwards caves in and forms a cavity, the cavity with the cavity communicates with each other, in order to form hold the cavity, pressure sensing subassembly set up in the cavity, the medium access passage set up in advance on the pressure head and with the cavity intercommunication.
Furthermore, an external thread is arranged on the outer wall of the pressure inlet head.
Further, the pressure sensor further comprises an adapter plate riveted with the main body structure, the signal output terminal is welded on the adapter plate, and a guide pin of the signal output terminal penetrates through the adapter plate.
The embodiment of the invention also provides a preparation method of the pressure sensor, wherein the pressure sensor is the pressure sensor, and the method comprises the following steps:
the pressure sensing chip is inversely welded on the signal amplification plate to form a pressure sensing assembly;
the pressure sensing assembly is pasted into a cavity of a pressure head through a sealant, and the sealant is cured;
welding a lead on the signal amplification board and leading out;
welding the pressure inlet head and the shell to form a main body structure, and pouring sealant into a containing cavity in the main body structure;
welding a signal output terminal on an adapter plate, and welding the lead wire led out onto a lead pin of the signal output terminal;
and riveting and fixing the adapter plate to the shell.
Compared with the prior art: the medium inlet channel is formed in the main body structure, the pressure sensing chip is directly arranged in the medium inlet channel to directly sense medium pressure, a metal diaphragm and pressure sensing oil are not required to be arranged to transfer pressure, the size of the pressure sensor is reduced, the preparation process is simplified, and cost is reduced.
Drawings
FIG. 1 is an assembled perspective view of a pressure sensor in a first embodiment of the present invention;
FIG. 2 is an assembled sectional view of the pressure sensor in the first embodiment of the present invention;
FIG. 3 is a flow chart of a method of manufacturing a pressure sensor according to a first embodiment of the present invention;
FIG. 4 is an assembled sectional view of a pressure sensor in a second embodiment of the invention;
fig. 5 is a flowchart of a method of manufacturing a pressure sensor in a second embodiment of the present invention.
Description of the main element symbols:
| |
10 | |
20 |
| |
30 | Accommodating |
10a |
| |
10b | |
31 |
| |
32 | |
10c |
| Conducting |
311 | |
11 |
| |
12 | |
13 |
| |
| Cavity |
12a |
| Step | |||
| 111 | Riveting edge pressing | 112 | |
| Pouring |
14 |
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 2, a pressure sensor according to a first embodiment of the present invention is shown, which includes a main body structure 10, a signal output terminal 20 disposed at one end of the main body structure 10, and a pressure sensing element 30 disposed inside the main body structure 10 and connected to the signal output terminal 20, wherein:
the main body structure 10 is provided with a receiving cavity 10a inside, one end of the main body structure 10 away from the connector 20 is provided with a medium inlet passage 10b communicated with the receiving cavity 10a, and the pressure sensing assembly 30 is arranged in the receiving cavity 10a and blocks the receiving cavity 10a and the medium inlet passage 10b to block the medium from entering the receiving cavity 10 a. Specifically, the pressure sensing assembly 30 includes a signal amplification plate 31, and a pressure sensing chip 32 disposed on the signal amplification plate 31, a sealant 10c is disposed between the signal amplification plate 31 and the inner wall of the receiving cavity 10a, so that the signal amplification plate 31 blocks the receiving cavity 10a and the medium inlet passage 10b, thereby blocking the medium from entering the receiving cavity 10a, and the pressure sensing chip 32 is disposed in the medium inlet passage 10b to directly sense the pressure of the medium entering from the medium inlet passage 10 b. The signal amplification board 31 is connected with the signal output terminal 20 through a lead 311, the lead 311 is accommodated in the accommodating cavity 10a, the pressure signal collected by the pressure sensing chip 32 is amplified by the signal amplification board 31, then transmitted to the signal output terminal 20 through the lead 311, and finally output through the signal output terminal 20.
Preferably, the pressure sensing chip 32 is flip-chip bonded to the signal amplification board 31 by flip-chip technology, so that the chip is mounted on the signal amplification board 31 with its front side down, and no wire bonding is required, thereby reducing the package size. The pressure sensing chip 32 is preferably a small MEMS (micro-electro-mechanical system) pressure sensitive chip, and may be specifically an FC chip. The signal amplification board 31 may be a PCBA amplification board, the sealant 10c may be 909 adhesive, the wire 311 may be a wire wrapped by silicone, and the signal output terminal 20 may be a 2.54-4P connection terminal. Of course, in other embodiments, the pressure sensing chip 32 may also be mounted on the signal amplifying board 31, and since the volume of the MEMS pressure sensitive chip itself is small, the overall volume can be reduced compared to the conventional MEMS pressure sensitive chip.
Specifically, the main structure 10 includes a housing 11, a pressure inlet head 12 connected to one end of the housing 11, and an adapter plate 13 riveted to the other end of the housing 11, the housing 11 encloses a hollow 11a, the end surface of the end of the pressure inlet head 12 connected to the housing 11 is recessed inward to form a cavity 12a, the hollow 11a is communicated with the cavity 12a to form the accommodating cavity 10a, the pressure sensing component 30 is disposed in the cavity 12a, and the medium inlet channel 10b is disposed on the pressure inlet head 12 and is communicated with the cavity 12 a. The signal output terminal 20 is soldered to the interposer 13, and the pin of the signal output terminal 20 is connected to the conductive wire 311 in the receiving cavity 10a through the interposer 13. In addition, an annular step 111 is arranged on the inner wall of one end of the shell 11, the adapter plate 13 is placed on the step 111, the edge of the end portion of the shell 11 is turned inwards to form a riveting pressing edge 112, and the riveting pressing edge 112 is tightly pressed on the adapter plate 13, so that the adapter plate 13 is riveted and fixed between the step 111 and the riveting pressing edge 112.
In addition, the outer wall of the pressure inlet head 12 is provided with an external thread, and the specification of the external thread is G1/8, so that the pressure inlet head 12 can be conveniently installed on equipment, and the pressure sensor is conveniently installed on the equipment to detect the pressure of a medium in the equipment. In practical applications, the housing 11 and the pressure inlet 12 may be made of a material with good thermal conductivity, such as a metal material, so as to dissipate heat from the internal components, the housing 11 may also be made of a transparent material so as to observe the state of the internal components, and the accommodating cavity 10a may also be filled with an inert gas with good heat dissipation, such as helium (He).
Referring to fig. 3, in view of the above structure, the present embodiment further provides a method for manufacturing a pressure sensor, for manufacturing the pressure sensor in the present embodiment, the method includes steps S01-S06:
and step S01, flip-chip bonding the pressure sensing chip on the signal amplification board to form the pressure sensing assembly.
In specific implementation, the pressure sensing chip can be connected with the signal amplification board through the ball-planting bonding pad in a soldering mode, and the process requirements of conventional wire binding and dispensing protection are reduced. In addition, after welding, the welding joint can be protected by filling filler (such as glue) at the bottom and the periphery of the chip, so that the welding point is prevented from contacting with the detected gas, liquid and other media, and the service life of the chip is prolonged.
And step S02, adhering the pressure sensing assembly into the cavity of the pressure head through a sealant, and curing the sealant.
In specific implementation, the sealant can be put into an oven to be cured at high temperature.
And step S03, welding a lead wire on the signal amplification board and leading out.
And step S04, welding the pressure inlet head and the shell to form a main structure.
And step S05, welding the signal output terminal to the adapter plate, and welding the lead wire to the lead pin of the signal output terminal.
And step S06, riveting and fixing the adapter plate on the shell.
In summary, in the pressure sensor in the above embodiments of the present invention, the main structure is provided with the medium inlet channel, and the pressure sensing chip is directly disposed in the medium inlet channel to directly sense the medium pressure, and it is not necessary to provide a metal diaphragm and a pressure transmission oil to transmit the pressure, and in addition, the flip-chip MEMS chip is adopted, so that the product has a pressure measurement function in a smaller package volume, the volume of the pressure sensor is reduced, the total height of the product is reduced to 37.5mm, and the maximum outer diameter or width is reduced to 16.8mm to 17mm, and in addition, the manufacturing process is simplified, and the process and component costs are reduced.
Referring to fig. 4, a pressure sensor according to a second embodiment of the present invention is shown, wherein the pressure sensor of the present embodiment is different from the pressure sensor of the first embodiment in that:
the containing cavity 10a is internally provided with a pouring sealant 14 for encapsulating and fixing the pressure sensing assembly 30 in the containing cavity 10a, and the pouring sealant 14 can encapsulate and protect the pressure sensing assembly 30 and can fix the lead 311. Preferably, the volume of the potting compound 14 occupies the total volume of the receiving cavity 10a between 1/2 and 2/3, so that the potting effect can be ensured, the material can be saved, and the weight of the finished product can be ensured. The potting adhesive 14 is preferably a black epoxy potting adhesive.
Referring to fig. 5, the present embodiment further provides a method for manufacturing a pressure sensor, which is used to manufacture the pressure sensor in the present embodiment, and the method includes steps S11 to S17:
and step S11, flip-chip bonding the pressure sensing chip on the signal amplification board to form the pressure sensing assembly.
And step S12, adhering the pressure sensing assembly into the cavity of the pressure head through a sealant, and curing the sealant.
And step S13, welding a lead wire on the signal amplification board and leading out.
And step S14, welding the pressure inlet head and the shell to form a main structure.
Step S15, pouring a potting adhesive into the accommodating cavity inside the main body structure.
And step S16, welding the signal output terminal to the adapter plate, and welding the lead wire to the lead pin of the signal output terminal.
And step S17, riveting and fixing the adapter plate on the shell.
It should be noted that the apparatus provided in the second embodiment of the present invention has the same implementation principle and produces some technical effects as the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment without reference to this embodiment.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a pressure sensor, its characterized in that includes the major structure, locates the signal output terminal of major structure one end and locate the major structure inside and with the pressure sensing subassembly that signal output terminal connects, the inside cavity that holds that is equipped with of major structure, the major structure is kept away from the one end of connector is equipped with the intercommunication the medium access passage who holds the cavity, the pressure sensing subassembly set up in hold in the cavity and the separation medium gets into hold in the cavity, the pressure sensing subassembly is including arranging in pressure sensing chip in the medium access passage.
2. The pressure sensor of claim 1, wherein the pressure sensing assembly further comprises a signal amplification board, the pressure sensing chip is disposed on the signal amplification board, and the signal amplification board is connected to the signal output terminal.
3. The pressure sensor of claim 2, wherein a sealant is disposed between the signal amplification plate and the inner wall of the receiving cavity to block the medium from entering the receiving cavity.
4. The pressure sensor of claim 2, wherein the pressure sensing die is flip-chip bonded to the signal amplification board.
5. The pressure sensor of claim 1 or 2, wherein the pressure sensing assembly is connected to the signal output terminal by a wire, the wire being received in the receiving cavity.
6. The pressure sensor of claim 1, wherein a potting compound is disposed within the receiving cavity for potting the pressure sensing assembly within the receiving cavity.
7. The pressure sensor of claim 1, wherein the main structure includes a housing and a pressure inlet head connected to one end of the housing, the housing defines a hollow, the pressure inlet head is recessed inwardly to form a cavity on an end surface of the end connected to the housing, the hollow communicates with the cavity to form the receiving cavity, the pressure sensing assembly is disposed in the cavity, and the medium inlet channel is disposed on the pressure inlet head and communicates with the cavity.
8. The pressure sensor of claim 7, wherein the outer wall of the indenter head is provided with external threads.
9. The pressure sensor of claim 1, further comprising an adapter plate riveted to the body structure, the signal output terminal being welded to the adapter plate, the pin of the signal output terminal passing through the adapter plate.
10. A method of manufacturing a pressure sensor, wherein the pressure sensor is the pressure sensor of any one of claims 1-9, the method comprising:
the pressure sensing chip is inversely welded on the signal amplification plate to form a pressure sensing assembly;
the pressure sensing assembly is pasted into a cavity of a pressure head through a sealant, and the sealant is cured;
welding a lead on the signal amplification board and leading out;
welding the pressure inlet head and the shell to form a main body structure, and pouring sealant into a containing cavity in the main body structure;
welding a signal output terminal on an adapter plate, and welding the lead wire led out onto a lead pin of the signal output terminal;
and riveting and fixing the adapter plate to the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911331986.XA CN110864846A (en) | 2019-12-21 | 2019-12-21 | Pressure sensor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911331986.XA CN110864846A (en) | 2019-12-21 | 2019-12-21 | Pressure sensor and preparation method thereof |
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|---|---|
| CN110864846A true CN110864846A (en) | 2020-03-06 |
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| CN201911331986.XA Pending CN110864846A (en) | 2019-12-21 | 2019-12-21 | Pressure sensor and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111879444A (en) * | 2020-07-31 | 2020-11-03 | 深圳市迈姆斯科技有限公司 | Small force sensor and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006090846A (en) * | 2004-09-24 | 2006-04-06 | Denso Corp | Pressure sensor |
| CN109534282A (en) * | 2018-10-26 | 2019-03-29 | 江西新力传感科技有限公司 | Production technology based on upside-down mounting welding core media isolation type pressure sensor |
| CN110132462A (en) * | 2019-06-20 | 2019-08-16 | 江西新力传感科技有限公司 | Pressure sensor packaging structure and its packaging method |
| CN110174210A (en) * | 2019-07-04 | 2019-08-27 | 昆山灵科传感技术有限公司 | Pressure sensor and its packaging method |
| CN110207885A (en) * | 2019-07-08 | 2019-09-06 | 南京新力感电子科技有限公司 | Pressure sensor core, core manufacture and packaging method and pressure sensor based on upside-down mounting welding core |
| CN210719517U (en) * | 2019-12-21 | 2020-06-09 | 南京新力感电子科技有限公司 | Pressure sensor |
-
2019
- 2019-12-21 CN CN201911331986.XA patent/CN110864846A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006090846A (en) * | 2004-09-24 | 2006-04-06 | Denso Corp | Pressure sensor |
| CN109534282A (en) * | 2018-10-26 | 2019-03-29 | 江西新力传感科技有限公司 | Production technology based on upside-down mounting welding core media isolation type pressure sensor |
| CN110132462A (en) * | 2019-06-20 | 2019-08-16 | 江西新力传感科技有限公司 | Pressure sensor packaging structure and its packaging method |
| CN110174210A (en) * | 2019-07-04 | 2019-08-27 | 昆山灵科传感技术有限公司 | Pressure sensor and its packaging method |
| CN110207885A (en) * | 2019-07-08 | 2019-09-06 | 南京新力感电子科技有限公司 | Pressure sensor core, core manufacture and packaging method and pressure sensor based on upside-down mounting welding core |
| CN210719517U (en) * | 2019-12-21 | 2020-06-09 | 南京新力感电子科技有限公司 | Pressure sensor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111879444A (en) * | 2020-07-31 | 2020-11-03 | 深圳市迈姆斯科技有限公司 | Small force sensor and manufacturing method thereof |
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